U.S. patent application number 14/858572 was filed with the patent office on 2016-03-24 for semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices.
The applicant listed for this patent is Jin-Ho An, Ju-Il Choi, Atsushi Fujisaki, Kwang-Jin Moon, Byung-Lyul Park. Invention is credited to Jin-Ho An, Ju-Il Choi, Atsushi Fujisaki, Kwang-Jin Moon, Byung-Lyul Park.
Application Number | 20160086874 14/858572 |
Document ID | / |
Family ID | 55526440 |
Filed Date | 2016-03-24 |
United States Patent
Application |
20160086874 |
Kind Code |
A1 |
Choi; Ju-Il ; et
al. |
March 24, 2016 |
SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF
MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE
SEMICONDUCTOR DEVICES
Abstract
A semiconductor device can include a substrate that has a
surface. A via structure can extend through the substrate toward
the surface of the substrate, where the via structure includes an
upper surface. A pad structure can be on the surface of the
substrate, where the pad structure can include a lower surface
having at least one protrusion that is configured to protrude
toward the upper surface of the via structure.
Inventors: |
Choi; Ju-Il; (Seongnam-Si,
KR) ; Moon; Kwang-Jin; (Hwaseong-si, KR) ;
Park; Byung-Lyul; (Seoul, KR) ; An; Jin-Ho;
(Seoul, KR) ; Fujisaki; Atsushi; (Seongnam-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Choi; Ju-Il
Moon; Kwang-Jin
Park; Byung-Lyul
An; Jin-Ho
Fujisaki; Atsushi |
Seongnam-Si
Hwaseong-si
Seoul
Seoul
Seongnam-si |
|
KR
KR
KR
KR
KR |
|
|
Family ID: |
55526440 |
Appl. No.: |
14/858572 |
Filed: |
September 18, 2015 |
Current U.S.
Class: |
257/751 ;
257/774 |
Current CPC
Class: |
H01L 2224/16145
20130101; H01L 24/11 20130101; H01L 2224/0401 20130101; H01L
2224/05647 20130101; H01L 2224/05155 20130101; H01L 2224/05611
20130101; H01L 2224/05655 20130101; H01L 2224/05564 20130101; H01L
23/481 20130101; H01L 2224/16145 20130101; H01L 2225/06541
20130101; H01L 2224/13139 20130101; H01L 2224/05018 20130101; H01L
23/53266 20130101; H01L 2225/06517 20130101; H01L 2224/05684
20130101; H01L 2224/05567 20130101; H01L 2224/05684 20130101; H01L
2224/05025 20130101; H01L 2224/05647 20130101; H01L 2224/16013
20130101; H01L 2224/13147 20130101; H01L 2224/16147 20130101; H01L
2224/16227 20130101; H01L 24/14 20130101; H01L 2224/05624 20130101;
H01L 24/16 20130101; H01L 2224/05655 20130101; H01L 25/18 20130101;
H01L 2224/16146 20130101; H01L 21/76898 20130101; H01L 23/5329
20130101; H01L 24/13 20130101; H01L 2224/13147 20130101; H01L
2224/05557 20130101; H01L 2224/05572 20130101; H01L 2224/06181
20130101; H01L 2224/32145 20130101; H01L 2224/05559 20130101; H01L
2224/13023 20130101; H01L 2224/73204 20130101; H01L 2224/03618
20130101; H01L 24/03 20130101; H01L 2224/05546 20130101; H01L
2224/05027 20130101; H01L 2924/15311 20130101; H01L 23/53223
20130101; H01L 2224/05611 20130101; H01L 23/53238 20130101; H01L
2224/13139 20130101; H01L 24/05 20130101; H01L 2224/16113 20130101;
H01L 2224/03618 20130101; H01L 2225/06513 20130101; H01L 2224/05624
20130101; H01L 25/0657 20130101; H01L 2224/16148 20130101; H01L
2924/00014 20130101; H01L 2224/73204 20130101; H01L 2924/00014
20130101; H01L 2924/013 20130101; H01L 2924/00 20130101; H01L
2924/00014 20130101; H01L 2924/00014 20130101; H01L 2924/00014
20130101; H01L 2924/00014 20130101; H01L 2224/32145 20130101; H01L
2924/01047 20130101; H01L 2924/00014 20130101 |
International
Class: |
H01L 23/48 20060101
H01L023/48; H01L 23/532 20060101 H01L023/532; H01L 23/528 20060101
H01L023/528; H01L 23/00 20060101 H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 22, 2014 |
KR |
10-2014-0126143 |
Claims
1. A semiconductor device, comprising: a via structure through a
substrate, a portion of the via structure exposed above a top
surface of the substrate, and the via structure having a top
surface of which a central portion is concave and including: a via
electrode including a conductive pattern and a barrier layer
pattern surrounding a sidewall of the conductive pattern; and an
insulation layer pattern surrounding a sidewall of the via
electrode, wherein a top surface of the conductive pattern is lower
than that of the insulation layer pattern and is flat, a protection
layer pattern structure on the top surface of the substrate, the
protection layer pattern structure surrounding a sidewall of the
portion of the via structure that is exposed and including a
photosensitive organic material; and a pad structure contacting a
top surface of the portion of the via structure that is exposed,
the pad structure having a flat top surface.
2. The semiconductor device of claim 1, wherein the protection
layer pattern structure includes a thermosetting organic
polymer.
3. The semiconductor device of claim 2, wherein the thermosetting
organic polymer comprises any one selected from the group
consisting of polyimide, novolac, polybenzoxazole,
benzocyclobutene, silicon polymer, epoxy polymer and acrylate
polymer.
4. The semiconductor device of claim 2, wherein a top surface of
the protection layer pattern structure has a substantially constant
height.
5. The semiconductor device of claim 1, wherein the top surface of
the conductive pattern is lower than those of both of the barrier
layer pattern and the insulation layer pattern.
6. The semiconductor device of claim 5, wherein the top surface of
the barrier layer pattern is substantially coplanar with that of
the insulation layer pattern.
7. The semiconductor device of claim 5, wherein upper portions of
each of the barrier layer pattern and the insulation layer pattern
above the conductive pattern have a width that decreases from a
bottom toward a top thereof.
8. The semiconductor device of claim 1, wherein a top surface of
the barrier layer pattern is lower than that of the insulation
layer pattern.
9. The semiconductor device of claim 8, wherein the top surface of
the barrier layer pattern is substantially coplanar with that of
the conductive pattern.
10. The semiconductor device of claim 1, wherein the top surface of
the conductive pattern is lower than that of the substrate.
11. The semiconductor device of claim 1, wherein the conductive
pattern includes a metal, the barrier layer pattern includes a
metal nitride, and the insulation layer pattern includes silicon
nitride.
12. The semiconductor device of claim 1, wherein the pad structure
has a bottom surface of which a central portion is concave, and
conforms to a contour of the top surface of the via structure.
13. The semiconductor device of claim 1, wherein the pad structure
includes a seed pattern thereon.
14. The semiconductor device of claim 13, wherein the pad includes
nickel.
15. The semiconductor device of claim 1, wherein the pad structure
contacts the via structure and the protection layer pattern
structure.
16. The semiconductor device of claim 15, wherein a bottom surface
of the pad structure follows a contour defined by variation in
respective heights of the top surface of the via structure and a
top surface of the protection layer pattern structure.
17. The semiconductor device of claim 1, wherein the semiconductor
device includes a plurality of via structures and a plurality of
pad structures, and wherein some conductive patterns in the via
structures have respective top surfaces at different heights.
18. The method of claim 17, wherein some pad structures have
respective top surfaces at different heights.
19. A semiconductor device, comprising: a via structure through a
substrate, a portion of the via structure exposed above a top
surface of the substrate, and the via structure having a top
surface of which a central portion is concave and including: a via
electrode including a conductive pattern and a barrier layer
pattern surrounding a sidewall of the conductive pattern; and an
insulation layer pattern surrounding a sidewall of the via
electrode, wherein a top surface of the conductive pattern is lower
than that of the insulation layer pattern and is flat, a protection
layer pattern structure on the top surface of the substrate, the
protection layer pattern structure surrounding a sidewall of the
portion of the via structure that is exposed, and a top surface of
a first portion of the protection layer pattern structure proximate
to the via structure is higher than a second portion of the
protection layer pattern structure remote from the via structure
relative to the first portion and a pad structure contacting the
portion of the via structure that is exposed, the pad structure
having a flat top surface.
20. (canceled)
21. (canceled)
22. A semiconductor device, comprising: a via structure through a
substrate, a portion of the via structure exposed above a top
surface of the substrate; a protection layer pattern structure on
the top surface of the substrate, the protection layer pattern
structure surrounding a sidewall of the portion of the via
structure that is exposed and having a top surface higher than that
of the via structure; and a pad structure contacting the portion of
the via structure that is exposed and contacting the protection
layer pattern structure, the pad structure having a flat top
surface.
23.-56. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority under 35 USC .sctn.119 to
Korean Patent Application No. 10-2014-0126143, filed on Sep. 22,
2014 in the Korean Intellectual Property Office (KIPO), the
contents of which are herein incorporated by reference in their
entirety.
FIELD
[0002] Example embodiments relate to a semiconductor device and a
method of manufacturing the same, and a semiconductor package
including the semiconductor device.
BACKGROUND
[0003] As semiconductor devices have been highly integrated, a
three-dimensional packaging technology in which a plurality of
chips may be stacked on each other has been developed. A through
silicon via (TSV) technology is a packaging technology in which a
via hole may be formed through a silicon substrate and a via
electrode may be formed in the via hole.
[0004] In order to electrically connect a chip having a TSV therein
to another chip, a conductive bump may be formed to contact the
TSV, and a rear portion of a silicon substrate in which the TSV is
formed may be removed and a CMP process may be performed to expose
the TSV. However, the CMP process may be expensive, and the TSV may
be damaged during the CMP process. Thus, a semiconductor device
including the TSV and a semiconductor package including the
semiconductor device may have a poor reliability.
SUMMARY
[0005] Embodiments according to the inventive concept can provide
semiconductor devices including through silicon vias and methods of
forming the devices and packages including the same. Pursuant to
these embodiments, a semiconductor device can include a substrate
that has a surface. A via structure can extend through the
substrate toward the surface of the substrate, where the via
structure includes an upper surface. A pad structure can be on the
surface of the substrate, where the pad structure can include a
lower surface having at least one protrusion that is configured to
protrude toward the upper surface of the via structure.
[0006] In some embodiments, a semiconductor device can include a
via structure through a substrate, where a portion of the via
structure is exposed above a top surface of the substrate and the
via structure has a top surface of which a central portion is
concave and includes a via electrode including a conductive
pattern, and a barrier layer pattern surrounding a sidewall of the
conductive pattern and an insulation layer pattern surrounding a
sidewall of the via electrode. A top surface of the conductive
pattern can be lower than that of the insulation layer pattern and
is flat. A protection layer pattern structure can be on the top
surface of the substrate, where the protection layer pattern
structure surrounding a sidewall of the portion of the via
structure that is exposed and including a photosensitive organic
material. A pad structure can contact a top surface of the portion
of the via structure that is exposed, and the pad structure has a
flat top surface.
[0007] In some embodiments, a semiconductor device can include a
via structure through a substrate, where a portion of the via
structure can be exposed above a top surface of the substrate. A
protection layer pattern structure can be on the top surface of the
substrate, where the protection layer pattern structure can
surround a sidewall of the portion of the via structure that is
exposed and having a top surface higher than that of the via
structure. A pad structure can contact the portion of the via
structure that is exposed and contact the protection layer pattern
structure, and the pad structure has a flat top surface.
[0008] In some embodiments, a semiconductor device can include a
via structure through a portion of a substrate and a protection
layer pattern structure on a top surface of the substrate, where
the protection layer pattern structure does not vertically overlap
the via structure. A pad structure can be through a portion of the
substrate, where the pad structure contacts respective top surfaces
of the via structure and the protection layer pattern structure and
has a flat top surface.
[0009] In some embodiments, a semiconductor package can include a
first semiconductor chip that includes a via structure through a
substrate, where a portion of the via structure is exposed above a
top surface of the substrate, and the via structure has a top
surface of which a central portion is concave and includes a via
electrode including a conductive pattern and a barrier layer
pattern that surrounds a sidewall of the conductive pattern and an
insulation layer pattern that surrounds a sidewall of the via
electrode, wherein a top surface of the conductive pattern is lower
than that of the insulation layer pattern and is flat. A protection
layer pattern structure can be on the top surface of the substrate,
where the protection layer pattern structure surrounding a sidewall
of the portion of the via structure that is exposed and including a
photosensitive organic material. A pad structure can contact the
portion of the via structure that is exposed, where the pad
structure has a flat top surface and a second semiconductor chip
can be electrically connected to the first semiconductor chip via
the pad structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Example embodiments will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. FIGS. 1 to 51 represent non-limiting,
example embodiments as described herein.
[0011] FIGS. 1A, 2A, 3A, 4A, 5A and 6A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0012] FIGS. 1B, 2B, 3B, 4B, 5B and 613 are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0013] FIGS. 7 to 25 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments;
[0014] FIGS. 26A, 27A and 28A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0015] FIGS. 26B, 27B and 28B are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0016] FIGS. 29 to 31 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments;
[0017] FIGS. 32A, 33A and 34A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0018] FIGS. 32B, 33B and 34B are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments;
[0019] FIGS. 35 to 37 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments;
[0020] FIGS. 38A, 39A, 40A, 41A, 42A and 43A are cross-sectional
views illustrating semiconductor devices in accordance with example
embodiments;
[0021] FIGS. 38B, 39B, 40B, 41B, 42B and 43B are cross-sectional
views illustrating semiconductor devices in accordance with example
embodiments;
[0022] FIGS. 44 to 48 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments; and
[0023] FIGS. 49 to 51 are cross-sectional views illustrating
semiconductor packages in accordance with example embodiments.
DESCRIPTION OF EMBODIMENTS
[0024] Various example embodiments are described hereinafter with
reference to the accompanying drawings, in which some example
embodiments are shown. The present inventive concept may, however,
be embodied in many different forms and should not be construed as
limited to the example embodiments set forth herein. Rather, these
example embodiments are provided so that this description will be
thorough and complete, and will fully convey the scope of the
present inventive concept to those skilled in the art. In the
drawings, the sizes and relative sizes of layers and regions may be
exaggerated for clarity.
[0025] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numerals refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items.
[0026] It will be understood that, although the terms first,
second, third, fourth etc. may be used herein to describe various
elements, components, regions, layers and/or sections, these
elements, components, regions, layers and/or sections should not be
limited by these terms. These terms are only used to distinguish
one element, component, region, layer or section from another
region, layer or section. Thus, a first element, component, region,
layer or section discussed below could be termed a second element,
component, region, layer or section without departing from the
teachings of the present inventive concept.
[0027] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein interpreted accordingly.
[0028] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be
limiting of the present inventive concept. As used herein, the
singular forms "a," "an" and "the" are intended to include the
plural forms as well, unless the context clearly indicates
otherwise. It will be further understood that the terms "comprises"
and/or "comprising," when used in this specification, specify the
presence of stated features, integers, steps, operations, elements,
and/or components, but do not preclude the presence or addition of
one or more other features, integers, steps, operations, elements,
components, and/or groups thereof.
[0029] Example embodiments are described herein with reference to
cross-sectional illustrations that are schematic illustrations of
idealized example embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, example embodiments should not be construed as
limited to the particular shapes of regions illustrated herein but
are to include deviations in shapes that result, for example, from
manufacturing. For example, an implanted region illustrated as a
rectangle will, typically, have rounded or curved features and/or a
gradient of implant concentration at its edges rather than a binary
change from implanted to non-implanted region. Likewise, a buried
region formed by implantation may result in some implantation in
the region between the buried region and the surface through which
the implantation takes place. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to illustrate the actual shape of a region of a device and are not
intended to limit the scope of the present inventive concept.
[0030] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
inventive concept belongs. It will be further understood that
terms, such as those defined in commonly used dictionaries, should
be interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0031] As used herein, the term "interlocking" refers to both a
single as well as a pair of structures that are configured to mate
with one another via corresponding protrusions and recesses. For
example, as shown in FIG. 1A herein, the via structure that
includes elements 205, 215, and 225 can be shaped so that an upper
surface of the via structure 235 is higher around the edges than at
a central portion so that a recess is provided over the element
225. Correspondingly, the pad 400 includes a lower surface that is
configured to interlock with the upper surface of the via structure
235 by providing a pair of recesses that interlock with the raised
portions of the via structure 235 provided by the elements 205 and
215 being raised relative to the element 225. In some embodiments
according to the invention, the protrusions and recesses that
correspond to one another in the pad and the via structure are
interdigitated with one another.
[0032] FIGS. 1A, 2A, 3A, 4A, 5A and 6A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments.
[0033] Referring to FIG. 1A, the semiconductor device may include a
via structure 235 through a substrate 100, a protection layer
pattern structure 345, and a pad structure. The semiconductor
device may further include first, second and third insulating
interlayers 160, 180 and 240, circuit elements, first, second and
third wirings 190, 250 and 260, a contact plug 170, and a first
conductive bump 280.
[0034] The substrate 100 may include silicon, germanium,
silicon-germanium, or III-V compounds, e.g., GaP, GaAs, GaSb, etc.
In some embodiments, the substrate 100 may be a
silicon-on-insulator (SOI) substrate, or a germanium-on-insulator
(GOI) substrate.
[0035] The substrate 100 may have a first surface 101 and a second
surface 102 opposite thereto. The substrate 100 may include a first
region I and a second region II, and hereinafter, not only the
first and second regions I and II of the substrate 100 but also
spaces extended from the first and second regions I and II of the
substrate 100 upwardly or downwardly may be defined altogether as
the first and second regions I and II, respectively. In example
embodiments, the first region I may be a circuit region in which
the circuit elements may be formed, and the second region II may be
a via region in which the via structure 235 may be formed. In FIG.
1A, one first region I and two second regions II are shown,
however, a plurality of second regions II and a plurality of first
regions I between the second regions II may be formed in the
semiconductor device. That is, the semiconductor device may include
a plurality of via structures 235, and a region in which each via
structure 235 is formed may be defined as the second region II.
[0036] The first region I may include a cell region in which memory
cells may be formed, a peripheral circuit region in which
peripheral circuits for driving the memory cells may be formed, and
a logic region in which logic devices may be formed.
[0037] An isolation layer 110 including an insulating material,
e.g., silicon oxide may be formed at a portion of the substrate 100
adjacent to the first surface 101, and circuit elements, e.g., a
transistor may be formed on the first surface 101 of the substrate
100. The transistor may include a gate structure 140 having a gate
insulation layer pattern 120 and a gate electrode 130 sequentially
stacked on the first surface 101 of the substrate 100, and an
impurity region 105 at a portion of the substrate 100 adjacent to
the gate structure 140. A gate spacer 15Q may be formed on a
sidewall of the gate structure 140.
[0038] The gate insulation layer pattern 120 may include an oxide,
e.g., silicon oxide or a metal oxide, the gate electrode 130 may
include, e.g., doped polysilicon, a metal, a metal nitride and/or a
metal silicide, and the gate spacer 150 may include a nitride,
e.g., silicon nitride.
[0039] In example embodiments, a plurality of transistors may be
formed on the first surface 101 of the substrate 100 in the first
region I. The circuit elements may not be limited to the
transistors, but various types of circuit elements, e.g., diodes,
resistors, inductors, capacitors, etc., may be formed in the first
region I.
[0040] The first, second and third insulating interlayers 160, 180
and 240 may be sequentially formed on the first surface 101 of the
substrate 100.
[0041] The first insulating interlayer 160 may cover the circuit
elements, and the contact plug 170 contacting the impurity region
105 may be formed through the first insulating interlayer 160.
Alternatively, the contact plug 170 may be formed through the first
insulating interlayer 160 to contact the gate structure 140. The
first insulating interlayer 160 may include an oxide, e.g., silicon
oxide, and the contact plug 170 may include, e.g., a metal, a metal
nitride, a metal silicide, doped polysilicon, etc.
[0042] The second insulating interlayer 180 may contain the first
wiring 190 therethrough, which may contact the first contact 170.
The second insulating interlayer 180 may include a low-k dielectric
material, e.g., silicon oxide doped with fluorine or carbon, a
porous silicon oxide, spin on organic polymer, or an inorganic
polymer, e.g., hydrogen silsesquioxane (HSSQ), methyl
silsesquioxane (MSSQ), etc.
[0043] In example embodiments, the first wiring 190 may include a
first conductive pattern 194 and a first barrier pattern 192
partially covering the first conductive pattern 194. The first
conductive pattern 194 may include a metal, e.g., copper, aluminum,
tungsten, titanium, tantalum, etc., and the first barrier pattern
192 may include a metal nitride, e.g., titanium nitride, tantalum
nitride, tungsten nitride, copper nitride, aluminum nitride, etc.
In example embodiments, the first wiring 190 may be formed by a
dual damascene process, and thus upper and lower portions of the
first wiring 190 may have different widths. Alternatively, the
first wiring 190 may be formed by a single damascene process, and
thus the first wiring 190 may have a substantially constant width
regardless of the height thereof. Hereinafter, for the convenience
of explanations, only the first wiring 190 formed by the dual
damascene process will be illustrated.
[0044] The via structure 235 may be formed through the first and
second insulating interlayers 160 and 180 and the substrate 100,
and a portion of the via structure 235 may be exposed over the
second surface 102 of the substrate 100. The via structure 235 may
have a top surface of which a central portion may be concave.
[0045] In example embodiments, the via structure 235 may include a
via electrode and an insulation layer pattern 205 surrounding a
sidewall of the via electrode. The via electrode may include a
second conductive pattern 225 and a second barrier layer pattern
215 surrounding a sidewall of the second conductive pattern 225.
The second conductive pattern 225 may include a metal, e.g.,
copper, aluminum, tungsten, etc., or doped polysilicon, and the
second barrier pattern 215 may include a metal nitride, e.g.,
titanium nitride, tantalum nitride, tungsten nitride, copper
nitride, aluminum nitride, etc. The insulation layer pattern 205
may include an oxide, e.g., silicon oxide, or a nitride, e.g.,
silicon nitride.
[0046] In example embodiments, a top surface of the second
conductive pattern 225 may be lower than top surfaces of the second
barrier layer pattern 215 and the insulation layer pattern 205, and
the top surface of the second barrier layer pattern 215 may be
substantially coplanar with the top surface of the insulation layer
pattern 205. Referring to FIG. 3A, the top surface of the second
conductive pattern 225 may be lower than the second surface 102 of
the substrate 100.
[0047] The protection layer pattern structure 345 may be formed on
the second surface 102 of the substrate 100, to cover a sidewall of
the exposed portion of the via structure 235. A top surface of a
portion of the protection layer pattern structure 345 surrounding a
sidewall of the via structure 235 may be higher than a top surface
of other portions of the protection layer pattern structure 345.
Thus, the whole top surfaces of the via structure 235 together with
the protection layer pattern structure 345 may not be flat (i.e.,
non-planar).
[0048] In example embodiments, the protection layer pattern
structure 345 may include a first oxide layer pattern 315, a
nitride layer pattern 325 and a second oxide layer pattern 335
sequentially stacked on the second surface 102 of the substrate
100.
[0049] Referring to FIG. 2A, the protection layer pattern structure
345 may include only the first oxide layer pattern 315 and the
nitride layer pattern 325 sequentially stacked on the second
surface 102 of the substrate 100.
[0050] The pad structure may contact the top surface of the exposed
portion of the via structure 235, and may have a flat or even top
surface. Thus, the pad structure may have a bottom surface of which
a central portion may be convex (i.e., protruding) according to the
shape of the top surface of the via structure 235 (i.e., the bottom
surface may have a contour that conforms to the non-planar top
surface of the protection layer pattern structure 345 and the via
structure 235). In example embodiments, the pad structure may
contact not only the top surface of the exposed portion of the via
structure 235 but also the top surface of the protection layer
pattern structure 345, and the bottom surface of the pad structure
may not be flat according to the variation of heights of the top
surfaces of the via structure 235 and the protection layer pattern
structure 345.
[0051] In example embodiments, the pad structure may include a seed
pattern 385 and a pad 400 sequentially stacked. The seed pattern
385 may include, e.g., copper, and the pad 400 may include, e.g.,
nickel, copper, tungsten, aluminum, tin-silver alloy, etc.
[0052] The pad structure may have the uneven bottom surface,
however, may have the flat top surface, and thus, when a conductive
bump (not shown) is formed on the top surface of the pad structure
so that a chip including the semiconductor device may be
electrically connected to another chip, the connection between the
pad structure and the conductive bump may be good. Thus, a
semiconductor package including the semiconductor device may have
good electrical characteristics.
[0053] The third insulating interlayer 240 may contain the second
and third wirings 250 and 260 therethrough, which may contact the
first wiring 190 and the via structure 235, respectively. The
second and third wirings 250 and 260 may be formed in the first and
second regions I and II, respectively. The third insulating
interlayer 240 may include a low-k dielectric material, e.g.,
silicon oxide doped with fluorine or carbon, a porous silicon
oxide, spin on organic polymer, or an inorganic polymer, e.g.,
hydrogen silsesquioxane (HSSQ), methyl silsesquioxane (MSSQ),
etc.
[0054] The second and third wirings 250 and 260 may be formed by a
dual damascene process or a single damascene process as the first
wiring 190, and may be electrically connected to each other
according to the circuit layout. In example embodiments, the second
wiring 250 may include a third conductive pattern 254 and a third
barrier layer pattern 252 partially covering the third conductive
pattern 254, and the third wiring 260 may include a fourth
conductive pattern 264 and a fourth barrier layer pattern 262
partially covering the fourth conductive pattern 264.
[0055] The first conductive bump 280 may contact the third wiring
260, and may include a metal, e.g., silver, copper, etc., or an
alloy, e.g., solder.
[0056] When the semiconductor device may be formed, the first
conductive bump 280 may be contained by an adhesion layer 290, and
the adhesion layer 29Q may adhere to a handling substrate 300. The
handling substrate 300 may be, e.g., a glass substrate.
[0057] As illustrated above, the via structure 235 of the
semiconductor device may have the top surface of which the central
portion may be concave, and the top surface of the protection layer
pattern structure 345 covering the sidewall of the via structure
235 may have a height varying according to the position thereof.
Thus, the bottom surface of the pad structure on the top surfaces
of the via structure 235 and the protection layer pattern structure
345 may not be flat; however, the top surface of the pad structure
may be flat. Accordingly, the connection between the top surface of
the pad structure and the conductive bump 280 on another may be
good, and the semiconductor package including the semiconductor
device may have good electrical characteristics.
[0058] As will be illustrated with reference to FIGS. 7 to 25
later, no chemical mechanical polishing (CMP) process may be
performed on the via structure 235, and thus the via structure 235
may not be damaged but still have good physical
characteristics.
[0059] In FIGS. 4A, 5A and 6A, the second barrier layer pattern 215
and the insulation layer pattern 205 of the via structure 235 may
have shapes different from those illustrated in FIGS. 1A, 2A and
3A, respectively.
[0060] That is, a portion of the second barrier layer pattern 215
above the second conductive pattern 225 may have a gradually
decreasing width from a bottom toward a top thereof, and likewise,
a portion of the insulation layer pattern 205 adjacent to the
portion of the second barrier layer pattern 215 above the second
conductive pattern 225 may have a gradually decreasing width from a
bottom toward a top thereof. Thus, an upper portion of the second
barrier layer pattern 215 and/or an upper portion of the insulation
layer pattern 205 may have slanted inner walls. The slanted inner
walls of the upper portion of the second barrier layer pattern 215
and/or the upper portion of the insulation layer pattern 205 may be
formed because the second barrier layer pattern 215 and/or the
insulation layer pattern 205 may be partially etched according to
the process conditions and the size of a first recess 370a (refer
to FIGS. 18A and 19A) when the second conductive pattern 225 is
formed by a wet etch process.
[0061] The shapes of the via structure 235 illustrated in FIGS. 4A,
5A and 6A may be applied to other semiconductor devices described
hereinafter, however, for the convenience of explanations, the via
structure 235 having the shapes of FIGS. 1A, 2A and 3A only will be
described.
[0062] FIGS. 1B, 2B, 3B, 4B, 5B and 6B are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as or similar to those illustrated with reference to FIGS. 1A,
2A, 3A, 4A, 5A and 6A, respectively, except for the heights of the
second conductive pattern and the pad.
[0063] Referring to FIG. 1B, the semiconductor device may include a
plurality of via structures 235, and each via structure 235 may
include an insulation layer pattern 205, a second conductive
pattern 225 and a second barrier layer pattern 215. Top surfaces of
the second conductive patterns 225 may have different heights from
each other, and top surfaces of pads 400 on the via structures 235
may have different heights from each other. In FIG. 1B, only two
via structures 235 are shown, however, more than two via structures
235 may be formed, and at least some of the second conductive
patterns 225 of the via structures 235 may have top surfaces at
different heights from each other, and thus at least some of the
pads 400 may have top surfaces at different heights from each
other.
[0064] Referring to FIGS. 2B, 3B, 4B, 5B and 6B, as the
semiconductor device shown in FIG. 1B, each of the semiconductor
devices may include a plurality of second conductive patterns 225,
and at least some of the second conductive patterns 225 may have
top surfaces at different heights from each other, and thus at
least some of the pads 400 may have top surfaces at different
heights from each other.
[0065] FIGS. 7 to 25 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments.
[0066] Referring to FIG. 7, circuit elements and a contact plug 170
may be formed on a substrate 100 having an isolation layer 110
thereon.
[0067] The substrate 100 may include silicon, germanium,
silicon-germanium, or III-V compounds, e.g., GaP, GaAs, GaSb, etc.
In some embodiments, the substrate 100 may be a
silicon-on-insulator (SOI) substrate, or a germanium-on-insulator
(GOI) substrate.
[0068] The substrate 100 may have a first surface 101 and a second
surface 102 opposite thereto. The substrate 100 may include a first
region I and a second region II. In example embodiments, the first
region I may be a circuit region in which the circuit elements may
be formed, and the second region II may be a via region in which a
via structure 235 (refer to FIG. 18A) may be formed.
[0069] The first region I may include a cell region in which memory
cells may be formed, a peripheral circuit region in which
peripheral circuits for driving the memory cells may be formed, and
a logic region in which logic devices may be formed.
[0070] In example embodiments, the isolation layer 110 may be
formed by a shallow trench isolation (STI) process, and include an
insulating material, e.g., silicon oxide.
[0071] A transistor serving as the circuit element may be formed by
a following method.
[0072] Particularly, after sequentially forming a gate insulation
layer and a gate electrode layer on the first surface 101 of the
substrate 100 having the isolation layer 110 thereon, the gate
electrode layer and the gate insulation layer may be patterned by a
photolithography process to form a gate structure 140 including a
gate insulation layer pattern 120 and a gate electrode 130
sequentially stacked on the first surface 101 of the substrate 100
in the first region I. The gate insulation layer may be formed to
include an oxide, e.g., silicon oxide or a metal oxide, and the
gate electrode layer may be formed to include, e.g., doped
polysilicon, a metal, a metal nitride and/or a metal silicide.
[0073] A gate spacer layer may be formed on the substrate 100 and
the isolation layer 110 to cover the gate structure 140, and may be
anisotropically etched to form a gate spacer 150 on a sidewall of
the gate structure 140. The gate spacer layer may be formed to
include a nitride, e.g., silicon nitride.
[0074] Impurities may be implanted into an upper portion of the
substrate 100 to form a first impurity region 105, so that the
transistor including the gate structure 140 and the first impurity
region 105 may be formed.
[0075] In example embodiments, a plurality of transistors may be
formed on the substrate 100 in the first region I. The circuit
elements may not be limited to the transistor, but various types of
circuit elements, e.g., diodes, resistors, inductors, capacitors,
etc. may be formed.
[0076] A first insulating interlayer 160 may be formed on the
substrate 100 to cover the circuit elements, and a contact plug 170
may be formed through the first insulating interlayer 160 to
contact the first impurity region 105. Alternatively, the contact
plug 170 may be formed through the first insulating interlayer 160
to contact the gate structure 140.
[0077] The first insulating interlayer 160 may be formed to include
an oxide, e.g., silicon oxide. The contact plug 170 may be formed
by forming a contact hole through the first insulating interlayer
160 to expose the first impurity region 105, forming a conductive
layer on the exposed first impurity region 105 and the first
insulating interlayer 160 to fill the contact hole, and planarizing
an upper portion of the conductive layer until a top surface of the
first insulating interlayer 160 may be exposed. The conductive
layer may be formed to include, e.g., a metal, a metal nitride, a
metal silicide, doped polysilicon, etc.
[0078] Referring to FIG. 8, a second insulating interlayer 180 may
be formed on the first insulating interlayer 160 and the contact
plug 170, and at least one first wiring 190 may be formed through
the second insulating interlayer 180 in the first region I.
[0079] The second insulating interlayer 180 may be formed to
include a low-k dielectric material, e.g., silicon oxide doped with
fluorine or carbon, a porous silicon oxide, spin on organic
polymer, or an inorganic polymer, e.g., hydrogen silsesquioxane
(HSSQ), methyl silsesquioxane (MSSQ), etc.
[0080] In example embodiments, the second insulating interlayer 180
may be formed by a dual damascene process as follows.
[0081] After partially removing the second insulating interlayer
180 to form a via hole therethrough, which may expose top surfaces
of the first insulating interlayer 160 and the contact plug 170, an
upper portion of the second insulating interlayer 180 may be
removed to form a first trench being in communication with the via
hole and having a diameter greater than that of the via hole.
Alternatively, after forming the first trench, the via hole may be
formed later. A first barrier layer may be formed on inner walls of
the via hole and the first trench and the exposed top surfaces of
the first insulating interlayer 160 and the contact plug 170, and a
first conductive layer may be formed on the first barrier layer to
sufficiently fill remaining portions of the via hole and the first
trench. Upper portions of the first barrier layer and the first
conductive layer may be planarized until a top surface of the
second insulating interlayer 180 may be exposed to form the first
wiring 190 contacting the top surface of the contact plug 170 in
the first region I. The first wiring 190 may be formed to include a
first conductive pattern 194 and a first barrier layer pattern 192
surrounding a bottom and a sidewall of the first conductive pattern
194.
[0082] The first barrier layer may be formed to include a metal
nitride, e.g., titanium nitride, tantalum nitride, tungsten
nitride, copper nitride, aluminum nitride, etc., and the first
conductive layer may be formed to include a metal, e.g., copper,
aluminum, tungsten, titanium, tantalum, etc. When the first
conductive layer is formed using copper or aluminum, a seed layer
may be formed on the first barrier layer, and the first conductive
layer may be formed by an electroplating process.
[0083] As illustrated above, the first wiring 190 may be formed by
a dual damascene process, and thus may be formed to have a lower
portion and an upper portion connected thereto. Alternatively, the
first wiring 190 may be formed by a single damascene process. In
this case, the first wiring 190 may have a substantially constant
thickness from a bottom portion toward a top portion thereof.
Hereinafter, for the convenience of explanations, only the first
wiring 190 formed by a dual damascene process as shown in FIG. 8
will be illustrated.
[0084] In FIG. 8, the first wiring 190 may be formed through the
single second insulating interlayer 180, however, more insulating
interlayers may be further formed on the second insulating
interlayer 180 and more first wirings 190 may be formed through
each of the insulating interlayers.
[0085] Referring to FIG. 9, a preliminary via structure 230 may be
formed through a portion of the substrate 100.
[0086] Particularly, a first photoresist pattern covering the first
region I of the substrate 100 and partially exposing the second
region II of the substrate 100 may be formed on the second
insulating interlayer 180 and the first wiring 190, and the first
and second insulating interlayers 160 and 180 and the substrate 100
may be etched using the first photoresist pattern as an etching
mask to form a second trench. The second trench may be formed
through the first and second insulating interlayers 160 and 180 and
the portion of the substrate 100.
[0087] An insulation layer 200 and a second barrier layer 210 may
be sequentially formed on an inner wall of the second trench, the
second insulating interlayer 180 and the first wiring 190, and a
second conductive layer 220 may be formed on the second barrier
layer 210 to sufficiently fill the second trench. The insulation
layer 200 may be formed to include an oxide, e.g., silicon oxide or
a nitride, e.g., silicon nitride, and the second barrier layer 210
may be formed to include a metal nitride, e.g., titanium nitride,
tantalum nitride, tungsten nitride, copper nitride, aluminum
nitride, etc. The second conductive layer 220 may be formed to
include a metal, e.g., copper, aluminum, tungsten, etc., or doped
polysilicon. When the second conductive layer 220 is formed to
include copper or aluminum, a second seed layer may be formed on
the second barrier layer 210, and the second conductive layer 220
may be formed by an electroplating process.
[0088] The second conductive layer 220, the second barrier layer
210 and the insulation layer 200 may be planarized until a top
surface of the second insulating interlayer 180 may be exposed to
form the preliminary via structure 230 filling the second trench.
The preliminary via structure 230 may include the insulation layer
200, the second barrier layer 210 and the second conductive layer
220.
[0089] Referring to FIG. 10, a third insulating interlayer 240 may
be formed on the second insulating interlayer 180, the first wiring
190 and the preliminary via structure 230, and second and third
wirings 250 and 260 may be formed through the third insulating
interlayer 240 in the first and second regions I and II,
respectively.
[0090] The third insulating interlayer 240 may be formed to include
a low-k dielectric material, e.g., silicon oxide doped with
fluorine or carbon, a porous silicon oxide, spin on organic
polymer, or an inorganic polymer, e.g., hydrogen silsesquioxane
(HSSQ), methyl silsesquioxane (MSSQ), etc.
[0091] The second and third wirings 250 and 260 may be formed by a
dual damascene process or a single damascene process, as the first
wiring 190. In example embodiments, the second wiring 250 may be
formed to contact a top surface of the first wiring 190, and the
third wiring 260 may be formed to contact a top surface of the
preliminary via structure 230. According to the circuit layout, the
second and third wirings 250 and 260 may be formed to be
electrically connected to each other. In example embodiments, the
second wiring 250 may be formed to include a third conductive
pattern 254 and a third barrier layer pattern 252 covering a bottom
and a sidewall of the third conductive pattern 254, and the third
wiring 260 may be formed to include a fourth conductive pattern 264
and a fourth barrier layer pattern 262 covering a bottom and a
sidewall of the fourth conductive pattern 264.
[0092] Referring to FIG. 11, after a first conductive bump 280 may
be formed on the third insulating interlayer 240 to contact a top
surface of the third wiring 260, an adhesion layer 290 may be
formed on the third insulating interlayer 240 and the second wiring
250, and may adhere to a handling substrate 300.
[0093] The first conductive bump 280 may be formed to include a
metal, e.g., silver, copper, etc., or an alloy, e.g., solder. The
handling substrate 300 may be, e.g., a glass substrate.
[0094] Referring to FIG. 12, the substrate 100 may be overturned
using the handling substrate 300 so that the second surface 102 of
the substrate 100 may face upward. A portion of the substrate 100
adjacent to the second surface 102 may be removed to expose a
portion of the preliminary via structure 230. Thus, the substrate
100 may be partially removed by, e.g., an etch back process.
[0095] Referring to FIG. 13, a protection layer structure 340 may
be formed on the second surface 102 of the substrate 100 and the
exposed portion of the preliminary via structure 230.
[0096] In example embodiments, the protection layer structure 340
may be formed to include a first oxide layer 310, a nitride layer
320 and a second oxide layer 330 sequentially stacked. In an
example embodiment, the second oxide layer 330 may be formed to
have a thickness more than that of the first oxide layer 310 and
the nitride layer 320. In this case, in a subsequent process
illustrated with reference to FIG. 17A, a first oxide layer pattern
315, a nitride layer pattern 325 and a second oxide layer pattern
335 may remain.
[0097] In other example embodiments, the nitride layer 320 may be
formed to have a thickness less than that of the first oxide layer
310 and the second oxide layer 330, and the first and second oxide
layers 310 and 330 may be formed to have thicknesses substantially
the same as or similar to each other. In this case, in the
subsequent process illustrated with reference to FIG. 17A, only the
first oxide layer pattern 315 and the nitride layer pattern 325 may
remain, and the second oxide layer 330 may be removed.
[0098] Referring to FIG. 14, the protection layer structure 340 may
be formed to include the first oxide layer 310 and the nitride
layer 320. Thus, in the subsequent process illustrated with
reference to FIG. 17A, only the first oxide layer pattern 315 and
the nitride layer pattern 325 may be formed. However, for
convenience the protection layer structure 340 including the first
oxide layer 310, the nitride layer 320 and the second oxide layer
330 sequentially stacked is illustrated hereinafter.
[0099] Referring to FIG. 15, a photoresist layer 350 may be formed
on the protection layer structure 340.
[0100] In example embodiments, the photoresist layer 350 may be
formed to have a top surface higher than that of a portion of the
protection layer structure 340 on the exposed portion of the
preliminary via structure 230 above the second surface 102 of the
substrate 100.
[0101] Referring to FIG. 16, the photoresist layer 350 may be
patterned by an exposure process and a development process to form
a second photoresist pattern 355 on the protection layer structure
340.
[0102] In example embodiments, the second photoresist pattern 355
may be formed to have a first opening 360 to provide an alignment
key. When the photoresist layer 350 is etched to form the second
photoresist pattern 355, the portion of the protection layer
structure 340 on the preliminary via structure 230 may be
exposed.
[0103] Referring to FIG. 17A, the protection layer structure 340
may be etched using the second photoresist pattern 355 as an
etching mask to form a protection layer pattern structure 345.
[0104] In example embodiments, by the etching process, a portion of
the protection layer structure 340 exposed by the first opening 360
may be etched to partially expose the second surface 102 of the
substrate 100. Additionally, by the etching process, the exposed
portion of the protection layer structure 340 on the preliminary
via structure 230 may be etched to expose a portion of the
preliminary via structure 230, and the exposed portion of the
preliminary via structure 230 may be also partially etched.
[0105] In example embodiments, upper portions of the insulation
layer 200 and the second barrier layer 210 may be removed, and thus
an insulation layer pattern 205 and a second barrier layer pattern
215, respectively, may be formed. The protection layer pattern
structure 345 may include the first oxide layer pattern 315, the
nitride layer pattern 325 and the second oxide layer pattern 335
sequentially stacked on the second surface 102 of the substrate
100.
[0106] In example embodiments, top surfaces of the insulation layer
pattern 205, the second barrier layer pattern 215 and the second
conductive layer 220 protruding from the second surface 102 of the
substrate 100 may be substantially coplanar with one another, and
the protection layer pattern structure 345 may surround sidewalls
of the protruding portions of the insulation layer pattern 205, the
second barrier layer pattern 215 and the second conductive layer
220.
[0107] Referring to FIGS. 17B, 17C and 17D, by the etching process,
the portion of the protection layer structure 340 exposed by the
first opening 360 may not be completely removed, and thus the
second surface 102 of the substrate 100 may not be exposed. That
is, FIG. 17B shows that portions of the second oxide layer pattern
335 and the nitride layer pattern 325 under the first opening 360
may be removed, however, a portion of the first oxide layer pattern
315 under the first opening 360 may remain. FIG. 17C shows that a
portion of the second oxide layer pattern 335 under the first
opening 360 may be removed, however, portions of the nitride layer
pattern 325 and the first oxide layer pattern 315 may remain. FIG.
17D shows that a portion of the second oxide layer pattern 335
under the first opening 360 may be partially removed and partially
remain, and portions of the nitride layer pattern 325 and the first
oxide layer pattern 360 may remain.
[0108] That is, the etching process may be performed to form an
alignment key in the protection layer structure 340, and the second
surface 102 of the substrate 100 may not be exposed if the
alignment key may be formed. However, for the convenience of
explanations, as shown in FIG. 17A, only the case in which the
second surface 120 of the substrate 100 is exposed is illustrated
hereinafter.
[0109] Referring to FIG. 18A, an upper portion of the second
conductive layer 220 may be removed to form a first recess 370a,
and thus the second conductive layer 220 may be transformed into a
second conductive pattern 225.
[0110] In example embodiments, the upper portion of the second
conductive layer 220 may be removed by a dry etching process or a
wet etching process, and a top surface of the second conductive
pattern 225 may be lower than those of the insulation layer pattern
205 and the second barrier layer pattern 215.
[0111] The second conductive pattern 225 and the second barrier
layer pattern 215 surrounding a sidewall of the second conductive
pattern 225 may form a via electrode, and the via electrode and the
insulation layer pattern 205 surrounding a sidewall of the via
electrode may form a via structure 235. A top surface of the second
conductive pattern 225 at a central portion of the via structure
235 may be lower than those of the second barrier layer pattern 215
and the insulation layer pattern 205 surrounding the sidewall of
the second conductive pattern 225, and thus the via structure 235
may have a top surface of which a central portion may be stepped
down relative to a top surface of the second barrier layer pattern
215.
[0112] Referring to FIG. 19A, when the upper portion of the second
conductive layer 220 is removed by a wet etching process to form
the first recess 370a, upper portions of the second barrier layer
pattern 215 and the insulation layer pattern 205 surrounding the
sidewall of the second conductive layer 220 may be also partially
removed by the wet etching process. Thus, a portion of the second
barrier layer pattern 215 above the second conductive pattern 225
exposed by the first recess 370a may have a gradually decreasing
width from a bottom toward a top thereof. Additionally, a portion
of the insulation layer pattern 205 adjacent to the portion of the
second barrier layer pattern 215 above the second conductive
pattern 225 exposed by the first recess 370a may have a decreasing
width from a bottom toward a top thereof. Thus, the upper portions
of the second barrier layer pattern 215 and/or the insulation layer
pattern 205 may have inner walls that are slanted.
[0113] That is, when the upper portion of the second conductive
layer 220 is removed by a dry etching process, portions of the
second barrier layer pattern 215 and/or the insulation layer
pattern 205 adjacent to the first recess 370a may have
substantially vertical sidewalls. When the upper portion of the
second conductive layer 220 is removed by a wet etching process,
the portions of the second barrier layer pattern 215 and/or the
insulation layer pattern 205 adjacent to the first recess 370a may
have gradually decreasing widths or substantially vertical
sidewalls according to the process conditions of the wet etching
process and/or the size of the first recess 370a.
[0114] Hereinafter, for the convenience of explanations, as shown
in FIG. 18A, only the second barrier layer pattern 215 and the
insulation layer pattern 205 having substantially vertical
sidewalls will be illustrated.
[0115] Referring to FIGS. 18B and 1913, when upper portions of a
plurality of second conductive layers 220 are removed by a wet
etching process, they may not be etched to the same degree
according to the positions thereof, and thus the recesses on the
second conductive patterns 225 may have different depths from each
other. That is, for example, first and second recesses 370a and
370b having different depths may be formed by the wet etching
process.
[0116] In this case, during a process for forming pads 400 (see
FIG. 25), top surfaces of the pads 400 formed on the second
conductive patterns 225 may have different heights, and
semiconductor devices having the pads 400 are shown in FIGS. 1B,
2B, 4B and 5B. That is, one of the pads 400 filling the first
recess 370a having a relatively shallow depth may have a top
surface higher than that of another of the pads 400 filling the
second recess 370b. However, for the convenience of explanations,
only the first recesses 370a having substantially the same depths
on the second conductive patterns 225 will be illustrated
hereinafter.
[0117] Referring to FIG. 20A, an upper portion of the second
conductive layer 220 may be removed to form a third recess 375a,
and a top surface of the second conductive pattern 225 may be lower
than the second surface 102 of the substrate 100.
[0118] Further referring to FIG. 21A, as similar to FIG. 19A, an
upper portion of the second conductive layer 220 may be removed by
a wet etching process to form a third recess 375a, and upper
portions of the second barrier layer pattern 215 and the insulation
layer pattern 205 may be partially removed by the wet etching
process. Thus, a portion of the second barrier layer pattern 215
above the second conductive pattern 225 exposed by the third recess
375a may have a decreasing width from a bottom toward a top
thereof, and a portion of the insulation layer pattern 205 adjacent
to the portion of the second barrier layer pattern 215 above the
second conductive pattern 225 may have a decreasing width from a
bottom toward a top thereof.
[0119] However, for the convenience of explanations, only the first
recess 370a formed by removing the upper portion of the second
conductive layer 220 is illustrated hereinafter.
[0120] Referring to FIGS. 20B and 21B, as similar to FIGS. 18B and
19B, when upper portions of a plurality of second conductive layers
220 are removed by a wet etching process, they may not be etched to
the same degree according to the positions thereof, and thus the
recesses on the second conductive patterns 225 may have different
depths from each other. That is, for example, third and fourth
recesses 375a and 375b having different depths may be formed by the
wet etching process.
[0121] In this case, during a process for forming pads 400 (see
FIG. 25), top surfaces of the pads 400 formed on the second
conductive patterns 225 may have different heights, and
semiconductor devices having the pads 400 are shown in FIGS. 3B and
6B. For the convenience of explanations, only the third recesses
375a having substantially the same depths on the second conductive
patterns 225 is illustrated hereinafter.
[0122] Referring to FIG. 22, the second photoresist pattern 355
remaining on the protection layer pattern structure 345 may be
removed.
[0123] In example embodiments, the second photoresist pattern 355
may be removed by an ashing process and/or a stripping process.
[0124] A portion of the protection layer pattern structure 345
surrounding a sidewall of the via structure 235 may have a top
surface higher than that of other portions of the protection layer
pattern structure 345. Thus, the whole top surface of the via
structure 235 together with the protection layer pattern structure
345 may not be flat but stepped, particularly toward the center of
the protection layer pattern 345.
[0125] Referring to FIG. 23, a third seed layer 380 may be
conformally formed on the via structure 235 and the protection
layer pattern structure 345, and may have an uneven top
surface.
[0126] The third seed layer 380 may be formed to include, e.g.,
copper, by a physical vapor deposition (PVD) process.
[0127] Referring to FIG. 24, a third photoresist pattern 390 may be
formed on the third seed layer 380.
[0128] In example embodiments, the third photoresist pattern 390
may be formed to have a second opening 395 exposing at least a
portion of the third seed layer 380 on the top surface of the via
structure 235. The second opening 395 may expose a portion of the
third seed layer 380 on the top surface of the portion of the
protection layer pattern structure 345 surrounding the sidewall of
the via structure 235.
[0129] Referring to FIG. 25, an electroplating process may be
performed to form the pad 400 filling the second opening 395.
[0130] In example embodiments, the electroplating process may be
performed using a plating solution including an electrolyte
solution containing nickel ion, and an additive. The additive may
include at least a leveler, and further include a suppressor and an
accelerator. The leveler may include a polymer, e.g., polyimine,
polyamide, etc., the suppressor may include a polymer, e.g.,
polyethylene glycol (PEG), and the accelerator may include an
organic sulfur compound.
[0131] The leveler may be disposed mostly at an entrance of the
second opening 395 to delay the nickel plating. The accelerator may
have a relatively small molecular size, and thus may easily
penetrate into the concave top surface of the via structure 235.
However, the suppressor may have a relatively large molecular size,
and thus may not easily penetrate into the second opening 395 and
may be disposed mostly on a top surface of the third photoresist
pattern 390. Thus, the nickel plating may be accelerated by the
accelerator in the second opening 395, and may be delayed by the
leveler and/or the suppressor at the entrance of the second opening
395 and on the third photoresist pattern 390. Accordingly, an upper
portion of the second opening 395 may not be filled before the
second opening 395 may be filled entirely, and further the pad 400
may be formed to have a flat top surface.
[0132] The bottom surface of the second opening 395, i.e., a top
surface of the third seed layer 380 may not be flat, however, the
pad 400 may have a flat top surface regardless of the profile of
the top surface of the third seed layer 380, because of the leveler
and/or the suppressor of the plating solution used in the
electroplating process.
[0133] Referring to FIG. 1 again, after removing the third
photoresist pattern 390, a portion of the third seed layer 380 not
covered by the pad 400 may be removed.
[0134] In example embodiments, the third photoresist pattern 390
may be removed by an ashing process and/or a stripping process, and
the third seed layer 380 may be partially removed to form a seed
pattern 385. The seed pattern 385 and the pad 400 sequentially
stacked may form a pad structure.
[0135] As illustrated above, in example embodiments, after forming
the protection layer structure 340 on the exposed preliminary via
structure 230 above the second surface 102 of the substrate 100, no
CMP process may be performed to expose the preliminary via
structure 230. Rather, in some embodiments, via structure 235 may
be partially removed by a wet etching process and an electroplating
process using a plating solution including a leveler may be
performed to form a pad having a flat to surface on the TSV. Thus,
the via structure 235 may not be damaged, and the cost for
performing the CMP process may be reduced.
[0136] Even though the third seed layer 380 may have the uneven top
surface as the upper portion of the preliminary via structure 230
may be removed by a wet etching process, the plating solution used
in the electroplating process may include the leveler and/or the
suppressor, and thus the pad 400 formed by the electroplating
process may have the flat top surface. Thus, when a conductive bump
is formed on the pad 400 so that the chip including the
semiconductor device may be electrically connected to another chip,
the connection between the pad 400 and the conductive bump may be
good, and thus a semiconductor package including the semiconductor
device may have good electrical characteristics.
[0137] FIGS. 26A, 27A and 28A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as or similar to those of FIGS. 1A, 2A and 3A, respectively,
except for the shape of the via structure.
[0138] Referring to FIG. 26A, the semiconductor device may include
a via structure 235, a protection layer pattern structure 345 and a
pad structure.
[0139] The via structure 235 may be formed through the first and
second insulating interlayers 160 and 180 and a substrate 100, and
a portion of the via structure 235 may be exposed above a second
surface 102 of the substrate 100. The via structure 235 may have a
top surface of which a central portion may be concave (or stepped
toward the center).
[0140] In example embodiments, the via structure 235 may include a
via electrode and an insulation layer pattern 205 surrounding a
sidewall of the via electrode. The via electrode may include a
second conductive pattern 225 and a second barrier layer pattern
215 surrounding a sidewall of the second conductive pattern
225.
[0141] In example embodiments, top surfaces of the second
conductive pattern 225 and the second barrier layer pattern 215 may
be lower than that of the insulation layer pattern 205, and the top
surfaces of the second conductive pattern 225 and the second
barrier layer pattern 215 may be substantially coplanar with each
other. Referring to FIG. 28A, the top surfaces of the second
conductive pattern 225 and the second barrier layer pattern 215 may
be lower than the second surface 102 of the substrate 100.
[0142] FIG. 27A shows that the protection layer pattern structure
345 may include only a first oxide layer pattern 315 and a nitride
layer pattern 325 sequentially stacked on the second surface 102 of
the substrate 100.
[0143] Each of the pad structures of the semiconductor devices
shown in FIGS. 26A, 27A and 28A may have an uneven bottom surface
but have a flat top surface, as those of the semiconductor devices
shown in FIGS. 1A, 2A and 3A, and thus the connection between the
pad structure and a conductive bump may be good. Thus, a
semiconductor package including the semiconductor device may have
good electrical characteristics.
[0144] FIGS. 26B, 27B and 28B are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as those of FIGS. 26A, 26B and 27B, respectively, except for
the heights of the second conductive pattern and the pad.
[0145] Referring to FIGS. 26B, 27B and 28B, each of the
semiconductor devices may include a plurality of second conductive
patterns 225, and at least some of the second conductive patterns
225 may have top surfaces at different heights, and
correspondingly, at least some of pads 400 may have top surface at
different heights.
[0146] FIGS. 29 to 31 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments. This method may include processes
substantially the same as or similar to those of the method
illustrated with reference to FIGS. 7 to 25.
[0147] First, processes substantially the same as or similar to
those illustrated with reference to FIGS. 7 to 16 may be
performed.
[0148] Referring to FIG. 29, the protection layer structure 340 may
be etched using a second photoresist pattern 355 as an etching mask
to form a protection layer pattern structure 345.
[0149] In example embodiments, by the etching process, a portion of
the protection layer structure 340 on the preliminary via structure
230 may be etched to expose the preliminary via structure 230, and
the exposed portion of the preliminary via structure 230 may be
also partially etched.
[0150] In example embodiments, an upper portion of the insulation
layer 200 in the preliminary via structure 230 may be removed to
form an insulation layer pattern 205, while an upper portion of the
second barrier layer 210 may not be removed due to the etching
selectivity with respect to the protection layer structure 340 or
the insulation layer 200.
[0151] Referring to FIG. 30, upper portions of the second barrier
layer 210 and the second conductive layer 220 may be removed to
form a first recess 370a, and thus the second barrier layer 210 and
the second conductive layer 220 may be transformed into a second
barrier layer pattern 215 and a second conductive pattern 225,
respectively.
[0152] In example embodiments, the upper portions of the second
barrier layer 210 and the second conductive layer 220 may be
removed by a wet etching process, and top surfaces of the second
barrier layer pattern 215 and the second conductive pattern 225
formed by the wet etching process may be lower than that of the
insulation layer pattern 205. The top surfaces of the second
barrier layer pattern 215 and the second conductive pattern 225 may
be substantially the same as each other.
[0153] The second conductive pattern 225 and the second barrier
layer pattern 215 surrounding a sidewall of the second conductive
pattern 225 may form a via electrode, and the via electrode and the
insulation layer pattern 205 surrounding a sidewall of the via
electrode may form a via structure 235. The top surfaces of the
second conductive pattern 225 and the second barrier layer pattern
215 at a central portion of the via structure 235 may be lower than
that of the insulation layer pattern 205 surrounding the second
conductive pattern 225 and the second barrier layer pattern 215,
and thus the via structure 235 may have a whole top surface of
which a central portion may be concave (i.e., stepped toward the
central portion).
[0154] Referring to FIG. 31, upper portions of the second barrier
layer 210 and the second conductive layer 220 may be removed to
form a third recess 375a, and top surfaces of the second conductive
pattern 225 and the second barrier layer pattern 215 may be lower
than the second surface 102 of the substrate 100.
[0155] Then, processes substantially the same as or similar to
those illustrated with reference to FIGS. 22 to 25 and FIGS. 1A, 2A
and 3A may be performed to complete the semiconductor device of
FIGS. 26 to 28.
[0156] As the method of manufacturing the semiconductor device
illustrated with reference to FIGS. 7 to 25, in the method of
manufacturing the semiconductor device illustrated with reference
to FIGS. 29 to 31, after forming the protection layer structure 340
on the exposed preliminary via structure 230 above the second
surface 102 of the substrate 100, no CMP process may be performed
to expose the preliminary via structure 230. Additionally, even
though the third seed layer 380 may have the uneven top surface as
the upper portion of the preliminary via structure 230 may be
removed by a wet etching process, the plating solution used in the
electroplating process may include the leveler and/or the
suppressor, and thus the pad 400 formed by the electroplating
process may have the flat top surface.
[0157] FIGS. 32A, 33A and 34A are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as or similar to those of FIGS. 1A, 2A and 3A, respectively,
except for the shape of the via structure.
[0158] Referring to FIG. 32A, the semiconductor device may include
a via structure 235, a protection layer pattern structure 345 and a
pad structure.
[0159] The via structure 235 may be formed through the first and
second insulating interlayers 160 and 180 and a substrate 100, and
a portion of the via structure 235 may be exposed above a second
surface 102 of the substrate 100.
[0160] In example embodiments, the via structure 235 may include a
via electrode and an insulation layer pattern 205 surrounding a
sidewall of the via electrode. The via electrode may include a
second conductive pattern 225 and a second barrier layer pattern
215 surrounding a sidewall of the second conductive pattern 225. In
example embodiments, top surfaces of the second conductive pattern
225, the second barrier layer pattern 215 and the insulation layer
pattern 205 may substantially coplanar with each other.
[0161] The protection layer pattern structure 345 may be formed on
the second surface 102 of the substrate 100, and cover a sidewall
of the exposed portion of the via structure 235. The protection
layer pattern structure 345 may have a top surface higher than that
of the via structure 235. Thus, the protection layer pattern
structure 345 may partially surround a lower portion of the pad
structure on the exposed via structure 235.
[0162] Referring to FIG. 33A, the protection layer pattern
structure 345 may include only the first oxide layer pattern 315
and the nitride layer pattern 325 sequentially stacked on the
second surface 102 of the substrate 100.
[0163] Referring to FIG. 34A, the semiconductor device may include
a via structure 235, a protection layer pattern structure 345 and a
pad structure.
[0164] The via structure 235 may be formed through the first and
second insulating interlayers 160 and 180 and a portion of a
substrate 100.
[0165] In example embodiments, the via structure 235 may include a
via electrode and an insulation layer pattern 205 surrounding a
sidewall of the via electrode. The via electrode may include a
second conductive pattern 225 and a second barrier layer pattern
215 surrounding a sidewall of the second conductive pattern 225. In
example embodiments, top surfaces of the second conductive pattern
225, the second barrier layer pattern 215 and the insulation layer
pattern 205 may substantially coplanar with each other and lower
than the second surface 102 of the substrate 100.
[0166] The protection layer pattern structure 345 may be formed on
the second surface 102 of the substrate 100, and may not vertically
overlap the via structure 235.
[0167] The pad structure may be formed through a portion of the
substrate 100, and may contact top surfaces of the via structure
235 and the protection layer pattern structure 345. A lower portion
of the pad structure on the via structure 235 may be partially
surrounded by the protection layer pattern structure 345.
[0168] Each of the pad structures shown in FIGS. 32A, 33A and 34A,
as those illustrated with reference to FIGS. 1A, 2A and 3A, may
have an uneven bottom surface, however, may have a flat top
surface, and thus, when a conductive bump is formed on the top
surface of the pad structure, the connection between the pad
structure and the conductive bump may be good.
[0169] FIGS. 32B, 33B and 34B are cross-sectional views
illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as those of FIGS. 32A, 32B and 32B, respectively, except for
the heights of the second conductive pattern and the pad.
[0170] Referring to FIGS. 32B, 33B and 34B, each of the
semiconductor devices may include a plurality of second conductive
patterns 225, and at least some of the second conductive patterns
225 may have top surfaces at different heights, and
correspondingly, at least some of pads 400 may have top surface at
different heights.
[0171] FIGS. 35 to 37 are cross-sectional views illustrating a
method of manufacturing a semiconductor device in accordance with
example embodiments. This method may include processes
substantially the same as or similar to those of the method
illustrated with reference to FIGS. 7 to 25.
[0172] First, processes substantially the same as or similar to
those illustrated with reference to FIGS. 7 to 16 may be
performed.
[0173] Referring to FIG. 35, the protection layer structure 340 may
be etched using a second photoresist pattern 355 as an etching mask
to form a protection layer pattern structure 345.
[0174] In example embodiments, by the etching process, a portion of
the protection layer structure 340 on the preliminary via structure
230 may be etched to expose the preliminary via structure 230.
[0175] Referring to FIG. 36, upper portions of the insulation layer
200, the second barrier layer 210 and the second conductive layer
220 may be removed to form a first recess 370a, and thus the
insulation layer 200, the second barrier layer 210 and the second
conductive layer 220 may be transformed into an insulation layer
pattern 205, a second barrier layer pattern 215 and a second
conductive pattern 225, respectively.
[0176] In example embodiments, the upper portions of the insulation
layer 200, the second barrier layer 210 and the second conductive
layer 220 may be removed by a wet etching process, and top surfaces
of the insulation layer pattern 205, the second barrier layer
pattern 215 and the second conductive pattern 225 formed by the wet
etching process may be lower than that of the insulation layer
pattern 205. The top surfaces of the insulation layer pattern 205,
the second barrier layer pattern 215 and the second conductive
pattern 225 may be substantially the same as each other.
[0177] The second conductive pattern 225 and the second barrier
layer pattern 215 surrounding a sidewall of the second conductive
pattern 225 may form a via electrode, and the via electrode and the
insulation layer pattern 205 surrounding a sidewall of the via
electrode may form a via structure 235.
[0178] Referring to FIG. 37, upper portions of the insulation layer
200, the second barrier layer 210 and the second conductive layer
220 may be removed to form a third recess 375a, and top surfaces of
the insulation layer pattern 205, the second conductive pattern 225
and the second barrier layer pattern 215 may be lower than the
second surface 102 of the substrate 100.
[0179] Then, processes substantially the same as or similar to
those illustrated with reference to FIGS. 22 to 25 and FIGS. 1A, 2A
and 3A may be performed to complete the semiconductor device of
FIGS. 32A, 33A and 34A.
[0180] FIGS. 38A, 39A, 40A, 41A, 42A and 43A are cross-sectional
views illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as or similar to those of FIGS. 1A, 2A and 3A, or FIGS. 26A,
27A and 28A, or FIGS. 32A, 33A and 34A, except for the shape of the
protection layer pattern structure. Particularly, the semiconductor
devices of FIGS. 38A, 39A, 40A, 41A, 42A and 43A may be
substantially the same as or similar to those of FIGS. 1A, 3A, 26A,
28A, 32A and 34A, respectively, except for the shape of the
protection layer pattern structure.
[0181] Referring to FIG. 38A, the semiconductor device may include
a via structure 235, a protection layer pattern structure 344 and a
pad structure.
[0182] The via structure 235 may be formed through the first and
second insulating interlayers 160 and 180 and a substrate 100, and
a portion of the via structure 235 may be exposed above a second
surface 102 of the substrate 100. The via structure 235 may have a
top surface of which a central portion may be concave (i.e.,
stepped toward a central portion).
[0183] The protection layer pattern structure 344 may be formed on
the second surface 102 of the substrate 100, and may surround a
sidewall of the exposed portion of the via structure 235. In
example embodiments, a top surface of the protection layer pattern
structure 344 may be substantially coplanar with a top surface of a
peripheral portion of the via structure 235, and may have a height
substantially constant regardless of the position thereof.
[0184] In example embodiments, the protection layer pattern
structure 344 may include a photosensitive organic material. Thus,
the protection layer pattern structure 344 may include a
thermosetting organic polymer and a photosensitive material. The
thermosetting organic polymer may include, e.g., polyimide,
novolac, polybenzoxazole, benzocyclobutene, silicon polymer, epoxy
polymer, acrylate polymer, etc., and the photosensitive material
may include, e.g., a positive photosensitive material.
[0185] In example embodiments, as shown in FIG. 3 8A, the
protection layer pattern structure 344 may include a single layer.
In other example embodiments, the protection layer pattern
structure 344 may include a plurality of layers sequentially
stacked, and each layer may include not only the photosensitive
organic polymer but also an oxide or a nitride.
[0186] The pad structure may have a convex (or protruding) bottom
surface corresponding to the concave (or stepped) top surface of
the via structure 235, however, may have a flat top surface.
[0187] The semiconductor devices of FIGS. 39A, 40A, 41A, 42A and
43A may be substantially the same as those of FIGS. 3A, 26A, 28A,
32A and 34A, respectively, except they may include the protection
layer pattern structure 344 shown in FIG. 38A.
[0188] FIGS. 38B, 39B, 40B, 41B, 42B and 43B are cross-sectional
views illustrating semiconductor devices in accordance with example
embodiments. The semiconductor devices may be substantially the
same as or similar to those of FIGS. 38A, 39A, 40A, 41A, 42A and
43A, except for the heights of the second conductive pattern and
the pad.
[0189] Referring to FIGS. 38B, 39B, 40B, 41B, 42B and 43B, each of
the semiconductor devices may include a plurality of second
conductive patterns 225, and at least some of the second conductive
patterns 225 may have top surfaces at different heights, and
correspondingly, at least some of the pads 400 may have top
surfaces at different heights.
[0190] FIGS. 44 to 48 are cross-sectional views illustrating stages
of a method of manufacturing a semiconductor device in accordance
with example embodiments. This method may include processes
substantially the same as or similar to those of the method
illustrated with reference to FIGS. 7 to 25.
[0191] First, processes substantially the same as or similar to
those illustrated with reference to FIGS. 7 to 16 may be
performed.
[0192] Referring to FIG. 44, a protection layer structure 342 may
be formed on the second surface 102 of the substrate 100 and the
exposed portion of the preliminary via structure 230.
[0193] In example embodiments, the protection layer structure 342
may be formed by dissolving a photosensitive organic insulating
material into a solution to form a compound, coating the compound
onto the second surface 102 of the substrate 100 by, e.g., a
spin-on coating process, and soft-baking the coated compound.
[0194] The compound may include a thermosetting organic polymer and
a photosensitive material. The thermosetting organic polymer may
not be limited to a specific material if it is a thermosetting
resin having insulation characteristics. For example, the
thermosetting organic polymer may include polyimide, novolac,
polybenzoxazole, benzocyclobutene, silicon polymer, epoxy polymer,
acrylate polymer, etc. The photosensitive material may include,
e.g., a positive photosensitive material.
[0195] The compound may further include a cross linking agent, a
hardening catalyst, and a photoactid generator (PAG).
[0196] Referring to FIG. 45, an exposure process and a development
process may be performed on the protection layer structure 342 to
form a first opening 360 for forming an alignment key, and a
portion of the protection layer structure 342 on the preliminary
via structure 230 may be also etched to expose the preliminary via
structure 230.
[0197] By the exposure process and the development process, the
protection layer structure 342 may be transformed into a protection
layer pattern structure 344. After the exposure process and the
development process, a portion of the exposed preliminary via
structure 230 may be further etched.
[0198] In example embodiments, upper portions of the insulation
layer 200 and the second barrier layer 210 of the preliminary via
structure 230 may be removed to form an insulation layer pattern
205 and a second barrier layer pattern 215, respectively.
[0199] In example embodiments, top surfaces of the insulation layer
pattern 205, the second barrier layer pattern 215, and the second
conductive layer 220 exposed above the second surface 102 of the
substrate 100 may be substantially the same as one another, and the
protection layer pattern structure 344 may surround sidewalls
thereof.
[0200] Referring to FIG. 46, the substrate 100 may be heated to
harden or cure the protection layer pattern structure 344.
[0201] In example embodiments, the protection layer pattern
structure 344 may be cured or hardened at a temperature equal to or
more than about 100.degree. C. However, the curing temperature may
not be limited thereto, and may be changed according to the
thermosetting organic polymer of the compound in the protection
layer pattern structure 344.
[0202] FIG. 47 shows that only an upper portion of the insulation
layer 200 of the exposed preliminary via structure 230 may be
removed after the exposure process and the development process
illustrated with reference to FIG. 45, and FIG. 48 shows that no
etching process may be performed on the exposed preliminary via
structure 230 after the exposure process and the development
process. That is, the exposed preliminary via structure 230 may be
partially etched, or may not be etched, after the exposure process
and the development process.
[0203] Then, processes substantially the same as or similar to
those illustrated with reference to FIGS. 18 to 25 may be
performed.
[0204] FIGS. 49 to 51 are cross-sectional views illustrating
semiconductor packages in accordance with example embodiments. Each
of the semiconductor packages may include semiconductor devices
illustrated with reference to FIGS. 1 to 6, FIGS. 26 to 28, FIGS.
32 to 34, and FIGS. 38 to 43, however, only the semiconductor
packages including the semiconductor devices of FIGS. 1A, 2A and 3A
will be illustrated herein. That is, the semiconductor packages of
FIGS. 49 to 51 may include first semiconductor chips containing the
semiconductor devices of FIGS. 1A, 2A and 3A, respectively.
[0205] Referring to FIG. 49, the semiconductor package may include
first and second semiconductor chips sequentially stacked on a
package substrate 600. The semiconductor package may further
include first and second conductive bumps 280 and 420, a molding
member 410, and an external connection terminal 650.
[0206] The package substrate 600 may be an insulation substrate on
which circuit patterns may be formed, e.g., a printed circuit board
(PCB). The external connection terminal 650 may be formed beneath
the package substrate 600, and thus the semiconductor package may
be configured to mount on a module substrate via the external
connection terminal 650.
[0207] The first semiconductor chip may be mounted on the package
substrate 600 via the first conductive bump 280, and may have a
structure substantially the same as or similar to that of the
semiconductor device of FIG. 1A.
[0208] In an example embodiment, the first semiconductor chip may
be a chip having logic devices, e.g., a central processing unit
(CPU), an application processor (AP), etc.
[0209] The second semiconductor chip may include an upper substrate
500 having a conductive pad 510 at a lower portion thereof, and
various types of circuit elements may be formed on the upper
substrate 500. In an example embodiment, the second semiconductor
chip may be a chip having a dynamic random access memory (DRAM)
device, a static random access memory (SRAM) device, a flash memory
device, etc.
[0210] The first and second semiconductor chips may be electrically
connected to each other via a pad structure, the second conductive
bump 420, and the conductive pad 510, and the molding member 410
may be formed between the first and second semiconductor chips. The
molding member 410 may include, e.g., epoxy molding compound
(EMC).
[0211] The foregoing is illustrative of example embodiments and is
not to be construed as limiting thereof. Although a few example
embodiments have been described, those skilled in the art will
readily appreciate that many modifications are possible in the
example embodiments without materially departing from the novel
teachings and advantages of the present inventive concept.
Accordingly, all such modifications are intended to be included
within the scope of the present inventive concept as defined in the
claims. In the claims, means-plus-function clauses are intended to
cover the structures described herein as performing the recited
function and not only structural equivalents but also equivalent
structures.
* * * * *