U.S. patent application number 14/468443 was filed with the patent office on 2016-03-03 for n-propyl bromide solvent systems.
The applicant listed for this patent is Cressie E. Holcombe, JR.. Invention is credited to Cressie E. Holcombe, JR..
Application Number | 20160060439 14/468443 |
Document ID | / |
Family ID | 55275327 |
Filed Date | 2016-03-03 |
United States Patent
Application |
20160060439 |
Kind Code |
A1 |
Holcombe, JR.; Cressie E. |
March 3, 2016 |
N-PROPYL BROMIDE SOLVENT SYSTEMS
Abstract
A solvent composition and system is disclosed having a
composition including n-propyl bromide and a propionate containing
liquid and/or a butyrate containing liquid. The solvent system may
include approximately 35 to 92.5 weight percent propionate
containing liquid and approximately 7.5 to 65 weight percent
n-propyl bromide. Alternatively, the solvent system may include
approximately 40 to 85 weight percent butyrate containing liquid
and 15 to 60 weight percent n-propyl bromide. The solvent system
may incorporate a polymer, such as a synthetic rubber polymer.
Further the solvent system preferably has high solvency while
maintaining desirable evaporation rates and is preferably
nonflammable, combustible, or minimally a class IC flammable
liquid.
Inventors: |
Holcombe, JR.; Cressie E.;
(Knoxville, TN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Holcombe, JR.; Cressie E. |
Knoxville |
TN |
US |
|
|
Family ID: |
55275327 |
Appl. No.: |
14/468443 |
Filed: |
August 26, 2014 |
Current U.S.
Class: |
510/412 ;
106/18.11; 106/18.35; 106/285; 252/364; 516/6 |
Current CPC
Class: |
C08L 1/02 20130101; C11D
7/5018 20130101; C09D 101/28 20130101; C08L 39/06 20130101; C09D
7/20 20180101; C09D 5/00 20130101; C09K 3/30 20130101; C11D 3/3749
20130101; C11D 7/266 20130101; C08L 1/28 20130101; C08L 21/00
20130101; C09J 101/28 20130101 |
International
Class: |
C08L 21/00 20060101
C08L021/00; C09D 7/00 20060101 C09D007/00; C11D 7/50 20060101
C11D007/50; C09K 3/30 20060101 C09K003/30 |
Claims
1. (canceled)
2. (canceled)
3. The solvent system of claim 7 wherein said propionate containing
liquid is hexyl propionate.
4. The solvent system of claim 7 wherein said mixture is
nonflammable.
5. The solvent system of claim 7 wherein said mixture has a
Kauri-Butanol solvency power greater than 75.
6. The solvent system of claim 7 wherein said mixture has a
Kauri-Butanol solvency power greater than 100.
7. A solvent system comprising a miscible solvent mixture
comprising n-propyl bromide, a propionate containing liquid and a
synthetic rubber, wherein the solvent mixture dissolves the
synthetic rubber to form a liquid rubber.
8. The solvent system of claim 7 wherein said system comprises 30
to 50 weight percent propionate containing liquid.
9. The solvent system of claim 7 wherein said system is used as a
liquid rubber agent.
10. The solvent system of claim 7 wherein said system is used as a
paint carrier.
11. The solvent system of claim 7 wherein said system is applied to
a metal surface and reduces tarnishing on said surface.
12. The solvent system of claim 7 wherein said system is used as a
bonding-agent.
13. The solvent system of claim 12 wherein said system is a bonding
agent for a polymer material comprising
styrene-block-copolymer.
14. The solvent system of claim 7 wherein said composition further
comprises functional additives selected from a tackifier,
antioxidant, UV-stabilizer, surfactants, plasticizers, dispersants,
biocides, binders, suspenders, extenders, flame retardants,
blocking agents, lubricants, rubber compounding agents, and plastic
compounding agents.
15. (canceled)
16. (canceled)
17. The solvent system of claim 7 wherein said system further
comprises a nonflammable propellant and said composition is
incorporated into an aerosol can.
18. The solvent system of claim 7 wherein said system further
comprises additives selected from a cellulosic,
polyvinylpyrrolidone, and organo-clay.
19-27. (canceled)
28-48. (canceled)
49. A method of controlling the vaporization rate of n-propyl
bromide in forming a liquid rubber comprising the steps of:
Providing an n-propyl bromide liquid having a first vaporization
rate; Providing a propionate containing liquid or a butyrate
containing liquid; Providing a synthetic rubber polymer; Combining
said n-propyl bromide liquid with said propionate containing liquid
or said butyrate containing liquid; and Adjusting the amounts of
said propionate containing liquid or said butyrate containing
liquid to form a solvent mixture having a second vaporization rate
less than said first vaporization rate of said n-propyl bromide
liquid, and Dissolving said synthetic rubber polymer in said
solvent mixture.
50. A method of reducing the amount of n-propyl bromide in a
solvent while maintaining solvency power and forming a liquid
rubber comprising the steps of: Providing an n-propyl bromide
liquid having a specified solvency power; Providing a propionate
containing liquid or a butyrate containing liquid; Providing a
synthetic rubber polymer; Combining said propionate containing
liquid or said butyrate containing liquid to said n-propyl bromide
liquid; Adjusting the amounts of said propionate containing liquid
or said butyrate containing liquid to form a solvent mixture having
a reduced amount of n-propyl bromide liquid while maintaining at
least said specified solvency power; and Dissolving said synthetic
rubber polymer in said solvent mixture.
Description
BACKGROUND
[0001] The present invention relates generally to the field of
solvents. More particularly, the present invention relates to
n-propyl bromide based solvent compositions and systems that have
high solvency powers while maintaining desirable evaporation rates.
Further, the solvent compositions and systems are preferably
capable of dissolving polymers such as synthetic rubber polymers.
Furthermore, the solvent compositions and systems of the present
invention are preferably classed as nonflammable, combustible, or,
minimally, as class IC flammable liquids, are preferably safe and
relatively environmentally friendly, and have various uses.
[0002] Solvents are traditionally used for cleaning, degreasing,
coating, and bonding or debonding and are frequently used in
connection with ultrasonic cleaning and vapor cleaning. Solvent
systems have been significantly restricted over the past couple of
decades dues to environmental and safety concerns. For example, it
is highly preferred that solvents have a high flash point, have low
toxicity, have little global warming potential, and produce low or
no hazardous air pollutants and VOCs. Further, stricter
environmental controls, such as in Europe, have necessitated no or
low flammability, safer, and more environmentally-friendly
solvents.
[0003] Further, the use of polymers such as synthetic rubber
polymers is extensive. For example, synthetic rubber polymers are
frequently used in adhesives, sealants, and coatings. Liquid
formulations of synthetic rubber polymers have been used that
incorporate high solvency solvents, such as toluene, to dissolve
the polymer to a liquid solvent system that incorporates both the
solvent and the polymer. Known solvent compositions for dissolving
such polymers, however, are highly flammable and have significant
health and environmental concerns. Thus, the resulting liquid
solvent systems are also flammable and have significant health and
environmental concerns. Combustible and nonflammable materials are
preferred for having less shipping/handling requirements compared
with Flammable materials.
[0004] Thus, there is a need for a solvent composition and system
that has high solvency power over a wide range of evaporation rates
and is capable of dissolving polymers, such as synthetic rubber
polymers, and is nonflammable or has low flammability.
SUMMARY
[0005] The present invention includes a solvent system. In one
embodiment of the invention, the solvent system includes a mixture
having n-propyl bromide and a propionate containing liquid. Such a
mixture may include approximately 35 to 92.5 weight percent
propionate containing liquid and 7.5 to 65 weight percent n-propyl
bromide. Alternatively, the mixture includes between 80 to 90
weight percent of a propionate containing liquid and between 10 to
20 weight percent n-propyl bromide. In another embodiment, the
mixture includes between 65 to 75 weight percent of a propionate
containing liquid and between 25 to 35 weight percent n-propyl
bromide. In yet another embodiment, the mixture includes between 35
to 45 weight percent of a propionate containing liquid and between
55 to 65 weight percent n-propyl bromide.
[0006] In an alternative embodiment of the present invention, the
solvent system includes a mixture having n-propyl bromide and a
butyrate containing liquid. Such a mixture may include
approximately 40 to 85 weight percent butyrate containing liquid
and 15 to 60 weight percent n-propyl bromide. Alternatively, the
mixture may include approximately 40 to 75 weight percent butyrate
containing liquid and 25 to 60 weight percent n-propyl bromide. In
yet another embodiment, the mixture may include approximately 40 to
70 weight percent butyrate containing liquid and 30 to 60 weight
percent n-propyl bromide.
[0007] The solvent system may be nonflammable and preferably has a
solvency power greater than 75 based upon its Kauri Butanol value.
The solvency power is even more preferably greater than 100 based
upon its Kauri Butanol value. Moreover, the solvent system may
include a synthetic rubber, wherein the solvent mixture dissolves
the synthetic rubber to form a liquid rubber. In one embodiment of
the invention that includes a synthetic rubber, the solvent system
includes approximately 30 to 50 weight percent propionate
containing liquid. In another embodiment that includes synthetic
rubber, the solvent system includes approximately 30 to 50 weight
percent butyrate containing liquid.
[0008] The solvent system of the present invention may have a wide
variety of uses including use as a liquid rubber agent, a paint
carrier, a cleaning agent, a debonder, a bonding agent, or to
reduce tarnishing on a metal surface. The solvent system may
further include functional additives such as a tackifier,
antioxidant, UV-stabilizer, surfactants, plasticizers, dispersants,
biocides, binders, suspenders, extenders, flame retardants,
blocking agents, lubricants, rubber compounding agents, and plastic
compounding agents. Additional additives that may be incorporated
in the solvent system of the present invention include cellulosic,
polyvinylpyrrolidone, and organo-clay. In one embodiment of the
present invention the solvent system includes a nonflammable
propellant for incorporation of the system into an aerosol can.
[0009] The present invention also includes a method of controlling
the vaporization rate of n-propyl bromide. The method includes the
steps of providing an n-propyl bromide liquid having a first
vaporization rate and also providing a propionate containing liquid
or a butyrate containing liquid. The method further includes the
steps of combining the n-propyl bromide liquid with the propionate
containing liquid or the butyrate containing liquid and adjusting
the amounts of the propionate containing liquid or the butyrate
containing liquid to obtain a second vaporization rate less than
the first vaporization rate of the n-propyl bromide liquid.
[0010] Furthermore, the present invention includes a method of
reducing the amount of n-propyl bromide in a solvent while
maintaining solvency power. The method includes the steps of
providing an n-propyl bromide liquid having a specified solvency
power and also providing a propionate containing liquid or a
butyrate containing liquid. The method further includes the steps
of combining the propionate containing liquid or the butyrate
containing liquid to the n-propyl bromide liquid and adjusting the
amounts of the propionate containing liquid or the butyrate
containing liquid to reduce the amount of n-propyl bromide liquid.
Further, the method includes the step of maintaining at least the
specified solvency power of the n-propyl bromide.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematic diagram of boiling point versus
percent concentration of amyl butyrate and n-propyl bromide.
[0012] FIG. 2 is a schematic diagram of boiling point versus
percent concentration of hexyl propionate and n-propyl bromide.
[0013] FIG. 3 is a schematic diagram of boiling point versus
percent concentration of n-butyl n-butyrate and n-propyl
bromide.
DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS
[0014] The present invention relates to solvent compositions and
systems. More particularly, the present invention relates to
n-propyl bromide based solvents and systems that preferably have
high flash points and are relatively environmentally friendly.
Further, the solvent compositions of the present invention have
high solvency rates and are preferably capable of dissolving
polymers such as synthetic rubbers including
styrene-block-copolymers. The components of the solvent
compositions and systems of the present invention may also be
varied to yield desired evaporation rates and drying times.
[0015] The solvent compositions and systems of the present
invention may have various uses. For example, particular solvent
compositions and systems may be used as cleaning agents,
protectants, coatings, sealants, and/or adhesives. Moreover, as
discussed above, the solvent compositions and systems of the
present invention may be used to dissolve polymers such as
styrene-block-copolymers and may incorporate such polymers for use
as a liquid rubber agent, paint carrier, cleaning agent, debonder,
and/or bonding-agent. Further, the solvent composition and polymer
solvent system of the present invention may also be combined with
various other components such as suspenders, binders, additives,
propellants, and/or fillers for a myriad of additional uses.
[0016] The solvent compositions and systems of the present
invention are related to the solvent compositions and systems of
U.S. patent application Ser. No. 14/069,942 titled Miscible Solvent
System and Method for Making Same and U.S. patent application Ser.
No. 14/230,791 titled Nonflammable Solvent Compositions for
Dissolving Polymers and Resulting Solvent Systems. These
applications are incorporated herein by reference in their
entirety.
[0017] Unless otherwise stated, the following terms used in the
specification and claims have the meanings given below.
[0018] As used herein unless otherwise stated, the term "flash
point" refers to the lowest temperature at which a material can
vaporize to form an ignitable mixture in air.
[0019] As used herein unless otherwise state, the term "cloud
point" refers to the composition at which combined components are
no longer miscible and the composition becomes cloudy. The cloud
point as used herein is determined at ambient temperature.
[0020] While various classifications and regulations may vary and
differ in assessment and description of flammability and
combustibility, below are flammability and combustibility
classifications as used herein.
[0021] As used herein unless otherwise stated, the term "flammable"
refers to liquids with a flash point less than about 100 degree
Fahrenheit (38 degrees Celsius) when an ignition source is used.
The designation of "flammable" herein therefore includes current
Environmental Protection Agency (EPA) flammability classifications
for Class IA liquids (flash point below 73 degrees Fahrenheit (23
degrees Celsius) and boiling point below 100 degrees Fahrenheit (38
degrees Celsius)), Class IB liquids (flash point below 73 degrees
Fahrenheit (23 degrees Celsius) and boiling point at or above 100
degrees Fahrenheit (38 degrees Celsius)), and Class IC liquids
(flash point at or above 73 degrees Fahrenheit (23 degrees Celsius)
and below 100 degrees Fahrenheit (38 degrees Celsius)).
[0022] As used herein unless otherwise stated, the term
"combustible" refers to liquids with a flash point less than about
140 degrees Fahrenheit (60 degrees Celsius) but greater than about
100 degree Fahrenheit (38 degrees Celsius). The designation of
"combustible" herein therefore includes current EPA flammability
classifications for class II liquids (flash point at or above 100
degrees Fahrenheit (38 degrees Celsius) and below 140 degrees
Fahrenheit (60 degrees Celsius)).
[0023] As used herein unless otherwise stated, the term
"nonflammable" refers to liquids with a flash point greater than
about 140 degree Fahrenheit (60 degrees Celsius). The designation
of "nonflammable" herein therefore includes current EPA
flammability classifications for class III liquids including both
class IIIA liquids (flash point at or above 140 degrees Fahrenheit
(60 degrees Celsius) and below 200 degrees Fahrenheit (93 degrees
Celsius)) and class IIIB liquids (flash point at or above 200
degrees Fahrenheit (93 degrees Celsius)).
[0024] The solvent compositions and systems of the present
invention are generally composed of at least two primary
components: (1) n-propyl bromide and (2) a propionate and/or a
butyrate. Further, the solvent systems of the present invention may
also include a polymer such as a synthetic rubber polymer and/or an
acrylic polymer.
[0025] N-propyl bromide (CAS 106-94-5), also commonly called
1-bromopropane and denoted as n-PB and 1-BP, is a colorless liquid
having a molecular formula CH.sub.3CH.sub.2CH.sub.2Br or
C.sub.3H.sub.7Br. EnSolv CW.TM. is a band name of a readily
available n-propyl bromide liquid made up of approximately 95
percent n-propyl bromide. N-propyl bromide has a low boiling point
of 159 degrees Fahrenheit (71 degrees Celsius) and therefore has a
fast evaporation and drying rate. N-propyl bromide is often
reported as having no flash point thereby resulting in it being
frequently classed as a nonflammable liquid. Further, n-propyl
bromide has a Kauri-Butanol Value (KB value) of 125 and is capable
of dissolving styrene block copolymers such as
Styrene-Ethylene/Butylene-Styrene (SEBS) as well as acrylic
polymers such as methyl methacrylate copolymer.
[0026] N-propyl bromide is widely used in industrial applications
as a solvent and vapor cleaner. Because of n-propyl bromide's low
boiling point and fast evaporation/drying rate, it is frequently
ineffective at dissolving impurities when used alone as a cleaner.
Furthermore, there are significant reported safety concerns
regarding the use of n-propyl bromide. For example, it has been
reported that excessive exposure to n-propyl bromide can cause eye,
airway, and skin irritation as well as damage to the nervous
system. Further, n-propyl bromide is being considered for
classification as a human carcinogen and has been listed as a
hazardous substance because of potential links to neurological
illnesses in humans as well as cancer and reproductive disorders in
animals.
[0027] Various propionates and butyrates may be used in the solvent
compositions and systems of the present invention. Example
propionates include, but are not limited to, isoamyl propionate
(CAS 105-68-0) and hexyl propionate (CAS 2445-76-3). Isoamyl
propionate (IAP) has a chemical formula of C.sub.8H.sub.16O.sub.2,
a flash point of 118 degrees Fahrenheit (48 degrees Celsius), and a
boiling point of 321 degrees Fahrenheit (160 degrees Celsius).
Hexyl propionate (HP) has a chemical formula of
C.sub.9H.sub.18O.sub.2, a flash point of 149 degrees Fahrenheit (65
degrees Celsius), and a boiling point of 356 degrees Fahrenheit
(180 degrees Celsius).
[0028] Example butyrates include, but are not limited to, isoamyl
butyrate (CAS 106-27-4), amyl butyrate (CAS 540-18-1), n-butyl
n-butyrate (CAS 109-21-7), isoamyl isobutyrate (CAS 2050-01-3), and
amyl isobutyrate (CAS 2445-72-9). Isoamyl butyrate (IAB) has a
chemical formula of C.sub.9H.sub.18O.sub.2, a flash point of 138
degrees Fahrenheit (58 degrees Celsius), and a boiling point of 372
degrees Fahrenheit (189 degrees Celsius). Amyl butyrate (AB) has a
chemical formula of C.sub.9H.sub.18O.sub.2, a flash point of 133
degrees Fahrenheit (56 degrees Celsius), and a boiling point of 370
degrees Fahrenheit (188 degrees Celsius). N-butyl n-butyrate (nBnB)
has a chemical formula of C.sub.8H.sub.16O.sub.2, a flash point of
127 degrees Fahrenheit (53 degrees Celsius), and a boiling point of
327 degrees Fahrenheit (164 degrees Celsius). Isoamyl isobutyrate
(IAIB) has a chemical formula of C.sub.18H.sub.36O.sub.4, a flash
point of 129 degrees Fahrenheit (54 degrees Celsius), and a boiling
point of 340 degrees Fahrenheit (171 degrees Celsius). Amyl
isobutyrate (AIB) has a chemical formula of C.sub.9H.sub.18O.sub.2,
a flash point of 133 degrees Fahrenheit (56 degrees Celsius), and a
boiling point of 340 degrees Fahrenheit (171 degrees Celsius).
[0029] The propionates and butyrates of the present invention may
be incorporated in their pure form wherein 100 percent of the
liquid is a propionate and/or butyrate. Frequently, however, small
amounts of additives are incorporated in a propionate or butyrate
containing liquid. Most propionate or butyrate containing liquids,
however, include at least 90 weight percent of the respective
propionate or butyrate. Preferably, the propionate or butyrate
containing liquids include at least 95 weight percent of the
respective propionate or butyrate. Even more preferably, the
propionate or butyrate containing liquids include at least 98 or 99
weight percent of the respective propionate or butyrate.
[0030] Mixtures and combinations of the above propionates and
butyrates may be used without departing from the spirit and the
scope of the present invention. Furthermore, the above propionates
and/or butyrates may be combined or mixed with other propionates
and/or butyrates such as allyl propionate (CAS 2408-20-0), butyl
propionate (CAS 590-01-2), n-propyl propionate (CAS 106-36-5),
isobutyl propionate (CAS 540-42-1), tert-butyl propionate (CAS
20487-40-5), ethyl propionate (CAS 105-37-3), methyl propionate
(CAS 554-12-1), isopropyl propionate (CAS 637-78-5), ethyl
3-ethoxypropionate (CAS 763-69-9), ethyl 2-hydroxypropionate (CAS
97-64-3), ethyl 2-hydroxypropanoate (CAS 687-47-8), ethyl butyrate
(CAS 105-54-4), methyl n-butyrate (CAS 623-42-7), and propyl
butyrate (CAS 105-66-8).
[0031] In one embodiment of the present invention, the solvent
system includes a miscible solvent mixture having between 35 to
92.5 weight percent of a propionate containing liquid and between
7.5 to 65 weight percent n-propyl bromide. In another embodiment of
the present invention, the solvent system includes a miscible
solvent mixture having between 80 to 90 weight percent of a
propionate containing liquid and between 10 to 20 weight percent
n-propyl bromide. In yet another embodiment, the solvent system
includes a miscible solvent mixture having approximately 85 weight
percent of a propionate containing liquid and approximately 15
weight percent n-propyl bromide. Alternatively, in one embodiment
of the present invention, the solvent system includes a miscible
solvent mixture having between 65 to 75 weight percent of a
propionate containing liquid and between 25 to 35 weight percent
n-propyl bromide. In another embodiment, the solvent system
includes a miscible solvent mixture having approximately 70 weight
percent of a propionate containing liquid and approximately 30
weight percent n-propyl bromide. In yet another embodiment of the
present invention, the solvent system includes a miscible solvent
mixture having between 35 to 45 weight percent of a propionate
containing liquid and between 55 to 65 weight percent n-propyl
bromide. In yet another embodiment, the solvent system includes a
miscible solvent mixture having approximately 40 weight percent of
a propionate containing liquid and approximately 60 weight percent
n-propyl bromide. Hexyl propionate is a particularly suitable
propionate in the above disclosed embodiments.
[0032] Further, the mixture may have a Kauri-Butanol solvency power
greater than 75. Alternatively, the mixture may have a
Kauri-Butanol solvency power greater than 100. The solvent mixture
is preferably nonflammable, combustible, or minimally a class IC
flammable liquid. Further, the solvent system may include a
nonflammable propellant for incorporating the system into an
aerosol can. Further, the solvent system may include additives such
as a cellulosic, polyvinylpyrrolidone, and/or organo-clay.
[0033] In another embodiment of the present invention, the solvent
system includes a miscible solvent mixture having between 40 to 85
weight percent of a butyrate containing liquid and between 15 to 60
weight percent n-propyl bromide. Alternatively, the miscible
solvent mixture has between 40 to 75 weight percent of a butyrate
containing liquid and between 25 to 60 weight percent n-propyl
bromide. In such an embodiment, amyl butyrate may be the butyrate
included in the solvent mixture. In yet another embodiment, the
miscible solvent mixture has between 40 to 70 weight percent of a
butyrate containing liquid and between 30 to 60 weight percent
n-propyl bromide. In such an embodiment, n-butyl n-butyrate may be
the butyrate included in the solvent mixture. The mixture may have
a Kauri-Butanol solvency power greater than 75. Alternatively, the
mixture may have a Kauri-Butanol solvency power greater than 100.
The solvent mixture is preferably nonflammable, combustible, or
minimally a class IC flammable liquid. Further, the solvent system
may include a nonflammable propellant for incorporating the system
into an aerosol can. Further, the solvent system may include
additives such as a cellulosic, polyvinylpyrrolidone, and/or
organo-clay.
[0034] The solvent compositions and systems of the present
invention may have various uses such as use as a cleaning agent or
a debonder. Further, as discussed above, the solvent compositions
and systems may be combined with a nonflammable propellant. Example
propellants include HFC 134A propellant or HFO-1234ze. The solvent
compositions and/or systems of the present invention when combined
with a nonflammable propellant and inserted into an aerosol can are
often capable of spraying on most substrates. Further, the
resulting aerosol sprays frequently include the added benefits of
being nonflammable, combustible, or minimally a class IC flammable
liquid.
[0035] The solvent system of the present invention may also include
polymers such as a synthetic rubber polymer for dissolving into the
solvent mixture to form a liquid rubber composition. A variety of
polymers may be used in the solvent system. For example, in one
embodiment, a styrene block copolymer such as
Styrene-Ethylene/Butylene-Styrene (SEBS) may be used. Several
suitable styrene polymers are sold under the brand name Kraton.TM.
such as Kraton G1652, Kraton G1643 (CAS 66070-58-4), and Kraton
FG-1901. These styrene polymers are highly versatile and are
typically in the form of synthetic rubber materials including
resins, powders, and pellets. Styrene polymer may be combined with
a solvent composition at approximately 1 through 50 weight percent
of the solvent system. In another embodiment, the styrene polymer
may be combined with a solvent composition at approximately 10
through 40 weight percent of the solvent system. In yet another
embodiment, the styrene polymer may be combined with a solvent
composition at approximately 20 through 30 weight percent of the
solvent system. In a further embodiment, the styrene polymer may be
combined with a solvent composition at approximately 5 through 25
weight percent of the solvent system. One example of the solvent
system of the present invention that incorporates SEBS, includes 51
weight percent n-propyl bromide, 34 weight percent hexyl
propionate, and 15 weight percent SEBS, such as Kraton FG-1901
polymer powder.
[0036] Alternatively, the solvent composition of the present
invention may be combined with a methyl methacrylate copolymer to
create the solvent system of the present invention. Methyl
methacrylate copolymer (CAS 9011-14-7) has a chemical formula of
C.sub.5H.sub.8O.sub.2X.sub.2. Paraloid B48N, also known as Acryloid
B48N, is an example of a methyl methacrylate copolymer that is
suitable for use in the present invention. Paraloid B48N may be in
the form of powder, pellets, or sheets and is typically hard and
abrasion resistant. Methyl methacrylate copolymer may be combined
with a solvent composition at approximately 1 through 50 weight
percent of the solvent system. In another embodiment, the methyl
methacrylate copolymer may be combined with a solvent composition
at approximately 10 through 40 weight percent of the solvent
system. In yet another embodiment, the methyl methacrylate
copolymer may be combined with a solvent composition at
approximately 20 through 30 weight percent of the solvent system.
In a further embodiment, the methyl methacrylate copolymer may be
combined with a solvent composition at approximately 5 through 25
weight percent of the solvent system. One example of the solvent
system of the present invention that incorporates methyl
methacrylate polymer, includes 48 weight percent n-propyl bromide,
32 weight percent hexyl propionate, and 20 weight percent methyl
methacrylate copolymer, such as Paraloid B48N.
[0037] In one embodiment containing polymer, the system includes 30
to 50 weight percent of a propionate containing liquid. In an
alternative embodiment containing a polymer, the system includes 30
to 50 weight percent of a butyrate containing liquid. The solvent
system containing a polymer, such as a synthetic rubber, may be
used to form a liquid rubber that has many uses. For example, the
system may be used as a liquid rubber agent, a paint carrier, a
tarnish reducer, or a bonding agent containing a polymer material,
such as styrene block copolymer. The solvent system may also
include functional additives such as tackifiers, antioxidants,
UV-stabilizers, surfactants, plasticizers, dispersants, biocides,
binders, suspenders, extenders, flame retardants, blocking agents,
lubricants, rubber compounding agents, and plastic compounding
agents.
[0038] The solvent compositions and systems of the present
invention may also be combined with other solvents and components
to vary the boiling point of the solvent system and thereby
increase or decrease the evaporation rate of the system. For
example, parachlorobenzotrifluoride (PCBTF), which is an organic
chemical compound with the molecular formula
C.sub.7H.sub.4CIF.sub.3, may be blended with the solvent system.
Incorporation of PCBTF into the solvent system may, however, lower
the solvency power of the system because the KB value of PCBTF is
only 64. Alternatively, tert-butyl acetate (Tbac) may be
incorporated into the solvent system. While useful for varying the
evaporation rate of a solvent system, the addition of components
and solvents may detrimentally affect the flash point and
flammability classification of the system.
[0039] The present invention also includes a method for controlling
the vaporization rate of n-propyl bromide. For example, the method
includes the steps of providing an n-propyl bromide liquid having a
first vaporization rate and also providing a propionate containing
liquid or a butyrate containing liquid. The method further includes
the steps of combining the n-propyl bromide liquid with either the
propionate containing liquid or the butyrate containing liquid and
adjusting the amounts of the propionate containing liquid or the
butyrate containing liquid to obtain a second desired vaporization
rate. The second vaporization rate of the combined mixture is
preferably less than the first vaporization rate of the n-propyl
bromide containing liquid.
[0040] The present invention further includes a method for reducing
the amount of n-propyl bromide in a solvent while maintaining
solvency power. For example, the method includes the steps of
providing an n-propyl bromide liquid having a specified solvency
power and providing a propionate containing liquid or a butyrate
containing liquid. The method further includes the steps of
combining the propionate containing liquid or the butyrate
containing liquid to the n-propyl bromide liquid and adjusting the
amounts of the propionate containing liquid or the butyrate
containing liquid to reduce the amount of n-propyl bromide liquid.
A specified solvency power is preferably maintained.
[0041] Having generally described this instant disclosure, a
further understanding can be obtained by reference to certain
specific examples illustrated below which are provided for purposes
of illustration only and are not intended to be all inclusive or
limiting unless otherwise specified.
TESTING & EXAMPLES
[0042] The preparation, identification, and testing of example
compositions and systems of this disclosure are further described
below. The particular materials and amounts thereof recited in
these examples, as well as other conditions and details, should not
be construed to unduly limit this invention. In these examples, all
percentages, proportions and ratios are by weight unless otherwise
indicated.
[0043] Selection of a particular propionate or butyrate as well as
the amount of n-propyl bromide frequently depends on the desired
evaporation/drying rate. Thus, the boiling points of compositions
having various concentrations of a n-propyl bromide component and a
propionate or butyrate component were determined. FIGS. 1 through 3
disclose schematic diagrams of boiling points of such solvent
compositions of the present invention. Tables I through III
disclose the compositions used to generate FIGS. 1 through 3. A
desirable boiling point for many applications of a solvent
composition is typically in the range of 60 to 130 degrees Celsius
or more preferably in the range of 80 to 120 degrees Celsius.
Except as stated below, the boiling points were measured by
Galbraith Labs using ASTMD110-11 standards and as set forth herein.
The components of the solvent systems were combined at the
designated weight percent concentration so that the compositions
were miscible in all proportions. The compositions were distilled
at ambient pressure (720 to 740 torr) in a concentric tube
distillation column and then allowed to equilibrate at total reflux
for at least 60 minutes. The boiling point of each distillate was
measured using a thermocouple.
[0044] Selection of a particular propionate and/or butyrate as well
as the amount of n-propyl bromide may also depend on the desired
solvency power. Solvency power is typically measured by the
Kauri-Butanol Value (KB value) of the solvent. Tables I through III
below also disclose the KB values of certain solvent compositions
of the present invention. The KB value is a measure of solvency
power whereby the higher the KB value, the higher the solvency
power. KB values were measured using standard techniques such as
shown in ASTM D 1133. The dissolving power of each solvent was
tested by dissolving Kauri resin and then the dissolvability of the
solvents were compared. A solvent having a KB value between 10-20
is typically considered a mild solvent while a solvent having a KB
value above 75 is typically considered a strong solvent. Further,
solvents having a KB value over 100 are typically considered
powerful solvents. Toluene, which has a KB value of 105, is a known
flammable composition that is often used to dissolve styrene
polymers.
[0045] In FIGS. 1 through 3, Ensolv CW.TM. was the brand of
n-propyl bromide used and is denoted as Component A. As discussed
above, Ensolv CW.TM. is a readily available n-propyl bromide liquid
made up of approximately 95 percent n-propyl bromide Various
propionates and butyrates are denoted as Component B. At zero
percent on the diagram, the composition is entirely Component A,
and the boiling point equals that of n-propyl bromide, which has a
listed boiling point of 71 degrees Celsius. At 100 percent on the
diagram, the composition is entirely Component B and would
therefore equal the boiling point of the particular propionate or
butyrate. The boiling points of 100 percent of a component were not
tested and instead were taken from readily available Material
Safety Data Sheets (MSDS) and related literature on the particular
components.
[0046] FIG. 1 is a schematic diagram of boiling point versus
percent concentration of Ensolv CW.TM. n-propyl bromide (EN-CW
n-PB) and Amyl Butyrate (AB). All tested concentrations were
miscible in all proportions. Table I shows the exact compositions
and measurements used to generate FIG. 1. As disclosed in FIG. 1
and Table I, concentrations of EN-CW n-PB and AB in a range of at
least 25 to 75 weight percent EN-CW n-PB and 25 to 75 weight
percent AB have a boiling point range between 81.6 and 118.36
degrees Celsius, which, as discussed above, are desirable boiling
points for many applications of a solvent composition. Further, no
flash was observed in the solvent compositions at or below a
concentration of 75 weight percent AB. Thus, a nonflammable solvent
composition was created over a wide range of AB concentrations
while maintaining desirable evaporation/drying rates. Further,
because AB was also particularly good at dissolving SEBS polymer,
the KB value of certain of the below concentrations was also
determined. As shown below, the solvent compositions combining AB
and n-PB had particularly high solvency power of approximately 132
to 135.
TABLE-US-00001 TABLE I Flash % Component A % Component B KB Boiling
Point Point (EN-CW n-PB) (AB) Value .degree. C. .degree.
F./.degree. C. 100% 0% 125 71 No Flash 75% 25% -- 81.6 No Flash 60%
40% 134.31 86.3 No Flash 50% 50% -- 95.3 No Flash 30% 70% 133.36
114.6 No Flash 25% 75% -- 118.3 No Flash 15% 85% 132.01 140.6 95/35
0% 100% 134.19 188 133/56.1
[0047] Further, xylene, toluene, and plastidip solvents are
flammable chemical compositions that may be used in connection with
styrene block copolymers and other polymers. Xylene has a boiling
point of approximately 139 degrees Celsius, toluene has a boiling
point of approximately 111 degrees Celsius, and PlastiDip mixed
solvents (combination of CAS 64742-48-9, CAS 110-54-3, CAS
108-88-3, and CAS 78-93-3) have a boiling point of approximately 88
degrees Celsius. Furthermore, standard vapor cleaners used as
aerosol-can carriers/vehicles typically have boiling points of
approximately 60-65 degrees Celsius. As shown in Table I above, the
solvent composition at 85 weight percent AB and 15 weight percent
EN-CW n-PB has a boiling point similar to Xylene, at 70 weight
percent AB and 30 weight percent EN-CW n-PB has a boiling point
similar to toluene, and at 40 weight percent AB and 60 weight
percent EN-CW n-PB has a boiling point similar to PlastiDip.
[0048] FIG. 2 is a schematic diagram of boiling point versus
percent concentration of Hexyl Propionate (HP) and EN-CW n-PB. All
tested concentrations were miscible in all proportions. Table II
shows the exact compositions and measurements used to generate FIG.
2. As disclosed in FIG. 2 and Table II, concentrations of EN-CW
n-PB and HP in a range of at least 30 to 60 weight percent EN-CW
n-PB and 40 to 70 weight percent HP have a boiling point range
between 86.6 and 114.9 degrees Celsius, which, as discussed above,
are desirable boiling points for many applications of a solvent
composition. Further, no flash was observed in the combined solvent
compositions. Thus, a nonflammable solvent composition was created
over a wide range of HP concentrations while maintaining desirable
evaporation/drying rates. Further, because HP was also particularly
good at dissolving SEBS polymer, the KB value of certain of the
below concentrations was also determined. As shown below, the
solvent compositions combining HP and n-PB had particularly high
solvency power of approximately 132 to 134.
TABLE-US-00002 TABLE II % Component A % Component KB Boiling Point
Flash Point (EN-CW n-PB) B (HP) Value .degree. C. .degree.
F./.degree. C. 100% 0% 125 71 No Flash 60% 40% 133.69 86.6 No Flash
30% 70% 132.53 114.9 No Flash 15% 85% 133.11 145.9 No Flash 7.5%
92.5% -- 161.9 No Flash 0% 100% 127.11 180 149/65
[0049] As shown in Table II above, the solvent composition at 85
weight percent HP and 15 weight percent EN-CW n-PB has a boiling
point similar to Xylene, at 70 weight percent HP and 30 weight
percent EN-CW n-PB has a boiling point similar to toluene, and at
40 weight percent HP and 60 weight percent EN-CW n-PB has a boiling
point similar to PlastiDip.
[0050] FIG. 3 is a schematic diagram of boiling point versus
percent concentration of n-Butyl n-Butyrate (nBnB) and EN-CW n-PB.
All tested concentrations were miscible in all proportions. Table
III shows the exact compositions and measurements used to generate
FIG. 3. As disclosed in FIG. 3 and Table III, concentrations of
EN-CW n-PB and nBnB in a range of at least 30 to 60 weight percent
EN-CW n-PB and 40 to 70 weight percent nBnB have a boiling point
range between 86.6 and 112.9 degrees Celsius, which, as discussed
above, are desirable boiling points for many applications of a
solvent composition. Further, no flash was observed in the solvent
compositions at or below a concentration of 70 weight percent nBnB.
Thus, a nonflammable solvent composition was created over a wide
range of nBnB concentrations while maintaining desirable
evaporation/drying rates. Further, because nBnB was particularly
good at dissolving SEBS polymer, the KB value of certain of the
below concentrations was also determined. As shown below, the
solvent compositions combining nBnB and n-PB had the highest
solvency power of approximately 140 to 148.
TABLE-US-00003 TABLE III % Component A % Component KB Boiling Point
Flash Point (EN-CW n-PB) B (nBnB) Value .degree. C. .degree.
F./.degree. C. 100% 0% 125 71 No Flash 60% 40% 140.95 86.6 No Flash
30% 70% 146.17 112.9 No Flash 15% 85% 147.43 134.9 95/35 0% 100%
163.04 164 127/52.8
[0051] As shown in Table III above, the solvent composition at 85
weight percent nBnB and 15 weight percent EN-CW n-PB has a boiling
point similar to Xylene, at 70 weight percent nBnB and 30 weight
percent EN-CW n-PB has a boiling point similar to toluene, and at
40 weight percent nBnB and 60 weight percent EN-CW n-PB has a
boiling point similar to PlastiDip.
[0052] As discussed above, the solvent compositions of the present
invention may be used for many applications and determination of
the particular components and ranges of components of the solvent
composition typically depends on the particular use of the
composition. For example, one composition may have properties
better suited for use as a cleaning agent while a different
composition may have properties better suited for mixing with
concentrated paints or coatings to act as a carrier for such
concentrated paints or coatings. Further, certain compositions may
be used as a bonding agent while other compositions may be used as
a debonder. Moreover, one composition may have properties better
suited for dissolving a particular polymer, such as those discussed
herein and including styrene polymers.
[0053] Further, selection of a particular propionate or butyrate as
well as the amount of n-propyl bromide frequently depends on the
desired evaporation/drying rate. For example and as shown by the
above tables, if faster drying time is desired, a higher quantity
of n-propyl bromide is typically incorporated into the composition
and system. In contrast, if slower drying time is desired, a lower
quantity of n-propyl bromide is typically incorporated into the
composition and system.
[0054] While the pure butyrates and propionates disclosed above
have high boiling points, which therefore leads to very low
evaporation and slow drying rates for the solvents, mixing with
n-propyl bromide significantly lowers the boiling points and
therefore allows for tailoring of a particular desirable
evaporation/drying rate as well as a particular desirable solvency
power. Further, a broad range of nonflammable or combustible
compositions are achievable by varying the amount of n-propyl
bromide as well as with the particular selection of propionates and
butyrates, including combinations thereof.
[0055] Moreover, because the drying/evaporation rate and actual
vaporization rate will also vary depending on the heat of
vaporization and cohesive energy density, a blend of the above
solvents and components may achieve highly desirable drying
characteristics. For example, a triple-blend of the above solvents
may result in practically any polymer-content dissolution and
drying rate that is needed for a particular application.
[0056] The present invention also relates to solvent systems that
incorporate polymers such as synthetic rubber polymers including
Styrene-Ethylene/Butylene-Styrene (SEBS). As discussed in U.S.
patent application Ser. No. 14/230,126, several propionates and
butyrates are capable of dissolving polymers and synthetic rubbers
such as SEBS. Further, it was discussed that several propionates
and butyrates when combined with particular fluorinated solvents
are also capable of dissolving polymers and synthetic rubbers. It
has likewise been determined that several propionates and butyrates
when combined with n-propyl bromide are also capable of dissolving
polymers and synthetic rubbers such as SEBS. Indeed, as set forth
in Table IV below, which compares KB values of various solvents,
n-propyl bromide combined with propionates and/or butyrates have
even higher solvency powers than most fluorinated solvents combined
with propionates and/or butyrates as disclosed in U.S. patent
application Ser. No. 14/230,126. Table IV also includes boiling
point and flash point data for comparative purposes.
[0057] In the table below, Novec 72DE refers to a fluorinated
solvent having a mixture of HFEs, including ethyl nonafluorobutyl
ether (C.sub.6H.sub.5F.sub.9O), ethyl nonafluoroisobutyl ether
(C.sub.6H.sub.5F.sub.9O), methyl nonafluorobutyl ether
(C.sub.5H.sub.3F.sub.9O), and methyl nonafluoroisobutyl ether
(C.sub.5H.sub.3F.sub.9O) and includes t-DCE, also known as
trans-1,2-dichloroethene. More particularly, Novec 72DE includes
approximately 68 through 72 weight percent t-DCE, approximately 4
through 16 weight percent ethyl nonafluorobutyl ether,
approximately 4 through 16 weight percent ethyl nonafluoroisobutyl
ether, approximately 2 through 8 percent methyl nonafluorobutyl
ether, and approximately 2 through 8 percent methyl
nonafluoroisobutyl ether. Novec 7100 refers to a mixture of methyl
nonafluoroisobutyl ether and methyl nonafluorobutyl ether, which is
also known as HFE 7100. PCBTF refers to parachlorobenzotrifluoride,
which is an organic chemical compound with the molecular formula
C.sub.7H.sub.4CIF.sub.3. Oxsol 100.TM. is a brand name of a
commonly sold PCBTF.
TABLE-US-00004 TABLE IV KB Boiling Point Flash Point Solvent
Composition Value .degree. C. .degree. F. N-Propyl Bromide Based
Compositions 40% AB + 60% n-PB 134.31 86 No Flash 70% AB + 30% n-PB
133.36 115 No Flash 85% AB + 15% n-PB 132.01 141 95 40% HP + 60%
n-PB 133.69 87 No Flash 70% HP + 30% n-PB 132.53 115 No Flash 85%
HP + 15% n-PB 133.11 146 No Flash 40% nBnB + 60% n-PB 140.95 87 No
Flash 70% nBnB + 30% n-PB 146.17 113 No Flash 85% nBnB + 15% n-PB
147.43 135 95 Novec 72DE/Fluorinated Solvent Based Compositions 90%
AB + 10% Novec 72DE 114.98 134 102 80% AB + 20% Novec 72DE 105.67
114 No Flash 65% AB + 35% Novec 72DE 86.85 87 No Flash 40% AB + 60%
Novec 72DE 69.49 66 No Flash 90% HP + 10% Novec 72DE 115.92 136 106
80% HP + 20% Novec 72DE 84.52 111 No Flash 65% HP + 35% Novec 72DE
91.51 99 No Flash 40% HP + 60% Novec 72DE 68.23 65 No Flash 90%
nBnB + 10% Novec 72DE 147.56 131 98 80% nBnB + 20% Novec 72DE
116.90 111 No Flash 65% nBnB + 35% Novec 72DE 112.54 90 No Flash
40% nBnB + 60% Novec 72DE 82.95 66 No Flash Comparative Solvents
100% n-PB 125 71 No Flash 100% AB 134.19 188 133 100% HP 127.11 180
149 100% nBnB 163.04 164 127 Xylene 98 139 77 PCBTF 64 139 109
Toluene 105 111 40 Tert-butyl acetate (Tbac) 114 98 40-60 Heptane
28 98 25 Naphtha 34-36 86 50 Hexane 29 68 -8.5 Novec 7100 10 61 No
Flash
[0058] It is apparent from Table IV above that the solvent
compositions of the present invention are capable of having very
high solvency power that can be tailored depending on a particular
use, while maintaining nonflammable or combustible properties up to
a very high concentration of AB, HP, nBnB, and n-PB.
[0059] Indeed as shown in Table V below, which reorganizes the
above solvents based upon similar boiling points, the solvent
compositions and systems of the present invention provide
nonflammable or low flammability and high solvency power
alternatives to known highly flammable solvents over a wide range
of evaporation rates. Particularly, the present invention discloses
several xylene-like compositions, toluene-like compositions,
tert-butyl acetate or Tbac-like compositions, and even
vapor-cleaning-like compositions. Within each group of Table V, the
compositions are listed based upon KB value with the highest KB
value composition listed first and the comparative solvent listed
in bold.
TABLE-US-00005 TABLE V KB Boiling Point Flash Point Solvent
Composition Value (BP) .degree. C. .degree. F. Xylene-like
Evaporation Rate Compositions (BP +/- 8.degree. C.) 90% nBnB + 10%
Novec 72DE 147.56 131 98 85% nBnB + 15% n-PB 147.43 135 95 85% HP +
15% n-PB 133.11 146 No Flash 85% AB + 15% n-PB 132.01 141 95 90% HP
+ 10% Novec 72DE 115.92 136 106 90% AB + 10% Novec 72DE 114.98 134
102 Xylene 98 139 77 PCBTF 64 139 109 Toluene-like Evaporation Rate
Composotions (BP +/- 7.degree. C.) 70% nBnB + 30% n-PB 146.17 113
No Flash 70% AB + 30% n-PB 133.36 115 No Flash 70% HP + 30% n-PB
132.53 115 No Flash 80% nBnB + 20% Novec 72DE 116.90 111 No Flash
80% AB + 20% Novec 72DE 105.67 114 No Flash Toluene 105 111 40 80%
HP + 20% Novec 72DE 84.52 111 No Flash Tbac-like Evaporation Rate
Compositions (BP +/- 6.degree. C.) Tbac 114 98 40-60 Heptane 28 98
25 65% HP + 35% Novec 72DE 91.51 99 No Flash PlastiDip-like
Evaporation Rate Compositions (BP +/- 5.degree. C.) 40% nBnB + 60%
n-PB 140.95 87 No Flash 40% AB + 60% n-PB 134.31 86 No Flash 40% HP
+ 60% n-PB 133.69 87 No Flash 65% nBnB + 35% Novec 72DE 112.54 90
No Flash 65% AB + 35% Novec 72DE 86.85 87 No Flash Naphtha 34-36 86
50 PlastiDip -- 88 54 Vapor Cleaner-like Evaporation Rate
Compositions (BP +/- 6.degree. C.) 100% n-PB 125 71 No Flash 40%
nBnB + 60% Novec 72DE 82.95 66 No Flash 40% AB + 60% Novec 72DE
69.49 66 No Flash 40% HP + 60% Novec 72DE 68.23 65 No Flash Hexane
29 68 -8.5 Novec 7100 10 61 No Flash Standard Vapor Cleaner --
60-65 --
[0060] Tests were also performed using HP and n-propyl bromide
solvent compositions and various polymers, wherein tackifying
resin, such as Eastotac H-100W Resin, which is a hydrogenated
hydrocarbon resin, may be used if desired. For example, a solvent
composition having 40 weight percent HP and 60 weight percent
n-propyl bromide was combined with SEBS polymer powder,
specifically Kraton FG-1901 polymer powder. The system proportions
were 51 weight percent n-propyl bromide, 34 weight percent hexyl
propionate, and 15 weight percent Kraton FG-1901 polymer powder.
The polymer completely dissolved without shear in the HP and
n-propyl bromide to create a solvent system incorporating the
styrene polymer. Further, because the polymer completely dissolved
in the 40/60 blend of HP and n-propyl bromide, the films of the
solvent system incorporating the styrene polymer can also be
removed using the 40/60 blend of HP and n-propyl bromide. Further,
the 40/60 blend of HP and n-propyl bromide was also combined with
methyl methacrylate copolymer, specifically Paraloid B48N. The
system proportions were 48 weight percent n-propyl bromide, 32
weight percent hexyl propionate, and 20 weight percent Paraloid
B48N. The polymer completely dissolved without shear in the HP and
n-propyl bromide to create a solvent system incorporating the
methyl methacrylate copolymer. Further, because the polymer
completely dissolved in the 40/60 blend of HP and n-propyl bromide,
the films of the solvent system incorporating the methyl
methacrylate copolymer can also be removed using the 40/60 blend of
HP and n-propyl bromide.
[0061] Both solvent systems were nonflammable and formed clear
liquids. Further, both systems were coated onto aluminum coupons to
create a thin polymer film on the coupon. The polymer films dried
onto the aluminum coupons in approximately three hours at
ambient/room-temperature (approximately 21 degrees Celsius). This
time may be accelerated by placing the coupons in a dryer at 60
degrees Celsius for approximately one hour or by using a
traditional hair dryer set on high heat and low fan speed for
approximately 3 through 5 minutes. A solvent composition having
approximately 40 weight percent HP and 60 weight percent n-propyl
bromide was then applied to the film after drying. Both films were
removed from the aluminum coupon in approximately one minute.
[0062] While the polymer films were transparent, traditional
pigments and colorants may be added to the systems to provide
coloring for the films. In one embodiment, titanium oxide may be
added to create a white film, which assists with visual clarity of
complete film application to the substrate as well as removal from
the substrate. Further, the methyl methacrylate copolymer solvent
system and the styrene polymer solvent system discussed above may
be blended. Because the blend of these solvent systems results in a
miscible system, the properties of the blended system can be
tailored as needed for a particular application.
INDUSTRIAL APPLICABILITY
[0063] As discussed above, the solvent compositions and systems of
the present invention may be used for many applications and
determination of the particular components and ranges of components
of the compositions and systems typically depends on the particular
use of the compositions and/or systems. Frequently, additional
materials and additives may be incorporated into the compositions
and systems of the present invention, such as the tackifying resins
discussed above.
[0064] In addition to the use of tackifying resins, colorants,
additives, and fillers may be added to the solvent compositions and
systems of the present invention. For example, approximately 1-10
weight percent of a colorant or pigment, such as those sold by Sun
Chemical Corporation, may be incorporated into the solvent
composition or polymer solvent system. Several colorants, including
organic, inorganic, and blended organic-inorganic colorants, may be
used with the compositions and systems of the present
invention.
[0065] Further the solvent compositions and systems of the present
invention may contain additives, agents, binders, suspenders,
and/or viscosity modifiers such as cellulosics, including
hydroxypropylcellulose or ethyl cellulose, polyvinylpyrrolidone,
and organo-clays. Typical viscosity modifiers preferably include
those that are compatible with non-aqueous fluids/liquids as well
as propionates and/or butyrates, such as organo-clays. Ethyl
cellulose at low percentages, such as 1-4 weight percent of the
composition or system, typically improves bonding of the styrene
solvent system to metals. Further, the synthetic rubber polymer may
act as a binder/suspender in reduced quantities by helping to bond
down fillers (i.e., pigments or inorganic additives) to modify the
color and/or performance of these materials.
[0066] As discussed above, the solvent compositions of the present
invention may be utilized as cleaners including removal of polymer
resins and films since the solvents may be capable of dissolving
such resins and films. Further, the solvent systems may be utilized
as a glue and/or as a bonding agent. Because the solvent
compositions and systems of the present invention are typically
non-aqueous, water reactive compounds may be incorporated for use
as paintable coatings. Further, such solvents, systems, and
coatings may be encapsulated in order to reduce reactivity with
water and extend their usefulness in an air-with-moisture
environment.
[0067] Functional additives for the polymers such as antioxidants,
light (UV) stabilizers, surfactants, plasticizers, tackifiers,
dispersants, biocides, binders/suspenders, extenders, flame
retardants, blocking agents, and lubricants as well as other rubber
and plastic compounding ingredients and other "fillers", may be
incorporated into the systems of the present invention. For
example, additives such as those disclosed in U.S. Pat. Nos.
3,239,478; 4,536,454; 4,745,139; 5,315,940; and 5,777,043; as well
as U.S. Patent Publication No. 2005/0119403 A1 may be useful
additives to the compositions and systems of the present invention
and are hereby incorporated by reference. These additives
preferably do not change the properties including flammability of
the solvent compositions and polymer systems of the present
invention.
[0068] The solvent compositions and systems of the present
invention may be combined with a nonflammable propellant, such as
HFC 134A propellant or HFO-1234ze, when canned for use as an
aerosol spray. The styrene solvent system of the present invention
combined with a nonflammable propellant is capable of spraying on
most substrates and compares to PlastiDip spray except that the
spray of the present invention may be nonflammable, combustible, or
minimally a class IC flammable liquid. In contrast, PlastiDip spray
is very flammable.
[0069] Further, the solvent system may incorporate boron nitride to
enhance thermal conductivity and result in a nonflammable or low
flammability brushable or dippable paint or coatings. Boron nitride
may also be incorporated into a solvent system utilizing propellant
for use as an aerosol can spray. The solvent system such as the
system incorporating a synthetic rubber polymer may be used for
sealing such as vacuum sealing or leak-sealing, or for creating an
electrically insulating and flexible polymer layer, film, or
coating. Such a flexible layer or film may also be used for making
gaskets, for sealing mating surfaces, for water protection to
prevent water from reacting with highly water reactive material,
and for preventing oxidation, rusting, and/or tarnishing due to
gases, vapors, and liquids. Further, the solvent system utilizing
polymers such as a styrene block copolymer or a methyl methacrylate
copolymer may be used for sealing in fibers on the surface of
porous ceramics such as lightweight fiber ceramic insulation.
Advantageously, the solvent system may allow for safer handling and
then burn off during initial heating in the furnace
environment.
[0070] The solvent compositions and systems of the present
invention may be used as protectants such as for mirrors and highly
polished surfaces. For example, a solvent system of the present
invention that incorporates a synthetic rubber polymer, may also
incorporate tackifiers to create a peelable coating, which protects
a surface but is easily removed. Alternatively, as discussed above,
the solvent system may be used as a protectant on a substrate or
surface without the addition of tackifiers. After application, the
system will dry on a surface or substrate thereby creating a
polymer film or layer that may provide chemical resistivity,
corrosion protection, electrical insulation, and/or
scratch/abrasion resistance. A solvent composition of the present
invention can later be applied to the polymer film or layer when it
is necessary to remove the film or layer. Additionally, the solvent
compositions of the present invention may also be used to dissolve
layers, films, and coatings other than polymer layers, films, and
coatings without departing from the spirit and the scope of the
invention.
[0071] Moreover, the above solvent system may be applied to metals
that have a tendency to oxidize, such as silver, to prevent
tarnishing. Dissolving SEBS polymer with a 40/60 blend of HP with
n-propyl bromide solvent composition results in a crystal clear
coating that is particularly suitable for coating silver and
reducing or preventing tarnishing for an extended period of
time.
[0072] Further, the solvent system may be applied to all or part of
a fiber surface to create additional traction when the fiber is
tied together or to retain the shape and/or size of the fiber
surface that may otherwise stretch or deform with extended use.
[0073] The solvent system of the present invention may be used to
prevent water absorption, which is particularly useful in high
humidity regions. For example, a solvent system having SEBS
polymer, may be used to coat a boron nitride hardcoat paint. The
polymer coated paint can then protect the underlying paint from
absorbing water and delaminating or weakening due to absorbed
water. Because the solvent system having the SEBS polymer oxidizes
away and burns off at high temperatures, such as 800 degrees
Celsius, the polymer does not cause any problems or affect the
performance of the boron nitride hardcoat when it is placed into
its use-environment at 800 degrees Celsius.
[0074] While various embodiments and examples of this invention
have been described above, these descriptions are given for
purposes of illustration and explanation, and not limitation.
Variations, changes, modifications, and departures from the
compositions, systems, and methods disclosed above may be adopted
without departure from the spirit and scope of this invention. In
fact, after reading the above description, it will be apparent to
one skilled in the relevant art(s) how to implement the invention
in alternative embodiments. Thus, the present invention should not
be limited by any of the above described exemplary embodiments.
[0075] Further, the purpose of the Abstract is to enable the
examining office and the public generally, and especially the
scientists, engineers, and practitioners in the art who are not
familiar with patent or legal terms or phraseology, to determine
quickly from a cursory inspection the nature and essence of the
technical disclosure of the application. The Abstract is not
intended to be limiting as to the scope of the invention in any
way.
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