U.S. patent application number 14/761289 was filed with the patent office on 2015-12-17 for fastening technique in a downhole tool.
The applicant listed for this patent is SCHLUMBERGER TECHNOLOGY CORPORATION. Invention is credited to Gautier COURT, Sihar MARPAUNG, Viet Tung NGUYEN.
Application Number | 20150361781 14/761289 |
Document ID | / |
Family ID | 47683667 |
Filed Date | 2015-12-17 |
United States Patent
Application |
20150361781 |
Kind Code |
A1 |
MARPAUNG; Sihar ; et
al. |
December 17, 2015 |
Fastening Technique in a Downhole Tool
Abstract
Systems and methods are provided for implementing sliders 44 in
a downhole tool. The tool includes a pad 24c having a pad base 32
and a pad cover 34 substantially encompassing electronic components
in the pad. The pad cover 34 and pad base 32 may be sealed, and
sliders 44 may be used to reduce negative effects from relative
movements between the pad base 32 and the pad cover 34. In some
embodiments, the sliders 44 may be shaped and positioned to guide
relative movements between the pad base 32 and pad cover 34, and
the sliders 44 may reduce stresses on the pad base, pad cover,
and/or the electronic components.
Inventors: |
MARPAUNG; Sihar; (Issy Les
Moulineaux, FR) ; NGUYEN; Viet Tung; (Bourg la Reine,
FR) ; COURT; Gautier; (Saint Cloud, FR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SCHLUMBERGER TECHNOLOGY CORPORATION |
Sugar Land |
TX |
US |
|
|
Family ID: |
47683667 |
Appl. No.: |
14/761289 |
Filed: |
January 15, 2014 |
PCT Filed: |
January 15, 2014 |
PCT NO: |
PCT/US14/11565 |
371 Date: |
July 15, 2015 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61752859 |
Jan 15, 2013 |
|
|
|
Current U.S.
Class: |
166/65.1 |
Current CPC
Class: |
E21B 47/017 20200501;
E21B 47/01 20130101 |
International
Class: |
E21B 47/01 20060101
E21B047/01 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 15, 2013 |
EP |
13305036.9 |
Claims
1. A downhole tool comprising: one or more pads, wherein each of
the one or more pads comprises: a pad base; electronic components
disposed on the pad base; a pad cover sealed to the pad base,
substantially encompassing the electronic components; and one or
more sliders positioned between the pad base and the pad cover,
wherein the one or more sliders mechanically couple the pad base
and pad cover such as to guide movements of the pad cover relative
to the pad base along an XY plane of each of the one or more
pads.
2. The downhole tool of claim 1, wherein the one or more sliders
comprise a rectangular shape having a length substantially parallel
to a length of each of the one or more pads.
3. The downhole tool of claim 1, wherein the one or more sliders
are configured such that the pad cover moves with respect to the
pad base along a length of each of the one or more sliders.
4. The downhole tool of claim 1, comprising one or more inserts
between the pad base and the pad cover, wherein each of the one or
more inserts mechanically couple the pad base and pad cover by
engaging with a respective one of the one or more sliders.
5. The downhole tool of claim 4, wherein the one or more sliders
substantially surround one or more of the one or more inserts in
the XY plane.
6. The downhole tool of claim 1, wherein the one or more sliders
are disposed substantially parallel to one or more edges of the pad
base and the pad cover.
7. The downhole tool of claim 1, wherein the pad cover comprises a
polymer suitable for maintaining properties in high
temperatures.
8. The downhole tool of claim 7, wherein the pad cover comprises
PEEK.TM..
9. The downhole tool of claim 1, wherein the one or more sliders
comprises a polymer suitable for maintaining properties in high
temperatures.
10. The downhole tool of claim 9, wherein the one or more sliders
comprises PEEK.TM..
11. The downhole tool of claim 1, wherein the one or more of the
one or more sliders comprise different materials or combinations of
materials from others of the one or more sliders.
12. The downhole tool of claim 1, wherein the one or more sliders
are shaped to be suitable for guiding relative movements between
the pad base and the pad cover.
13. The downhole tool of claim 1, wherein the one or more sliders
are configured to reduce force on the pad base, the pad cover, the
electronic components, or combinations thereof.
14. The downhole tool of claim 1, wherein the one or more sliders
are configured to reduce effects of relative movement between the
pad base and the pad cover.
Description
BACKGROUND
[0001] This disclosure relates generally to downhole tools and more
specifically to sealing techniques for the pad of a downhole
tool.
[0002] This section is intended to introduce the reader to various
aspects of art that may be related to various aspects of the
present techniques, which are described and/or claimed below. This
discussion is believed to be helpful in providing the reader with
background information to facilitate a better understanding of the
various aspects of the present disclosure. Accordingly, it should
be understood that these statements are to be read in this light,
and not as admissions.
[0003] Many downhole tools have been developed to determine
properties of geological formations surrounding wells. One such
downhole tool is referred to as a resistivity tool. Resistivity
tools may inject a current into the surrounding geological
formation using an injection electrode. The current may return to
the tool from the geological formation via a return electrode. In
general, the injection electrode may represent a current-measuring
electrode (referred to as a measuring electrode) through which this
current may be measured. By measuring the current, resistivity
tools may determine the impedance, or resistivity, of the
surrounding formation. For example, resistivity measurements may be
used to obtain an image of the geological formation in the
well.
[0004] Downhole tools often include electronics, sensors, or other
components that may be susceptible to the high ambient temperatures
of the downhole environment. Such components are designed to
operate within a certain range of temperatures, and these
acceptable temperatures may be lower than the temperature in the
borehole. In such contexts, maintaining the temperature sensitive
components within the acceptable temperature range may prevent
heat-related failures. Various techniques may be implemented to
provide protection to such temperature sensitive components. For
example, electronics, sensors, and other components may be covered,
for example by a pad cover, to protect the components from the
downhole environment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is a schematic diagram of a downhole system in
accordance with an embodiment;
[0006] FIG. 2 is a schematic diagram of a downhole tool having
multiple pads, in accordance with an embodiment;
[0007] FIG. 3 is a cross-sectional view of a pad, in accordance
with an embodiment;
[0008] FIG. 4 is a perspective view of a pad having a fastened pad
cover, in accordance with an embodiment; and
[0009] FIG. 5 is a view of a pad and cover having a fastener to
allow relative movement, in accordance with an embodiment.
DETAILED DESCRIPTION
[0010] One or more specific embodiments of the present disclosure
will be described below. These described embodiments are examples
of the presently disclosed techniques. Additionally, in an effort
to provide a concise description of these embodiments, certain
features of an actual implementation may not be described in the
specification. It should be appreciated that in the development of
any such actual implementation, as in any engineering or design
project, numerous implementation-specific decisions may be made to
achieve the developers' specific goals, such as compliance with
system-related and business-related constraints, which may vary
from one implementation to another. Moreover, it may be appreciated
that such a development effort might be complex and time consuming,
but would nevertheless be a routine undertaking of design,
fabrication, and manufacture for those of ordinary skill having the
benefit of this disclosure.
[0011] When introducing elements of various embodiments of the
present disclosure, the articles "a," "an," and "the" are intended
to mean that there are one or more of the elements. The terms
"comprising," "including," and "having" are intended to be
inclusive and mean that there may be additional elements other than
the listed elements. Additionally, it should be understood that
references to "one embodiment" or "an embodiment" of the present
disclosure are not intended to be interpreted as excluding the
existence of additional embodiments that also incorporate the
recited features.
[0012] FIG. 1 shows a downhole system 10 cable head 11 connected at
its lower end to a logging tool 12. An upper end of the cable head
11 is secured to a cable 14 in this embodiment. The cable 14 may
be, for example, a wireline cable extending to the surface 16 of a
well or hole 18 and is operable to lower the cable head 11 and one
or more logging tools, such as logging tool 12, down to an area
where formations and parameters are determined and recorded during
logging operations. A vertical well 18 is shown but it should be
understood that it can be highly deviated or even horizontal in
another example. During a logging operation, data may be
transmitted from the logging tool 12 to the cable 14 through the
cable head 11. Within the cable 14, the data may be transmitted to
a data-transmission and acquisition system 20 at the surface
16.
[0013] While a wireline cable is provided as an example of one
implementation of the cable 14, the downhole system 10 in the
present application may include drilling or logging systems, such
as measurement-while-drilling (MWD) systems, logging-while-drilling
(LWD) systems, wireline systems, coiled tubing systems, testing
systems, completions systems, productions systems, or combinations
thereof. Furthermore, the logging tool 12 discussed herein may
include any tool suitable for use in the downhole system 10.
[0014] In some embodiments, the logging tool 12 may be a downhole
imaging tool suitable obtaining an image of formation surrounding
the well 18. For example, a downhole imaging tool may be suitable
for obtaining resistivity or micro-resistivity measurements. The
downhole imaging tool may measure the resistivity of the formation
by injecting a current into the surrounding formation using an
injection electrode. The current may return to the tool from the
geological formation via a return electrode. In general, the
injection electrode may represent a current-measuring electrode
through which this current may be measured. By measuring the
current, the impedance, or resistivity, of the surrounding
formation may be determined. The measured resistivity and/or
impedance may be used to obtain an image of the formation
surrounding the well 18.
[0015] In one embodiment, the body of the downhole tool 12 may have
one or more extendable arms carrying sensor pads. In use, the arm
or arms may be extended until the pad is placed against the wall of
the borehole, at which point measurements are made using the
sensors on the pad. In some embodiments, multiple arms may extend
multiple pads against a portion of the circumference of a borehole.
The tool may be moved along the borehole such that the pad is
disposed across the borehole wall and makes multiple measurements
along the length of the borehole.
[0016] For example, FIG. 2 is a schematic configuration of a
downhole tool having one or more extendable arms, according to
embodiments of the invention. The downhole tool 12a may have one or
more sets of arms 22a, 22b, 22c, 22d (four arms in each set)
located spaced apart in the axial direction on the downhole tool
12a. Each arm is provided with a connection for a measurement pad
24. In one embodiment, a centraliser or standoff 28 may be
positioned at the bottom of the downhole tool 12a.
[0017] As the pads may operate in relatively high temperature and
high pressure environments, electronic components in the pads 24
may be configured to perform reliably in such an environment. In
some embodiments, each of the pads 24 may include functional
electronic components for acquiring, processing, and transmitting
measurements associated with the downhole formation. Such
components may be arranged on a pad base and protected by a pad
cover.
[0018] FIG. 3 is a cross-sectional view of an example of a pad 24a
including electronic components 30 for acquiring, processing, and
or transmitting formation measurements disposed on a pad base 32.
The electronic components 30 may be covered with a pad cover 34,
and the pad base 32 and pad cover 34 may be substantially sealed to
protect the electronic components 30 of the pad 24a. For example, a
bore sealing 36 may be used to seal the pad cover 34 to the pad
base 32. Furthermore, sealing techniques may also be used to seal
the pad cover or pad base to any of the electronic components 30.
For example, the bore sealing 38 may seal the pad cover 34 to
button electrodes 40.
[0019] FIG. 4 is a perspective view of a pad 24b having a pad cover
34 sealed on the pad base 32. As illustrated in FIG. 4, the pad
base 32 may have raised inserts 42, and the pad cover 34 may have
depressions configured to fit the inserts 42 to seal the pad cover
34 to the pad base 32. In some embodiments, the pad cover 34 may
have raised inserts, and the pad base 32 may have depressions
configured to fit the cover inserts. In some embodiments, the
inserts 42 may mechanically connect the pad base 32 and pad cover
34 in the XY plane (e.g., in the plane substantially along the
plane of the pad base 32 and pad cover 34)
[0020] The different electronic components 30, pad base 32, and pad
cover 34 may include various different materials. For example, due
to the environmental conditions which the pad 24a may be exposed
to, the pad base 32 may have a substantially rigid metallic body
while the pad base 34 may include a suitable high-temperature
polymer (e.g., PEEK.TM.). The various materials in the pad 24a may
react differently due to the environmental conditions, as different
materials may have different properties, such as thermal expansion.
Furthermore, due to operations of the pad 24a downhole, the pad
base 32 and pad cover 34 may have move, shift, and/or expand
relative to one another. Such relative movements between the pad
base 32 and pad cover 34 may affect the sealing of the pad base 32
and pad cover 34.
[0021] Embodiments of the present disclosure include techniques for
reducing negative effects from the relative movements between a pad
cover and pad base in a pad of a downhole tool. In one embodiment,
sliders may be implemented between a pad base 32 and a pad cover
34, such that relative movements in the x-axis and/or y-axis may be
guided along a dimension of the slider, thereby reducing stress,
shear, pressure, and/or deformation in the pad base 32, pad cover
34, and/or the sealing (e.g., sealing 36 and 38) in the pad 24.
[0022] The illustration in FIG. 5 provides an example of a pad 24c
having a pad base 32 and a pad cover 34 sealing electronic
components of the pad 24c, including button electrodes 40. The pad
cover 34 is faded in this illustration to depict the position of
one embodiment of the sliders 44. The position of the sliders 44
may guide relative movements in the x- and y-directions (referred
to as the XY plane; axis provided) of the pad base 32 and the pad
cover 34, such that stress, sheer, pressure, and/or deformation
which may result from such relative movement may be reduced. In
some instances, the pad cover 34 may move relative to the pad base
32 along the length of one or more of the sliders 44. For example,
the sliders 44 may be positioned and configured such that a length
of the sliders 44 is substantially parallel to one or more edges of
the pad base 32 and pad cover 34. The movement of the pad base 32
and the pad cover 34 relative to one another may be substantially
parallel to the length or to another dimension of the sliders 44.
The shape, dimension, and size of the sliders 44 may be suitable
for guiding relative movements between the pad cover 34 and the pad
base 32. The guiding of relative movements may reduce effects, such
as stress, sheering, or any force which may result in deformation
or damage to the pad base 32, the pad cover 34, and/or electronic
components 30 of the pad 24.
[0023] In some embodiments, the sliders 44 may substantially
surround in the XY plane one or more of the inserts 42 connecting
the pad base 32 and pad cover 34. For example, in one embodiment,
the pad base 32 may include sliders 44 while the pad cover 34 may
include inserts 42, and the inserts 42 of the pad cover 34 may
substantially fit in the sliders 44 of the pad base 32. In another
embodiment, the pad base 32 may include inserts 42 while the pad
cover 34 may include sliders 44, and the inserts of the pad base 32
may substantially fit in the sliders 44 of the pad cover 34. The
movement of the pad base 32 and the pad cover 34 relative to one
another may therefore be controlled or limited based on the
movement of the inserts 42 in each respective slider 44.
[0024] In different embodiments, the sliders 44 may be configured
on the pad base 32, on the pad cover 34, independently from the pad
base 32 and the pad cover 34, or in combinations of these
implementations. In one or more embodiments, the sliders may
include a material suitable for high temperature and suitable for
withstanding the relative movement between the pad base 32 and pad
cover 34.
[0025] Various refinements of the features noted above may exist in
relation to various aspects of this disclosure. Further features
may also be incorporated in these various aspects as well. These
refinements and additional features may exist individually or in
any combination. For instance, various features discussed below in
relation to one or more of the illustrated embodiments may be
incorporated into any of the above-described aspects of this
disclosure alone or in any combination. The brief summary presented
above is intended to familiarize the reader with certain aspects
and contexts of embodiments of this disclosure without limitation
to the claimed subject matter.
* * * * *