U.S. patent application number 14/784324 was filed with the patent office on 2016-02-25 for battery protection circuit module package.
The applicant listed for this patent is ITM SEMICONDUCTOR CO.,LTD. Invention is credited to Sang-hoon AHN, Ho-seok HWANG, Da-Woon JUNG, Tae Hwan JUNG, Young-Seok KIM, Hyun-suck LEE, Myoung-Ki MOON, Jae-ku PARK, Seong-beom PARK, Seung-uk PARK.
Application Number | 20160056444 14/784324 |
Document ID | / |
Family ID | 51997528 |
Filed Date | 2016-02-25 |
United States Patent
Application |
20160056444 |
Kind Code |
A1 |
HWANG; Ho-seok ; et
al. |
February 25, 2016 |
BATTERY PROTECTION CIRCUIT MODULE PACKAGE
Abstract
Disclosed is a battery protection circuit module package capable
of easily achieving high integration and size reduction. The
battery protection circuit module package includes a terminal lead
frame including a first internal connection terminal lead and a
second internal connection terminal lead provided at two edges of
the terminal lead frame and electrically connected to electrode
terminals of a battery bare cell, and a plurality of external
connection terminal leads provided between the first and second
internal connection terminal leads and serving as a plurality of
external connection terminals, and a device package including a
substrate mounted on the terminal lead frame to be electrically
connected to the terminal lead frame, and providing a battery
protection circuit device thereon.
Inventors: |
HWANG; Ho-seok; (Gunpo-si,
KR) ; KIM; Young-Seok; (Cheongju-si, KR) ;
PARK; Seong-beom; (Guri-si, KR) ; AHN; Sang-hoon;
(Cheongju-si, KR) ; JUNG; Tae Hwan;
(Cheongwon-gun, KR) ; PARK; Seung-uk; (Cheonan-si,
KR) ; PARK; Jae-ku; (Cheongwon-gun, KR) ;
MOON; Myoung-Ki; (Wonju-si, KR) ; LEE; Hyun-suck;
(Cheongwon-gun, KR) ; JUNG; Da-Woon;
(Cheorwan-gun, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ITM SEMICONDUCTOR CO.,LTD |
Chungcheongbuk-do |
|
KR |
|
|
Family ID: |
51997528 |
Appl. No.: |
14/784324 |
Filed: |
April 17, 2014 |
PCT Filed: |
April 17, 2014 |
PCT NO: |
PCT/KR2014/003345 |
371 Date: |
October 14, 2015 |
Current U.S.
Class: |
429/7 |
Current CPC
Class: |
H01L 2224/48145
20130101; H01M 2/34 20130101; H01M 10/48 20130101; H01M 2/1061
20130101; H02J 7/0029 20130101; H01L 2224/48247 20130101; Y02E
60/10 20130101; H01M 2200/106 20130101; H01M 2220/30 20130101; H01M
2010/4278 20130101; H01L 2924/19105 20130101; H01M 10/4257
20130101; H01M 2200/00 20130101; H01L 2224/49111 20130101; H01L
2224/48145 20130101; H01L 2924/00012 20130101 |
International
Class: |
H01M 2/34 20060101
H01M002/34; H01M 10/0525 20060101 H01M010/0525 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 17, 2013 |
KR |
10-2013-0042566 |
Apr 19, 2013 |
KR |
10-2013-0043289 |
Apr 19, 2013 |
KR |
10-2013-0043290 |
Apr 19, 2013 |
KR |
10-2013-0043291 |
Apr 25, 2013 |
KR |
10-2013-0046036 |
Claims
1. A battery protection circuit module package comprising: a
terminal lead frame comprising: a first internal connection
terminal lead and a second internal connection terminal lead
provided at two edges of the terminal lead frame and electrically
connected to electrode terminals of a battery bare cell; and a
plurality of external connection terminal leads provided between
the first and second internal connection terminal leads and serving
as a plurality of external connection terminals; and a device
package comprising a substrate mounted on the terminal lead frame
to be electrically connected to the terminal lead frame, and
providing a battery protection circuit device thereon.
2. The battery protection circuit module package of claim 1,
wherein the device package provides exposure terminals on a bottom
surface of the device package.
3. The battery protection circuit module package of claim 1,
wherein the device package provides exposure terminals on a top
surface and a bottom surface of the device package.
4. The battery protection circuit module package of claim 3,
wherein the device package further comprises: a near field
communication (NFC) matching device provided on the substrate; and
an encapsulant for encapsulating the battery protection circuit
device and the NFC matching device to expose the exposure
terminals, wherein one of the external connection terminals is an
NFC external connection terminal, and wherein the exposure
terminals provided on the top surface of the device package are
provided to electrically interconnect an NFC antenna and the NFC
matching device.
5. The battery protection circuit module package of claim 2,
wherein the device package further comprises: an authentication
chip circuit composition provided on the substrate; and an
encapsulant for encapsulating the battery protection circuit device
and the authentication chip circuit composition to expose the
exposure terminals, and wherein one of the external connection
terminals is an authentication chip external connection
terminal.
6. The battery protection circuit module package of claim 2,
wherein the device package further comprises: a fuel gauge circuit
composition provided on the substrate; and an encapsulant for
encapsulating the battery protection circuit device and the fuel
gauge circuit composition to expose the exposure terminals, and
wherein one of the external connection terminals is a fuel gauge
external connection terminal.
7. The battery protection circuit module package of claim 2,
wherein the exposure terminals provided on the bottom surface of
the device package facing the terminal lead frame are bonded and
electrically connected to at least parts of the terminal lead
frame.
8. The battery protection circuit module package of claim 2,
further comprising an encapsulant for encapsulating the battery
protection circuit device to expose the exposure terminals.
9. The battery protection circuit module package of claim 1,
wherein the device package is mounted on the terminal lead frame
using surface mounting technology.
10. The battery protection circuit module package of claim 1,
wherein the substrate comprises a mounting lead frame having a
plurality of mounting leads spaced apart from each other, wherein
the battery protection circuit device is directly mounted on the
mounting lead frame and comprises a protection integrated circuit
(IC), a field effect transistor (FET), and one or more passive
devices, and wherein the passive devices are provided to
interconnect at least some of the mounting leads spaced apart from
each other, and further comprises an electrical connection member
for electrically interconnecting any two selected from the group
consisting of the protection IC, the FET, and the mounting leads,
thereby configuring a battery protection circuit without using a
printed circuit board (PCB).
11. The battery protection circuit module package of claim 10,
wherein the electrical connection member comprises bonding wire or
bonding ribbon.
12. The battery protection circuit module package of claim 10,
wherein the passive devices are not inserted and fixed into the
mounting lead frame but are mounted and fixed onto at least parts
of a surface of the mounting lead frame using surface mounting
technology.
13. The battery protection circuit module package of claim 10,
wherein the protection IC and the FET are not inserted and fixed
into the mounting lead frame in a form of a semiconductor package
but are mounted and fixed onto at least parts of a surface of the
mounting lead frame using surface mounting technology in a form of
a chip die not encapsulated with an encapsulant.
14. The battery protection circuit module package of claim 1,
wherein the substrate comprises a PCB, and wherein the battery
protection circuit device comprises a protection IC, an FET, and
one or more passive devices provided on the PCB.
15. The battery protection circuit module package of claim 1,
wherein the electrode terminals of the battery bare cell comprise a
plate having first polarity, and an electrode cell provided at a
center of the plate and having second polarity, and wherein the
first internal connection terminal lead is directly bonded and
electrically connected to the plate having the first polarity, and
the second internal connection terminal lead is directly bonded and
electrically connected to the electrode cell having the second
polarity.
16. The battery protection circuit module package of claim 15,
wherein the terminal lead frame and the device package are provided
at a side part of a top surface of the battery bare cell based on
the electrode cell having the second polarity.
17. The battery protection circuit module package of claim 15,
wherein the first internal connection terminal lead is bent in a
form of a gull to be bonded to the electrode terminal of the
battery bare cell.
18. The battery protection circuit module package of claim 1,
wherein the first and second internal connection terminal leads are
bonded to the electrode terminals of the battery bare cell using
any one selected from the group consisting of laser welding,
resistance welding, soldering, a conductive adhesive (e.g.,
conductive epoxy), and conductive tape.
19. The battery protection circuit module package of claim 1,
wherein the terminal lead frame is formed of nickel or
nickel-plated copper.
20. The battery protection circuit module package of claim 1,
wherein the external connection terminals comprise four or more
external connection terminals.
21. The battery protection circuit module package of claim 1,
further comprising a positive temperature coefficient (PTC)
structure comprising: a PTC device; a metal layer adhered to a
first surface corresponding to any one of a top surface and a
bottom surface of the PTC device; and a connecting member adhered
to a second surface corresponding to the other of the top surface
and the bottom surface of the PTC device, wherein the metal layer
is bonded and electrically connected to one of the first and second
internal connection terminal leads, and the connecting member is
bonded and electrically connected to the electrode terminal of the
battery bare cell.
Description
TECHNICAL FIELD
[0001] The present invention relates to a battery protection
circuit module package and, more particularly, to a battery
protection circuit module package producible in a small size and
easily mountable in a battery pack or a battery can.
BACKGROUND ART
[0002] A battery is generally used in portable devices such as a
mobile phone and a personal digital assistant (PDA). As a battery
most commonly used in the portable devices, a lithium ion battery
is heated when overcharge or overcurrent occurs, and even has the
risk of explosion as well as performance degradation if heating is
continued and thus temperature thereof is increased. Accordingly, a
typical battery includes a protection circuit module for detecting
and blocking overcharge, overdischarge, and overcurrent, or uses an
external protection circuit for detecting overcharge,
overdischarge, or heating and blocking operation of the battery
from the outside of the battery. This conventional protection
circuit is generally produced by soldering a protection integrated
circuit (IC), a field effect transistor (FET), resistors,
capacitors, etc. on a printed circuit board (PCB). However, the
conventional protection circuit may not be produced in a small size
because the protection IC, the FET, the resistors, and the
capacitors occupy an excessively large space. Furthermore, an
additional process is required to mount the protection circuit in a
battery pack. After the protection circuit is mounted, a process
for connecting external connection terminals or internal connection
terminals thereof through wires, wire bonding, the pattern of the
PCB, or exposure terminals of the PCB is complicated.
DETAILED DESCRIPTION OF THE INVENTION
Technical Problem
[0003] The present invention provides a battery protection circuit
module package capable of easily achieving high integration and
size reduction. However, the scope of the present invention is not
limited thereto.
Technical Solution
[0004] According to an aspect of the present invention, there is
provided a battery protection circuit module package including a
terminal lead frame including a first internal connection terminal
lead and a second internal connection terminal lead provided at two
edges of the terminal lead frame and electrically connected to
electrode terminals of a battery bare cell, and a plurality of
external connection terminal leads provided between the first and
second internal connection terminal leads and serving as a
plurality of external connection terminals, and a device package
including a substrate mounted on the terminal lead frame to be
electrically connected to the terminal lead frame, and providing a
battery protection circuit device thereon.
[0005] The device package may provide exposure terminals on a
bottom surface of the device package.
[0006] The device package may provide exposure terminals on a top
surface and a bottom surface of the device package.
[0007] The device package may further include a near field
communication (NFC) matching device provided on the substrate, and
an encapsulant for encapsulating the battery protection circuit
device and the NFC matching device to expose the exposure
terminals, one of the external connection terminals may be an NFC
external connection terminal, and the exposure terminals provided
on the top surface of the device package may be provided to
electrically interconnect an NFC antenna and the NFC matching
device.
[0008] The device package may further include an authentication
chip circuit composition provided on the substrate, and an
encapsulant for encapsulating the battery protection circuit device
and the authentication chip circuit composition to expose the
exposure terminals, and one of the external connection terminals
may be an authentication chip external connection terminal.
[0009] The device package may further include a fuel gauge circuit
composition provided on the substrate, and an encapsulant for
encapsulating the battery protection circuit device and the fuel
gauge circuit composition to expose the exposure terminals, and one
of the external connection terminals may be a fuel gauge external
connection terminal.
[0010] The exposure terminals provided on the bottom surface of the
device package facing the terminal lead frame may be bonded and
electrically connected to at least parts of the terminal lead
frame.
[0011] The battery protection circuit module package may further
include an encapsulant for encapsulating the battery protection
circuit device to expose the exposure terminals.
[0012] The device package may be mounted on the terminal lead frame
using surface mounting technology.
[0013] The substrate may include a mounting lead frame having a
plurality of mounting leads spaced apart from each other, the
battery protection circuit device may be directly mounted on the
mounting lead frame and may include a protection integrated circuit
(IC), a field effect transistor (FET), and one or more passive
devices, and the passive devices may be provided to interconnect at
least some of the mounting leads spaced apart from each other, and
may further include an electrical connection member for
electrically interconnecting any two selected from the group
consisting of the protection IC, the FET, and the mounting leads,
thereby configuring a battery protection circuit without using a
printed circuit board (PCB).
[0014] The electrical connection member may include bonding wire or
bonding ribbon.
[0015] The passive devices may not be inserted and fixed into the
mounting lead frame but may be mounted and fixed onto at least
parts of a surface of the mounting lead frame using surface
mounting technology.
[0016] The protection IC and the FET may not be inserted and fixed
into the mounting lead frame in a form of a semiconductor package
but may be mounted and fixed onto at least parts of a surface of
the mounting lead frame using surface mounting technology in a form
of a chip die not encapsulated with an encapsulant.
[0017] The substrate may include a PCB, and the battery protection
circuit device may include a protection IC, an FET, and one or more
passive devices provided on the PCB.
[0018] The electrode terminals of the battery bare cell may include
a plate having first polarity, and an electrode cell provided at a
center of the plate and having second polarity, and the first
internal connection terminal lead may be directly bonded and
electrically connected to the plate having the first polarity, and
the second internal connection terminal lead may be directly bonded
and electrically connected to the electrode cell having the second
polarity.
[0019] The terminal lead frame and the device package may be
provided at a side part of a top surface of the battery bare cell
based on the electrode cell having the second polarity.
[0020] The first internal connection terminal lead may be bent in a
form of a gull to be bonded to the electrode terminal of the
battery bare cell.
[0021] The first and second internal connection terminal leads may
be bonded to the electrode terminals of the battery bare cell using
any one selected from the group consisting of laser welding,
resistance welding, soldering, a conductive adhesive (e.g.,
conductive epoxy), and conductive tape.
[0022] The terminal lead frame may be formed of nickel or
nickel-plated copper.
[0023] The external connection terminals may include four or more
external connection terminals.
[0024] The battery protection circuit module package may further
include a positive temperature coefficient (PTC) structure
including a PTC device, a metal layer adhered to a first surface
corresponding to any one of a top surface and a bottom surface of
the PTC device, and a connecting member adhered to a second surface
corresponding to the other of the top surface and the bottom
surface of the PTC device, and the metal layer may be bonded and
electrically connected to one of the first and second internal
connection terminal leads, and the connecting member may be bonded
and electrically connected to the electrode terminal of the battery
bare cell.
Advantageous Effects
[0025] According to embodiments of the present invention, a battery
protection circuit module package capable of easily achieving high
integration and size reduction may be provided. However, the scope
of the present invention is not limited to the above-described
effect.
DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a circuit diagram of a battery protection circuit
for configuring a battery protection circuit module package,
according to an embodiment of the present invention.
[0027] FIG. 2 is a structural view showing the configuration of a
multilayer chip for configuring the battery protection circuit
module package, according to an embodiment of the present
invention.
[0028] FIG. 3 is a cross-sectional view showing the configurations
of a lead frame and a battery protection circuit device for
configuring the battery protection circuit module package,
according to an embodiment of the present invention.
[0029] FIG. 4 is a detailed plan view showing the structure of the
lead frame for configuring the battery protection circuit module
package, according to an embodiment of the present invention.
[0030] FIG. 5 is a detailed plan view showing the configuration of
the battery protection circuit device for configuring the battery
protection circuit module package, according to an embodiment of
the present invention.
[0031] FIG. 6 includes perspective and plan views of a part of a
battery protection circuit module package according to an
embodiment of the present invention.
[0032] FIG. 7 is a plan view of a part of a battery protection
circuit module package according to a comparative example of the
present invention.
[0033] FIG. 8A is a circuit diagram of a battery protection circuit
for configuring a part of a battery protection circuit module
package, according to another embodiment of the present
invention.
[0034] FIG. 8B is a circuit diagram of a battery protection circuit
for configuring a part of a battery protection circuit module
package, according to another embodiment of the present
invention.
[0035] FIG. 8C is a structural view of a battery protection circuit
and a fuel gauge circuit for configuring a part of a battery
protection circuit module package, according to another embodiment
of the present invention.
[0036] FIGS. 9A and 10A are perspective views of a device package
of a battery protection circuit module package, according to some
embodiments of the present invention.
[0037] FIGS. 9B and 10B are perspective views of a device package
of a battery protection circuit module package, according to other
embodiments of the present invention.
[0038] FIG. 11 is a partially exploded perspective view of portion
E of FIG. 9A or 9B.
[0039] FIG. 12A is a perspective view showing a process for
mounting the device package on a terminal lead frame in the battery
protection circuit module package, according to some embodiments of
the present invention.
[0040] FIG. 12B is a perspective view showing a process for
mounting the device package on a terminal lead frame in the battery
protection circuit module package, according to other embodiments
of the present invention.
[0041] FIG. 13A is a perspective view of the battery protection
circuit module package according to some embodiments of the present
invention.
[0042] FIG. 13B is a perspective view of the battery protection
circuit module package according to other embodiments of the
present invention.
[0043] FIG. 14 is a perspective view of the battery protection
circuit module package according to embodiments of the present
invention.
[0044] FIG. 15 is a perspective view showing a process for
combining the battery protection circuit module package with a
battery can, according to at least some embodiments of the present
invention.
[0045] FIG. 16 is a perspective view of a positive temperature
coefficient (PTC) structure for configuring the battery protection
circuit module package, according to at least some embodiments of
the present invention.
[0046] FIG. 17 illustrates the battery protection circuit module
package according to at least some embodiments of the present
invention.
[0047] FIG. 18 is a perspective view showing a process for
combining the battery protection circuit module package with the
battery can, according to at least some embodiments of the present
invention.
[0048] FIG. 19 is a perspective view of a battery pack including
the battery protection circuit module package, according to at
least some embodiments of the present invention.
[0049] FIG. 20 is a flowchart of a method of manufacturing the
device package of the battery protection circuit module package,
according to at least some embodiments of the present
invention.
MODE OF THE INVENTION
[0050] Hereinafter, the present invention will be described in
detail by explaining embodiments of the invention with reference to
the attached drawings.
[0051] The invention may, however, be embodied in many different
forms and should not be construed as being limited to the
embodiments set forth herein; rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the concept of the invention to one of ordinary
skill in the art. In the drawings, the thicknesses of layers are
exaggerated for clarity.
[0052] It will also be understood that when a layer is referred to
as being "on" another layer or substrate, it can be directly on the
other layer or substrate, or intervening layers may also be
present. In the drawings, the thicknesses of layers and regions are
exaggerated for clarity. Like reference numerals in the drawings
denote like elements. As used herein, the term "and/or" refers to
one of or a combination of at least two listed items.
[0053] It will be understood that, although the terms first,
second, third, etc., may be used herein to describe various
elements, components, regions, layers and/or sections, these
elements, components, regions, layers and/or sections should not be
limited by these terms. These terms are only used to distinguish
one element, component, region, layer or section from another
element, component, region, layer or section. Thus, a first
element, component, region, layer or section discussed below could
be termed a second element, component, region, layer or section
without departing from the teachings of the present invention.
[0054] Spatially relative terms, such as "above," "upper,"
"beneath," "below," "lower," and the like, may be used herein for
ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. It will be understood that the spatially relative
terms are intended to encompass different orientations of the
device in use or operation in addition to the orientation depicted
in the figures. For example, if the device in the figures is turned
over, elements described as "below" or "beneath" other elements or
features would then be oriented "above" the other elements or
features. Thus, the term "above" may encompass both an orientation
of above and below. The device may be otherwise oriented (rotated
90 degrees or at other orientations) and the spatially relative
descriptors used herein interpreted accordingly.
[0055] The terminology used herein is for the purpose of describing
particular embodiments and is not intended to limit the invention.
As used herein, the singular forms "a", "an", and "the" are
intended to include the plural forms as well, unless the context
clearly indicates otherwise. It will be further understood that the
terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0056] Embodiments of the invention are described herein with
reference to schematic illustrations of idealized embodiments (and
intermediate structures) of the invention. As such, variations from
the shapes of the illustrations as a result, for example, of
manufacturing techniques and/or tolerances, are to be expected.
Thus, the embodiments of the invention should not be construed as
limited to the particular shapes of regions illustrated herein, but
are to include deviations in shapes that result, for example, from
manufacturing.
[0057] This application claims the benefit of priority to Korean
Patent Application Nos. 10-2013-0042566, 10-2013-0043289,
10-2013-0043290, 10-2013-0043291, and 10-2013-0046036 filed with
the Korean Intellectual Property Office, the disclosures of which
are incorporated herein by reference in their entirety.
[0058] In embodiments of the present invention, a lead frame is an
element in which lead terminals are patterned on a metal frame, and
may differ from a printed circuit board (PCB) in which a metal
wiring layer is provided on an insulating core, in terms of
structures or thicknesses thereof.
[0059] FIG. 1 is a circuit diagram of a battery protection circuit
10 for configuring a battery protection circuit module package,
according to an embodiment of the present invention.
[0060] As illustrated in FIG. 1, the battery protection circuit 10
according to an embodiment of the present invention includes first
and second internal connection terminals B+ and B- to be connected
to a battery cell, and first to third external connection terminals
P+, CF, and P- to be connected to a charger for charging and to be
connected to an electronic device (e.g., a portable device)
operating by battery power, for discharging. Herein, among the
first to third external connection terminals P+, CF, and P-, the
first and third external connection terminals P+ and P- are used to
supply power and the other second external connection terminal CF
is used to detect a battery type and perform charging appropriately
for the battery type. In addition, the second external connection
terminal CF may be provided as a thermistor for detecting battery
temperature when charging, and may be used as a terminal having
another function.
[0061] The battery protection circuit 10 has a structure in which a
dual FET chip 110, a protection integrated circuit (IC) 120,
resistors R1, R2, and R3, a varistor V1, and capacitors C1 and C2
are connected to each other. The dual FET chip 110 includes first
and second field effect transistors FET1 and FET2 having a common
drain. The protection IC 120 has a terminal (e.g., VDD) connected
through the resistor R1 to the first internal connection terminal
B+ serving as (+) terminal of the battery, applying a charge or
discharge voltage through a first node n1, and detecting a battery
voltage, a reference terminal (e.g., VSS) for providing a reference
voltage of an internal operation voltage of the protection IC 120,
a detection terminal (e.g., V-) for detecting charge/discharge and
overcurrent states, a discharge off signal output terminal (e.g.,
DO) for switching off the first field effect transistor FET1 in
overdischarge state, and a charge off signal output terminal (e.g.,
CO) for switching off the second field effect transistor FET2 in
overcharge state.
[0062] Here, the protection IC 120 includes a reference voltage
setter, a comparer for comparing a reference voltage and a
charge/discharge voltage to each other, an overcurrent detector,
and a charge/discharge detector. Herein, reference voltages for
determining the charge and discharge states may be changed
depending on specifications required by a user, and the charge and
discharge states are determined based on the reference voltages by
detecting the voltage difference between terminals of the
protection IC 120.
[0063] The protection IC 120 is configured in such a manner that
the terminal DO is changed to LOW state to switch off the first
field effect transistor FET1 in overdischarge state, that the
terminal CO is changed to LOW state to switch off the second field
effect transistor FET2 in overcharge state, and that the second
field effect transistor FET2 is switched off when charging and the
first field effect transistor FET1 is switched off when discharging
in overcurrent state.
[0064] The resistor R1 and the capacitor C1 stabilize variations in
power supply of the protection IC 120. The resistor R1 is connected
between the first node n1 serving as a power (V1) supply node of
the battery, and the terminal VDD of the protection IC 120, and the
capacitor C1 is connected between the terminal VDD and the terminal
VSS of the protection IC 120. Herein, the first node n1 is
connected to the first internal connection terminal B+ and the
first external connection terminal P+. If the resistor R1 has a
high value, when a voltage is detected, the detected voltage is
increased due to a current flowing into the protection IC 120. As
such, the value of the resistor R1 is set to an appropriate value
equal to or less than 1 K.OMEGA.. In addition, for stable
operation, the capacitor C1 has an appropriate value equal to or
greater than 0.01 .mu.F.
[0065] The resistors R1 and R2 serve as a current limiter if a
charger provides a high voltage exceeding absolute maximum ratings
of the protection IC 120 or if the charger is connected with wrong
polarity. The resistor R2 is connected between the terminal V- of
the protection IC 120 and a second node n2 connected to a source
terminal S2 of the second field effect transistor FET2. Since the
resistors R1 and R2 are closely related to power consumption, a sum
of the values of the resistors R1 and R2 is set to be greater than
1 K.OMEGA.. In addition, since recovery may not occur after
overcharge blocking if the value of the resistor R2 is excessively
large, the value of the resistor R2 is set to a value equal to or
less than 10 K.OMEGA..
[0066] The capacitor C2 is connected between the second node n2 (or
the third external connection terminal P-) and a source terminal S1
of the first field effect transistor FET1 (or the terminal VSS or
the second internal connection terminal B-). The capacitor C2 does
not exert a strong influence on product features of the battery
protection circuit 10, but is added upon a request of the user or
for stability. The capacitor C2 is used to achieve system
stabilization by improving tolerance to voltage variations or
external noise.
[0067] The resistor R3 and the varistor V1 are devices for
electrostatic discharge (ESD) and surge protection, and are
connected in parallel to each other between the second external
connection terminal CF and the second node n2 (or the third
external connection terminal P-). The varistor V1 is a device for
reducing resistance thereof when overvoltage occurs, and may
minimize, for example, circuit damage due to overvoltage.
[0068] According to an embodiment of the present invention, the
battery protection circuit module package is implemented by
packaging the battery protection circuit 10 of FIG. 1 which
includes the external connection terminals P+, P-, and CF, and the
internal connection terminals B+ and B-.
[0069] The above-described battery protection circuit 10 according
to an embodiment of the present invention is merely an example, and
the configuration, number, or disposition of the protection IC 120,
the field effect transistors FET1 and FET2, or the passive devices
R1, R2, R3, C1, C2, and V1 may be appropriately changed depending
on the function of the battery protection circuit 10.
[0070] FIG. 2 is a structural view showing the configuration of a
multilayer chip 100a for configuring the battery protection circuit
module package, according to an embodiment of the present
invention.
[0071] As illustrated in FIG. 2, the dual FET chip 110 and the
protection IC 120 are stacked on one another or provided adjacent
to each other. For example, the protection IC 120 may be stacked on
a top surface of the dual FET chip 110, or the dual FET chip 110
may be provided adjacent to a left or right side of the protection
IC 120.
[0072] The dual FET chip 110 includes two field effect transistors
(FETs) having a common drain, i.e., the first and second field
effect transistors FET1 and FET2, and external connection terminals
include a first gate terminal G1 and a first source terminal S1 of
the first field effect transistor FET1 and a second gate terminal
G2 and a second source terminal S2 of the second field effect
transistor FET2 which are provided on the top surface of the dual
FET chip 110. In addition, a common drain terminal D may be
provided on a bottom surface of the dual FET chip 110.
[0073] The protection IC 120 is stacked on the top surface of the
dual FET chip 110. The protection IC 120 is stacked on an area
(e.g., a central area) of the dual FET chip 110 other than the area
having provided the external connection terminals thereon. In this
case, an insulating layer for insulation may be provided between
the protection IC 120 and the dual FET chip 110, and the protection
IC 120 and the dual FET chip 110 may be bonded to each other using
an insulating adhesive. Since the dual FET chip 110 is generally
smaller than the protection IC 120, the protection IC 120 is
stacked on the dual FET chip 110.
[0074] After the protection IC 120 is stacked on the top surface of
the dual FET chip 110, the terminal DO of the protection IC 120 is
electrically connected to the first gate terminal G1 through wire
or wiring, and the terminal CO of the protection IC 120 is
electrically connected to the second gate terminal G2 through wire
or wiring. A description of connections of the other terminals will
be given below. The protection IC 120 and the dual FET chip 110
which are stacked on one another as described above are called `the
multilayer chip 100a`.
[0075] In the battery protection circuit module package according
to an embodiment of the present invention, by employing the
protection IC 120 and the dual FET chip 110 stacked on one another,
a mounting area thereof on a lead frame to be described below may
be reduced and thus a battery may achieve a small size or a high
capacity.
[0076] FIG. 3 is a cross-sectional view showing the configurations
of a lead frame 50 and a battery protection circuit device 130 and
100a for configuring the battery protection circuit module package,
according to an embodiment of the present invention, and FIGS. 4
and 5 are detailed plan views of the lead frame 50 and the battery
protection circuit device 130 and 100a illustrated in FIG. 3.
[0077] Referring to FIGS. 3 and 4, a protection circuit structure
200a for configuring the battery protection circuit module package
according to an embodiment of the present invention is illustrated.
The protection circuit structure 200a includes the lead frame 50
and the battery protection circuit device 130 and 100a mounted on
the lead frame 50.
[0078] The lead frame 50 has a structure in which a first internal
connection terminal area A1, an external connection terminal area
A2, a protection circuit area of a device area A3 and a chip area
A4, and a second internal connection terminal area A5 are
sequentially provided. The protection circuit area is provided
between the external connection terminal area A2 and the second
internal connection terminal area A5, and the order of the device
area A3 and the chip area A4 may be changed in various ways. A top
surface 50a of the lead frame 50 is a surface for mounting the
battery protection circuit device 130 and 100a thereon, and a
bottom surface 50b of the lead frame 50 may be a surface opposite
to the top surface 50a. A part of the bottom surface 50b of the
lead frame 50 corresponding to the external connection terminal
area A2 may be entirely or partially plated. A plating material may
include at least one selected from the group consisting of gold,
silver, nickel, tin, and chromium.
[0079] The first and second internal connection terminal areas A1
and A5 are provided at two edges of the module package, and first
and second internal connection terminal leads B+ and B- serving as
first and second internal connection terminals connected to a
battery bare cell accommodated in a battery can are provided
thereon, respectively.
[0080] The external connection terminal area A2 is provided
adjacent to the first internal connection terminal area A1, and
first to third external connection terminal leads P+, CF, and P-
serving as a plurality of external connection terminals are
sequentially provided thereon. The order of the first to third
external connection terminal leads P+, CF, and P- may be changed in
various ways. Herein, the first external connection terminal lead
P+ and the first internal connection terminal lead B+ are connected
to each other. That is, the first internal connection terminal lead
B+ may extend from the first external connection terminal lead P+,
or the first external connection terminal lead P+ may extend from
the first internal connection terminal lead B+.
[0081] The device area A3 is used to provide thereon the passive
devices R1, R2, R3, C1, C2, and V1 for configuring the battery
protection circuit 10. Although the device area A3 includes a
single lead in FIG. 3 for convenience, the device area A3 may be
configured as illustrated in FIG. 4 to provide thereon, for
example, first to sixth passive device leads L1, L2, L3, L4, L5,
and L6 formed of conductive lines. For example, the first to third
passive device leads L1, L2, and L3 may be sequentially provided on
an upper part of the device area A3, and the fourth to sixth
passive device leads L4, L5, and L6 may be sequentially provided on
a lower part of the device area A3.
[0082] The first passive device lead L1 is provided with a certain
size on the device area A3 adjacent to the external connection
terminal area A2, and the second passive device lead L2 is provided
adjacent to the first passive device lead L1 with a certain size.
The third passive device lead L3 is provided adjacent to the second
passive device lead L2 with a certain size on the device area A3
adjacent to the chip area A4.
[0083] The fourth passive device lead L4 is provided with a certain
size on the device area A3 adjacent to the external connection
terminal area A2, and the fifth and sixth passive device leads L5
and L6 are provided adjacent to the fourth passive device lead L4
in such a manner that the fifth passive device lead L5 surrounds
the sixth passive device lead L6.
[0084] The chip area A4 is an area adjacent to the device area A3
and used to provide thereon the protection IC 120 and the dual FET
chip 110 for configuring the battery protection circuit 10. For
example, a die pad DP for mounting thereon the multilayer chip 100a
illustrated in FIG. 2 may be provided on the chip area A4. The die
pad DP may be electrically connected to the common drain terminal
of the dual FET chip 110 for configuring the multilayer chip 100a,
and may be exposed in a subsequent packaging process to serve as
external connection terminals and to improve heat radiation
properties.
[0085] Referring to FIGS. 3 and 5, the passive devices R1, R2, R3,
C1, C2, and V1 and the multilayer chip 100a are provided on the
lead frame 50 illustrated in FIG. 4, and the equivalent circuit
illustrated in FIG. 1 is configured through, for example, wire
bonding 220.
[0086] Initially, the multilayer chip 100a is mounted on the die
pad DP of the chip area A4, and the reference voltage terminal VSS
of the protection IC 120 for configuring the multilayer chip 100a
is electrically connected to the source terminal S1 of the first
field effect transistor FET1 or the third passive device lead L3
through wire bonding.
[0087] The voltage application and battery voltage detection
terminal VDD for applying a charge voltage and a discharge voltage
in the protection IC 120 is electrically connected to the second
passive device lead L2 through, for example, wire bonding, and the
detection terminal V- for detecting charge/discharge and
overcurrent states in the protection IC 120 is electrically
connected to the sixth passive device lead L6 through wire
bonding.
[0088] The source terminal S1 of the first field effect transistor
FET1 is electrically connected to the third passive device lead L3
through, for example, wire bonding, and the source terminal S2 of
the second field effect transistor FET2 is electrically connected
to the fifth passive device lead L5 through, for example, wire
bonding.
[0089] Then, the first passive device lead L1 and the first
external connection terminal lead P+ are electrically connected to
each other through, for example, wire bonding, and the third
passive device lead L3 and the second internal connection terminal
lead B- are electrically connected to each other through, for
example, wire bonding. The fourth passive device lead L4 is
electrically connected to the second external connection terminal
lead CF through wire bonding, and the fifth passive device lead L5
is electrically connected to the third external connection terminal
lead L3 through, for example, wire bonding. Among the plurality of
passive devices R1, R2, R3, C1, C2, and V1, the first resistor R1
is provided between the first and second passive device leads L1
and L2, and the second resistor R2 is provided between the fifth
and sixth passive device leads L5 and L6.
[0090] Among the plurality of passive devices R1, R2, R3, C1, C2,
and V1, the third resistor R3 for configuring a surge protection
circuit is provided between the fourth and fifth passive device
leads L4 and L5, the first capacitor C1 is provided between the
second and third passive device leads L2 and L3, and the second
capacitor C2 is provided between the third and fifth passive device
leads L3 and L5.
[0091] Among the plurality of passive devices R1, R2, R3, C1, C2,
and V1, the varistor V1 for configuring the surge protection
circuit is provided between the fourth and fifth passive device
leads L4 and L5 in parallel to the third resistor R3.
[0092] The circuit diagram of the battery protection circuit 10
illustrated in FIG. 1 and the protection circuit structure 200a
illustrated in FIG. 5 to implement the battery protection circuit
10 may be changed in various ways, and thus a variety of modified
structures may be implemented.
[0093] For example, in a first modified structure, the first and
second field effect transistors FET1 and FET2 and the protection IC
120 may be integrated into one chip. The integrated chip may be
mounted on the lead frame 50 in the form of a flip chip. Since the
flip chip has external terminals electrically connected to, for
example, a lead through soldering instead of wire bonding, compared
to the wire bonding process, electrical conductivity may be
improved, production costs may be lowered, process simplification
may be achieved, and a small space may be occupied.
[0094] In a second modified structure, the first and second field
effect transistors FET1 and FET2 may not be implemented as a dual
FET chip but may be separately provided on the lead frame 50. In
this case, to electrically interconnect a drain of the first field
effect transistor FET1 and a drain of the second field effect
transistor FET2, a conductive plate for interconnecting bottom
parts of the lead frame 50 may be additionally provided.
[0095] The protection circuit structure 200a illustrated in FIG. 5
or the above-described modified structure may be packaged, e.g.,
molded with an encapsulant 250, to configure the battery protection
circuit module package as illustrated in FIG. 6.
[0096] (a) of FIG. 6 illustrates a bottom surface of a battery
protection circuit module package 300 according to an embodiment of
the present invention, and (b) of FIG. 6 illustrates a top surface
of the battery protection circuit module package 300. For example,
the bottom surface of the battery protection circuit module package
300 may correspond to the top surface 50a of the lead frame 50, and
the top surface of the battery protection circuit module package
300 may correspond to the bottom surface 50b of the lead frame 50.
The battery protection circuit module package 300 is configured to
expose the external connection terminals P+, CF, and P- on the top
surface thereof, and to expose the first and second internal
connection terminals B+ and B- on the bottom surface thereof.
Herein, the battery protection circuit module package 300 may be
packaged to additionally expose a bottom surface of the die pad DP
(a surface opposite to the surface having mounted the multilayer
chip 100a thereon) on the top surface thereof for heat radiation or
another purpose. At least one of the first and second internal
connection terminal leads B+ and B- may be bent in the form of a
gull.
[0097] FIG. 7 is a plan view of a part of a battery protection
circuit module package 300 according to a comparative example of
the present invention.
[0098] As illustrated in FIG. 6, the battery protection circuit
module package 300 according to an embodiment of the present
invention exposes the three external connection terminals P+, CF,
and P- on the top surface thereof, and an area D between the
external connection terminals P+, CF, and P- and the second
internal connection terminal lead B- corresponds to an area for
providing thereon the protection IC 120 and the dual FET chip 110
for configuring the battery protection circuit 10, and an area for
providing thereon the passive devices R1, R2, R3, C1, C2, and V1
for configuring the battery protection circuit 10.
[0099] As illustrated in FIG. 7, the battery protection circuit
module package 300 according to the comparative example of the
present invention may expose the three external connection
terminals P+, CF, and P- on a top surface thereof, and expose
additional external connection terminals 50-1 and 50-2 on the area
D. In this case, to additionally ensure an area for providing
thereon the protection IC 120 and the dual FET chip 110 for
configuring the battery protection circuit 10, and an area for
providing thereon the passive devices R1, R2, R3, C1, C2, and V1
for configuring the battery protection circuit 10, the length of
the battery protection circuit module package 300 should be
increased. However, the battery protection circuit module package
300 is mounted on a top surface of a battery bare cell and thus the
length thereof is restricted. Particularly, if the battery
protection circuit module package 300 needs to be provided only at
a side part based on the center of the top surface of the battery
bare cell, the length thereof is further restricted. Therefore, the
battery protection circuit module package 300 according to an
embodiment of the present invention may not be easily implemented
when the number of external connection terminals is equal to or
greater than 4. A description is now given of a battery protection
circuit module package capable of easily achieving high integration
and size reduction when the number of external connection terminals
is equal to or greater than 4, according to another embodiment of
the present invention.
[0100] FIGS. 9A and 10A are perspective views of a device package
302a of a battery protection circuit module package 304a, according
to some embodiments of the present invention, FIG. 11 is a
partially exploded perspective view of portion E of FIG. 9A, FIG.
12A is a perspective view showing a process for mounting the device
package 302a on a terminal lead frame 70 in the battery protection
circuit module package 304a, according to some embodiments of the
present invention, FIGS. 13A and 14 are perspective views of the
battery protection circuit module package 304a according to some
embodiments of the present invention, FIG. 15 is a perspective view
showing a process for combining the battery protection circuit
module package 304a with a battery can 400, according to at least
some embodiments of the present invention, and FIG. 19 is a
perspective view of a battery pack 600 including the battery
protection circuit module package 304a, according to at least some
embodiments of the present invention.
[0101] Referring to FIGS. 9A, 10A, 11, 12A, 13A, 14, and 15, the
battery protection circuit module package 304a according to another
embodiment of the present invention includes the terminal lead
frame 70 and the device package 302a.
[0102] The terminal lead frame 70 includes first and second
internal connection terminal leads 70-1 and 70-7 provided at two
edges of the terminal lead frame 70 and electrically connected to
electrode terminals 420 and 430 of a battery bare cell, and
external connection terminal leads 70-2, 70-3, 70-4, 70-5, and 70-6
provided between the first and second internal connection terminal
leads 70-1 and 70-7 and serving as a plurality of external
connection terminals. The external connection terminals may include
four or more external connection terminals. For example, as
illustrated in FIG. 12A, the terminal lead frame 70 may include the
fourth and fifth external connection terminal leads 70-5 and 70-6
in addition to the first to third external connection terminal
leads P+, CF, and P-. The fifth external connection terminal lead
70-6 may be configured to be connected to the second internal
connection terminal lead 70-7 by, for example, changing the design
of the terminal lead frame 70, and thus may be used to evaluate
electrical properties of the battery protection circuit module
package 304a. The terminal lead frame 70 may be formed of nickel,
copper, nickel-plated copper, or other metal. Furthermore, surfaces
of the external connection terminal leads of the terminal lead
frame 70, which face the outside of a battery, (e.g., surfaces
illustrated in FIG. 15) may be entirely or partially plated. A
plating material may include at least one selected from the group
consisting of gold, silver, nickel, tin, and chromium.
[0103] The device package 302a includes a substrate having provided
a battery protection circuit device 110, 120, and 130 thereon. For
example, the device package 302a may include a substrate having
provided a field effect transistor (FET) 110, a protection IC 120,
and one or more passive devices 130 thereon. The device package
302a may further include an encapsulant 250 for encapsulating the
battery protection circuit device 110, 120, and 130. The
encapsulant 250 may include, for example, an epoxy molding compound
(EMC). The device package 302a is mounted on the terminal lead
frame 70 to be electrically connected to the terminal lead frame
70. For example, the device package 302a may be mounted on the
terminal lead frame 70 using surface mounting technology. One or
more exposure terminals 60-3, 60-4, 60-5, 60-6, and 60-7 may be
provided on a bottom surface of the device package 302a.
Furthermore, optionally, one or more exposure terminals 60-1 and
60-2 may be provided on a top surface of the device package 302a.
The encapsulant 250 for encapsulating the battery protection
circuit device 110, 120, and 130 may be provided to expose the
exposure terminals 60-1, 60-2, 60-3, 60-4, 60-5, 60-6, and 60-7.
The exposure terminals 60-3, 60-4, 60-5, 60-6, and 60-7 provided on
the bottom surface of the device package 302a may be bonded and
electrically connected to at least parts of the terminal lead frame
70, thereby configuring at least a part of the circuit illustrated
in FIG. 1, 8A, 8B, or 8C.
[0104] The substrate of the device package 302a capable of
providing the battery protection circuit device 110, 120, and 130
thereon may include a lead frame, a printed circuit board (PCB), a
ceramic substrate, or a glass substrate.
[0105] For example, referring to FIG. 11, the substrate may include
a mounting lead frame 60 having a plurality of mounting leads
spaced apart from each other. The battery protection circuit device
directly mounted on the substrate may include the FET 110, the
protection IC 120, and the passive devices 130. The passive devices
130 may include capacitors, resistors, and/or a varistor. In the
battery protection circuit module package 304a according to another
embodiment of the present invention, the device package 302a
including the mounting lead frame 60 may configure a battery
protection circuit without using a PCB. This configuration may be
implemented by providing the passive devices 130 to interconnect at
least some of the mounting leads spaced apart from each other, and
providing an electrical connection member for electrically
interconnecting any two selected from the group consisting of the
protection IC 120, the FET 110, and the mounting leads. The passive
devices 130 may not be inserted and fixed into the mounting lead
frame 60 but may be mounted and fixed onto at least parts of the
surface of the mounting lead frame 60 using surface mounting
technology. The electrical connection member may include bonding
wire or bonding ribbon.
[0106] According to embodiments of the present invention in which
the substrate includes the mounting lead frame 60 having the
mounting leads spaced apart from each other, since a battery
protection circuit is configured by providing the electrical
connection member such as bonding wire or bonding ribbon on the
mounting lead frame 60, a process for designing and manufacturing
the mounting lead frame 60 for configuring the battery protection
circuit may be simplified. According to embodiments of the present
invention, if the electrical connection member is not employed to
configure the battery protection circuit, the configuration of the
mounting leads of the mounting lead frame 60 may be very
complicated and thus the mounting lead frame 60 may not be
appropriately and efficiently provided.
[0107] According to embodiments of the present invention in which
the substrate is configured with the mounting lead frame 60, the
protection IC 120 and the FET 110 may not be inserted and fixed
into the mounting lead frame 60 in the form of a semiconductor
package but may be mounted and fixed onto at least parts of the
surface of the mounting lead frame 60 using surface mounting
technology in the form of a chip die not encapsulated with an
encapsulant but sawed on a wafer. Herein, the chip die refers to an
individual structure not encapsulated with an encapsulant but
implemented by performing a sawing process on a wafer having an
array of a plurality of structures (e.g., the protection IC 120 and
the FET 110) thereon. That is, when the protection IC 120 and the
FET 110 are mounted on the mounting lead frame 60, since the
protection IC 120 and the FET 110 are mounted in non-encapsulated
state and then are encapsulated with the encapsulant 250, only one
encapsulation process is necessary to implement the battery
protection circuit module package 304a. On the contrary, when the
passive devices 130, the protection IC 120, and the FET 110 are
inserted and fixed or mounted into a PCB, since each component
requires a molding process and then additionally requires another
molding process after being fixed or mounted on the PCB, a
manufacturing process is complicated and a manufacturing cost is
high.
[0108] FIG. 20 is a flowchart of a method of manufacturing a device
package of a battery protection circuit module package, according
to at least some embodiments of the present invention.
[0109] Referring to FIG. 20, a method of manufacturing the device
package 302a in which the substrate is configured with the mounting
lead frame 60, according to an embodiment of the present invention,
includes providing the mounting lead frame 60 including a plurality
of leads spaced apart from each other (S10), mounting the
protection IC 120 and the FET 110 on the mounting lead frame 60
(S20), mounting the passive devices 130 on the mounting lead frame
60 to interconnect at least some of the leads, before or after step
S20 (S30), providing an electrical connection member for
electrically interconnecting any two selected from the group
consisting of the protection IC 120, the FET 110, and the leads
(S40), and providing the encapsulant 250 for encapsulate the
protection IC 120, the FET 110, and the passive devices 130 to
expose parts of the mounting lead frame 60 (S50).
[0110] In the method according to some embodiments of the present
invention, the mounting of the protection IC 120 and the FET 110 on
the mounting lead frame 60 in the form of a chip die (S20) and the
mounting of the passive devices 130 on the mounting lead frame 60
to interconnect at least some of the leads (S30) may be performed
sequentially, in reverse order, simultaneously, or alternately.
[0111] The mounting of the protection IC 120 and the FET 110 on the
mounting lead frame 60 (S20) includes mounting the protection IC
120 and the FET 110 the mounting lead frame 60 using surface
mounting technology in the form of a chip die not encapsulated with
an encapsulant but sawed on a wafer.
[0112] Meanwhile, the substrate of the device package 302a capable
of providing the battery protection circuit device 110, 120, and
130 thereon may include a printed circuit board (PCB). In this
case, the battery protection circuit device 110, 120, and 130 may
be provided on the PCB.
[0113] Referring to FIGS. 15 and 19, the battery protection circuit
module package 304a having the above-described structure is
inserted between an upper case 500 and a top surface of the battery
bare cell accommodated in the battery can 400, thereby configuring
the battery pack 600 illustrated in FIG. 19. The upper case 500 is
formed of a plastic material and has through holes 550 to expose
the external connection terminals P+, CF, and P- and the additional
external connection terminals 70-5 and 70-6. The battery pack 600
may be understood as a battery generally used in a mobile phone or
a portable device.
[0114] The battery bear cell includes an electrode assembly and a
cap assembly. The electrode assembly may include a positive plate
produced by coating a positive active material on a positive
current collector, a negative plate produced by coating a negative
active material on a negative current collector, and a separator
provided between the positive and negative plates to prevent a
short circuit therebetween and allowing lithium ions to move. A
positive tap adhered to the positive plate and a negative tap
adhered to the negative plate protrude from the electrode
assembly.
[0115] The cap assembly includes a negative terminal 410, a gasket
420, and a cap plate 430. The cap plate 430 may serve as a positive
terminal. The negative terminal 410 may also be called a negative
cell or an electrode cell. The gasket 420 may be formed of an
insulating material to insulate the negative terminal 410 and the
cap plate 430 from each other. Accordingly, electrode terminals of
the battery bear cell may include the negative terminal 410 and the
cap plate 430.
[0116] That is, the electrode terminals of the battery bare cell
include a plate 430 having a first polarity (e.g., positive
polarity) and an electrode cell 410 having a second polarity (e.g.,
negative polarity) and provided at the center of the plate 430, and
the first internal connection terminal lead B+ of the terminal lead
frame 70 may be directly bonded and electrically connected to the
plate 430 having the first polarity (e.g., positive polarity) while
the second internal connection terminal lead B- of the terminal
lead frame 70 may be directly bonded and electrically connected to
the electrode cell 410 having the second polarity (e.g., negative
polarity). In this case, the length of the terminal lead frame 70
may correspond to a length L/2 from one end of the plate 430 having
the first polarity (e.g., positive polarity) to the electrode cell
410 having the second polarity (e.g., negative polarity). According
to this embodiment, since the battery protection circuit module
package 304a has four or more external connection terminals 70-2,
70-3, 70-4, 70-5, and 70-6, and is mounted using only a side part
based on the electrode cell 410 having the second polarity (e.g.,
negative polarity), a battery may achieve a small size or a high
capacity. For example, by further providing a cell on the other
side part based on the electrode cell 410, the capacity of the
battery may be increased or a chip having another function may be
additionally provided, and thus products having such battery may be
reduced in size.
[0117] Furthermore, at least one of the first internal connection
terminal lead B+ or 70-1 and the second internal connection
terminal lead B- or 70-7 may be bent in the form of a gull to be
bonded to the electrode terminal of the battery bare cell. For
example, the first internal connection terminal lead B+ or 70-1 may
be bent in the form of a gull to be directly bonded and fixed to
the plate 430 having the first polarity (e.g., positive polarity).
The second internal connection terminal lead B- or 70-7 is bonded
and fixed to the negative terminal 410 having the second polarity
(e.g., negative polarity). The bonding process may be performed
using any one selected from the group consisting of laser welding,
resistance welding, soldering, a conductive adhesive (e.g.,
conductive epoxy), and conductive tape. Accordingly, since the
first and second internal connection terminal leads B+ and B- are
bonded to the electrode terminals of the battery bare cell, the
battery protection circuit module package 304a may be stably fixed.
Therefore, according to embodiments of the present invention, since
a process for bending sides of a lead frame and bonding the bent
sides of the lead frame to the battery can 400 accommodating the
battery bare cell is not necessary, a manufacturing process may be
simplified and a final product, e.g., a battery, may achieve a
small size.
[0118] According to a modified embodiment of the present invention,
instead of the plate 430 having the first polarity (e.g., positive
polarity), a first-polarity terminal (not shown) may be provided as
the electrode terminal of the battery bare cell. In this case, the
first internal connection terminal lead B+ may be directly bonded
and electrically connected to the first-polarity terminal, and the
second internal connection terminal lead B- may be directly bonded
and electrically connected to the electrode cell 410 having the
second polarity (e.g., negative polarity). In this case, the length
of the lead frame 50 may correspond to a length from the
first-polarity terminal to the electrode cell 410 having the second
polarity (e.g., negative polarity). Even in this case, since the
battery protection circuit module package 304a is mounted using
only a side part based on the electrode cell 410 having the second
polarity (e.g., negative polarity), a battery may achieve a small
size or a high capacity.
[0119] The above-described configurations of the battery protection
circuit module package 304a and the battery pack 600 may be applied
to implement battery protection circuits illustrated in FIGS. 8A to
8C.
[0120] FIG. 8A is a circuit diagram of a battery protection circuit
for configuring a part of a battery protection circuit module
package, according to another embodiment of the present
invention.
[0121] Referring to FIG. 8A, a near field communication (NFC)
circuit 131 may be added to the configuration of the battery
protection circuit 10 illustrated in FIG. 1, thereby supporting NFC
communication. The NFC circuit 131 may include, for example, an NFC
external connection terminal NFC1, NFC access terminals PD1 and
PD2, and NFC matching devices C3, C4, C5, and C6. The NFC access
terminals PD1 and PD2 may contact ends of an NFC antenna (not
shown) provided near a battery pack. The NFC antenna may be, for
example, a loop-type antenna. If the ends of the NFC antenna
contact the NFC access terminals PD1 and PD2, the NFC matching
devices C3, C4, C5, and C6 and the NFC antenna may be electrically
interconnected to form a closed loop. The NFC matching devices C3,
C4, C5, and C6 may be, for example, capacitors for frequency
matching. For example, the two ends of the NFC loop antenna may be
connected to the NFC matching devices C3, C4, C5, and C6, e.g.,
capacitors, to form a closed loop, and communication with an NFC
device may be performed by generating a frequency region of 13.56
MHz for NFC communication using resonance generated from the NFC
antenna and the capacitors.
[0122] When the NFC circuit 131 is added to the configuration of
the battery protection circuit 10 illustrated in FIG. 1, since the
NFC external connection terminal NFC1 is configured in addition to
the three external connection terminals P+, CF, and P-, the number
of external connection terminals included in the battery protection
circuit module package is 4. As described above in relation to FIG.
7, the battery protection circuit module package 300 according to
an embodiment of the present invention may not be easily
implemented when the number of external connection terminals is
equal to or greater than 4. The NFC external connection terminal
NFC1 may correspond to the fourth external connection terminal 50-1
of the battery protection circuit module package 300 illustrated in
FIG. 7. A battery protection circuit module package and a battery
pack capable of easily achieving high integration and size
reduction when the number of external connection terminals is equal
to or greater than 4, according to another embodiment of the
present invention are now described with reference to FIGS. 9A,
10A, 11, 12A, 13A, 14, 15, and 19. However, the descriptions given
above are omitted herein to avoid redundancy.
[0123] In the battery protection circuit module package 304a
according to another embodiment of the present invention, the
terminal lead frame 70 includes the external connection terminal
leads 70-2, 70-3, 70-4, 70-5, and 70-6 serving as a plurality of
external connection terminals. The external connection terminals
may include four or more external connection terminals. For
example, as illustrated in FIG. 14, the terminal lead frame 70 may
include the fourth and fifth external connection terminal leads
70-5 and 70-6 in addition to the first to third external connection
terminal leads P+, CF, and P-. The fourth external connection
terminal lead 70-5 may be the NFC external connection terminal NFC1
of FIG. 8A. The fifth external connection terminal lead 70-6 may be
configured to be connected to the second internal connection
terminal lead 70-7 by, for example, changing the design of the
terminal lead frame 70, and thus may be used to evaluate electrical
properties of the battery protection circuit module package
304a.
[0124] The device package 302a includes a substrate having provided
the battery protection circuit device 110, 120, and 130 thereon.
For example, the device package 302a may include a substrate having
provided the FET 110, the protection IC 120, and the passive
devices 130 thereon. Furthermore, the NFC matching devices C3, C4,
C5, and C6 illustrated in FIG. 8A may be provided on the substrate.
The device package 302a may further include the encapsulant 250 for
encapsulating the battery protection circuit device 110, 120, and
130 and the NFC matching devices C3, C4, C5, and C6. The
encapsulant 250 may include, for example, an epoxy molding compound
(EMC).
[0125] The exposure terminals 60-3, 60-4, 60-5, 60-6, and 60-7 may
be provided on a bottom surface of the device package 302a.
Furthermore, optionally, at least the exposure terminals 60-1 and
60-2 may be provided on a top surface of the device package 302a.
The exposure terminals 60-1 and 60-2 provided on the top surface of
the device package 302a may be, for example, the NFC access
terminals PD1 and PD2 illustrated in FIG. 8A. The NFC access
terminals PD1 and PD2 may be connected to ends of the NFC antenna,
and thus the NFC matching devices C3, C4, C5, and C6 and the NFC
antenna may be electrically interconnected to form a closed loop.
The encapsulant 250 for encapsulating the battery protection
circuit device 110, 120, and 130 and the NFC matching devices C3,
C4, C5, and C6 may be provided to expose the exposure terminals
60-1, 60-2, 60-3, 60-4, 60-5, 60-6, and 60-7. The exposure
terminals 60-3, 60-4, 60-5, 60-6, and 60-7 provided on the bottom
surface of the device package 302a may be bonded and electrically
connected to at least parts of the terminal lead frame 70, thereby
configuring at least a part of the circuit illustrated in FIG. 8A.
The disposition and number of the exposure terminals 60-1, 60-2,
60-3, 60-4, 60-5, 60-6, and 60-7 according to the current
embodiment are merely examples and may be changed in various ways
depending on the functions of the battery protection circuit and
the NFC circuit 131.
[0126] The substrate of the device package 302a capable of
providing the battery protection circuit device 110, 120, and 130
and the NFC matching devices C3, C4, C5, and C6 thereon may include
a lead frame, a printed circuit board (PCB), a ceramic substrate,
or a glass substrate.
[0127] For example, referring to FIG. 11, the substrate may include
the mounting lead frame 60 having a plurality of mounting leads
spaced apart from each other. The battery protection circuit device
directly mounted on the substrate may include the FET 110, the
protection IC 120, and the passive devices 130. The passive devices
130 may include capacitors, resistors, and/or a varistor. In the
battery protection circuit module package 304a according to another
embodiment of the present invention, the device package 302a
including the mounting lead frame 60 may configure a battery
protection circuit without using a PCB. This configuration may be
implemented by providing the passive devices 130 and/or the NFC
matching devices C3, C4, C5, and C6 to interconnect at least some
of the mounting leads spaced apart from each other, and providing
an electrical connection member for electrically interconnecting
any two selected from the group consisting of the protection IC
120, the FET 110, and the mounting leads. The electrical connection
member may include bonding wire or bonding ribbon.
[0128] FIG. 8B is a circuit diagram of a battery protection circuit
for configuring a part of a battery protection circuit module
package, according to another embodiment of the present
invention.
[0129] Referring to FIG. 8B, an authentication chip circuit
composition 132 may be added to a battery protection circuit
composition including the battery protection circuit 10 illustrated
in FIG. 1 or a battery protection circuit composition including the
battery protection circuit modified from the battery protection
circuit 10 illustrated in FIG. 1, thereby supporting an
authentication function. The authentication function may include
all additional functions for authenticating or identifying a
battery, a device including the battery, and a user using the
device. The authentication chip circuit composition 132 may
include, for example, an ID chip 134 and one or more passive
devices C5, V1, R4, and R5. The number, types, and disposition of
the passive devices C5, V1, R4, and R5 for configuring the
authentication chip circuit composition 132 illustrated in FIG. 8B
are merely examples, and may be changed depending on the purpose or
configuration of the authentication function. The authentication
chip circuit composition 132 may be connected to an external device
through an authentication chip external connection terminal ID.
[0130] When the authentication chip circuit composition 132 is
added to the configuration of the battery protection circuit 10
illustrated in FIG. 1, since the authentication chip external
connection terminal ID is configured in addition to three external
connection terminals P+, TH, and P-, the number of external
connection terminals included in the battery protection circuit
module package is 4. As described above in relation to FIG. 7, the
battery protection circuit module package 300 according to an
embodiment of the present invention may not be easily implemented
in terms of size reduction when the number of external connection
terminals is equal to or greater than 4. The authentication chip
external connection terminal ID may correspond to the fourth
external connection terminal 50-1 of the battery protection circuit
module package 300 illustrated in FIG. 7. A battery protection
circuit module package and a battery pack capable of easily
achieving high integration and size reduction when the number of
external connection terminals is equal to or greater than 4,
according to another embodiment of the present invention are now
described with reference to FIGS. 9B, 10B, 11, 12B, 13B, 14, 15,
and 19. However, the descriptions given above are omitted herein to
avoid redundancy.
[0131] In a battery protection circuit module package 304b
according to yet another embodiment of the present invention, the
terminal lead frame 70 includes the external connection terminal
leads 70-2, 70-3, 70-4, 70-5, and 70-6 serving as a plurality of
external connection terminals. The external connection terminals
may include four or more external connection terminals. For
example, as illustrated in FIG. 14, the terminal lead frame 70 may
include the fourth and fifth external connection terminal leads
70-5 and 70-6 in addition to the first to third external connection
terminals P+, TH, and P-. For example, the fourth external
connection terminal lead 70-5 may be the authentication chip
external connection terminal ID of FIG. 8B. The fifth external
connection terminal lead 70-6 may be configured to be connected to
the second internal connection terminal lead 70-7 by, for example,
changing the design of the terminal lead frame 70, and thus may be
used to evaluate electrical properties of the battery protection
circuit module package 304b.
[0132] A device package 302b includes a substrate having provided a
battery protection circuit composition 110, 120, and 130 and the
authentication chip circuit composition 132 thereon. For example,
the device package 302a may include a substrate having provided the
FET 110, the protection IC 120, and one or more first passive
devices 130 thereon. Herein, the first passive devices 130 may
include the passive devices illustrated in FIG. 1 or the passive
devices illustrated in FIG. 8B except for the authentication chip
circuit composition 132. Furthermore, the ID chip 134 and one or
more second passive devices C5, V1, R4, and R5 for configuring the
authentication chip circuit composition 132 illustrated in FIG. 8B
may be provided on the substrate. The device package 302b may
further include the encapsulant 250 for encapsulating the battery
protection circuit composition 110, 120, and 130 and the
authentication chip circuit composition 132. The encapsulant 250
may include, for example, an epoxy molding compound (EMC).
[0133] The device package 302b is mounted on the terminal lead
frame 70 to be electrically connected to the terminal lead frame
70. For example, the device package 302b may be mounted on the
terminal lead frame 70 using surface mounting technology. One or
more exposure terminals 60-1, 60-2, 60-3, 60-4, and 60-5 may be
provided on a bottom surface of the device package 302b. The
encapsulant 250 for encapsulating the battery protection circuit
composition 110, 120, and 130 and the authentication chip circuit
composition 132 may be provided to expose the exposure terminals
60-1, 60-2, 60-3, 60-4, and 60-5. The exposure terminals 60-1,
60-2, 60-3, 60-4, and 60-5 provided on the bottom surface of the
device package 302b may be bonded and electrically connected to at
least parts of the terminal lead frame 70, thereby configuring at
least a part of the circuit illustrated in FIG. 8B. The disposition
and number of the exposure terminals 60-1, 60-2, 60-3, 60-4, and
60-5 according to the current embodiment are merely examples and
may be changed in various ways depending on the functions of the
battery protection circuit and the authentication chip circuit
composition 132.
[0134] The substrate of the device package 302b capable of
providing the battery protection circuit composition 110, 120, and
130 and the authentication chip circuit composition 132 thereon may
include a lead frame, a printed circuit board (PCB), a ceramic
substrate, or a glass substrate.
[0135] For example, referring to FIG. 11, the substrate may include
the mounting lead frame 60 having a plurality of mounting leads
spaced apart from each other. The battery protection circuit
composition directly mounted on the substrate may include the FET
110, the protection IC 120, and the first passive devices 130. The
first passive devices 130 may include capacitors, resistors, and/or
a varistor. The authentication chip circuit composition 132 mounted
on the mounting lead frame 60 may include the ID chip 134 and the
second passive devices C5, V1, R4, and R5.
[0136] Referring to FIG. 20, in a method of manufacturing a device
package 302 in which the substrate is configured with the mounting
lead frame 60, according to an embodiment of the present invention,
step S10 includes providing the mounting lead frame 60 including a
plurality of leads spaced apart from each other, step S20 includes
mounting the protection IC 120, the FET 110, and the ID chip 134 on
the mounting lead frame 60, step S30 performed before or after step
S20 includes mounting the first passive devices 130 and/or the
second passive devices C5, V1, R4, and R5 on the mounting lead
frame 60 to interconnect at least some of the leads, step S40
includes providing an electrical connection member for electrically
interconnecting any two selected from the group consisting of the
protection IC 120, the FET 110, the ID chip 134, and the leads, and
step S50 includes providing the encapsulant 250 for encapsulating
the protection IC 120, the FET 110, the ID chip 134, and the
passive devices 130 to expose parts of the mounting lead frame
60.
[0137] FIG. 8C is a structural view of a battery protection circuit
and a fuel gauge circuit for configuring a part of a battery
protection circuit module package, according to another embodiment
of the present invention.
[0138] Referring to FIG. 8C, a fuel gauge circuit composition 135
may be added to a battery protection circuit composition 131
including the battery protection circuit 10 illustrated in FIG. 1
or a battery protection circuit composition 131 including the
battery protection circuit modified from the battery protection
circuit 10 illustrated in FIG. 1, thereby supporting a fuel gauge
function. The battery protection circuit composition 131 may
include the FET 110, the protection IC 120, and the passive devices
130. The fuel gauge function may include all or some additional
functions for a fuel gauge for a battery, a device including the
battery, and a user using the device. The fuel gauge circuit
composition 135 may have, for example, functions for measuring the
temperature, current, and/or voltage of a battery of a mobile phone
to check battery charge of the mobile phone. The fuel gauge circuit
composition 135 may include, for example, an F/G device. The F/G
device may include a multiplexer and an analog-to-digital (ND)
converter. Furthermore, optionally, the F/G device may further
include a microprocessor including embedded memory, and an
oscillator. The number, type, and disposition of the fuel gauge
circuit composition 135 illustrated in FIG. 8C are merely examples,
and may be changed depending on the purpose or configuration of the
fuel gauge function. The fuel gauge circuit composition 135 may be
connected to an external device through a fuel gauge external
connection terminal FG. The fuel gauge external connection terminal
FG may include a single terminal or multiple terminals depending on
the configuration, disposition, and function of the fuel gauge
circuit composition 135, and may be used commonly with the second
external connection terminal TH. Although an electrical connection
structure between the first and second internal connection
terminals B+ and B- and/or the external connection terminals P+,
P-, TH, and FG, and the battery protection circuit composition 131
and/or the fuel gauge circuit composition 135 is omitted for
convenience in FIG. 8C, an arbitrary electrical connection
structure may be provided to implement the functions of a battery
protection circuit and a fuel gauge.
[0139] When the fuel gauge circuit composition 135 is added to the
configuration of the battery protection circuit 10 illustrated in
FIG. 1, since the fuel gauge external connection terminal FG is
configured in addition to three external connection terminals P+,
TH, and P-, the number of external connection terminals included in
the battery protection circuit module package is 4. As described
above in relation to FIG. 7, the battery protection circuit module
package 300 according to an embodiment of the present invention may
not be easily implemented in terms of size reduction when the
number of external connection terminals is equal to or greater than
4. The fuel gauge external connection terminal FG may correspond to
the fourth external connection terminal 50-1 of the battery
protection circuit module package 300 illustrated in FIG. 7. A
battery protection circuit module package and a battery pack
capable of easily achieving high integration and size reduction
when the number of external connection terminals is equal to or
greater than 4, according to another embodiment of the present
invention are now described with reference to FIGS. 9B, 10B, 11,
12B, 13B, 14, 15, and 19. However, the descriptions given above are
omitted herein to avoid redundancy.
[0140] The battery protection circuit module package 304b according
to another embodiment of the present invention includes the
terminal lead frame 70 and the device package 302b.
[0141] The terminal lead frame 70 includes the external connection
terminal leads 70-2, 70-3, 70-4, 70-5, and 70-6 serving as a
plurality of external connection terminals. The external connection
terminals may include four or more external connection terminals.
For example, as illustrated in FIG. 14, the terminal lead frame 70
may include the fourth and fifth external connection terminal leads
70-5 and 70-6 in addition to the first to third external connection
terminals P+, TH, and P-. For example, the fourth external
connection terminal lead 70-5 may be the fuel gauge external
connection terminal FG of FIG. 8C. The fifth external connection
terminal lead 70-6 may be configured to be connected to the second
internal connection terminal lead 70-7 by, for example, changing
the design of the terminal lead frame 70, and thus may be used to
evaluate electrical properties of the battery protection circuit
module package 304b. When the fuel gauge external connection
terminal FG includes multiple terminals, if necessary, additional
external connection terminal leads may be further provided on the
terminal lead frame 70.
[0142] The device package 302b includes a substrate having provided
the battery protection circuit composition 110, 120, and 130 and
the fuel gauge circuit composition 135 thereon. For example, the
device package 302a may include a substrate having provided the FET
110, the protection IC 120, and the passive devices 130 thereon.
Herein, the passive devices 130 may include the passive devices
illustrated in FIG. 1 or the passive devices illustrated in FIG. 8C
except for the fuel gauge circuit composition 135. Furthermore, the
F/G device and one or more second passive devices for configuring
the fuel gauge circuit composition 135 illustrated in FIG. 8C may
be provided on the substrate. The F/G device may include a part of
at least one selected from the group consisting of a multiplexer,
an ND converter, a microprocessor including embedded memory, and an
oscillator. Alternatively, the F/G device may include a one-chip
device including at least any two selected from the group
consisting of a multiplexer, an ND converter, a microprocessor
including embedded memory, and an oscillator. The device package
302b may further include the encapsulant 250 for encapsulating the
battery protection circuit composition 110, 120, and 130 and the
fuel gauge circuit composition 135. The encapsulant 250 may
include, for example, an epoxy molding compound (EMC).
[0143] The device package 302b is mounted on the terminal lead
frame 70 to be electrically connected to the terminal lead frame
70. For example, the device package 302b may be mounted on the
terminal lead frame 70 using surface mounting technology. One or
more exposure terminals 60-1, 60-2, 60-3, 60-4, and 60-5 may be
provided on a bottom surface of the device package 302b. The
encapsulant 250 for encapsulating the battery protection circuit
composition 110, 120, and 130 and the fuel gauge circuit
composition 135 may be provided to expose the exposure terminals
60-1, 60-2, 60-3, 60-4, and 60-5. The exposure terminals 60-1,
60-2, 60-3, 60-4, and 60-5 provided on the bottom surface of the
device package 302b may be bonded and electrically connected to at
least parts of the terminal lead frame 70, thereby configuring at
least a part of the circuit illustrated in FIG. 1 or 8C. The
disposition and number of the exposure terminals 60-1, 60-2, 60-3,
60-4, and 60-5 according to the current embodiment are merely
examples and may be changed in various ways depending on the
functions of the battery protection circuit and the fuel gauge
circuit composition 135.
[0144] The substrate of the device package 302b capable of
providing the battery protection circuit composition 110, 120, and
130 and the fuel gauge circuit composition 135 thereon may include
a lead frame, a printed circuit board (PCB), a ceramic substrate,
or a glass substrate.
[0145] For example, referring to FIG. 11, the substrate may include
the mounting lead frame 60 having a plurality of mounting leads
spaced apart from each other. The battery protection circuit
composition directly mounted on the substrate may include the FET
110, the protection IC 120, and the passive devices 130. The
passive devices 130 may include capacitors, resistors, and/or a
varistor. The fuel gauge circuit composition 135 mounted on the
mounting lead frame 60 may include the F/G device and the second
passive devices.
[0146] The device package 302b including the mounting lead frame 60
may configure a battery protection circuit without using a PCB.
This configuration may be implemented by providing the passive
devices 130 and/or the second passive devices to interconnect at
least some of the mounting leads spaced apart from each other, and
providing an electrical connection member for electrically
interconnecting at least any two selected from the group consisting
of the FET 110, the protection IC 120, the F/G device, and the
mounting leads. The electrical connection member may include
bonding wire or bonding ribbon.
[0147] Referring to FIG. 20, in a method of manufacturing the
device package 302 in which the substrate is configured with the
mounting lead frame 60, according to an embodiment of the present
invention, step S10 includes providing the mounting lead frame 60
including a plurality of leads spaced apart from each other, step
S20 includes mounting the protection IC 120, the FET 110, and the
F/G device on the mounting lead frame 60, step S30 performed before
or after step S20 includes mounting the passive devices 130 and/or
the second passive devices on the mounting lead frame 60 to
interconnect at least some of the leads, step S40 includes
providing an electrical connection member for electrically
interconnecting at least any two selected from the group consisting
of the protection IC 120, the FET 110, the F/G device, and the
leads, and step S50 includes providing the encapsulant 250 for
encapsulating the protection IC 120, the FET 110, the F/G device,
and the passive devices 130 to expose parts of the mounting lead
frame 60. Step S20 and step S30 may be performed sequentially, in
reverse order, simultaneously, or alternately.
[0148] FIG. 15 is a perspective view of a positive temperature
coefficient (PTC) structure for configuring the battery protection
circuit module package, according to at least some embodiments of
the present invention, FIG. 16 illustrates the battery protection
circuit module package according to at least some embodiments of
the present invention, and FIG. 17 is a perspective view showing a
process for combining the battery protection circuit module package
with the battery can, according to at least some embodiments of the
present invention.
[0149] Referring to FIGS. 15 to 17, the battery protection circuit
module package according to at least some embodiments of the
present invention includes the PTC structure 350. The PTC structure
350 includes a PTC device 310, a metal layer 320 adhered to a first
surface corresponding to any one of a top surface and a bottom
surface of the PTC device 310, and connecting members 330 and 340
having conductivity and adhered to a second surface corresponding
to the other of the top surface and the bottom surface of the PTC
device 310. The metal layer 320 may be bonded to any one of the
first and second internal connection terminal leads B+ and B-, and
the connecting members 330 and 340 may be bonded to the electrode
terminal 410 of a battery bare cell. For example, the metal layer
320, the connecting members 330 and 340, and the lead frame 50 may
be formed of nickel, copper, nickel-plated copper, or other metal.
The metal layer 320 may be bonded to any one of the first and
second internal connection terminal leads B+ and B- using any one
selected from the group consisting of laser welding, resistance
welding, soldering, a conductive adhesive (e.g., conductive epoxy),
and conductive tape.
[0150] The PTC device 310 may be produced by, for example,
dispersing conductive particles in a crystalline polymer.
Accordingly, the PTC device 310 serves as a current path between
the metal layer 320 and the connecting members 330 and 340 at a
temperature equal to or less than a set temperature. However, if
overcurrent occurs and the temperature increases above the set
temperature, the crystalline polymer expands, the conductive
particles dispersed in the crystalline polymer are disconnected
from each other, and thus a resistance value is rapidly increased.
Accordingly, the flow of the current between the metal layer 320
and the connecting members 330 and 340 is blocked or reduced. As
described above, since the flow of a current may be blocked by the
PTC device 310, the PTC device 310 serves as a safety device for
preventing a burst of a battery. If the PTC device 310 is cooled
under the set temperature, the crystalline polymer contracts, the
conductive particles recover connections therebetween, and thus the
current flows appropriately.
[0151] The terminal lead frame 70 for configuring the battery
protection circuit module package 304a or 304b is electrically
connected to the electrode terminal 410 of the battery bare cell by
disposing the PTC structure 350 therebetween. For example, the
second internal connection terminal lead B- or 70-7 of the terminal
lead frame 70 may be electrically connected to the negative
terminal 410 of the battery bare cell by disposing the PTC
structure 350 therebetween. That is, the second internal connection
terminal lead B- or 70-7 of the terminal lead frame 70 is bonded to
the metal layer 320 and is electrically connected via the PTC
device 310 and the connecting members 330 and 340 to the negative
terminal 410 of the battery bare cell. In this case, the metal
layer 320 may be configured to be restricted within the top surface
of the PTC device 310, and the connecting members 330 and 340 may
be configured to extend from the bottom surface of the PTC device
310 to the negative terminal 410 of the battery bare cell. The
connecting members of the PTC structure 350 may include the first
connecting member 330 adhered to a surface of the PTC device 310,
and the second connecting member 340 connected to the first
connecting member 330 and extending to the negative terminal 410 of
the battery bare cell. Since the second connecting member 340
should have an appropriate level to be bonded to the negative
terminal 410, a part where the first and second connecting members
330 and 340 are connected to each other may be bent. The second
connecting member 340 may be bonded to the negative terminal 410 of
the battery bare cell using any one selected from the group
consisting of laser welding, resistance welding, soldering, a
conductive adhesive (e.g., conductive epoxy), and conductive
tape.
[0152] In the battery protection circuit module package 304a or
304b having the above-described structure, the length of the
terminal lead frame 70 may be set in such a manner that the
terminal lead frame 70 is provided at a side part based on the
center of a top surface of the battery bare cell (e.g., the
negative terminal 410). Alternatively, the length of the terminal
lead frame 70 may be set in such a manner that the battery
protection circuit module package 304a or 304b combined with the
PTC structure 350 is provided at a side part based on the center of
the top surface of the battery bare cell (e.g., the negative
terminal 410). For example, the length of the battery protection
circuit module package 304a or 304b combined with the PTC structure
350 may be a half L/2 of a total length L of the cap plate 430.
[0153] As described above, since electrical connection between the
second internal connection terminal lead B- and the PTC device 310
is achieved using the metal layer 320 restricted within the top
surface of the PTC device 310, the PTC device 310 may be provided
directly under the second internal connection terminal lead B-. Due
to the above-described configuration of the PTC structure 350 and
the configuration in which the device package 302a or 302b is
mounted on the terminal lead frame 70, the battery protection
circuit module package 304a or 304b according to some embodiments
of the present invention has four or more external connection
terminals 70-2, 70-3, 70-4, 70-5, and 70-6 and is able to reduce
the length of the battery protection circuit module package 300
combined with the PTC structure 350 to, for example, the half L/2
of the total length L of the cap plate 430. If the PTC device 310
is not provided directly under the second internal connection
terminal lead B- but is provided to be spaced apart therefrom in a
length direction, the length of the battery protection circuit
module package 300 combined with the PTC structure 350 relatively
increases. However, since the PTC device 310 is provided directly
under the second internal connection terminal lead B-, the first
internal connection terminal lead B+ may be bent in the form of a
gull to horizontally adjust the level of the battery protection
circuit module package 300.
[0154] According to the above-described embodiments of the present
invention, since a battery protection circuit module package is
mountable using only a side part of a cap plate based on a negative
terminal of a battery, the battery may achieve a small size or a
high capacity. For example, by further providing a cell on the
other side part based on the negative terminal, in which the
battery protection circuit module package is not provided, the
capacity of the battery may be increased or a chip having another
function may be additionally provided, and thus products having
such battery may be reduced in size.
[0155] The battery protection circuit module package according to
the above-described embodiments of the present invention has four
or more external connection terminals and is mountable using only a
side part based on the center of a top surface of a battery bare
cell, the battery may achieve a small size or a high capacity. For
example, by further providing a cell on the other side part based
on the electrode cell, the capacity of the battery may be increased
or a chip having another function may be additionally provided, and
thus products having such battery may be reduced in size. However,
the battery protection circuit module package according to
embodiments of the present invention is not limited to use only a
side part and may be configured to use the whole top surface of the
electrode cell of the battery.
[0156] Furthermore, if a device package of the battery protection
circuit module package according to the above-described embodiments
of the present invention uses a lead frame, compared to a case in
which a battery protection circuit is mounted on a PCB and then
leads are boned onto the PCB, since a battery protection circuit
may be mounted and leads connectable to a battery cell may be
provided using only the lead frame, a manufacturing cost may be
reduced and a total height may be remarkably reduced. That is,
since the PCB typically has a thickness of about 2 mm while the
lead frame has a thickness of about 0.8 mm, battery size may be
reduced or battery capacity may be increased by a value
corresponding to the difference in thickness therebetween.
[0157] In addition, since an electrical connection member such as
bonding wire or bonding ribbon is provided on the lead frame to
configure the battery protection circuit, a process for designing
and producing the lead frame for configuring the battery protection
circuit may be simplified. If the electrical connection member is
not employed to configure the battery protection circuit in the
embodiments of the present invention, the configuration of a
plurality of leads for configuring the lead frame may be very
complicated and thus an appropriate lead frame may not be
efficiently provided.
[0158] Besides, according to the above-described embodiments of the
present invention, a connection structure between a PTC device and
the lead frame may be simplified or reduced in size without
constantly maintaining the size of the PTC device, and thus a PTC
structure may be reduced in size.
[0159] While the present invention has been particularly shown and
described with reference to embodiments thereof, it will be
understood by those of ordinary skill in the art that various
changes in form and details may be made therein without departing
from the spirit and scope of the present invention as defined by
the following claims.
* * * * *