U.S. patent application number 14/826345 was filed with the patent office on 2016-02-18 for reformable epoxy resin for composites.
The applicant listed for this patent is Zephyros, Inc.. Invention is credited to Craig Chmielewski, Sylvain Gleyal, Alex Gutierrez, Brandon Madaus.
Application Number | 20160046047 14/826345 |
Document ID | / |
Family ID | 54012290 |
Filed Date | 2016-02-18 |
United States Patent
Application |
20160046047 |
Kind Code |
A1 |
Gleyal; Sylvain ; et
al. |
February 18, 2016 |
REFORMABLE EPOXY RESIN FOR COMPOSITES
Abstract
The present invention contemplates a method for forming a
composite structure including a plurality of rigid layers and one
or more reformable epoxy resin layers. The resulting composite is
molded to form a non-planar composite structure.
Inventors: |
Gleyal; Sylvain; (Rochester,
MI) ; Chmielewski; Craig; (Shelby Twp., MI) ;
Madaus; Brandon; (Shelby Twp., MI) ; Gutierrez;
Alex; (Romeo, MI) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Zephyros, Inc. |
Romeo |
MI |
US |
|
|
Family ID: |
54012290 |
Appl. No.: |
14/826345 |
Filed: |
August 14, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62037199 |
Aug 14, 2014 |
|
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|
Current U.S.
Class: |
264/266 |
Current CPC
Class: |
B32B 21/042 20130101;
B29C 43/18 20130101; B29C 70/30 20130101; F41H 1/08 20130101; B32B
27/08 20130101; B32B 7/12 20130101; F41H 5/08 20130101; B32B
2605/00 20130101; B32B 2479/00 20130101; B32B 2307/75 20130101;
B29K 2063/00 20130101; B32B 2307/738 20130101; B32B 21/08 20130101;
B32B 21/04 20130101 |
International
Class: |
B29C 43/18 20060101
B29C043/18 |
Claims
1) A method comprising: i. forming a substantially planar composite
structure having at least two layers; ii. applying a reformable
epoxy resin material onto one or more of the at least two layers;
iii. optionally cutting the composite structure to a desired shape;
iv. heating the composite structure in a mold to form a non-planar
composite structure.
2) The method according to claim 1, wherein the reformable epoxy
resin epoxy material falls below its glass transition temperature
upon exposure to ambient temperature in less than 5 minutes.
3) The method according to claim 1, wherein after the reformable
epoxy resin material falls below its glass transition temperature,
it can be heated multiple times above its glass transition
temperature for molding into the non-planar composite
structure.
4) The method according to claim 3, wherein the reformable epoxy
resin material falls below its glass transition temperature upon
exposure to ambient temperature.
5) The method according to claim 2, wherein the composite structure
is a furniture panel.
6) The method according to claim 2, wherein the composite structure
is an automotive or aerospace panel.
7) The method according to claim 1, wherein the reformable epoxy
resin material falls below its glass transition temperature prior
to forming the non-planar composite structure.
8) The method according to claim 1, wherein at least one of the at
least two layers is a wood material.
9) The method according to claim 3, wherein at least one of the at
least two layers is a polymeric material.
10) The method according to claim 2, wherein the reformable epoxy
resin material is stored at room temperature prior to use.
11) The method according to claim 1, wherein the shelf life of the
reformable epoxy resin material is at least about 3 months, at
least about 6 months, at least about 1 year, or even at least about
5 years.
12) The method according to claim 3, wherein the reformable epoxy
resin material is recyclable.
13) The method according to claim 1, wherein the glass transition
temperature of the reformable epoxy resin material is higher than
room temperature but lower than 200.degree. C.
14) The method according to claim 1, wherein the reformable epoxy
resin material can be processed at a temperature of less than
200.degree. C., or even less than 150.degree. C.
15) The method according to claim 10, wherein the stiffness of the
reformable epoxy resin material is substantially higher than the
stiffness of a thermoplastic material without an epoxy
component.
16) The method according to claim 1, wherein the reformable epoxy
resin material is capable of receiving printed material prior to
forming the composite structure whereby the printed material can be
clearly viewed after formation of the composite structure.
17) The method according to claim 1, wherein the resulting
composite structure is stampable.
18) The method according to claim 1, wherein the resulting
composite structure includes natural fiber materials.
19) The method according to claim 1, wherein the resulting
composite structure does not fail at greater than 2.5% strain
during a three point bend test.
20) The method according to claim 1, wherein the resulting
composite structure does not fail at greater than 3.5% strain
during a three point bend test.
Description
TECHNICAL FIELD
[0001] The present invention pertains generally to reformable epoxy
resins for use in composites, and more particularly to reformable
epoxy resin adhesives layered between material layers whereby the
reformable epoxy resin permits shaping and re-shaping of the
composite structures without adhesive failure of the adhesive or
breaking of the material layers.
BACKGROUND
[0002] Composite structures are common in a wide variety of
industries including building construction, sporting equipment,
furniture, automotive, train, aerospace (and other transportation
vehicles) among others. It is common to use composite structures
due to their high strength and the variety of materials that can be
utilized for the various composite layers. However, it is
challenging to identify materials that provide sufficient strength
and also sufficient cohesion with adjacent material layers,
especially when it is desirable to mold or shape the composite
structures. Thus, there are often significant limitations on the
ability to curve, mold and form composite structures having both
sufficient strength and sufficient cohesion. Further, the ability
to mold complex shapes may be limited by the adhesive used to form
the composite, such that the adhesive fails to adhere the layers
when the composite structure is molded. Such adhesives also prevent
reforming of a composite structure into a different shape after
initial forming of the composite structure.
[0003] There is thus a need for an adhesive that avoids these
common problems encountered with forming composite structures into
curved and/or complex shapes.
SUMMARY OF THE INVENTION
[0004] The teachings herein are directed to a method comprising
forming a substantially planar composite structure having at least
two layers, applying a reformable epoxy resin material onto one or
more of the at least two layers, optionally cutting the composite
structure to a desired shape and heating the composite structure in
a mold to form a non-planar composite structure.
[0005] The reformable epoxy resin material may fall below its glass
transition temperature upon exposure to ambient temperature in less
than 5 minutes. After the reformable epoxy resin material falls
below its glass transition temperature, it may be heated multiple
times above its glass transition temperature for molding into the
non-planar composite structure. The reformable epoxy resin material
falls below its glass transition temperature upon exposure to
ambient temperature.
[0006] The composite structure may be a furniture panel. The
composite structure may be an automotive or aerospace panel. The
reformable epoxy resin material may fall below its glass transition
temperature prior to forming the non-planar composite structure. At
least one of the at least two layers may be a wood material. At
least one of the at least two layers may be a polymeric material.
At least one of the at least two layers may be a cellulosic
material. The reformable epoxy resin material may be stored at room
temperature prior to use. The shelf life of the reformable epoxy
resin material may be at least about 3 months, at least about 6
months, at least about 1 year, or even at least about 5 years.
[0007] The reformable epoxy resin material may be recyclable. The
glass transition temperature of the reformable epoxy resin material
may be higher than room temperature but lower than 200.degree. C.
The reformable epoxy resin material can be processed at a
temperature of less than 200.degree. C., or even less than
150.degree. C. The stiffness of the reformable epoxy resin material
may be substantially higher than the stiffness of a thermoplastic
material without an epoxy component. The reformable epoxy resin
material may be capable of receiving printed material prior to
forming the composite structure whereby the printed material can be
clearly viewed after formation of the composite structure. The
resulting composite structure may be stampable. The resulting
composite structure may include natural fiber materials. The
resulting composite structure does not fail at greater than 2.5%
strain during a three point bend test. The resulting composite
structure does not fail at greater than 3.5% strain during a three
point bend test.
[0008] The teachings herein facilitate a simple process for forming
and shaping composites structures using a reformable epoxy resin
adhesive. The composite structures are formed such that the
material layers will fail during a curving or molding process
before the adhesive material fails. The resulting composite
structures are thus stronger than similar structures made using a
typical thermoplastic material, and also more flexible (e.g.,
moldable, shapeable and/or stampable) than similar structures made
using a typical epoxy-based thermoset material.
DETAILED DESCRIPTION
[0009] The present teachings meet one or more of the above needs by
the improved composite structures and methods described herein. The
explanations and illustrations presented herein are intended to
acquaint others skilled in the art with the teachings, its
principles, and its practical application. Those skilled in the art
may adapt and apply the teachings in its numerous forms, as may be
best suited to the requirements of a particular use. Accordingly,
the specific embodiments of the present teachings as set forth are
not intended as being exhaustive or limiting of the teachings. The
scope of the teachings should, therefore, be determined not with
reference to the above description, but should instead be
determined with reference to the appended claims, along with the
full scope of equivalents to which such claims are entitled. The
disclosures of all articles and references, including patent
applications and publications, are incorporated by reference for
all purposes. Other combinations are also possible as will be
gleaned from the following claims, which are also hereby
incorporated by reference into this written description.
[0010] This application claims the benefit of the filing date of
U.S. Provisional Application No. 62/037,199, filed Aug. 14, 2014,
the entirety of the contents of this application being hereby
incorporated by reference for all purposes.
[0011] The teachings herein make advantageous use of a reformable
epoxy resin epoxy adhesive that hardens and adheres when it cools.
The teachings herein contemplate a method for providing composite
structures that are formable and moldable after the reformable
epoxy resin material is heated and subsequently falls below its
glass transition temperature. The reformable epoxy resin adhesive
provides structural toughness associated with epoxy materials, but
is amenable to molding and re-molding after cure unlike other
epoxy-based adhesive materials. Thermoplastic films are known in
the art of composite structure formation, but such films typically
fail to provide sufficient adhesion and stiffness. Reformable epoxy
resin adhesives for use in composite structures provide additional
stiffness, adhesion and allow for reforming and are therefore
useful for composites that are formed to have curved profiles.
[0012] The materials and methods taught herein include possible
uses for reformable epoxy resin (RER) materials. It is possible
that the RER materials may be provided initially in a pellet form
and then formed into an RER film. Accordingly, a reformable epoxy
resin may be desirable because of its long shelf life, which may be
in pelletized form or in a film form, or in an alternative adhesive
form. It also may not require storage at a refrigerated
temperature, unlike some alternative materials. The shelf life of
the reformable epoxy resin material is at least about 3 months, at
least about 6 months, at least about 1 year, or even at least about
5 years.
[0013] Typically, the use of epoxy-based adhesives provides for
composite materials that can endure minimal curving based on the
relatively brittle nature of the epoxy adhesives. As a result, the
amount of curving that a composite structure can withstand without
cohesive failure is controlled by the adhesive. However, the amount
of curving that a composite structure can withstand when formed
with the adhesives described herein is controlled by the material
layers that receive the adhesive.
[0014] An advantage of the present teachings over existing epoxy
materials used for adhesives is that the materials herein have
improved strength and adhesion as compared to typical thermoplastic
materials and are also significantly more flexible than other
epoxy-based adhesives. Further, the RER adhesive can be easily and
selectively removed by the addition of heat. Thus, a composite
material formed using an RER adhesive could be shaped and reshaped
by the addition of heat, as required. The removed RER adhesive may
also be recyclable and thus re-used. Additional benefits of the RER
material include fast hardening and adhesion, and also the ability
to remove the adhesive and re-mold any composite formed with the
adhesive. Adhesion, hardening, and returning to a solid state upon
cooling of the RER begins almost immediately after heating is
stopped. Full adhesion can occur within about 10 seconds to about
60 seconds (e.g., about 30 seconds). It is contemplated that
allowing the adhesive to return to ambient temperature is
sufficient for adhesion, and additional hardening steps are
possible, but not necessary.
[0015] Exemplary RER materials are made using bisphenol A
diglycidyl ether (BADGE) and monoethanolamine. For some
applications that may require a higher glass transition temperature
(T.sub.g), it is contemplated that BADGE may be replaced by an
epoxy monomer with less mobility. Such epoxy monomers may include
diglycidylether of fluoren diphenol or 1,6 napthalene diepoxy.
Also, it is contemplated that where fire resistance is desired,
BADGE can be replaced by a brominated bisphenol A epoxy resin. The
RER material having at least one epoxide group may be
hydroxy-phenoxyether polymer, such as a polyetheramine
thermoplastic material as described herein. For example, such
thermoplastic polymeric material having at least one epoxide group
may be a product (e.g., a thermoplastic condensation reaction
product) of a reaction of a mono-functional or di-functional
species (i.e., respectively, a species having one or two reactive
groups, such as an amide containing species), with an
epoxide-containing moiety, such as a diepoxide (i.e., a compound
having two epoxide functionalities), reacted under conditions for
causing the hydroxyl moieties to react with the epoxy moieties to
form a generally linear backbone polymer chain with ether
linkages.
[0016] Though other functional species may be employed, as is
taught in U.S. Pat. No. 6,011,111 (incorporated by reference; see,
e.g., Cols. 6-8) and WO 98/14498 (incorporated by reference; see,
e.g., pages 8-11) examples of such mono-functional or di-functional
species may include a dihydric phenol, a secondary amine (e.g., a
bis-secondary amine), a primary amine, or any combination thereof.
Any amine of the functional species can be an aromatic amine, an
aliphatic amine or a combination thereof. The mono-functional or
di-functional species may have one or two functionalities capable
of reacting with epoxide groups to form a generally
non-cross-linked polymer. Some particular examples, without
limitation, of functional species for reaction with an epoxy moiety
in accordance with the present teachings includes an ethanolamine
(e.g., monoethanolamine), piperazine or a combination thereof. Any
of the illustrative functional species may be substituted or
unsubstituted.
[0017] Though other epoxide-containing moieties may be employed, as
is taught in U.S. Pat. No. 6,011,111 (incorporated by reference;
see, e.g., Cols. 5-6), and WO 98/14498 (incorporated by reference;
see, e.g., page 8) such moieties may include at least one
mono-functional epoxide and/or a di-functional epoxide
("diepoxide"). An example of a diepoxide that can be employed in
the teachings includes a diglycidyl ether of a dihydric phenol
(e.g., resorcinol, biphenol or bisphenol A). Any epoxide-containing
moiety herein may be an aliphatic and/or an aromatic epoxide.
[0018] Other examples of illustrative materials, functional species
and diepoxides are described in U.S. Pat. Nos. 5,115,075;
4,438,254; 6,011,111; and WO 98/14498 (see e.g., pages 3-8) along
with illustrative synthesis conditions, all incorporated by
reference herein (see also U.S. Pat. Nos. 3,317,471 and 4,647,648,
also incorporated by reference herein). Examples of such materials
also can be found, without limitation at paragraphs 15-25 of
Published U.S. Patent Application No. 20070270515 (Chmielewski et
al), incorporated by reference for all purposes.
[0019] The composite structures envisioned herein may comprise
panels consisting of a plurality of material layers with the
reformable epoxy resin adhesive located onto and/or between the
plurality of material layers. In this instance, the material layers
may be of wood, paper, fabric, plastic or metal. The material
layers may be a naturally occurring material (e.g., a rubber, a
cellulose, sisal, jute, hemp, or some other naturally occurring
material). The material layers may include a natural fiber
material. The material layers may be a synthetic material (e.g., a
polymer (which may be a homopolymer, a copolymer, a terpolymer, a
blend, or any combination thereof)). It may be a carbon derived
material (e.g., carbon fiber, graphite, graphene, or otherwise).
The material layers may include fibers selected from (organic or
inorganic) mineral fibers (e.g., glass fibers, such as E-glass
fibers, S-glass, B-glass or otherwise), polymeric fibers (e.g., an
aramid fiber, a cellulose fiber, or otherwise), carbon fibers,
metal fibers, natural fibers (e.g., derived from an agricultural
source), or any combination thereof. The plurality of elongated
fibers may be oriented generally parallel to each other. They may
be braided. They may be twisted. Collections of fibers may be woven
and/or nonwoven.
[0020] The material layers may include a honeycomb or other
material support structure. The material layers may comprise the
same material or may comprise different materials. The material
layers may include exterior veneer layers with internal layers that
provide sufficient support for the external veneer layers. The
composite structure may include any structure where the reformable
epoxy resin can be utilized with an external veneer to provide a
visually appealing exterior surface to the composite structure. In
addition, the reformable epoxy resin material is capable of
receiving printed material prior to forming the composite structure
whereby the printed material can be clearly viewed after formation
of the composite structure. Certain composite materials are
disclosed in U.S. Provisional Application Nos. 62/130,832, filed
Mar. 10, 2015; and 62/183,380, filed Jun. 23, 2015, the entirety of
these applications being hereby incorporated by reference for all
purposes.
[0021] While it is possible to use a liquid material for the
adhesive, the present teachings also contemplate using an RER film.
Using a film can be beneficial, as it avoids bringing significant
unwanted mass to the composite structure, as a liquid adhesive may
do. A film also enables the user to control the quantity and
distribution of the adhesive, which may assist in handling the
adhesive. The film may be located along the entirety of a surface
of a material layer of the composite structure, or may be located
onto only portions of a surface of a material layer. The adhesive
film may be a continuous sheet or may be cut into strips or any
other shape to facilitate connection between one or more material
layers of the composite structure. Certain films that may be used
in accordance with the teachings herein are described in U.S.
Provisional Application No. 62/113,728, filed Feb. 9, 2015, the
entirety of this application being hereby incorporated by reference
for all purposes.
[0022] RER adhesives are advantageous as they allow for faster
hardening and adhesion, thereby reducing the need for extended
periods of time and large areas of space for curing adhesives in
composite structures. While RER adhesives may be workable at
ambient temperature, it is often desirable to have a heat applying
step to soften or melt the RER adhesive to allow it to move or
become more workable. Heating the resulting composite structure
allows for ease of formability into a desired shape (e.g., by
molding or stamping), which may have a curved profile. Adhesion and
hardening of the RER begins almost immediately after heating is
stopped and full adhesion can occur within about 10 seconds to
about 5 minutes (e.g., about 2 minutes). It is contemplated that
allowing the adhesive to return to ambient temperature is
sufficient for adhesion, and additional hardening steps are
possible, but not necessary. With an RER adhesive, it is also
possible that the bond formed between the adhesive and the
substrates of the composites can be debonded by increasing the
temperature over the glass transition temperature (T.sub.g) of the
RER to allow the bonded substrates to be separated.
[0023] In one embodiment, the RER adhesive may be applied as a film
layer to a substrate (e.g., a material layer). The substrate may be
a wood-based material. The substrate may be a plastic or metallic
material. A second material layer may be located over and onto the
RER adhesive film layer. Additional layers of RER adhesive and
material layers may be alternated to any desired thickness to make
a resulting composite. Additional covering material layers (e.g.,
veneers) may be added to the composite, each veneer adjacent a
layer of the RER film. The composite may then be heated and shaped,
either simultaneously or heated and then shaped to soften the RER
adhesive and form a curved composite. Cooling at ambient
temperature may be sufficient to reduce the RER adhesive to a
temperature below its glass transition temperature for sufficient
adhering and hardening of the curved composite. The glass
transition temperature of the RER adhesive may be greater than
30.degree. C., greater than 50.degree. C., greater than 60.degree.
C., or even greater than 70.degree. C. The glass transition
temperature of the reformable epoxy resin material may be higher
than room temperature but lower than 200.degree. C. The RER
adhesive may thus be processed at a temperature of less than
200.degree. C., or even less than 150.degree. C.
EXAMPLES
[0024] Two pieces of 1/8'' maple wood were each laminated. The
first piece was laminated with a thermoset epoxy material including
Araldite 1564 SP epoxy and Aradur 22962 curing agent (both
available from Huntsman Corporation, The Woodlands, TX) in a ratio
of about 4:1. The second piece was laminated with an RER film
material in accordance with the teachings herein (two sheets of
0.005'' film). All laminates were cured in a press at 75 psi and
120.degree. C. for 15 minutes then 75 psi at 150.degree. C. for 2
hours. A three-point bend test for flexural properties was
performed at 85.degree. C. (in accordance with ASTM D790). The
thermoset laminate failed at 2.2% strain. The RER film laminate did
not fail at 2.2% strain. The RER film laminate did not fail even up
to 3.8% strain. Testing was stopped at 3.8% strain due to failure
of the wood material (as opposed to failure of the laminating
material). The thermoset laminate was thus limited by the
flexibility of the thermoset epoxy, whereas the RER laminate was
limited only by the flexibility of the wood. This shows that the
shaping of thermoset laminates is limited by the epoxy laminate,
while the RER laminate has greater flexibility. Furthermore, the
tensile strengths of the thermoset laminate (41 MPa) and the RER
laminate (44 MPa) are comparable. Thus the RER material is not
significantly weaker than a thermoset epoxy, as may be expected
from a typical thermoplastic material.
[0025] The laminates were then allowed to cool under strain. When
the strain was removed, the thermoset laminate returned to its
original shape. As desired, the RER laminate retained the curved
shape. Thus, the RER laminate was shapeable, whereas the thermoset
laminate was not. Results are shown in the table below.
TABLE-US-00001 Ultimate Tensile Strain at Sample Thickness Peak
Load Strength Break Type (mm) (N) (MPa) (mm/mm) Result Thermoset
29.490 161.443 41.0 0.022 Failed under strain at 2.2%; Laminate
cooled and strain removed - returned to original shape. RER 29.610
168.445 44.2 0.038 No failure under strain at 3.8%; Laminate (no
break) cooled and retained curved shape.
[0026] As mentioned above, the composite materials described herein
are applicable to wide range of products. RER adhesives may be used
for the manufacture of furniture including chairs, tables,
cupboards, bed frames, or any other type of furniture where
curvature may be desired. RER adhesives may be used for the
manufacture of sporting equipment such as racquets, snow boards,
skis, hockey and lacrosse sticks, helmets, or the like. RER
adhesives may be used for the manufacture of ballistic or other
safety devices such as shields, helmets, body armor or the like.
RER adhesives may be used for the manufacture of building
construction materials, especially those where aesthetic
presentation is important such as home and office interiors.
[0027] As used herein, unless otherwise stated, the teachings
envision that any member of a genus (list) may be excluded from the
genus; and/or any member of a Markush grouping may be excluded from
the grouping.
[0028] Unless otherwise stated, any numerical values recited herein
include all values from the lower value to the upper value in
increments of one unit provided that there is a separation of at
least 2 units between any lower value and any higher value. As an
example, if it is stated that the amount of a component, a
property, or a value of a process variable such as, for example,
temperature, pressure, time and the like is, for example, from 1 to
90, preferably from 20 to 80, more preferably from 30 to 70, it is
intended that intermediate range values such as (for example, 15 to
85, 22 to 68, 43 to 51, 30 to 32 etc.) are within the teachings of
this specification. Likewise, individual intermediate values are
also within the present teachings. For values which are less than
one, one unit is considered to be 0.0001, 0.001, 0.01 or 0.1 as
appropriate. These are only examples of what is specifically
intended and all possible combinations of numerical values between
the lowest value and the highest value enumerated are to be
considered to be expressly stated in this application in a similar
manner. As can be seen, the teaching of amounts expressed as "parts
by weight" herein also contemplates the same ranges expressed in
terms of percent by weight. Thus, an expression in the of a range
in terms of at "x' parts by weight of the resulting polymeric blend
composition" also contemplates a teaching of ranges of same recited
amount of "x" in percent by weight of the resulting polymeric blend
composition."
[0029] Unless otherwise stated, all ranges include both endpoints
and all numbers between the endpoints. The use of "about" or
"approximately" in connection with a range applies to both ends of
the range. Thus, "about 20 to 30" is intended to cover "about 20 to
about 30", inclusive of at least the specified endpoints.
[0030] The disclosures of all articles and references, including
patent applications and publications, are incorporated by reference
for ail purposes. The term "consisting essentially of to describe a
combination shall include the elements, ingredients, components or
steps identified, and such other elements ingredients, components
or steps that do not materially affect the basic and novel
characteristics of the combination. The use of the terms
"comprising" or "including" to describe combinations of elements,
ingredients, components or steps herein also contemplates
embodiments that consist of, or consist essentially of the
elements, ingredients, components or steps.
[0031] Plural elements, ingredients, components or steps can be
provided by a single integrated element, ingredient, component or
step. Alternatively, a single integrated element, ingredient,
component or step might be divided into separate plural elements,
ingredients, components or steps. The disclosure of "a" or "one" to
describe an element, ingredient, component or step is not intended
to foreclose additional elements, ingredients, components or
steps.
[0032] It is understood that the above description is intended to
be illustrative and not restrictive. Many embodiments as well as
many applications besides the examples provided will be apparent to
those of skill in the art upon reading the above description. The
scope of the invention should, therefore, be determined not with
reference to the above description, but should instead be
determined with reference to the appended claims, along with the
full scope of equivalents to which such claims are entitled. The
disclosures of all articles and references, including patent
applications and publications, are incorporated by reference for
all purposes. The omission in the following claims of any aspect of
subject matter that is disclosed herein is not a disclaimer of such
subject matter, nor should it be regarded that the inventors did
not consider such subject matter to be part of the disclosed
inventive subject matter.
* * * * *