U.S. patent application number 14/709651 was filed with the patent office on 2015-11-19 for heat conversion device.
This patent application is currently assigned to LG INNOTEK CO., LTD.. The applicant listed for this patent is LG INNOTEK CO., LTD.. Invention is credited to Yong Sang CHO, Jong Bae SHIN.
Application Number | 20150330677 14/709651 |
Document ID | / |
Family ID | 53188879 |
Filed Date | 2015-11-19 |
United States Patent
Application |
20150330677 |
Kind Code |
A1 |
SHIN; Jong Bae ; et
al. |
November 19, 2015 |
HEAT CONVERSION DEVICE
Abstract
Provided is a heat conversion device including a thermoelectric
element. In the structure of a heat exchanger to which the
thermoelectric module is applied, a pair of heat absorbing modules
and a heat emitting module are disposed in a horizontal direction
so that a desired air volume and wind speed can be maintained
without resistance to an air flow path, a heat conversion effect
for air can be implemented, a drying and dehumidifying effect can
be implemented, and a heat conversion function having high
efficiency can be implemented even under low power consumption.
Inventors: |
SHIN; Jong Bae; (Seoul,
KR) ; CHO; Yong Sang; (Seoul, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LG INNOTEK CO., LTD. |
Seoul |
|
KR |
|
|
Assignee: |
LG INNOTEK CO., LTD.
|
Family ID: |
53188879 |
Appl. No.: |
14/709651 |
Filed: |
May 12, 2015 |
Current U.S.
Class: |
62/3.3 |
Current CPC
Class: |
H01L 35/30 20130101;
F25B 21/02 20130101 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 13, 2014 |
KR |
10-2014-0057407 |
Claims
1. A heat conversion device, comprising: a thermoelectric module
including a thermoelectric semiconductor between substrates facing
each other; a first module converting a temperature of inflowing
air using a heat conversion function of the thermoelectric module;
a second module reconverting the temperature of the air passing
through the first module; and a third module controlling the
temperature of the air passing through the second module.
2. The heat conversion device of claim 1, wherein the first module
and the third module comes into contact with a first heat
conversion part of the thermoelectric module.
3. The heat conversion device of claim 2, wherein the first heat
conversion part comprises a first substrate of the thermoelectric
module.
4. The heat conversion device of claim 3, wherein the first
substrate is a heat absorbing substrate.
5. The heat conversion device of claim 2, wherein the second module
comes into contact with a second heat conversion part of the
thermoelectric module.
6. The heat conversion device of claim 5, wherein the second heat
conversion part comprises a second substrate of the thermoelectric
module.
7. The heat conversion device of claim 6, wherein the second
substrate is a heat emitting substrate.
8. The heat conversion device of claim 1, wherein the first module,
the second module, and the third module are disposed in one side
direction based on the thermoelectric module, the one side
direction being defined as any one direction of an upwards
direction and a downwards direction of the thermoelectric
module.
9. The heat conversion device of claim 5, wherein the second module
is disposed at a lower portion of the second substrate of the
thermoelectric module, and the first module and the second module
are disposed at both sides of the thermoelectric module.
10. The heat conversion device of claim 8, wherein the first
module, the second module, and the third module are spaced apart
from one another.
11. The heat conversion device of claim 10, wherein a ratio of a
plane area (d1*e1) of the first module to a plane area (d2*e2) of
the second module ranges from 1:1 to 10.
12. The heat conversion device of claim 10, wherein a spaced
distance between the first module and the second module ranges from
0.01 to 50.0 mm.
13. The heat conversion device of claim 8, wherein at least one of
the first module, the second module, and the third module further
comprises: a heat transmission substrate in contact with the first
substrate or the second substrate of the thermoelectric module; and
a heat transmission member in contact with inflowing air.
14. The heat conversion device of claim 13, wherein the heat
transmission member comprises: a radiating substrate having a first
plane in surface contact with air, and a second plane opposite to
the first plane; and at least one flow path pattern forming an air
flow path in the radiating substrate in an air flowing
direction.
15. The heat conversion device of claim 14, wherein the flow path
pattern has a structure in which a curvature pattern having a fixed
pitch is implemented in a lengthwise direction of the radiating
substrate.
16. The heat conversion device of claim 14, further comprising a
resistance pattern formed on a surface of the flow path pattern and
protruding from a surface of the radiating substrate.
17. The heat conversion device of claim 16, wherein the resistance
pattern is a protruding structure in which a horizontal extension
line of a surface of the resistance pattern and an extension line
of a surface of the radiating substrate are inclined to make an
inclination angle (.theta.).
18. The heat conversion device of claim 17, wherein the inclination
angle (.theta.) is an acute angle.
19. The heat conversion device of claim 16, further comprising a
plurality of fluid flowing grooves passing through the surface of
the radiating substrate.
20. The heat conversion device of claim 19, wherein the fluid
flowing grooves are formed in a connection portion between an end
of the resistance pattern and the radiating substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority under 35 U.S.C. .sctn.119
to Korean Application No. 10-2004-0057407 filed on May 13, 2014, in
the Korean Intellectual Property Office, whose entire disclosure is
hereby incorporated by reference.
BACKGROUND
[0002] 1. Field
[0003] Embodiments of the present disclosure relate to a heat
conversion device including a thermoelectric element.
[0004] 2. Background
[0005] In general, a thermoelectric element including a
thermoelectric conversion element is configured such that a P-type
thermoelectric material and an N-type thermoelectric material are
bonded between metal electrodes to form a PN bonding pair. When a
temperature difference is applied to the PN bonding pair, electric
power is produced by a Seebeck effect so that the thermoelectric
element can serve as a power generation device. Furthermore, the
thermoelectric element may be used as a temperature control device
by a Peltier effect that one of the PN boding pair is cooled and
another one thereof is heated.
[0006] In such a case, as a radiating member is formed on a heat
emitting part and a heat absorbing part, the thermoelectric element
may be applied as a device that can dehumidify and dry inflowing
air. However, even though the air flowing into the heat absorbing
part from a thermoelectric module is primarily dehumidified, and
thereafter, the air is introduced to the heat emitting part
disposed at an upper portion of the thermoelectric element and is
dried, it is problematic in that dehumidifying efficiency is
reduced because flow of the air is increased, and thus a resistance
to the flow is generated. Even though there is a way intended for
solving this problem by increasing the intensity of the inflowing
air and entirely making the flow of air strong, since this way
results in an increase in power consumption and an increase in
noise, it is problematic in that performance of the thermoelectric
element as a dehumidifier is reduced.
[0007] Also, when the thermoelectric element is applied as a device
capable of dehumidifying and drying inflowing air by forming a
radiating member on a heat emitting part and a heat absorbing part,
humid air is entered, and thus when the air passes through a heat
sink, the air has low humidity and temperature. Accordingly, when
the device is used in a closed space, since a temperature is
increased, the device has a limit in using it.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The embodiments will be described in detail with reference
to the following drawings in which like reference numerals refer to
like elements wherein:
[0009] FIG. 1 illustrates a perspective conceptual view of a heat
conversion device according to an embodiment of the present
disclosure;
[0010] FIG. 2 illustrates a cross-sectional view of the heat
conversion device taken along line W-W' of FIG. 1;
[0011] FIG. 3 illustrates one example of the structure of a heat
conversion member included in a heat conversion module according to
an embodiment of the present disclosure;
[0012] FIG. 4 is an enlarged conceptual view showing a structure
formed by one flow path pattern in the heat conversion member;
[0013] FIG. 5 is a partially enlarged view of the flow path pattern
of FIG. 4;
[0014] FIG. 6 is a conceptual view variously illustrating an
implementation example of the flow path pattern of the heat
transmission member;
[0015] FIG. 7 is a conceptual view showing a flat arrangement of a
thermoelectric module;
[0016] FIG. 8 a structure of a unit cell of the thermoelectric
module including a thermoelectric element in contact with a first
module and a second module in the embodiment of the present
disclosure; and
[0017] FIG. 9 illustrates the thermoelectric module in which the
structure of FIG. 8 is disposed in plural number.
DETAILED DESCRIPTION
[0018] Hereinafter, the configurations and operations according to
embodiments of the present disclosure will be described in detail
with reference to the accompanying drawings. The present disclosure
may, however, be embodied in different forms and should not be
construed as limited to the embodiments set forth herein. In the
explanation with reference to the accompanying drawings, regardless
of reference numerals of the drawings, like numbers refer to like
elements through the specification, and repeated explanation
thereon is omitted. Terms such as a first term and a second term
may be used for explaining various constitutive elements, but the
constitutive elements should not be limited to these terms. These
terms are only used for the purpose for distinguishing a
constitutive element from other constitutive element. As used
herein, the singular forms "a," "an" and "the" are intended to
include the plural forms as well, unless the context clearly
indicates otherwise.
[0019] FIG. 1 illustrates a perspective conceptual view of a heat
conversion device according to an embodiment of the present
disclosure, and FIG. 2 illustrates a cross-sectional view of the
heat conversion device taken along line W-W' of FIG. 1.
[0020] Referring to FIGS. 1 and 2, a heat conversion device
according to an embodiment of the present disclosure may include: a
thermoelectric module 100 including a thermoelectric semiconductor
between substrates facing each other; a first module 200 converting
a temperature of inflowing air using a heat conversion function of
the thermoelectric module 100; a second module 300 reconverting the
temperature of the air passing through the first module; and a
third module 400 controlling the temperature of the air passing
through the second module. Thanks to this configuration, when the
first module and the third module are implemented as cooling
modules, and the second module is implemented as a drying module,
the heat conversion device according to the embodiment of the
present disclosure primarily performs cooling and condensing with
regard to first inflowing air, and thereafter, secondarily dries
the air by drying and heating, and tertiarily cools the air having
a high temperature so that the air can be controlled and discharged
at a desired temperature. Of course, such an arrangement of the
thermoelectric module may be changed and executed to cause
drying-cooling-drying in addition to cooling-drying-cooling.
However, in the present embodiment, the functions of the heat
conversion device of the present disclosure will be described based
on an example of the thermoelectric module in which the drying
module is disposed in a central portion and the cooling modules are
disposed at both sides.
[0021] The thermoelectric module 100 is configured such that
thermoelectric semiconductor elements 120 electrically connected to
each other are disposed between a pair of substrates 140, 150. The
thermoelectric semiconductor elements are configured such that a
P-type semiconductor and an N-type semiconductor are disposed to
make a pair, and a heat absorbing part and a heat emitting part are
implemented on the pair of substrates by the Peltier effect when an
electric current is applied. The present embodiment of the
disclosure shows an example in which, in the structure of FIGS. 1
and 2, a heat absorbing region is formed on a side of the first
substrate 140, and a heat emitting region is formed on a side of
the second substrate 150.
[0022] Moreover, the first module 200, the second module 300, and
the third module 400, which perform a heat converting function with
respect to air, may be disposed to be adjacent to any one of the
first substrate 140 and the second substrate 150 of the
thermoelectric module.
[0023] Also, in the illustrated structure in which a heat emitting
effect and a heat absorbing effect of the thermoelectric module be
received, the first module 200, the second module 300, and the
third module 400 may be configured such that separate heat
conversion members 220, 320, 420 are received inside separate
receiving members, and the surface of the first substrate 140 or
the second substrate 150 of the thermoelectric module 100 comes
into contact with a surface of each receiving member. However, this
is only an example. In addition to the structure in which the first
module 200 and the third module 400 come into contact with each
other by extending an intermediate member 100A in contact with the
first substrate 120, a structure in which the first module 200 and
the third module 400 come into contact with each other by extending
the first substrate 120 itself may be also implemented. As such,
the structure in which the first module and the second module come
into direct contact with a surface of the first substrate 140 and a
surface of the second substrate 150 enables direct transmission of
a heat emitting operation and a heat absorbing operation of the
thermoelectric module. Thus, it is advantageous in that heat
transmission efficiency is increased, and stability of the device
itself is increased with regard to the structure in which the
intermediate member is interposed.
[0024] Also, the heat conversion device according to the present
embodiment of the disclosure may include the heat conversion
members 220, 320, 420 received in the first module, the second
module and the third module, respectively and intended for
performing heat conversion by coming into contact with the first
substrate 140 and the second substrate 150, and various radiating
members or structures such as a heat absorbing member and the like
may be applied as the heat conversion members. In particular, in
the present embodiment of the disclosure, the heat conversion
members may be implemented to have contact surfaces with air, a
liquid, and the like and to have flow path grooves capable of
maximizing contact areas.
[0025] Like the structure illustrated in FIGS. 1 and 2, the
thermoelectric module 100 is provided with the structure in which
the first substrate 140 and the second substrate are included. In
particular, a region in which the first substrate 140 is disposed
is defined as a first heat conversion part as a region performing a
heat absorbing function, and a region in which the second substrate
150 is disposed is defined as a second heat conversion part as a
region performing a heat emitting function. The first and second
heat conversion parts may enable the heat absorbing function and
the heat emitting function to be implemented by the function of the
thermoelectric element 120 and may further include an electrode, a
dielectric, and the like, as well as the first substrate and the
second substrate. The description thereof will be performed
later.
[0026] The first module 200 and the third module 400 according to
the present embodiment of the disclosure may be implemented to come
in contact with the first heat conversion part of the
thermoelectric module 100. In particular, such a contact may be
implemented by disposing the intermediate member 100A so that the
heat absorbing function of the first substrate 140 of the first
heat conversion part can be transmitted.
[0027] Also, the second module 300 may be disposed to come into
contact with the second heat conversion part. In particular, the
second module may be implemented to come into contact with the
second substrate 150 of the thermoelectric module 100 so that the
heat emitting function can be transmitted.
[0028] In particular, in the embodiment of the present disclosure,
it is more preferable to dispose the first module, the second
module, and the third module in one side direction based on the
thermoelectric module 100. In this case, as shown in FIGS. 1 and 2,
like the structure in which the thermoelectric module 100, the
first module 200, the second module 300, and the third module 400
are disposed in a horizontal direction, the arrangement in one side
direction means any one direction of an upwards direction and a
downwards direction based on the thermoelectric module. For
example, one example of the present disclosure, the second module
300 may be disposed at a lower portion of the thermoelectric module
100, and the first module 200 and the third module 400 may be
disposed so that an air flow path can be formed in a direction
horizontal to the second module. It is advantageous in that such a
structure can minimized resistance to the flow path and can
increase thermoelectric efficiency by allowing the air flow path in
the same space to pass through the module sequentially performing a
heat absorbing function and a heat emitting function.
[0029] The heat transmission members 220, 320, 420 for implementing
heat conversion by receiving a heat emitting function and the heat
absorbing function may be further included in the first module 200,
the second module 300, and the third module, respectively, so that
the air can be dried and cooled.
[0030] The first module 200, the second module 300, and the third
module 400 may further include the heat transmission members 220,
320, 420 performing heat conversion by receiving the heat emitting
and absorbing functions, respectively so that air can be dried and
cooled. The heat transmission members 220, 320, 420 have separates
heat transmission member receiving units 210, 310, 410,
respectively, so that one or more heat transmission members can be
laminated in each heat transmission member receiving unit, and may
be implemented such that the remaining portions except for the air
flow path are sealed. In the embodiment of FIGS. 1 and 2, when the
plurality of heat transmission members is laminated, separate
intermediate members 211, 311, 312, 411, 412 may be disposed
between the respective heat transmission members. Moreover, even
though it has not been described, when an upper portion of the
first module 200 comes into contact with the intermediate member
100A, the intermediate member 100A comes into direct contact with
the uppermost heat transmission member without being limited
thereto. As described above, the heat transmission members may be
received in the separate heat transmission receiving members.
[0031] In the structure illustrated in FIG. 1, the intermediate
member 100A of the first module 200 comes into contact with the
first substrate 140 from which a heat absorbing reaction is
generated so that the first module 200 can perform a heat absorbing
function, namely, a function of reducing a temperature.
Accordingly, when external air entered from an external fan flows
in the first module 200, the inflowing air comes into the first
module 200 and the first heat conversion member 220 in the first
module via the first substrate 140 of the thermoelectric module
100, and as a result, a temperature of the air is reduced so that
moisture of the humid air can be condensed.
[0032] To do so, the first module 200 may maintain a low
temperature in such a manner that a low temperature is induced to
the first substrate due to a heat absorbing reaction, and the low
temperature of the first substrate is transmitted to the first heat
conversion member 220 of the first module 200 and the first heat
conversion member receiving unit via the intermediate member 100A.
In particular, in the embodiment of the present disclosure, the
first heat transmission member 220 may be implemented in a
structure in which characteristic flow path patterns are formed, so
that a contact area with air can be maximized (see FIG. 4).
Moreover, in the structure illustrated in FIG. 1, it is illustrated
that the intermediate member 100A and the first substrate 140 are
formed as separate structures. However, in order to further
simplify the structure and enable efficient heat transmission, the
first substrate 140 and the intermediate member 100A may be also
implemented in an integral structure.
[0033] After moisture included in cooled air passing through an
inner portion of the first module has been condensed and
discharged, the second module 300 may introduce air and may include
the second heat transmission member receiving unit 310 in contact
with the second substrate forming a heat emitting region (the
second heat conversion part) of the thermoelectric module 100. The
second module may function to transmit the heat resulting from a
heat emitting reaction of the second module due to surface contact
with the second substrate into the second heat transmission member
and the second heat transmission member receiving unit 310, and to
enable air passing through the first module to be converted into
dried air with the heat. Moreover, in such a case, a separate
intermediate member may be further included between the second heat
transmission member 320 and the second substrate 150. Of course, in
this case, even though the intermediate member and the second
substrate 150 may be formed as separate structures, in order to
further simplify the structure and to enable efficient heat
transmission, the intermediate member and the second substrate may
be also implemented in an integral structure.
[0034] The third module 400 has the same structure as that of the
first module 200 and comes into contact with the intermediate
member 100A, thereby functioning to cool air again dried and heated
by passing through the second module 300. Accordingly, the air
passing through the third module may be finally converted into air
having low humidity and low temperature and may be discharged. The
configuration of the third module 400 may be formed to be identical
to that of the first module 200. Of course, by changing the
configuration of the heat transmission member, the heat conversion
module having a structure presented in FIG. 7 may be disposed.
[0035] FIG. 3 is a conceptual view illustrated for explaining an
example of an arrangement structure of the first module 200, the
second module 300, and the third module 400 according to the
embodiment of the present disclosure described in the sections
regarding FIGS. 1 and 2.
[0036] As previously described, the first module 200, the second
module 300, and the third module 400 according to the embodiment of
the present disclosure may be disposed in `one side direction`
based on the thermoelectric module 100. In this case, the `one side
direction` means any one direction of an upwards direction Y1 and a
downwards direction Y2 based on the thermoelectric module 100. That
is, in consideration of an extension line X1 on an upper plane and
an extension line X2 on a lower plane of the first substrate 140 of
the thermoelectric module 100, any one of the first module, the
second module, and the third module is disposed in a direction at
which such a module comes into direct contact with the
thermoelectric module, and another module is disposed in a
direction horizontal to the direction. For example, as described in
the sections regarding FIGS. 1 and 2, the second module 300 may be
disposed at a lower part of the thermoelectric module 100, and the
first module 200 and the third module 400 may be disposed so that
an air flow path can be formed in a direction horizontal to the
second module.
[0037] However, the arrangement structure of the first module, the
second module, and the third module is not limited to the
arrangement structure in the horizontal direction. As illustrated
in (b) of FIG. 3, based on the first substrate of the
thermoelectric module 100, any one of the first module 200 and the
third module 400 may be disposed to be regularly inclined. If an
arrangement structure enables the air to flow from the first module
to the second module and from the second module to the third module
without causing resistance to an air flow path according to a
bending state of the air flow path through which the air passing
through the first module and the second module travels, all
arrangement structures in the form of such an arrangement structure
may be included in the arrangement structure of the present
disclosure in one side direction.
[0038] That is, `the arrangement in the horizontal direction` in
the form of `the arrangement structure in the one side direction`
defined in the embodiment of the present disclosure may cover all
arrangement structures that enable external air primarily passing
through the first module, namely, any or all of the air discharged
by passing through the first module, to flow into the second
module, and enable the air passing through the second module to
flow into the third module. Accordingly, within the scope of the
arrangement structures, the arrangement of the first module, the
second module, and the third module may be modified in any form,
and the modified arrangement structures may be also included in the
gist of the present disclosure.
[0039] That is, except for a bidirectional arrangement structure in
which the modules are disposed to be in close contact with an upper
portion and a lower portion based on the thermoelectric module as
shown in (a) of FIG. 3, namely, the arrangement structure of the
first module 200 arranged at an upper part of the thermoelectric
module 100 and the second module 300 arranged at a lower part of
the thermoelectric module 100, all arrangement structures in which,
as shown in (b) and (c) of FIG. 3, the first module 200 and the
third module except for the second module 300 in contact with the
thermoelectric module come into contact with the first substrate
140 and extend in an external side direction rather than a upwards
direction to be disposed in a direction at which the second module
300 is disposed may be included in the embodiment of the present
disclosure.
[0040] In the structure of (a) of FIG. 3, the inflowing air A is
cooled while passing through the first module 200, moisture in the
air is condensed. After the air has passed through the first
module, the air travels to an air flow path bent in a "U"-like
shape and flows into the second module 300 disposed in the
downwards direction of the thermoelectric module so as to be dried
by the heat emitting function. At this time, since serious
resistance to the flow path is generated from the bent region, a
dehumidification effect is reduced. Accordingly, in preferred
embodiments of the present disclosure, the air flow path bent in
the "U"-like shape is not formed, and the first module, the second
module, and the third module are disposed in a direction horizontal
to the air flow path so that resistance to the air flow path can be
minimized.
[0041] FIGS. 4 to 6 are conceptual views illustrated for explaining
a structure of the first heat transmission member 220, the second
heat transmission member 320, and the third heat transmission
member 420 received in the first module, the second module, and the
third module, respectively, (wherein the structure will be
described based on the first heat transmission member 220).
[0042] Referring to FIGS. 1, 4, and 5, the first heat transmission
member 220 according to the embodiment of the present disclosure
may be formed in a structure in which at least one flow path
pattern 220A forming an air flow path C1 corresponding a fixed
movement path of air is formed on a substrate having a flat
plate-like shape and including a first plane 221, and a second
plane 222 opposite to the first plane 221 so that a surface contact
with the air can be performed.
[0043] As illustrated in FIGS. 4 and 6, the flow path pattern 220A
may be implemented such that a substrate is formed in a folding
structure so that curvature patterns having a constant pitch P1, P2
and height T1 can be formed. The flow path pattern may be formed in
variously modified shapes as illustrated in FIG. 6, as well as the
structure illustrated in FIG. 4. That is, the first heat
transmission member 220 or the second heat transmission member 320
according to the embodiment of the present may have two planes in a
surface contact with air and may be implemented in a structure in
which the flow path pattern is formed for maximizing a surface area
in contact with the air. In the structure illustrated in FIG. 4,
when the air is entered from a flow path direction C1 of an
inflowing part into which the air flows, the air uniformly comes
into contact with the first plane 221 and the second plane 222
opposite to the first plane so as to travel in an end direction of
the flow path C2. Thus, such a structure may ensure a larger
contact area with the air in the same space than a contact area
generated from a simple flat plate-like shape so that the heat
absorbing effect or the heat emitting effect can be improved.
[0044] In particular, in order to increase a contact area with the
air, as illustrated in FIGS. 4 and 5, the first heat transmission
member 220 according to the embodiment of the present disclosure
may include a protruding resistance pattern 223 on a surface of the
substrate. In consideration of unit flow path patterns, the
resistant pattern 223 may be formed on a first curved surface B1
and a second curved surface B2.
[0045] Furthermore, as shown in the partially enlarged view of FIG.
5, the resistance pattern 223 is formed as a protruding structure
inclined to have a fixed inclination angle so that friction with
the air can be maximized, thereby increasing a contact area or
contact efficiency. Also, a groove 224 (hereinafter referred to as
`the flow path groove 224") is formed on the surface of the
substrate at the front of the resistance pattern 223 so that part
of the air in contact with the resistance pattern 223 can pass
through a front surface and a rear surface of the substrate via the
groove, thereby enabling an increase in a contact frequency or
area. Also, in the example illustrated in FIG. 5, the resistance
patterns are disposed so that resistance can be maximized at a
flowing direction of the air, but are not limited thereto. The
protruding direction of the resistance patterns may be designed in
reverse so that a resistance level can be adjusted according to a
resistance design. In FIG. 5, even though the resistance patterns
223 are formed on the external surface of the heat transmission
member, in reverse, the resistance patterns may be formed on an
internal surface of the heat transmission member.
[0046] FIG. 6 is a conceptual view variously illustrating an
implementation example of the respective flow path patterns of the
first heat transmission member, the second heat transmission
member, and the third heat transmission member.
[0047] As illustrated in FIG. 6, (A) the pattern having a curvature
with a fixed pitch P1 may be repeatedly formed, (B) unit patterns
of the flow path pattern may be implemented in a repeated pattern
structure having a triangular form, or as illustrated in (C) and
(D), the unit patterns may be variously changed so as to have each
cross section having a polygonal structure. Of course, the flow
path pattern may be configured such that the resistance patterns
described in the sections of FIG. 5 are provided on surfaces B1, B2
of the flow path pattern.
[0048] The flow path pattern illustrated in FIG. 6 is formed to
have a fixed pitch and cycle. However, unlike this, the pitches of
the unit patterns may not be uniform, and the cycles of the
patterns may be modified to be non-uniform. Furthermore, the height
T1 of each unit pattern may be also modified to be non-uniform.
[0049] Also, with regard to each structure of the first heat
transmission member, the second heat transmission member, and the
third heat transmission member, the respective pitches of the flow
path patterns of the first heat transmission member, the second
heat transmission member, and the third heat transmission member
included in the first module 200, the second module 300, and the
third module 400, respectively, may be adjusted to be different
from each other, or the pitches of the flow path patterns of the
first and third heat transmission member, and the pitch of the flow
path pattern of the second transmission member may be adjusted to
be different from each other in consideration of the heat
conversion device according to the embodiment of the present
disclosure illustrated in FIGS. 1 and 2.
[0050] In particular, the pitch of the flow path pattern of the
first heat conversion member may be formed larger than the pitch of
the flow path pattern of the second heat conversion member.
[0051] Specifically, a ratio (P1:P2) of the pitch P1 of the first
heat transmission member 220 of the first module 200 to the pitch
P2 of the second heat transmission member 320 of the second module
300 may range from 1.about.1.4:1. Also, the pitch of the third heat
transmission member 420 may be formed to be identical to that of
the first heat transmission member.
[0052] Each structure of the heat transmission members according to
the embodiment of the present disclosure, which form the flow
patterns in FIGS. 4 and 5, may implement a larger contact area in
the same volume than that generated from the heat transmission
member having a flat plate-like structure or the existing radiating
pin-like structure. This structure may result in an increase of the
contact area with air up to 50% or more compared to the heat
transmission member having the flat plate-like structure.
Accordingly, a size of the module can be also largely reduced. In
consideration of the condensing efficiency of initially inflowing
humid air the drying efficiency of air using radiating after
removal of moisture, a ratio of the pitch of the first heat
transmission member 220 of the first module 200 to the pitch P2 of
the second heat transmission member 320 of the second module 300
may range from 1.about.1.4:1.
[0053] Also, a volume of the first module 200 may be formed less
than a volume of the second module 300. In particular, in this
case, a plane area occupied by the heat absorbing module
corresponding to the first module may be formed in the range of 5
to 50% with respect to a total plane area formed by the first
module and the second module. When the area of the heat absorbing
module is less than 5%, a condensing process of the air is properly
generated, so condensing efficiency is reduced. When the area of
the heat absorbing module is more than 50%, part of the condensed
air may not be discharged due to the delay in condensation.
[0054] More preferably, a ratio of the plane area (d1*e1) of the
first module illustrated in FIG. 2 to the plane area (d2*e2) of the
second module may range from 1:1 to 10. Also, the first module 200
and the second module 300 may be spaced apart from each other to
have a maximum spaced distance d2. In order to ensure efficient
transmission of the condensed air and to increase the drying
efficiency using radiating by preventing re-condensation of the
air, the maximum spaced distance d2 may range from 0.01 to 50.0 mm.
When the maximum spaced distance d2 is less than 0.01 mm, since the
heat absorbing parts and the heat emitting parts of the first
module and the second module are formed to be adjacent to each
other, temperature offsetting is generated from each adjacent
portion, and thus cooling efficiency is reduced. When the maximum
spaced distance d2 is more than 50.0 mm, most of the condensed air
is dispersed so that transmission of the air to the second module
is not efficiently performed. Also, in this case, an area ratio and
a spaced distance d5 between the third module 400 and the second
module 300 may be also formed to be identical to the ratio between
the first module and the second module.
[0055] FIG. 7 illustrates the structure of a heat conversion device
according to another embodiment of the present disclosure.
[0056] As described above, in the embodiment of the present
disclosure, the structure having the folding structure (i.e., the
structure in which the flow path pattern is formed) performing
surface contact with air is applied as the heat transmission
member. In this case, the first module (heat absorbing module) 200,
the second module (heat emitting module) 300, and the third module
(heat absorbing module) 400 are disposed so that air can be
transmitted to a direction horizontal to air flow, and as a result,
resistance to the flow path can be minimized, and the processes of
cooling, drying, and condensing can be sequentially
implemented.
[0057] In the embodiment of FIG. 7, a plurality of structures
having a pin form rather than the heat transmission member having
the structure as shown in FIG. 4 is applied as a heat absorbing
member 230, and a heat emitting member 330. In such a case, the
first module (heat absorbing module), the second module (heat
emitting module), and the third module (heat absorbing module) are
also disposed so that air can be transmitted to a direction
horizontal to air flow. Thus, the heat conversion device capable of
minimizing the resistance to the flow path is illustrated.
[0058] Of course, in the embodiment of this case, each volume of
the heat absorbing members 230, 430, and the heat emitting member
330, which can be installed in the same area, is reduced compared
to that of the heat transmission member of FIG. 4, and each size of
the heat absorbing members 230, 430, and the heat emitting member
330 has a limit in disposing them in a fixed space. Due to this,
even though heat conversion efficiency is slightly reduced, as
described above, since the first module (heat absorbing module),
the second module (heat emitting module), and the third module
(heat absorbing module) are also disposed so that air can be
transmitted to the direction horizontal to air flow, it is
advantageous in that the resistance to the flow path can be
minimized.
[0059] Also, even though it is not illustrated in FIG. 7, the heat
conversion device may be implemented by combining any one structure
of the first module, the second module and the third module with a
structure to which the radiating pin structure described in the
section regarding FIG. 7 is applied.
[0060] FIG. 8 illustrates a structure of the unit cell of the
thermoelectric module including the thermoelectric element in
contact with the first module and the second module, and FIG. 9
exemplarily illustrates the thermoelectric module in which the
structure of FIG. 8 is disposed in plural number.
[0061] As illustrated in FIGS. 8 and 9, the thermoelectric module
including the thermoelectric element according to the embodiment of
the present disclosure may be configured to include at least one
unit cell including the first substrate 140 and the second
substrate 150 facing each other, the first semiconductor element
120 and the second semiconductor element 130 electrically connected
to each other and disposed between the first substrate 140 and the
second substrate 150. An insulating substrate, for example, an
alumina substrate, may be used as the first substrate 140 and the
second substrate 150. Also, according to the other embodiments, a
metal substrate may be used so that heat absorbing and heat
emitting efficiency and a slimming structure can be implemented. Of
course, when the first substrate 140 and the second substrate are
formed with the metal substrate, as illustrated in FIG. 8,
dielectric layers 170a, 170b may be further formed between the
first and second substrates and the electrode layers 160a, 160b
formed at the first substrate 140 and the second substrate 150. In
the structure described in the sections regarding FIG. 1, when a
third substrate 210A and a fourth substrate 310B of the first
module 200 and the second module 300 are integrally implemented
with the first substrate and the second substrate, a material such
as alumina, Cu, a Cu alloy, and the like may be applied to the
substrates.
[0062] In the case of a metal substrate, Cu or a Cu alloy may be
applied as the material of the substrate. A thickness of the
substrate may be range from 0.1 to 0.5 mm so that a slimming
structure can be realized. When the thickness of the metal
substrate is less than 0.1 mm or more than 0.5 mm, since a
radiating property is excessively increased, or heat conductivity
becomes very high, reliability of the thermoelectric module is
largely reduced. Also, in the case of the dielectric layers 170a,
170b, a material having a heat conductivity of 5 to 10 W/K may be
used in consideration of the heat conductivity of the cooling
thermoelectric module, and a thickness of the dielectric layer may
range from 0.01 to 0.15 mm. In this case, when the thickness is
less than 0.01 mm, insulating efficiency (or a withstanding voltage
property) is largely reduced, and when the thickness is more than
0.15 mm, heat conductivity is reduced, and thus radiating
efficiency is reduced. The electrode layers 160a, 160b electrically
connect the first semiconductor element and the second
semiconductor element using an electrode material such as Cu, Ag,
Ni, and the like. When the illustrated unit cells are connected, as
illustrated in FIG. 9, the electrode layers result in an electrical
connection with the adjacent unit cell. A thickness of the
electrode pattern may range from 0.01 to 0.3 mm. When the thickness
of the electrode pattern is less than 0.01 mm, a function of the
electrode pattern as an electrode is reduced, thereby causing a
reduction of electric conductivity. Also, when the thickness of the
electrode pattern is more than 0.3 mm, electric conductivity is
also reduced due to an increase of resistance.
[0063] In particular, with regard to the thermoelectric elements
forming unit cells, thermoelectric elements including unit elements
having a laminated structure according to the one embodiment of the
present disclosure may be applied. In this case, one surface of the
thermoelectric element may be composed of a P-type semiconductor as
the first semiconductor element 120 and an N-type semiconductor as
the second semiconductor element 130. The first semiconductor and
the second semiconductor are connected to the metal electrodes
160a, 160b. Such a structure is formed in plural number, and the
Peltier effect is implemented by circuit lines 181, 182 for
supplying electric current to the semiconductor element by means of
the electrodes.
[0064] Moreover, in FIGS. 8 and 9, a P-type semiconductor or N-type
semiconductor material may be applied to the semiconductor elements
in the thermoelectric module in FIGS. 8 and 9. With regard to the
P-type semiconductor or the N-type semiconductor material, the
N-type semiconductor element may be formed using a mixture in which
a main raw material based on BiTe containing Se, Ni, Al, Cu, Ag,
Pb, B, Ga, Te, Bi, and In is mixed with 0.001 to 1.0 wt % of Bi or
Te based on a total weight of the main raw material. For example,
when the main raw material is a Bi--Se--Te based material, Bi or Te
may be added in an amount of 0.001 to 1.0 wt % based on the total
weight of the Bi--Se--Te material. That is, when the Bi--Se--Te
based material is added in an amount of 100 g, the amount of Bi or
Te additionally mixed therewith may range from 0.001 to 1.0 g. As
described above, when the amount of the material added to the main
raw material ranges from 0.001 to 0.1 wt %, heat conductivity is
not reduced, and electric conductivity is reduced. Thus, the
numerical range has a meaning in that the increase of a ZT value
cannot be expected.
[0065] The P-type semiconductor element may be formed using a
mixture in which a main raw material based on BiTe containing Sb,
Ni, Al, Cu, Ag, Pb, B, Ga, Te, Bi, and In is mixed with 0.001 to
1.0 wt % of Bi or Te based on a total weight of the main raw
material. For example, when the main raw material is a Bi--Se--Te
based material, Bi or Te may be added in an amount of 0.001 to 1.0
wt % based on the total weight of the Bi--Se--Te material. That is,
when the Bi--Se--Te based material is added in an amount of 100 g,
the amount of Bi or Te additionally mixed therewith may range from
0.001 to 1.0 g. As described above, when the amount of the material
added to the main raw material ranges from 0.001 to 0.1 wt %, heat
conductivity is not reduced, and electric conductivity is reduced.
Thus, the numerical range has a meaning in that the increase of a
ZT value cannot be expected.
[0066] The first semiconductor element and the second semiconductor
element facing each other while forming unit cells may have the
same shape and size. However, in this case, since electric
conductivity of the P-type semiconductor element is different from
that of the n-type semiconductor element, cooling efficiency is
reduced. In consideration of this fact, any one of them may be
formed to have a volume different from that of the other
semiconductor element so that a cooling ability can be
improved.
[0067] That is, the volumes of the semiconductor elements of the
unit cells disposed to face each other may be formed different from
each other in such a manner that the semiconductor elements are
entirely formed to have different shapes, a cross section of any
one of the semiconductor elements having the same height is formed
to have a diameter wider than that of a cross section of another
one, or the semiconductor elements having the same shape are formed
to have different heights and different diameters of each cross
section. In particular, a diameter of the N-type semiconductor
element is formed larger than that of the P-type semiconductor
element in order to cause the increase of a volume, so that
thermoelectric efficiency can be improved.
[0068] The heat conversion device according to the embodiment of
the present disclosure may create air, which can be adjusted to a
low temperature, while finally minimizing moisture by applying the
heat emitting and absorbing effects realized by the thermoelectric
module to the arrangement structure of the first module, the second
module, and the third module, and by performing condensing, drying
and re-condensing processes. Accordingly, when the heat conversion
device is applied to a head lamp for a vehicle, the problem of a
reduction in efficiency of an LED generated due to an increase in a
temperature in a closed space can be solved.
[0069] Furthermore, when the heat conversion device according to
the embodiment of the present disclosure is used in a dehumidifier,
a temperature increase in indoor air in summer is prevented so that
a dehumidifying effect and a cooling effect can be implemented.
[0070] As such, the heat conversion device according to the
embodiment of the present disclosure may be very widely and
commonly applied to various kinds of industrial equipment and
various household electric appliances including a washing machine,
a dehumidifier, a refrigerator, and the like.
[0071] As set forth above, according to some embodiments of the
present disclosure, in the structure of a heat exchanger to which
the thermoelectric module is applied, the heat conversion device
capable of performing the condensing, drying and re-condensing
processes of inflowing air is provided so that a temperature of the
dried air can be controlled, and the air can be discharged in a
state of being maintained at a desired temperature.
[0072] In particular, according to some embodiments of the present
disclosure, the heat absorbing effect and the heat emitting effect
can be implemented by the first module, the second module and the
third module via the thermoelectric module. The pair of the cooling
modules and one drying module are disposed in a horizontal
direction so that a desired air volume and wind speed can be
maintained without resistance to an air flow path, and a heat
conversion effect for air can be implemented, and a heat conversion
function having high efficiency can be implemented even under low
power consumption.
[0073] Also, the absorbing modules and the heat emitting module are
disposed in the heat conversion member coming into surface contact
with air and having a folding structure while forming a plurality
of flow paths so that a contact area with the air can be maximized
and heat conversion efficiency can be largely improved.
[0074] Furthermore, friction with the air at a curvature surface of
the unit heat conversion part of the heat conversion member can be
increased, and heat conversion efficiency can be further increased
by forming the patterns having the structure in which the
resistance patterns for enabling an increase of air circulation and
the flow path grooves are combined.
[0075] Also, thanks to the heat conversion member having the
folding structure, the heat conversion device having high
efficiency can be formed regardless of a limited area of a heat
exchanger, and a widely used design arrangement can be implemented
by forming the product to be small in volume.
[0076] As previously described, in the detailed description of the
disclosure, having described the detailed exemplary embodiments of
the disclosure, it should be apparent that modifications and
variations can be made by persons skilled without deviating from
the spirit or scope of the disclosure. Therefore, it is to be
understood that the foregoing is illustrative of the present
disclosure and is not to be construed as limited to the specific
embodiments disclosed, and that modifications to the disclosed
embodiments, as well as other embodiments, are intended to be
included within the scope of the appended claims and their
equivalents.
[0077] The present disclosure has been made keeping in mind the
above problems, and an aspect of embodiments of the present
disclosure provides a heat conversion device capable of performing
the processes for condensing, drying, and re-condensing inflowing
air with regard to a structure of a heat exchanger to which a
thermoelectric module is applied, so that a temperature of the
dried air can be controlled again, and the air can be discharged in
a state of being maintained at a desired temperature.
[0078] According to an aspect of the embodiments of the present
disclosure, a heat conversion device may include: a thermoelectric
module including a thermoelectric semiconductor between substrates
facing each other; a first module converting a temperature of
inflowing air using a heat conversion function of the
thermoelectric module; a second module reconverting the temperature
of the air passing through the first module ; and a third module
controlling the temperature of the air passing through the second
module.
[0079] Any reference in this specification to "one embodiment," "an
embodiment," "example embodiment," etc., means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
disclosure. The appearances of such phrases in various places in
the specification are not necessarily all referring to the same
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with any embodiment, it
is submitted that it is within the purview of one skilled in the
art to effect such feature, structure, or characteristic in
connection with other ones of the embodiments.
[0080] Although embodiments have been described with reference to a
number of illustrative embodiments thereof, it should be understood
that numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, various
variations and modifications are possible in the component parts
and/or arrangements of the subject combination arrangement within
the scope of the disclosure, the drawings and the appended claims.
In addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
* * * * *