U.S. patent application number 14/573496 was filed with the patent office on 2016-06-23 for sensor array packaging solution.
The applicant listed for this patent is LOCKHEED MARTIN CORPORATION. Invention is credited to James E. BISHOP, Allan JOHNSON, Brian KAPLUN, Steven E. McELWAIN, JR., David L. VOS.
Application Number | 20160178410 14/573496 |
Document ID | / |
Family ID | 56127816 |
Filed Date | 2016-06-23 |
United States Patent
Application |
20160178410 |
Kind Code |
A1 |
BISHOP; James E. ; et
al. |
June 23, 2016 |
SENSOR ARRAY PACKAGING SOLUTION
Abstract
A gigahertz sensor array packaging solution for harsh operating
environments is disclosed. The sensor array packaging system
includes a structural core body comprising sensor mounting features
on a surface thereof and an alignment through hole extending from
the surface to a backside thereof which incorporates finned
features providing cooling and stiffness. The sensor array
packaging system further includes one or more electro-optical
components mounted to the backside of the structural core body. The
sensor array packaging system further includes a wiring board
comprising a plurality of sensor array elements contacting walls of
the spiral ribbon configuration, each having a cable extending
through the through hole to at least one of the one or more
electro-optical components.
Inventors: |
BISHOP; James E.; (Newark
Valley, NY) ; JOHNSON; Allan; (Johnson City, NY)
; KAPLUN; Brian; (Endicott, NY) ; McELWAIN, JR.;
Steven E.; (Johnson City, NY) ; VOS; David L.;
(Apalachin, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LOCKHEED MARTIN CORPORATION |
Bethesda |
MD |
US |
|
|
Family ID: |
56127816 |
Appl. No.: |
14/573496 |
Filed: |
December 17, 2014 |
Current U.S.
Class: |
250/239 |
Current CPC
Class: |
G02B 6/4298 20130101;
G01D 11/245 20130101; G02B 6/04 20130101 |
International
Class: |
G01D 11/24 20060101
G01D011/24 |
Claims
1. A sensor array packaging system, comprising: a structural core
body comprising a predetermined configuration on a surface thereof
and a through hole extending from the surface to a backside
thereof; one or more electro-optical components mounted to the
backside of the structural core body; and a wiring board comprising
a plurality of sensor array elements contacting walls of the
predetermined configuration, each having a cable extending through
the through hole to at least one of the one or more electro-optical
components.
2. The sensor array packaging system of claim 1, wherein the cables
are fiber optical cables provided within the predetermined
configuration and arranged as a fiber optical comb disk extending
through the through hole.
3. The sensor array packaging system of claim 2, wherein the fiber
optical cables for each of the sensor array elements are of a same
length.
4. The sensor array packaging system of claim 1, wherein the
structural core body and the predetermined configuration are a
single, unitary component, and the predetermined configuration is a
spiral ribbon configuration.
5. The sensor array packaging system of claim 1, wherein the
plurality of sensor array elements are configured in an arrangement
corresponding to the predetermined configuration.
6. The sensor array packaging system of claim 1, further comprising
a forced convection system comprising one or more fans, air inlets
and one or more air outlets.
7. The sensor array packaging system of claim 6, further comprising
channels formed from a plurality of fins on the backside of the
structural core body, leading from the air inlets to the one or
more fans.
8. The sensor array packaging system of claim 7, wherein the
plurality of fins and the structural core body are a single,
unitary component.
9. The sensor array packaging system of claim 1, further comprising
one or more heat sink fins positioned on the surface of the
structural core body, remotely from the predetermined configuration
which is a spiral ribbon configuration or a sunburst
configuration.
10. The sensor array packaging system of claim 1, further
comprising a radome cover and a back cover mounted to opposing
sides of the structural core body, protecting the plurality of
sensor array elements and the one or more electro-optical
components body, respectively.
11. A sensor array packaging system, comprising: a structural core
body comprising: a spiral ribbon configuration on a surface
thereof; a plurality of fins on the backside thereof and covered by
a cover attached to the structural core body; and a through hole at
a center of the spiral ribbon configuration extending from the
surface to the cover; and one or more electro-optical components
mounted to the cover; and a plurality of sensor array elements
mounted directly to walls of the spiral ribbon configuration, where
each sensor element of the plurality of sensor array elements has a
fiber optical cable which is provided within the spiral ribbon
configuration and passes through the through hole to at least one
of the one or more electro-optical components.
12. The sensor array packaging system of claim 11, wherein the
fiber optical cables are arranged as a fiber optical comb disk at
the center of the spiral ribbon configuration, which extends
through the through hole.
13. The sensor array packaging system of claim 12, wherein the
fiber optical cables for each of the sensor elements are of a same
length.
14. The sensor array packaging system of claim 11, wherein the
structural core body, the spiral ribbon configuration and the
plurality of fins are a single, unitary component.
15. The sensor array packaging system of claim 11, wherein the
plurality of sensor array elements are in a spiral arrangement
corresponding to the spiral ribbon configuration.
16. The sensor array packaging system of claim 11, wherein the
through hole is a splined through hole for alignment.
17. The sensor array packaging system of claim 11, wherein the
plurality of fins form channels leading from air inlets to one or
more fans of a forced air convection system.
18. The sensor array packaging system of claim 11, further
comprising one or more heat sink fins positioned on the surface of
the structural core body, remotely from the spiral ribbon
configuration.
19. The sensor array packaging system of claim 11, further
comprising a radome cover and a back cover mounted to opposing
sides of the structural core body, protecting the plurality of
sensor array elements and the one or more electro-optical
components body, respectively.
20. A sensor array packaging system, comprising: a structural core
body comprising a spiral ribbon configuration on a surface thereof,
and a fin arrangement forming channels from an air inlet to an air
outlet on a backside; a cover mounted to the backside of the
structural core body, covering the fin arrangement; a through hole
extending from the surface of the structural core body to the
cover; electro-optical components mounted to the cover on the
backside of the structural core body; a wiring board comprising a
plurality of sensor array elements directly contacting walls of the
spiral ribbon configuration, each having a cable extending through
the through hole to the electro-optical components; a radome cover
mounted to the structural core body which protects the wiring board
and the plurality of sensor array elements; and a back cover
mounted to the cover on the backside of the structural core body
which protects the one or more electro-optical components.
Description
FIELD OF THE INVENTION
[0001] The invention is directed to a sensor array packaging
system. More particularly, the invention is directed to a gigahertz
sensor array packaging solution for harsh operating
environments.
BACKGROUND DESCRIPTION
[0002] A sensor array is a group of sensors deployed in a certain
geometric arrangement. Typically, the sensor array pattern is
designed to increase antenna gain in the direction of the signal
while decreasing the gain in the directions of noise and
interferences. In this way, the sensor array pattern is designed to
increase signal-to-noise ratio.
[0003] The sensor array is deployed in array signal processing
systems. These array signal processing systems include, for
example, radar/sonar, wireless communications, seismology, machine
condition monitoring and fault diagnosis, etc. Radar and sonar
applications are typically implemented in aviation environments,
including military applications. These environments can be harsh
environments, for example, presenting high vibration loads, as well
as extreme thermal and other environmental conditions such as high
moisture conditions. Also, it is known that the array signal
processing systems, e.g., sensors, back end electronics, power
supplies, etc. generate a tremendous amount of heat.
[0004] To this end, packaging of the sensors and other
electro-optical components must protect the components from harsh
environmental conditions, while still providing stiffness, relative
position, and alignment of the optical interface to the camera, as
well as providing heat dissipation in the smallest possible
package. These features are competing, though, making it very
difficult to accomplish each of the necessary requirements.
SUMMARY OF THE INVENTION
[0005] In an aspect of the invention, a sensor array packaging
system comprises a structural core body comprising a predetermined
configuration on a surface thereof and a through hole extending
from the surface to a backside thereof. The sensor array packaging
system further comprises one or more electro-optical components
mounted to the backside of the structural core body. The sensor
array packaging system further comprises a wiring board comprising
a plurality of sensor array elements contacting walls of the
predetermined configuration, each having a cable extending through
the through hole to at least one of the one or more electro-optical
components.
[0006] In yet another aspect of the invention, a sensor array
packaging system comprises a structural core body comprising: a
spiral ribbon configuration on a surface thereof; a plurality of
fins on the backside thereof and covered by a cover attached to the
structural core body; and a through hole at a center of the spiral
ribbon configuration extending from the surface to the cover. The
sensor array packaging system further comprises one or more
electro-optical components mounted to the cover. The sensor array
packaging system further comprises a plurality of sensor array
elements mounted directly to walls of the spiral ribbon
configuration, where each sensor element of the plurality of sensor
array elements has a fiber optical cable which is provided within
the spiral ribbon configuration and passes through the through hole
to at least one of the one or more electro-optical components.
[0007] In still yet another aspect of the invention, a sensor array
packaging system comprises: a structural core body comprising a
spiral ribbon configuration on a surface thereof, and a fin
arrangement forming channels from an air inlet to an air outlet on
a backside; a cover mounted to the backside of the structural core
body, covering the fin arrangement; a through hole extending from
the surface of the structural core body to the cover;
electro-optical components mounted to the cover on the backside of
the structural core body; a wiring board comprising a plurality of
sensor array elements directly contacting walls of the spiral
ribbon configuration, each having a cable extending through the
through hole to the electro-optical components; a radome cover
mounted to the structural core body which protects the wiring board
and the plurality of sensor array elements; and a back cover
mounted to the cover on the backside of the structural core body
which protects the one or more electro-optical components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The invention is described in the detailed description which
follows, in reference to the noted plurality of drawings by way of
non-limiting examples of exemplary embodiments of the present
invention, in which like reference numerals represent similar parts
throughout the several views of the drawings, and wherein:
[0009] FIG. 1 shows a perspective view of a heat exchanger and
structural support for a sensor array packaging solution in
accordance with aspects of the present invention;
[0010] FIG. 2 shows a plan view of the heat exchanger and
structural support for the sensor array packaging solution in
accordance with aspects of the present invention;
[0011] FIG. 3 shows a cut away view of the heat exchanger and
structural support, along line A-A of FIG. 2;
[0012] FIG. 4 shows an implementation of a plurality of sensor
array elements on a printed wiring board, PWB, which can be mounted
to the heat exchanger and structural support shown in FIGS.
1-3;
[0013] FIG. 5 shows an assembly process of the printed wiring board
to the heat exchanger and structural support in accordance with
aspects of the present invention;
[0014] FIG. 6 shows an assembled sensor array packaging solution in
accordance with aspects of the present invention; and
[0015] FIGS. 7a-7d show additional array patterns for a heat
exchanger and structural support in accordance with aspects of the
present invention.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0016] The invention is directed to a sensor array packaging
system. More particularly, the invention is directed to a gigahertz
sensor array packaging solution for harsh operating environments.
In even more specific embodiments, the invention is directed to a
thermal heat exchanger and structural support for electro-optical
subassemblies, e.g., sensor array elements and related optical and
processing components for a sensor array. In embodiments, the
thermal heat exchanger and structural support includes a core
structure, preferably of metal, which includes a spiral ribbon
configuration (or other configurations) for mounting of sensor
array elements, e.g., front end optical module and related
components mounted on a printed wiring board (PWB). The spiral
ribbon configuration or other configurations provide several
advantages, including: (i) heat dissipation (heat transfer); (ii)
relative location and alignment of the sensor array elements to
related optical and processing components; and (iii) electrical and
optical interconnects for the sensor array elements to back end
electronics and optical equipment.
[0017] Advantageously, the sensor array packaging system provides a
packaging solution for harsh environments including, e.g., aviation
and marine applications. In further embodiments, for example, the
sensor array packaging system is well suited for military
applications including helicopter applications which present
challenging high vibration environments. By way of illustration,
the sensor array packaging system is robust, able to withstand
harsh physical vibration and thermal environments, e.g., helicopter
flight, as well as exhibits ease of manufacturing and repair. The
sensor array packaging system also is designed with minimum mass,
compared to conventional systems. Moreover, the sensor array
packaging system and, more specifically, the heat exchanger thereof
can dissipate large quantities of heat generation, e.g., on the
order of -330 watts or more.
[0018] FIGS. 1 and 2 show a heat exchanger and structural support
for a sensor array packaging solution in accordance with aspects of
the present invention. More specifically, FIG. 1 shows a
perspective view of a heat exchanger and structural support 10 for
a sensor array packaging solution; whereas, FIG. 2 shows a plan
view of the heat exchanger and structural support 10 for a sensor
array packaging solution.
[0019] In embodiments, the heat exchanger and structural support 10
includes a core structural body 15. The core structural body 15
acts as a main thermal and structural element of the sensor array
packaging system of the present invention. For example, the core
structural body 15 provides thermal management and stiff structural
support for electro-optical subassemblies, and supports composite
housing/radome pieces that provide protection from external
environments. Also, the core structural body 15 minimizes
structural requirements on the radome and rear cover of the
assembly (see, e.g., FIG. 6).
[0020] The core structural body 15 can be an aluminum body;
although other materials are also contemplated by the present
invention. For example, the core structural body 15 (and other
components of the heat exchanger and structural support 10) can
comprise other metals, alloys, etc. which exhibit high thermal
conductivity (W/(m*K)). The material of the heat exchanger and
structural support 10 should also exhibit a high stiffness, e.g.,
minimal deflection on the order of about 0.0001 inch or no
deflection, as well as a low mass in order to reduce weight carried
by a vehicle, e.g., aircraft.
[0021] Still referring to FIGS. 1 and 2, the core structural body
15 includes a spiral ribbon configuration 20 provided on a front
face thereof. In embodiments, the spiral ribbon configuration 20
can be machined from the core structural body 15, as an example;
although other configurations are also contemplated by the present
invention, e.g., welding or other types of bonding or attachment
mechanisms. In embodiments, the structure can be manufactured in
additional manners including additive manufacturing techniques and
3-D printing as further examples. In embodiments, the spiral ribbon
configuration 20 and the core structural body 15 can be a single,
unitary (e.g., integral) structure, hence improving heat transfer
and structural support capabilities. In embodiments, other
configurations are also contemplated by the present invention such
as those shown in FIGS. 7a-7d, as described further herein.
[0022] As shown more specifically in FIG. 2, the spiral ribbon
configuration 20 is configured and structured so as to provide
support for a plurality of sensor array elements 50, e.g., 220
sensor array elements, and their respective fiber optical cables
55. To this end, the spiral walls of the spiral ribbon
configuration 20 are spaced apart to accommodate the sensor array
elements 50 directly mounted to the spiral walls, and their
respective fiber optical cables 55. By providing a mounting
structure for the sensor array elements 50, the sensor array
elements 50 can be thermally and structurally bonded directly to
the core structural body 15, and more specifically directly to the
walls of the spiral ribbon configuration 20 (or the additional
configurations shown in FIGS. 7a-7d). This will, in turn, improve
heat dissipation and alignment processes of the sensor array
elements 50 with other electro-optical components. The spiral
ribbon configuration 20 can also minimize deflection in critical
optical image processing components. The spiral ribbon
configuration 20 will further accommodate a wide variety of sensor
patterns including the "cosine squared example shown while
providing a thermal path to the heat sink, e.g., core structural
body 15.
[0023] Also, and advantageously, the fiber optical cables 55 of the
sensor array elements 50 can be draped and mounted to an inside
curvature of the spiral ribbon configuration 20, allowing all the
fiber optical cables to have equal length. In alternative
embodiments, the fiber optical cables 55 can be fed through holes
in each of the spiral walls, until it reaches a center location
20a. In this alternative configuration, the fiber optical cables 55
would also be configured to have equal length. In any embodiment
noted herein, the different configurations provide for a more
compact and efficient method of feeding the fiber optical cables 55
of the sensor element 50 to other electronic components, compared
to conventional systems. For example, the fiber optical cables 55
can be wound in a spiral configuration to the center 20a of the
spiral ribbon configuration 20, where they can then be fed through
a machined through hole 45 (see FIG. 2) to a backside of the core
structural body 15.
[0024] Still referring more specifically to FIG. 2, the fiber
optical bundles 55 terminate (co-located) into a fiber optical comb
disk 55a (as shown in the inset of FIG. 2) at the center 20a of the
spiral ribbon configuration 20 (or the configurations shown in
FIGS. 7a-7d). The fiber optical comb disk 55a can then be inserted
through the machined through hole 45 in the center 20a of the
spiral ribbon configuration 20. The fiber optical comb disk 55a can
be fed to, for example, an optical camera or other electro-optical
devices mounted on a backside of the core structural body 15 (see,
e.g., FIG. 6). In embodiments, the machined through hole 45 is a
tight-tolerance machined tube 45 with spline cuts 45a in order to
maintain proper optical alignment between the optical fibers 55 and
the optical camera or other electro-optical devices. The
tight-tolerance machined tube 45 can also minimize deflections.
[0025] As further shown in FIGS. 1 and 2, a plurality of additional
heat sink fins 25 can be provided on the surface of the core
structural body 15. In embodiments, the heat sink fins 25 are
provided remotely from the spiral ribbon configuration 20. Although
these heat sink fins 25 are shown on each corner of the core
structural body 15, other configurations/patterns are also
contemplated by the present invention. For example, the heat sink
fins 25 can be placed at edges of the core structural body 15 or at
alternate or other combinations of corners and sides of the core
structural body 15. In any scenario, the heat sink fins 25 can be
machined directly from the core structural body 15, much like the
spiral ribbon configuration 20.
[0026] The heat exchanger and structural support 10 further
includes a forced convection system integrated into the core
structural body 15. For example, in embodiments, the forced
convection system includes a fan system comprising one or more fans
30, air inlets 35 at a first side or edge of the core structural
body 15 and air outlets 40 positioned remotely from the air inlets
35. The one or more fans 30 should preferably be located remotely
from the air inlets 35 and adjacent to the air outlets 40. The
present invention also contemplates other configurations such as a
single fan at a first side of the core structural body 15, with the
air inlets 35 at another side of the core structural body 15. The
heat exchanger can also be designed to use forced convection from
rotor downwash of a helicopter; however, the use of the forced
convection system of the present invention may enable operation
during ground maintenance without rotors turning.
[0027] FIG. 3 shows a cut-away view of the heat exchanger and
structural support 10, along line A-A of FIG. 2. In this view, the
back cover of the heat exchanger and structural support 10 is
removed to show the forced convection system integrated into the
core structural body 15. As shown in FIG. 3, for example, the
forced convection system includes a plurality of fins 35 extending
from the air inlets 35 to the one or more fans 30. In embodiments,
the plurality of fins 35a increases the surface area of the heat
exchanger for maximum heat dissipation, while also directly
channeling air to the one or more fans 30 by way of channels 35b. A
lightweight back cover, e.g., aluminum, can be provided over the
plurality of fins 35.
[0028] The fins 35a can be provided in a fanned configuration,
although other configurations are also contemplated by the present
invention, depending on the location of the air inlets 35 and the
one or more fans 30. For example, the plurality of fins 35a can
create parallel channels, when the one or more fans are located on
an opposite side of the air inlets 35. Also, the plurality of fins
35a are positioned (e.g., routed) so as to not interfere with the
feed through of the fiber optical comb disk 55a through the
machined through hole 45 (which extends through the cover). The
plurality of fins 35a can be machined from the core structural body
15, much like the spiral ribbon configuration 20.
[0029] FIG. 4 shows a plurality of sensor array elements 50 on a
printed wiring board, PWB, 60. In embodiments, the sensor array
elements 50 are provided as discrete elements in a spiral pattern
alignment, to match with the spiral ribbon configuration 20 of the
core structural body 15. By matching to the spiral ribbon
configuration 20 (or other patterns shown in FIGS. 7a-7d), it is
possible to mount the sensor array elements 50 directly onto the
walls of the spiral ribbon configuration 20 to improve heat
transfer capabilities, as shown representatively and schematically
in FIG. 2. In embodiments, the PWB 60 includes 220+ sensor array
elements 50 held in a spiral pattern alignment, each with a fiber
optical cable represented at reference numeral 55. In embodiments,
the fiber optical cable 55 from each sensor element 50 should have
a uniform length and terminate in a tightly tolerance array (e.g.,
fiber optical comb disk 55a as shown in FIG. 2) aligned with an
optical camera.
[0030] FIG. 5 shows the assembly process of the PWB 60 to the heat
exchanger and structural support 10, i.e., core structural body 15.
In the assembly process, the sensor array elements 50 of the PWB 60
are aligned with the spiral ribbon configuration 20 (or other
configurations described herein). The sensor array elements 50 of
the PWB 60 will then be lowered and bonded directly to the walls of
the spiral ribbon configuration 20. The PWB 60 will also be mounted
directly to the front face of the core structural body 15. In
embodiments, the assembly process will also include the feeding of
the fiber optical cables 55 about the spiral ribbon configuration
20, extending through the machined through hole 45 as a fiber
optical comb disk 55a. Processing/power components 65 and
electro-optical components 70 can be mounted to the back cover 15a
of the core structural body 15, with appropriate connection to the
fiber optical comb disk 55a. In embodiments, the sensors
configuration 20 may be populated prior to attachment to the heat
exchanger to aid in manufacturing and repair. For example, the
sensors and optical fibers may be soldered to the PWB prior to
attachment to the heat exchanger, and still be able to unsolder for
repair of individual sensor/fiber elements within the array.
[0031] FIG. 6 shows an assembled sensor array packaging solution in
accordance with aspects of the present invention. More
specifically, as shown in FIG. 6, the PWB 60 is mounted to the heat
exchanger and structural support 10, i.e., core structural body 15.
The sensor array elements 50 of the printed wiring board 60 are
mounted directly to the walls of the spiral ribbon configuration
20, and the PWB 60 is directly mounted to the core structural body
15. The PWB 60 can be bolted to the core structural body 15;
although other fastening mechanisms are also contemplated by the
present invention, e.g., adhesive bond, solder, clips, screws,
welding, etc.
[0032] In embodiments, the fiber optical comb disk 55a is provided
through the machined through hole 45 (and the cover 15a), and
coupled to the back end electronics 70, via camera optics and
related components. The back end electronics 70, e.g.,
electro-optical elements, and the power/processing unit 65 are
mounted to the back cover 15a of the core structural body 15. In
embodiments, the back end electronics 70, e.g., electro-optical
elements, and the power/processing unit 65 can be bolted to the
core structural body 15; although other fastening mechanisms are
also contemplated by the present invention, e.g., clips, screws,
etc. A rear cover 75 is mounted to the core structural body 15;
whereas, a radome 80 is mounted to a front face of the core
structural body 15. In embodiments, the rear cover 75 and radome 80
can be mounted by bolts, in a pattern dictated by electromagnetic
interference (EMI).
[0033] FIGS. 7a-7d show different configurations as contemplated by
the present invention. These different configurations include,
e.g., modified spiral or radial configuration (FIGS. 7a and 7c),
enlarged sunburst configuration (FIG. 7b) and compact stunburst
configuration (FIG. 7d). It should be understood that the
features/elements described with regard to FIGS. 1-6 can also
equally be implemented in these different configurations, e.g.,
fiber optical comb disk, machined through hole (tight-tolerance
machined tube with spline cuts), heat sink fins, etc.
[0034] In each of these embodiments, the walls can be
intermittently spaced apart walls; although or can be solid walls.
As shown more specifically in FIGS. 7a-7d, the different ribbon
configurations are configured and structured so as to provide
support for a plurality of sensor array elements 50, and their
respective fiber optical cables. To this end, the walls of the each
configuration are spaced apart to accommodate the sensor array
elements 50 directly mounted to the walls, and their respective
fiber optical cables 55. By providing a mounting structure for the
sensor array elements 50, the sensor array elements 50 can be
thermally and structurally bonded directly to the core structural
body 15, and more specifically directly to the walls of the
different configurations. This will, in turn, improve heat
dissipation and alignment processes of the sensor array elements 50
with other electro-optical components. The configurations shown in
FIGS. 7a-7d can also minimize deflection in critical optical image
processing components, and will further accommodate a wide variety
of sensor patterns including the "cosine squared example shown
while providing a thermal path to the heat sink, e.g., core
structural body 15.
[0035] Also, and advantageously, the fiber optical cables 55 of the
sensor array elements 50 can be draped and mounted to curvature of
the configuration 20, allowing all the fiber optical cables to have
equal length. In alternative embodiments, the fiber optical cables
55 can be fed through holes in each of the walls, until it reaches
a center location 20a. In this alternative configuration, the fiber
optical cables 55 would also be configured to have equal length. In
any embodiment noted herein, the different configurations provide
for a more compact and efficient method of feeding the fiber
optical cables 55 of the sensor element 50 to other electronic
components, compared to conventional systems. For example, the
fiber optical cables 55 can be wound in the appropriate
configuration to the center 20a of the each different
configuration, where they can then be fed through a machined
through hole 45 (see FIG. 2) to a backside of the core structural
body 15.
[0036] As should now be understood, the present invention provides
many advantages over conventional systems. For example, the sensor
array packaging solution of the present invention provides an
integration of electro-optical integration of components into a
single package which minimizes mass and assembly labor. By way of
illustration, again, the core structural body 15 becomes the
"central spine" for mounting the front radome, as well as sensor
array elements, fiber optics, camera, supporting electronics,
cooling fans, and rear cover. Also, by implementing the sensor
array packaging solution of the present invention, a lightweight
back cover and front radome materials are only required to protect
the assembly from external environments, allowing for minimum
weight. The integration of thermal and structural solutions into
one component also minimizes mass while withstanding the harsh
physical vibration and thermal environments of, e.g., helicopter
flight. The front surface, e.g., spiral ribbon configuration, of
the heat exchanger also provides relative location as well as
electrical connection for the sensor array elements.
[0037] It is noted that the foregoing examples have been provided
merely for the purpose of explanation and are in no way to be
construed as limiting of the present invention. While the present
invention has been described with reference to exemplary
embodiments, it is understood that the words which have been used
herein are words of description and illustration, rather than words
of limitation. Changes may be made, within the purview of the
appended claims, as presently stated and as amended, without
departing from the scope and spirit of the present invention in its
aspects. Although the present invention has been described herein
with reference to particular means, materials and embodiments, the
present invention is not intended to be limited to the particulars
disclosed herein; rather, the present invention extends to all
functionally equivalent structures, methods and uses, and
combinations thereof such as are within the scope of the appended
claims.
* * * * *