U.S. patent application number 14/945588 was filed with the patent office on 2016-06-30 for nozzle body for wet-blast processing appratus.
This patent application is currently assigned to MACOHO CO. LTD.. The applicant listed for this patent is MACOHO CO. LTD.. Invention is credited to Sachito MATSUBARA, Masanori TSUCHIDA.
Application Number | 20160184968 14/945588 |
Document ID | / |
Family ID | 56163168 |
Filed Date | 2016-06-30 |
United States Patent
Application |
20160184968 |
Kind Code |
A1 |
MATSUBARA; Sachito ; et
al. |
June 30, 2016 |
NOZZLE BODY FOR WET-BLAST PROCESSING APPRATUS
Abstract
The purpose of the present invention is to provide a nozzle body
for an innovative wet-blast processing apparatus that demonstrates
unprecedented effects. The present invention is a nozzle body for a
wet-blast processing apparatus in which a slurry (4) formed by
mixing an abrasive (3) in a liquid (2) can be jetted together with
pressurized air. The nozzle body removes burrs attached to a
terminal (20b) of a semiconductor package (20) formed by providing
a wiring substrate with an electronic component such as a
semiconductor integrated circuit chip and covering the
semiconductor package (20) with a synthetic resin. The nozzle body
has a slurry-jetting opening (5) for jetting the slurry (4) to the
tip of a cylindrical main body (6). The slurry-jetting opening (5)
is formed having a polygonal shape in cross-section.
Inventors: |
MATSUBARA; Sachito;
(Nagaoka-shi, JP) ; TSUCHIDA; Masanori;
(Nagaoka-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MACOHO CO. LTD. |
Nagaoka-shi |
|
JP |
|
|
Assignee: |
MACOHO CO. LTD.
Nagaoka-shi
JP
|
Family ID: |
56163168 |
Appl. No.: |
14/945588 |
Filed: |
November 19, 2015 |
Current U.S.
Class: |
451/102 |
Current CPC
Class: |
B24C 3/322 20130101;
B24C 5/04 20130101 |
International
Class: |
B24C 5/04 20060101
B24C005/04 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 25, 2014 |
JP |
2014-262513 |
Claims
1. A nozzle body for a wet-blast processing apparatus for causing a
slurry formed by mixing an abrasive in a liquid to be jetted
together with pressurized air, the nozzle body removing a burr
attached to a terminal of a semiconductor package formed by
providing a wiring substrate with an electronic component such as a
semiconductor integrated circuit chip and covering the
semiconductor package with a synthetic resin, the nozzle body
having a slurry-jetting opening for jetting the slurry to a tip of
a cylindrical main body, and the slurry-jetting opening being
formed having a polygonal shape in cross-section.
2. The nozzle body for a wet-blast processing apparatus according
to claim 1, wherein the slurry-jetting opening has a square shape
in cross-section.
3. The nozzle body for a wet-blast processing apparatus according
to claim 1, wherein a cylindrical main body provided with a
cylinder hole having a square shape in cross-section is used as the
cylindrical main body.
4. The nozzle body for a wet-blast processing apparatus according
to claim 1, wherein the opening dimensions of the slurry-jetting
opening are set to a length of about 6 mm and a width of about 3
mm.
5. The nozzle body for a wet-blast processing apparatus according
to claim 2, wherein the dimensions of the slurry-jetting opening
are set to a length of about 6 mm and a width of about 3 mm.
6. The nozzle body for a wet-blast processing apparatus according
to claim 3, wherein the dimensions of the slurry-jetting opening
are set to a length of about 6 mm and a width of about 3 mm.
7. The nozzle body for a wet-blast processing apparatus according
to claim 2, wherein a cylindrical main body provided with a
cylinder hole having a square shape in cross-section is used as the
cylindrical main body.
8. The nozzle body for a wet-blast processing apparatus according
to claim 7, wherein the dimensions of the slurry-jetting opening
are set to a length of about 6 mm and a width of about 3 mm.
Description
TECHNICAL FIELD
[0001] The present invention relates to a nozzle body for a
wet-blast processing apparatus.
BACKGROUND ART
[0002] Wet-blast processing has conventionally been performed as a
method for removing resin burrs attached to terminals of
semiconductor packages formed by providing a wiring substrate with
an electronic component such as a semiconductor integrated circuit
chip and covering the semiconductor package with a synthetic resin.
The present applicants have proposed the nozzle body disclosed in
Japanese Patent Publication No. 3393664 (hereinafter, referred to
as the "conventional art example") as a nozzle body for a wet-blast
processing apparatus for resin deburring. Resin burrs mainly attach
near the base part of terminals (area continuously connecting the
area covered by the synthetic resin and the terminal).
[0003] This conventional art example has a main body having a space
with which it is possible to maintain the interior at constant
pressure, the conventional art example being configured so that a
nozzle cylindrical body is provided inside the space, a
pressurized-air-supplying part is provided to a base end of the
nozzle cylindrical body, a communication hole is provided to a
prescribed position of the nozzle cylindrical body inside the
space, a slurry introduction part and a slurry output part for
introducing and outputting a slurry at a prescribed pressure are
respectively provided to the space, the slurry inside the space is
maintained at a constant pressure, and the slurry maintained at a
constant pressure inside the space can be drawn in and introduced
into the nozzle cylindrical body via the communication hole of the
nozzle cylindrical body.
[0004] The conventional art example is therefore configured so that
the slurry inside the space is maintained at a good balance at a
prescribed pressure and drawn in from the communication hole by the
presence of the slurry introduction part and the slurry output
part, injection is not intermittent, and removal of resin burrs can
be performed very effectively.
[0005] Patent Document 1: Japanese Patent Publication No.
3393664
SUMMARY OF THE INVENTION
Problems to be Solved by the Invention
[0006] As a result of further advancements in research and
development of the above-described nozzle body, the present
applicants have invented an innovative nozzle body for wet-blast
processing that demonstrates unprecedented effects.
[0007] The main point of the present invention will be described
with reference to the annexed drawings.
[0008] In a nozzle body for a wet-blast processing apparatus
according to a first aspect of the invention, a slurry 4 formed by
mixing an abrasive 3 in a liquid 2 is jetted together with
pressurized air, the nozzle body removing a burr attached to a
terminal 20b of a semiconductor package 20 formed by providing a
wiring substrate with an electronic component such as a
semiconductor integrated circuit chip and covering the
semiconductor package 20 with a synthetic resin, the nozzle body
having a slurry-jetting opening 5 for jetting the slurry 4 to a tip
of a cylindrical main body 6, and the slurry-jetting opening 5
being formed having a polygonal shape in cross-section.
[0009] A nozzle body for a wet-blast processing apparatus according
to a second aspect of the invention, is the wet-blast processing
apparatus according to the first aspect, wherein the slurry-jetting
opening 5 has a square shape in cross-section.
[0010] A nozzle body for a wet-blast processing apparatus according
to a third aspect of the invention, is the wet-blast processing
apparatus according to the first or second aspect, wherein, wherein
a cylindrical main body 6 provided with a cylinder hole having a
square shape in cross-section is used as the cylindrical main body
6.
[0011] A nozzle body for a wet-blast processing apparatus according
to a fourth aspect of the invention, is the wet-blast processing
apparatus according to the first aspect, wherein the opening
dimensions of the slurry-jetting opening 5 are set to a length of
about 6 mm and a width of about 3 mm.
[0012] A nozzle body for a wet-blast processing apparatus according
to a fifth aspect of the invention, is the wet-blast processing
apparatus according to the second aspect, wherein the opening
dimensions of the slurry-jetting opening 5 are set to a length of
about 6 mm and a width of about 3 mm.
[0013] A nozzle body for a wet-blast processing apparatus according
to a sixth aspect of the invention, is the wet-blast processing
apparatus according to the third aspect, wherein the opening
dimensions of the slurry-jetting opening 5 are set to a length of
about 6 mm and a width of about 3 mm.
Effect of the Invention
[0014] Due to being configured as described above, the present
invention is an innovative nozzle body for wet-blast processing
that makes it possible to perform wet-blast processing of a
semiconductor package quickly and efficiently, and demonstrates
other unprecedented effects.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is an explanatory view of the present example in a
state of use;
[0016] FIG. 2 is a lateral cross-sectional view of the present
example;
[0017] FIG. 3 is a cross-sectional view along line A-A in FIG.
2;
[0018] FIG. 4 is a perspective view illustrating the principal part
of the present example;
[0019] FIG. 5 is an explanatory view of the present example in a
state of use;
[0020] FIG. 6 is a perspective view illustrating the principal part
of a conventional art example; and
[0021] FIG. 7 is an explanatory view of a conventional art example
in a state of use.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0022] Preferred embodiments of the present invention are described
merely by indicating the effect of the present invention on the
basis of the accompanying drawings.
[0023] A slurry 4 that has passed through a cylindrical main body
is jetted from a slurry-jetting opening 5, the slurry 4 is jetted
onto a resin burr attached to, for example, a base part of a
terminal 20b, and the resin burr is removed.
[0024] In the present invention, the slurry-jetting opening 5 has a
polygonal shape in cross-section, the slurry 4 jetted from the
slurry-jetting opening 5 is in the shape of a rectangular prism,
and processing is performed with good efficiency.
[0025] That is, when a semiconductor package 20 undergoes wet-blast
processing, it is necessary that an area 20a covered by a synthetic
resin not be jetted by the slurry 4. The slurry 4 is jetted along
the outer edge of the area 20a covered by the synthetic resin, but
the outer edge area of the jetted slurry is arcuate when the
slurry-jetting opening 53 is circular, as illustrated in FIG. 6,
and the outer edge of the area 20a covered by the synthetic resin
is linear, as illustrated in FIG. 7, resulting in poor processing
efficiency.
[0026] Inasmuch, because, in the present invention, the slurry 4 is
jetted in the shape of a rectangular prism from the slurry-jetting
opening 5, and the outer edge area of the jetted slurry 4 is
linear, the jetted surface area relative to the outer edge of the
area 20a covered by the synthetic resin is larger than in the
above-described case in which the slurry-jetting opening 5 is
circular, as illustrated in FIG. 5, and resin burrs can be removed
quickly and with good processing efficiency.
EXAMPLE
[0027] Specific examples of the present invention will be described
on the basis of the drawings.
[0028] The present example is a nozzle body M for a wet-blast
processing apparatus in which a slurry 4 formed by mixing an
abrasive 3 in a liquid 2 is jetted together with pressurized air,
the nozzle body M removing a burr (resin burr 30) attached to a
terminal 20b of a semiconductor package 20 formed by providing a
wiring substrate with an electronic component such as a
semiconductor integrated circuit chip and covering the
semiconductor package 20 with a synthetic resin.
[0029] Specifically, the wet-blast processing apparatus is:
provided to a base body 21 through which the semiconductor package
20 which is a body to be processed passes, as illustrated in FIG.
1; equipped with a slurry-jetting part comprising the nozzle body
M, a slurry-accumulating part 22 installed in a lower position, and
a slurry-conveying part 24 for conveying the slurry from the
slurry-accumulating part 22 to the slurry-jetting part via a pump
device 23; and configured so that the slurry jetted from the
slurry-jetting part is sent to the slurry-accumulating part 22 to
be reused. Numeral 25A is a pressurized-air-supplying device, 25B
is a pressurized-air-conveying part, and 26 is a
slurry-returning/conveying part connected to the nozzle body M, the
slurry-returning/conveying part returning the slurry 4 to the
slurry-accumulating part 22.
[0030] The nozzle M is configured of a cylindrical main body 6 and
a fitting cylinder 8 continuously connected in a fitted state to
the cylindrical main body 6, as illustrated in FIG. 1.
[0031] In addition, a base end of the cylindrical main body 6 is
continuously connected to a base end part of the fitting cylinder
8, and the base end part of the fitting cylinder 8 is continuously
connected to the pressurized-air-conveying part 25B via a port
10.
[0032] Furthermore, a communication hole 12 is bored into an area
arranged inside a space 7 of the fitting cylinder 8 in the
cylindrical main body 6, and a slurry introduction part 13
connected to the above-described slurry-conveying part 24 and a
slurry output part 14 connected to the slurry-returning/conveying
part 26 are provided to a prescribed outer peripheral location on
the fitting cylinder 8.
[0033] The cylindrical main body 6 of the present example is, as
illustrated in FIGS. 1 to 4, configured so that the periphery of a
to rectangular cylindrical member 6a provided with a cylinder hole
having a square shape in cross-section and being formed of a
suitable metal member is covered by a synthetic resin coating
member 6b, and a tip opening part having a rectangular shape in
cross-section is configured as the slurry-jetting opening 5 for
jetting the slurry 4 at the tip of the cylinder hole of the
rectangular cylindrical member 6a.
[0034] Accordingly, the slurry 4 is jetted in the shape of a
rectangular prism from the slurry-jetting opening 5.
[0035] In addition, in the present example, the opening dimensions
of the slurry-jetting opening 5 are set to a length of about 6 mm
and a width of about 3 mm. The slurry-jetting opening 5 may have a
square shape in cross-section (for example, length of 3 mm, width
of 3 mm).
[0036] Furthermore, although not illustrated in the drawings, when
a guide extending from the slurry-jetting opening 5 toward the tip
(downward) in the slurry-jetting opening 5 is provided, dispersing
of the slurry 4 to the outside (periphery) is inhibited, and
satisfactory burr removal can be performed without as much of a
tendency for the jetted slurry 4 to degrade.
[0037] Because of the above-mentioned configuration of the present
example, the slurry 4 can be introduced to the inside of the space
7 from the slurry introduction part 13, and the slurry 4 can be
outputted from the slurry output part 14 to the outside of the
space 7. As a result, the pressure of the slurry 4 is reduced by
the outputting of the slurry 4 from the slurry output part 14, and
the slurry 4 is circulated while a constant pressure is maintained
inside the space 7. In this state, when pressurized air is
introduced into the cylindrical main body 6 from the port 10, the
pressurized air draws the slurry 4 into the space 7 via the
communication hole 12, and the slurry 4 is accelerated by the
pressurized air inside the cylindrical main body 6 and jetted in
the shape of a rectangular prism to the outside from the
slurry-jetting opening 5. The slurry 4 is circulated inside the
space 7 by the slurry introduction part 13 and the slurry output
part 14, and a constant pressure is maintained inside the space 7
(accordingly, even if the slurry 4 is drawn into the cylindrical
main body 6 via the communication hole 12, the pressure inside the
space 7 does not change.).
[0038] According to the present example, the slurry 4 is therefore
jetted from the slurry-jetting opening 5 in the shape of a
rectangular prism, and the outer edge area of the jetted slurry 4
is linear. Therefore, the impacted surface area of the outer edge
of the semiconductor package 20 (the area 20a covered by the
synthetic resin) is larger than a case in which the slurry-jetting
opening 5 is circular, as illustrated in FIG. 5, and resin burrs 30
can be removed quickly and with good processing efficiency.
[0039] In addition, the present example is configured so that the
slurry 4 is drawn in by pressurized air passing through at a
constant pressure from the space 7 in which the slurry 4 is
enclosed at a constant pressure, and there is no excess abrasive.
Furthermore, the air-intake pressure for taking in air through the
communication hole 12 is maintained at a good balance, the jetted
slurry 4 is therefore not intermittent, jetting can be performed
smoothly and continuously, and the amount of the abrasive in the
slurry 4 jetted from the slurry-jetting opening 5 is constant
because the amount of the abrasive drawn in from the communication
hole 12 is constant.
[0040] Accordingly, the power for drawing the slurry 4 into the
cylindrical main body 6 via the communication hole 12 is
appropriately adjusted by adjustment of the air pressure, whereby
the diameter of the slurry-jetting opening 5 can also be reduced as
much as possible, and deburring can be performed that much more
accurately in a desired area.
[0041] Furthermore, it is preferable that the diameter of the
cylindrical main body 6 be reduced in order for accurate deburring
to be performed.
[0042] As a result of experimentation, jetting of the slurry 4 can
be continuously performed without intermittency.
[0043] Because the pressurized-air passage can be made longer than
with the conventional art example (in the conventional art example,
the pressurized-air passage is the cylindrical main body 6, and the
length of the pressurized-air passage is the length of the
cylindrical main body 6), the length over which the air is
accelerated is increased in commensurate fashion, and the jetting
speed from the cylindrical main body 6 can therefore be increased
even if the air-supply pressure is not increased to such an extent.
The effectiveness of burr removal can therefore be improved.
[0044] This means that the expansion of air in the long air passage
is commensurately sufficient, and air-flow regulation is excellent.
The width of pressurized water when jetted from the cylindrical
main body 6 (radially expanding width) is reduced in commensurate
fashion, and accurate deburring can therefore be performed in
commensurate fashion on an area in which deburring is desired. In
addition, reducing the width when the water is jetted from the
cylindrical main body 6 means that noise generated during
commensurately spreading can be suppressed.
[0045] The present invention is not limited to the present
examples, it being possible to design the specific configuration of
various constituent elements as appropriate.
* * * * *