U.S. patent application number 14/966587 was filed with the patent office on 2016-06-16 for image sensors including non-aligned grid patterns.
The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Joonkyoung Lee, Yun Ki Lee.
Application Number | 20160172394 14/966587 |
Document ID | / |
Family ID | 56111943 |
Filed Date | 2016-06-16 |
United States Patent
Application |
20160172394 |
Kind Code |
A1 |
Lee; Yun Ki ; et
al. |
June 16, 2016 |
Image Sensors Including Non-Aligned Grid Patterns
Abstract
An image sensor includes a substrate including a first surface
and a second surface, a first device isolation layer disposed in
the substrate and defining a plurality of pixels in the substrate,
and having a lower surface adjacent the first surface of the
substrate and an upper surface adjacent the second surface of the
substrate. Each of the pixels includes a photoelectric conversion
element, a floating diffusion region adjacent the first surface of
the substrate, and a grid pattern on the second surface of the
substrate. At least one of the grid patterns is not vertically
aligned with the first device isolation layer.
Inventors: |
Lee; Yun Ki; (Seoul, KR)
; Lee; Joonkyoung; (Seoul, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-si |
|
KR |
|
|
Family ID: |
56111943 |
Appl. No.: |
14/966587 |
Filed: |
December 11, 2015 |
Current U.S.
Class: |
257/432 |
Current CPC
Class: |
H01L 27/14621 20130101;
H01L 27/14605 20130101; H01L 27/14607 20130101; H01L 27/14636
20130101; H01L 27/14634 20130101; H01L 27/1462 20130101; H01L
27/1463 20130101; H01L 27/1464 20130101; H01L 27/14629 20130101;
H01L 27/14609 20130101; H01L 27/14645 20130101; H01L 27/14627
20130101 |
International
Class: |
H01L 27/146 20060101
H01L027/146 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 11, 2014 |
KR |
10-2014-0178618 |
Claims
1. An image sensor comprising: a substrate including a first
surface and a second surface opposite the first surface; and a
first device isolation layer in the substrate and defining a
plurality of pixels in the substrate, the first device isolation
layer having a lower surface proximate the first surface of the
substrate and an upper surface proximate the second surface of the
substrate; wherein each of the plurality of pixels comprises: a
photoelectric conversion element; a floating diffusion region
adjacent the first surface of the substrate; and a grid pattern on
the second surface of the substrate, and wherein at least one of
the grid patterns is not vertically aligned with the first device
isolation layer.
2. The image sensor of claim 1, wherein the lower surface of the
first device isolation layer and the upper surface of the first
device isolation layer are opposite to each other.
3. The image sensor of claim 1, wherein the grid pattern vertically
overlaps with a partial region of the photoelectric conversion
element that is adjacent to the first device isolation layer.
4. The image sensor of claim 3, further comprising: an
interconnection structure on the first surface of the substrate; a
color filter on the second surface of the substrate and
corresponding to the photoelectric conversion element of one of the
pixels; and a micro-lens disposed on the color filter.
5. The image sensor of claim 4, wherein the pixels include a first
pixel and a second pixel, and wherein the color filter is disposed
between the grid pattern of the first pixel and the grid pattern of
the second pixel to cover the photoelectric conversion element of
the first pixel and a partial region of the photoelectric
conversion element of the second pixel
6. The image sensor of claim 5, wherein the micro-lens includes a
first point and a second point at which a top surface and a bottom
surface of the micro-lens meet each other, and wherein the first
point is aligned with one sidewall of the color filter and the
second point is aligned with another sidewall of the color
filter.
7. The image sensor of claim 5, wherein the micro-lens includes a
first point and a second point at which a top surface and a bottom
surface of the micro-lens meet each other, and wherein the first
point is disposed on a top surface of the color filter disposed in
the first pixel and the second point is disposed on a top surface
of the color filter disposed in the second pixel.
8. The image sensor of claim 4, wherein the pixels include a first
pixel and a second pixel, and wherein the color filter covers a top
surface of the grid pattern disposed in each of the pixels, the
image sensor further comprising: an isolation member between the
color filter of the first pixel and the color filter of the second
pixel.
9. The image sensor of claim 1, wherein a shortest distance between
a center of the grid pattern and the second surface of the
substrate is smaller than a shortest distance between the center of
the grid pattern and a midpoint of the upper surface of the first
device isolation layer.
10. The image sensor of claim 1, wherein the substrate comprises: a
central region; a first edge region surrounding a first side of the
central region and a third side of the central region adjacent to
the first side; and a second edge region surrounding a second side
of the central region and a fourth side of the central region
adjacent to the second side, wherein the pixels comprise: a first
pixel disposed in the first edge region; a second pixel disposed in
the central region; and a third pixel disposed in the second edge
region, and wherein the grid pattern disposed in the first pixel is
not vertically aligned with the first device isolation layer.
11. The image sensor of claim 10, wherein the grid pattern disposed
in the second pixel vertically overlaps with the first device
isolation layer in the second pixel.
12. The image sensor of claim 11, wherein the grid pattern disposed
in the third pixel is not vertically aligned with the first device
isolation layer.
13. The image sensor of claim 12, wherein the grid pattern disposed
in the first pixel vertically overlaps a partial region of the
photoelectric conversion element that is adjacent to the first
device isolation layer, wherein the partial region of the
photoelectric conversion element of the first pixel is spaced away
from the floating diffusion region of the first pixel, and wherein
the grid pattern in the third pixel vertically overlaps the
floating diffusion region of the third pixel which is adjacent to
the first device isolation layer.
14. The image sensor of claim 12, wherein shortest distances from
centers of the grid patterns to midpoints of the upper surface of
the first device isolation layers are gradually increased from the
central region toward the first edge region and are gradually
increased from the central region toward the second edge
region.
15. The image sensor of claim 14, wherein a distance by which the
grid pattern of the first pixel is shifted from the upper surface
of the first device isolation layer of the first pixel in a first
direction is greater than a distance by which the grid pattern of
the second pixel is shifted from the upper surface of the first
device isolation layer of the second pixel in the first direction,
wherein a distance by which the grid pattern of the third pixel is
shifted from the upper surface of the first device isolation layer
of the third pixel in a second direction opposite to the first
direction is greater than a distance by which the grid pattern of
the second pixel is shifted from the upper surface of the first
device isolation layer of the second pixel in the second direction,
and wherein the first and second directions are parallel to the
second surface of the substrate.
16. An image sensor comprising: a substrate; first and second
pixels in the substrate; a device isolation layer between the first
and second pixels; first and second color filters on the substrate
above the first and second pixels, respectively; and a grid pattern
on the substrate between the first and second color filters;
wherein the grid pattern is not vertically aligned with the device
isolation layer.
17. The image sensor of claim 16, wherein the grid pattern is
laterally offset from the device isolation layer.
18. The image sensor of claim 16, wherein the grid pattern overlaps
a partial region of a photoelectric conversion element in the first
pixel.
19. An image sensor comprising: a substrate; a plurality of pixels
in the substrate, each of the plurality of pixels comprising a
photoelectric conversion element; a plurality of device isolation
layers between respective ones of the plurality of pixels; a
plurality of color filters on the substrate above respective ones
of the plurality of pixels; and a plurality of grid patterns on the
substrate and disposed between respective ones of the color filters
and exposing the photoelectric conversion elements of the plurality
of pixels; wherein the plurality of grid patterns are laterally
offset from the plurality of device isolation layers.
20. The image sensor of claim 19, wherein the plurality of grid
patterns overlap partial regions of photoelectric conversion
elements of the plurality of pixels.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This U.S. non-provisional patent application claims priority
under 35 U.S.C. .sctn.119 to Korean Patent Application No.
10-2014-0178618, filed on Dec. 11, 2014, in the Korean Intellectual
Property Office, the disclosure of which is hereby incorporated by
reference in its entirety.
BACKGROUND
[0002] The inventive concepts relate to image sensors. More
particularly, the inventive concepts relate to image sensors with
improved sensitivity.
[0003] An image sensor is a semiconductor device that converts an
optical image into electrical signals. Image sensors include charge
coupled device (CCD) type image sensors and complementary
metal-oxide-semiconductor (CMOS) image sensors.
[0004] As semiconductor devices become more highly integrated, the
size of pixels of image sensors has been reduced. Although
decreasing the pixel size may increase the number of pixels that
can be formed in a given area, the increasing density of pixels may
cause an increase in crosstalk between pixels in an image sensor,
and the sensitivity of the image sensor may be reduced.
SUMMARY
[0005] Embodiments of the inventive concepts may provide image
sensors capable of improving sensitivity.
[0006] In an aspect, an image sensor may include: a substrate
including a first surface and a second surface; a first device
isolation layer disposed in the substrate to define pixels, the
first device isolation layer having one surface exposed by the
first surface and another surface exposed by the second surface; a
photoelectric conversion element disposed in the substrate of each
of the pixels; a floating diffusion region disposed in the
substrate of each of the pixels and exposed by the first surface of
the substrate; and a grid pattern disposed on the second surface of
the substrate of each of the pixels. At least one of the grid
patterns may not be vertically aligned with the first device
isolation layer.
[0007] In an embodiment, the one surface and the another surface of
the first device isolation layer may be opposite to each other.
[0008] In an embodiment, the grid pattern may vertically overlap
with a partial region of the photoelectric conversion element which
is adjacent to the first device isolation layer.
[0009] In an embodiment, the image sensor may further include: an
interconnection structure disposed on the first surface of the
substrate; a color filter disposed on the second surface of the
substrate to correspond to the photoelectric conversion element of
each of the pixels; and a micro-lens disposed on the color
filter.
[0010] In an embodiment, the pixels may include a first pixel and a
second pixel, and the color filter may be disposed between the grid
pattern of the first pixel and the grid pattern of the second pixel
to cover the photoelectric conversion element of the first pixel
and a partial region of the photoelectric conversion element of the
second pixel at the same time.
[0011] In an embodiment, the micro-lens may include a first point
and a second point at which a top surface and a bottom surface of
the micro-lens meet each other. The first point may be adjacent to
one sidewall of the color filter and the second point may be
adjacent to another sidewall of the color filter.
[0012] In an embodiment, the micro-lens may include a first point
and a second point at which a top surface and a bottom surface of
the micro-lens meet each other. The first point may be disposed on
a top surface of the color filter disposed in the first pixel and
the second point may be disposed on a top surface of the color
filter disposed in the 10 second pixel.
[0013] In an embodiment, the pixels may include a first pixel and a
second pixel, and the color filter may cover a top surface of the
grid pattern disposed in each of the pixels. In this case, the
image sensor may further include: an isolation part disposed
between the color filter of the first pixel and the color filter of
the second pixel.
[0014] In an embodiment, a shortest distance between a center of
the grid pattern and the second surface of the substrate may be
smaller than a shortest distance between the center of the grid
pattern and the another surface of the first device isolation
layer.
[0015] In an embodiment, the substrate may include: a central
region; a first edge region surrounding a first side of the central
region and a third side of the central region adjacent to the first
side; and a second edge region surrounding a second side of the
central region and a fourth side of the central region adjacent to
the second side. The pixels may include: a first pixel disposed in
the first edge region; a second pixel disposed in the central
region; and a third pixel disposed in the second edge region. The
grid pattern disposed in the first pixel may not be vertically
aligned with the first device isolation layer.
[0016] An image sensor according to further embodiments includes a
substrate, first and second pixels in the substrate, a device
isolation layer between the first and second pixels, first and
second color filters on the substrate above the first and second
pixels, respectively; and a grid pattern on the substrate between
the first and second color filters. The grid pattern is not
vertically aligned with the device isolation layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The inventive concepts will become more apparent in view of
the attached drawings and accompanying detailed description.
[0018] FIG. 1 is a circuit diagram illustrating an image sensor
according to some embodiments of the inventive concepts;
[0019] FIG. 2 is a plan view illustrating an image sensor according
to some embodiments of the inventive concepts;
[0020] FIG. 3 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts;
[0021] FIG. 4 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts;
[0022] FIG. 5 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts;
[0023] FIG. 6 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts;
[0024] FIG. 7 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts;
[0025] FIG. 8 illustrates cross-sectional views taken along lines
II-II', III-III', and IV-IV' of FIG. 2 to illustrate an image
sensor according to some embodiments of the inventive concepts;
[0026] FIG. 9 illustrates cross-sectional views taken along lines
II-II', V-V', and III-III' of FIG. 2 to illustrate an image sensor
according to some embodiments of the inventive concepts;
[0027] FIG. 10 is a schematic block diagram illustrating an
electronic system including an image sensor according to some
embodiments of the inventive concepts; and
[0028] FIGS. 11 to 15 illustrate embodiments of multimedia devices
implemented with image sensors according to some embodiments of the
inventive concepts.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] The inventive concepts will now be described more fully
hereinafter with reference to the accompanying drawings, in which
exemplary embodiments of the inventive concepts are shown. The
advantages and features of the inventive concepts and methods of
achieving them will be apparent from the following exemplary
embodiments that will be described in more detail with reference to
the accompanying drawings. It should be noted, however, that the
inventive concepts are not limited to the following exemplary
embodiments, and may be implemented in various forms. Accordingly,
the exemplary embodiments are provided only to disclose the
inventive concepts and let those skilled in the art know the
category of the inventive concepts. In the drawings, embodiments of
the inventive concepts are not limited to the specific examples
provided herein and are exaggerated for clarity.
[0030] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to limit the
invention. As used herein, the singular terms "a," "an" and "the"
are intended to include the plural forms as well, unless the
context clearly indicates otherwise. As used herein, the term
"and/or" includes any and all combinations of one or more of the
associated listed items. It will be understood that when an element
is referred to as being "connected" or "coupled" to another
element, it may be directly connected or coupled to the other
element or intervening elements may be present.
[0031] Similarly, it will be understood that when an element such
as a layer, region or substrate is referred to as being "on"
another element, it can be directly on the other element or
intervening elements may be present. In contrast, the term
"directly" means that there are no intervening elements. It will be
further understood that the terms "comprises", "comprising,",
"includes" and/or "including", when used herein, specify the
presence of stated features, integers, steps, operations, elements,
and/or components, but do not preclude the presence or addition of
one or more other features, integers, steps, operations, elements,
components, and/or groups thereof.
[0032] It will be understood that references herein to "an element
A not vertically overlapping an element B" (or similar language)
means that no vertical line exists that intersects both the
elements A and B.
[0033] Additionally, the embodiment in the detailed description
will be described with sectional views as ideal exemplary views of
the inventive concepts. Accordingly, shapes of the exemplary views
may be modified according to manufacturing techniques and/or
allowable errors. Therefore, the embodiments of the inventive
concepts are not limited to the specific shape illustrated in the
exemplary views, but may include other shapes that may be created
according to manufacturing processes. Areas exemplified in the
drawings have general properties, and are used to illustrate
specific shapes of elements. Thus, this should not be construed as
limited to the scope of the inventive concepts.
[0034] It will be also understood that although the terms first,
second, third etc. may be used herein to describe various elements,
these elements should not be limited by these terms. These terms
are only used to distinguish one element from another element.
Thus, a first element in some embodiments could be termed a second
element in other embodiments without departing from the teachings
of the present invention. Exemplary embodiments of aspects of the
present inventive concepts explained and illustrated herein include
their complementary counterparts. The same reference numerals or
the same reference designators denote the same elements throughout
the specification.
[0035] Moreover, exemplary embodiments are described herein with
reference to cross-sectional illustrations and/or plane
illustrations that are idealized exemplary illustrations.
Accordingly, variations from the shapes of the illustrations as a
result, for example, of manufacturing techniques and/or tolerances,
are to be expected. Thus, exemplary embodiments should not be
construed as limited to the shapes of regions illustrated herein
but are to include deviations in shapes that result, for example,
from manufacturing. For example, an etching region illustrated as a
rectangle will, typically, have rounded or curved features. Thus,
the regions illustrated in the figures are schematic in nature and
their shapes are not intended to illustrate the actual shape of a
region of a device and are not intended to limit the scope of
example embodiments.
[0036] FIG. 1 is a circuit diagram illustrating an image sensor
according to some embodiments of the inventive concepts. FIG. 2 is
a plan view illustrating an image sensor according to some
embodiments of the inventive concepts.
[0037] Referring to FIGS. 1 and 2, each pixel of an image sensor
may include a photoelectric conversion element PD, a transfer
transistor T.sub.X, a source follower transistor S.sub.X, a reset
transistor R.sub.X, and a selection transistor A.sub.X. The
transfer transistor T.sub.X, the source follower transistor
S.sub.X, the reset transistor R.sub.X, and the selection transistor
A.sub.X may include a transfer gate TG, a source follower gate SG,
a reset gate RG, and a selection gate AG, respectively. The
photoelectric conversion element PD may be a photodiode including
an N-type dopant region and a P-type dopant region. A drain of the
transfer transistor T.sub.X may be coupled to a floating diffusion
region FD. The floating diffusion region FD may also be coupled to
a source of the reset transistor R.sub.X. The floating diffusion
region FD may be electrically connected to the source follower gate
SG of the source follower transistor S.sub.X. The source follower
transistor S.sub.X may be connected to the selection transistor
A.sub.X. The reset transistor R.sub.X, the source follower
transistor S.sub.X, and the selection transistor A.sub.X may be
shared by adjacent pixels, which may increase an integration
density of the image sensor.
[0038] A method of operating the image sensor will be described
with reference to FIG. 1. First, in a dark state, a power voltage
VDD may be applied to a drain of the reset transistor R.sub.X and a
drain of the source follower transistor S.sub.X and the reset
transistor R.sub.x may be turned-on, so charges remaining in the
floating diffusion region FD may be discharged through the VDD
terminal. Thereafter, the reset transistor RX may be turned-off by
applying an appropriate voltage to the reset gate RG. And light may
be applied to the photoelectric conversion element PD, which causes
electron-hole pairs to be generated in a p-n junction of the
photoelectric conversion element PD. A built-in electric field in
the p-n junction of the photoelectric conversion element PD causes
the generated holes to move into and then accumulate in the P-type
dopant region of the photoelectric conversion element PD, and
causes generated electrons to move into and accumulate in the
N-type dopant region of the photoelectric conversion element PD.
The transfer transistor T.sub.X may be turned-on by applying an
appropriate voltage to the transfer gate TG to transfer charges
(e.g., elements) into the floating diffusion region FD. The
transferred charges may accumulate in the floating diffusion region
FD. A gate bias of the source follower transistor S.sub.X may
change in proportion to the amount of accumulated charges in the
floating diffusion region FD, which causes variation in a source
potential of the source follower transistor S.sub.X. At this time,
if the selection transistor A.sub.X is turned-on, a signal
generated by the charges may be sensed through a column line
Vout.
[0039] FIG. 2 is a plan view illustrating an image sensor according
to some embodiments of the inventive concepts. FIG. 3 is a
cross-sectional view taken along a line I-I' of FIG. 1 and
illustrates an image sensor according to some embodiments of the
inventive concepts. FIG. 4 is a cross-sectional view taken along a
line I-I' of FIG. 1 and illustrates an image sensor according to
some embodiments of the inventive concepts.
[0040] Referring to FIGS. 2 and 3, a substrate 100 may include a
first surface 100a and a second surface 100b. For example, the
first surface 100a may be a front side of the substrate 100, and
the second surface 100b may be a back side of the substrate 100.
For example, the substrate 100 may be a semiconductor substrate
(e.g., a silicon substrate, a germanium substrate, a
silicon-germanium substrate, a II-VI group compound semiconductor
substrate, or a III-V group compound semiconductor substrate) or a
silicon-on-insulator (SOI) substrate.
[0041] The substrate 100 may include a plurality of pixels PX. The
pixels PX may include a first pixel PX1 and a second pixel PX2. The
first pixel PX1 and the second pixel PX2 may be arranged in an
alternating and repeating fashion in a first direction X on the
substrate 100. The pixels PX may be defined by a deep device
isolation layer DTI formed in the substrate 100. The deep device
isolation layer DTI may be formed using a deep trench isolation
technique. The deep device isolation layer DTI may include a first
device isolation layer 103. The first device isolation layer 103
may include, for example, SiOC, SiO.sub.2, poly silicon, SiOCN. In
some embodiments, the first device isolation layer 103 may include
a cavity therein. A negative fixed charge layer 105 may be formed
on and may contact the first device isolation layer 103. The
negative fixed charge layer 105 may reduce leakage current by
inducing a hole accumulation layer on the substrate 100. For
example, the negative fixed charge layer 105 may include aluminium
oxide (e.g., Al.sub.2O.sub.3), tantalum oxide (e.g.,
Ta.sub.2O.sub.5) or hafnium oxide (e.g., HfO.sub.2).
[0042] The first device isolation layer 103 may penetrate the
substrate 100. The first device isolation layer 103 may include a
lower surface 102 and an upper surface 104 that may be opposite to
each other. The lower surface 102 of the first device isolation
layer 103 may be disposed at the same level as the first surface
100a of the substrate 100, and the upper surface 104 of the first
device isolation layer 103 may be disposed at the same level as the
second surface 100b of the substrate 100. In some embodiments, the
first device isolation layer 103 may extend for only a portion of
the substrate 100 in a vertical direction. The upper surface 104 of
the first device isolation layer 103 may be disposed at the same
level as the second surface 100b of the substrate 100 but the lower
surface 102 of the first device isolation layer 103 may be disposed
at a higher level than the first surface 100a of the substrate 100
such that the lower surface 102 of the first device isolation layer
103 may not contact the first surface 100a of the substrate 100.
The negative fixed charge layer 105 may be formed over and may
cover the second surface 100b of the substrate 100. Although FIG. 3
shows an interface between the first device isolation layer 103 and
the negative fixed charge layer 105, in some embodiments, the
interface may be not invisible. In some embodiments, the first
device isolation layer 103 and the negative fixed charge layer 105
may have a unitary structure.
[0043] A photoelectric conversion element PD may be disposed in the
substrate 100 of each of the pixels PX. The photoelectric
conversion element PD may be spaced away from the first surface
100a of the substrate 100. For example, the photoelectric
conversion element PD may include a region doped with N-type
dopants. A well region 107 may be disposed in the substrate 100 of
each of the pixels PX. The well region 107 may be near or adjacent
to the first surface 100a of the substrate 100. The well region 107
may be a region doped with P-type dopants, so that a p-n junction
is formed between the photoelectric conversion element PD and the
well region 107.
[0044] A floating diffusion region FD may be disposed in the
substrate 100 (e.g., the well region 107) of each of the pixels PX.
The floating diffusion region FD may be near or adjacent to the
first surface 100a of the substrate 100. The floating diffusion
region FD may be a region doped with dopants of which a
conductivity type is opposite to that of the dopants of the well
region 107. The floating diffusion region FD may be, for example, a
region doped with N-type dopants. A transfer gate TG may be
disposed on the first surface 100a of the substrate 100. The
transfer gate TG may be disposed in each of the pixels PX. The
transfer gate TG may be adjacent to the floating diffusion region
FD.
[0045] An interconnection structure 110 may be disposed on the
first surface 100a of the substrate 100. The interconnection
structure 110 may include a plurality of interlayer insulating
layers 11 and interconnections 113. A first interlayer insulating
layer 11a that is in contact with the first surface 100a of the
substrate 100 may cover the transfer gate TG. A plurality of
through-vias 115 may penetrate the first interlayer insulating
layer 111a on the first surface 100a of the substrate 100. Each
through-via 115 may be in contact with one of the floating
diffusion regions FD.
[0046] An anti-reflection layer 120 may be formed over the negative
fixed charge layer 105 and may be disposed on the second surface
100b of the substrate 100. The anti-reflection layer 120 may
completely cover the negative fixed charge layer 105. The
anti-reflection layer 120 may reduce or prevent the reflection of
light, such that the light incident on the second surface 100b of
the substrate 100 can efficiently reach the photoelectric
conversion element PD. The negative fixed charge layer 105 may also
have an anti-reflection effect. Although FIG. 3 illustrates that
the anti-reflection layer 120 is a single layer, in some
embodiments, the anti-reflection layer 120 may include more than
two layers. For example, the anti-reflection layer 120 may include
Al.sub.2O.sub.3 and/or Ta.sub.2O. In some embodiments, the negative
fixed charge layer 105 may include Al.sub.2O.sub.3 and/or
Ta.sub.2O.
[0047] A grid pattern 123 may be disposed on the anti-reflection
layer 120. In more detail, the grid pattern 123 may generally be
disposed on the second surface 100b of the substrate 100 of each of
the pixels PX, with the negative fixed charge layer 105 and the
anti-reflection layer 120 between the grid pattern 123 and the
second surface 100b of the substrate 100. The grid patterns 123 may
be formed of a reflective material in some embodiments. In some
embodiments, an interface between the grid patterns and the color
filters CF (discussed below) may be a reflective interface. The
grid pattern 123 may include a conductive material (e.g.,
aluminum(Al), copper(Cu), or silver(Ag)). The grid pattern 123 may
not be vertically aligned with the first device isolation layer
103. The grid pattern 123 may vertically overlap with a partial
region SR of the photoelectric conversion element PD. The partial
region SR may be a portion of the photoelectric conversion element
PD. Thus, the partial region SR may include a region doped with
N-type dopants. The partial region SR of the photoelectric
conversion element PD may be adjacent to the first device isolation
layer 103 and may be disposed far away from the floating diffusion
region FD. That is, the partial region SR may be disposed near a
first vertical sidewall 106a of the photoelectric conversion
element PD, while the floating diffusion region FD may be
positioned nearer to a second vertical sidewall 106b of the
photoelectric conversion element PD that is opposite the first
vertical sidewall 106a. The shortest distance D1 between a center S
of the grid pattern 123 and the second surface 100b of the
substrate 100 may be smaller than the shortest distance D2 between
the center S of the grid pattern 123 and the a midpoint of the
upper surface 104 of the first device isolation layer 103. The grid
pattern 123 may guide light L that is incident obliquely on the
second surface 100b of the substrate 100 to a corresponding pixel
PX. In other words, the obliquely incident light L may be reflected
by the grid pattern 123 into the photoelectric conversion element
PD of the corresponding pixel PX.
[0048] In some embodiments, a central vertical axis CA_G of the
grid pattern 123 may be offset in a third direction Z that is
opposite to the first direction X from a central vertical axis CA_D
of the device isolation layer 103 by a distance D3 as illustrated
in FIG. 3. The central vertical axis CA_G of the grid pattern 123
may pass through the center S of the grid pattern 123, and the
central vertical axis CA_D of the device isolation layer 103 may
pass through the midpoint of the upper surface 104 of the first
device isolation layer 103. Further, the central vertical axis CA_G
of the grid pattern 123 may be offset in the third direction Z from
the central vertical axis CA_D of the device isolation layer 103
toward the photoelectric conversion element PD. Referring again to
FIG. 2, the central vertical axis CA_G of the grid pattern 123 may
be offset in the third direction Z from the central vertical axis
CA_D of the device isolation layer 103 toward one of opposing short
sides of the image sensor that is closer to the pixel PX1. The grid
pattern 123 may vertically overlap the photoelectric conversion
element PD by a length L0 as illustrated in FIG. 3.
[0049] According to FIG. 4, the grid pattern 123 may be omitted. In
this case, the obliquely incident light L may be reflected by the
deep device isolation layer DTI (e.g., the first device isolation
layer 103) into the corresponding pixel PX. Thus, the deep device
isolation layer DTI may include a material having an index of
refraction less than an index of refraction of the substrate. For
example, the deep device isolation layer DTI may be formed of a
silicon oxide layer.
[0050] Referring again to FIGS. 2 and 3, color filters CF may be
disposed on the anti-reflection layer 120. The color filters CF may
include a first color filter CF1 and a second color filter CF2. The
first color filter CF1 and the second color filter CF2 may be
alternately and repeatedly arranged in the first direction X. Each
of the color filters CF may be disposed between the grid patterns
123 adjacent to each other. In detail, the first color filters CF1
may be disposed on the photoelectric conversion elements PD of the
first pixels PX1 in one-to-one correspondence. The second color
filters CF2 may be disposed on the photoelectric conversion
elements PD of the first pixels PX2 in one-to-one correspondence.
In more detail, the first color filter CF1 may cover the
photoelectric conversion element PD of the first pixel PX1 and the
partial region SR of the photoelectric conversion element PD of the
second pixel PX2 adjacent to the first pixel PX1 at the same time.
The second color filter CF2 may cover the photoelectric conversion
element PD of the second pixel PX2 and the partial region SR of the
photoelectric conversion element PD of the first pixel PX1 adjacent
to the second pixel PX2 at the same time.
[0051] Micro-lenses 125 may be disposed on the color filters CF.
The micro-lenses 125 may be disposed on the color filters CF in
one-to-one correspondence. In detail, each of the micro-lenses 125
may have a convex top surface. The micro-lens 125 may include a
first point P1 and a second point P2 at which the top surface and a
bottom surface of the micro-lens 125 meet each other. The first
point P1 may fall on one sidewall 127a of the color filter CF, and
the second point P2 may fall on another sidewall 127b of the color
filter CF. The micro-lens 125 may have the same width as the color
filter CF.
[0052] Referring again to FIG. 3, if the grid pattern 123 is
vertically aligned with the deep device isolation layer DTI,
oblique light which may not be reflected by the grid pattern but
may pass through a first color filter may be provided into a
photoelectric conversion element of a neighboring pixel sensing a
second color. Thus, crosstalk may occur between adjacent pixels. In
other words, the sensitivity of the image sensor may be
deteriorated.
[0053] According to some embodiments of the inventive concepts, the
grid pattern 123 is not vertically aligned with the first device
isolation layer such that the oblique light L passing through the
first color filter CF1 can be provided into the photoelectric
conversion element PD of the first pixel PX1 sensing the same color
as the first color filter CF1. For example, if the light L is
obliquely incident from the left to the right, the grid pattern 123
may be moved from the first device isolation layer 103 to the left.
Thus, the light L may be reflected by the grid pattern 123 and then
incident on the corresponding photoelectric conversion element PD.
In addition, an incident direction of the light L may be closer to
the grid pattern 123 than the first device isolation layer 103.
Thus, even though the light L is not reflected by the grid pattern
123, the light L may be blocked by the first device isolation layer
103 and may be then incident on the corresponding photoelectric
conversion element PD. Thus, the crosstalk may be inhibited to
improve the sensitivity of the image sensor.
[0054] FIG. 5 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts. In FIG. 5, the same elements as
described in FIG. 3 will be indicated by the same reference
numerals or the same reference designators. The descriptions to the
same elements as in FIG. 3 will be omitted or mentioned briefly for
the purpose of ease and convenience in explanation.
[0055] Referring to FIG. 5, a grid pattern 123 may be formed on the
anti-reflection layer 120. The grid pattern 123 may be disposed on
the second surface 100b of the substrate 100 of each of the pixels
PX. The grid pattern 123 may not be vertically aligned with the
first device isolation layer 103. The grid pattern 123 may
vertically overlap with the partial region SR of the photoelectric
conversion element PD. Thus, the shortest distance D1 between the
center S of the grid pattern 123 and the second surface 100b of the
substrate 100 may be smaller than the shortest distance D2 between
the center S of the grid pattern 123 and the midpoint of the upper
surface 104 of the first device isolation layer 103.
[0056] The color filters CF may be disposed on the anti-reflection
layer 120. The color filters CF may include the first color filters
CF1 and the second color filters CF2. Each of the color filters CF
may be disposed between the grid patterns 123 adjacent to each
other. In detail, the first color filters CF1 may be disposed on
the photoelectric conversion elements PD of the first pixels PX1 in
one-to-one correspondence. The second color filters CF2 may be
disposed on the photoelectric conversion elements PD of the first
pixels PX2 in one-to-one correspondence. In more detail, the first
color filter CF1 may cover the photoelectric conversion element PD
of the first pixel PX1 and the partial region SR of the
photoelectric conversion element PD of the second pixel PX2
adjacent to the first pixel PX1 at the same time. The second color
filter CF2 may cover the photoelectric conversion element PD of the
second pixel PX2 and the partial region SR of the photoelectric
conversion element PD of the first pixel PX1 adjacent to the second
pixel PX2 at the same time.
[0057] Micro-lenses 125 may be disposed on the color filters CF. In
the embodiments of FIG. 5, the micro-lenses 125 may not be
vertically aligned with the color filters CF, respectively. For
example, the first point P1 of the micro-lens 125 may be in contact
with a top surface of the second color filter CF2, and the second
point P2 of the micro-lens 125 may be in contact with a top surface
of the first color filter CF1. In other words, the first and second
points P1 and P2 may not be aligned with the sidewalls 127a and
127b of the color filters CF.
[0058] FIG. 6 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts. In FIG. 6, the same elements as
described in FIG. 3 will be indicated by the same reference
numerals or the same reference designators. The descriptions to the
same elements as in FIG. 3 will be omitted or mentioned briefly for
the purpose of ease and convenience in explanation.
[0059] Referring to FIG. 6, an isolation member 130 may be disposed
on the anti-reflection layer 120. The isolation member 130 may be
disposed on the first device isolation layer 103. In some
embodiments, the isolation member 130 may be vertically aligned
with the first device isolation layer 103. The isolation member 130
may physically isolate the color filters CF respectively disposed
in the pixels PX from each other. The isolation member 130 may
include, for example, air.
[0060] The grid pattern 123 may be disposed on the anti-reflection
layer 120. The grid pattern 123 may be disposed on the second
surface 100b of the substrate 100 of each of the pixels PX. The
grid pattern 123 may be disposed beside the isolation member 130,
so that the grid pattern 123 may not be vertically aligned with the
first device isolation layer 103. The grid pattern 123 may
vertically overlap with the partial region SR of the photoelectric
conversion element PD. Thus, the shortest distance D1 between the
center S of the grid pattern 123 and the second surface 100b of the
substrate 100 may be smaller than the shortest distance D2 between
the center S of the grid pattern 123 and the midpoint of the upper
surface 104 of the first device isolation layer 103.
[0061] The color filters CF may be disposed on the anti-reflection
layer 120. Each of the color filters CF may cover the grid pattern
123 formed on respective ones of the pixels PX. The color filters
CF may be disposed on the photoelectric conversion elements PD of
the pixels PX in one-to-one correspondence. In detail, the first
color filter CF1 may completely overlap with the photoelectric
conversion element PD of the first pixel PX1. The first color
filter CF1 may not overlap with the partial region SR of the
photoelectric conversion element PD of the second pixel PX2. The
second color filter CF2 may completely overlap with the
photoelectric conversion element PD of the second pixel PX2. The
second color filter CF2 may not overlap with the partial region SR
of the photoelectric conversion element PD of the first pixel
PX1.
[0062] Micro-lenses 125 may be disposed on the color filters CF.
The micro-lenses 125 may be disposed on the color filters CF in
one-to-one correspondence.
[0063] FIG. 7 is a cross-sectional view taken along a line I-I' of
FIG. 1 to illustrate an image sensor according to some embodiments
of the inventive concepts. In FIG. 7, the same elements as
described in FIG. 3 will be indicated by the same reference
numerals or the same reference designators. The descriptions to the
same elements as in FIG. 3 will be omitted or mentioned briefly for
the purpose of ease and convenience in explanation.
[0064] Referring to FIG. 7, a deep device isolation layer DTI may
be formed in a substrate 100 to define pixels PX. The pixels PX may
include first pixels PX1 and second pixels PX2. A lower surface 102
of the deep device isolation layer DTI may be disposed in the
substrate 100. An upper surface 104 of the deep device isolation
layer DTI may be disposed at the same level as the first surface
100a of the substrate 100. Thus, the upper surface 104 of the deep
device isolation layer DTI may be exposed by the first surface 100a
of the substrate 100. A photoelectric conversion element PD and a
well region 107 may be disposed in the substrate 100 of each of the
pixels PX. A floating diffusion region FD may be disposed in the
well region 107 of each of the pixels PX.
[0065] A transfer gate TG may be disposed on the first surface 100a
of the substrate 100. The transfer gate TG may be disposed in each
of the pixels PX and may be adjacent to the floating diffusion
region FD. An interconnection structure 110 may be disposed on the
first surface 100a of the substrate 100. The interconnection
structure 110 may include interlayer insulating layers 111 and
interconnections 113. A first interlayer insulating layer 111a
which is in contact with the first surface 100a of the substrate
100 may cover the transfer gate TG. A through-via 115 that
penetrates the first interlayer insulating layer 111a may be in
contact with the floating diffusion region FD of each of the pixels
PX.
[0066] An anti-reflection layer 120 may be disposed on the
interconnection structure 110. A grid pattern 123 may be disposed
on the anti-reflection layer 120. In detail, the grid pattern 123
may be disposed on the first surface 100a of the substrate 100 of
each of the pixels PX. The grid pattern 123 may not be vertically
aligned the deep device isolation layer DTI. The grid pattern 123
may vertically overlap with a partial region SR of the
photoelectric conversion element PD. The shortest distance D1
between a center S of the grid pattern 123 and the first surface
100a of the substrate 100 may be smaller than the shortest distance
D2 between the center S of the grid pattern 123 and the midpoint of
the upper surface 104 of the deep device isolation layer DTI.
[0067] In some embodiments, a central vertical axis CA_G of the
grid pattern 123 may be offset in the third direction Z from a
central vertical axis CA_D of the deep device isolation layer DTI
by a distance D3 as illustrated in FIG. 7. The central vertical
axis CA_G of the grid pattern 123 may pass through the center S of
the grid pattern 123, and the central vertical axis CA_D of the
deep device isolation layer DTI may pass through the midpoint of
the upper surface 104 of the deep device isolation layer DTI.
Further, the central vertical axis CA_G of the grid pattern 123 may
be offset in the third direction Z from the central vertical axis
CA_D of the deep device isolation layer DTI toward the
photoelectric conversion element PD. Referring again to FIG. 2, the
central vertical axis CA_G of the grid pattern 123 may be offset in
the third direction Z from the central vertical axis CA_D of the
deep device isolation layer DTI toward one of opposing short sides
of the image sensor that is closer to the pixel PX1. The grid
pattern 123 may vertically overlap the photoelectric conversion
element PD by a length L0 as illustrated in FIG. 7.
[0068] Color filters CF may be disposed on the anti-reflection
layer 120. The color filters CF may include first color filters CF1
and second color filters CF2. Each of the color filters CF may be
disposed between the grid patterns 123 adjacent to each other. In
detail, the first color filters CF1 may be disposed on the
photoelectric conversion elements PD of the first pixels PX1 in
one-to-one correspondence, and the second color filters CF2 may be
disposed on the photoelectric conversion elements PD of the first
pixels PX2 in one-to-one correspondence. In more detail, the first
color filter CF1 may cover the photoelectric conversion element PD
of the first pixel PX1 and the partial region SR of the
photoelectric conversion element PD of the second pixel PX2
adjacent to the first pixel PX1 at the same time. The second color
filter CF2 may cover the photoelectric conversion element PD of the
second pixel PX2 and the partial region SR of the photoelectric
conversion element PD of the first pixel PX1 adjacent to the second
pixel PX2 at the same time.
[0069] Micro-lenses 125 may be disposed on the color filters CF.
The micro-lenses 125 may be disposed on the color filters CF in
one-to-one correspondence. In detail, the micro-lens 125 may
include a first point P1 and a second point P2 at which top and
bottom surfaces of the micro-lens 125 meet each other. The first
point P1 may be collinear with one sidewall 127a of the color
filter CF, and the second point P2 may be collinear with another
sidewall 127b of the color filter CF.
[0070] FIG. 8 illustrates cross-sectional views taken along line
II-II', III-III', and IV-IV' of FIG. 2 to illustrate an image
sensor according to some embodiments of the inventive concepts. In
FIG. 8, the same elements as described in FIG. 3 will be indicated
by the same reference numerals or the same reference designators.
The descriptions to the same elements as in FIG. 3 will be omitted
or mentioned briefly for the purpose of ease and convenience in
explanation.
[0071] Referring to FIGS. 2 and 8, a substrate 100 may include a
plurality of pixels PX. The pixels PX may be arranged in a first
direction X and a second direction Y perpendicular to the first
direction X. The substrate 100 may include a central region CR, a
first edge region PR1, and a second edge region PR2 when viewed
from a plan view. The first edge region PR1 may surround a first
side S1 a third side S3 of the central region CR when viewed from a
plan view. The third side S3 may be adjacent to the first side S1.
The second edge region PR2 may surround a second side S2 and a
fourth side S4 of the central region CR when viewed from a plan
view. The fourth side S4 may be adjacent to the second side S2. The
first side S1 and the second side S2 of the central region CR may
face each other in the first direction X, and the third side S3 and
the fourth side S4 of the central region CR may face each other in
the second direction Y. The first edge region PR1 may include a
first pixel PX1a, the central region CR may include a second pixel
PX2a, and the second edge region PR2 may include a third pixel
PX3a. A center of the image sensor may be closer to the second
pixel PX2a than to the first pixel PX1a and the third pixel PX3a,
and the first pixel PX1a and the third pixel PX3a may be in
opposite regions of the image sensor with respect to the center of
the image sensor as illustrated in FIG. 2.
[0072] The first to third pixels PX1a, PX2a, and PX3a may be
defined by a deep device isolation layer DTI which may be formed in
the substrate 100 by a deep trench isolation technique.
[0073] A photoelectric conversion element PD and a well region 107
may be formed in the substrate 100 of each of the pixels. The
photoelectric conversion element PD may be spaced apart from the
first surface 100a of the substrate 100, and the well region 107
may be adjacent to the first surface 100a of the substrate. A
floating diffusion region PD may be disposed in the well region
107. A transfer gate TG may be disposed on the first surface 100a
of the substrate 100. The transfer gate TG may be disposed in each
of the pixels PX and may be adjacent to the floating diffusion
region FD.
[0074] An interconnection structure 110 may be disposed on the
first surface 100a of the substrate 100. An anti-reflection layer
120 may be disposed on the second surface 100b of the substrate 100
to cover the negative fixed charge layer 105 of the deep device
isolation layer DTI.
[0075] A grid pattern may be disposed on the anti-reflection layer
120 of each of the pixels X. A first grid pattern 123a disposed in
the first pixel PX1a may not be vertically aligned with the first
device isolation layer 103. In more detail, the first grid pattern
123a may vertically overlap with a partial region SR of the
photoelectric conversion element PD of the first pixel PX1a. The
partial region SR of the photoelectric conversion element PD may be
adjacent to the first device isolation layer 103 and may be
disposed far away from the floating diffusion region FD. As a
result, the shortest distance D1 between a center S of the first
grid pattern 123a and the second surface 100b of the substrate 100
may be smaller than the shortest distance D2 between the center S
of the first grid pattern 123a and the midpoint of the upper
surface 104 of the first device isolation layer 103.
[0076] According to FIG. 8, a central vertical axis CA_G of the
first grid pattern 123a may be offset in the third direction Z from
a central vertical axis CA_D of the first device isolation layer
103 by a distance D3a. The central vertical axis CA_G of the first
grid pattern 123a may be offset in the third direction Z from the
central vertical axis CA_D of the first device isolation layer 103
toward the photoelectric conversion element PD. Referring again to
FIG. 2, the central vertical axis CA_G of the first grid pattern
123a may be offset in the third direction Z from the central
vertical axis CA_D of the first device isolation layer 103 toward a
first one of opposing short sides of the image sensor that is
closer to the first pixel PX1a. The first grid pattern 123a may
vertically overlap the photoelectric conversion element PD by a
length La as illustrated in FIG. 8.
[0077] In contrast, a second grid pattern 123b disposed in the
second pixel PX2a may vertically overlap, and in some cases be
vertically aligned, with the upper surface 104 of the first device
isolation layer 103. In other words, the second grid pattern 123b
may be vertically aligned with the first device isolation layer 103
in some embodiments. Thus, the shortest distance D1 between a
center S of the second grid pattern 123b and the second surface
100b of the substrate 100 may be greater than the shortest distance
D2 between the center S of the second grid pattern 123b and the
midpoint of the upper surface 104 of the first device isolation
layer 103.
[0078] A central vertical axis CA_G of the second grid pattern 123b
may not be offset from a central vertical axis CA_D of the first
device isolation layer 103 as illustrated in FIG. 8. An offset
between the central vertical axis CA_G of the second grid pattern
123b and the central vertical axis CA_D of the first device
isolation layer 103 may be substantially zero. In some embodiments,
the second grid pattern 123b may not vertically overlap the
photoelectric conversion element PD as illustrated in FIG. 8, and
an overlapping length between the second grid pattern 123b and the
photoelectric conversion element PD may be substantially zero.
[0079] A third grid pattern 123c disposed in the third pixel PX3a
may not be vertically aligned with the first device isolation layer
103. In more detail, the third grid pattern 123c may be vertically
aligned with the floating diffusion region FD of the third pixel
PX3a. As a result, the shortest distance D1 between a center S of
the third grid pattern 123c and the second surface 100b of the
substrate 100 may be smaller than the shortest distance D2 between
the center S of the third grid pattern 123c and the upper surface
104 of the first device isolation layer 103.
[0080] A central vertical axis CA_G of the third grid pattern 123c
may be offset in the first direction X from a central vertical axis
CA_D of the first device isolation layer 103 by a distance D3c as
illustrated in FIG. 8. The central vertical axis CA_G of the third
grid pattern 123c may be offset in the first direction X from the
central vertical axis CA_D of the first device isolation layer 103
toward the photoelectric conversion element PD. Referring again to
FIG. 2, the central vertical axis CA_G of the third grid pattern
123c may be offset in the first direction X from the central
vertical axis CA_D of the first device isolation layer 103 toward a
second one of the opposing short sides of the image sensor that is
closer to the third pixel PX3a. The third grid pattern 123c may
vertically overlap the photoelectric conversion element PD by a
length Lc as illustrated in FIG. 8.
[0081] The shortest distances D2 from the centers of the grid
patterns to the midpoints of the upper surfaces 104 of the first
device isolation layer 103 may be increased, in some embodiments
may be gradually increased, from the pixels PX of the central
region CR toward the pixels PX of the first edge region PR1. For
example, the shortest distances D2 from the centers of the grid
patterns to the midpoints of the upper surfaces 104 of the first
device isolation layer 103 may be increased from the second pixel
PX1a toward the first pixel PX2a. Thus, when viewed from a plan
view, a distance by which the first grid pattern 123a is shifted
from the upper surface 104 of the first device isolation layer 103
in the third direction Z opposite to the first direction X in the
first pixel PX1a may be greater than a distance by which the second
grid pattern 123b is shifted from the upper surface 104 of the
first device isolation layer 103 in the third direction Z in the
second pixel PX2a. In addition, the shortest distances D2 from the
centers of the grid patterns to the midpoints of the upper surfaces
104 of the first device isolation layer 103 may be increased, in
some embodiments may be gradually increased, from the pixels PX of
the central region CR toward the pixels PX of the second edge
region PR2. For example, the shortest distances D2 from the centers
of the grid patterns to the midpoints of the upper surfaces 104 of
the first device isolation layer 103 may be increased, in some
embodiments may be gradually increased, from the second pixel PX2a
toward the third pixel PX3a. Thus, when viewed from a plan view, a
distance by which the third grid pattern 123c is shifted from the
upper surface 104 of the first device isolation layer 103 in the
first direction X in the third pixel PX3a may be greater than a
distance by which the second grid pattern 123b is shifted from the
upper surface 104 of the first device isolation layer 103 in the
first direction X in the second pixel PX2a.
[0082] First light L1 incident on the first PX1a may be oblique to
the second surface 100b of the substrate 100, second light L2
incident on the second pixel PX2a may be substantially
perpendicular to the second surface 100b of the substrate 100, and
third light L3 incident on the third pixel PX3a may be oblique to
the second surface 100b of the substrate. Incident directions of
the first and third lights L1 and L3 may be symmetrical. For
example, the first light L1 may be obliquely incident from the left
to the right, and the third light L3 may be obliquely incident from
the right to the left.
[0083] Color filters CF may be disposed on the anti-reflection
layer 120. Each of the color filters CF may be disposed between the
grid patterns 123 adjacent to each other. A first color filter CF1
disposed in the first pixel PX1a may cover the photoelectric
conversion element PD of the first pixel PX1a and a partial region
SR of another photoelectric conversion element PD adjacent to the
photoelectric conversion element PD of the first pixel PX1a at the
same time. A second color filter CF2 disposed in the second pixel
PX2a may completely cover the photoelectric conversion element PD
of the second pixel PX2a. A third color filter CF3 disposed in the
third pixel PX3a may cover the photoelectric conversion element PD
of the third pixel PX3a and a partial region SR of another
photoelectric conversion element PD adjacent to the photoelectric
conversion element PD of the third pixel PX3a at the same time.
[0084] Micro-lenses 125 may be disposed on the color filters CF.
The micro-lenses 125 may be disposed on the color filters CF in
one-to-one correspondence. The micro-lens 125 may include a first
point P1 and a second point P2 at which top and bottom surfaces of
the micro-lens 125 meet each other. The first point P1 may be
aligned with one sidewall 127a of the color filter CF, and the
second point P2 may be aligned with another sidewall 127b of the
color filter CF.
[0085] FIG. 9 illustrates cross-sectional views taken along line
II-II', V-V', and IV-IV' of FIG. 2 to illustrate an image sensor
according to some embodiments of the inventive concepts. The
cross-sectional views taken along the lines II-II' and IV-IV' are
similar to those illustrated in FIG. 8. Referring to FIGS. 2 and 9,
a fourth pixel PX4a may be in the first edge region PR1 in which
the first pixel PX1a is. The center of the image sensor may be
closer to the second pixel PX2a than to the fourth pixel PX4a, and
the center of the image sensor may be closer to the fourth pixel
PX4a than to the first pixel PX1a. The fourth pixel PX4a may be
also defined by a deep device isolation layer DTI which may be
formed in the substrate 100 by a deep trench isolation
technique.
[0086] Referring to FIG. 9, a fourth grid pattern 123d disposed in
the fourth pixel PX4a may not be vertically aligned with the first
device isolation layer 103 and may vertically overlap with a
partial region SR of the photoelectric conversion element PD of the
fourth pixel PX4a. The shortest distance D1 between a center S of
the fourth grid pattern 123d and the second surface 100b of the
substrate 100 may be smaller than the shortest distance D2 between
the center S of the fourth grid pattern 123d and the midpoint of
the upper surface 104 of the first device isolation layer 103. The
shortest distance D2 of the fourth pixel PX4a may be shorter than
the shortest distance D2 of the first pixel PX1a and may be longer
than the shortest distance D2 of the second pixel PX2a as
illustrated in FIG. 9. Accordingly, it will be understood that, in
some embodiments, the shortest distances D2 from the centers of the
grid patterns to the midpoints of the upper surfaces 104 of the
first device isolation layer 103 may be increased from the pixels
PX of the central region CR toward the pixels PX of the first edge
region PR1 or the second edge region PR2.
[0087] According to FIG. 9, a central vertical axis CA_G of the
fourth grid pattern 123d may be offset in the third direction Z
from a central vertical axis CA_D of the first device isolation
layer 103 by a distance D3d. The distance D3d may be less than the
distance D3a of the first pixel PX1a. The central vertical axis
CA_G of the fourth grid pattern 123d may be offset in the third
direction Z from the central vertical axis CA_D of the first device
isolation layer 103 toward the photoelectric conversion element PD.
The fourth grid pattern 123d may vertically overlap the
photoelectric conversion element PD by a length Ld, and the length
Ld may be shorter than the length La of the first pixel PX1a.
Therefore, it will be understood that, in some embodiments, an
offset between a central vertical axis of a grid pattern of a pixel
and a central vertical axis of a first device isolation layer 103
of the pixel may be increased from the center of the image sensor
to the first edge region PR1 or the second edge region PR2. Further
it will be understood that an overlapping length between a grid
pattern of a pixel and a photoelectric conversion element PD of the
pixel may be increased from the center of the image sensor to the
first edge region PR1 or the second edge region PR2.
[0088] FIG. 10 is a schematic block diagram illustrating an
electronic device including an image sensor according to some
embodiments of the inventive concepts.
[0089] An electronic device may be a digital camera or a mobile
device. Referring to FIG. 10, an electronic device may include an
image sensor 1000, a processor 1100, a memory device 1200, a
display device 1300, and a bus 1400. The image sensor 1000 may
capture external image information in response to control signals
of the processor 1100. The processor 1100 may store the captured
image information into the memory device 1200 through the bus 1400.
The processor 1100 may output the image information stored in the
memory device 1200 to the display device 1300.
[0090] FIGS. 11 to 15 illustrate embodiments of multimedia devices
implemented with image sensors according to some embodiments of the
inventive concepts.
[0091] At least one of the image sensors according to the above
embodiments of the inventive concepts may be applied to various
multimedia devices having an image photographing function. For
example, at least one of the image sensors according to the
inventive concepts may be applied to a mobile or smart phone 2000
illustrated in FIG. 11 and/or a tablet or smart tablet 3000
illustrated in FIG. 12. In addition, at least one of the image
sensors according to the inventive concepts may be applied to a
notebook computer 4000 illustrated in FIG. 13 and/or a television
or smart television 5000 illustrated in FIG. 14. Moreover, at least
one of the image sensors according to the inventive concepts may be
applied to a digital camera or digital camcorder 6000 illustrated
in FIG. 15.
[0092] In the image sensor according to some embodiments of the
inventive concepts, the grid pattern may not be vertically aligned
with the deep device isolation layer, so the oblique light may not
be incident on a neighboring pixel but may be incident on the
corresponding pixel. As a result, the sensitivity of the image
sensor may be improved.
[0093] While the inventive concepts have been described with
reference to example embodiments, it will be apparent to those
skilled in the art that various changes and modifications may be
made without departing from the spirits and scopes of the inventive
concepts. Therefore, it should be understood that the above
embodiments are not limiting, but illustrative. Thus, the scopes of
the inventive concepts are to be determined by the broadest
permissible interpretation of the following claims and their
equivalents, and shall not be restricted or limited by the
foregoing description.
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