U.S. patent application number 14/648229 was filed with the patent office on 2015-11-26 for high heat-dissipating high strength aluminum alloy.
This patent application is currently assigned to INHA-INDUSTRY PARTNERSHIP INSTITUTE. The applicant listed for this patent is INHA-INDUSTRY PARTNERSHIP INSTITUTE. Invention is credited to Mok Soon KIM.
Application Number | 20150337413 14/648229 |
Document ID | / |
Family ID | 50828041 |
Filed Date | 2015-11-26 |
United States Patent
Application |
20150337413 |
Kind Code |
A1 |
KIM; Mok Soon |
November 26, 2015 |
HIGH HEAT-DISSIPATING HIGH STRENGTH ALUMINUM ALLOY
Abstract
The present invention relates to a high heat-dissipating, high
strength aluminum alloy, more particularly to an aluminum alloy
containing, as essential components, manganese (Mn), silicon (Si)
and magnesium (Mg) at a predetermined content ratio and further
containing one or more metal selected from a group consisting of
copper (Cu), iron (Fe), zirconium (Zr), chromium (Cr) and titanium
(Ti) at a predetermined content ratio, with the remainder being
aluminum (Al) and inevitable impurities. The aluminum alloy
provided by the present invention has very superior
heat-dissipating property and strength and, therefore, can be used
as a heat-dissipating material and also as a material for
electric/electronic device packaging, a peripheral material for
power devices and a material for heat exchangers for use in various
applications including transportation such as electric vehicles,
hybrid vehicles, gasoline vehicles, etc., energy such as solar
generation, etc., home electric appliances, industrial equipment,
lighting, and so forth.
Inventors: |
KIM; Mok Soon; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INHA-INDUSTRY PARTNERSHIP INSTITUTE |
Nam-gu Incheon |
|
KR |
|
|
Assignee: |
INHA-INDUSTRY PARTNERSHIP
INSTITUTE
Incheon
KR
|
Family ID: |
50828041 |
Appl. No.: |
14/648229 |
Filed: |
November 30, 2012 |
PCT Filed: |
November 30, 2012 |
PCT NO: |
PCT/KR2012/010281 |
371 Date: |
July 28, 2015 |
Current U.S.
Class: |
420/544 ;
420/534; 420/535; 420/545; 420/546 |
Current CPC
Class: |
C22C 21/12 20130101;
C22C 21/00 20130101; C22C 21/08 20130101 |
International
Class: |
C22C 21/00 20060101
C22C021/00 |
Claims
1. (canceled)
2. (canceled)
3. An aluminum alloy comprising 0.8-2.2 wt % of manganese (Mn),
0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of magnesium (Mg) and
0.01-0.5 wt % of zirconium (Zr), with the remainder comprising
aluminum (Al) and inevitable impurities.
4. An aluminum alloy comprising comprising 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg) and 0.01-0.5 wt % of chromium (Cr), with the
remainder comprising aluminum (Al) and inevitable impurities.
5. An aluminum alloy comprising 0.8-2.2 wt % of manganese (Mn),
0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of magnesium (Mg) and
0.01-0.5 wt % of titanium (Ti), with the remainder comprising
aluminum (Al) and inevitable impurities.
6. (canceled)
7. (canceled)
8. (canceled)
9. (canceled)
10. (canceled)
11. An aluminum alloy comprising 0.8-2.2 wt % of manganese (Mn),
0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of magnesium (Mg),
0.01-0.5 wt % of chromium (Cr) and 0.01-0.5 wt % of titanium (Ti),
with the remainder comprising aluminum (Al) and inevitable
impurities.
12. An aluminum alloy comprising 0.8-2.2 wt % of manganese (Mn),
0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of magnesium (Mg),
0.01-0.5 wt % of zirconium (Zr) and 0.01-0.5 wt % of titanium (Ti),
with the remainder comprising aluminum (Al) and inevitable
impurities.
13. (canceled)
14. (canceled)
15. (canceled)
16. (canceled)
17. (canceled)
Description
TECHNICAL FIELD
[0001] The present invention relates to a high heat-dissipating,
high strength aluminum alloy.
BACKGROUND ART
[0002] Recently, the circuitry of electronic devices such as
televisions, radios, computers, medical devices, office machinery,
communications devices, etc. is becoming more and more complicated.
For example, these and other devices include integrated circuits
having hundreds of thousands of transistors. As such, device design
is becoming more and more complicated. Meanwhile, device size is
decreasing continuously as smaller-sized electronic components are
manufactured and the ability of assembling these components on a
smaller area is improving.
[0003] For this reason, a method for effectively dissipating the
heat generated from the electronic components to prevent failure or
malfunction is required.
[0004] In addition, demand on good heat dissipation, high strength
and lightweightness is increasing for vehicles, home electric
appliances and industrial heat exchangers.
[0005] Aluminum, widely known as a lightweight, high
heat-dissipating metal, has been widely used as a material for
substrates of integrated circuits, heat exchangers, etc. but is
limited in mechanical strength. Although several alloys have been
proposed to overcome this limitation, an alloy having greatly
improved heat-dissipating property and strength at the same time
has not been reported.
DISCLOSURE
Technical Problem
[0006] The present invention is directed to providing a high
heat-dissipating, high strength aluminum alloy.
Technical Solution
[0007] In an aspect, the present invention provides an aluminum
alloy containing:
[0008] 0.8-2.2 wt % of manganese (Mn); 0.1-0.9 wt % of silicon
(Si); and 0.6-1.5 wt % of magnesium (Mg), as essential components,
and further containing one or more metal selected from a group
consisting of 0.01-1.0 wt % of copper (Cu), 0.01-1.0 wt % of iron
(Fe), 0.01-0.5 wt % of zirconium (Zr), 0.01-0.5 wt % of chromium
(Cr) and 0.01-0.5 wt % of titanium (Ti), with the remainder being
aluminum (Al) and inevitable impurities.
[0009] In an exemplary embodiment, the present invention provides a
quaternary aluminum alloy containing 0.8-2.2 wt % of manganese
(Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of magnesium (Mg)
and 0.01-1.0 wt % of iron (Fe), with the remainder being aluminum
(Al) and inevitable impurities.
[0010] In another exemplary embodiment, the present invention
provides a quaternary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg) and 0.01-0.5 wt % of zirconium (Zr), with the
remainder being aluminum (Al) and inevitable impurities.
[0011] In another exemplary embodiment, the present invention
provides a quaternary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg) and 0.01-0.5 wt % of chromium (Cr), with the
remainder being aluminum (Al) and inevitable impurities.
[0012] In another exemplary embodiment, the present invention
provides a quaternary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg) and 0.01-0.5 wt % of titanium (Ti), with the
remainder being aluminum (Al) and inevitable impurities.
[0013] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy further containing 0.01-1.0 wt %
of copper (Cu), with the remainder being aluminum (Al) and
inevitable impurities.
[0014] In another exemplary embodiment, the present invention
provides a quaternary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg) and 0.01-1.0 wt % of copper (Cu), with the remainder
being aluminum (Al) and inevitable impurities.
[0015] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe) and 0.01-0.5 wt % of
zirconium (Zr), with the remainder being aluminum (Al) and
inevitable impurities.
[0016] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe) and 0.01-0.5 wt % of
chromium (Cr), with the remainder being aluminum (Al) and
inevitable impurities.
[0017] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-0.5 wt % of zirconium (Zr) and 0.01-0.5 wt %
of chromium (Cr), with the remainder being aluminum (Al) and
inevitable impurities.
[0018] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-0.5 wt % of chromium (Cr) and 0.01-0.5 wt % of
titanium (Ti), with the remainder being aluminum (Al) and
inevitable impurities.
[0019] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-0.5 wt % of zirconium (Zr) and 0.01-0.5 wt %
of titanium (Ti), with the remainder being aluminum (Al) and
inevitable impurities.
[0020] In another exemplary embodiment, the present invention
provides a senary aluminum alloy further containing 0.01-1.0 wt %
of copper (Cu), with the remainder being aluminum (Al) and
inevitable impurities.
[0021] In another exemplary embodiment, the present invention
provides a quinary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe) and 0.01-0.5 wt % of
titanium (Ti), with the remainder being aluminum (Al) and
inevitable impurities.
[0022] In another exemplary embodiment, the present invention
provides a senary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe), 0.01-0.5 wt % of
zirconium (Zr) and 0.01-0.5 wt % of chromium (Cr), with the
remainder being aluminum (Al) and inevitable impurities.
[0023] In another exemplary embodiment, the present invention
provides a septenary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe), 0.01-0.5 wt % of
zirconium (Zr), 0.01-0.5 wt % of chromium (Cr) and 0.01-1.0 wt % of
copper (Cu), with the remainder being aluminum (Al) and inevitable
impurities.
[0024] In another exemplary embodiment, the present invention
provides a septenary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe), 0.01-0.5 wt % of
zirconium (Zr), 0.01-0.5 wt % of chromium (Cr) and 0.01-0.5 wt % of
titanium (Ti), with the remainder being aluminum (Al) and
inevitable impurities.
[0025] In another exemplary embodiment, the present invention
provides an octonary aluminum alloy containing 0.8-2.2 wt % of
manganese (Mn), 0.1-0.9 wt % of silicon (Si), 0.6-1.5 wt % of
magnesium (Mg), 0.01-1.0 wt % of iron (Fe), 0.01-0.5 wt % of
zirconium (Zr), 0.01-0.5 wt % of chromium (Cr), 0.01-1.0 wt % of
copper (Cu) and 0.01-0.5 wt % of titanium (Ti), with the remainder
being aluminum (Al) and inevitable impurities.
Advantageous Effects
[0026] An aluminum alloy provided by the present invention has very
superior heat-dissipating property and strength and, therefore, can
be used as a heat-dissipating material and also as a material for
electric/electronic device packaging, a peripheral material for
power devices and a material for heat exchangers for use in various
applications including transportation such as electric vehicles,
hybrid vehicles, gasoline vehicles, etc., energy such as solar
generation, etc., home electric appliances, industrial equipment,
lighting, and so forth.
BEST MODE FOR CARRYING OUT INVENTION
[0027] The present invention relates to an aluminum alloy
containing manganese (Mn), silicon (Si) and magnesium (Mg) as
essential components and further containing one or more metal
selected from group consisting of copper (Cu), iron (Fe), zirconium
(Zr), chromium (Cr) and titanium (Ti), with the remainder being
aluminum (Al) and inevitable impurities.
[0028] Manganese (Mn), silicon (Si) and magnesium (Mg) can provide
the effect of enhancing both heat-dissipating property and strength
when they exist together in aluminum. If the content of manganese
is less than 0.8 wt %, the effect of enhancing both
heat-dissipating property and strength may be insufficient. And, if
it exceeds 2.2 wt %, processability may be unsatisfactory because a
coarse dispersoid is produced. Accordingly, the manganese content
may be 0.8-2.2 wt %, specifically 1.0-1.7 wt %. If the content of
silicon is less than 0.1 wt %, the effect of enhancing both
heat-dissipating property and strength may be insufficient. And, if
it exceeds 0.9 wt %, processability may be unsatisfactory because a
coarse dispersoid is produced. Accordingly, the silicon content may
be 0.1-0.9 wt %, specifically 0.2-0.9 wt %. If the content of
magnesium is less than 0.6 wt %, the effect of enhancing strength
may be insufficient. And, if it exceeds 1.5 wt %, heat-dissipating
property may be unsatisfactory. The magnesium may be 0.6-1.5 wt %,
specifically 0.6-1.2 wt %.
[0029] The aluminum alloy may further contain one or more metal
selected from group consisting of copper (Cu), iron (Fe), zirconium
(Zr), chromium (Cr) and titanium (Ti).
[0030] The content of the one or more metal selected from copper
and iron may be 0.01-1.0 wt %, respectively. If the content of
copper exceeds 1.0 wt %, heat-dissipating property may be
unsatisfactory. Accordingly, the copper content may be 0.01-1.0 wt
%, specifically 0.05-0.8 wt %. If the content of iron exceeds 1.0
wt %, processability may be unsatisfactory because a coarse
dispersoid is produced. Accordingly, the iron content may be
0.01-1.0 wt %, specifically 0.05-0.8 wt %.
[0031] The content of the one or more metal selected from
zirconium, chromium and titanium may be 0.01-0.5 wt %,
respectively. If the content of each of zirconium, chromium and
titanium exceeds 0.5 wt %, processability may be unsatisfactory
because a coarse dispersoid is produced. Accordingly, the content
of each of zirconium, chromium and titanium may be 0.1-0.5 wt
%.
[0032] In order to further enhance the properties such as strength,
heat-dissipating property, etc. of the aluminum alloy provided by
the present invention, a plastic working such as rolling,
extrusion, forging, etc., a combined processing of plastic working
and heat treatment (e.g., H12, H24, H34, etc.), an aging treatment
(e.g., T4, T6, T651, etc.), or the like may be employed.
[0033] The present invention will be described in more detail
through examples. The following examples are for illustrative
purposes only and it will be apparent to those skilled in the art
that the scope of this invention is not limited by the
examples.
Examples 1-17
[0034] Aluminum alloy ingots with compositions as described in
Table 1 were homogenized, rolled and then annealed to manufacture
1.5 mm-thick plates. Samples for tensile testing were obtained from
the plates and a tensile test was conducted at room
temperature.
[0035] From stress-strain curves obtained from the tensile test,
the stress at a plastic strain of 0.2% was taken as the yield
strength.
[0036] It is known that heat dissipation ability can be determined
by thermal conductivity and, for metals, the thermal conductivity
is proportional to electrical conductivity. It is also known that
the electrical conductivity can be calculated from the reciprocal
of electrical resistivity. Accordingly, in order to evaluate the
heat dissipation ability, electrical resistivity was measured at
room temperature and the electrical conductivity was calculated
from the reciprocal of the electrical resistivity.
[0037] As seen from Table 1, the aluminum alloys of the present
invention of Examples 1-17 showed superior strength and electrical
conductivity, with yield strengths of 100 MPa or higher and
electrical conductivities of 23 MS/m or higher.
TABLE-US-00001 TABLE 1 Yield Electrical Alloy composition (wt %)
strength conductivity Mn Si Mg Cu Fe Zr Cr Ti Al (MPa) (MS/m)
Example 1 1.2 0.3 0.6 -- -- 0.02 -- -- remainder.sup.a) 101 26.2
Example 2 1.5 0.4 0.8 0.6 -- -- -- -- remainder 196 25.7 Example 3
1.1 0.8 1.0 -- 0.2 -- -- -- remainder 130 29.0 Example 4 1.2 0.5
0.9 -- -- 0.3 -- -- remainder 190 26.0 Example 5 1.3 0.7 1.0 -- --
-- 0.4 -- remainder 148 24.7 Example 6 1.6 0.9 0.7 -- -- -- -- 0.4
remainder 178 27.8 Example 7 2.2 0.8 0.9 -- -- 0.1 0.1 -- remainder
185 27.1 Example 8 0.8 0.6 0.7 -- -- 0.1 -- 0.2 remainder 107 30.2
Example 9 0.8 0.7 0.8 -- -- 0.1 0.5 0.1 remainder 128 28.2 Example
10 0.9 0.4 0.7 0.02 -- 0.2 0.02 0.5 remainder 155 26.4 Example 11
1.2 0.8 1.5 -- 0.5 0.2 -- -- remainder 173 26.9 Example 12 1.2 0.8
0.8 -- 0.3 -- 0.3 -- remainder 145 27.6 Example 13 1.1 0.7 0.7 --
1.0 -- -- 0.02 remainder 175 26.3 Example 14 1.2 0.6 0.7 -- 0.03
0.5 0.2 -- remainder 182 26.5 Example 15 1.2 0.6 1.0 -- 0.2 -- 0.1
0.1 remainder 154 29.7 Example 16 1.4 0.5 1.2 -- 0.1 0.2 0.1 0.2
remainder 198 25.4 Example 17 1.2 0.1 0.8 0.9 0.2 0.2 0.1 0.1
remainder 205 23.2 .sup.a)Balance to make the total content of the
alloy composition 100 wt %.
Comparative Examples 1-11
[0038] Aluminum alloy ingots with compositions as described in
Table 2 were homogenized, rolled and then annealed to manufacture
1.5 mm-thick plates in the same manner as in Examples 1-17. Samples
for tensile testing were obtained from the plates and a tensile
test was conducted at room temperature. Then, yield strength and
electrical conductivity were measured in the same manner as in
Examples 1-17.
[0039] As seen from Table 2, the aluminum alloys outside the scope
of the present invention do not exhibit the performance of high
heat-dissipating, high strength aluminum alloys. Comparative
Example 1 with a small manganese content, Comparative Example 2
with a small silicon content and Comparative Example 3 with a small
magnesium content showed poor yield strengths of lower than 70 MPa.
For Comparative Example 4 with a large manganese content and
Comparative Example 5 with a large silicon content, sampling was
difficult because sound plates could not be obtained. Comparative
Example 6 with a large magnesium content and Comparative Example 7
with a large copper content exhibited poor electrical
conductivities of lower than 20 MS/m. For Comparative Example 8
with a large iron content, Comparative Example 9 with a large
zirconium content, Comparative Example 10 with a large chromium
content and Comparative Example 11 with a large titanium content,
sampling was difficult because sound plates could not be
obtained.
TABLE-US-00002 TABLE 2 Yield Electrical Alloy composition (wt %)
strength conductivity Mn Si Mg Cu Fe Zr Cr Ti Al (MPa) (MS/m)
Comparative 0.7 0.2 0.7 -- 0.1 -- -- -- remainder.sup.a) 55 25.1
Example 1 Comparative 1.1 0.07 0.8 -- 0.1 -- -- -- remainder 68
23.3 Example 2 Comparative 1.1 0.7 0.4 -- 0.1 -- -- -- remainder 62
26.7 Example 3 Comparative 2.4 0.6 1.1 -- 0.1 -- -- -- remainder X*
X Example 4 Comparative 1.9 1.1 1.2 -- 0.1 -- -- -- remainder X X
Example 5 Comparative 1.2 0.2 1.8 -- -- -- 0.2 -- remainder 125
18.7 Example 6 Comparative 1.2 0.2 1.1 1.2 -- -- -- -- remainder
138 17.1 Example 7 Comparative 1.2 0.7 1.1 -- 1.3 -- -- --
remainder X X Example 8 Comparative 1.7 0.5 0.8 -- -- 0.7 -- --
remainder X X Example 9 Comparative 1.7 0.8 0.9 -- -- -- 0.6 --
remainder X X Example 10 Comparative 1.5 0.6 1.2 -- -- -- -- 0.6
remainder X X Example 11 .sup.a)Balance to make the total content
of the alloy composition 100 wt %. *X means that sampling was
impossible.
* * * * *