U.S. patent application number 14/997108 was filed with the patent office on 2016-06-16 for nanostructures having low defect density and methods of forming thereof.
The applicant listed for this patent is Micron Technology, Inc.. Invention is credited to Gurtej S. Sandhu.
Application Number | 20160172195 14/997108 |
Document ID | / |
Family ID | 53495762 |
Filed Date | 2016-06-16 |
United States Patent
Application |
20160172195 |
Kind Code |
A1 |
Sandhu; Gurtej S. |
June 16, 2016 |
NANOSTRUCTURES HAVING LOW DEFECT DENSITY AND METHODS OF FORMING
THEREOF
Abstract
A method of forming nanostructure comprises forming
self-assembled nucleic acids on at least a portion of a substrate.
The method further comprises contacting the self-assembled nucleic
acids on the at least a portion of a substrate with a solution
comprising at least one repair enzyme to repair defects in the
self-assembled nucleic acids. The method may comprise repeating the
repair of defects in the self-assembled nucleic acids on the at
least a portion of a substrate until a desired, reduced threshold
level of defect density is achieved. A semiconductor structure
comprises a pattern of self-assembled nucleic acids defining a
template having at least one aperture therethrough. At least one of
the apertures has a dimension of less than about 50 nm.
Inventors: |
Sandhu; Gurtej S.; (Boise,
ID) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Micron Technology, Inc. |
Boise |
ID |
US |
|
|
Family ID: |
53495762 |
Appl. No.: |
14/997108 |
Filed: |
January 15, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14151635 |
Jan 9, 2014 |
9275871 |
|
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14997108 |
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Current U.S.
Class: |
257/769 ;
438/695 |
Current CPC
Class: |
H01L 21/3081 20130101;
H01L 2924/0002 20130101; B81C 1/00031 20130101; H01L 2221/1094
20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101; B81C
2201/0149 20130101; H01L 21/0332 20130101; H01L 21/0337 20130101;
H01L 21/76868 20130101; H01L 21/0338 20130101; H01L 21/3086
20130101; H01L 21/0335 20130101 |
International
Class: |
H01L 21/033 20060101
H01L021/033; H01L 21/768 20060101 H01L021/768 |
Claims
1. A semiconductor structure comprising a pattern of self-assembled
nucleic acids defining a template having at least one aperture
therethrough, the at least one aperture comprising at least one
dimension of less than about 50 nm.
2. The semiconductor structure of claim 1, wherein the pattern of
self-assembled nucleic acids comprise a pattern of self-assembled
ribonucleic acid (RNA) strands, deoxyribonucleic acid (DNA)
strands, peptide nucleic acid (PNA) strands, or combinations
thereof.
3. The semiconductor structure of claim 1, wherein the at least one
aperture in the pattern of self-assembled nucleic acids comprises
at least one dimension of less than about 40 nm.
4. The semiconductor structure of claim 1, wherein the at least one
aperture in the pattern of self-assembled nucleic acids comprises
at least one dimension of less than about 30 nm.
5. The semiconductor structure of claim 1, wherein the at least one
aperture in the pattern of self-assembled nucleic acids comprises
at least one dimension of less than about 20 nm.
6. The semiconductor structure of claim 1, wherein the at least one
aperture in the pattern of self-assembled nucleic acids comprises
at least one dimension of less than about 10 nm.
7. A semiconductor structure comprising a pattern of self-assembled
nucleic acids on a substrate, the pattern of self-assembled nucleic
acids comprising at least one aperture therethrough and the at
least one aperture comprising at least one dimension of less than
about 50 nm.
8. The semiconductor structure of claim 7, wherein the at least one
aperture extends into the substrate.
9. The semiconductor structure of claim 8, further comprising a
nanocomponent selected from the group consisting of a silicon
nanowire, a gold nanoparticle, a semiconductive quantum dot, a
fluorescent quantum dot, and combinations thereof in the at least
one aperture.
10. The semiconductor structure of claim 7, wherein the substrate
comprises gold, silver, silicon dioxide, or aluminum.
11. The semiconductor structure of claim 7, wherein the
self-assembled nucleic acids comprise self-assembled multi-stranded
nucleic acids, self-assembled scaffolded nucleic acids,
self-assembled single-stranded nucleic acids, or combinations
thereof.
12. A semiconductor structure comprising: a substrate comprising at
least one feature having at least one feature dimension of less
than about 50 nm, the at least one feature formed on the substrate
by a process comprising: forming a mask comprising a pattern of
self-assembled nucleic acids on a substrate; exposing the pattern
of self-assembled nucleic acids on the substrate to at least one
repair enzyme to repair defects in the self-assembled nucleic
acids; and forming the at least one feature on portions of the
substrate exposed through the mask.
13. The semiconductor structure of claim 12, wherein the at least
one feature dimension is less than about 40 nm.
14. The semiconductor structure of claim 12, wherein the at least
one feature dimension is less than about 30 nm.
15. The semiconductor structure of claim 12, wherein the at least
one feature dimension is less than about 20 nm.
16. The semiconductor structure of claim 12, wherein the at least
one feature dimension is less than about 10 nm.
17. The semiconductor structure of claim 12, wherein the at least
one feature comprises at least one of a silicon nanowire, a gold
nanoparticle, a semiconductive quantum dot, or a fluorescent
quantum dot.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. patent application
Ser. No. 14/151,635, filed Jan. 9, 2014, pending, the disclosure of
which is hereby incorporated herein in its entirety by this
reference.
FIELD
[0002] The present disclosure, in various embodiments, relates
generally to nanostructures comprising self-assembled nucleic acids
and exhibiting low defect density, and to methods of preparing such
nano structures.
BACKGROUND
[0003] A continuing goal of integrated circuit fabrication is to
decrease the dimensions thereof. Integrated circuit dimensions can
be decreased by reducing the dimensions and spacing of the
constituent features or structures. For example, by decreasing the
dimensions and spacing of semiconductor features (e.g., storage
capacitors, access transistors, access lines) of a memory device,
the overall dimensions of the memory device may be decreased while
maintaining or increasing the storage capacity of the memory
device.
[0004] As the dimensions and spacing of semiconductor device
features become smaller, conventional lithographic processes become
increasingly more difficult and expensive to conduct. Therefore,
significant challenges are encountered in the fabrication of
nanostructures, particularly structures having a feature dimension
(e.g., critical dimension) less than a resolution limit of
conventional photolithography techniques (currently about 50 nm).
It is possible to fabricate semiconductor structures of such
feature dimensions using a conventional lithographic process, such
as shadow mask lithography and e-beam lithography. However, use of
such processes is limited because the exposure tools are extremely
expensive or extremely slow and, further, may not be amenable to
formation of structures having dimensions of less than 50 nm.
[0005] The development of new processes, as well as materials
useful in such processes, is of increasing importance to make the
fabrication of small-scale devices easier, less expensive, and more
versatile. One example of a method of fabricating small-scale
devices that addresses some of the drawbacks of conventional
lithographic techniques is self-assembled block copolymer
lithography.
[0006] Although self-assembled block copolymer lithography is
useful for fabrication of semiconductor structures having
dimensions of less than 50 nm, there are still problems that must
be addressed. Self-assembled block copolymer materials may not
provide nanostructures exhibiting sufficiently low defect
levels.
[0007] Self-assembled nucleic acids have been researched for
forming semiconductor devices. The specificity of complementary
base pairing in nucleic acids provides self-assembled nucleic acids
that may be used for self-assembled nucleic acid lithography
processes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is a flowchart diagram showing a method of forming
nanostructures in accordance with one embodiment of the present
disclosure;
[0009] FIG. 2A shows self-assembled "multi-stranded" nucleic acids
according to one embodiment of the present disclosure;
[0010] FIG. 2B shows self-assembled "scaffolded" nucleic acids
according to one embodiment of the present disclosure;
[0011] FIG. 2C shows self-assembled "single-stranded" nucleic acids
according to one embodiment of the present disclosure; and
[0012] FIGS. 3A-3C are cross-sectional views of various stages of
using self-assembled nucleic acids as nano-scale templates or masks
to transfer the desired pattern to the substrate, according to one
embodiment of the present disclosure.
DETAILED DESCRIPTION
[0013] The following description provides specific details, such as
material types, material thicknesses, and processing conditions in
order to provide a thorough description of embodiments of the
disclosure. However, a person of ordinary skill in the art will
understand that embodiments of the present disclosure may be
practiced without employing these specific details. Indeed, the
embodiments of the present disclosure may be practiced in
conjunction with conventional fabrication techniques employed in
the industry.
[0014] In addition, the description provided herein does not form a
complete process flow for forming nanostructures. Only those
process acts and structures necessary to understand the embodiments
of the present disclosure are described in detail below. Additional
acts to form the complete nanostructures may be performed by
conventional fabrication techniques. Also the drawings accompanying
the application are for illustrative purposes only, and are thus
not necessarily drawn to scale. Elements common between figures may
retain the same numerical designation. Furthermore, while the
materials described and illustrated herein may be formed as layers,
the materials are not limited thereto and may be formed in other
three-dimensional configurations.
[0015] As used herein, the singular forms "a," "an," and "the" are
intended to include the plural forms as well, unless the context
clearly indicates otherwise.
[0016] As used herein, the term "nucleic acid" means and includes a
polymeric form of nucleotides (e.g., polynucleotides and
oligonucleotides) of any length that comprises purine and
pyrimidine bases, or chemically or biochemically modified purine
and pyrimidine bases. Nucleic acids may comprise single stranded
sequences, double stranded sequences, or portions of both double
stranded or single stranded sequences. As non-limiting example, the
nucleic acid may include ribonucleic acid (RNA), deoxyribonucleic
acid (DNA), peptide nucleic acid (PNA), or combinations thereof.
The backbone of the polynucleotide may comprise sugars and
phosphate groups as may typically be found in RNA or DNA, or
modified sugar and/or phosphate groups. Furthermore, the
polynucleotide may comprise modified nucleotides, such as
methylated nucleotides and nucleotide analogs.
[0017] As used herein, the term "substrate" means and includes a
base material or a construction upon which additional materials are
formed. Non-limiting example of the substrates may include glass,
mica, polystyrene, polypropylene, polyamides, polyesters,
polyacrylates, polyvinylchloride, polycarbonate, fluoropolymers,
fluorinated ethylene propylene, polyvinylidene,
polydimethylsiloxane, silicon, metals (e.g., gold, silver,
titanium), and stainless steel.
[0018] In some embodiments, the substrate may be a semiconductor
substrate, a base semiconductor material on a supporting structure,
a metal electrode, or a semiconductor substrate having one or more
materials, structures or regions formed thereon. By way of
non-limiting example, the semiconductor substrate may be a
conventional silicon substrate, or other bulk substrate comprising
a layer of semiconductive material. As used herein, the term "bulk
substrate" means and includes not only silicon wafers, but also
silicon-on-insulator (SOI) substrates, silicon-on-sapphire (SOS)
substrates and silicon-on-glass (SOG) substrates, epitaxial layers
of silicon on a base semiconductor foundation, or other
semiconductor or optoelectronic materials, such as
silicon-germanium (Si.sub.1-xGe.sub.x, where x is, for example, a
mole fraction between 0.2 and 0.8), germanium (Ge), gallium
arsenide (GaAs), gallium nitride (GaN), or indium phosphide (InP),
among others. Furthermore, when reference is made to a "substrate"
in the following description, previous process acts may have been
conducted to form materials, regions, or junctions in or on the
base semiconductor structure or foundation.
[0019] In one embodiment, a method of forming nanostructure may
comprise forming self-assembled nucleic acids on at least a portion
of a substrate, and repairing defects in the self-assembled nucleic
acids using at least one repair enzyme. As a non-limiting example,
the method may include process acts as shown in flow diagram 100 of
FIG. 1.
[0020] As shown in the FIG. 1, nucleic acids configured and
formulated to form the predetermined self-assembled structures may
be designed and synthesized (101). Upon dissolving the nucleic
acids into a solution, nucleic acids may form the predetermined
self-assembled structures through a complementary base pairing
mechanism (102). Then, a pattern of self-assembled nucleic acids
may be formed on at least a portion of a substrate (103). These
self-assembled nucleic acids on the substrate may include at least
one defect. Optionally, the defects and the density of defects may
be determined (104) using any conventional techniques. The defects
in the self-assembled nucleic acids may be repaired using at least
one repair enzyme (105), to provide a nanostructure comprising
self-assembled nucleic acids on at least a portion of the substrate
exhibiting a reduced defect density. The repairing of defects (104)
may be repeated as desired until a desired, reduced threshold level
of defect density is achieved. Once the threshold level of defect
density is achieved, the resulting pattern of the self-assembled
nucleic acids may be transferred to the substrate (106).
[0021] A computer software program may be used to design and
identify the nucleic acid sequences that are capable of
self-assembling into the desired structures. The nucleic acids may
be non-naturally occurring nucleic acids. The length and chemical
makeup of the nucleic acid sequences may be selected depending on
the desired self-assembled structures to be formed.
[0022] Any conventional techniques may be used to synthesize
nucleic acids, and therefore such techniques are not described in
detail herein. By way of non-limiting example, the nucleic acids
may be synthesized using automated DNA synthesizer and
phosphoramidite chemistry procedures.
[0023] Once synthesized, the nucleic acids may be dissolved into a
solution. Upon dissolving in the solution, the nucleic acids may
self-assemble into the desired self-assembled structures through a
complementary base pairing mechanism. Various self-assembled
nucleic acids may be used in the present disclosure.
[0024] In some embodiments, nucleic acids may self-assemble into a
"multi-stranded" structure that is composed entirely of short
oligonucleotide strands. For example, as shown in FIG. 2A,
self-assembled nucleic acids 201 are composed of short
oligonucleotide strands 201a, 201b and 201c.
[0025] In some embodiments, nucleic acids may self-assemble into a
"scaffolded" structure. The self-assembled "scaffolded" structure
is composed of a long single stranded polynucleotide ("scaffold
strand") that is folded and bonded by a number of short strands of
nucleic acids ("helper strands") into the desired structures. For
example, as shown in FIG. 2B, self-assembled nucleic acids 202 are
composed of a scaffold strand 202a that is folded and fixed into a
certain structure by the helper strands 202b, 202b', and
202b''.
[0026] In some embodiments, nucleic acids may self-assemble into a
"single-stranded" structure that is composed substantially of one
long scaffold strand and few or no helper strands. For example, as
shown in FIG. 2C, the self-assembled nucleic acid 203 is composed
of one long scaffold strand 203a.
[0027] It is understood that FIGS. 2A-2C show non-limiting example
of the self-assembled nucleic acids, and that other self-assembled
nucleic acids may be recognized by one skilled in the art.
[0028] The self-assembled nucleic acids may be formed on at least a
portion of a substrate using any conventional techniques. In some
embodiments, the self-assembled nucleic acids may be formed on a
substantially entire exposed surface of a substrate. Then, portions
of the self-assembled nucleic acids on the substrate may be
selectively removed, leaving the self-assembled nucleic acids only
on the desired portions of the substrate. By way of non-limiting
example, the self-assembled nucleic acids on the substrate may be
selectively removed using conventional mask techniques. In some
embodiments, the self-assembled nucleic acids may be formed on the
patterned regions of carbon on a silicon oxide background over a
substrate.
[0029] In some embodiments, the self-assembled nucleic acids may be
applied onto at least a portion of the substrate by contacting at
least a portion of the substrate with a solution comprising the
self-assembled nucleic acids. By way of non-limiting example, a
solution comprising self-assembled nucleic acids may be applied to
at least a portion of the substrate by spraying or coating
techniques, or by dipping the substrate in a solution comprising
self-assembled nucleic acids.
[0030] In some embodiments, the self-assembled nucleic acids may be
formed on at least a portion of a substrate by covalently coupling
the self-assembled nucleic acids to the substrate. The nucleic
acids in the self-assembled nucleic acids may include a coupling
functional group formulated and configured to form covalent bond
with the substrate. By way of example only, when the substrate is
gold, silver, silicon dioxide or aluminum metalized features, the
coupling functional group on the nucleic acid may be a primary
amine. When the substrate is metal, the coupling functional group
on the nucleic acid may be an amine derivatized with a thiolation
reagent such as succinimidyl 3-(2-pyridyldithio)propionate (SPDP).
When the substrate is silicon dioxide, the coupling functional
group on the nucleic acid may be dialdehyde derivatives of Schiff's
base reaction. By way of a non-limiting example, when the substrate
is glass or silicon dioxide (SiO.sub.2), the substrate may be
treated with dilute sodium hydroxide solution. Then, the substrate
may be contacted with a solution of self-assembled nucleic acids
that comprises 3-aminopropyltriethoxysilane (APS) group, to
covalently couple the self-assembled nucleic acids to the substrate
via the APS group.
[0031] In some embodiments, the self-assembled nucleic acids may be
formed on at least a portion of substrate by ionic attraction using
any conventional techniques. By way of a non-limiting example,
magnesium ions (Mg.sup.2+) may be added to an aqueous solution of
self-assembled nucleic acids. The positive charge Mg.sup.2+
attracts the negative charges on self-assembled nucleic acids, as
well as the negative portions of the substrate. Thus, Mg.sup.2+
ions function to adhere the self-assembled nucleic acids to the
negative portions of the substrate.
[0032] In addition to forming the self-assembled nucleic acids on
at least a portion of a substrate via covalent bonds or ionic
attractions as described above, one of ordinary skill in the art
recognizes that other known bonding techniques between the
self-assembled nucleic acids and a substrate may be used.
[0033] In some embodiments, at least a portion of the substrate may
be exposed to a solution comprising self-assembled nucleic acids to
provide a nanostructure that comprises self-assembled nucleic acids
on at least a portion of the substrate. Then, the nanostructure may
be exposed again to a solution comprising self-assembled nucleic
acids. The exposure to the solution comprising self-assembled
nucleic acids may be repeated until the desired thickness of the
self-assembled nucleic acids on at least a portion of the substrate
is achieved.
[0034] The defect level, which may also be characterized as defect
density, of the features on the substrate may then be determined,
the defect level corresponding to defects in the pattern of
self-assembled nucleic acids. The defects may be determined using
any conventional technique such as optical or e-beam based
metrology techniques, and therefore such techniques are not
described in detail herein.
[0035] The defects in the pattern of self-assembled nucleic acids
may be repaired using at least one repair enzyme. The
self-assembled nucleic acids on at least a portion of the substrate
may be contacted with a solution comprising at least one repair
enzyme. By way of non-limiting example, the self-assembled nucleic
acids on the at least a portion of the substrate may be exposed to
a repair solution comprising at least one repair enzyme by spraying
or coating the self-assembled nucleic acids with the repair
solution, or by dipping the substrate in the repair solution
comprising at least one repair enzyme. The repair enzyme may be
selected based at least in part on the identified defects in the
pattern of self-assembled nucleic acids. The repair enzyme may be
dissolved in an appropriate solvent, such as water, methanol,
ethanol, or combinations thereof. The repair solution may include a
sufficient concentration of the repair enzyme to repair the
defects.
[0036] The defects in the self-assembled nucleic acids on the at
least a portion of substrate may be repaired by various mechanisms.
By way of non-limiting example, the defects may be repaired by at
least one of following mechanisms: [0037] (a) a single step
mechanism that involves a direct reversal by a single enzyme, such
as photolyase enzyme or O-6-methyl-DNA alkyltransferase enzyme;
[0038] (b) a single-step or multi-step mechanism that involves base
excision, such as using glycosylase enzymes; and [0039] (c) a
multi-step mechanism that involves pleiotropic specificities from
multiple protein components.
[0040] With knowledge of the specific nucleic acids to be used in
the self-assembled nucleic acids, the type of repair enzyme may be
selected by a person of ordinary skill in the art. Additionally,
the repair enzyme may be formulated and configured to selectively
repair certain defects in the self-assembled nucleic acids.
[0041] In some embodiments, the repair enzyme may include an enzyme
in a metallo-.beta.-lactamase superfamily. The repair enzymes in
this superfamily usually bind a zinc ion (Zn.sup.2+), but in a few
cases bind an iron ion (Fe.sup.2+), and catalyze the cleavage of
C--N, O.dbd.O, C--S, and/or P--O bonds. These repair enzymes repair
a defect that involves two divalent metal ion binding sites.
Non-limiting example of such repair enzymes may include
.beta.-lactamase, oxidoreductase (rubredoxin/oxygen, ROO),
glyoxalase II, or artemis/DNA nuclease.
[0042] In some embodiments, the repair enzyme may include an enzyme
in a haloacid dehalogenase superfamily. The repair enzymes in this
superfamily catalyze the cleavage and formation of C--Cl, C--P,
and/or P--O bonds. These repair enzymes repair a defect that
involves aspartate nucleophile and a general base. Non-limiting
example of such repair enzymes may include haloacid dehalogenase,
phosphonatase, Ca.sup.2+-ATpase, or DNA 3'-phosphatase.
[0043] In some embodiments, the repair enzyme may include an enzyme
in an Fe (II)/.alpha.-ketoglutarate-dependent dioxygenase
superfamily. The repair enzymes in this superfamily catalyze the
cleavage of C--S and C--N bonds, or formation of C--N, C--O, and
C--S heterocycle structure. These repair enzymes repair a defect
that involves a single divalent metal ion binding site.
Non-limiting example of such repair enzymes may include clavimate
synthase, isopenicillin synthase, taurine dioxygenase, or AlkB.
[0044] Accordingly, a method of forming a nanostructure comprises
forming a pattern of self-assembled nucleic acids on at least a
portion of a substrate. The method further comprises exposing the
pattern of self-assembled nucleic acids on the at least a portion
of the substrate to at least one repair enzyme to repair defects in
the self-assembled nucleic acids.
[0045] The repairing of defects in the self-assembled nucleic acids
on at least a portion of a substrate may be repeated until a
desired, reduced threshold level of the defect density is achieved.
The defects may be repaired by repeatedly exposing the
self-assembled nucleic acids on the substrate to the repair
solution. By way of example only, the repair solution may be
contacted with the self-assembled nucleic acids between one time
and ten times. As the concentration of repair enzyme in a repair
solution decreases, a freshly made solution of the repair enzyme
having a higher concentration may be employed in substitution for
the initial repair solution.
[0046] Accordingly, a method of forming a nanostructure comprises
forming self-assembled nucleic acids on at least a portion of a
substrate, wherein the self-assembled nucleic acids exhibits an
initial defect density. The method further comprises contacting the
self-assembled nucleic acids on the at least a portion of a
substrate with a solution comprising at least one repair enzyme to
repair defects in the self-assembled nucleic acids. The method
further comprises repeating the repair of defects in the
self-assembled nucleic acids until a desired, reduced threshold
level of defect density is achieved.
[0047] In some embodiments, the defect in the self-assembled
nucleic acids on at least a portion of a substrate may be repaired
using more than one repair enzyme. In such embodiments, the
self-assembled nucleic acid on the at least a portion of a
substrate may be exposed to repair solutions including different
repair enzymes simultaneously or consecutively to lower the defect
density in the self-assembled nucleic acids on the at least a
portion of a substrate.
[0048] Accordingly, a method of decreasing a defect density in
self-assembled nucleic acids on at least a portion of a substrate
comprises repairing defects in self-assembled nucleic acids on at
least a portion of a substrate by exposure to at least one repair
enzyme.
[0049] Once the threshold level of the defect density is achieved,
the resulting pattern of the self-assembled nucleic acids may be
transferred to the substrate. The self-assembled nucleic acids may
function as nano-scale templates or masks having operative
dimensions of less than about 50 nm to transfer the desired pattern
to the substrate.
[0050] FIGS. 3A-3C show various stages for a method of using the
self-assembled nucleic acids as nano-scale templates or masks to
transfer the desired pattern to the substrate.
[0051] FIG. 3A shows a semiconductor structure 300 that includes a
substrate 301, a hardmask material 303 overlying the substrate 301,
and a pattern of self-assembled nucleic acids 302 over the hardmask
material 303. In FIG. 3B, the pattern of self-assembled nucleic
acids 302 is transferred to the hardmask material 303, thus the
pattern of self-assembled nucleic acids 302 may function as a
nano-scale template. At least a portion of the substrate 301 may be
selectively removed using the self-assembled nucleic acids 302 as
the template/mask to protect at least a portion of the substrate
301 from an etchant (such term being non-limiting, and encompassing
liquid and gaseous fluid compositions suitable to remove substrate
material exposed through apertures in the template) to provide a
semiconductor structure 400 that includes a modified substrate 401
and the overlying mask comprising the pattern of self-assembled
nucleic acids 302 and the hardmask material 303. Then, as shown in
FIG. 3C, the self-assembled nucleic acids 302 and the hardmask
material 303 may be removed. By way of example only, the
self-assembled nucleic acids 302 may be removed by a heat treatment
at a temperature of from about 90.degree. C. to about 200.degree.
C., or by an acidic solution.
[0052] Accordingly, a method of forming a nanostructure comprises
forming a mask comprising a pattern of self-assembled nucleic acids
over at least a portion of substrate surface, and removing at least
a portion of the substrate exposed through the pattern of the
mask.
[0053] The modified substrate 401 may be further processed for the
fabrication of components on the substrate, such as by way of
non-limiting example, silicon nanowires, gold nanoparticles,
semiconductive quantum dots, or fluorescent quantum dots.
[0054] Accordingly, a method of forming a nanostructure comprises
forming a mask comprising a pattern of self-assembled nucleic acids
over at least a portion of a substrate surface. The method further
comprises forming a nanocomponent on at least a portion of the
substrate exposed through the pattern in the mask. The
nanocomponent comprises a material selected from the group
consisting of nanowires, gold nanoparticles, semiconductive quantum
dots, and fluorescent quantum dots.
[0055] In some embodiments, the self-assembled nucleic acids may be
used to form features on the substrate having dimensions of less
than about 50 nm and exhibiting a low defect density. By way of
example only, the features on the substrate may have dimensions of
less than about 40 nm, less than about 30 nm, less than about 20
nm, or less than about 10 nm. The nanostructure comprising
self-assembled nucleic acids may be subjected to further processing
for fabrication of the desired devices. In some embodiments, the
self-assembled nucleic acids may be removed during further
processing acts.
[0056] Accordingly, a semiconductor structure comprises a pattern
of self-assembled nucleic acids defining a template having at least
one aperture therethrough, the at least one aperture comprising at
least one dimension of less than about 50 nm.
[0057] While the present disclosure is susceptible to various
modifications and alternative forms, specific embodiments have been
shown by way of example in the drawings and have been described in
detail herein. However, the present disclosure is not intended to
be limited to the particular forms disclosed. Rather, the present
disclosure is to cover all modifications, equivalents, and
alternatives falling within the scope of the present disclosure as
defined by the following appended claims and their legal
equivalents.
* * * * *