U.S. patent application number 14/872259 was filed with the patent office on 2016-04-14 for heat pipe assembly with bonded fins on the baseplate hybrid.
This patent application is currently assigned to MERSEN CANADA TORONTO INC.. The applicant listed for this patent is MERSEN CANADA TORONTO INC.. Invention is credited to Ahmed ZAGHLOL.
Application Number | 20160102920 14/872259 |
Document ID | / |
Family ID | 54325326 |
Filed Date | 2016-04-14 |
United States Patent
Application |
20160102920 |
Kind Code |
A1 |
ZAGHLOL; Ahmed |
April 14, 2016 |
HEAT PIPE ASSEMBLY WITH BONDED FINS ON THE BASEPLATE HYBRID
Abstract
A hybrid heat pipe assembly includes a baseplate dimensioned to
be placed in surface contact with a device. The baseplate is
configured to extract heat from the device. A plurality of fins is
bonded to the baseplate. The fins are configured to transfer a
first portion of the extracted heat from the baseplate to air
surrounding the fins. A complex heat pipe extends from the
baseplate and has an end positioned within the baseplate. The
complex heat pipe is configured to receive and transfer a second
portion of the extracted heat transferred from the baseplate. The
complex heat pipe is configured to transfer the second portion of
heat to a heat pipe fin stack to which.
Inventors: |
ZAGHLOL; Ahmed; (Cambridge,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MERSEN CANADA TORONTO INC. |
Mississauga |
|
CA |
|
|
Assignee: |
MERSEN CANADA TORONTO INC.
Mississauga
CA
|
Family ID: |
54325326 |
Appl. No.: |
14/872259 |
Filed: |
October 1, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62061311 |
Oct 8, 2014 |
|
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|
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28D 15/0266 20130101;
F28F 1/32 20130101; F28D 15/0275 20130101; F28F 3/02 20130101; F28D
15/02 20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Claims
1. A hybrid heat pipe assembly comprising: a baseplate dimensioned
to be placed in surface contact with a device, the baseplate being
configured to extract heat from the device; a plurality of fins
bonded to the baseplate, the fins being configured to transfer a
first portion of the extracted heat from the baseplate to air
surrounding the fins; a complex heat pipe extending from the
baseplate and having an end positioned within the baseplate, the
complex heat pipe being configured to receive and transfer a second
portion of the extracted heat transferred from the baseplate; and a
heat pipe fin stack to which the complex heat pipe is configured to
transfer the second portion of heat, the heat pipe fin stack being
joined to the complex heat pipe and configured to transfer the
second portion of the extracted heat received from the complex heat
pipe to air surrounding the stack.
2. The assembly of claim 1, wherein the complex heat pipe extends
from the baseplate and through the fins and the heat pipe fin
stack.
3. The assembly of claim 1, wherein the fins are bonded to the
baseplate in a plurality of groups, and wherein the groups are
separated from each other by the complex heat pipe.
4. The assembly of claim 3, wherein the complex heat pipe extends
from the baseplate and through two of the fin groups and the heat
pipe fin stack.
5. The assembly of claim 1, wherein the heat pipe fin stack is
separated from the baseplate by the fins.
6. The assembly of claim 1, wherein the fins are bonded to the
baseplate in a plurality of groups, wherein the complex heat pipe
is one of a plurality of complex heat pipes, and wherein each of
the complex heat pipes separates one of the fin groups from another
one of the fin groups.
7. The assembly of claim 6, wherein each of the complex heat pipes
extends through the heat pipe fin stack.
8. The assembly of claim 1, wherein the heat pipe fin stack
comprises a heat pipe protective fin into which the complex heat
pipe extends, and wherein the heat pipe protective fin is
positioned on an opposite side of the heat pipe fin stack from the
fins.
9. The assembly of claim 8, wherein the heat pipe protective fin is
positioned adjacent to one end of the complex heat pipe.
10. The assembly of claim 9, wherein another end of the complex
heat pipe is embedded in the baseplate.
11. The assembly of claim 1, wherein the fins are mounted to an
opposite side of the plate from a side of the baseplate in contact
with the device.
12. The assembly of claim 1, wherein the complex heat pipe is
embedded in the baseplate.
13. The assembly of claim 12, wherein the complex heat pipe extends
at an angle from the baseplate to an end of the complex heat
pipe.
14. A hybrid heat pipe assembly comprising: a baseplate dimensioned
to be placed in surface contact with a device, the baseplate being
configured to extract heat from the device; a plurality of fins
bonded to the baseplate, the fins being configured to transfer a
first portion of the extracted heat from the baseplate to air
surrounding the fins; a complex heat pipe apparatus positioned
within the baseplate, the apparatus comprising a chamber positioned
within the baseplate and a plurality of complex heat pipes secured
within the chamber, the complex heat pipes extending from the
baseplate and having ends positioned within the baseplate, the
chamber being configured to receive a second portion of the
extracted heat transferred from the baseplate and transfer the
second heat portion to the complex heat pipes, the complex heat
pipes being configured to receive and transfer the second heat
portion from the chamber; and a heat pipe fin stack to which the
complex heat pipes are configured to transfer the second portion of
heat, the heat pipe fin stack being joined to the complex heat
pipes and configured to transfer the second portion of the
extracted heat received from the complex heat pipes to air
surrounding the stack.
15. The assembly of claim 14, wherein the complex heat pipes extend
from the chamber through the fins and the heat pipe fin stack.
16. The assembly of claim 14, wherein the fins are bonded to the
baseplate in a plurality of groups, and wherein the groups are
separated from each other by the complex heat pipes.
17. The assembly of claim 16, wherein the complex heat pipes extend
from the chamber through two of the fin groups and the heat pipe
fin stack.
18. The assembly of claim 14, wherein the chamber is mounted
horizontally in the baseplate.
19. The assembly of claim 14, wherein the chamber is embedded in
the baseplate.
20. The assembly of claim 14, wherein the chamber is positioned in
a baseplate channel comprising walls defining the baseplate
channel, the chamber being secured to the walls.
Description
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application No. 62/061,311, filed Oct. 8, 2014, which is fully
incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The following disclosure is directed generally to hybrid
heat pipe assemblies.
BACKGROUND OF THE INVENTION
[0003] A device usually generates heat as a result of losses in
efficiency. A heat sink is a passive heat exchanger that can cool a
device by transferring heat generated by the device into a
surrounding cooling medium, such as air. A heat sink may have a
baseplate that can extract heat from a device that is in contact
with the baseplate. A heat sink may also include an assembly of
fins bonded to the baseplate that can transfer the extracted heat
from the baseplate to the surrounding cooling medium. Thus, there
is a flow of heat from the device through the baseplate and the
fins to the surrounding cooling medium, thereby serving to cool the
device in contact with the baseplate.
[0004] Since the heat sink is a passive heat transfer mechanism,
there may be situations in which the heat sink is not able to
adequately cool a device in contact therewith. In such cases, a
heat pipe apparatus might be applied. A heat pipe apparatus is also
a heat exchanger than can cool a device by transferring heat
generated by the device into a surrounding cooling medium. The heat
pipe apparatus may include an evaporator plate that can extract
heat from a device that is in contact with the evaporator plate.
The apparatus may also include a plurality of heat pipes in contact
with the evaporator plate that can transfer heat from the
evaporator plate to another location using liquid-to-vapor phase
changes.
[0005] Each of the heat pipes includes a working fluid, such as
water, sealed in a long thin walled cavity under vacuum. The cavity
may be cylindrical or rectangular, but is not limited thereto. When
heat is applied to a portion of the heat pipe, the working fluid
boils and is converted into vapor. The vapor moves from the heated
portion, or an evaporating area, of the pipe to a lower temperature
area, or a condensing area, of the heat pipe via an adiabatic
portion of the pipe where no phase change takes place. The lower
temperature area of the heat pipe is at an opposite end of the heat
pipe from the end of the heat pipe in contact with the evaporator
plate. In the lower temperature area of the heat pipe, the vapor
will condense back into a liquid. The liquid will move back to the
heated area of the heat pipe via the adiabatic portion of the pipe
to be heated and evaporated again. Thus, a two-phase flow cycle is
created.
[0006] The condensed liquid moves from the lower temperature area
of the heat pipe to the heated area of the heat pipe using gravity
or a wicking structure. If the liquid moves back to the heated area
as a result of gravity, the heat pipe has been oriented in such a
way that gravity can draw the condensed liquid down toward the
heated portion of the heat pipe. For example, such an orientation
may include a heat pipe being angled downwardly from the lower
temperature area of the heat pipe to the heated area of the heated
pipe. This allows gravity to draw the condensed liquid from the
higher, condensing area of the heat pipe toward the lower,
evaporating area of the heat pipe.
[0007] A large fin stack is positioned around the lower temperature
area, and possibly the adiabatic portion, of the heat pipe. The fin
stack can transfer the heat away from the heat pipes into the air
through forced or natural convection.
[0008] However, even such a heat pipe apparatus may not be
effective to dissipate heat from certain devices that are either
exceedingly inefficient or of a size significant enough to require
a greater cooling capacity than such a heat pipe apparatus can
provide on its own.
SUMMARY OF THE INVENTION
[0009] Described herein are multiple example embodiments related to
hybrid heat pipe assemblies.
[0010] In an aspect, a hybrid heat pipe is provided. The assembly
includes a baseplate dimensioned to be placed in surface contact
with a device, the baseplate being configured to extract heat from
the device. The assembly additionally includes a plurality of fins
bonded to the baseplate, the fins being configured to transfer a
first portion of the extracted heat from the baseplate to air
surrounding the fins. The assembly further includes a complex heat
pipe extending from the baseplate and having an end positioned
within the baseplate, the complex heat pipe being configured to
receive and transfer a second portion of the extracted heat
transferred from the baseplate. Moreover, the assembly includes a
heat pipe fin stack to which the complex heat pipe is configured to
transfer the second portion of heat, the heat pipe fin stack being
joined to the complex heat pipe and configured to transfer the
second portion of the extracted heat received from the complex heat
pipe to air surrounding the stack.
[0011] In an example of the aspect, the complex heat pipe extends
from the baseplate and through the fins and the heat pipe fin
stack. In another example of the aspect, the fins are bonded to the
baseplate in a plurality of groups. The groups are separated from
each other by the complex heat pipe. In a further example of the
aspect, the complex heat pipe extends from the baseplate and
through two of the fin groups and the heat pipe fin stack. In an
additional example of the aspect, each of the complex heat pipes
extends through the heat pipe fin stack.
[0012] In a further example of the aspect, the heat pipe fin stack
includes a heat pipe protective fin into which the complex heat
pipe extends. The heat pipe protective fin is positioned on an
opposite side of the heat pipe fin stack from the fins. In an
example of the aspect, the heat pipe protective fin is positioned
adjacent to one end of the complex heat pipe. In yet another
example of the aspect, another end of the complex heat pipe is
embedded in the baseplate.
[0013] In an additional example of the aspect, the fins are mounted
to an opposite side of the baseplate from a side of the baseplate
in contact with the device. In still another example of the aspect,
the complex heat pipe is embedded in the baseplate. In a further
example of the aspect, the complex heat pipe extends at an angle
from the baseplate to an end of the complex heat pipe.
[0014] In a second aspect, a hybrid heat pipe assembly for cooling
a device in contact is provided. The assembly includes a baseplate
dimensioned to be placed in surface contact with a device, the
baseplate being configured to extract heat from the device. The
assembly also includes a plurality of fins bonded to the baseplate,
the fins being configured to transfer a first portion of the
extracted heat from the baseplate to air surrounding the fins. The
assembly further includes a complex heat pipe apparatus positioned
within the baseplate, the apparatus including a chamber positioned
within the baseplate and a plurality of complex heat pipes secured
within the chamber, the complex heat pipes extending from the
baseplate and having ends positioned within the baseplate, the
chamber being configured to receive a second portion of the
extracted heat transferred from the baseplate and transfer the
second heat portion to the complex heat pipes, the complex heat
pipes being configured to receive and transfer the second heat
portion from the chamber. The assembly additionally includes a heat
pipe fin stack to which the complex heat pipes are configured to
transfer the second portion of heat, the heat pipe fin stack being
joined to the complex heat pipes and configured to transfer the
second portion of the extracted heat received from the complex heat
pipes to air surrounding the stack.
[0015] In an example of the aspect, the complex heat pipes extend
from the chamber through the fins and the heat pipe fin stack. In
an additional example of the aspect, the fins are bonded to the
baseplate in a plurality of groups, and the groups are separated
from each other by the complex heat pipes. In a further example of
the aspect, the complex heat pipes extend from the chamber through
two of the fin groups and the heat pipe fin stack. In yet another
example of the aspect, the chamber is mounted horizontally in the
baseplate. In another example of the aspect, the chamber is
embedded in the baseplate. In a still further example of the
aspect, the chamber is positioned in a baseplate channel comprising
walls defining the baseplate channel, the chamber being secured to
the walls.
[0016] Other features and aspects may be apparent from the
following detailed description, the drawings and the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 is a perspective view illustrating an example of a
hybrid heat pipe assembly.
[0018] FIG. 2 is front view illustrating an example of the hybrid
heat pipe assembly shown in FIG. 1.
[0019] FIG. 3 is a side cross-sectional view taken along lines 3-3
of FIG. 2 illustrating an example of the hybrid heat pipe assembly
shown in FIG. 1.
[0020] FIG. 4 is a close-up view of area 4 of FIG. 3 illustrating
an example of an interface of a baseplate and a complex heat pipe
of the hybrid heat pipe assembly shown in FIG. 1.
[0021] FIG. 5 is a perspective view illustrating an example of a
complex heat pipe of the hybrid heat pipe assembly shown in FIG.
1.
[0022] FIG. 6 is a perspective view illustrating an example of the
hybrid heat pipe assembly shown in FIG. 1 with devices in contact
therewith.
[0023] Throughout the drawings and the detailed description, unless
otherwise described, the same drawing reference numerals will be
understood to refer to the same elements, features and structures.
The relative size and depiction of these elements may be
exaggerated for clarity, illustration and convenience.
DETAILED DESCRIPTION
[0024] Examples incorporating one or more embodiments are described
and illustrated in the drawings. These illustrated examples are not
intended to be limiting. For example, one or more aspects of an
embodiment may be utilized in other embodiments and even other
types of devices.
[0025] FIGS. 1-6 illustrate an example hybrid heat pipe assembly in
surface contact with a plurality of devices 4. While the devices 4
illustrated in FIG. 6 bear a common resemblance with electronic
modules, embodiments described herein are not limited thereto. In
fact, one having ordinary skill in the art may use the hybrid heat
pipe assembly 2 to cool any applicable heat-generating device
having the ability to be in contact with the hybrid heat pipe
assembly 2.
[0026] While the devices 4 illustrated in FIG. 6 are mounted to the
hybrid heat pipe assembly 2 using fasteners 6, embodiments
described herein are not limited thereto. For example, the devices
4 may merely be in contact with the hybrid heat pipe assembly 2
without being fixed or mounted thereto. In addition, the devices 4
contacting the hybrid heat pipe assembly 2 may be related or
unrelated to each other. Moreover, the devices 4 may be in contact
with or isolated from each other. Whatever the case, the devices 4
to be cooled by the hybrid heat pipe assembly 2 are positioned with
respect to the hybrid heat pipe assembly in such a way as to
maximize surface contact with the hybrid heat pipe assembly 2,
thereby serving to increase an amount of heat extracted from the
devices 4 by the hybrid heat pipe assembly 2.
[0027] The illustrated hybrid heat pipe assembly 2 may combine
various aspects and elements of a bonded fin heat sink and a heat
pipe apparatus. However, the hybrid heat pipe assembly 2 is not
limited thereto and can be further supplemented by other heat
transfer means known by those of ordinary skill in the art.
[0028] The example hybrid heat pipe assembly 2 described and
illustrated herein includes a baseplate 8 in contact with the
devices 4, baseplate fins 10 bonded to the baseplate 8, a complex
heat pipe 12 extending from the baseplate 8 and having an end
positioned within the baseplate 8, and a heat pipe fin stack 14
joined to the complex heat pipe 12.
[0029] The baseplate 8 is configured to extract heat from the
devices 4 in contact with the baseplate 8. As was previously noted
with respect to the hybrid heat pipe assembly 2, while the devices
4 illustrated in FIG. 6 are mounted to the baseplate 8 using
fasteners 6, embodiments described herein are not limited thereto.
For example, the devices 4 may be in contact with the baseplate 8
without being fixed or mounted thereto. In addition, the devices 4
may be related or unrelated to each other or other items contacting
the baseplate 8.
[0030] The baseplate 8 may have a shape consistent with that of a
rectangular block. However, embodiments disclosed herein are not
limited thereto as the baseplate 8 can have any shape or structure
that is effective in cooling devices in contact therewith. Further,
while the baseplate 8 is illustrated in the example herein as being
flat or planar, embodiments described here are not limited thereto,
as the baseplate 8 may be curved or otherwise to maximize surface
contact with the devices 4 and extract heat from the devices 4 as
efficiently as possible. Thus, the shape and design of the
baseplate 8 may be adjusted for effective extraction of heat from
whatever device might be in surface contact therewith.
[0031] The baseplate 8 may be mounted on a corresponding structure
such that an edge line 20 of the baseplate 8 is parallel with
gravity. However, embodiments disclosed herein are not limited
thereto, as the baseplate 8 can be mounted in any plane
particularly suited for cooling the devices 4 in contact therewith,
as long as requirements for cooling the heat-generating devices 4
are met and acceptable support is provided for the baseplate 8.
[0032] The heat extracted from the devices 4 by the baseplate 8 may
be transferred therefrom to the baseplate fins 10 bonded to the
baseplate 8. The heat received by the baseplate fins 10 may be
directly transferred to the air surrounding the baseplate fins
10.
[0033] The baseplate fins 10 may be mounted directly on the
baseplate 8 or on a fin plate 30 that is subsequently mounted on
the baseplate 8. If mounted directly on the baseplate 8, each of
the baseplate fins 10 may include a flange (not shown) via which
the baseplate fin 10 is fastened to the baseplate 8. The flange may
extend from an edge of a body 32 of the baseplate fin 10 in a
substantially perpendicular manner that is additionally
substantially parallel with the sides 16, 18 of the baseplate 8.
The baseplate fins 10 may be bonded to the baseplate 8 in a
plurality of groups. In addition, the baseplate fins 10 may be
mounted to an opposite side 16 of the baseplate 8 from a side 18 of
the baseplate 8 in contact with the devices 4.
[0034] In some cases, when cooling requirements for the devices 4
are great, the heat generated by the devices 4 may be too
substantial to be effectively dissipated solely by the baseplate
fins 10. When this occurs, the excess heat may be dissipated from
the baseplate 8 through the complex heat pipe 12. The complex heat
pipe 12 may transfer the received excess heat from the baseplate 8
to the heat pipe fin stack 14 for subsequent dissipation to air
surrounding the heat pipe fin stack 14.
[0035] As is the case with the baseplate fins 10, the complex heat
pipe 12 may also be positioned on the opposite side 16 of the
baseplate 8 from the side 18 of the baseplate 8 in contact with the
devices 4. In addition, the complex heat pipe 12 may be mounted on
the complex heat pipe side of the baseplate 8 in a location that
corresponds with a location of the devices 4 positioned on the
opposite side 18 of the baseplate 8. When the complex heat pipe 12
is mounted on the baseplate 8 in such a location, the heat
extraction from the devices 4 may be more efficient.
[0036] The complex heat pipe 12 may be similar in design to a
clarinet heat pipe or a tube that has been fabricated to seal a
working fluid under vacuum pressure. Several complex heat pipes 12
may be mounted in the baseplate 8 to extend therefrom. Ends of the
complex heat pipes 12 may also be embedded in the baseplate 8.
[0037] As such, a complex heat pipe 12 may separate one group of
the baseplate fins 10 from another group of the baseplate fins 10.
The complex heat pipe 12 may extend from the baseplate 8 and
through the baseplate fins 10 and the heat pipe fin stack 14. The
baseplate fins 10 may be mounted to and arranged on the baseplate 8
in a plurality of separated groups. In such cases, the groups of
the baseplate fins 10 may be separated from each other by a complex
heat pipe 12 extending from the baseplate 8, between the groups of
the baseplate fins 10, and through the heat pipe fin stack 14. For
example, two groups of baseplate fins 10 may be separated by a
complex heat pipe 12 mounted to the baseplate 8 in an area between
the two groups of the baseplate fins 10. The complex heat pipe 12
may extend between and past the baseplate fins 10 and into the heat
pipe fin stack 14. The heat pipe fin stack 14 may be separated from
the baseplate 8 by the baseplate fins 10.
[0038] Further, a complex heat pipe apparatus 22 may include a
plurality of the complex heat pipes 12 secured within a closed
chamber 24 that is positioned within the baseplate 8. The complex
heat pipes 12 may be secured within respective recesses in the
closed chamber 24 by brazing the heat pipes 12 to respective walls
that define the recesses. The chamber 24 may be embedded in a
baseplate channel 26 formed within the baseplate 8 such that
chamber 24 can fit therein. For example, the chamber 24 may be
welded to walls that define the baseplate channel 26. The closed
chamber 24 may act as a fluid reservoir within the baseplate 8 to
expedite the transfer of heat from the baseplate 8 using a
two-phase flow cycle created within the complex heat pipes 12.
[0039] Moreover, the closed chamber 24 may be mounted at a location
in the baseplate 8 that enhances or maximizes heat extraction from
the devices 4. For example, the chamber 24 may be placed within a
baseplate channel 26 at a location on the side 18 at which the
devices 4 make surface contact with the baseplate 8. The baseplate
channel 26 location on the side 16 may be essentially opposite a
location on the side 18 at which the devices 4 are in surface
contact therewith.
[0040] Further, the chamber 24 and the channel 26 may be
correspondingly oriented to maximize exposure to devices 4 in
surface contact with the baseplate 8 in order to enhance or
maximize extraction of heat therefrom. For example, while both the
chamber 24 and the channel 26 are illustrated herein as being
straight, embodiments disclosed herein are not limited thereto, as
the channel 24 can be correspondingly curved to a curved channel 26
and of the baseplate 8 in order to maximize heat extraction from a
correspondingly positioned and/or shaped group of devices 4 making
surface contact with the baseplate 8.
[0041] The heat pipe fin stack 14 may include a heat pipe
protective fin 28 to provide protection for a complex heat pipe 12
extending therethrough. The heat pipe protective fin 28 may be
positioned on an opposite side of the heat pipe fin stack 14 from
the baseplate fins 10 and adjacent to one end 36 of the complex
heat pipe 12. The pipe end 36 may extend through the heat pipe
protective fin 28, such that the pipe end 36 is separated from a
remainder of the complex heat pipe 12 by the heat pipe protective
fin 28. Further, an end cap 34 may be positioned on the pipe end 36
of the complex heat pipe 12 to provide additional protection to the
complex heat pipe 12.
[0042] In the examples described herein, the complex heat pipe 12
is positioned to absorb excess heat from the baseplate 8 when
cooling requirements are high enough that the baseplate fins 10 are
unable to effectively cool the devices 4 contacting the baseplate
8. As a result, melting of a devices 4 due to insufficient cooling
may be inhibited.
[0043] A number of examples have been described above.
Nevertheless, it will be understood that various modifications may
be made. For example, suitable results may be achieved if the
described elements are combined in a different manner and/or
replaced or supplemented by other elements or their equivalents.
Accordingly, other implementations are within the scope of the
following claims.
* * * * *