U.S. patent application number 14/289920 was filed with the patent office on 2015-12-03 for z-fold multi-element substrate structure.
The applicant listed for this patent is Ronald Steven Cok, Thomas Nathaniel Tombs. Invention is credited to Ronald Steven Cok, Thomas Nathaniel Tombs.
Application Number | 20150346858 14/289920 |
Document ID | / |
Family ID | 54542847 |
Filed Date | 2015-12-03 |
United States Patent
Application |
20150346858 |
Kind Code |
A1 |
Cok; Ronald Steven ; et
al. |
December 3, 2015 |
Z-FOLD MULTI-ELEMENT SUBSTRATE STRUCTURE
Abstract
A folded micro-wire substrate structure includes a transparent
folded flexible substrate having a first side and a second side
opposed to the first side. The flexible substrate has a first
portion and a second portion adjacent to the first portion of the
flexible substrate. The flexible substrate has at least a first
fold between the first and second portions so that the first
portion is aligned with the second portion in a perpendicular
direction. One or more electrical conductors is located in or on
the flexible substrate, at least one electrical component is
located on or in the flexible substrate in the first portion. At
least one optical element is located on or in the flexible
substrate in the second portion located so that the optical element
directs light to or from the electrical component.
Inventors: |
Cok; Ronald Steven;
(Rochester, NY) ; Tombs; Thomas Nathaniel;
(Rochester, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Cok; Ronald Steven
Tombs; Thomas Nathaniel |
Rochester
Rochester |
NY
NY |
US
US |
|
|
Family ID: |
54542847 |
Appl. No.: |
14/289920 |
Filed: |
May 29, 2014 |
Current U.S.
Class: |
345/174 |
Current CPC
Class: |
H05K 2201/055 20130101;
H05K 1/189 20130101; G06F 3/0446 20190501; H05K 2203/1545 20130101;
G06F 1/1652 20130101; G06F 2203/04103 20130101; G06F 2203/04102
20130101; H05K 2201/10128 20130101; H05K 1/148 20130101; G06F
2203/04112 20130101; G06F 1/1643 20130101; G06F 3/04164 20190501;
H05K 3/1275 20130101 |
International
Class: |
G06F 3/044 20060101
G06F003/044 |
Claims
1. A folded micro-wire substrate structure, comprising: a
transparent folded flexible substrate having a first side and a
second side opposed to the first side, the flexible substrate
having a first portion and a second portion adjacent to the first
portion of the flexible substrate; the flexible substrate having at
least a first fold between the first and second portions so that
the first portion is aligned with the second portion in a direction
perpendicular to the first and second portions of the flexible
substrate; one or more electrical conductors located in or on the
flexible substrate; at least one electrical component located on or
in the flexible substrate in the first portion; and at least one
optical element located on or in the flexible substrate in the
second portion located so that the optical element directs light to
or from the electrical component.
2. The folded micro-wire substrate structure of claim 1, the
flexible substrate further including a third portion adjacent to
the second portion so that the second portion is between the first
and third portions of the flexible substrate, the flexible
substrate having a second fold between the second and third
portions so that the second side is between the second and third
portions in the perpendicular direction.
3. The folded micro-wire substrate structure of claim 2, the
flexible substrate further including a fourth portion adjacent to
the third portion so that the third portion is located between the
second and fourth portions of the flexible substrate, the flexible
substrate having a fourth fold between the fourth and fifth
portions so that the fourth portion is adjacent to the third
portion in the perpendicular direction.
4. The folded micro-wire substrate structure of claim 1 wherein the
electrical component is a light emitter or absorbs light to produce
electrical current.
5. The folded micro-wire substrate structure of claim 1, wherein
the optical element is a first optical element on or in the first
side and further including at least one second optical element on
or in the second side.
6. The folded micro-wire substrate structure of claim 5, wherein
the first and second optical elements have a common optical
axis.
7. The folded micro-wire substrate structure of claim 5, wherein
the first and second optical elements do not have a common optical
axis.
8. The folded micro-wire substrate structure of claim 1 wherein the
optical element is formed in the flexible substrate or secured to
the flexible substrate.
9. The folded micro-wire substrate structure of claim 1 further
including an additional substrate located between the first and
second portions in the perpendicular direction.
10. The folded micro-wire substrate structure of claim 9 wherein
the additional substrate is electrically insulating.
11. The folded micro-wire substrate structure of claim 9 wherein
the additional substrate is transparent.
12. The folded micro-wire substrate structure of claim 11 wherein
the additional substrate has one or more optical elements formed in
or secured to the additional substrate.
13. The folded micro-wire substrate structure of claim 1 wherein at
least one electrical conductor extends from the first portion to
the second portion and across the first fold.
14. The folded micro-wire substrate structure of claim 1 further
including a protective layer on the flexible substrate so that the
electrical conductors are between the protective layer and at least
a portion of the flexible substrate.
15. The folded micro-wire substrate structure of claim 1 wherein
the flexible substrate further includes an extended portion
adjacent to the first portion so that the first portion is located
between the extended portion and the second portion and so that
there is no portion of the flexible substrate adjacent to the
extended portion in the perpendicular direction.
16. The folded micro-wire substrate structure of claim 1 further
including an electrical connection between an electrical conductor
in the first portion and an electrical conductor in the second
portion that does not extend across the first fold.
17. (canceled)
18. (canceled)
19. The micro-wire substrate structure of claim 1, wherein the
first portion is in contact with the second portion.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] Reference is made to commonly-assigned, co-pending U.S.
patent application Ser. No. 14/253,929 filed Apr. 16, 2014,
entitled "Wrap-Around Micro-Wire Structure" by Tombs et al, U.S.
patent application Ser. No. ______ (Kodak Docket K001781) filed
concurrently herewith, entitled "Z-Fold Micro-Wire Substrate
Structure" by Cok et al, to commonly-assigned, co-pending U.S.
patent application Ser. No. ______ (Kodak Docket K001790) filed
concurrently herewith, entitled "Making Z-Fold Micro-Wire Substrate
Structure" by Cok et al, and to commonly-assigned, co-pending U.S.
patent application Ser. No. ______ (Kodak Docket K001792) filed
concurrently herewith, entitled "Making Z-Fold Multi-Element
Substrate Structure" by Cok et al, the disclosures of which are
incorporated herein.
FIELD OF THE INVENTION
[0002] The present invention relates to electrically conductive
micro-wires, circuits, and optical elements formed on a common
flexible substrate in a folded configuration.
BACKGROUND OF THE INVENTION
[0003] Electronic devices formed on flexible substrates are used in
applications that require non-planar forms or that require
mechanical manipulation in different configurations. For example,
some devices are designed to be folded or unfolded. Other devices
are located on curved surfaces. A variety of technologies are under
development for such applications, including organic electronics,
inkjet deposition, polymer layers, and flexible substrate materials
such as polymers and paper. Such technologies enable applications
such as flexible or curved displays, antennas, solar cells,
batteries, sensors, and biomedical devices.
[0004] Flexible substrates or printed circuit boards are an
important component of flexible electronic devices. Currently,
silk-screened metal wire conductors formed on a polymer substrate
are used as flexible connectors in many electronic systems. Such
methods typically have limited resolution. Other patterned
conductors are formed using photolithographic processes on flexible
materials, but such methods are typically difficult because of
material and process compatibility issues and the expense of such
processes. Such prior-art methods can also produce devices with a
relatively limited radius of curvature, thereby limiting the
applications and configurations to which the technology is
applied.
[0005] There is also a need for high-density electronic devices
that incorporate three-dimensional circuit structures. Such
structures increase the number of computing elements per volume but
are typically expensive to construct. Other applications integrate
optical devices such as lenses or reflectors into optoelectronic
devices. Such devices typically include multiple, separate elements
that are separately manufactured and then carefully aligned and
integrated at a relatively high resolution and cost.
[0006] Very fine patterns of conductive elements, such as metal
wires or conductive traces are known. For example, U.S. Patent
Application Publication No. 2011/0007011 teaches a capacitive touch
screen with a mesh electrode, as do U.S. Patent Application
Publication No. 2010/0026664, U.S. Patent Application Publication
No. 2010/0328248, and U.S. Pat. No. 8,179,381, which are hereby
incorporated in their entirety by reference. As disclosed in U.S.
Pat. No. 8,179,381, fine conductor patterns are made by one of
several processes, including laser-cured masking, inkjet printing,
gravure printing, micro-replication, and micro-contact printing. In
particular, micro-replication is used to form micro-conductors
formed in micro-replicated channels. The transparent micro-wire
electrodes include micro-wires between 0.5.mu. and 4.mu. wide and a
transparency of between approximately 86% and 96%.
[0007] Conductive micro-wires can be formed in micro-channels
embossed in a substrate, for example as taught in CN102063951,
which is hereby incorporated by reference in its entirety. As
discussed in CN102063951, a pattern of micro-channels is formed in
a substrate using an embossing technique. Embossing methods are
generally known in the prior art and typically include coating a
curable liquid, such as a polymer, onto a rigid substrate. A
pattern of micro-channels is imprinted (impressed or embossed) onto
the polymer layer by a master having an inverted pattern of
structures formed on its surface. The polymer is then cured. A
conductive ink is coated over the substrate and into the
micro-channels, the excess conductive ink between micro-channels is
removed, for example by mechanical buffing, patterned chemical
electrolysis, or patterned chemical corrosion. The conductive ink
in the micro-channels is cured, for example by heating or exposure
to HCl vapor. In an alternative method described in CN102063951, a
photosensitive layer, chemical plating, or sputtering is used to
pattern conductors, for example, using patterned radiation exposure
or physical masks. Unwanted material (e.g. photosensitive resist)
is removed, followed by electro-deposition of metallic ions in a
bath.
[0008] Multi-level masks are used with photo-lithography to form
thin-film devices, for example as disclosed in U.S. Pat. No.
7,202,179. An imprinted 3D template structure is provided over
multiple thin films formed on a substrate. The multiple levels of
the template structure are used as masks for etching the thin
films. This approach requires the use of a mask and multiple
photo-lithographic steps.
[0009] The use of integrated circuits with electrical circuitry is
well known. Various methods for providing integrated circuits on a
substrate and electrically connecting them are also known.
Integrated circuits can have a variety of sizes and packages. In
one technique, Matsumura et al., in U.S. Patent Application
Publication No. 2006/0055864, describes crystalline silicon
substrates used for driving LCD displays. The application describes
a method for selectively transferring and affixing pixel-control
devices made from first semiconductor substrates onto a second
planar display substrate. Wiring interconnections within the
pixel-control device and connections from buses and control
electrodes to the pixel-control device are shown.
[0010] Printed circuit boards are well known for electrically
interconnecting integrated circuits and often include multiple
layers of conductors with vias for electrically connecting
conductors in different layers. Circuit boards are often made by
etching conductive layers deposited on laminated fiberglass
substrates. However, such etching processes are expensive and the
substrates are not transparent and therefore of limited use in
applications for which transparency is important, for example
display and touch-screen applications.
[0011] Flexible substrates are also known in the art and are used
with other devices, such as displays. U.S. Pat. No. 6,501,528
discloses a stacked display device with a folded substrate. U.S.
Pat. No. 7,792,558 describes a mobile communication device with
bent connector wires and U.S. Pat. No. 8,017,884 illustrates an
integrated touch panel and electronic device. U.S. Pat. No.
5,520,112 describes a folded substrate and a dual-sided printing
process. Such substrates, structures, and methods demonstrate an
on-going need in the industry for manufacturing methods
incorporating devices and flexible substrates.
SUMMARY OF THE INVENTION
[0012] There is a need, therefore, for further improvements in
flexible optoelectronic devices that enable simplified
manufacturing processes and fewer parts and processing steps at a
lower cost.
[0013] In accordance with the present invention, a folded
micro-wire substrate structure comprises:
[0014] a transparent folded flexible substrate having a first side
and a second side opposed to the first side, the flexible substrate
having a first portion and a second portion adjacent to the first
portion of the flexible substrate;
[0015] the flexible substrate having at least a first fold between
the first and second portions so that the first portion is aligned
with the second portion in a direction perpendicular to the first
and second portions of the flexible substrate;
[0016] one or more electrical conductors located in or on the
flexible substrate;
[0017] at least one electrical component located on or in the
flexible substrate in the first portion; and
[0018] at least one optical element on or in the flexible substrate
in the second portion located so that the optical element directs
light to or from the electrical component.
[0019] The present invention provides micro-wire structures in
flexible configurations having improved electrical connectivity,
processing capability, optical attributes and capabilities, and
manufacturability. The micro-wire structures of the present
invention are particularly useful in display devices or systems or
photovoltaic devices or systems. The integration of active
electronic devices, electrical conductors, and optical elements on
a single flexible substrate reduces the number of parts, for
example fewer electrical connectors are needed and permits fewer
manufacturing steps, thereby reducing costs.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The above and other features and advantages of the present
invention will become more apparent when taken in conjunction with
the following description and drawings wherein identical reference
numerals have been used to designate identical features that are
common to the figures, and wherein:
[0021] FIG. 1A is a cross section of an embodiment of the present
invention in a folded configuration;
[0022] FIG. 1B is a cross section of an embodiment of the present
invention corresponding to FIG. 1A in a flat, unfolded
configuration;
[0023] FIG. 1C is a plan view of an embodiment of the present
invention in a flat, unfolded configuration having a cross section
line corresponding to the embodiments of FIGS. 1A and 1B;
[0024] FIG. 2A is a cross section of an embodiment of the present
invention in a folded configuration;
[0025] FIG. 2B is a cross section of an embodiment of the present
invention corresponding to FIG. 2A in a flat, unfolded
configuration;
[0026] FIG. 3A is a cross section of an embodiment of the present
invention in a folded configuration;
[0027] FIG. 3B is a cross section of an embodiment of the present
invention corresponding to FIG. 3A in a flat, unfolded
configuration;
[0028] FIG. 4A is a cross section of an embodiment of the present
invention in a folded configuration;
[0029] FIG. 4B is a cross section of an embodiment of the present
invention corresponding to FIG. 4A in a flat, unfolded
configuration;
[0030] FIG. 5A is a cross section of an embodiment of the present
invention in a folded configuration;
[0031] FIG. 5B is a cross section of an embodiment of the present
invention corresponding to FIG. 5A in a flat, unfolded
configuration;
[0032] FIGS. 6-10 are partial cross sections of embodiments of the
present invention;
[0033] FIGS. 11-12 are flow diagrams illustrating various methods
of the present invention;
[0034] FIGS. 13-14 are schematics illustrating various methods of
the present invention; and
[0035] FIG. 15 is a flow diagram illustrating a method of the
present invention.
[0036] The Figures are not drawn to scale since the variation in
size of various elements in the Figures is too great to permit
depiction to scale.
DETAILED DESCRIPTION OF THE INVENTION
[0037] The present invention is directed toward a folded micro-wire
circuit structure that can incorporate aligned optical, conductive,
and processing elements. The present invention is usefully
constructed with a single substrate and methods of the present
invention can form electrical and optical structures in common
steps with common tools to reduce construction costs.
[0038] FIG. 1A illustrates a folded embodiment of the present
invention, FIG. 1B illustrates a flat, unfolded embodiment of the
present invention, and FIG. 1C is a plan view of a flat, unfolded
embodiment of the present invention. The cross sections of FIGS. 1A
and 1B are taken across cross section line A of FIG. 1C. Referring
to FIGS. 1A, 1B, and 1C, in an embodiment of the present invention,
a folded micro-wire substrate structure 5 includes a folded
flexible substrate 10 having a first side 12 and a second side 14
opposed to the first side 12 in a direction 40 perpendicular to the
first side 12. The flexible substrate 10 has a first portion 21, a
second portion 22 adjacent to the first portion 21, and a third
portion 23 adjacent to the second portion 22 so that the second
portion 22 is between the first portion 21 and the third portion 23
of the flexible substrate 10 in a substrate direction 42 of the
flexible substrate 10 when the flexible substrate 10 is in a flat,
unfolded configuration (FIG. 1B). The perpendicular direction 40 is
also perpendicular to the first, second, and third portions 21, 22,
23 in the flat, unfolded configuration (FIG. 1B).
[0039] In a folded configuration (FIG. 1A), the substrate direction
42 is along the surface of the flexible substrate 10. In the folded
configuration of FIG. 1A, the flexible substrate 10 has at least a
first fold 31 between the first and second portions 21, 22 so that
the first portion 21 is also adjacent to the second portion 22 in
the perpendicular direction 40. The flexible substrate 10 has at
least a second fold 32 between the second and third portions 22, 23
so that the second side 14 is also between the second and third
portions 22, 23 in the perpendicular direction 40. One or more
electrical conductors 50 are located in or on the flexible
substrate 10.
[0040] In various embodiments, the flexible substrate 10 is or
includes a polymer material or layers including polymers. The
electrical conductors 50 are metal, are formed from sintered or
agglomerated metal particles, are located on the surface of the
flexible substrate 10, or are located in micro-channels formed in
the surface of the flexible substrate 10 and extending into the
flexible substrate 10. Such materials are known in the art. In a
useful embodiment, the electrical conductors 50 are micro-wires and
the electrical conductors 50 are considered to be micro-wires and
are also referred to as micro-wire herein.
[0041] In the folded configuration of FIG. 1A, the first and second
folds 31, 32 fold the flexible substrate 10 into a stacked or
folded configuration. In the flat configuration of FIGS. 1B and 1C,
the first, second, and third portions 21, 22, 23 are located
substantially in a plane. In this configuration, the first fold 31
separates the first and second portions 21, 22 in a direction
parallel to the substrate direction 42 or along the flexible
substrate 10 and the second fold 32 separates the second and third
portions 22, 23 in a direction parallel to the substrate direction
42 or along the flexible substrate 10. In the flat configuration,
the first and second folds 31, 32 are not folded and are also
referred to herein as the first and second fold gaps 31, 32 since
they separate the different portions of the flexible substrate 10
substantially in a plane.
[0042] As used herein, portions are adjacent when two portions do
not have another portion between them. Two portions can be adjacent
in the substrate direction 42 or along the flexible substrate 10,
for example when the flexible substrate 10 is in a flat
configuration. Two portions can be adjacent in the perpendicular
direction 40 when there is no other portion between them when the
flexible substrate 10 is in the folded configuration. Thus, in FIG.
1A, the first portion 21 is adjacent to the second portion 22 and
the second portion 22 is adjacent to the third portion 23 in the
perpendicular direction 40. The first portion 21 is not adjacent to
the third portion 23 in the perpendicular direction 40 because the
second portion 22 is between the first and third portions 21, 23 in
the perpendicular direction 40. Similarly, in FIGS. 1B and 1C, the
first portion 21 is adjacent to the second portion 22 and the
second portion 22 is adjacent to the third portion 23 in the
substrate direction 42. The first portion 21 is not adjacent to the
third portion 23 in the substrate direction 42 because the second
portion 22 is between the first and third portions 21, 23 in the
substrate direction 42. In the folded configuration of FIG. 1A, the
first portion 21 is adjacent to the second portion 22 in both the
perpendicular direction 40 and along the surface or first side 12
of the flexible substrate 10. Similarly, the second portion 22 is
adjacent to the third portion 23 in both the perpendicular
direction 40 and along the surface or first side 12 of the flexible
substrate 10.
[0043] In a further embodiment of the present invention, the folded
micro-wire substrate structure 5 further includes at least one
electrical component 60 on or in the flexible substrate 10 in the
first, second, or third portion 21, 22, 23. In an embodiment, the
electrical component 60 is an active component, such as an organic
transistor or an inorganic transistor. The electrical component 60
can use the same substrate as the flexible substrate 10 or have a
substrate different from the flexible substrate 10, for example the
electrical component 60 is an integrated circuit having an
inflexible semiconductor substrate such as silicon completely
different from but affixed to the flexible substrate 10.
Alternatively, the electrical component 60 is an integrated circuit
formed directly on or in the flexible substrate 10.
[0044] In various embodiments, the electrical component 60 forms an
electrical circuit, is a part of an electrical circuit, or multiple
electrical components 60 are electrically connected with electrical
conductors 50 to form a circuit. In an arrangement, the electrical
components 60 are located on both the first and second portions 21,
22. The electrical components 60 can process information, receive
or transmit signals, or form a power circuit. In an embodiment, the
electrical components 60 are light-interactive electrical
components 62 that absorb light or other electro-magnetic radiation
to produce electrical power, such as current, for example in a
photo-voltaic system. Alternatively, the electrical components 60
are light-interactive electrical components 62 that emit light or
other electro-magnetic radiation in response to electrical power,
current, or voltage, for example in a display system. In a useful
arrangement, the light-interactive electrical components 62 are
located in the second portion 22 and the electrical components 60
are located in the first portion 21. The light-interactive
electrical components 62 in the second portion 22 are electrically
connected to the electrical components 60 in the first portion 21
with electrical conductors 50 that extend from the first portion
21, through the first fold 31, into the second portion 22. Thus, in
an embodiment, at least one electrical conductor 50 extends from
the first portion 21 to the second portion 22 and across the first
fold 31, at least one electrical conductor 50 extends from the
second portion 22 to the third portion 23 and across the second
fold 32, or at least one electrical conductor 50 extends from the
first portion 21 to the third portion 23 and across the first and
second folds 31, 32 (not shown).
[0045] In another embodiment of the folded micro-wire substrate
structure 5, the flexible substrate 10 is at least partially
transparent and further includes one or more optical elements 70 on
or in the flexible substrate 10 in the first, second, or third
portions 21, 22, 23. In various embodiments, the optical elements
70 serve to redirect light 44, for example with refraction or
reflection. In a useful embodiment, the optical elements 70 are
lenses, for example convex or concave lenses.
[0046] In a useful embodiment, the first and second folds 31, 32,
the optical elements 70, and the electrical components 60 or
light-interactive electrical components 62 are aligned on the
flexible substrate 10 so that at least one electrical component 60
or light-interactive electrical component 62 on or in the flexible
substrate 10 in the first, second, or third portions 21, 22, or 23
is located so that light 44 is directed through the optical
elements 70 to or from the electrical components 60 or
light-interactive electrical components 62. In a useful
arrangement, the electrical component 60 is located in the first
portion 21, the light-interactive electrical component 62 is
located in the second portion 22, and the optical element 70 is in
the third portion 23 and the light travels through the flexible
substrate 10. In various embodiments, the optical element 70 is
formed in the flexible substrate 10 or secured to the flexible
substrate 10, for example mechanically or with an adhesive. The
flexible substrate 10 is substantially transparent, for example
more than 50%, more than 70%, more than 80%, more than 90%, or more
than 95% transparent to visible light or other electro-magnetic
radiation.
[0047] In an alternative embodiment of the present invention, the
folded micro-wire substrate structure 5 includes the folded
flexible substrate 10 having the first side 12 and the second side
14 opposed to the first side 12 in the direction 40 perpendicular
to the first side 12. The flexible substrate 10 has the first
portion 21, the second portion 22 adjacent to the first portion 21,
and the third portion 23 adjacent to the second portion 22 so that
the second portion 22 is between the first and third portions 21,
23 of the flexible substrate 10 in the substrate direction 42 in a
flat configuration. The first portion 21 is separated from the
second portion 22 by the first fold gap 31 and the second portion
22 is separated from the third portion 23 by the second fold gap 32
along the flexible substrate 10. One or more electrical conductors
50 are located in or on the flexible substrate 10 and extend from
the first portion 21 into the second portion 22 across the first
fold gap 31. The third portion 23 includes at least one optical
element 70 on or in the flexible substrate 10. In a further
embodiment, the folded micro-wire substrate structure 5 includes
one or more electrical components 60 electrically connected to the
one or more electrical conductors 50 in the first or second
portions 21, 22.
[0048] Referring next to FIGS. 2A and 2B, in another embodiment of
the present invention, the folded micro-wire substrate structure 5
includes the flexible substrate 10 having the first side 12 and the
second side 14 opposed to the first side 12 in the direction 40
perpendicular to the first side 12. The flexible substrate 10 has
the first portion 21 and the second portion 22 adjacent to the
first portion 21 of the flexible substrate 10 in the substrate
direction 42 when the flexible substrate 10 is in a flat, unfolded
configuration (FIG. 2B). The flexible substrate 10 has at least the
first fold 31 between the first and second portions 21, 22 so that
the first portion 21 is aligned and adjacent with the second
portion 22 in the perpendicular direction 40 (FIG. 2A). One or more
electrical conductors 50 are located in or on the flexible
substrate 10. At least one electrical component 60 or
light-interactive electrical component 62 is located on or in the
flexible substrate 10 in the first portion 21. At least one optical
element 70 is located on or in the flexible substrate 10 in the
second portion 22 so that the optical element 70 directs light 44
to or from the electrical component 60 or the light-interactive
electrical component 62. In an embodiment an extended portion 26 of
the flexible substrate 10 adjacent to the first portion 21 extends
beyond the second portion 22 in the substrate direction 42 in the
folded configuration.
[0049] In a further embodiment, the folded micro-wire substrate
structure 5 includes the flexible substrate 10 having the first
side 12 and the second side 14 opposed to the first side 12 in the
direction 40 perpendicular to the first side 12. The flexible
substrate 10 has the first portion 21 and the second portion 22
adjacent to the first portion 21 of the flexible substrate 10. The
flexible substrate 10 has at least the first fold gap 31 between
the first and second portions 21 22. One or more electrical
conductors 50 is located in or on the flexible substrate 10 in the
first portion 21 and at least one optical element 70 is located on
or in the flexible substrate 10 in the second portion 22. In a
further embodiment, the folded micro-wire substrate structure 5
further includes at least one electrical component 60 or
light-interactive electrical component 62 on or in the flexible
substrate 10 in the first portion 21 electrically connected to one
or more of the electrical conductors 50.
[0050] In the embodiment of FIGS. 1A, 1B, and 1C and the embodiment
of FIGS. 2A and 2B, the electrical conductors 50, the
light-interactive electrical components 62, and the optical
elements 70 are all located on the first side 12 of the flexible
substrate 10. Referring next to FIGS. 3A and 3B, in another
embodiment of the present invention, the folded micro-wire
substrate structure 5 includes the flexible substrate 10 having the
first side 12 and the second side 14 opposed to the first side 12
in the direction 40 perpendicular to the first side 12. The
flexible substrate 10 has the first portion 21 and the second
portion 22 adjacent to the first portion 21 of the flexible
substrate 10 in the substrate direction 42 when the flexible
substrate 10 is in a flat, unfolded configuration (FIG. 3B). The
flexible substrate 10 has at least the first fold 31 between the
first and second portions 21, 22 so that the first portion 21 is
aligned and adjacent to the second portion 22 in the perpendicular
direction 40 (FIG. 3A). One or more electrical conductors 50 are
located in or on the flexible substrate 10. At least one electrical
component 60 or light-interactive electrical component 62 is
located on or in the flexible substrate 10 in the first portion 21.
At least one optical element 70 is located on or in the flexible
substrate 10 in the second portion 22 on a side of the flexible
substrate 10 opposite a side of the flexible substrate 10 than has
the electrical component 60 or light-interactive electrical
component 62 located thereon so that the optical element 70 directs
light 44 to or from the electrical component 60 or the
light-interactive electrical component 62. In an embodiment the
extended portion 26 of the flexible substrate 10 adjacent to the
first portion 21 extends beyond second portion 22 in the substrate
direction 42 in the folded configuration.
[0051] Turning next to FIGS. 4A and 4B, the folded micro-wire
substrate structure 5 includes the flexible substrate 10 having the
first side 12 and the second side 14 opposed to the first side 12
in the direction 40 perpendicular to the first side 12. The
flexible substrate 10 has the first portion 21 and the second
portion 22 adjacent to the first portion 21 of the flexible
substrate 10 in the substrate direction 42 when the flexible
substrate 10 is in a flat, unfolded configuration (FIG. 4B). The
flexible substrate 10 has at least the first fold 31 between the
first and second portions 21, 22 so that the first portion 21 is
aligned and adjacent to the second portion 22 in the perpendicular
direction 40 (FIG. 4A). The flexible substrate 10 further includes
a fourth portion 24 adjacent to the third portion 23 so that the
third portion 23 is between the second and fourth portions 22, 24
of the flexible substrate 10, both on the first side 12 along the
surface of the flexible substrate 10 in the substrate direction 42
and in the perpendicular direction 40. The flexible substrate 10
has a third fold 33 between the third and fourth portions 23, 24 so
that the fourth portion 24 is adjacent to the third portion 23 in
the perpendicular direction 40.
[0052] Similarly, referring to FIGS. 5A and 5B, the folded
micro-wire substrate structure 5 includes the flexible substrate 10
having the first side 12 and the second side 14 opposed to the
first side 12 in the direction 40 perpendicular to the first side
12. The flexible substrate 10 has the first portion 21 and the
second portion 22 adjacent to the first portion 21 of the flexible
substrate 10 in the substrate direction 42 when the flexible
substrate 10 is in a flat, unfolded configuration (FIG. 4B). The
flexible substrate 10 has at least the first fold 31 between the
first and second portions 21, 22 so that the first portion 21 is
aligned and adjacent to the second portion 22 in the perpendicular
direction 40 (FIG. 4A). The flexible substrate 10 includes the
fourth portion 24 adjacent to the third portion 23 so that the
third portion 23 is between the second and fourth portions 22, 24
of the flexible substrate 10, both on the first side 12 along the
surface of the flexible substrate 10 in the substrate direction 42
and in the perpendicular direction 40. The flexible substrate 10
has the third fold 33 between the third and fourth portions 23, 24
so that the fourth portion 24 is adjacent to the third portion 23
in the perpendicular direction 40. The flexible substrate 10
further includes a fifth portion 25 adjacent to the fourth portion
24 so that the fourth portion 24 is between the third and fifth
portions 23, 25 of the flexible substrate 10, both on the first
side 12 along the surface of the flexible substrate 10 in the
substrate direction 42 and in the perpendicular direction 40. The
flexible substrate 10 has a fourth fold 34 between the fourth and
fifth portions 24, 25 so that the fifth portion 25 is adjacent to
the fourth portion 24 in the perpendicular direction 40.
[0053] Referring next to FIGS. 6 and 7, the optical element 70 is a
first optical element 70 on or in the first side 12 and the
flexible substrate 10 further includes at least one second optical
element 72 on or in the second side 14. In one embodiment, as shown
in FIG. 6, the first and second optical elements 70, 72 have a
common optical axis 74. In another embodiment, as shown in FIG. 7,
the first and second optical elements 70, 72 do not have a common
optical axis 74. As noted with respect to FIG. 1A, the first and
second optical elements 70, 72 are effective to direct light to the
light-sensitive electrical components (not shown in FIGS. 6 and
7).
[0054] Referring next to FIGS. 8 and 9, in an embodiment of the
present invention, the folded micro-wire substrate structure 5
further includes an additional substrate 16 located between the
first and second portions 21, 22 or between the second and third
portions 22, 23 of the flexible substrate 10 in the perpendicular
direction 40. In one embodiment, the additional substrate 16 is
electrically insulating. In another embodiment, the additional
substrate 16 is transparent. Referring specifically to FIG. 9 in
yet another embodiment, the additional substrate 16 has one or more
optical elements 70 formed in or secured to the additional
substrate 16. The optical elements 70 are located on one side of
the additional substrate 16 or on both sides, as shown in FIG.
9.
[0055] In a further embodiment of the present invention illustrated
in FIG. 10, the folded micro-wire substrate structure 5 further
includes a protective layer 18 on the flexible substrate 10 so that
at least one electrical conductor 50 is between the protective
layer 18 and at least a portion of the flexible substrate 10. The
protective layer 18 can include a polymer or layers of polymers
and, in an embodiment is cured and includes, for example cross
linking materials. In a useful embodiment, the protective layer 18
is transparent.
[0056] The protective layer 18 can protect the flexible substrate
10, the electrical conductors 50, or the electrical components 60
from environmental damage. In an embodiment, the protective layer
18 relieves stress or strain on the electrical conductors 50 when
the flexible substrate 10 and portions of the electrical conductors
50, for example in the first or second folds 31 or 32 are in a
folded configuration. In an embodiment, the electrical conductors
50 have a thickness less than one half the thickness of the
flexible substrate 10. In another embodiment, the protective layer
18 has a thickness equal to, or greater than, the flexible
substrate (not shown).
[0057] As shown in FIGS. 2A, 2B, 3A, 3B, and 10, in an embodiment
the flexible substrate 10 further includes the extended portion 26
adjacent to the first portion 21 so that the first portion 21 is
located between the extended portion 26 and the second portion 22
in the substrate direction 42 and so that there is no portion of
the flexible substrate 10 adjacent to the extended portion 26 in
the perpendicular direction 40. The extended portion 26 is useful
for connecting an external device, such as an electronic controller
or other electrical component, to the electrical conductors 50, for
example with a wire 54 or ribbon cable including a plurality of
wires 54, each connected to a different electrical conductor 50.
The electrical conductor 50 can form a connection pad to which the
wire 54 is affixed. Wires 54, ribbon cables, and electronic
controllers are known in the art.
[0058] In a further embodiment of the present invention, as shown
in FIG. 10, the folded micro-wire substrate structure 5 further
includes an electrical connector 52 between an electrical conductor
50 or electrical component 60 in the first portion 21 and an
electrical conductor 50 or electrical component 60 in the second
portion 22 that does not extend across the first fold 31. Such an
electrical connector 52 can directly connect electrical conductors
50 or electrical components 60 from one portion of the flexible
substrate 10 to another portion and provide connectivity to the
electrical circuit formed by the electrical conductors 50 and
electrical components 60.
[0059] In yet another embodiment, at least a part of the first
portion 21 is in contact with at least a part of the second portion
22, or at least a part of the second portion 22 is in contact with
at least a part of the third portion 23. Contacting the portions
can aid in manufacturing alignment, forming electrical connections
between electrical conductors 50 in different portions, or in light
transmission. Such a contact can also seal the various components
to prevent exposure to the ambient environment. In an embodiment, a
patterned insulating adhesive or UV-curable layer is put between at
least part of the portions to assist in adhesion and contacting
only those desired parts of the portions. In one embodiment, the
additional substrate 16 (FIG. 8) is patterned so that at least some
parts of the first, second, or third portions 21, 22, 23 are in
contact.
[0060] The present invention provides a structure and method for
making a high-density electronic or optoelectronic circuit on a
single flexible substrate 10. The structure can form a
three-dimensional circuit and is useful for a variety of
applications, including photo-voltaic systems for generating
electrical power from electromagnetic energy (e.g. solar power) or
for light-emitting systems such as displays. Because the
high-density electronic or optoelectronic circuit is formed on a
single flexible substrate 10, manufacturing process costs are
reduced, parts count is reduced, and alignment simplified.
Moreover, in an embodiment the folded micro-wire substrate
structure 5 is manufactured in a flat configuration and then folded
when in operation. Furthermore, in an embodiment, the folded
micro-wire substrate structure 5 is unfolded into a flat
configuration after operation in a folded configuration. In other
useful processes, the micro-wire substrate structure is transported
in a flat configuration.
[0061] Referring to FIG. 11, a method of making the folded
micro-wire substrate structure 5 includes providing the flexible
substrate 10 having the first side 12 and the second side 14
opposed to the first side 12 in the direction 40 perpendicular to
the first side 12 in step 100. The flexible substrate 10 has the
first portion 21, the second portion 22 adjacent to the first
portion 21, and the third portion 23 adjacent to the second portion
22 so that the second portion 22 is located between the first and
third portions 21, 23 of the flexible substrate 10 in the substrate
direction 42.
[0062] In optional step 110, a surface (e.g. first side 12) of the
flexible substrate 10 is structured to form micro-channels and one
or more optical elements 70. In an embodiment, the formation of the
micro-channels and the optical elements 70 is done at least partly
in a single processing step with common materials. One or more
electrical conductors 50 are formed on or in the flexible substrate
10 in step 110, for example in the micro-channels or printed on the
first side 12. In optional step 120, the electrical components 60
are located on the flexible substrate 10 in electrical
communication with the electrical conductors 50. In another
optional step 130, the protective layer 18 is coated on the
flexible substrate 10. The protective layer 18 can cover the
electrical conductors 50 or the electrical components 60. An
external electrical connection, for example a ribbon cable
including wires 54 is electrically connected to one or more of the
electrical conductors 50 in step 140. In optional step 150, the
flexible substrate 10 is inspected for flaws. In various
embodiments, one or more inspection steps 150 are performed after
the various different steps of the method.
[0063] The flexible substrate 10 is folded in step 160 with the
first fold 31 between the first and second portions 21, 22 so that
the first portion 21 is located adjacent to the second portion 22
in the perpendicular direction 40 and with at least the second fold
32 between the second and third portions 22, 23 so that the second
side 14 is between the second portion 22 and the third portion 23
in the perpendicular direction 40. In step 170, the folded flexible
substrate 10 is secured to form the folded micro-wire substrate
structure 5. In one embodiment, when in a folded configuration the
different portions are secured to each other with adhesives. In
another embodiment, a mechanical structure is provided.
[0064] In another embodiment of the present invention, a method of
making the folded micro-wire substrate structure 5 includes
providing the flexible substrate 10 having the first side 12 and
the second side 14 opposed to the first side 12 in the direction 40
perpendicular to the first side 12 in step 100. The flexible
substrate 10 has the first portion 21, the second portion 22
adjacent to the first portion 21, and the third portion 23 adjacent
to the second portion 22 so that the second portion 22 is located
between the first and third portions 21, 23 of the flexible
substrate 10 in the substrate direction 42. The first portion 21 is
separated from the second portion 22 by the first fold gap 31 and
the second portion 22 is separated from the third portion 23 by the
second fold gap 32. One or more optical elements 70 are formed on
or in the flexible substrate 10 in the third portion 23 in step 110
or one or more electrical conductors 50 are formed in step 110 on
or in the flexible substrate 10 in the first or second portions 21,
22 extending from the first portion 21 into the second portion 22
across the first fold gap 31. In a further embodiment, a method of
the present invention further includes forming one or more
electrical components 60 on the flexible substrate 10 electrically
connected to the one or more electrical conductors 50 in the first
or second portions 21, 22 in step 120.
[0065] In yet another embodiment, a method of making the folded
micro-wire substrate structure 5 includes providing a transparent
flexible substrate 10 having the first side 12 and the second side
14 opposed to the first side 12 in the direction 40 perpendicular
to the first side 12 in step 100. The flexible substrate 10 has the
first portion 21 and the second portion 22 adjacent to the first
portion 21 of the flexible substrate 10. One or more optical
elements 70 are formed in step 110 on or in the flexible substrate
10 in the second portion 22, one or more electrical conductors 50
are formed in step 110 on or in the flexible substrate 10, and one
or more electrical components 60 are formed in step 120 on or in
the flexible substrate 10. The flexible substrate 10 is folded in
step 160 with the first fold 31 between the first and second
portions 21, 22 so that the first portion 21 is aligned with the
second portion 22 in the perpendicular direction 40 and the optical
element 70 directs light 44 to or from the electrical component
60.
[0066] In a further embodiment, a method of making the folded
micro-wire substrate structure 5 includes providing the transparent
flexible substrate 10 having the first side 12 and the second side
14 opposed to the first side 12 in the direction 40 perpendicular
to the first side 12 in step 100. The flexible substrate 10 has the
first portion 21 and the second portion 22 adjacent to the first
portion 21 of the flexible substrate 10 and is separated from the
first portion 21 by the first fold gap 31. One or more optical
elements 70 is formed on or in the flexible substrate 10 in the
second portion 22 and one or more electrical conductors 50 is
formed on or in the flexible substrate 10 in the first portion
21.
[0067] In embodiments, the flexible substrate 10 is any substrate
that is bent or folded at least once and that has a surface on
which the electrical conductors 50, electrical components 60, or
optical elements 70 are formed. In an embodiment, the flexible
substrate 10 is a plastic or polymer material, is transparent, and
has opposing substantially parallel and extensive surfaces (e.g.
first side 12 and second side 14), or additional layers. In various
embodiments, the flexible substrate 10 is transparent, for example
transmitting 50%, 80%, 90%, 95% or more of visible light. The
flexible substrates 10 can include a dielectric material and can
have a wide variety of thicknesses, for example 10 microns, 50
microns, 100 microns, 1 mm, or more.
[0068] In an embodiment, the electrical conductors 50 are
micro-wires in micro-channels in the flexible substrate 10 or the
electrical components 60 are printed on the flexible substrate 10,
for example by gravure printing, offset printing, flexographic
printing, or inkjet printing. In a useful method, a patterned stamp
or printing plate is provided and coated with a conductive ink, and
the conductive ink is printed on the first side 12, the second side
14, or both the first and second sides 12, 14 of the flexible
substrate 10. In another embodiment, the conductive ink is printed
with an inkjet printer. Alternatively, the electrical conductors 50
or electrical components 60 are affixed to the flexible substrate
10. For example, pick-and-place technologies for affixing
integrated circuits to a substrate are well known. In one
embodiment, the electrical components 60 are located on the
flexible substrate 10 or formed on the flexible substrate 10 after
the electrical conductors 50 are located on the flexible substrate
10 or formed on the flexible substrate 10. Alternatively, the
electrical components 60 are located on the flexible substrate 10
or formed on the flexible substrate 10 before the electrical
conductors 50 are located on the flexible substrate 10 or formed on
the flexible substrate 10. The electrical components 60 can include
pads or leads that are soldered or otherwise electrically connected
to the electrical conductors 50 using methods known in the art, for
example with anisotropic conductive films.
[0069] In various embodiments, the electrical components 60 are
integrated circuits using inorganic materials that are placed and
affixed to the flexible substrate 10. In other embodiments, the
electrical components 60 are formed on the flexible substrate 10,
for example using organic materials known in the art such as
pentacene or using inorganic materials. Methods including coating,
curing, and patterning materials are usable and known in the art,
for example using photolithographic techniques or atomic layer
deposition and selective area deposition methods.
[0070] Referring next to FIG. 12, in a useful embodiment, the
flexible substrate 10 includes a layer on a side of a support and a
method of the present invention further includes coating a curable
layer on the side of the support in step 111. The curable layer can
be a polymer or resin layer that includes cross linking elements
activated by heat or radiation to form a cured layer. The coated
curable layer is imprinted in step 112, for example with a stamp,
to form micro-channels for the electrical conductors 50 or to form
optical elements 70. The curable layer is cured in step 113 to form
a cured layer having the micro-channels or optical elements 70, for
example using heat or radiation. The cured layer forms the layer on
the side of the support and a surface of the cured layer is
opposite the support forming the first side 12. Steps 111 through
113 effectively structure the surface of the flexible substrate 10
in step 110.
[0071] Imprinted structures are also known to those skilled in the
art as embossed or impressed structures formed by locating in a
curable layer an imprinting, impressing, or embossing stamp having
protruding structural features, curing the layer, and then removing
the stamp to form micro-channels or optical elements 70
corresponding to the structural features.
[0072] In various embodiments, curable layers are deposited as a
single layer in a single step using coating methods known in the
art, e.g. curtain coating. In an alternative embodiment, curable
layers are deposited as multiple sub-layers using multi-level
deposition methods known in the art, e.g. multi-level slot coating,
repeated curtain coatings, or multi-level extrusion coating. In yet
another embodiment, curable layers include multiple sub-layers
formed in different, separate steps, for example with a multi-level
extrusion, curtain coating, or slot coating as is known in the
coating arts. Such coating methods are also applicable to forming
the protective layer 18.
[0073] Cured layers useful in the present invention can include a
cured polymer material with cross-linking agents that are sensitive
to heat or radiation, for example infra-red, visible light, or
ultra-violet radiation. The polymer material can be a curable
material applied in a liquid form that hardens when the
cross-linking agents are activated, for example with exposure to
radiation or heat. Micro-channels and optical elements 70 are
embossed and cured in curable layers in a single step using a
single stamp that includes structural elements for forming both
micro-channels and lens structures. When a molding device, such as
a stamp having an inverse micro-channel or optical element 70
structure is applied to liquid curable material in a curable layer
coated on the flexible substrate 10 and the cross-linking agents in
the curable material are activated, the liquid curable material in
the curable layer is hardened into a cured layer having
micro-channels or optical element 70 or both with the inverse
structure of the stamp. Thus, in an embodiment, a method of the
present invention includes imprinting one or more optical elements
70 in the curable layer in a common step with imprinting the
micro-channels. The liquid curable materials can include a
surfactant to assist in controlling coating. Materials, tools, and
methods are known for embossing coated liquid curable materials to
form cured layers having conventional single-layer
micro-channels.
[0074] Referring next to step 114 of FIG. 12, a method of the
present invention further includes coating the cured layer and
micro-channels with a conductive ink. Excess conductive ink is
removed from the surface of the cured layer in step 115 and the
conductive ink in the micro-channels is cured in step 116, for
example using heat, HCl vapor, or radiation, to form micro-wires in
the micro-channels that are the electrical conductors 50.
[0075] Curable inks useful in the present invention are known and
can include conductive inks having electrically conductive
nano-particles, such as silver nano-particles. The electrically
conductive nano-particles can be metallic or have an electrically
conductive shell. In various embodiments, the electrically
conductive nano-particles are silver, are a silver alloy, include
silver, are copper, are a copper alloy, or include copper. In other
embodiments, cured inks can include metal particles, for example
nano-particles. The metal particles can be sintered to form a
metallic electrical conductor. The metal nano-particles can be
silver or a silver alloy or other metals, such as tin, tantalum,
titanium, gold, copper, or aluminum, or alloys thereof. Cured inks
can include light-absorbing materials such as carbon black, a dye,
or a pigment.
[0076] Curable inks provided in a liquid form are deposited or
located in micro-channels and cured, for example by heating or
exposure to radiation such as infra-red, visible light, or
ultra-violet radiation. The curable ink hardens to form the cured
ink that makes up micro-wires useful as electrical conductors 50.
For example, a curable conductive ink with conductive
nano-particles is located within micro-channels and heated to
agglomerate or sinter the nano-particles, thereby forming an
electrically conductive micro-wire. Materials, tools, and methods
are known for coating liquid curable inks to form the micro-wires
in conventional single-layer micro-channels. The curable conductive
ink is not necessarily electrically conductive before it is
cured.
[0077] Electrically conductive micro-wires and methods of the
present invention are useful for making electrical conductors 50,
for example as used in electrodes and electrical buses. A variety
of micro-wire or micro-channel patterns can be used and the present
invention is not limited to any one pattern. The micro-wires can be
spaced apart, form separate electrical conductors 50, or intersect
to form a mesh electrical conductor on or in a layer.
Micro-channels can be identical or have different sizes, aspect
ratios, or shapes. Similarly, the micro-wires can be identical or
have different sizes, aspect ratios, or shapes. Micro-wires can be
straight or curved.
[0078] In some embodiments, a micro-channel is a groove, trench, or
channel formed in a cured layer and having a cross-sectional width
less than 20 microns, for example 10 microns, 5 microns, 4 microns,
3 microns, 2 microns, 1 micron, or 0.5 microns, or less. In an
embodiment, a micro-channel depth is comparable to a micro-channel
width. Micro-channels can have a rectangular cross section. Other
cross-sectional shapes, for example trapezoids, are known and are
included in the present invention. The width or depth of a layer is
measured in cross section.
[0079] In an embodiment, a curable ink can include conductive
nano-particles in a liquid carrier (for example an aqueous solution
including surfactants that reduce flocculation of metal particles,
humectants, thickeners, adhesives or other active chemicals). The
liquid carrier can be located in micro-channels and heated or dried
to remove liquid carrier or treated with hydrochloric acid, leaving
a porous assemblage of conductive particles that can be
agglomerated or sintered to form a porous electrical conductor in a
layer. Thus, in an embodiment, curable inks are processed to change
their material compositions, for example conductive particles in a
liquid carrier are not electrically conductive but after processing
form an assemblage that is electrically conductive.
[0080] Once deposited, the conductive inks are cured, for example
by heating. The curing process drives out the liquid carrier and
sinters the metal particles to form a metallic electrical
conductor. Conductive inks are known in the art and are
commercially available. In any of these cases, conductive inks or
other conducting materials are conductive after they are cured and
any needed processing completed. Deposited materials are not
necessarily electrically conductive before patterning or before
curing. As used herein, a conductive ink is a material that is
electrically conductive after any final processing is completed and
the conductive ink is not necessarily conductive at any other point
in the micro-wire formation process.
[0081] In an example and non-limiting embodiment of the present
invention, each micro-wire is from 10 to 15 microns wide, from 5 to
10 microns wide, from one micron to five microns wide or from
one/half micron to one micron wide. In some embodiments,
micro-wires can fill micro-channels; in other embodiments
micro-wires do not fill micro-channels. In an embodiment,
micro-wires are solid; in another embodiment micro-wires are
porous.
[0082] Micro-wires can include metal, for example silver, gold,
aluminum, nickel, tungsten, titanium, tin, or copper or various
metal alloys including, for example silver, gold, aluminum, nickel,
tungsten, titanium, tin, or copper. Micro-wires can include a thin
metal layer composed of highly conductive metals such as gold,
silver, copper, or aluminum. Other conductive metals or materials
can be used. Alternatively, micro-wires can include cured or
sintered metal particles such as nickel, tungsten, silver, gold,
titanium, or tin or alloys such as nickel, tungsten, silver, gold,
titanium, or tin. Conductive inks can be used to form micro-wires
with pattern-wise deposition or pattern-wise formation followed by
curing steps. Other materials or methods for forming micro-wires,
such as curable ink powders including metallic nano-particles, can
be employed and are included in the present invention.
[0083] Electrically conductive micro-wires of the present invention
can be operated by electrically connecting the micro-wires through
connection pads to electrical circuits that provide or receive
electrical current to or from the micro-wires and can control the
electrical behavior of the micro-wires. In operation, electrically
interconnected electrical conductors 50 and electrical components
60 of the present invention are electrically controlled by a
controller. Electrical signals are provided to or received from any
electrical components 60 to process information, control sensors,
respond to sensors, emit electromagnetic radiation, or respond to
electromagnetic radiation. Integrated circuits and electrical
circuits are generally well known in the computing arts and can
include circuits built on crystalline inorganic materials such as
silicon or using organic materials that are formed on or in or
affixed to the flexible substrate 10.
[0084] Methods and devices for forming and providing flexible
substrates 10 and coating flexible substrates 10 are known in the
photo-lithographic arts. Likewise, tools for laying out electrodes,
conductive traces, connectors, and electrical components are known
in the electronics industry as are methods for manufacturing such
electronic system elements. All of these tools and methods can be
usefully employed to design, implement, construct, and operate the
present invention.
[0085] The present invention contemplates integrating optical
elements 70 with electrical components 60 and electrical conductors
50. Hence, in an embodiment, a useful method of the present
invention includes locating an electrical component 60 on or in the
flexible substrate 10 in the first, second, or third portion 21,
22, 23 and folding the flexible substrate 10 so that the optical
element 70 directs light to or from the electrical components 60 or
the light-interactive electrical components 62.
[0086] In one embodiment of the present invention, the optical
elements 70, the electrical components 60, and the electrical
conductors 50 are all formed on a common side of the flexible
substrate 10, for example first side 12. As illustrated in FIGS.
3A, 3B, 6, and 7, one or more of the optical elements 70,
electrical components 60, and electrical conductors 50 are formed
on different sides, for example on first side 12 and second side
14. The imprinting method described above is applicable to such
arrangements. For example, the flexible substrate 10 can include a
support having opposing first and second support sides and a
curable layer coated on both the first and second support sides.
One or more micro-channels are formed in a curable layer on the
second support side and an electrical conductor formed in each
micro-channel. A surface of the layer on the first support side
forms the first side 12 and a surface of the layer on the second
support side forms the second side 14. Moreover, a useful method
can include forming one or more optical elements 70 in the layer on
the second support side in a common step with forming the
micro-channels on the second support side. The structures on the
first and second support sides are formed in different steps, or
alternatively the optical elements 70 and micro-channels in the
curable layer on each of the first and second support sides are
formed in a common step with common materials by imprinting the
curable layers on both of the first and second support sides at the
same time.
[0087] In further steps of the present invention, an additional
substrate 16 is located between the first and second portions 21,
22 in the perpendicular direction 40 or is located between the
second and third portions 22, 23 in the perpendicular direction 40.
The folding steps and location of the additional substrate 16 is
performed using mechanical methods known in the art for
manipulating substrates. The folding steps can include folding the
flexible substrate 10 so that the flexible substrate 10 includes
the extended portion 26 adjacent to the first portion 21 with the
first portion 21 located between the extended portion 26 and the
second portion 22 in the substrate direction 42. The folding steps
can also include folding the flexible substrate 10 so that the
first, second, and third portion 21, 22, 23 are aligned and the
optical elements 70 and electrical components 60 are aligned. A
wire 54 is electrically connected to one or more of the electrical
conductors using interconnection methods known in the art.
[0088] Referring to FIGS. 13, 14, and 15, and also to FIG. 1A, a
method of making a folded micro-wire substrate structure 5 includes
providing a flexible substrate 10 in a flexible substrate roll 80
configuration in step 101. The flexible substrate 10 has the first
side 12 and the second side 14 opposed to the first side 12 in the
direction 40 perpendicular to the first side 12, the flexible
substrate 10 has the first portion 21, the second portion 22
adjacent to the first portion 21, and the third portion 23 adjacent
to the second portion 22 so that the second portion 22 is located
between the first and third portions 21, 23 of the flexible
substrate 10 (FIG. 1A).
[0089] In step 102, the flexible substrate roll 80 is unrolled, and
in step 110 a plurality of electrical conductors 50 is formed on or
in the flexible substrate 10 for example using a material
deposition and processor 82 to form the structures described above
in the flexible substrate 10 in step 110. Optional steps 120, 130,
and 150 can also be performed. In one embodiment of the present
invention, the flexible substrate 10 is then rolled and transported
or stored (FIG. 13). In another embodiment, the flexible substrate
10 is not rolled. If the flexible substrate 10 is rolled, it is
then unrolled in repeated step 102. In either case, the first,
second, and third portions 21, 22, 23 are cut with a knife 84 from
the unrolled flexible substrate 10 to form a cut portion 28 of the
flexible substrate 10 in step 155. The cut portion 28 of the
flexible substrate 10 is folded in step 160 with the first fold 31
between the first and second portions 21, 22 so that the first
portion 21 is located adjacent to the second portion 22 in the
perpendicular direction 40 and with at least the second fold 32
between the second and third portions 22, 23 so that the second
side 14 is between the second portion 22 and the third portion 23
in the perpendicular direction 40 (FIG. 1A) in step 160 to form a
folded flexible substrate 86. The folded flexible substrate 86 is
secured in step 170 to form a secured folded micro-wire substrate
structure 88 forming the folded micro-wire substrate structure
5.
[0090] In another embodiment of the present invention, referring
again to FIGS. 13, 14, and 15, and also to FIG. 2A, a method of
making a folded micro-wire substrate structure 5 includes providing
in step 101 a flexible substrate 10 in a flexible substrate roll 80
configuration. The flexible substrate 10 has the first side 12 and
the second side 14 opposed to the first side 12 in the direction 40
perpendicular to the first side 12. The flexible substrate 10 has
the first portion 21 and the second portion 22 adjacent to the
first portion 21 of the flexible substrate 10 (FIG. 2A).
[0091] In step 102, the flexible substrate roll 80 is unrolled, and
in step 110 a plurality of electrical conductors 50 is formed on or
in the flexible substrate 10 for example using a material
deposition and processor 82 to form the structures described above
in the flexible substrate 10 in step 110. In one embodiment of the
present invention, the flexible substrate 10 is then rolled and
transported or stored (FIG. 13). In another embodiment, the
flexible substrate 10 is not rolled. If the flexible substrate 10
is rolled, it is then unrolled in repeated step 102. In either
case, the first and second portions 21, 22 are cut with the knife
84 from the unrolled flexible substrate 10 to form the cut portion
28 of the flexible substrate 10 in step 155. The cut portion 28 of
the flexible substrate 10 is then folded in step 160 with a first
fold 31 between the first and second portions 21, 22 so that the
first portion 21 is located adjacent to the second portion 22 in
the perpendicular direction 40 (FIG. 2A) in step 160 to form a
folded flexible substrate 86 (with two portions 21, 22 rather than
the three portions 21, 22, 23 depicted in FIG. 14). The folded
flexible substrate 86 is secured in step 170 to form the secured
folded micro-wire substrate structure 88 forming the folded
micro-wire substrate structure 5.
[0092] The invention has been described in detail with particular
reference to certain embodiments thereof, but it will be understood
that variations and modifications can be effected within the spirit
and scope of the invention.
PARTS LIST
[0093] A cross section line [0094] 5 folded micro-wire substrate
structure [0095] 10 flexible substrate [0096] 12 first side [0097]
14 second side [0098] 16 additional substrate [0099] 18 protective
layer [0100] 21 first portion [0101] 22 second portion [0102] 23
third portion [0103] 24 fourth portion [0104] 25 fifth portion
[0105] 26 extended portion [0106] 28 cut portion [0107] 31 first
fold/first fold gap [0108] 32 second fold/second fold gap [0109] 33
third fold [0110] 34 fourth fold [0111] 40 perpendicular direction
[0112] 42 substrate direction [0113] 44 light [0114] 50 electrical
conductor [0115] 52 electrical connector [0116] 54 wire [0117] 60
electrical component [0118] 52 light-interactive electrical
component [0119] 70 optical element/first optical element [0120] 72
second optical element [0121] 74 optical axis [0122] 80 flexible
substrate roll [0123] 82 material deposition and processor [0124]
84 knife [0125] 86 folded flexible substrate [0126] 88 secured
folded flexible substrate [0127] 100 provide flexible substrate
step [0128] 101 provide rolled flexible substrate step [0129] 102
unroll flexible substrate step [0130] 110 form electrical
conductors step [0131] 111 coat curable layer on flexible substrate
step [0132] 112 imprint curable layer step [0133] 113 cure curable
layer step [0134] 114 coat imprinted cured layer with conductive
ink step [0135] 115 remove excess conductive ink step [0136] 116
cure conductive ink in micro-channels step [0137] 120 locate
electrical components step [0138] 130 coat protective layer step
[0139] 140 affix connector step [0140] 150 inspect flexible
substrate step [0141] 155 cut flexible substrate step [0142] 160
fold flexible substrate step [0143] 170 secure folded substrate
step
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