U.S. patent application number 14/882163 was filed with the patent office on 2016-02-04 for modular power device.
The applicant listed for this patent is Chicony Power Technology Co., Ltd.. Invention is credited to Pei-Li CHANG, Ping-Yu CHEN, Yen-Ming CHEN, Chi-Chang HO, Yung-Hung HSIAO, Hao-Te HSU, Chih-Hang LEE, Huei-Fang LIN, Shin-Bin LIN, Ju-Tang LO, Yu-Hsuan WU, Chia-Hsien YEN.
Application Number | 20160037670 14/882163 |
Document ID | / |
Family ID | 49946392 |
Filed Date | 2016-02-04 |
United States Patent
Application |
20160037670 |
Kind Code |
A1 |
HSIAO; Yung-Hung ; et
al. |
February 4, 2016 |
MODULAR POWER DEVICE
Abstract
A modular power device is used for mounting on a main plate. The
modular power device includes a first substrate, a driving module,
and a converting module. The first substrate having a first axial
direction and a second axial direction perpendicular to the first
axial direction is inserted into the main plate to make the second
axial direction be perpendicular to the main plate. The driving
module is located on one side of the first substrate, and the
converting module is located on the other side of the first
substrate and includes a second substrate, wherein the second
substrate is inserted into the main plate. A length of the
converting module is substantially equal to that of the first
substrate in the first axial direction, and a width of the
converting module is smaller than a length of the first substrate
in the first axial direction.
Inventors: |
HSIAO; Yung-Hung; (New
Taipei City, TW) ; LO; Ju-Tang; (New Taipei City,
TW) ; CHEN; Yen-Ming; (New Taipei City, TW) ;
HSU; Hao-Te; (New Taipei City, TW) ; CHANG;
Pei-Li; (New Taipei City, TW) ; YEN; Chia-Hsien;
(New Taipei City, TW) ; LIN; Shin-Bin; (New Taipei
City, TW) ; WU; Yu-Hsuan; (New Taipei City, TW)
; LEE; Chih-Hang; (New Taipei City, TW) ; LIN;
Huei-Fang; (New Taipei City, TW) ; CHEN; Ping-Yu;
(New Taipei City, TW) ; HO; Chi-Chang; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chicony Power Technology Co., Ltd. |
New Taipei City |
|
TW |
|
|
Family ID: |
49946392 |
Appl. No.: |
14/882163 |
Filed: |
October 13, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13647385 |
Oct 9, 2012 |
9198319 |
|
|
14882163 |
|
|
|
|
Current U.S.
Class: |
361/736 |
Current CPC
Class: |
H05K 7/026 20130101;
H05K 7/2039 20130101; H05K 7/2089 20130101; H05K 7/1432 20130101;
H05K 7/08 20130101 |
International
Class: |
H05K 7/08 20060101
H05K007/08; H05K 7/02 20060101 H05K007/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 23, 2012 |
TW |
101126470 |
Claims
1. A modular power device is used for mounting on a main plate, the
modular power device comprising: a first substrate having a first
axial direction and a second axial direction perpendicular to the
first axial direction, the first substrate inserted into the main
plate, such that the second axial direction is perpendicular to the
main plate; a driving module placed on one side of the first
substrate and electrically connected to the first substrate; a
converting module located on the other side of the first substrate
and electrically connected to the driving module, the converting
module comprising: a second substrate, one end of the second
substrate inserted into the main plate, such that the second
substrate is perpendicular to the main plate; a third substrate
located between the first substrate and the second substrate; a
fourth substrate located at one side of the second substrate
opposite to where the third substrate being disposed, and one end
of the fourth substrate inserted into the main plate and
perpendicular to the main plate; a converting unit disposed on the
first substrate; a controlling unit placed on the second substrate
and electrically connected to the second substrate; a signal
transmitting unit placed on the third substrate and electrically
connected to the third substrate for electrically connecting the
controlling unit and the converting unit; and an outputting unit
placed on the fourth substrate and electrically connected to the
fourth substrate; and an intermediate plate, wherein the other end
of the second substrate opposite to where the second substrate is
inserted to the main plate is inserted into the intermediate plate,
and the other end of the fourth substrate opposite to where the
fourth substrate is inserted to the main plate is inserted into the
intermediate plate; wherein a length of the converting module is
equal to that of the first substrate in the first axial, and a
width of the converting module is smaller than a length of first
axial direction of the first substrate.
2. The modular power device in claim 1, wherein the intermediate
plate comprises: a multi-layer circuit board; a first metallic
layer attached to a surface of the multi-layer circuit board; and a
second metallic layer attach to the other surface of the
multi-layer circuit board.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a division of application Ser. No.
13/647,385 filed on Oct. 9, 2012, which claims priority to Taiwan
Application No. 101126470 filed Jul. 23, 2012. The entire
disclosure is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a power device. More
particularly, the present invention relates to a modular power
device.
[0004] 2. Description of Prior Art
[0005] Power supply devices are the essential components of
industrial equipment, and are used for converting alternating
current (AC) electric power into direct current (DC) electric power
or providing functions of bucking or boosting. A conventional power
supply device includes a flat circuit board, at least one converter
and a plurality of electrical components. The converter and the
electrical components are individually placed on the circuit board
and electrically connected to thereto via traces formed on the
circuit board.
[0006] While the demanded functions of industrial equipment
increased, the internal devices which are disposed within the
industrial equipment are increased accordingly. In order to
sufficiently driving the internal devices, the output power of the
power supply device must be increased simultaneously. When the
outputting power of the power supply device is increased, the
tolerance (such as rated working voltage) of the converter and the
electronic components may also be increased. The volume of part of
electronic component, such as capacitor, is direct proportion to
the rated working voltage, namely, the larger rated working voltage
and the greater volume. While the electronic components with
greater volume are placed on the circuit board, will occupy a lot
of space in the circuit board, this becomes the main reason of the
high power supply system cannot miniaturization.
SUMMARY OF THE INVENTION
[0007] It is an object to provide a modular power device with small
volume.
[0008] According to one aspect of the present invention is used for
mounted on a main plate. The module power device comprises a first
substrate, a driving module, a converting module, and an
intermediate plate. The first substrate has a first axial direction
and a second axial direction substantially perpendicular to the
first axial direction. The first substrate is inserted into the
main plate, such that the second axial direction of the first
substrate is perpendicular to the main plate. The driving module is
placed on one side of the first substrate and electrically
connected to the first substrate. The converting module is located
on the other side of the first substrate and electrically connected
to the driving module. A length of the converting module is
substantially equal to that of the first substrate in the first
axial direction, and a width of the converting module is smaller
than a length of the first substrate in the first axial direction.
The converting module comprises a second substrate, a third
substrate, a fourth substrate, a converting unit, a controlling
unit, a signal transmitting unit, and an outputting unit. One end
of the second substrate is inserted into the main plate to make the
second substrate be perpendicular to the main plate, wherein the
other end of the second substrate opposite to where the second
substrate is inserted to the main plate is inserted into the
intermediate plate. The third substrate is located between the
first substrate and the second substrate. The converting unit is
disposed on the first substrate. The fourth substrate is located at
one side of the second substrate which is opposite to where the
third substrate is disposed, and one end of the fourth substrate is
inserted into the main plate and perpendicular to the main plate.
The controlling unit is placed on the second substrate and
electrically connected to the second substrate. The signal
transmitting unit is placed on the third substrate and electrically
connected to the third substrate for electrically connecting the
controlling unit and the converting unit. The outputting unit is
placed on the fourth substrate and electrically connected to the
fourth substrate.
[0009] In the present invention, the first substrate of the modular
power device is directly inserted into the main plate and
substantially perpendicular to the main plate. The driving module
and the converting module are respectively located at two side of
the first substrate, and the driving module is directly is placed
on first substrate. Thereby, the volume of the modular power device
can be substantially reduced, and prevent outputting electric power
by interference from inputting electric power. Besides, the route
for transmitting current is also reduced.
BRIEF DESCRIPTION OF DRAWING
[0010] The features of the invention believed to be novel are set
fourth with particularity in the appended claims. The invention
itself however may be best understood by reference to the following
detailed description of the invention, which describes certain
exemplary embodiments of the invention, taken in conjunction with
the accompanying drawings in which:
[0011] FIG. 1 is a perspective view of a modular power device
according to a first embodiment of the present invention.
[0012] FIG. 2 is a perspective view of a modular power device and a
main plate according to a first embodiment of the present
invention.
[0013] FIG. 3 is an assemble view of the modular power device and
the main board according to the first embodiment of the present
invention.
[0014] FIG. 4 is a perspective view of a power system according to
a first embodiment of the present invention.
[0015] FIG. 5 is a perspective view of a modular power device
according to a second embodiment of the present invention.
[0016] FIG. 6 is a perspective view of a modular power device and a
main plate according to a second embodiment of the present
invention.
[0017] FIG. 7 is an assemble view of the modular power device and
the main plate according to the second embodiment of the present
invention.
[0018] FIG. 8 is a perspective view of a modular power device
according to a third embodiment of the present invention.
[0019] FIG. 9 is a perspective view of a modular power module and a
main plate according to the third embodiment of the present
invention.
[0020] FIG. 10 is a perspective view of a modular power module
according to a fourth embodiment of the present invention.
[0021] FIG. 11 is a perspective view of a modular power device and
a main plate according to the fourth embodiment of the present
invention.
[0022] FIG. 12 is a perspective view of a power system according to
a second embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0023] A preferred embodiment of the present invention will be
described with reference to the drawings.
[0024] Referring to FIG. 1 to FIG. 3, FIG. 1 is a perspective view
of a modular power device according to a first embodiment of the
present invention, FIG. 2 is a perspective view of a modular power
module and a main plate according to a first embodiment of the
present invention, and FIG. 3 is an assemble view of the module
power device and the main plate according to the first embodiment
of the present invention. The modular power device 1 is used for
mounting on a main plate 50. The main plate 50 has a plurality of
grooves 52 for the modular power device 1 to be inserted therein.
The main plate 50 may be a printed circuit board (PCB) or a
substrate provided with conductive traces (not shown), and the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the main plate 50 may also be combined PCB
with copper slice or other material with good electrical
conductivity.
[0025] The modular power device 1 includes a first substrate 10, a
driving module 20 and a converting module 30. The driving module 20
is placed on one side of the first substrate 10 and electrically
connected to the first substrate 10. The converting module 30 is
located on the other side of the first substrate 10 and
electrically connected to the driving module 20.
[0026] The first substrate 10 is a PCB or a substrate provided with
conductive traces (not shown). In more particular, the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the first substrate 10 may also be combined
PCB with copper slice or other material with good electrical
conductivity.
[0027] The first substrate 10 has a first axial direction A1 and a
second axial direction A2 substantially perpendicular to the first
axial direction A1. In this embodiment, the first axial direction
A1 is lengthwise direction of the first substrate 10, and the
second axial direction A2 is widthwise direction of the first
substrate 10. The first substrate 10 is inserted into the main
plate 50, such that the second axial direction A2 of the first
substrate 10 is substantially perpendicular to a board 54 of the
main plate 50. An end of the first substrate 10 has at least one
pillar 102. The first substrate 10 can include one or more pillars
102. As non-limiting examples, the first substrate 10 includes two
pillars 102. The pillars 102 are inserted into the grooves 52, such
that the first substrate 10 is substantially perpendicular to the
main plate 50 and electrically connected thereto.
[0028] The driving module 20 is directly placed on the first
substrate 10 and electrically connected thereto for receiving
electric power inputting to the modular power device 10 and driving
the modular power device 10. The driving module 20 includes at
least one converter 200, at least one switching component 202 and a
plurality of active or passive components 204. The driving module
20 can include one or more converters 200 and switch components
202, respectively. As a non-limiting example, the driving module 20
of the modular power device 1 includes two converters 200 and four
switch components 202. In preferably, each switch component 202 is
metal-oxide-semiconductor field-effect transistor (MOSFET). The
converters 200, the switching components 202 and the active or
passive components 204 collectively construct a driving
circuit.
[0029] The converting module 30 receives voltage source outputted
by the driving module 20 and provides a function of voltage
converting for reducing voltage value of the voltage source. A
length of the converting module 30 is substantially equal to that
of the first substrate 10 in the first axial direction A1, and a
width of the converting module 30 is smaller than a length of first
substrate 10 in the first axial direction A1.
[0030] The converting module 30 includes a second substrate 300, a
third substrate 310, a fourth substrate 320, a converting unit 330,
a controlling unit 340, a signal-transmitting unit 350, an
outputting unit 360, a first connector 370, a second connector 380,
a third connector 390 and a fourth connector 400.
[0031] The converting unit 330 is placed on a board of the first
substrate 10 (which is opposite to where the driving module 20 is
disposed) and is used for receiving the electric power outputted by
the driving module 20. The converting unit 330 includes at least
one converter 332 and multiple active or passive components (not
shown) for collectively constructing a power modulating
circuit.
[0032] The first connector 370 is mounted on the first substrate 10
which is the same side where the converting module 330 is placed,
and electrically connected to the first substrate 10.
[0033] The second substrate 300 may be a PCB or a substrate
provided with conductive traces (not shown). In more particular,
the substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the second substrate 300 may also be
combined PCB with copper slice or other material with good
electrical conductivity. In preferably, the second substrate 300 is
multi-layer (more than or equal to two layers) circuit board. The
second substrate 300 is inserted into the main plate 50 and
electrically connected thereto, such that the second substrate 300
is parallel to the first substrate 10. In addition, one end of the
second substrate 300 has at least one pillar 302. The second
substrate 300 can include one or more pillars 302. As a
non-limiting example, the second substrate 300 includes two pillars
302. The pillars 302 are inserted into the grooves 52, such that
the second substrate 300 is perpendicular to the main plate 50 and
electrically connected thereto.
[0034] The controlling unit 340 is placed on the second substrate
300 and electrically connected thereto. The controlling unit 340
includes a plurality of controlling components 342, which can be
active or passive components, for collectively constructing a
circuit with controllable function. However, the controlling
components 342 can be an integrated circuit (IC) with function of
control.
[0035] The second connector 380 is mounted on the second substrate
300 and electrically connected to the controlling unit 340. In this
embodiment, the second connector 380 is mounted on a lateral side
of the second substrate 300 which is faced to where the first
substrate 10 is disposed.
[0036] The third substrate 310 may be a PCB or a substrate provided
with conductive traces (not shown). In more particular, the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the third substrate 310 may also be combined
PCB with copper slice or other material with good electrical
conductivity. The third substrate 310 is disposed between the first
substrate 10 and the second substrate 300, and is parallel to the
first substrate 10. The signal-transmitting unit 350 including a
plurality of electronic components 352 for constructing a
signal-transmitting circuit is placed on the third substrate 310
and electrically connected thereto.
[0037] The third connector 390 is mounted on the third substrate
310 and electrically connected thereto. The third connector 390 is
assembled with the first connector 370, such that the
signal-transmitting unit 350 is electrically connected to
converting unit 330.
[0038] The fourth connector 400 is mounted on the third substrate
310 and electrically connected thereto. The fourth connector 400 is
assembled with the second connector 380, such that the
signal-transmitting unit 359 is electrically connected to the
controlling unit 340.
[0039] The fourth substrate 320 may be a PCB or a substrate
provided with conductive traces (not shown. In more particular, the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the fourth substrate 320 may also be
combined PCB with copper slice or other material with good
electrical conductivity. The fourth substrate 320 is disposed at
one side of the second substrate 300 which is opposite to where the
third substrate 310 is disposed, and is substantially parallel to
the second substrate 300. The fourth substrate 320 is inserted into
the main plate 50 and electrically connected thereto. One end of
the fourth substrate 320 includes at least one pillar 322. The
fourth substrate 320 can includes one or more pillars 322. As a
non-limiting example, the fourth substrate 320 includes three
pillars 322. The pillars 322 are inserted into the grooves 52, such
that the fourth substrate 320 is perpendicular to the main plate 50
and electrically connected thereto.
[0040] The outputting unit 360 including at least one inductor 362
and at least one capacitor 364 is placed on the fourth substrate
320 and electrically connected thereto. The outputting unit 360 can
includes one or more inductors 362 and capacitors 364,
respectively. As non-limiting example, the outputting unit 360
includes two inductors 362 and two capacitors 364. The inductors
362 and the capacitors 364 are collectively constructing a
.pi.-type filter for stabilizing outputting current and reducing
outputting noise.
[0041] In the practical application, the user can adjust the
specifications (such as rated working voltage) of the driving
module 20, the converting unit 330, the controlling unit 340, the
signal-transmitting unit 350 and the outputting unit 360 according
to demanded outputting power, and the user can respectively insert
the first substrate 10, the second substrate 300, the third
substrate 310 and the fourth substrate 320 (where the driving
module 20, the converting unit 330, the controlling unit 340, the
signal-transmitting unit 350 and the outputting unit 360 is
disposed) into the main plate 50 and electrically connected to the
main plate 50, and then assemble the first connector 370 and the
second connector 380 with the third connector 390 and the fourth
connector 400, respectively, such that the converting unit 330 can
electrically connect to the controlling unit 340 via the
signal-transmitting unit 350. Therefore, the electric power
inputting from the modular power device 1 can be converted into a
demanded electric power, and outputted from the outputting unit
360. For this result, the modular power device 1 has advantages of
easily fabricating and easily modulating specifications.
[0042] To sum up, the modular power device 1 has advantage of small
volume, and the arrangement of the modular power device 1 can
effectively isolate the outputting unit 360 from the converting
unit 330, so as to reduce outputting power by interference from
inputting power, and then stabilize outputting electric power.
Besides, the space formed between each two substrate allows air
flowing therethrough, such that the heat dissipating effect can be
enhanced.
[0043] Reference is made to FIG. 4, which is a perspective view of
a power system according to a first embodiment of the present
invention. The power system includes a main plate 50 and a
plurality of modular power devices 1 mentioned above. The modular
power devices 1 are mounted on the main plate 50 and electrically
connected thereto. In this embodiment, the power system includes,
for example, two modular power devices 1, and the modular power
devices 1 electrically connected in parallel are arranged in an
alignment manner.
[0044] Therefore, when the power system is operated with light
load, only one modular power device 1 is activated for reducing
outputting electric power. When the power system is operated with
heavy load, a plurality of modular power devices 1 are activated to
increase outputting electric power. In addition, when activate more
modular power devices 1, the controlling units 340 of the modular
power devices 1 can collectively construct the function of
phase-shift, such that the effect of power system can be enhanced,
and the outputting ripple current is reduced. For this result, the
power system can achieve optimal efficiency wherever operating with
light load or heavy load, and prevent the problem of pool
efficiency of high power system as operating with light load.
[0045] Referring to FIG. 5 to FIG. 7, FIG. 5 is a perspective view
of a modular power device according to a second embodiment of the
present invention, FIG. 6 is a perspective view of a modular power
device and a main plate according to a second embodiment of the
present invention, and FIG. 7 is an assemble view of the modular
power device and the main plate according to the second embodiment
of the present invention. The modular power device 1a is similar to
the modular power device 1 mentioned above, and the same reference
numbers are used in the drawings and the description to refer to
the same parts.
[0046] The modular power device 1a further includes an intermediate
plate 40. The intermediate plate 40 may be a PCB or a substrate
provided with conductive traces (not shown). In more particular,
the substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the intermediate plate 40 may also be
combined PCB with copper slice or other material with good thermal
conductivity. A plurality of accommodating slots 41 are formed on
the intermediate plate 40.
[0047] In addition, one end the second substrate 300a which is
opposite to where the pillars 302 are formed has at least one rib
304. The second substrate 300a can includes one or more ribs 304.
As non-limited example, the second substrate 300a includes four
ribs 304. The ribs 304 are inserted into the accommodating slots 41
formed on the intermediate plate 40, such that the second substrate
300a is substantially perpendicular to the intermediate plate 40
and electrically connected thereto.
[0048] One end of the fourth substrate 320a which is opposite to
where the pillars 322 are formed has at least one rib 324. The
fourth substrate 320a can includes one or more ribs 324. As
non-limiting example, the fourth substrate 320a includes four ribs
324. The ribs 324 are inserted into the accommodating slots 41,
such that the fourth substrate 320a is substantially perpendicular
to the intermediate plate 320a and electrically connected
thereto.
[0049] Each converter 332a of the converting unit 330a has at least
one protrusion 3322a. The converter can include one or more
protrusions 3322a. As non-limiting example, each converter 330a
includes two protrusions 3322a. The protrusions 3322a are inserted
into the accommodating slots 41 of the intermediate plate 40, and
then electrically connect the intermediate plate 40 and the
converting unit 330a.
[0050] Thereby, the controlling unit 340 placed on the second
substrate 300a and the outputting unit 360 placed on the fourth
substrate 320a are electrically connected to the converting unit
330a and the driving module 20 via the main plate 50 and the
intermediate plate 40. Preferably, the potentials transmitted by
the main plate 50 and the intermediate plate 40 are different in
level.
[0051] The function and relative description of other components of
the module power device 1a is the same as that of first embodiment
mentioned above and are not repeated here, and the modular power
device 1a can fulfill the functions as the modular power device 1
does.
[0052] Besides, a power system may be constructed by the main plate
50 and a plurality of modular power devices 1a. The arrangement of
the modular power devices 1a is the same as the modular power
devices 1 mentioned above and its description is not repeated
here.
[0053] Referring to FIG. 8 and FIG. 9, FIG. 8 is respectively a
perspective view of a modular power device according to a third
embodiment of the present invention, and FIG. 9 is an assemble view
of a modular power device according to the third embodiment of the
present invention. The modular power device 1b is similar to the
modular power device 1a mentioned above, and the same reference
numbers are used in the drawings and the description to refer to
the same parts.
[0054] It should be noted that the second substrate 300b is a
multi-layer circuit board and a plurality of engaging slots 306b
are formed thereon for disposing a plurality of electric layers
308a therein. Preferably, a plurality of engaging parts 307b are
respectively formed on a wall of each engaging slot 306b for
fastening each electric layer 308b. Each electric layer 308b is
made of copper or other material with good electrical conductivity
and used as current transmitting routes.
[0055] The intermediate plate 40b includes a multi-layer circuit
board 400b, a first metallic layer 402b and the second metallic
layer 404b. Multiple through holes 401b are formed on the
multi-layer circuit board 400b. The first metallic layer 402b and
the second metallic layer 404b are made of copper or other material
with good electrical conductivity and used as current transmitting
routes.
[0056] The first metallic layer 402b is attached to a lower surface
of the multi-layer circuit board 400b, and a plurality of first
holes 403b corresponding to the through holes 401b are formed
thereon. The second metallic layer 404b is attached to an upper
surface of the multi-layer circuit board 400b, and a plurality of
second holes 405b corresponding to the through holes 401b are
formed thereon.
[0057] The protrusions 3322a of the converters 332a and the ribs
304b of the second substrate 300b are inserted into the through
holes 401b, the first holes 403b and the second holes 405b, and
electrically connected to the intermediate plate 40b.
[0058] The fourth substrate 320a includes a flat part 322b and a
bent part 324b. The flat part 322b is parallel to the first
substrate 10 and has a plurality of pillars 323b for inserting into
the main plate 50, such that the firth substrate 320b is
electrically connected to the main plate 50. The bent part 324b is
substantially perpendicular to the flat part 322b and a plurality
of openings 325b are formed thereon. A plurality of pins 363b of
each inductor 362b of outputting unit 360b are inserted into the
openings 325b of the fourth substrate 320b, the through holes 401b
of the intermediate plate 40b, the first holes 403b and the second
holes 405b, such that the fourth substrate 320b is electrically
connected to the intermediate plate 40b.
[0059] The modular power device 1b further comprises a carrier 42,
a first isolating and thermal-dissipating board 44, a second
isolating and thermal-dissipating board 46, a plurality of fixing
component 48 and a fifth substrate 49. The carrier 42 includes a
first board 420, a second board 422, a connecting part 424 and a
shoulder-part 426. The first board 420 is disposed adjacent to the
first substrate 10, and the second board 422 is disposed adjacent
to the second substrate 300b. In his embodiment, the first board
420 and the second board 422 are of rectangular shape, a length of
the second board 422 is substantially equal to that of the first
board 420, and a width of the second board 422 is smaller than that
of the first board 420. The connecting part 424 is located at one
end of the first board 420 and the second board 422 and connected
thereof. The first board 420, the second board 422 and the
connecting part 424 collectively construct an accommodating space
425 for accommodating the converter 332a of the converting unit
330a, so as to prevent the converters 332a from electromagnetic
interference produced by the converters 200 of the driving module
20. The connecting part 424 further includes a plurality of
supporting components 427 for inserting into the main plate 50. The
shoulder-part 426 is disposed on one end of the first board 420,
which is opposite to where the connecting part 424 is disposed, and
extending toward a direction where the first substrate 10 is
disposed for disposing the carrier 42 on the first substrate 10.
The first isolating and thermal-dissipating board 44 is disposed in
one side of the first substrate 10, the second isolating and
thermal-dissipating board 46 is disposed on the other side of the
first substrate 10. The fixing component 48 penetrates the first
isolating and thermal-dissipating board 44 and is fastened on the
second isolating and thermal-dissipating board 46 so as to provide
electromagnetic isolating effect and thermal-dissipating
effect.
[0060] The fifth substrate 49 is disposed at one side of the second
substrate 300b which is opposite to where the first substrate 10 is
disposed. The fifth substrate 49 is a PCB or a substrate provided
with conductive traces (not shown). In more particular, the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the fifth substrate 49 may also be combined
PCB with copper slice or other material with good thermal
conductivity. Preferably, the fifth substrate 49 is multi-layer
(more than or equal to two layers) circuit board. At least one
pillar 490 is formed at one end of the fifth substrate 49. The
fifth substrate 49 can include one or more pillars 490. As
non-limiting example, the fifth substrate 49 includes two pillars
490. The pillars 490 are inserted into the intermediate plate 40b
and electrically connected thereto. At least one rib 494 formed on
the other end of the fifth substrate 49 is inserted into the main
plate 50 and electrically connected to the main plate 50.
[0061] The fifth substrate 49 further includes at least one
electric layer 492 for functioning as routes of current
transmitting. The controlling unit 340 is simultaneously disposed
on the second substrate 300b and the fifth substrate 49 and
electrically connected thereto. For this result, the controlling
elements of the controlling unit 340 can disposed with intervals
for enhancing the effect of thermal-dissipation.
[0062] The function and relative description of other components of
the module power device 1b is the same as that of second embodiment
mentioned above and are not repeated here, and the modular power
device 1b can fulfill the functions as the modular power device 1a
does.
[0063] Besides, a power system may be constructed by the main plate
50 and a plurality of modular power devices 1b. The arrangement of
the modular power devices 1b is the same as the modular power
devices 1 mentioned above and the description thereof is not
repeated here.
[0064] Referring to FIG. 10 and FIG. 11, FIG. 9 is a perspective
view of a modular power device and main plate according to a fourth
embodiment of the present invention, and FIG. 10 is an assemble
view of a modular power device and main plate according to the
fourth embodiment of the present invention. The modular power
device 6 is used for mounting on a main plate 50. The main plate 50
has a plurality of grooves 52 through which the modular power
device 6 is inserted therein. The main plate 50 may be a printed
circuit board (PCB) or a substrate provided with conductive traces
(not shown), and the substrate mentioned above may be copper
substrate, aluminum substrate, ceramic substrate or other substrate
with good thermal conductivity. However, the main plate 50 may also
be combined PCB with copper slice or other material with good
electrical conductivity.
[0065] The modular power device 6 includes a first substrate 60, a
driving module 70 and a converting module 80. The converting module
70 is placed on one side of the first substrate 60 and electrically
connected the first substrate 60. The converting module 80 is
located at the other side of the first substrate 60, and
electrically connected to the driving module 70.
[0066] The first substrate 60 may be a (PCB) or a substrate
provided with conductive traces (not shown), and the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the first substrate 60 may also be combined
PCB with copper slice or other material with good thermal
conductivity. The first substrate 60 has a first axial direction A1
and a second axial direction A2 substantially perpendicular to the
first axial direction A1. In this embodiment, the first axial
direction A1 is lengthwise direction of the first substrate 60, and
the second axial direction A2 is widthwise direction of the first
substrate 60. The first substrate 60 is inserted into the main
plate 50, such that the second axial direction A2 of the first
substrate 60 is substantially perpendicular to a board 54 of the
main plate 50. An end of the first substrate 60 has at least one
pillar 602. The first substrate 60 can include one or more pillars
602. As non-limiting examples, the first substrate 60 includes two
pillars 602. The pillars 602 are inserted into the grooves 52, such
that the first substrate 60 is substantially perpendicular to the
main plate 50 and electrically connected thereto.
[0067] The driving module 70 is directly placed on the first
substrate 60 and electrically connected thereto. The driving module
70 receives electric power inputting to the modular power device 6
and drives thereof. The driving module 70 includes at least one
converter 700, at least one switch 702 and a plurality of active
and passive components 704. The driving module 70 can include one
or more converters 700 and switch components 702, respectively. As
a non-limiting example, the driving module 70 includes two
converters 700 and four switches 702, and each switch 702 is
MOSFET. The converters 700, the switches 702 and the active or
passive components 704 collectively construct a driving
circuit.
[0068] The converting module 80 receives voltage source passing
through the driving module 70 and provides the function of voltage
converting so as to reduce the voltage value of the voltage source.
A length of the converting module 80 is substantially equal to that
of the first substrate 60 in the first axial direction A1, and a
width of the converting module is smaller than a length of the
first substrate 60 in the first axial direction A1.
[0069] The converting module 80 includes a second substrate 800, at
least one conductive layer 810, a converting unit 830, a
controlling unit 840, an outputting unit 860, a first connecting
post 870, two second connecting posts 880 and an electric layer
890.
[0070] The second substrate 800 is disposed opposite to the main
plate 50. The second substrate 800 may be a PCB or a substrate
provided with conductive traces (not shown), and the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the second substrate 800 may also be
combined PCB with copper slice or other material with good thermal
conductivity. Preferably, the second substrate 800 is multi-layer
(more than or equal to two layers) circuit board.
[0071] The conductive layer 810 is made of copper of other material
with good electrical conductivity. The conductive layer 810 is
attached to the second substrate 800 for functioning as route of
current transmission. Preferably, a containing slot (not shown) is
formed on the second substrate 800 for containing the conductive
layer 810 and fastening the conductive layer 810.
[0072] The converting unit 830, the controlling unit 840 and the
outputting unit 860 are placed on the second substrate 800 and
electrically connected thereto. The converting unit 830 receives
the power outputted by the driving module 70 and converts the
outputted power into a demand voltage value. The converting unit
830 includes at least one converter 832 and a plurality of action
or passive components (not shown). The converter 832 and the active
or passive components collectively construct a voltage-converting
circuit.
[0073] The controlling unit 840 is used for controlling the
operating state of the modular power device 6. The controlling unit
840 includes multiple controlling components for constructing a
controlling circuit. However, the controlling unit 840 may be a
integrate circuit (IC) with controlling function. The outputting
unit 860 includes at least one inductor 862 and at least one
capacitor 864. The outputting unit 860 can include one or more
inductors 862 and capacitors 864, respectively. As non-limiting
example, the outputting unit 860 includes two inductors 862 and
four capacitors 864. The inductors 862 and the capacitor 864
collectively construct a .pi.-type filter for stabilizing
outputting current and reducing outputting noise.
[0074] The first connecting post 870 is located between the main
plate 50 and the second substrate 800, and inserted into the
grooves 52 of the main plate 50 and the through hole 801 of the
second substrate 800, and electrically connected to the main plate
50 and the second substrate 800.
[0075] The electric layer 980 is made of copper of other material
with good electrical conductivity. The electric layer 810 is
attached to the second substrate 800 for providing connective path
between the outputting unit 860 and the second substrate 800, and
then current can flow between the outputting unit 860 and the
second substrate 800. A plurality of buckles 891 are formed on the
electric layer 980, the buckles 891 are locked on a plurality of
positioning slots 802 formed on the second substrate 800 for
achieving the effect of position and enhancing the connecting
strength of the electric layer 890 and the second substrate 800. In
this embodiment, the electric layer 890 is of T-shape. In the
practical application, the profile of the electric layer 890 may be
adjusted by demand.
[0076] The electric layer 890 is connected to each second post 880
through at least one connecting component 892. The connecting
component 892 is preferably rivet for riveting the electric layer
890 to one end of each second connecting post 880, such that
current can transmit between the electric layer 890 and the second
connecting posts 880. The other end of each second connecting post
880 is inserted into the groove 52 of the main plate 50 and
electrically connected to the main plate 50, such that electric
power can transmit between the main plate 50 and the second
substrate 800 via second connecting posts 880. Preferably, the
potentials transmitted by the second connecting posts 880 and the
first connecting post 870 are different in level.
[0077] The modular power device 6 further comprises a first
isolating and thermal-dissipating board 94, a second isolating and
thermal-dissipating board 96 and a plurality of fixing components
98. The first isolating and thermal-dissipating board 94 is
disposed in one side of the first substrate 60, the second
isolating and thermal-dissipating board 96 is disposed on the other
side of the first substrate 60. The fixing components 98 penetrate
the first isolating and thermal-dissipating board 94 and fastened
on the second isolating and thermal-dissipating board 96 so as to
provide electromagnetic isolating and thermal-dissipating
effect.
[0078] To sum up, the modular power device 6 has advantage of small
volume and air can flow therein to enhance heat dissipating
effect.
[0079] In the practical application, the user can adjust the
specifications (such as rated working voltage) of the driving
module 70, the converting unit 830, the controlling unit 840 and
the outputting unit 860 according to demanded outputting power.
Therefore, the electric power inputting from the modular power
device 6 can be converted into a demanded electric power, and
output from the outputting unit 860. For this result, the modular
power device 6 has advantages of easily fabricating and easily
modulating specifications.
[0080] Reference is made to FIG. 12, which is a perspective view of
a power system according to a second embodiment of the present
invention. The power system includes a main plate 50 and a
plurality of modular power devices 6 mentioned above. The modular
power devices 6 are mounted on the main plate 50 and electrically
connected thereto. In this embodiment, the power system includes,
for example, two modular power devices 6, and the modular power
devices 6 electrically connected in parallel are mounted on the
main plate 50 in an alignment manner.
[0081] Therefore, when the power system is operated with light
load, only one modular power device 6 is activated for reducing
outputting electric power. When the power system is operated with
heavy load, a plurality of modular power devices 6 are activated to
increase outputting electric power. In addition, when activate more
modular power devices 6, the controlling units 840 of the modular
power device 6 can collectively construct the function of
phase-shift, such that the effect of power system can be enhanced,
and the outputting current ripple can be reduced. For this result,
the power system can achieve optimal efficiency wherever operating
with light load or heavy load, and prevent the problem of pool
efficiency of high power system as operating with light load.
[0082] Although the present invention has been described with
reference to the foregoing preferred embodiment, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *