U.S. patent application number 14/644461 was filed with the patent office on 2016-03-31 for memory device and method for operating the same.
This patent application is currently assigned to Kabushiki Kaisha Toshiba. The applicant listed for this patent is Kabushiki Kaisha Toshiba. Invention is credited to Wataru SAKAMOTO.
Application Number | 20160093392 14/644461 |
Document ID | / |
Family ID | 55585190 |
Filed Date | 2016-03-31 |
United States Patent
Application |
20160093392 |
Kind Code |
A1 |
SAKAMOTO; Wataru |
March 31, 2016 |
MEMORY DEVICE AND METHOD FOR OPERATING THE SAME
Abstract
According to an embodiment, an operation method for a memory
device which has a first memory element and a second memory element
respectively provided on both sides of a semiconductor member
includes applying a first voltage to a second word line, the first
voltage being negative for a voltage of a cell source line, and
applying a second voltage to a first word line, the second voltage
being positive for the voltage of the cell source line when reading
out a data from the first memory element.
Inventors: |
SAKAMOTO; Wataru;
(Yokkaichi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kabushiki Kaisha Toshiba |
Minato-ku |
|
JP |
|
|
Assignee: |
Kabushiki Kaisha Toshiba
Minato-ku
JP
|
Family ID: |
55585190 |
Appl. No.: |
14/644461 |
Filed: |
March 11, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62056793 |
Sep 29, 2014 |
|
|
|
Current U.S.
Class: |
365/185.18 |
Current CPC
Class: |
H01L 27/11573 20130101;
G11C 16/26 20130101; H01L 27/1157 20130101; H01L 29/4916 20130101;
G11C 16/10 20130101; H01L 29/495 20130101; H01L 27/11526 20130101;
H01L 29/51 20130101; H01L 29/1095 20130101; H01L 27/11582 20130101;
G11C 16/0483 20130101; H01L 27/11575 20130101; H01L 27/11524
20130101; G11C 16/14 20130101; H01L 27/11556 20130101; H01L
27/11548 20130101 |
International
Class: |
G11C 16/26 20060101
G11C016/26; G11C 16/14 20060101 G11C016/14 |
Claims
1. An operation method for a memory device including: a first
memory element provided on a side of a first plane of a
semiconductor member, the first memory element having a first
electrode and a first charge storage layer, the semiconductor
member extending in a first direction, the first plane being along
the first direction; a second memory element on a side of a second
plane of the semiconductor member, the second memory element having
a second electrode and a second charge storage layer, the second
plane being opposed on the first plane with the semiconductor
member; a cell source line connected to an end of the semiconductor
member; a first word line connected to the first electrode; and a
second word line connected to the second electrode, the operation
method comprising: when reading out data from the first memory
element, applying a first voltage to the second electrode, the
first voltage being negative for a voltage of the semiconductor
member; and applying a second voltage to the first electrode, the
second voltage being positive for the voltage of the semiconductor
member.
2. The operation method according to claim 1, wherein when writing
data to the first memory element, applying a third voltage to the
first word line, the third voltage being positive for the voltage
of the cell source line, applying a fourth voltage to the second
word line, the fourth voltage being positive for the voltage of the
cell source line, and being lower than the third voltage.
3. The operation method according to claim 1, wherein the
semiconductor member includes a semiconductor layer, having one of
a conductivity type of a p-type and at least one of defects of an
acceptor type and impurities of the acceptor type, a density of the
defects and a concentration of the impurities preventing the
semiconductor layer from changing a complete depletion state when
the first voltage is applied to the second word line and the second
voltage is applied to the first word line.
4. The operation method according to claim 1, wherein an absolute
value of the first voltage is lower than an absolute value of a
minimum value of an erase threshold.
5. The operation method according to claim 1, wherein when erasing
data from the first memory element, applying a fifth voltage to the
first word line, the fifth voltage being negative for a voltage of
the cell source line, applying a sixth voltage to the second word
line, the six voltage being negative for the voltage of the cell
source line, an absolute value of the sixth voltage being lower
than an absolute value of the fifth voltage.
6. The operation method according to claim 5, wherein the absolute
value of the sixth voltage is a half of the absolute value of the
fifth voltage.
7. The operation method according to claim 1, wherein the memory
device further includes: a first transistor provided on the side of
the first plane; and a second transistor provided on the side of
the second plane, the operation method further comprises: when
writing the data to the first memory element, turning on the first
transistor; and turning off the second transistor.
8. A memory device comprising: a first memory element provided on a
side of a first plane of a semiconductor member, the first memory
element having a first electrode and a first charge storage layer,
the first charge storage layer provided between the first plane and
the first electrode, the semiconductor member extending in a first
direction, the first plane being along the first direction; a
second memory element on a side of a second plane of the
semiconductor member, the second memory element having a second
electrode and a second charge storage layer, the second storage
layer being provided between the second plane and the second
electrode, the second plane being opposed on the first plane with
the semiconductor member; a cell-source line connected to an end of
the semiconductor member; a first word line connected to the first
electrode; a second word line connected to the second electrode;
and a control unit configured to apply a first voltage to the
second word line, the first voltage being negative for a voltage of
the cell source line, and apply a second voltage to the first word
line, the second voltage being positive for the voltage of the cell
source line, when reading out a data from the first memory
element.
9. The memory device according to claim 8, wherein when writing
data to the first memory element, the control unit is configured to
apply a third voltage to the first word line, the third voltage
being positive for the voltage of the cell source line, and apply a
fourth voltage to the second word line, the fourth voltage being
positive for the voltage of the cell source line and being lower
than the third voltage.
10. The memory device according to claim 8, wherein the
semiconductor member includes a semiconductor layer, having one of
a conductivity type of a p-type and at least one of defects of an
acceptor type and impurities of the acceptor type, a density of the
defects and a concentration of the impurities preventing the
semiconductor layer from changing a complete depletion state when
the first voltage is applied to the second word line and the second
voltage is applied to the first word-line.
11. The memory device according to claim 8, wherein an absolute
value of the first voltage is lower than an absolute value of a
minimum value of an erase threshold.
12. The memory device according to claim 8, wherein, the control
unit is configured to apply a fifth voltage to the first word line,
the fifth voltage being negative for a voltage of the cell source
line, and apply a sixth voltage to the second word line, the six
voltage being negative for the voltage of the cell source line, an
absolute value of the sixth voltage being lower than an absolute
value of the fifth voltage when erasing a data from the first
memory element.
13. The memory device according to claim 12, wherein the absolute
value of the sixth voltage is a half of the absolute value of the
fifth voltage.
14. The memory device according to claim 8, further comprising: a
first transistor provided on the side of the first plane; and a
second transistor provided on the side of the second plane, the
control unit being configured to turn on the first transistor and
turn off the second transistor.
15. The memory device according to claim 8, further comprising a
substrate having a plane that crosses the first direction.
16. The memory device according to claim 8, further comprising a
substrate having a plane parallel to the first direction.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of
priority from Provisional Application No. 62/056,793 filed on Sep.
29, 2014; the entire contents of which are incorporated herein by
reference.
FIELD
[0002] Embodiment described herein relates to a memory device and
method for operating same.
BACKGROUND
[0003] In a NAND flash memory, an integration degree has been
increased by refining of a plane structure to reduce a bit cost. In
recent years, a technique for attaining further improvement of the
integration degree by three-dimensionally stacking memory cells has
been proposed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a perspective view illustrating a memory device
according to the first embodiment;
[0005] FIG. 2 is a plan view illustrating the memory device
according to the first embodiment;
[0006] FIG. 3A is a sectional view illustrating the memory device
according to the first embodiment on a plane parallel to a XZ plane
concerning a memory cell region shown in FIG. 1;
[0007] FIG. 3B is a sectional view taken along A-A' in FIG. 3A;
[0008] FIG. 4 is a circuit diagram illustrating a part of a circuit
of the memory device according to the first embodiment;
[0009] FIG. 5 is a block diagram illustrating arrangement of memory
device strings and connection of terminals of the memory device
according to the first embodiment;
[0010] FIG. 6 is a block diagram illustrating the memory device
according to the first embodiment;
[0011] FIG. 7 is a conceptual diagram for describing an operation
method of the memory device according to the first embodiment;
[0012] FIG. 8 is a conceptual diagram for describing the operation
method of the memory device according to the first embodiment;
[0013] FIG. 9A is a graph indicating to what a voltage on a back
gate side affects a threshold characteristic and a I-V
characteristic on a front gate side in a MOSFET of an SOI
(Silicon-On-Insulator) structure;
[0014] FIG. 9B is a conceptual diagram for describing a shift of a
threshold voltage of the MOSFET of the SOI structure in a B region
of the graph of FIG. 9A;
[0015] FIG. 10 is a conceptual diagram for describing the operation
method of the memory device according to the first embodiment;
[0016] FIGS. 11A and 11B are conceptual diagrams for describing the
operation method of the memory device according to the first
embodiment;
[0017] FIG. 12A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0018] FIG. 12B is a sectional view taken along line A-A' in FIG.
12A;
[0019] FIG. 13A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0020] FIG. 13B is a sectional view taken along line A-A' in FIG.
13A;
[0021] FIG. 14A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0022] FIG. 14B is a sectional view taken along line A-A' in FIG.
14A;
[0023] FIG. 15A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0024] FIG. 15B is a sectional view taken along line A-A' in FIG.
15A;
[0025] FIG. 16A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0026] FIG. 16B is a sectional view taken along line A-A' in FIG.
16A;
[0027] FIG. 17A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0028] FIG. 17B is a sectional view taken along line A-A' in FIG.
17A;
[0029] FIG. 18A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0030] FIG. 18B is a sectional view taken along line A-A' in FIG.
18A;
[0031] FIG. 19A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0032] FIG. 19B is a sectional view taken along line A-A' in FIG.
19A;
[0033] FIG. 20A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0034] FIG. 20B is a sectional view taken along line A-A' in FIG.
20A;
[0035] FIG. 21A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0036] FIG. 21B is a sectional view taken along line A-A' in FIG.
21A;
[0037] FIG. 22A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0038] FIG. 22B is a sectional view taken along line A-A' in FIG.
22A;
[0039] FIG. 23A is a sectional view illustrating a manufacturing
method for the memory device according to the first embodiment;
[0040] FIG. 23B is a sectional view taken along line A-A' in FIG.
23A;
[0041] FIG. 24A is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment and
show a cross section corresponding to FIG. 23B;
[0042] FIG. 24B is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment and
show a cross section corresponding to FIG. 23B;
[0043] FIG. 24C is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment and
show a cross section corresponding to FIG. 23B;
[0044] FIG. 24D is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment and
show a cross section corresponding to FIG. 23B;
[0045] FIG. 25 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment;
[0046] FIG. 26 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment;
[0047] FIG. 27 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment;
[0048] FIG. 28 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment;
[0049] FIG. 29 is a sectional view illustrating the memory device
according to a second embodiment; and
[0050] FIG. 30 is a block diagram illustrating the memory device
according to the second embodiment.
DETAILED DESCRIPTION
[0051] According to an embodiment, an operation method for a memory
device which has a first memory element and a second memory element
respectively provided on both sides of a semiconductor member
includes applying a first voltage to a second word line, the first
voltage being negative for a voltage of a cell source line, and
applying a second voltage to a first word line, the second voltage
being positive for the voltage of the cell source line when reading
out a data from the first memory element.
[0052] Various embodiments will be described hereinafter with
reference to the accompanying drawings.
First Embodiment
[0053] A first embodiment is described.
[0054] FIG. 1 is a perspective view illustrating a memory device
according to the first embodiment.
[0055] FIG. 2 is a plan view illustrating the memory device
according to the first embodiment.
[0056] FIG. 3A is a sectional view illustrating the memory device
according to the first embodiment on a plane parallel to a XZ plane
concerning a memory cell region shown in FIG. 1.
[0057] FIG. 3B is a sectional view taken along A-A' in FIG. 3A.
[0058] FIG. 4 is a circuit diagram illustrating a part of a circuit
of the memory device according to the first embodiment.
[0059] FIG. 5 is a block diagram illustrating arrangement of memory
device strings and connection of terminals of the memory device
according to the first embodiment.
[0060] FIG. 6 is a block diagram illustrating the memory device
according to the first embodiment.
[0061] As shown in FIGS. 1 and 2, a silicon substrate 10 is
provided in a semiconductor memory device 1 according to the
embodiment. On the silicon substrate 10, a memory cell region Rm, a
word line leading region Rc, and a peripheral circuit region Rp
including a control circuit are set. In the following description,
for convenience of description, an XYZ orthogonal coordinate system
is sometimes used in the specification. In the XYZ orthogonal
coordinate system, two directions parallel to an upper surface 10a
of the silicon substrate 10 and orthogonal to each other are
referred to as "X-direction" and "Y-direction". A direction
perpendicular to the upper surface 10a is referred to as
"Z-direction".
[0062] The memory cell region Rm is a region where memory elements
are three-dimensionally arrayed. The word line leading region Rc is
provided in the vicinity of the memory cell region Rm in the
semiconductor memory device 1. The word line leading region Rc
includes a structure for leading interconnects from the memory
elements on the memory cell region Rm. The peripheral circuit
region Rp includes a control unit including a control circuit that
selects, with respect to the led interconnects, voltages
corresponding to operation modes of the semiconductor memory device
1 and applies the voltages to the memory elements. The memory cell
region Rm, the word line leading region Rc, and the peripheral
circuit region Rp are respectively surrounded by insulation regions
Ri including insulating layers and are electrically insulated from
one another.
[0063] As shown in FIGS. 1 and 3A, in the memory cell region Rm, an
insulating layer 11, a conductive layer 12, a interconnection layer
13, and a conductive layer 14 are stacked in this order on the
silicon substrate 10. For example, the insulating layer 11 is
formed of a silicon oxide. The conductive layers 12 and 14 are
formed of polysilicon. The interconnection layer 13 is formed of
tungsten (W). A cell source line 15 is formed of the conductive
layer 12, the interconnection layer 13, and the conductive layer
14. On the cell source line 15, insulating layers 16 and 17 made
of, for example, a silicon oxide are provided. A plurality of
silicon pillars 20 extending in the Z-direction are provided on the
cell source line 15. The silicon pillars 20 are made of, for
example, polysilicon. The lower ends of the silicon pillars 20 are
connected to the cell source line 15 piercing through the
insulating layers 16 and 17. When viewed from the Z-direction, the
silicon pillars 20 are arrayed in a matrix shape along the
X-direction and the Y-direction and connected to the single cell
source line 15 in common.
[0064] The silicon pillar 20 is formed in a square pillar shape
including a plane 20a extending along the Z-direction and a plane
20b present in a position opposed to the plane 20a in the
X-direction. In a lateral direction of one plane 20a of the silicon
pillar 20, a plurality of control gate electrode films (first
electrode layers) 21 are provided spaced apart from one another
along the Z-direction. In a lateral direction of the other plane
20b of the silicon pillar 20, a plurality of control gate electrode
films 21 are also provided spaced apart from one another in the
Z-direction. The control gate electrode films 21 provided in the
lateral directions of the planes 20a and 20b on both sides of the
silicon pillar 20 are disposed in positions opposed to each other
across the silicon pillar 20. In other words, the silicon pillar 20
extending in the Z-direction is disposed between the control gate
electrode films 21 disposed opposed to each other in the
X-direction. Two control gate electrode films 21 are disposed
between two silicon pillars 20 adjacent to each other in the
X-direction. The control gate electrode films 21 extend in the
Y-direction. Therefore, the control gate electrode films 21 are not
disposed between the silicon pillars 20 arrayed adjacent to each
other along the Y-direction. The control gate electrode films 21
are made of a gate electrode material such as polysilicon. The
control gate electrode films 21 may be made of a high conductivity
material such as tungsten (W), nickel silicide (NiSi), cobalt
silicide (CoSi), or molybdenum silicide (MoSi).
[0065] Between the control gate electrode films 21 disposed between
the silicon pillars 20 adjacent to each other in the X-direction,
an insulating layer 24 made of, for example, a silicon oxide is
provided. Between the control gate electrode films 21 adjacent to
each other in the Z-direction, below the bottom layer of the
control gate electrode films 21 and above the top layer of the
control gate electrode films 21, insulating layers 24 are provided.
The control gate electrode films 21 and the insulating layers 24
are stacked in the Z-direction. A hard mask 26 is provided on the
top layer of the insulating layers 24.
[0066] The silicon pillars 20 are led above the hard mask 26 and
integrated with interconnects 27 that extend in the X-direction.
Consequently, the silicon pillars 20 arrayed along the X-direction
are connected to the interconnect 27 in common. On the
interconnects 27, vias 28 are provided piercing through an
inter-layer insulating layer 23. On the vias 28, bit lines 29
extending in the X-direction are provided. The bit lines 29 are
connected to the interconnects 27 via the vias 28. In this way, the
silicon pillars 20 are connected between the bit lines 29 and the
cell source line 15. That is, the semiconductor memory device 1 is
a stacked memory device of an I-shaped pillar type.
[0067] As shown in FIG. 3B, between one plane 20a of the silicon
pillar 20 and the control gate electrode film 21, floating gate
electrode films 31 (charge storage layers) made of, for example,
polysilicon are provided. The floating gate electrode films 31 are
provided at respective crossing points of the silicon pillars 20
and the control gate electrode films 21. Therefore, the floating
gate electrode films 31 are arrayed in a matrix shape spaced apart
from one another in the Y-direction and the Z-direction. Note that,
when viewed from the Z-direction, the shape of the floating gate
electrode films 31 may be a fan shape, the control gate electrode
film 21 side of which is expanded. In this case, the length in the
Y-direction of ends of the floating gate electrode films 31 on the
side of the silicon pillar 20 is smaller than the length in the
Y-direction of ends of the floating gate electrode films 31 on the
side of the control gate electrode film 21. Like the floating gate
electrode films 31 on the side of one plane 20a, the floating gate
electrode films 31 are also provided between the other plane 20b of
the silicon pillar 20 and the control gate electrode film 21. The
floating gate electrode films 31 on the side of the other plane 20b
of the silicon pillar 20 are also provided at respective crossing
points of the silicon pillars 20 and the control gate electrode
films 21. Therefore, the floating gate electrode films 31 are
arrayed in a matrix shape spaced apart from one another along the
Y-direction and the Z-direction.
[0068] Between both the planes 20a and 20b of the silicon pillar 20
and the floating gate electrode films 31, tunnel insulating films
33 made of, for example, a silicon oxide are respectively provided.
The tunnel insulating films 33 are provided in the respective
planes 20a and 20b of the silicon pillar 20. The shape of the
tunnel insulating films 33 is a belt shape having a thickness in
the X-direction, having a width in the Y-direction, and extending
in the Z-direction.
[0069] Block insulating films 34 are respectively provided between
the floating gate electrode films 31 and the control gate electrode
films 21 on the respective sides of both the planes 20a and 20b of
the silicon pillar 20. The block insulating films 34 are, for
example, three-layer films in which silicon nitride layers 35,
silicon oxide layers 36, and silicon nitride layers 37 are stacked
in this order from the floating gate electrode film 31 side to the
control gate electrode film 21 side. The silicon nitride layers 35
are formed to surround planes of the floating gate electrode films
31 other than planes on which the tunnel insulating films 33 are
formed. The silicon oxide layers 36 and the silicon nitride layers
37 are formed to surround the control gate electrode films 21.
[0070] The tunnel insulating films 33 are films that are usually
insulative but, when a voltage in a range of a driving voltage of
the semiconductor memory device 1 is applied thereto, allow a
tunnel current to flow. The block insulating films 34 are films
that do not substantially allow an electric current to flow even if
the voltage in the range of the driving voltage of the
semiconductor memory device 1 is applied thereto. An electric film
thickness (EOT) of the tunnel insulating films 33 is larger than an
electric film thickness of the block insulating films 34. A
dielectric constant of the tunnel insulating films 33 is lower than
a dielectric constant of the block insulating films.
[0071] Note that, in the example described in the embodiment, the
block insulating films are the three-layer films. However, the
block insulating films are not limited to this. The layers forming
the block insulating films are not limited to the silicon oxide
layer (SiO.sub.2 layer) and the silicon nitride layer
(Si.sub.3N.sub.4 layer). The block insulating films may be, for
example, stacked films including a high dielectric layer such as an
Al.sub.2O.sub.3 layer, an MgO layer, an SrO layer, an SiN layer, a
BaO layer, a TiO layer, a Ta.sub.2O.sub.5 layer, a BaTiO.sub.3
layer, a BaZrO layer, a ZrO.sub.2 layer, a Y.sub.2O.sub.3 layer, a
ZrSiO layer, an HfO.sub.2 layer, an HfAlO layer, an HfSiO layer, an
La.sub.2O.sub.3 layer, or an LaAlO layer.
[0072] In the example described in the embodiment, the floating
gate electrode films 31 are formed of polysilicon. However, the
floating gate electrode films 31 are not limited to this and may be
formed of metal silicide or metal.
[0073] In the example described in the embodiment, the control gate
electrode films 21 are formed of tungsten W. However, the control
gate electrode films 21 are not limited to this and may be formed
of metal silicide by embedding a polysilicon film and thereafter
siliciding the polysilicon film.
[0074] Further, in the example described in the embodiment, the
memory cell transistor in which the floating gate electrode film is
the conductive film is formed. However, a memory cell of a
so-called MONOS (Metal-Oxide-Nitride-Oxide-Semiconductor) type in
which the floating gate electrode film is replaced with an
insulating film may be formed.
[0075] In this way, memory elements 30 including the control gate
electrode films 21, the block insulating films 34, the floating
gate electrode films 31, and the tunnel insulating films 33 are
respectively formed at the crossing points of the silicon pillars
20 and the control gate electrode films 21. The memory elements 30
are formed on both the planes 20a and 20b of the silicon pillar 20
line-symmetrically with respect to an axis B-B' that passes the
center in the Y-direction of the silicon pillar 20. The silicon
pillar 20 is used in common in the memory elements 30 arrayed in
the Z-direction. The memory elements 30 disposed spaced apart from
one another in the Z-direction form memory element strings 40.
Therefore, the memory element strings 40 are respectively formed on
the two planes 20a and 20b of the one common silicon pillar 20.
[0076] The word line leading region Rc includes a region used for
leading a interconnect for driving the control gate electrode films
21. In the word line leading region Rc, as shown in FIG. 1, the
insulating layer 11, the conductive layer 12, the interconnection
layer 13, and the conductive layer 14 are stacked in this order on
the silicon substrate 10 common to the memory cell region Rm. The
cell source line 15 is formed of the conductive layer 12, the
interconnection layer 13, and the conductive layer 14. The
insulating layers 16 and 17 cover the cell source line 15. In the
word line leading region Rc, the insulating layers 24 made of
silicon oxide films and the control gate electrode films 21 made of
polysilicon films are alternately stacked on the insulating layers
16 and 17.
[0077] In the memory cell region Rm, a plurality of the control
gate electrode films 21 formed spaced apart from one another in the
Z-direction extend in the Y-direction. In the word line leading
region Rc, as shown in FIG. 1, a stacked body 25 including the
control gate electrode films 21 and the insulating layers 24 is
processed in a step shape. In the word line leading region Rc, the
vias 38 are provided to pierce through to the layers of the control
gate electrode films 21 connected thereto. Word lines 39 extending
in the Y-direction are provided on the vias 38. The positions of
the word lines 39 in the Z-direction are equal to the positions of
the bit lines 29. The word lines 39 are connected to the control
gate electrode films 21 via the vias 38. Note that the end in the
Y-direction of the stacked body is not limited to the step shape
and may be fabricated in a wall surface shape like the other
planes.
[0078] The word lines 39 led in this way are connected to a control
unit described below in the word line leading region Rc. The bit
lines 29 and the cell source line 15 are also connected to the
control unit in the word line leading region.
[0079] In the silicon pillar 20, according to a voltage applied to
the control gate electrode films 21, presence or absence of charges
in the floating gate electrode films 31, and a voltage applied to
both ends of the silicon pillar 20, a channel is formed on the
surface of the silicon pillar 20 to provide a route for feeding
charges. In the semiconductor memory device 1, a voltage in the
range of the driving voltage of the semiconductor memory device 1
is applied to the control gate electrode films 21 to feed the
charges, which flow through the formed channel, as a tunnel current
via the tunnel insulating films 33. When the tunnel current flows,
the charges are injected into the floating gate electrode films 31.
The charges injected into the floating gate electrode films 31 are
led out to the silicon pillar 20, which provides the channel, via
the tunnel insulating films 33. In the semiconductor memory device
1, a threshold voltage of the memory elements 30 changes according
to presence or absence of charges in the floating gate electrode
films 31. When a predetermined voltage is applied to the control
gate electrode films 21 of the memory elements 30, a change in the
threshold is determined according to whether an electric current
flows. For example, a case in which the electric current flows is
associated with "1" and a case in which the electric current does
not flow is associated with "0". In this way, in the memory
elements 30, data is stored in a nonvolatile manner, erased, and
read out.
[0080] In the semiconductor memory device 1 of the embodiment, the
memory element strings 40 are arrayed in a lattice shape on an XY
plane on the silicon substrate 10, whereby the memory elements 30
are three-dimensionally arrayed. Therefore, in the semiconductor
memory device 1, compared with a case in which memory elements are
two-dimensionally arrayed, a bit integration degree per unit area
of the silicon substrate 10 can be improved. Typically, a memory
unit of 1 bit is allocated per one memory element 30. However, a
memory unit of ternary or larger values can be allocated by causing
the memory element 30 to store a plurality of values. The
integration degree can be substantially further improved. In the
semiconductor memory device 1 of the embodiment, one silicon pillar
20 is used in common in two memory element strings 40. Therefore,
it is possible to reduce the length in the X-direction and further
improve the bit integration degree.
[0081] As described above, in the semiconductor memory device 1 of
the embodiment, the memory elements 30 are formed in opposed
positions on the opposed two planes 20a and 20b. The silicon pillar
20 is used in common between the two memory elements 30. Therefore,
a voltage applied to the control gate electrode films 21 of the
memory elements 30 on the side of one plane affects an operation
condition of the memory elements 30 on the side of the other plane
present in the opposed positions. As described below, in order to
prevent the silicon pillar 20 from falling into a complete
depletion state depending on an applied state of the voltage of any
one of the planes 20a and 20b of the silicon pillar 20, the silicon
pillar 20 is desirably formed of doped polysilicon in which p-type
impurities are introduced or non-doped polysilicon including a
defect of an acceptor type.
[0082] A circuit configuration of the semiconductor memory device 1
according to the embodiment is described.
[0083] As shown in FIG. 4, the semiconductor memory device 1
according to the embodiment includes a memory cell 2 and a control
unit 3.
[0084] The memory cell 2 includes the memory element strings 40
arrayed in a matrix shape in the memory cell region Rm. The memory
elements 30 are three-dimensionally disposed.
[0085] The control unit 3 is formed in the peripheral circuit
region Rp that is adjacent to the word line leading region Rc. The
control unit 3 includes a mode selection line 5 that selects
operation modes. The operation modes include a write mode for
writing data in the memory elements 30, a readout mode for reading
out the data written in the memory elements 30, and an erase mode
for erasing the data written in the memory elements 30. The mode
selection line 5 includes three selection lines to which, for
example, a write enable signal WE, a readout enable signal RE, and
an erasing signal ER are respectively input. When the write enable
signal is input to the mode selection line 5, the semiconductor
memory device 1 changes to the write mode. When the readout enable
signal is input, the semiconductor memory device 1 changes to the
readout mode. When the erasing signal is input, the semiconductor
memory device 1 changes to the erase mode. The control unit 3 may
have ternary analog values corresponding to these operation modes
to make it possible to set the operation modes according to an
analog value allocated to one mode selection line 5.
[0086] The control unit 3 includes a bit line selection line 6, a
cell source line selection line 7, a selection transistor selection
line 8, and a word line selection line 9. The control unit 3
appropriately selects the bit line selection line 6, the cell
source line selection line 7, the selection transistor selection
line 8, and the word line selection line 9 and applies a voltage
corresponding to the operation mode to a desired memory element 30.
The bit line selection line 6 selects any one of the bit lines 29
and applies a predetermined voltage to the selected bit line 29.
The cell source line selection line 7 selects any one of the cell
source lines 15 and applies a predetermined voltage to the selected
cell source line. The selection transistor selection line 8 applies
a voltage to a gate electrode of a specific selection transistor
for selecting a specific column among the memory element strings 40
arrayed in the lattice shape. The word line selection line 9
selects any one of the memory elements 30 and applies a
predetermined voltage to the control gate electrode film 21 of the
selected memory element 30.
[0087] When the write mode is selected by the control unit 3, the
memory cell 2 enables an input of write data and writes the write
data in the memory element 30 selected by the control unit 3. When
the readout mode is selected by the control unit 3, the memory cell
2 reads out data from the selected memory element 30 and outputs
the data as readout data RO. The readout data RO is amplified by,
for example, a sense amplifier and output.
[0088] As shown in FIG. 5, when the matrix of the memory element
strings 40 arrayed on the memory cell region Rm is m rows.times.n
columns, the memory element strings 40 are represented as Str(ij).
Str(ij) represents the memory element string 40 in an i-th row and
a j-th column. A cell source line and a bit line in the i-th row
are respectively represented as SL(i) and BL(i).
[0089] In FIG. 6, an equivalent circuit of a part of a first row
extracted from the matrix of the memory element strings 40 is
shown. The memory elements 30 are connected in series and connected
between the cell source line 15 and the bit line 29. A selection
transistor 4s is connected between the memory element 30 of the
bottom layer and the cell source line 15. A selection transistor 4d
is connected between the memory element 30 of the top layer and the
bit line 29. The selection transistors 4s and 4d may have structure
same as the structure of the memory element 30. However, charge
injection via the tunnel insulating film 33 is not performed in the
selection transistors 4s and 4d. For simplification, the number of
the memory elements 30 connected in series is four in the following
description. However, five or more memory elements 30 may be
connected. In this way, the memory element string 40 includes a
plurality of the memory elements 30 and the selection transistors
4s and 4d.
[0090] The memory elements 30 belonging to one memory element
string 40 are referred to as first bit M1, second bit M2, third bit
M3, and fourth bit M4 from the bottom. A word line (a control gate
electrode film) of the memory element 30 of a p-th bit in a j-th
column is represented as WL(j)p. Selection lines to which gate
electrodes of the selection transistors 4s and 4d in the j-th
column are connected are referred to as SSG(j) and SDG(J). SSG(j)
is a selection line for the selection transistor on the cell source
line side. SDG(j) is a selection line for the selection transistor
on the bit line side.
[0091] A gate terminal of the memory element 30 is formed of the
control gate electrode film 21. Gate terminals of the memory
elements 30 adjacent to each other in the Y-direction are
connected. As described above, the control gate electrode film 21
is led to the end in the Y-direction of the memory cell region Rm
and connected to the control unit 3 via the word lines 39 in the
word line leading region Rc. The control gate electrode film 21 is
sometimes connected to the control gate electrode film 21 of the
memory element 30 in another column in the word line leading region
Rc. For example, as shown in FIG. 6, when word lines in a first
column and word lines in a third column of bits are connected to
one another and word lines in a second column and word lines in a
fourth column of the bits are connected to one another, the word
line in the third column is simultaneously selected when the word
line of any one of the bits in the first column is selected. When
the word line in the second column is selected, the word line in
the fourth column is simultaneously selected. Therefore, a desired
row can be selected by providing the selection transistors 4s and
4d. Selection lines SSG and SDG for the selection transistors 4s
and 4d are respectively connected by the control gate electrode
films 21 of the selection transistors 4s and 4d adjacent to each
other in the Y-direction, led to the end in the Y-direction of the
memory cell region Rm, and connected to the control unit via the
word line 39 in the word line leading region Rc. The selection
lines SSG and SDG to which gates of the selection transistors 4s
and 4d are connected are not connected to gate electrodes of the
selection transistors 4s and 4d adjacent to each other in the
X-direction unlike the gate electrodes of the memory elements
30.
[0092] The cell source line 15 and the bit line 29 are provided for
each row. By selecting the cell source line 15 and/or the bit line
29 of a relevant row, the row can be selected. By selecting the
selection lines SSG and SDG of the selection transistors 4s and 4d
of a relevant column, a desired column is selected. When the word
line 39 is selected, the memory element 30 in a desired bit
position is selected.
[0093] For example, a memory element M2 of a second bit of the
memory element string 40 in a first row and a first column is
selected as described below.
[0094] The cell source line 15 and/or the bit line 29 in the first
row, that is, SL(1) and/or BL(1) is selected.
[0095] The selection transistor 4s and/or 4d in the first column,
that is, SSG(1) and/or SDG(1) is selected.
[0096] Consequently, a memory element string Str(11) in the first
row and the first column is selected.
[0097] Subsequently, the word line 39 of the second bit M2 in the
first column, that is, WL(1)1 is selected and a desired memory
element is selected.
[0098] Concerning the selection of the cell source line 15 and the
bit line 29, both or any one of the cell source line 15 and the bit
line 29 is selected according to the operation mode of the
semiconductor memory device 1, that is, any one of the write mode,
the readout mode, and the erase mode. Concerning the selection of
SSG(j) and SDG(j), similarly, both or one of SSG(j) and SDG(j) is
selected according to the operation mode. As described below,
concerning a voltage applied to the control gate electrode film 21
of the selected memory element 30, a voltage applied to the control
gate electrode films 21 of the unselected memory elements, and the
like, an appropriate voltage is selected according to the operation
mode. Note that the order of the selection of the selection lines
is not limited to the above.
[0099] Subsequently, an operation method of the semiconductor
memory device 1 according to the embodiment is described.
[0100] FIG. 7 is a conceptual diagram for describing an operation
method of a memory device according to the first embodiment.
[0101] FIG. 8 is a conceptual diagram for describing the operation
method of the memory device according to the first embodiment.
[0102] FIG. 9A is a graph indicating to what a voltage on a back
gate side affects an I-V characteristic which shows the threshold
voltage on a front gate side in a MOSFET of an SOI
(Silicon-On-Insulator) structure.
[0103] FIG. 9B is a conceptual diagram for describing a shift of a
threshold voltage of the MOSFET of the SOI structure in a B region
of the graph of FIG. 9A.
[0104] FIG. 10 is a conceptual diagram for describing the operation
method of the memory device according to the first embodiment.
[0105] FIGS. 11A and 11B are a conceptual diagram for describing
the operation method of the memory device according to the first
embodiment.
[0106] In the following description, as in the case of FIG. 6, the
word lines in the first column and the third column are connected
to each other and the word lines in the second column and the
fourth column are connected to each other. The memory element
strings in the first column and the second column are disposed on
the opposed surfaces of the silicon pillar 20 to use the silicon
pillar 20 in common. The memory element strings in the third column
and the fourth column are disposed respectively the same as the
memory element strings in the first column and the second
column.
[0107] First, writing of data in a specific memory element 30 is
described. The data is written in the memory element M2 of the
second bit in the first row and the first column. Note that, in
FIGS. 7, 8, 10, 11A, and 11B, flowing of an electric current
(charges) is indicated by an arrow. Portions where an electric
current does not flow are indicated by X. The charges are
electrons. A flowing direction of the electrons is a positive
direction of the arrow unless specifically noted otherwise.
[0108] First, the memory element M2 in which data is written is
selected.
[0109] As shown in FIG. 7, in order to select the first row, the
bit line BL(1) in the first row is selected. To select the bit line
BL(1), 0 V is supplied to the bit line BL(1) by the control unit 3.
When the bit line BL(1) in the first row is selected, bit lines
BL(k) in the other rows are not selected. In BL(k), k is a natural
number other than 1. To not select the bit lines BL(k) in the other
rows, as shown in FIG. 8, a power supply voltage Vdd is supplied to
the bit lines BL(k) by the control unit 3. The power supply voltage
Vdd is, for example, 2.5 V.
[0110] Subsequently, to select the first column, a voltage is
supplied to the selection line SDG(1) of the selection transistor
4d in the first column. The voltage applied to the selection line
SDG(1) is, for example, 2.5 V. Since the selection transistors 4d
in the other columns are not selected, for example, 0 V is supplied
to the selection lines SDG(j.noteq.1). Note that, in the write
mode, since charge injection is not performed from the cell source
line 15, the selection transistor 4s on the source side is not
selected.
[0111] In this way, the memory element string Str(11) in the first
row and the first column is selected. In FIG. 7, the selected
memory element string Str(11) is surrounded by a solid line.
Unselected memory element strings Str(12) to Str(14) are surrounded
by broken lines.
[0112] In order to select the memory element M2 of the second bit
in the first column, a write voltage is supplied to the word line
WL(1)2 of the second bit in the first column. A write voltage Vpgm
applied to the word line in the write mode is, for example, 20
V.
[0113] In the selected memory element string Str(11), to the word
lines WL(1)1, WL(1)3, and WL(1)4 of unselected memory elements,
that is, the memory elements M1, M3, and M4 of the first bit, the
third bit, and the fourth bit, a channel forming voltage Vpass for
forming a channel on the surface of the silicon pillar is supplied.
The channel forming voltage Vpass is a voltage necessary to form a
channel. The channel forming voltage Vpass is a voltage in a degree
for not causing a tunnel current in the tunnel insulating film 33
and is, for example, 10 V.
[0114] Vpass is applied to the word lines WL(2)1 to WL(2)4 of the
memory elements M1 to M4 of the first to fourth bits included in
the memory element string Str(12) that uses the silicon pillar 20
in common with the selected memory element string Str(11). Since
the selection line SDG(2) of the selection transistor has 0 V, the
plane 20b side of the memory element string Str(12) is in a
floating state. Charges do not flow and writing is not performed on
the plane 20b side of the memory element string Str(12).
[0115] The word line in the first column and the word line in the
third column are connected to each other for each bit corresponding
thereto. Therefore, the same voltage is applied to the word line of
the bits of the memory element string Str(11) in the first column
and the memory element string Str(13) in the third column
irrespective of a selection state of the respective bits. That is,
when 20 V is applied to the word line WL(1)2 of the memory element
M2 of the second bit in the first column set as a selection target,
at the same time, 20 V is also applied to the word line WL(3)2 of
the memory element M2 of the second bit in the third column.
However, since the selection transistor 4d in the third column is
not selected, channel sections of the first to fourth bits change
to a floating state (a boost state). Writing of data is not
performed. A voltage same as the voltage applied to the word lines
of the bits of the memory element string Str(12) in the second
column is applied to the memory element string Str(14) in the
fourth column. Since the memory element string Str(14) in the
fourth column uses the silicon pillar in common with the memory
element string Str(13) in the third column, the channel of the
memory element string Str(14) in the fourth column changes to the
boost state like the channel of the memory device element Str(13)
in the third column. Therefore, writing is not performed.
[0116] As shown in FIG. 8, the power supply voltage Vdd is applied
to the bit line BL(k) in the unselected k-th row. Vdd is, for
example, 2.5 V. A voltage of the same potential as selection line
SDG(1) of the selection transistor in the first column is applied
to the selection line SDG(1) of the selection transistor in the
first column. The selection transistor having SDG(1) is in a
cut-off state. In this case, the channel section changes to the
boost state. The channel section has potential of about 5 V to 11
V. Therefore, a potential difference between the channel section
and the word line WL(1)2 is not so high as to generate a tunnel
current. Therefore, writing of data is not performed.
[0117] In the case of FIG. 8, in the word line leading region Rc,
the word lines in the first column and the third column are
connected to each other and the word lines in the second column and
the fourth column are connected to each other. Therefore, the
connected word lines have the same potential in the respective
columns. However, since the channel changes to the boost state,
writing is performed in none of the memory element strings Str(k1)
to Str(k4).
[0118] As described above, in the memory element 30 that use the
silicon pillar 20 in common and are disposed in the positions
opposed to each other, the channel forming voltage Vpass lower than
the write voltage Vpgm is applied to the channel section of the
memory element to which writing is not performed. Consequently, the
memory elements do not interfere with each other and normal writing
can be performed.
[0119] Note that the above description of the writing operation
indicates one step of incremental stepup programming performed in
typical NAND flash memories. After a write enable signal is input,
a procedure described below is repeated to perform the writing
operation. That is, an operation executed in the order is set as
one cycle, which is writing at low Vpgm (e.g., 12 V), verifying
readout concerning whether the writing reaches a predetermined
writing level (verify readout), writing at increased Vpgm (e.g.,
12.5 V), and verifying the readout. The cycle operation is repeated
until a writing end. A basic operation of the verify readout is
performed in the same manner as a readout operation described
below.
[0120] The readout mode of data is subsequently described.
[0121] It is known that a threshold voltage of an SOI-type MOS
transistor formed on an SOI substrate changes according to a bias
state of a back gate side. In FIG. 9A, a graph is shown in which a
relation between a gate voltage VG and a drain current ID on a MOS
transistor side is plotted with a voltage on a back gate side set
as a parameter. When a voltage on the back gate side is high, the
MOS transistor falls into a complete depletion state in which an
entire SOI region is depleted. The MOS transistor cannot be turned
off unless a negative voltage is applied to a front gate electrode
of the MOS transistor (an "A" region and an "a" region). As shown
in FIG. 9B, in a "B" region of FIG. 9A, a depletion layer width Dbg
changes according to a bias voltage on the back gate side.
Therefore, curves of energy levels Ec and Ev of a conduction band
and a valence band are larger as the voltage on the back gate side
is higher. Therefore, an energy level on the MOS transistor side is
also curved. A depletion layer width Dfg changes. The threshold
voltage on the front gate side of the MOS transistor changes. When
a negative voltage having a sufficiently large absolute value is
applied to the back gate side, a back gate oxide film interface
side changes to an accumulation state. Therefore, the threshold of
the MOS transistor on the front gate side takes a substantially
fixed value irrespective of the applied voltage on the back gate
side (a "C" region).
[0122] In the case of the semiconductor memory device 1 of the
embodiment, according to an applied voltage to the control gate
electrode films 21 of the memory elements 30 formed on the side of
one plane 20a of the silicon pillar 20, a threshold of the memory
elements 30 formed on the side of the other plane 20b shifts and
vice versa. When a voltage is applied to the control gate electrode
films 21 of the memory elements 30 on the side of the other surface
20b, the threshold of the memory elements 30 on the side of one
plane 20a shifts. For example, a threshold voltage of the memory
elements of the second bit in the first row and the first column
from which data is about to be read out depends on a voltage
applied to the word line of the memory element belonging to the
memory element string Str(12) in the first row and the second
column that uses the silicon pillar in common with the memory
elements.
[0123] In the semiconductor memory device 1 of the embodiment, a
negative voltage Vr_neg having a sufficiently large absolute value
is applied to the word lines of the memory elements of the memory
element strings disposed in opposed positions via the silicon
pillar 20 common to the memory element string including the
selected memory element. The surface of the silicon pillar is
changed to the accumulation state. The negative voltage Vr_neg
applied to the word lines of the memory element strings only has to
be a voltage enough for changing the surface of the silicon pillar
to the accumulation state. Therefore, a voltage not less than an
erase threshold voltage during data erasing is applied. That is,
when a lower limit of the erase threshold voltage is represented as
Vthe_min, the negative voltage Vr_neg needs to satisfy the
following:
Vr_neg<Vthe_min
[0124] A specific example is described. In FIG. 10, the memory
element M2 of the second bit in the first row and the first column
is selected.
[0125] First, in order to select the first row, the bit line BL(1)
in the first row and the cell source line SL(1) in the first row
are selected.
[0126] For example, 0.25 V is applied to the bit line BL(1) and the
cell source line SL(1) to be selected. Note that, although not
shown in the figure, Vdd, for example, 2.5 V is applied to
unselected bit lines.
[0127] Subsequently, in order to select the first column, the
selection transistors 4s and 4d in the first column are turned on.
For example, 4.3 V is applied to the selection lines SDG(1) and
SSG(1). In this way, the memory element string Str(11) in the first
row and the first column is selected.
[0128] All the unselected memory elements in the memory element
string Str(11) are turned on. For example, a voltage of
approximately 5 V to 8 V is applied to, for example, the word lines
of the unselected memory elements to form a channel on the surface
of the silicon pillar 20.
[0129] Since data is read out from the memory element string
Str(11) in the first row and the first column, the memory element
string Str(11) and the silicon pillar 20 are used in common. In
order to change the plane 20b of the silicon pillar 20 on the
memory element string Str(12) side to the accumulation state, the
negative voltage Vr_neg is applied to the word lines WL(2)1 to
WL(2)4 of the memory element of the memory element string Str(12)
in a position opposed to the memory element string Str(11). When a
lower limit of the erase threshold voltage is represented as
Vthe_min, the negative voltage Vr_neg satisfies a relation
Vr_neg<Vthe_min and is, for example, -10 to -5 V.
[0130] In order to read out data from the memory element of the
second bit in the first row and the first column, for example, a
voltage of 5 V is applied to the word line WL(1)2 of the memory
element M2. An electric current flowing to the cell source line
SL(1) is detected by a sense amplifier (not shown in the figure)
connected to the cell source line SL(1). When written data is
binary values, a positive gate voltage is applied. Presence or
absence of the data is detected according to whether a current
value is larger or smaller than a threshold. When data is ternary
or larger values, positive gate voltages of two levels are
sequentially applied. The first state without current flowing
irrespective of the gate voltage level applied, the second state
which the current flows at the high level gate voltage applied and
the current does not flow at the lower level gate voltage applied,
and the third state with current flowing irrespective of the gate
voltage level applied are respectively associated with stored data.
For example, as shown in FIGS. 9A and 9B, in case of three level
data in one memory unit, the threshold changes according to a
charge injection amount into the floating gate electrode films 31.
Therefore, threshold voltages are represented as AR, BR, and CR in
order from the lowest threshold voltage. The stored data may be
data in which binary numbers 01, 00, and 10 are respectively
associated with the threshold voltages AR, BR, and CR.
[0131] The word lines in the first column and the third column are
electrically connected in the word line leading region Rc.
Therefore, a voltage of the word line in the third column, which is
an unselected column, is the same as the voltage of the first word
line. When the word lines in the second column and the fourth
column are electrically connected in the word line leading region
Rc, the same voltage is applied to the word lines. However, since 0
V is applied to the selection lines SDG and SSG of the selection
transistor in the unselected column, charges are not transferred
from the bit lines and readout is not performed.
[0132] As described above, in the case of the memory elements that
use the silicon pillar in common, the channel section of the memory
element on the side where readout is not performed is applied the
negative voltage enough for a change to the accumulation state to
the gate terminal of the memory element. Consequently, it is
possible to suppress shift in the threshold of the memory element
on the side where readout is performed and perform normal
readout.
[0133] The erase mode for data is subsequently described.
[0134] In the erase mode for data, an erasing operation is
performed for each selected block. In FIG. 11A, one of the two
memory element strings Str(11) and Str(12) having the silicon
pillar 20 in common belongs to a selected block and the other
belongs to a unselected block. In FIG. 11B, both of two memory
element strings Str(i,j) and Str(i,j+1) using the silicon pillar 20
in common belong to the unselected block.
[0135] As shown in FIG. 11A, in the selected block, a voltage for
erasing is applied to a bit line and a cell source line belonging
to the selected block. An erasing voltage is, for example, 20
V.
[0136] A selection transistor belonging to the selected block is
turned on to form a channel. For example, 10 V to 15 V is applied
to the selection lines SSG and SDG of the selection transistor.
[0137] All word lines of the memory elements belonging to the
selected block are set to 0 V.
[0138] By setting the word lines in this way, electrons injected
into the floating gate electrode films 31 of the memory elements in
the selected block are led out to the side of the silicon pillar
where the channel is formed and flow to the bit line and the cell
source line. Since charges in the floating gate electrode film are
removed, data is erased.
[0139] In the memory element string included the unselected block,
a voltage for a potential difference in a degree for not generating
a tunnel current in the tunnel insulating films 33 of the memory
elements is applied to the control gate electrode film 21. For
example, a half voltage of the erasing voltage Vera is applied.
[0140] In this way, even when the memory element string having the
silicon pillar 20 in common with the memory element string in the
selected block is included in the unselected block, it is possible
to prevent data from erasing in the memory element string by
turning off the selection transistor. That is, the two memory
element strings having the silicon pillar 20 in common may be
respectively included in different erasing blocks. It is possible
to improve a degree of flexibility of arrangement of memory cells
and interconnections.
[0141] As shown in FIG. 11B, in the unselected block, a voltage for
data erasing is applied to the bit line and the cell source
line.
[0142] The selection transistor belonging to the selected block is
turned on to form a channel.
[0143] The word lines of the memory elements belonging to the
unselected block are set to a voltage lower than the erasing
voltage, which a degree does not generate a tunnel current between
a voltage of the bit line and the voltage of the word lines and
between a voltage of cell source line and the voltage of the word
line. The voltage of the word lines of the memory elements of the
unselected block is, for example, 10 V, which is a half of the
erasing voltage Vera.
[0144] In this way, in the erase mode for data, irrespective of
whether the memory element string uses the silicon pillar 20 in
common, all of the bit lines and the cell source lines of the
selected block and the unselected block are set to the erasing
voltage. The word lines of the selected block are set to 0 V and
the word lines of the unselected block are set to a voltage lower
than the erasing voltage. Consequently, it is possible to erase
data of all the memory elements of the selected block.
[0145] As described above, in the semiconductor memory device 1 of
the embodiment, by appropriately setting the voltages of the word
lines of the memory elements, it is possible to use the silicon
pillar in common between the memory element strings. Therefore,
since it is unnecessary to provide an insulation region for
separating the memory element strings for each silicon pillar, it
is possible to reduce an occupied area of the insulation region for
separation and improve a bit integration degree.
[0146] A manufacturing method for the semiconductor memory device 1
according to the embodiment is subsequently described.
[0147] FIGS. 12A to 23A are sectional views illustrating a
manufacturing method for the memory device according to the
embodiment.
[0148] FIGS. 12B to 23B are respectively sectional views taken
along line A-A' in FIGS. 12A to 23A.
[0149] FIGS. 24A to 24D are sectional views illustrating the
manufacturing method for the memory device according to the first
embodiment and show a cross section corresponding to FIG. 23B.
[0150] FIG. 25 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment.
[0151] FIG. 26 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment.
[0152] FIG. 27 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment.
[0153] FIG. 28 is a sectional view illustrating the manufacturing
method for the memory device according to the first embodiment.
[0154] As shown in FIGS. 12A and 12B, the cell source line 15
including the conductive layer 12, the interconnection layer 13,
and the conductive layer 14 is formed on the insulating layer 11
formed on the upper surface 10a of the silicon substrate 10. The
insulating layers 16 and 17 are formed and then a plurality of
silicon oxide films 51 and polysilicon films 52a are stacked. A
hard mask 26b is formed on a silicon oxide film 51a of the top
layer. The hard mask 26b is formed of, for example, a silicon
nitride film.
[0155] As shown in FIGS. 13A and 13B, the hard mask 26b is
patterned. A trench 53 is formed in the stacked body with the
patterned hard mask 26b as a mask using an anisotropic etching
technology such as reactive ion etching (RIE). The trench 53 is
opened to reach the conductive layer 14 piercing through the
insulating layers 16 and 17. The trench 53 is opened in a
rectangular shape, the long side of which extends in the
Y-direction.
[0156] As shown in FIGS. 14A and 14B, wet etching is applied to
recess the polysilicon films 52a exposed to the side surface of the
trench 53. Recessed sections 54 are formed in regions corresponding
to the polysilicon films 52a on the side surface of the trench 53.
The recessed sections 54 are formed to surround the trench 53 in
the respective polysilicon films 52a.
[0157] As shown in FIGS. 15A and 15B, oxidation treatment is
applied to the whole surface including the recessed surface using
an SPA (Slot Plane Antenna) technique or the like. End faces of the
polysilicon films 52a exposed by the recess are covered with a thin
silicon oxide layer 50. Note that a part of the silicon oxide layer
50 finally becomes the silicon oxide layer 36 that forms the block
insulating film 34.
[0158] As shown in FIGS. 16A and 16B, a silicon nitride layer 35a
is formed over the entire surface. A polysilicon film 55a is formed
on the silicon nitride layer 35a by the CVD or the like. Note that
a part of the silicon nitride layer 35a finally becomes the silicon
nitride layer 35 that forms the block insulating film 34.
[0159] As shown in FIGS. 17A and 17B, the anisotropic etching such
as the RIE is applied along the trench 53 to selectively remove the
polysilicon film 55a and leave a polysilicon films 55 in the
recessed sections 54. Therefore, the polysilicon films 55 remaining
in the recessed sections 54 adjacent to each other are divided from
each other in the Z-direction. Note that the polysilicon films 55
remaining in the recessed sections 54 finally becomes the floating
gate electrode films 31.
[0160] As shown in FIGS. 18A and 18B, the anisotropic etching such
as the RIE is performed. Consequently, the silicon nitride layer
35a formed on the side surface and the bottom surface of the trench
53 is selectively removed. The silicon nitride layers 35 remaining
in the recessed sections 54 adjacent to each other in the
Z-direction become a layer that forms the block insulating film
34.
[0161] As shown in FIGS. 19A and 19B, a silicon oxide film 33a is
formed to cover the entire surface including the side surface and
the bottom surface of the trench 53. Further, a polysilicon film
56a is deposited on the silicon oxide film 33a. Note that the
silicon oxide film 33a finally becomes the tunnel insulating film
33. Since the polysilicon film 56a deposited provides the surface
side of the silicon pillar 20, an applied bias voltage of one side
shifts the threshold of the memory element 30 on the other side.
Therefore, the polysilicon film 56a is desirably formed of doped
polysilicon in which p-type impurities are introduced to suppress
the threshold voltage shift.
[0162] As shown in FIGS. 20A and 20B, the silicon oxide film 33a
and the polysilicon film 56a deposited on the bottom of the trench
53 are removed until the conductive layer 14 is exposed by the
anisotropic etching such as the RIE.
[0163] As shown in FIGS. 21A and 21B, a polysilicon film 56b is
deposited over the entire surface. A lower part of the polysilicon
film 56b is connected to the conductive layer 14. Note that the
polysilicon films 56a and 56b are formed of undoped polysilicon or
p-type doped polysilicon and finally becomes the silicon pillar
20.
[0164] In order to maintain the accumulation state of the surface
of the silicon pillar 20 during readout of data, the polysilicon
film 56a on the outer side may be formed of the p-type doped
polysilicon and the inner side polysilicon film 56b may be formed
as an undoped polysilicon film including acceptor defects.
Alternatively, both of the polysilicon films 56a and 56b may be
formed as p-type doped polysilicon films.
[0165] As shown in FIGS. 22A and 22B, the polysilicon film 56b on
the upper surface is removed by the RIE or the like.
[0166] As shown in FIGS. 23A and 23B, a polysilicon layer 69 is
deposited over the entire surface by the CVD or the like. Note that
the polysilicon layer 69 finally becomes the interconnect 27.
[0167] As shown in FIG. 24A, in order to form the memory element
strings 40 arrayed in the Y-direction, the polysilicon film 56b is
divided along the Y-direction.
[0168] As shown in FIG. 24B, the silicon oxide film 33a is divided
by the wet etching or the like.
[0169] As shown in FIG. 24C, the polysilicon film is divided by the
wet etching or the like to form the floating gate electrode films
31. In this case, the centers of exposed surfaces of the
polysilicon films 56a and 56b are more preferentially etched than
the ends of the exposed surfaces. Therefore, the floating gate
electrode films 31 are formed in a fan shape. The length of the
floating gate electrode films 31 opposed to the control gate
electrode film 21 side can be set longer than the length of the
floating gate electrode films 31 opposed to the silicon pillar 20
side.
[0170] As shown in FIG. 24D, insulating layers 57 are formed in air
gaps 53 formed by the dividing processing.
[0171] As shown in FIG. 25, between the trenches 53 filled with the
polysilicon films 56a and 56b, that is, between the silicon pillars
20 adjacent to each other, a trench 58 reaching the insulating
layer 17 is formed by patterning the hard mask 26a. Like the trench
53, the trench 58 is formed in a rectangular shape, the long side
of which extends in the Y-direction.
[0172] As shown in FIG. 26, by applying the wet etching using a hot
TMY solution, the polysilicon films 52a are recessed via the trench
58.
[0173] As shown in FIG. 27, a silicon nitride layer 37a is formed
over the entire surface. The silicon nitride layer 37a finally
becomes the silicon nitride layer 37 that forms the block
insulating film 34. Thereafter, as shown in FIG. 28, W or the like
is deposited over the entire surface and unnecessary W is removed
to form the control gate electrode films 21. After the trench 58,
from which W is removed, is filled with the insulating layer 57, an
inter-layer insulating layer is formed. The vias 28 are opened in
the interlayer insulating layer 23. An electrode material is filled
in the vias 28. Thereafter, the bit line 29 is formed to complete
the structure shown in FIG. 3A.
[0174] The manufacturing process described above is not limited to
the order described above. For example, the process for forming the
trench 58 and separating the control gate electrode film 21 for the
respective memory element strings 40 may be carried out before the
process for dividing the silicon pillar 20. Alternatively, the
process for dividing the silicon pillar 20 may be executed after
the control gate electrode film forming process.
[0175] According to the embodiment described above, it is possible
to make the semiconductor memory device including the silicon
pillar 20 provided between the memory element strings 40 disposed
to be opposed to each other.
Second Embodiment
[0176] FIG. 29 is a sectional view illustrating a memory device
according to a second embodiment.
[0177] FIG. 30 is a block diagram illustrating the memory device
according to the second embodiment.
[0178] In the above description, the semiconductor memory device
including the memory element strings 40 formed on the sides of the
silicon pillar 20 extending in the up down direction with respect
to the silicon substrate is described. However, the semiconductor
memory device may include a semiconductor layer in which a channel
is formed along a direction parallel to the silicon substrate.
[0179] As shown in FIG. 29, a semiconductor memory device is in the
second embodiment includes the silicon substrate 10 having the
upper surface 10a and semiconductor layers 70 extending in the
X-direction substantially in parallel to the upper surface 10a of
the silicon substrate 10 and having lower surfaces 70a and upper
surfaces 70b. The semiconductor layers 70 are disposed spaced in
the Y-direction (not shown in the figure) and provided separated
from the upper surface 10a of the silicon substrate 10 in the
Z-direction. The semiconductor memory device 1a includes a
plurality of control gate electrode layers 81a disposed separated
from one another in the X-direction between the silicon substrate
10 and the lower surfaces 70a of the semiconductor layers 70. The
semiconductor memory device 1a includes floating gate electrode
layers 91a provided between the lower surfaces 70a of the
semiconductor layers 70 and the control gate electrode layers 81a.
The semiconductor memory device is includes tunnel insulating
layers 93a provided between the lower surfaces 70a of the
semiconductor layers 70 and the floating gate electrode layers 91a.
The semiconductor memory device 1a includes block insulating layers
94a provided between the floating gate electrode layers 91a and the
control gate electrode layers 81a.
[0180] The control gate electrode layers 81a are divided from one
another in the X-direction by insulating layers 74a. The control
gate electrode layers 81a divided in the X-direction extend in the
Y-direction and cross the semiconductor layers 70 disposed
substantially in parallel to the Y-direction. Therefore, crossing
points of the semiconductor layers 70 and the control gate
electrode layers 81a are arrayed in a matrix shape on the XY
plane.
[0181] The floating gate electrode layers 91a are disposed to
divide from one another in the X-direction and the Y-direction at
the respective crossing points of the semiconductor layers 70 and
the control gate electrode layers 81a.
[0182] The tunnel insulating layers 93a are formed over the entire
lower surfaces 70a of the semiconductor layers 70.
[0183] The block insulating layers 94a are two-layer films
including first insulating layers 95a made of, for example, a
silicon oxide and second insulating layers 96a made of, for
example, a silicon nitride.
[0184] In the block insulating layers 94a, the first insulating
layers 95a and the second insulating layers 96a are stacked in this
order from the floating gate electrode layers 91a to the control
gate electrode layers 81a. The block insulating layers 94a are
formed to divide from one another in the X-direction and the
Y-direction at the respective crossing points of the semiconductor
layers 70 and the control gate electrode layers 81a.
[0185] In this way, memory elements 100a are formed by stacking,
from the upper surface 10a of the silicon substrate 10, the control
gate electrode layers 81a, the second insulating layers 96a, the
first insulating layers 95a, the floating gate electrode layers
91a, the tunnel insulating layers 93a, and the semiconductor layers
70 in this order. The memory elements 100a are formed in a matrix
shape in the X-direction and the Y-direction at the respective
crossing points of the semiconductor layers 70 and the control gate
electrode layers 81a.
[0186] Memory element strings 110a include a plurality of memory
elements having the semiconductor layers 70 in common and arrayed
in the X-direction. At both ends in the X-direction of the memory
element strings 110a, insulating layers are formed.
[0187] Insulating layers are formed between the memory element
strings 110a and the silicon substrate 10.
[0188] The semiconductor memory device 1a includes control gate
electrode layers 81b provided spaced from the upper surfaces 70b of
the semiconductor layers 70 upward in the Z-direction and spaced
from one another in the X-direction. The semiconductor memory
device is includes floating gate electrode layers 91b between the
upper surfaces 70b of the semiconductor layers 70 and the control
gate electrode layers 81b. The semiconductor memory device 1a
includes tunnel insulating layers 93b provided between the upper
surfaces 70b of the semiconductor layers 70 and the floating gate
electrode layers 91b. The semiconductor memory device 1a includes
block insulating layers 94b provided between the floating gate
electrode layers 91b and the control gate electrode layers 81b.
[0189] The control gate electrode layers 81b are divided from one
another in the X-direction by insulating layers 74b. The control
gate electrode layers 81b divided in the X-direction extend in the
Y-direction and cross the semiconductor layers 70 disposed in the
Y-direction. Therefore, crossing points of the semiconductor layers
70 and the control gate electrode layers 81b are arrayed in a
matrix shape on the XY plane.
[0190] The floating gate electrode layers 91b are disposed to be
divided from one another in the X-direction and the Y-direction at
the respective crossing points of the semiconductor layers 70 and
the control gate electrode layers 81b.
[0191] The tunnel insulating layers 93b are formed over the entire
upper surfaces 70b of the semiconductor layers 70.
[0192] The block insulating layers 94b are two-layer films
including first insulating layers 95b made of, for example, a
silicon oxide and second insulating layers 96b made of, for
example, a silicon nitride.
[0193] The first insulating layers 95b and the second insulating
layers 96b are stacked in this order from the floating gate
electrode layers 91b to the control gate electrode layers 81b. The
block insulating layers 94b are formed to divide from one another
in the X-direction and the Y-direction at the respective crossing
points of the semiconductor layers 70 and the control gate
electrode layers 81b.
[0194] In this way, in memory elements 100b, the tunnel insulating
layers 93b, the floating gate electrode layers 91b, the first
insulating layers 95b, the second insulating layers 96b, and the
control gate electrode layers 81b are stacked in this order from
the upper surfaces 70b of the semiconductor layers 70. The memory
elements 100b are formed in a matrix shape in the X-direction and
the Y-direction at the respective crossing points of the
semiconductor layers 70 and the control gate electrode layers 81b.
Insulating layers 74b are formed among the memory elements 100b
adjacent to one another. In this way, the memory elements 100b have
the semiconductor layers 70 in common and are arrayed in the
X-direction. Memory element strings 110b extending in the
X-direction are formed. At both ends in the X-direction of the
memory element strings 110b, insulating layers are formed.
[0195] The memory elements 100b forming the memory element strings
110b are respectively disposed in positions opposed to, in the
Z-direction, the memory elements 100a that forms the memory element
strings 110a. Therefore, the memory element strings 110a and 110b
are formed having the semiconductor layers 70 in common and are
disposed to be opposed to each other across the semiconductor
layers 70. In other words, the semiconductor layers 70 are provided
between the two memory elements 100a and 100b and used in common by
the two memory elements 100a and 100b.
[0196] A cell source line 115 is formed to extend in the
Y-direction above the memory element strings 110b. Inter-layer
insulating layers 124 are formed between the memory element strings
110b and the cell source line 115. Inter-layer insulating layers
124 are formed between the semiconductor layers 70 and the cell
source line 115. Vias 128S filled with conductive layers 127S are
formed in the inter-layer insulating layers 124 between the
semiconductor layers 70 and the cell source line 115. The
semiconductor layers 70 and the cell source line 115 are
electrically connected.
[0197] Bit lines 129 are formed in the X-direction above the memory
element strings 110b and the cell source line 115. The
interlayer-insulating layers 124 are formed between the memory
element strings 110b and the bit lines 129. The
interlayer-insulating layers 124 are formed between the
semiconductor layer 70 and the bit lines 129. Vias 128B filled with
conductive layers 127B made of, for example, polysilicon, are
formed in the inter-layer insulating layers 124. The semiconductor
layers 70 and the bit lines 129 are electrically connected by the
conductive layers 127B. Note that the inter-layer insulating layers
124 are also formed between the cell source line 115 and the bit
lines 129.
[0198] As described above, the semiconductor memory device 1a
includes the memory element strings 110a and 110b including a
plurality of the memory elements 100a and 100b extending in the
X-direction, arrayed spaced from one another in the Y-direction,
and having the semiconductor layers 70 in common. Therefore, the
semiconductor memory device 1a is a lateral-type stacked memory
device.
[0199] As shown in FIG. 30, the semiconductor memory device 1a
according to the embodiment includes a memory cell 2a including the
memory element strings 110a and 110b and the control unit 3.
[0200] The memory cell 2a includes the memory element strings 110a
and 110b arrayed in a matrix shape. The memory elements 100a and
100b are three-dimensionally disposed on the memory cell 2a. As the
control unit 3a, the control unit same as the control unit 3 of the
semiconductor memory device 1 in the first embodiment can be used.
Like the semiconductor memory device 1 according to the first
embodiment, the semiconductor memory device 1a, which is the
lateral-type stacked memory device, includes the memory elements
having the semiconductor layers 70, which form channels, in common.
Therefore, an applied bias state of the memory elements 100a on one
side affects a threshold voltage of the memory elements on the
other side. Therefore, as in the semiconductor memory device 1
according to the first embodiment, a voltage applied to the bit
line 129, the cell source line 115, and a word line 139 is selected
according to the write mode, the readout mode, and the erase mode
using the control unit 3a.
[0201] As described above, in the semiconductor memory device 1a of
the embodiment, insulating layers that separate the memory element
strings 110a and 110b are unnecessary. It is possible to improve a
bit integration degree. Since a process forming the insulting layer
is unnecessary, a manufacturing process is reduced and a throughput
of manufacturing is improved.
[0202] As described above, by respectively appropriately setting
voltages applied to the control gate electrode films 21 of the
memory elements disposed to be opposed to each other across the
silicon pillar 20, it is possible to use the silicon pillar 20 in
common between the two memory element 30. Therefore, regions that
separate the silicon pillars belonging to the respective memory
elements are unnecessary. It is possible to improve the bit
integration degree. Since a process for separating the silicon
pillars is unnecessary, manufacturing is facilitated.
* * * * *