U.S. patent application number 14/555706 was filed with the patent office on 2016-06-02 for heat dissipation structure for wearable mobile device.
The applicant listed for this patent is ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Ching-Hang Shen.
Application Number | 20160154441 14/555706 |
Document ID | / |
Family ID | 56079190 |
Filed Date | 2016-06-02 |
United States Patent
Application |
20160154441 |
Kind Code |
A1 |
Shen; Ching-Hang |
June 2, 2016 |
HEAT DISSIPATION STRUCTURE FOR WEARABLE MOBILE DEVICE
Abstract
A heat dissipation structure for a wearable mobile device
comprises a wearable mobile device and a flexible belt. The
wearable mobile device has a receiving space which receives a
plurality of electronic components having at least one heat source.
The flexible belt is made of rubber or silicone and has a cavity
which has at least one wick structure and a working liquid. A wall
of the cavity protrudes to form a supporting portion. The flexible
belt defines a heat absorbing portion and at least one heat
dissipating portion. Two ends of the heat absorbing portion form
the heat dissipating portion. The heat absorbing portion contacts
the electronic components or the heat source to conduct heat. The
present invention provides a heat dissipation structure using a
vapor-liquid circulating chamber and structure disposed in a
flexible belt for a wearable mobile device to enhance the whole
heat dissipation efficiency.
Inventors: |
Shen; Ching-Hang; (New
Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS CO., LTD. |
New Taipei City |
|
TW |
|
|
Family ID: |
56079190 |
Appl. No.: |
14/555706 |
Filed: |
November 28, 2014 |
Current U.S.
Class: |
361/679.03 |
Current CPC
Class: |
G06F 1/203 20130101;
G06F 1/163 20130101 |
International
Class: |
G06F 1/20 20060101
G06F001/20; G06F 1/16 20060101 G06F001/16 |
Claims
1. A heat dissipation structure for a wearable mobile device,
comprising: a wearable mobile device having a receiving space which
receives a plurality of electronic components, wherein the
electronic components have at least one heat source; and a flexible
belt made of rubber or silicone, wherein the flexible belt has a
cavity which is filled with a working liquid and protrudes to form
a supporting portion, wherein a wall of the cavity has at least one
wick structure, wherein the flexible belt defines a heat absorbing
portion and at least one heat dissipating portion, wherein two ends
of the heat absorbing portion form the heat dissipating portion,
wherein the heat absorbing portion contacts the electronic
components or the heat source to conduct heat.
2. The heat dissipation structure according to claim 1, wherein the
wick structure is selected to be one of mesh, fiber, metal wire
braid, and sintered powder.
3. The heat dissipation structure according to claim 1, wherein the
electronic components are selected to be one of PCBs, transistors,
CPUs, MCUs, GPUs, RAMs, displays, touch panels, and batteries.
4. The heat dissipation structure according to claim 1, wherein the
wall of the cavity has a coating layer.
5. The heat dissipation structure according to claim 1, wherein a
heat conductor is embedded in the heat absorbing portion, wherein
one side of the heat conductor is attached to the electronic
components or the heat source, wherein the other side of the heat
conductor corresponds to the cavity of the flexible belt, wherein
the wick structure is disposed around the heat conductor.
6. The heat dissipation structure according to claim 1, wherein the
heat absorbing portion of the flexible belt is thinner than the
other portion of the flexible belt, wherein part of the heat
absorbing portion contacts the heat transfer unit.
7. The heat dissipation structure according to claim 1, further
comprising at least one heat transfer unit which is selected to be
one of a heat pipe, a vapor chamber, and a graphite sheet, wherein
the heat transfer unit is disposed between the electronic
components and the flexible belt.
8. The heat dissipation structure according to claim 1, wherein the
supporting portion has a plurality of ribs which are disposed in
parallel, wherein at least one channel is disposed among the
ribs.
9. The heat dissipation structure according to claim 1, wherein the
supporting portion has a plurality of protrusions which are spaced
to each other, wherein at least one channel is disposed transverse
to or longitudinal to the protrusions.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat dissipation
structure for a wearable mobile device and, in particular, to a
heat dissipation structure for a wearable mobile device which is
used to dissipate heat inside the wearable mobile device.
[0003] 2. Description of Prior Art
[0004] As technology increasingly advances, the current wearable
mobile devices are not limited to mobile phones and tablet
computers, but further cover wearable devices such as watches,
necklaces, and rings which become multiple function smart mobile
devices. Besides, per customers request, the electronic components
associated with the touch panel, GPS function, exercise sensors,
and medical monitoring function are integrated into the smart
mobile devices. For the smart watch, it not only can connect with
other mobile devices through the Bluetooth or the network, but also
can have the network capability after a 3G or 4G SIM card inserted
and perform the functions of calling, photographing, and video
recording. Thus, when the smart watch is operating, it will
generate heat. Also, the whole structure of the smart watch is
designed as sealed to be dustproof, waterproof, or protected. As a
result, the heat generated by the internal electronic elements
cannot be dissipated to the outside and accumulated inside the
smart watch or the device, which causes the smart watch to operate
inefficiently or pause and more serious to crash. Therefore, how to
dissipate the heat generated by the smart watch or various wearable
exercise devices becomes a priority issue to be resolved.
SUMMARY OF THE INVENTION
[0005] Thus, to overcome the disadvantages of the above issue, the
primary objective of the present invention is to provide a heat
dissipation structure for a wearable mobile device, which resolves
the issue of internal heat accumulation of the wearable mobile
device.
[0006] To achieve the above objective, the present invention
provides a heat dissipation structure for a wearable mobile device,
which comprises a wearable mobile device and a flexible belt. The
wearable mobile device has a receiving space which receives a
plurality of electronic components. The electronic components have
at least one heat source. The flexible belt is made of rubber or
silicone; the flexible belt has a cavity which is configured with a
working liquid and a wick structure. A wall of the cavity protrudes
to form a supporting portion. The flexible belt defines a heat
absorbing portion and at least one heat dissipating portion. Two
ends of the heat absorbing portion form the heat dissipating
portion. The heat absorbing portion contacts the electronic
components or the heat source to conduct heat. The present
invention provides a heat dissipation structure using a
vapor-liquid circulating chamber and structure disposed in a
flexible belt for a wearable mobile device to enhance the whole
heat dissipation efficiency.
BRIEF DESCRIPTION OF DRAWING
[0007] FIG. 1 is a perspective exploded view of the heat
dissipation structure for a wearable mobile device according to the
first embodiment of the present invention;
[0008] FIG. 2 is an assembled cross-sectional view of the heat
dissipation structure for a wearable mobile device according to the
first embodiment of the present invention;
[0009] FIG. 3 is a local enlarged view of FIG. 2;
[0010] FIG. 4 is a perspective exploded view of the heat
dissipation structure for a wearable mobile device according to the
second embodiment of the present invention;
[0011] FIG. 5 is an assembled cross-sectional view of the heat
dissipation structure for a wearable mobile device according to the
second embodiment of the present invention;
[0012] FIG. 6 is a local enlarged view of FIG. 5;
[0013] FIG. 7 is an assembled cross-sectional view of the heat
dissipation structure for a wearable mobile device according to the
third embodiment of the present invention;
[0014] FIG. 8 is an assembled cross-sectional view of the heat
dissipation structure for a wearable mobile device according to the
fourth embodiment of the present invention; and
[0015] FIG. 9 is a perspective exploded view of the heat
dissipation structure for a wearable mobile device according to the
fifth embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0016] The above objective of the present invention and the
features of structure and function of the present invention are
described according to preferred embodiments in accompanying
figures.
[0017] Please refer to FIGS. 1-3, which are a perspective exploded
view, an assembled cross-sectional view, and a local enlarged view
of the heat dissipation structure for a wearable mobile device
according to the first embodiment of the present invention,
respectively. As shown in FIGS. 1-3, the heat dissipation structure
for a wearable mobile device 1 of the present invention comprises a
wearable mobile device 11 and a flexible belt 12.
[0018] The wearable mobile device 11 has a receiving space 111
which receives a plurality of electronic components 112. The
electronic components 112 have at least one heat source 1121.
[0019] The flexible belt 12 is made of rubber or silicone. The
flexible belt 12 has a cavity 121 which is provided with at least
one wick structure 123 and a working liquid 2. A wall of the cavity
121 protrudes to form a supporting portion 121a.
[0020] The supporting portion 121 a has a plurality of ribs 1211
which are arranged continuously or non-continuously and are
disposed in parallel. At least one channel 1212 is disposed among
the ribs 1211. The channel 1212 can be used as a vapor channel to
vaporize the working liquid 2.
[0021] The flexible belt 12 defines a heat absorbing portion 122
and at least one heat dissipating portion 124. At least one end of
the heat absorbing portion 122 forms the heat dissipating portion
124.
[0022] The heat absorbing portion 122 is disposed in the receiving
space 111 of the wearable mobile device 11 to contact the
electronic components 112 or the heat source 1121.
[0023] In the current embodiment, the electronic components 112 are
selected to be one of PCBs, transistors, CPUs, MCUs, displays,
touch panels, and batteries. The electronic components 112 is
attached on or placed on the heat absorbing portion 122 which is
disposes close to the center of the flexible belt 12. The upper
side or lower side of the heat absorbing portion 122 can directly
contact the electronic components 112 (as shown in FIG. 2).
[0024] The heat absorbing portion 122 of the flexible belt 12 is
thinner than the other portion of the flexible belt 12. Through the
direct contact between the heat absorbing portion 122 and the
electronic components 112 or the heat source 1121, the heat can be
directly conducted from the heat absorbing portion 122 to the
flexible belt 12 and can vaporize and diffuse the working liquid 2
in the cavity 121 of the flexible belt 12. Besides, condensation
occurs in the cavity 121 located at the heat dissipating portion
124 of the flexible belt 12 and then the condensed liquid flows
back to around the heat absorbing portion 122 through the wick
structure 123 to repeat the vapor-liquid circulation to achieve the
effect of heat dissipation.
[0025] Please refer to FIGS. 4-6, which are a perspective exploded
view, an assembled cross-sectional view, and a local enlarged view
of the heat dissipation structure for a wearable mobile device
according to the second embodiment of the present invention,
respectively. Some structural and technical features of the current
embodiment are the same as those of the first embodiment and will
not be described here again. The difference is given below for the
current embodiment. A heat conductor 122a is embedded in the heat
absorbing portion 122. One side of the heat conductor 122a is
attached to the electronic components 112 or the heat source 1121;
the other side of the heat conductor 122a corresponds to the cavity
121 of the flexible belt 12. The wick structure 123 is partially
extended and disposed around the heat conductor 122a.
[0026] In the current embodiment, the heat conductor 122a may be
selected to be one of a copper plate, an aluminum plate, a metal
plate, a heat pipe, a vapor chamber, and a graphite. The copper
plate is used as an example in the current embodiment, but not
limited to this.
[0027] The current embodiment is mainly to deal with the heat
generated by the heat source 1121 of the electronic components 112
of the wearable mobile device 11. The heat is further absorbed
through the heat conductor 122a disposed on the heat absorbing
portion 122 and conducted into the cavity 121. The working liquid 2
in the cavity 121 of the heat absorbing portion 122 is heated and
vaporized. Vaporization and diffusion occur in the cavity 121 of
the heat absorbing portion 122. Then, the vapor is condensed to be
a liquid state in the cavity 121 of the heat dissipating portion
124 and then is absorbed by the wick structure 123 to flow back to
around the heat absorbing portion 122 to repeat the vapor-liquid
circulation to achieve the effect of heat dissipation of the
electronic components 112.
[0028] Please refer to FIG. 7, which is an assembled
cross-sectional view of the heat dissipation structure for a
wearable mobile device according to the third embodiment of the
present invention. As shown in FIG. 7, some structural and
technical features of the current embodiment are the same as those
of the second embodiment and will not be described here again. The
difference is that the cavity 121 of the flexible belt 12 of the
current embodiment further has a coating layer 3. The coating layer
3 is disposed on the wall of the cavity 121. The coating layer 3
can improve the condensation of the working liquid 2 (refer to FIG.
5) and the efficiency of liquid collection.
[0029] Please refer to FIG. 8, which is an assembled
cross-sectional view of the heat dissipation structure for a
wearable mobile device according to the fourth embodiment of the
present invention. As shown in FIG. 8, some structural and
technical features of the current embodiment are the same as those
of the first embodiment and will not be described here again. The
difference is that the current embodiment further comprises at
least one heat transfer unit 4 which is selected to be one of a
heat pipe, a vapor chamber, and a graphite sheet. The heat transfer
unit 4 is disposed between the electronic components 112 and the
flexible belt 12. The heat of the electronic components 112 can be
absorbed through the large surface of the heat transfer unit 4 and
then is conducted to the heat absorbing portion 122 of the flexible
belt 12. The received heat in the heat absorbing portion 122 in
then conducted to the heat dissipating portion 124 in the distance
for heat dissipation (as shown in FIG. 5).
[0030] Please refer to FIG. 9, which is a perspective exploded view
of the heat dissipation structure for a wearable mobile device
according to the fifth embodiment of the present invention. As
shown in FIG. 9, some structural and technical features of the
current embodiment are the same as those of the first embodiment
and will not be described here again. The difference is that the
supporting portion 121a of the current embodiment has a plurality
of protrusions 1213. The protrusions 1213 are spaced to each other.
At least one channel 1212 is disposed transverse to or longitudinal
to the protrusions 1213. The channel 1212 is used as a vapor
channel after the working liquid 2 (refer to FIG. 5) is
vaporized.
[0031] The working liquid 2 in the previous embodiments is selected
to be one of mesh, fiber, metal wire braid, and sintered powder.
The mesh is used as an example in the current embodiment, but not
limited to this.
* * * * *