U.S. patent application number 14/824896 was filed with the patent office on 2016-06-09 for semiconductor device and method of fabricating the same.
The applicant listed for this patent is Jeong-Hyo Lee, Jung-Gun You. Invention is credited to Jeong-Hyo Lee, Jung-Gun You.
Application Number | 20160163699 14/824896 |
Document ID | / |
Family ID | 56095018 |
Filed Date | 2016-06-09 |
United States Patent
Application |
20160163699 |
Kind Code |
A1 |
You; Jung-Gun ; et
al. |
June 9, 2016 |
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Abstract
A semiconductor device is provided as follows. Active fins
protrude from a substrate, extending in a first direction. A first
device isolation layer is disposed at a first side of the active
fins. A second device isolation layer is disposed at a second side
of the active fins. A top surface of the second device isolation
layer is higher than a top surface of the first device isolation
layer and the second side is opposite to the first side. A normal
gate extends across the active fins in a second direction crossing
the first direction. A first dummy gate extends across the active
fins and the first device isolation layer in the second direction.
A second dummy gate extends across the second device isolation
layer in the second direction.
Inventors: |
You; Jung-Gun; (Ansan-si,
KR) ; Lee; Jeong-Hyo; (Suwon-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
You; Jung-Gun
Lee; Jeong-Hyo |
Ansan-si
Suwon-si |
|
KR
KR |
|
|
Family ID: |
56095018 |
Appl. No.: |
14/824896 |
Filed: |
August 12, 2015 |
Current U.S.
Class: |
257/401 |
Current CPC
Class: |
H01L 21/823431 20130101;
H01L 29/4966 20130101; H01L 27/0886 20130101; H01L 21/823437
20130101; H01L 21/823418 20130101; H01L 27/0207 20130101; H01L
21/823481 20130101; H01L 29/0649 20130101; H01L 29/495
20130101 |
International
Class: |
H01L 27/088 20060101
H01L027/088; H01L 29/49 20060101 H01L029/49; H01L 29/06 20060101
H01L029/06 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 3, 2014 |
KR |
10-2014-0172248 |
Claims
1. A semiconductor device comprising: a plurality of active fins
protruding from a substrate and extending in a first direction; a
first device isolation layer disposed at a first side of the active
fins; a second device isolation layer disposed at a second side of
the active fins, wherein a top surface of the second device
isolation layer is higher than a top surface of the first device
isolation layer and the second side is opposite to the first side;
a normal gate extending across the active fins in a second
direction crossing the first direction; a first dummy gate
extending across the active fins and the first device isolation
layer in the second direction; and a second dummy gate extending
across the second device isolation layer in the second
direction.
2. The semiconductor device of claim 1, wherein a bottom surface of
the second device isolation layer is lower than a bottom surface of
the first device isolation layer.
3. The semiconductor device of claim 2, wherein the bottom surface
of the second device isolation layer is lower than a top surface of
the substrate.
4. The semiconductor device of claim 1, wherein the second dummy
gate is distant from the first side of the active fins.
5. The semiconductor device of claim 1, wherein the second dummy
gate overlaps the second device isolation layer and at least one of
the active fins.
6. The semiconductor device of claim 1, further comprising: an
impurity epitaxial layer disposed on the active fins and between
the first dummy gate and the normal gate adjacent to the first
dummy gate.
7. The semiconductor device of claim 1, wherein each of the normal
gate, the first dummy gate and the second dummy gate includes a
metal gate.
8. The semiconductor device of claim 1, wherein the normal gate
includes a metal gate and at least one of the first dummy gate and
the second dummy gate includes a poly Si gate.
9. The semiconductor device of claim 1, further comprising: a third
dummy gate extending across the first device isolation layer in the
second direction and being spaced apart from the first side of the
active fins.
10. The semiconductor device of claim 9, wherein each of the normal
gate and the first to third dummy gates includes a metal gate.
11. The semiconductor device of claim 9, wherein the normal gate
includes a metal gate and at least one of the first to third dummy
gates includes a poly Si gate.
12. A semiconductor device comprising: a first active fin
protruding from a substrate and extending in a first direction; a
second active fin protruding from the substrate and extending in
the first direction, wherein the second active fin is spaced apart
from the first active fin in a second direction crossing the first
direction; a first device isolation layer disposed at a first side
of the first active fin and at a first side of the second active
fin; a second device isolation layer disposed at a second side of
the first active fin and at a second side of the second active fin,
wherein the second side of the first active fin is opposite to the
first side of the first active fin; a first dummy gate extending in
the second direction and overlapping the first active fin, the
second active fin and the first device isolation layer; and a
second dummy gate extending in the second direction and overlapping
the first active fin and the second device isolation layer.
13. The semiconductor device of claim 12, wherein the second dummy
gate overlaps a portion of the second active fin.
14. The semiconductor device of claim 12, further comprising: a
third dummy gate extending across the first device isolation layer
in the second direction and being spaced apart from the first
active fin and the second active fin.
15. The semiconductor device of claim 12, further comprising: a
normal gate extending across the first and second active fins in
the second direction, wherein the normal gate includes a metal gate
and at least one of the first dummy gate and the second dummy gate
includes a poly Si gate.
16. The semiconductor device of claim 12, wherein a top surface of
the second device isolation layer is higher than a top surface of
the first device isolation layer.
17. The semiconductor device of claim 16, wherein a bottom surface
of the second device isolation layer is lower than a bottom surface
of the first device isolation layer.
18. The semiconductor device of claim 17, wherein the bottom
surface of the second device isolation layer is lower than a top
surface of the substrate.
19.-23. (canceled)
24. A semiconductor device comprising: a plurality of active fins
protruding from a substrate and extending in a first direction; a
device isolation layer disposed at one side of the active fins and
extended in a second direction crossing the first direction; a
normal gate extending across the active fins in a second direction
crossing the first direction; a first dummy gate extending across
the device isolation layer in the second direction; and a second
dummy gate extending across the active fins and the device
isolation layer in the second direction.
25. (canceled)
26. The semiconductor device of claim 24, wherein the normal gate
includes a metal gate and at least one of the first dummy gate and
the second dummy gate includes a poly Si gate.
27.-42. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority under 35 U.S.C. .sctn.119
to Korean Patent Application No. 10-2014-0172248, filed on Dec. 3,
2014 in the Korean Intellectual Property Office, and the disclosure
of which is incorporated by reference herein in its entirety.
TECHNICAL FIELD
[0002] The present inventive concept relates to a semiconductor
device and a method of fabricating the same.
DISCUSSION OF RELATED ART
[0003] As semiconductor devices scale down in size, a
three-dimensional channel structure is used to increase current
controlling capability and reduce a short channel effect (SCE) of
the semiconductor devices.
SUMMARY
[0004] According to an exemplary embodiment of the present
inventive concept, a semiconductor device is provided as follows.
Active fins protrude from a substrate, extending in a first
direction. A first device isolation layer is disposed at a first
side of the active fins. A second device isolation layer is
disposed at a second side of the active fins. A top surface of the
second device isolation layer is higher than a top surface of the
first device isolation layer and the second side is opposite to the
first side. A normal gate extends across the active fins in a
second direction crossing the first direction. A first dummy gate
extends across the active fins and the first device isolation layer
in the second direction. A second dummy gate extends across the
second device isolation layer in the second direction.
[0005] According to an exemplary embodiment of the present
inventive concept, a semiconductor device is provided as follows. A
first active fin protrudes from a substrate, extending in a first
direction. A second active fin protrudes from the substrate,
extending in the first direction. The second active fin is spaced
apart from the first active fin in a second direction crossing the
first direction. A first device isolation layer is disposed at a
first side of the first active fin and at a first side of the
second active fin. A second device isolation layer is disposed at a
second side of the first active fin and at a second side of the
second active fin. The second side of the first active fin is
opposite to the first side of the first active fin. A first dummy
gate extends in the second direction, overlapping the first active
fin, the second active fin and the first device isolation layer. A
second dummy gate extends in the second direction, overlapping the
first active fin and the second device isolation layer.
[0006] According to an exemplary embodiment of the present
inventive concept, a semiconductor device is provided as follows.
An active fin protrudes from a substrate, extending in a first
direction. A first device isolation layer is disposed at a first
side of the active fin. A second device isolation layer is disposed
at a second side of the active fin. The second device isolation
layer has a top surface higher than a top surface of the first
device isolation layer. A normal gate extends across the active fin
in a second direction crossing the first direction. A first dummy
gate extends across the first device isolation layer in the second
direction. A second dummy gate extends across the second device
isolation layer and the active fin in the second direction.
[0007] According to an exemplary embodiment of the present
inventive concept, a semiconductor device is provided as follows.
Active fins protrude from a substrate, extending in a first
direction. A device isolation layer is disposed at one side of the
active fins and extended in a second direction crossing the first
direction. A normal gate extends across the active fins in a second
direction crossing the first direction. A first dummy gate extends
across the device isolation layer in the second direction. A second
dummy gate extends across the active fins and the device isolation
layer in the second direction.
[0008] According to an exemplary embodiment of the present
inventive concept, a method of fabricating a semiconductor device
is provided as follows. Active fins are formed. The active fins
protrude from a substrate, extending in a first direction. A first
device isolation layer, extending at a first side of the active
fins, is formed. A second device isolation layer, extending at a
second side of the active fins opposite to the first side, is
formed. The second device isolation layer has a top surface higher
than a top surface of the first device isolation layer. A first
dummy gate, extending across the active fins and the first device
isolation layer in a second direction crossing the first direction,
is formed. A second dummy gate, extending across the active fins in
the second direction, is formed. A third dummy gate, extending
across the second device isolation layer in the second direction,
is formed. The second dummy gate is interposed between the first
dummy gate and the third dummy gate. The second dummy gate is
replaced with a metal gate.
[0009] According to an exemplary embodiment of the present
inventive concept, a semiconductor device is provided as follows.
An active fin protrudes from a substrate, extending in a first
direction. A first device isolation layer is adjacent to a first
side of the active fin. A second device isolation layer is adjacent
to a second side of the active fin opposite to the first side. A
first dummy gate line is disposed on the active fin and the first
device isolation layer. A first boundary between the active fin and
the first device isolation layer is underneath the first dummy
gate. A second dummy gate is disposed on the active fin and the
second device isolation layer. A second boundary between the active
fin and the second device isolation is underneath the second dummy
gate. Normal gates are disposed on the active fin and between the
first dummy gate and the second dummy gate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] These and other features of the inventive concept will
become more apparent by describing in detail exemplary embodiments
thereof with reference to the accompanying drawings of which:
[0011] FIG. 1 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept;
[0012] FIG. 2 is a perspective view of a normal gate shown in FIG.
1;
[0013] FIG. 3A is a cross-sectional view taken along line A-A of
FIG. 1;
[0014] FIG. 3B is a cross-sectional view taken along line B-B of
FIG. 1;
[0015] FIG. 4 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept;
[0016] FIG. 5 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept;
[0017] FIG. 6 is a cross-sectional view taken along line C-C of
FIG. 5;
[0018] FIG. 7 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept;
[0019] FIG. 8 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept;
[0020] FIG. 9 is a cross-sectional view taken along line D-D of
FIG. 8;
[0021] FIG. 10 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept;
[0022] FIG. 11 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept;
[0023] FIG. 12 is a cross-sectional view taken along line E-E of
FIG. 11;
[0024] FIG. 13 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept;
[0025] FIGS. 14 and 15 are block diagrams of semiconductor devices
according to an exemplary embodiment of the present inventive
concept;
[0026] FIG. 16 is a block diagram of a system on chip (SoC) system
including a semiconductor device according to an exemplary
embodiment of the present inventive concept;
[0027] FIG. 17 is a block diagram of an electronic system including
a semiconductor device according to an exemplary embodiment of the
present inventive concept;
[0028] FIGS. 18 to 20 illustrate exemplary semiconductor systems
including a semiconductor device according to an exemplary
embodiment of the present inventive concept; and
[0029] FIGS. 21 to 26 show process steps in a method of fabricating
a semiconductor device according to an exemplary embodiment of the
present inventive concept.
[0030] Although corresponding plan views and/or perspective views
of some cross-sectional view(s) may not be shown, the
cross-sectional view(s) of device structures illustrated herein
provide support for a plurality of device structures that extend
along two different directions as would be illustrated in a plan
view, and/or in three different directions as would be illustrated
in a perspective view. The two different directions may or may not
be orthogonal to each other. The three different directions may
include a third direction that may be orthogonal to the two
different directions. The plurality of device structures may be
integrated in a same electronic device. For example, when a device
structure (e.g., a memory cell structure or a transistor structure)
is illustrated in a cross-sectional view, an electronic device may
include a plurality of the device structures (e.g., memory cell
structures or transistor structures), as would be illustrated by a
plan view of the electronic device. The plurality of device
structures may be arranged in an array and/or in a two-dimensional
pattern.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0031] Exemplary embodiments of the inventive concept will be
described below in detail with reference to the accompanying
drawings. However, the inventive concept may be embodied in
different forms and should not be construed as limited to the
embodiments set forth herein. In the drawings, the thickness of
layers and regions may be exaggerated for clarity. It will also be
understood that when an element is referred to as being "on"
another element or substrate, it may be directly on the other
element or substrate, or intervening layers may also be present. It
will also be understood that when an element is referred to as
being "coupled to" or "connected to" another element, it may be
directly coupled to or connected to the other element, or
intervening elements may also be present. Like reference numerals
may refer to the like elements throughout the specification and
drawings.
[0032] Hereinafter, a semiconductor device according to an
embodiment of the present inventive concept will be described with
reference to FIGS. 1 to 3.
[0033] FIG. 1 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept. FIG. 2
is a perspective view of a normal gate shown in FIG. 1. FIG. 3A is
a cross-sectional view taken along line A-A of FIG. 1, and FIG. 3B
is a cross-sectional view taken along line B-B of FIG. 1.
[0034] Referring to FIGS. 1 to 3, the semiconductor device 1
includes active fins F1 to F5, dummy gates 110 and 120, normal
gates 130 and 140, and a device isolation layer 20.
[0035] The active fins F1 to F5 protrude from a substrate 10,
extending in a first direction X. For the convenience of
description, five active fins will be described. However, the
present inventive concept is not limited thereto, and the number of
the active fins may change according to an exemplary
embodiment.
[0036] The substrate 10 may include a semiconductor material. The
semiconductor material may include Si, Ge, SiGe, GaP, GaAs, SiC,
SiGeC, InAs or InP, but the present inventive concept is not
limited thereto. For example, the substrate 10 may include an
insulating substrate. In this case, the substrate 10 may be, for
example, a silicon on insulator (SOI) substrate. If the substrate
10 is an SOI substrate, a response speed of the semiconductor
device 1 may increase.
[0037] Each of the active fins F1 to F5 may have long sides and
short sides. As shown in FIG. 1, the active fins F1 to F5 may be
arranged on the substrate 10 to be spaced apart from each other in,
for example, a second direction Y.
[0038] In FIG. 1, the long-side direction of the active fins F1 to
F5 is the first direction X, and the short-side direction of the
active fins F1 to F5 is the second direction Y, but the present
inventive concept is not limited thereto. For example, the
long-side direction of the active fins F1 to F5 may be the second
direction Y and the short-side direction of the active fins F1 to
F5 may be the first direction X.
[0039] In an exemplary embodiment, the active fins F1 to F5 may be
part of the substrate 10. In this case, the active fins F1 to F5
may be formed by etching the substrate 10. Alternatively, the
active fins F1 to F5 may be epitaxial layers grown from the
substrate 10.
[0040] The active fins F1 to F5 may be formed of a semiconductor
material including, for example, Si or SiGe.
[0041] In an exemplary embodiment, the active fins F1 to F5 and the
substrate 10 may be formed of the same material. For example, if
the substrate 10 is formed of, for example Si, the active fins F1
to F5 may be formed of Si. The present inventive concept is not
limited thereto. For example, the substrate 10 and the active fins
F1 to F5 may include different materials. In this case, if the
substrate 10 includes, for example Si, the active fins F1 to F5 may
include a different material from Si. In this case, the active fins
F1 to F5 may be formed on the substrate 10 through, for example, an
epitaxial growth process.
[0042] In this embodiment, the active fins F1 to F3 are formed in a
first active region ACT1 and the active fins F4 and F5 are formed
in a second active region ACT2. The present inventive concept is
not limited thereto, and the number of active fins in each active
region may change according to an exemplary embodiment.
[0043] A field insulation layer 22 is formed on the substrate 10,
covering lower portions of sidewalls of the active fins F1 to F5
and exposing upper portions of the active fins F1 to F5. The field
insulation layer 22 may be formed of an oxide layer, for
example.
[0044] The device isolation layer 20 is formed at one side of the
active fins F1 to F5. For example, referring to FIG. 3A, the device
isolation layer 20 is formed in the left side of the active fin F2.
The device isolation layer 20 and the field insulation layer 22 may
be merged to each other at regions where the long and short sides
of the active fins F1 to F5 intersect each other.
[0045] A bottom surface of the device isolation layer 20 is
positioned on substantially the same plane with a top surface of
the substrate 10. Alternatively, a top surface of the device
isolation layer 20 may be positioned on substantially the same
plane with top surfaces of the active fins F1 to F5.
[0046] The device isolation layer 20 may be formed of an insulation
layer. For example, the device isolation layer 20 may include an
oxide layer, an oxynitride layer or a nitride layer, but the
present inventive concept is not limited thereto.
[0047] The device isolation layer 20 may serve to electrically
insulate the active fins F1 to F5 from each other.
[0048] The normal gates 130 and 140 are formed on the active fins
F1 to F5, extending in the second direction Y crossing the first
direction X along which the active fins F1 to F5 are extended.
[0049] The present inventive concept is not limited thereto. For
example, the normal gates 130 and 140 may extend in acute angles or
obtuse angles with respect to the first direction along which the
active fins F1 to F5 are extended.
[0050] As shown, the normal gates 130 and 140 are spaced apart from
each other in the first direction X.
[0051] Each of the normal gates 130 and 140 may include a metal
gate. The normal gates 130 and 140 may include first metal layers
133 and 143 and second metal layers 134 and 144. As shown, the
normal gates 130 and 140 may be formed by stacking two or more
layers of the first metal layers 133 and 143 and the second metal
layers 134 and 144.
[0052] The first metal layers 133 and 143 may function to adjust a
work function, and the second metal layers 134 and 144 may function
to fill spaces formed by the first metal layers 133 and 143.
[0053] As shown in FIG. 3A, the first metal layers 133 and 143 are
interposed between the gate insulation layers 132 and 142 and the
second metal layers 134 and 144. For example, the first metal
layers 133 and 143 cover conformally the gate insulating layers 132
and 142. In this case, the gate insulating layers 132 and 142 are
U-shaped, and the first metal layers 133 and 143 are also U-shaped.
The second metal layers 134 and 144 fill the insides of the
U-shaped first metal layers 133 and 143.
[0054] In addition, the first metal layers 133 and 143 may cover
conformally the field insulation layer 22 and the active fins F1 to
F2. For example, as shown in FIG. 3B, the first metal layer 133
covers conformally a top surface of the field insulation layer 22
and sidewalls and top portions of the active fin F2. The second
metal layer 143 may also cover conformally the field insulating
layer 22 and the active fin F2.
[0055] The first metal layers 133 and 143 may be formed of, for
example, at least one of TiN, TaN, TiC, TiAlC and TaC. The second
metal layers 134 and 144 may be formed of, for example, W or Al,
but the present inventive concept is not limited thereto. The first
metal layers 133 and 143 and the second metal layers 134 and 144
may be formed in various configuration.
[0056] The normal gates 130 and 140 may be formed by, for example,
a gate replacement process, but the present inventive concept is
not limited thereto.
[0057] Alternatively, the normal gates 130 and 140 may be formed of
a non-metal material including, for example, Si, or SiGe.
[0058] The gate insulation layers 132 and 142 may be formed under
the normal gates 130 and 140.
[0059] The gate insulation layers 132 and 142 may be formed of a
high-k dielectric material having a higher dielectric constant than
silicon oxide. The gate insulation layers 132 and 142 may include,
for example, HfO.sub.2, ZrO.sub.2, LaO, Al2O3 or Ta2O5, but the
present inventive concept is not limited thereto.
[0060] As shown in FIG. 3A, the gate insulation layers 132 and 142
may be U-shaped. For example, the gate insulation layers 132 and
142 extend along the top surfaces of the active fins F1 to F5 and
lateral surfaces of the normal gates 130 and 140.
[0061] In addition, the gate insulation layers 132 and 142 may
extend in the second direction Y along the top surface of the field
insulation layer 22 and lateral surfaces and top surfaces of the
active fins F1 to F5. For example, as shown in FIG. 3, the gate
insulation layer 132 extends in the second direction Y along the
top surface of the field insulation layer 22, and lateral surfaces
and top surfaces of the active fins F1 to F5.
[0062] The normal spacers 131 and 141 are formed at opposite sides
of the normal gates 130 and 140, respectively. For example, the
normal spacer 131 is formed at opposite sides of the normal gate
130, and the normal spacer 141 is formed at opposite sides of the
normal gate 140.
[0063] The normal spacers 131 and 141 are pillar-shaped, but the
present inventive concept is not limited thereto. For example,
shapes of the normal spacers 131 and 141 may vary in various
manners.
[0064] In this embodiment, the normal spacers 131 and 141 may be
formed of, for example, a nitride layer, but the present inventive
concept is not limited thereto. However, constituents of the normal
spacers 131 and 141 may vary in various manners. For example, the
normal spacers 131 and 141 may include, for example, at least one
of an oxide layer and an oxynitride layer.
[0065] The dummy gates 110 and 120 are formed on the device
isolation layer 20, extending in the second direction Y.
[0066] For example, the dummy gate 110 extends on the device
isolation layer 20 in the second direction Y without overlapping
the active fins F1 to F5. The dummy gate 120 extends on the device
isolation layer 20 in the second direction Y, overlapping the
active fins F1 to F5.
[0067] In this case, the dummy gate 110 is formed only on the
device isolation layer 20, and the dummy gate 120 is formed on the
device isolation layer 20 and the active fins F1 to F5.
[0068] As shown, the dummy gates 110 and 120 are spaced apart from
each other in the first direction X. In addition, as shown in FIG.
3A, the dummy gate 120 is spaced apart from the normal gate 130 in
the first direction X.
[0069] In FIG. 1, the dummy gates 110 and 120 extending in the
second direction Y are illustrated, but the present inventive
concept is not limited thereto. For example, the dummy gates 110
and 120 extend in acute angles or obtuse angles with respect to the
first direction X along which the active fins F1 to F5 are
extended.
[0070] In this embodiment, each of the dummy gates 110 and 120 may
include a metal gate. The dummy gates 110 and 120 may include first
metal layers 113 and 123 and second metal layers 114 and 124,
respectively.
[0071] In this embodiment, the first metal layers 113 and 123 and
the second metal layers 114 and 124 included in the dummy gates 110
and 120 are substantially the same as the first metal layers 133
and 143 and the second metal layers 134 and 144 included in the
normal gates 130 and 140, which have been described above.
[0072] The gate insulation layers 112 and 122 are formed under the
dummy gates 110 and 120. Here, the gate insulation layers 112 and
122 formed under the dummy gates 110 and 120 may be substantially
the same as the gate insulation layers 132 and 142 formed under the
normal gates 130 and 140, which have been described above.
[0073] The dummy spacers 111 and 121 are formed at opposite sides
of the dummy gates 110 and 120. For example, the dummy spacer 111
is formed at opposite sides of the dummy gate 110, and the dummy
spacer 121 is formed at opposite sides of the dummy gate 120.
[0074] The dummy spacers 111 and 121 may be substantially the same
as the above-described normal spacers 131 and 141.
[0075] Impurity epitaxial layers 31 to 33 are formed on the active
fins F1 to F5. For example, the impurity epitaxial layer 31 is
formed between the dummy gate 120 and the normal gate 130; the
impurity epitaxial layer 32 is formed between two adjacent normal
gates 130 and 140; and the impurity epitaxial layer 33 is formed at
the other side of the normal gate 140. For example, the impurity
epitaxial layer 33 is formed in the right side of the normal gate
140, as shown in FIG. 3A).
[0076] The impurity epitaxial layers 31 to 33 may be formed in some
etched regions of the active fins F1 to F5. Alternatively, the
impurity epitaxial layers 31 to 33 may be formed on the active fins
F1 to F5 through, for example, an epitaxial growth process.
[0077] In an exemplary embodiment, the impurity epitaxial layers 31
to 33 may be elevated source or drain regions. In this case, top
surfaces of the impurity epitaxial layers 31 to 33 may be higher
than top surfaces of the active fins F1 to F5.
[0078] The impurity epitaxial layers 31 to 33 may be formed of a
semiconductor material including Si, for example. The present
inventive concept is not limited thereto.
[0079] If the semiconductor device 1 is a P-type Metal Oxide
Semiconductor (PMOS) transistor, the impurity epitaxial layers 31
to 33 may include a compressive stress material. For example, the
compressive stress material may include a material, for example,
SiGe, having a larger lattice constant than silicon (Si).
[0080] The compressive stress material may increase the mobility of
carriers of a channel region by applying compressive stress to the
active fins F1 to F5.
[0081] If the semiconductor device 1 is an N-type Metal Oxide
Semiconductor (NMOS) transistor, the impurity epitaxial layers 31
to 33 may include the same material as the substrate 10 or a
tensile stress material. For example, if the substrate 10 includes
Si, the impurity epitaxial layers 31 to 33 may include Si or a
material having a smaller lattice constant than Si (for example,
SiC or SiP).
[0082] For example, the tensile stress material may increase the
mobility of carriers of a channel region by applying tensile stress
to the active fins F1 to F5.
[0083] An interlayer dielectric layer 77, shown in FIG. 2, may
cover the dummy gates 110 and 120 and the normal gates 130 and
140.
[0084] In this embodiment, the dummy gate 120 is formed on both the
device isolation layer 20 and the active fins F1 to F5. For
example, a boundary between the active fin F2 and the device
isolation layer 20 is underneath the dummy gate 120. Accordingly,
the impurity epitaxial layer 31 formed to be adjacent to the dummy
gate 120 may grow well without a defect, such as a facet.
[0085] For example, the dummy gate 120 may be formed by replacing a
poly Si gate with a metal gate through a gate replacement process.
After forming the dummy gate 120 including the poly Si gate, the
impurity epitaxial layer 31 may be formed between the dummy gate
120 and the normal gate 130.
[0086] The dummy gate 120 and the dummy spacer 121 may include, for
example, Si. In this case, since the dummy gate 120 and the dummy
spacer 121 may have a crystal structure similar to that of the
impurity epitaxial layer 31 including Si. Part of the impurity
epitaxial layer 31 may grow from the dummy gate 120 and the dummy
spacer 121, and in this case, the impurity epitaxial layer 31 may
grow without forming a defect, such as a facet.
[0087] Without the dummy gate 120 overlapping the device isolation
layer 20 and the active fins F1 to F5, the growth of the impurity
epitaxial layer 31 including Si may be interfered by the device
isolation layer 20 including an insulating layer during the growth
of the impurity epitaxial layer 31. Such interference of the device
isolation layer 20 with the impurity epitaxial layer 31 may cause
to generate defects, such as facets, in the impurity epitaxial
layer 31.
[0088] In an exemplary embodiment, the dummy gate 120 is formed on
the boundary between the device isolation layer 20 and the active
fins F1 to F5, and thus the dummy gate 120 may serve to prevent the
interference between the device isolation layer and the active fins
F1 to F5, and thus the impurity epitaxial layer 31 may be formed in
a reliable manner. Accordingly, the product reliability of the
semiconductor device may be increased.
[0089] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIG. 4.
[0090] FIG. 4 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept. For the sake of brevity and convenient explanation,
substantially the same content with the previous embodiment will be
omitted.
[0091] Referring to FIG. 4, the semiconductor device 2 is different
from the semiconductor device 1, in view of configurations of dummy
gates 110a and 120a.
[0092] For example, the dummy gates 110a and 120a of the
semiconductor device 2 include poly Si gates, unlike in the
semiconductor device 1 according to the previous embodiment.
[0093] The dummy gates 110a and 120a may be formed in such a manner
that the poly Si gates included in the dummy gates 110a and 120a
are not replaced with metal gates during a gate replacement
process.
[0094] The dummy gate 110a including a poly Si gate and the dummy
gate 120a including a poly Si gate are illustrated in FIG. 4, but
the present inventive concept is not limited thereto.
[0095] For example, the dummy gate 110a may include a poly Si gate
and the dummy gate 120a may include a metal gate. Alternatively,
the dummy gate 110a may include a metal gate and the dummy gate
120a may include a poly Si gate.
[0096] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIGS. 5 and 6.
[0097] FIG. 5 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept. FIG. 6
is a cross-sectional view taken along line C-C of FIG. 5. For the
sake of brevity and convenient explanation, substantially the same
content with the previous embodiment will be omitted.
[0098] Referring to FIGS. 5 and 6, the semiconductor device 3
includes active fins F11, F21 and F31 in first active region ACT11,
active fins F12, F22 and F32 in a second active region ACT12,
active fins F41 and F5 in a third active region ACT21, and active
fins F42 and F52 in a fourth active region ACT22.
[0099] The active fins F11, F21, and F31 are spaced apart from the
active fins F12, F22, and F32 in a first direction X1, and the
active fins F41 and F51 are spaced apart from the active fins F42
and F52 in the first direction X1.
[0100] A normal gate 150 is disposed on the active fins F11, F21,
F31, F41, and F51, extending in the second direction Y and crossing
the active fins F11, F21, F31, F41, and F51. Normal gates 180, 190,
and 195 are disposed on the active fins F12, F22, F32, F42 and F52,
extending in the second direction Y and crossing the active fins
F12, F22, F32, F42 and F52.
[0101] A first dummy gate 160 overlaps the active fins F11, F21,
F31, F41, and F51 and the device isolation layer 23, extending in
the second direction Y.
[0102] A second dummy gate 170 overlaps the active fins F12, F22,
F32, F42 and F52 and the device isolation layer 23, extending in
the second direction Y.
[0103] The first metal layers 153 and 183 and the second metal
layers 154 and 184 included in the normal gates 150 and 180 may be
substantially the same as corresponding elements of the previous
embodiment, which have been described above. In addition, the gate
insulation layers 152 and 182 and the normal spacers 151 and 181
may also be substantially the same as corresponding elements of the
previous embodiment, which have been described above.
[0104] The first metal layers 163 and 173 and the second metal
layers 164 and 174 included in the dummy gates 160 and 170 may be
substantially the same as corresponding elements of the previous
embodiment, which have been described above. In addition, the gate
insulation layers 162 and 172 and the dummy spacers 161 and 171 may
also be substantially the same as corresponding elements of the
previous embodiment, which have been described above.
[0105] Impurity epitaxial layers may be formed on the active fins
disposed at opposite sides of the normal gate. For example,
impurity epitaxial layers 41 and 42 are formed on an active fin F21
disposed at opposite sides of the normal gate 150, and impurity
epitaxial layers 43 and 44 are formed on an active fin F22 disposed
at opposite sides of the normal gate 180.
[0106] Since the dummy gate 160 is formed to be adjacent to the
impurity epitaxial layer 42, the impurity epitaxial layer 42 may be
formed in a reliable manner. In addition, since the dummy gate 170
is formed to be adjacent to the impurity epitaxial layer 43, the
impurity epitaxial layer 43 may also be formed in a reliable
manner.
[0107] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIG. 7.
[0108] FIG. 7 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept. For the sake of brevity and convenient explanation,
substantially the same content with the previous embodiments will
be omitted.
[0109] Referring to FIG. 7, the semiconductor device 4 is different
from the semiconductor device 3 according to the previous
embodiment shown in FIG. 5, in view of configurations of dummy
gates 160a and 170a.
[0110] For example, the dummy gates 160a and 170a of the
semiconductor device 4 include poly Si gates, unlike in the
semiconductor device 3 according to the previous embodiment.
[0111] The dummy gates 160a and 170a may be formed in such a manner
that the poly Si gates included in the dummy gates 160a and 170a
are not replaced with metal gates during a gate replacement
process.
[0112] The dummy gate 160a including a poly Si gate and the dummy
gate 170a including a poly Si gate are illustrated in FIG. 7, but
the present inventive concept is not limited thereto.
[0113] For example, the dummy gate 160a may include a poly Si gate
and the dummy gate 170a may include a metal gate. Alternatively,
the dummy gate 160a may include a metal gate and the dummy gate
170a may include a poly Si gate.
[0114] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIGS. 8 and 9.
[0115] FIG. 8 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept, and
FIG. 9 is a cross-sectional view taken along line D-D of FIG. 8.
For the sake of brevity and convenient explanation, substantially
the same content with the previous embodiments will be omitted.
[0116] Referring to FIGS. 8 and 9, active fins F101 to F104 of the
semiconductor device 5 extend in a first direction X.
[0117] In this embodiment, long sides of the active fins F101 and
F104 are longer than long sides of the active fins F102 and
F103.
[0118] A first device isolation layer 24 is formed at one side of
the active fins F101 to F104 (for example, in the left side of FIG.
8). A second device isolation layer 26 is formed at the other side
of the active fins F102 and F103 (for example, in the right side of
FIG. 8).
[0119] As shown, the second device isolation layer 26 may be formed
at the other side of the active fins F102 and F103 (for example, in
the right side of FIG. 8).
[0120] A bottom surface of the second device isolation layer 26 is
lower than a bottom surface of the first device isolation layer 24.
For example, the bottom surface of the second device isolation
layer 26 is lower than the bottom surface of the first device
isolation layer 24 by a first predetermined distance H1.
[0121] The bottom surface of the second device isolation layer 26
is also lower than a top surface of the substrate 10 (that is, a
bottom surface of the active fin F102).
[0122] A top surface of the second device isolation layer 26 is
higher than a top surface of the first device isolation layer 24.
For example, the top surface of the second device isolation layer
26 is higher than the top surface of the first device isolation
layer 24 by a predetermined distance H2.
[0123] Accordingly, a total height of the second device isolation
layer 26 is greater than a total height of the first device
isolation layer 24 by the sum of the first distance H1 and the
second distance H2.
[0124] The dummy gate 210 is disposed on the first device isolation
layer 24, extending in the second direction Y without overlapping
the active fins F101 to F104. The dummy gate 220 is disposed on the
first device isolation layer 24, extending in the second direction
Y and overlapping the active fins F101 to F104.
[0125] The dummy gate 240 is disposed on the second device
isolation layer 26, extending in the second direction Y. The dummy
gate 240 does not overlap the active fins F102 and F103 and
overlaps the active fins F101 and F104.
[0126] First metal layers 213, 223, and 243 and second metal layers
214, 224, and 244 included in the dummy gates 210, 220, and 240 may
be substantially the same as corresponding elements of the previous
embodiment, which have been described above. In addition, gate
insulation layers 212, 222, and 242 and dummy spacers 211, 221, and
241 may also be substantially the same as corresponding elements of
the previous embodiment, which have been described above.
[0127] A normal gate 230 is disposed on the active fins F101 to
F104, extending in the second direction Y and crossing the active
fins F101 to F104.
[0128] The first metal layer 233 and the second metal layer 234
included in the normal gate 230 may be substantially the same as
corresponding elements of the previous embodiment, which have been
described above. In addition, a gate insulation layer 232 and a
normal spacer 231 may also be substantially the same as
corresponding elements of the previous embodiment, which have been
described above.
[0129] Impurity epitaxial layers may be formed on active fins
disposed at opposite sides of the normal gate 230. For example,
impurity epitaxial layers 51 and 52 are formed on active fin F102
disposed at opposite sides of the normal gate 230.
[0130] Since the dummy gate 220 is formed to be adjacent to the
impurity epitaxial layer 51, the impurity epitaxial layer 51 may be
formed in a reliable manner.
[0131] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIG. 10.
[0132] FIG. 10 is a cross-sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept. For the sake of brevity and convenient explanation,
substantially the same content with the previous embodiments will
be omitted.
[0133] Referring to FIG. 10, the semiconductor device 6 is
different from the semiconductor device 5 according to the previous
embodiment shown in FIGS. 8 and 9, in view of configurations of
dummy gates 210a, 220a, and 240a.
[0134] For example, the dummy gates 210a, 220a, and 240a of the
semiconductor device 6 may include poly Si gates, unlike the
semiconductor device 5 according to the previous embodiment.
[0135] The dummy gates 210a, 220a, and 240a may be formed in such a
manner that the poly Si gates included in the dummy gates 210a,
220a, and 240a are not replaced with metal gates during a gate
replacement process.
[0136] The dummy gates 210a, 220a, and 240a including poly Si gates
are illustrated in FIG. 10, but the present inventive concept is
not limited thereto.
[0137] For example, one of the dummy gates 210a, 220a, and 240a may
include a poly Si gate and the other two dummy gates may include
metal gates.
[0138] Alternatively, two of the dummy gates 210a, 220a, and 240a
may include poly Si gates and the other may include a metal
gate.
[0139] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIGS. 11 and 12.
[0140] FIG. 11 is a layout view of a semiconductor device according
to an exemplary embodiment of the present inventive concept, and
FIG. 12 is a cross-sectional view taken along line E-E of FIG. 11.
For the sake of brevity and convenient explanation, substantially
the same content with the previous embodiments will be omitted.
[0141] Referring to FIGS. 11 and 12, the semiconductor device 7 is
different from the semiconductor device 5 according to the previous
embodiment shown in FIGS. 8 and 9, in view of arrangement of a
dummy gate 250.
[0142] For example, unlike the semiconductor device 5 of FIGS. 8
and 9 in which the dummy gate 240 is disposed on the second device
isolation layer 26, extending in the second direction Y without
overlapping the active fins F102 and F103, the dummy gate 250 of
the semiconductor device 7 is disposed on a second device isolation
layer 26, extending in a second direction Y and overlapping some
portions of active fins F102 and F103.
[0143] Accordingly, an impurity epitaxial layer 52 formed to be
adjacent to the dummy gate 250 may be formed in a reliable
manner.
[0144] Hereinafter, a semiconductor device according to an
exemplary embodiment of the present inventive concept will be
described with reference to FIG. 13.
[0145] FIG. 13 is a cross-sectional view illustrating a
semiconductor device according to an exemplary embodiment of the
present inventive concept. For the sake of brevity and convenient
explanation, substantially the same content with the previous
embodiments will be omitted.
[0146] Referring to FIG. 13, the semiconductor device 8 is
different from the semiconductor device 7 according to the previous
embodiment shown in FIG. 12, in view of configuration of a dummy
gate 250a.
[0147] For example, the dummy gate 250a of the semiconductor device
8 may include a poly Si gate, unlike in the semiconductor device 7
according to the previous embodiment.
[0148] The dummy gate 250a may be formed in such a manner that the
poly Si gate included in the dummy gate 250a is not replaced with a
metal gate during a gate replacement process.
[0149] Among dummy gates 210 and 220 and 250a, only the dummy gate
250a includes a poly Si gate, but the present inventive concept is
not limited thereto.
[0150] For example, at least one of dummy gates 210 and 220 may
include a poly Si gate.
[0151] FIGS. 14 and 15 are block diagrams of semiconductor devices
according to exemplary embodiments of the present inventive
concept.
[0152] Referring first to FIG. 14, the semiconductor device 13
includes a logic region 410 and a static random access memory
(SRAM) forming region 420. A first transistor 411 is disposed in
the logic region 410, and a second transistor 421 is disposed in
the SRAM forming region 420.
[0153] The first transistor 411 and the second transistor 421 may
be different from each other. For example, the first transistor 411
may include the above-described semiconductor device 5 and the
second transistor 421 may include the above-described semiconductor
device 3. The present inventive concept is not limited thereto.
Configurations of the first transistor 411 and the second
transistor 421 may vary in various manners.
[0154] Next, referring to FIG. 15, the semiconductor device 14 may
include a logic region 410, and third and fourth transistors 412
and 422, which are different from each other, are formed in the
logic region 410. The third and fourth transistors 412 and 422
different from each other may be formed in an SRAM forming region
420 (not shown) as well.
[0155] The third transistor 412 and the fourth transistor 422 may
be different from each other. For example, the third transistor 412
may be an N-type Metal Oxide Semiconductor (NMOS) transistor and
the fourth transistor 422 may be a P-type Metal Oxide Semiconductor
(PMOS) transistor, but the present inventive concept is not limited
thereto.
[0156] The third and fourth transistors 412 and 422 may include at
least one of the semiconductor devices 1 to 8 according to an
exemplary embodiment of the present inventive concept.
[0157] In FIG. 14, the logic region 410 and the SRAM forming region
420 are illustrated by way of example, but the present inventive
concept is not limited thereto. For example, the present inventive
concept may also be applied to the logic region 410 and a region
where other types of memories are formed. For example, the other
memories may include a dynamic random access memory (DRAM), a
magnetoresistive random access memory (MRAM), a resistive random
access memory (RRAM), a phase change random access memory (PRAM),
etc.
[0158] FIG. 16 is a block diagram of a system on chip (SoC) system
including a semiconductor device according to an exemplary
embodiment of the present inventive concept.
[0159] Referring to FIG. 16, the SoC system 1000 includes an
application processor 1001 and a DRAM 1060.
[0160] The application processor 1001 includes a central processing
unit (CPU) 1010, a multimedia system 1020, a bus 1030, a memory
system 1040, and a peripheral circuit 1050.
[0161] The CPU 1010 may execute arithmetic operations required to
drive the SoC system 1000. In some exemplary embodiments of the
present inventive concept, the CPU 1010 may be configured by
multi-core environments including a plurality of cores.
[0162] The multimedia system 1020 may be used when the SoC system
1000 performs various multimedia functions. The multimedia system
1020 may include a three dimensional (3D) engine module, a video
codec, a display system, a camera system, and a post-processor.
[0163] The bus 1030 may be used when the CPU 1010, the multimedia
system 1020, the memory system 1040, and the peripheral circuit
1050 perform data communication with each other. In some exemplary
embodiments of the present inventive concept, the bus 1030 may have
a multi-layer structure. For example, the bus 1030 may include a
multi-layer advanced high-performance bus (AHB) or a multi-layer
advanced eXtensible interface (AXI), but the present inventive
concept is not limited thereto.
[0164] The memory system 1040 may provide an environment required
for high-speed operation of the application processor 1001
connected to an external memory (for example, DRAM 1060). In some
exemplary embodiments of the present inventive concept, the memory
system 1040 may include a separate controller (for example, a DRAM
controller) for controlling the external memory (for example, DRAM
1060).
[0165] The peripheral circuit 1050 may provide environments
required for the SoC system 1000 to be connected to an external
device (e.g., a main board). Accordingly, the peripheral circuit
1050 may include various interfaces to be compatible with the
external device connected to the SoC system 1000.
[0166] The DRAM 1060 may function as a working memory required for
the application processor 1001 to operate. In some exemplary
embodiments of the present inventive concept, as shown, the DRAM
1060 may be positioned outside the application processor 1001. In
this case, the DRAM 1060 may be packaged with the application
processor 1001 in the form of a package on package (PoP).
Alternatively, the DRAM 1060 may be part of the application
processor 1001. In this case, the DRAM 1060 may be integrated with
the application processor in a fabrication process thereof.
[0167] At least one of the components of the SoC system 1000 may
employ one of the semiconductor devices 1 to 8 according to some
exemplary embodiments of the present inventive concept.
[0168] FIG. 17 is a block diagram of an electronic system including
a semiconductor device according to an exemplary embodiment of the
present inventive concept.
[0169] Referring to FIG. 17, the electronic system 1100 includes a
controller 1110, an input/output device (I/O) 1120, a memory device
1130, an interface 1140 and a bus 1150. The controller 1110, the
I/O 1120, the memory device 1130, and/or the interface 1140 may be
connected to each other through the bus 1150. The bus 1150
corresponds to a path through which data moves.
[0170] The controller 1110 may include at least one of a
microprocessor, a digital signal processor, a microcontroller, and
logic elements capable of performing similar functions of these
elements listed. The I/O 1120 may include a key pad, a key board, a
display device, and so on. The memory device 1130 may store data
and/or commands. The interface 1140 may perform functions of
transmitting data to a communication network or receiving data from
the communication network. The interface 1140 may be wired or
wireless. For example, the interface 1140 may include an antenna or
a wired/wireless transceiver, and so on.
[0171] Although not shown, the electronic system 1100 may further
include high-speed DRAM and/or SRAM as a working memory for
increasing the performance of the controller 1110.
[0172] The semiconductor devices 1 to 8 according to some exemplary
embodiments of the present inventive concept may be provided in the
memory device 1130 or may be provided as some components of the
controller 1110 or the I/O 1120.
[0173] The electronic system 1100 may be applied to a personal
digital assistant (PDA), a portable computer, a web tablet, a
wireless phone, a mobile phone, a digital music player, a memory
card, or any type of electronic device capable of transmitting
and/or receiving information in a wireless environment.
[0174] The electronic system 1100 may be applied to a personal
digital assistant (PDA), a portable computer, a web tablet, a
wireless phone, a mobile phone, a digital music player, a memory
card, or any type of electronic device capable of transmitting
and/or receiving information in a wireless environment.
[0175] FIGS. 18 to 20 illustrate exemplary electronic systems to
which semiconductor devices according to some exemplary embodiments
of the present inventive concept may be applied.
[0176] FIG. 18 illustrates a tablet PC including a semiconductor
device according to an exemplary embodiment of the present
inventive concept, FIG. 19 illustrates a notebook computer
including a semiconductor device according to an exemplary
embodiment of the present inventive concept, and FIG. 20
illustrates a smart phone including a semiconductor device
according to an exemplary embodiment of the present inventive
concept. In addition, an exemplary semiconductor device according
to the present inventive concept may also be applied to other
consumer electronic products not illustrated herein.
[0177] For example, the consumer electronic products may include a
computer, an ultra mobile personal computer (UMPC), a work station,
a net-book, a personal digital assistant (PDA), a portable
computer, a wireless phone, a mobile phone, an e-book, a portable
multimedia player (PMP), a potable game console, a navigation
device, a black box, a digital camera, a 3-dimensional (3D)
television, a digital audio recorder, a digital audio player, a
digital picture recorder, a digital picture player, a digital video
recorder, a digital video player, or the like.
[0178] FIGS. 21 to 26 are diagrams illustrating intermediate
process steps in a method of fabricating a semiconductor device
according to an exemplary embodiment of the present inventive
concept.
[0179] First, referring to FIG. 21, an active fin F102, which
protrudes from a substrate 10 and extends in one direction, is
formed on the substrate 10.
[0180] For example, the active fin F102 may be formed by etching
the substrate 10. Alternatively, the active fin F102 may be formed
by forming an epitaxial layer including a semiconductor material on
the substrate 10 and patterning the formed epitaxial layer.
[0181] Next, referring to FIG. 22, a first trench T1 is formed by
etching one side of the active fin F102 (for example, the left side
of the active fin F102). A top surface of the substrate 10 may be
exposed by the first trench T1.
[0182] Next, referring to FIG. 23, a first device isolation layer
24 is formed to fill the first trench (T1 of FIG. 22) and to
surround the active fin F102. The first device isolation layer 24
may extend in the second direction Y, for example, as shown in FIG.
8.
[0183] Referring to FIG. 24, a second trench T2 is formed by
etching the other side of the active fin F102 (for example, the
right side of the active fin F102). The second trench T2 is formed
to be lower than the first trench (T1 of FIG. 22) by a first
distance H1. For example, in the course of forming the second
trench T2, a top portion of the substrate 10 may be etched.
[0184] Next, referring to FIG. 25, the second trench (T2 of FIG.
24) is filled with a second device isolation layer 26. For example,
the second device isolation layer 26 is formed to be higher than a
top surface of the active fin F102 by a second distance H2.
Accordingly, a top surface of the second device isolation layer 26
is higher than a top surface of the first device isolation layer 24
and a top surface of the active fin F102 by the second distance
H2.
[0185] Next, referring to FIG. 26, dummy gates 210a, 220a, 230a,
and 240a are formed on the active fin F102 and the first and second
device isolation layers 24 and 26.
[0186] For example, the dummy gate 210a is formed on the first
device isolation layer 24, extending in the second direction (Y of
FIG. 8) without overlapping the active fin F102. The dummy gate
220a is formed on the active fin F102 and the first device
isolation layer 24, extending in the second direction (Y of FIG.
8).
[0187] In addition, the dummy gate 230a may be formed on the active
fin F102, extending in the second direction (Y of FIG. 8), and the
dummy gate 240a may be formed on the second device isolation layer
26, extending in the second direction (Y of FIG. 8).
[0188] Next, spacers 211, 221, 231, and 241 are formed at opposite
sides of the dummy gates 210a, 220a, 230a, and 240a, respectively.
The spacers 211, 221, 231, and 241 may include materials having
etching selectivity with respect to the dummy gates 210a, 220a,
230a, and 240a.
[0189] Next, impurity epitaxial layers 51 and 52 are formed on the
active fin F102 disposed at opposite sides of the dummy gate 230a.
In this embodiment, the impurity epitaxial layers 51 and 52 may be
formed through, for example, an epitaxial growth process.
[0190] In such a manner, in a case where the impurity epitaxial
layers 51 and 52 are formed through the epitaxial growth process,
growth of the impurity epitaxial layers 51 and 52 may be interfered
by an insulation layer formed to be adjacent to the impurity
epitaxial layers 51 and 52. For example, the impurity epitaxial
layers 51 and 52 may include a defect, such as a facet, due to the
interference of the insulation layer.
[0191] In this embodiment, the dummy gate 220a and the spacer 221,
including a material having a similar crystal structure to a
material included in the impurity epitaxial layer 51, are formed to
be adjacent to the impurity epitaxial layer 51. Therefore, the
impurity epitaxial layer 51 may grow without or reducing defects
through the epitaxial growth process.
[0192] Thereafter, the dummy gates 210a, 220a, 230a, and 240a are
replaced with metal gates using a gate replacement process, thereby
fabricating the semiconductor device 5 shown in FIG. 9.
[0193] In addition, the semiconductor device 6 shown in FIG. 10 may
be fabricated by replacing only the dummy gate 230a among the dummy
gates 210a, 220a, 230a, and 240a with a metal gate using the gate
replacement process.
[0194] Further, the semiconductor device 7 of FIG. 12 and the
semiconductor device 8 of FIG. 13 may be fabricated by forming the
dummy gate 240a on the second device isolation layer 26 and the
active fin F102, respectively.
[0195] In addition, the semiconductor device 1 of FIG. 2, the
semiconductor device 2 of FIG. 4, the semiconductor device 3 of
FIG. 6, and the semiconductor device 4 of FIG. 7 may be fabricated
by skipping the process of forming the second device isolation
layer 26.
[0196] While the present inventive concept has been shown and
described with reference to exemplary embodiments thereof, it will
be apparent to those of ordinary skill in the art that various
changes in form and detail may be made therein without departing
from the spirit and scope of the inventive concept as defined by
the following claims.
* * * * *