U.S. patent application number 14/651771 was filed with the patent office on 2015-11-05 for resin composition, and printed circuit board using same.
The applicant listed for this patent is LG INNOTEK CO., LTD.. Invention is credited to Sanga JU, Myeong Jeong KIM, Yeo Eun YOON, Sungjin YUN.
Application Number | 20150319855 14/651771 |
Document ID | / |
Family ID | 50934625 |
Filed Date | 2015-11-05 |
United States Patent
Application |
20150319855 |
Kind Code |
A1 |
YOON; Yeo Eun ; et
al. |
November 5, 2015 |
RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
Abstract
According to one embodiment of the present invention, an epoxy
resin composition comprises: a resin including an epoxy compound,
triethylenediamine, diphenylphosphine and/or tetraphenylborate; a
curing agent including diaminodiphenylsulfone, ethylenediamine,
diaminopropane, methanediamine, phenylenediamine and/or
triethanolamine; and an inorganic filler, wherein the inorganic
filler includes at least two alumina (Al.sub.2O.sub.3) groups
classified by particle size.
Inventors: |
YOON; Yeo Eun; (Seoul,
KR) ; KIM; Myeong Jeong; (Seoul, KR) ; YUN;
Sungjin; (Seoul, KR) ; JU; Sanga; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LG INNOTEK CO., LTD. |
Jung-gu Seoul |
|
KR |
|
|
Family ID: |
50934625 |
Appl. No.: |
14/651771 |
Filed: |
December 6, 2013 |
PCT Filed: |
December 6, 2013 |
PCT NO: |
PCT/KR2013/011312 |
371 Date: |
June 12, 2015 |
Current U.S.
Class: |
174/258 ;
523/457 |
Current CPC
Class: |
C08K 2003/2227 20130101;
H05K 2201/0209 20130101; C08G 59/4064 20130101; C08K 2201/005
20130101; H05K 1/053 20130101; C08G 59/245 20130101; C08K 3/22
20130101; C08G 59/22 20130101; C08L 63/00 20130101; C08L 63/00
20130101; C08K 3/22 20130101; H05K 1/0373 20130101 |
International
Class: |
H05K 1/03 20060101
H05K001/03; C08K 3/22 20060101 C08K003/22 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 12, 2012 |
KR |
10-2012-0144787 |
Claims
1. A resin composition comprising: a resin comprising an epoxy
compound represented by the following Formula 1; a curing agent
comprising diaminodiphenylsulfone; and an inorganic filler, wherein
the inorganic filler includes at least two alumina
(Al.sub.2O.sub.3) groups classified according to a particle size:
##STR00006## wherein R.sup.1 to R.sup.14 may each independently be
selected from the group consisting of H, Cl, Br, F, a
C.sub.1-C.sub.3 alkyl, a C.sub.2-C.sub.3 alkene, and a
C.sub.2-C.sub.3 alkyne, and m and n may each be 1, 2 or 3.
2. The resin composition of claim 1, wherein the resin comprises an
epoxy compound represented by the following Formula 2.
##STR00007##
3. The resin composition of claim 1, wherein the epoxy compound of
Formula 1, the curing agent, and the inorganic filler are included
at contents of 3 to 40% by weight, 0.5 to 30% by weight, and 40 to
96.5% by weight, respectively, based on the total weight of the
resin composition.
4. The resin composition of claim 1, wherein the inorganic filler
comprises a first alumina group having a particle size of 0.1 .mu.m
or more and less than 10 .mu.m, a second alumina group having a
particle size of 10 .mu.m or more and less than 30 .mu.m, and a
third alumina group having a particle size of 30 .mu.m or more and
60 .mu.m or less.
5. The resin composition of claim 4, wherein the first alumina
group is included at a content of 10 to 66.5% by weight, based on
the total weight of the resin composition, the second alumina group
is included at a content of 10 to 66.5% by weight, based on the
total weight of the resin composition, and the third alumina group
is included at a content of 20 to 76.5% by weight, based on the
total weight of the resin composition.
6. The resin composition of claim 4, wherein a content ratio of the
first alumina group and the second alumina group is in a range of
1:1 to 2, and a content ratio of the first alumina group and the
third alumina group is in a range of 1:1.5 to 5.5.
7. A printed circuit board comprising: a metal plate, an insulating
layer formed on the metal plate; and a circuit pattern formed on
the insulating layer, wherein the insulating layer is made of the
resin composition defined in claim 1.
8. The printed circuit board of claim 7, wherein the inorganic
filler comprises a first alumina group having a particle size of
0.1 .mu.m or more and less than 10 .mu.m, a second alumina group
having a particle size of 10 .mu.m or more and less than 30 .mu.m,
and a third alumina group having a particle size of 30 .mu.m or
more and 60 .mu.m or less.
9. The resin composition of claim 4, wherein the particle size of
the first alumina group is 0.5 .mu.m to 5 .mu.m, the particle size
of the second alumina group is 15 .mu.m to 25 .mu.m, and the
particle size of the third alumina group is 30 .mu.m to 45
.mu.m.
10. The resin composition of claim 5, wherein the third alumina
group is included at a content of 30 to 70% by weight, based on the
total weight of the resin composition.
11. The resin composition of claim 10, wherein the third alumina
group is included at a content of 40 to 65% by weight, based on the
total weight of the resin composition.
12. The resin composition of claim 1, further comprising at least
one of phenoxy and hyperbranched polyester.
13. The resin composition of claim 1, wherein the m and n each are
2 or 3.
14. The resin composition of claim 13, wherein the m and n each is
3.
15. The printed circuit board of claim 8, wherein a content ratio
of the first alumina group and the second alumina group is in a
range of 1:1 to 2, and a content ratio of the first alumina group
and the third alumina group is in a range of 1:1.5 to 5.5.
16. The printed circuit board of claim 7, wherein the m and n each
are 2 or 3.
17. The printed circuit board of claim 16, wherein the m and n each
is 3.
18. The printed circuit board of claim 7, wherein thermal
conductivity of the insulating layer is more than 7.8 W/mK.
19. The printed circuit board of claim 18, wherein thermal
conductivity of the insulating layer is more than 8.9 W/mK.
Description
TECHNICAL FIELD
[0001] The present invention relates to a resin composition, and
more particularly, to a resin composition and a printed circuit
board using the same.
BACKGROUND ART
[0002] Various electronic parts used in electronic devices may, for
example, be heating elements. Heat emitted by the heating elements
may degrade the performance and reliability of the electronic
devices. With the realization of high integration and higher
capacity of electronic parts, there is an increasing concern about
heat dissipation problems of printed circuit boards on which the
electronic parts are mounted, or materials to which the electronic
parts attached.
[0003] To improve the heat dissipation performance, a heat
dissipation board including a non-conductive heat dissipation layer
is proposed. For example, the non-conductive heat dissipation layer
includes a ZnO-based ceramic material as a main ingredient. In this
case, the non-conductive heat dissipation layer may be made of a
composition including Bi.sub.2O.sub.3, a praseodymium oxide
(PrxOy), other additives, etc. (Korean Unexamined Patent
Application Publication No. 2011-0027807).
[0004] However, such a non-conductive heat dissipation layer has a
problem in that it is difficult to handle heat emitted by elements
due to its insufficient thermal conductivity.
DISCLOSURE
Technical Problem
[0005] To solve the above problems, one aspect of the present
invention provides a resin composition, and a printed circuit board
using the same.
Technical Solution
[0006] According to an aspect of the present invention, there is
provided a resin composition which includes a resin including at
least one selected from the group consisting of an epoxy compound
represented by the following Formula 1, triethylenediamine,
diphenylphosphine, and tetraphenylborate, a curing agent including
at least one selected from the group consisting of
diaminodiphenylsulfone, ethylenediamine, diaminopropane,
methanediamine, phenylenediamine, and triethanolamine, and an
inorganic filler, wherein the inorganic filler includes at least
two alumina (Al.sub.2O.sub.3) groups classified according to a
particle size.
##STR00001##
[0007] In Formula 1, R.sup.1 to R.sup.14 may each independently be
selected from the group consisting of H, Cl, Br, F, a
C.sub.1-C.sub.3 alkyl, a C.sub.2-C.sub.3 alkene, and a
C.sub.2-C.sub.3 alkyne, and m and n may each be 1, 2 or 3.
[0008] The resin may include an epoxy compound represented by the
following Formula 2.
##STR00002##
[0009] The epoxy compound of Formula 2, the curing agent, and the
inorganic filler may be included at contents of 3 to 40% by weight,
0.5 to 30% by weight, and 40 to 96.5% by weight, respectively,
based on the total weight of the resin composition.
[0010] The inorganic filler may include a first alumina group
having a particle size of 0.1 .mu.m or more and less than 10 .mu.m,
a second alumina group having a particle size of 10 .mu.m or more
and less than 30 .mu.m, and a third alumina group having a particle
size of 30 .mu.m or more and 60 .mu.m or less.
[0011] The first alumina group may be included at a content of 10
to 66.5% by weight, based on the total weight of the resin
composition, the second alumina group may be included at a content
of 10 to 66.5% by weight, based on the total weight of the resin
composition, and the third alumina group may be included at a
content of 20 to 76.5% by weight, based on the total weight of the
resin composition.
[0012] A content ratio of the first alumina group and the second
alumina group may be in a range of 1:1 to 2, and a content ratio of
the first alumina group and the third alumina group may be in a
range of 1:1.5 to 5.5.
[0013] According to an aspect of the present invention, there is
provided a printed circuit board which includes a metal plate, an
insulating layer formed on the metal plate, and a circuit pattern
formed on the insulating layer, wherein the insulating layer is
made of the resin composition according to one exemplary embodiment
of the present invention.
Advantageous Effects
[0014] According to exemplary embodiments of the present invention,
a resin composition can be obtained. When the resin composition is
used, a heat dissipation layer having high thermal conductivity can
be obtained, and reliability and heat dissipation performance of
electronic devices mounted on electronic parts can be improved.
DESCRIPTION OF DRAWINGS
[0015] FIG. 1 is a cross-sectional view of a printed circuit board
according to one exemplary embodiment of the present invention.
BEST MODE
[0016] The present invention may be modified in various forms and
have various embodiments, and thus particular embodiments thereof
will be illustrated in the accompanying drawings and described in
the detailed description. However, it should be understood that the
description set forth herein is not intended to limit the present
invention, and encompasses all modifications, equivalents, and
substitutions that do not depart from the spirit and scope of the
present invention.
[0017] Although the terms encompassing ordinal numbers such as
first, second, etc. may be used to describe various elements, these
elements are not limited by these terms. These terms are only used
for the purpose of distinguishing one element from another. For
example, a first element could be termed a second element, and,
similarly, a second element could be termed a first element without
departing from the scope of the present invention. The term
"and/or" includes any and all combinations of a plurality of
associated listed items.
[0018] The terminology provided herein is merely used for the
purpose of describing particular embodiments, and is not intended
to be limiting of exemplary embodiments of the present invention.
The singular forms "a," "an" and "the" are intended to include the
plural forms as well, unless the context clearly indicates
otherwise. It should be understood that the terms "comprises,"
"comprising," "includes" and/or "including," when used herein,
specify the presence of stated features, integers, steps,
operations, elements, components and/or combinations thereof, but
do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components and/or
combinations thereof.
[0019] Unless defined otherwise, all the terms (including technical
and scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which the present
invention belongs. It will be further understood that the terms,
such as those defined in commonly used dictionaries, should be
interpreted as having meanings that are consistent with their
meanings in the context of the relevant art, and will not be
interpreted in an idealized or overly formal sense unless expressly
defined otherwise herein.
[0020] It will be understood that when it is assumed that a part
such as a layer, film, region, or board is disposed "on" another
part, it can be directly disposed on the other part or intervening
parts may also be present therebetween. On the other hand, it will
be understood that when it is assumed that a part such as a layer,
film, region, or board is "directly disposed on" another part, no
intervening parts may be present therebetween.
[0021] Hereinafter, exemplary embodiments of the present invention
will be described in detail with reference to the accompanying
drawings. Regardless of reference numerals, like numbers refer to
like elements throughout the description of the figures, and the
description of the same elements will be not reiterated.
[0022] In this specification, the term "% by weight(s)" may be
replaced with "part(s) by weight."
[0023] According to an aspect of the present invention, there is
provided a resin composition which includes a resin, a curing
agent, and an inorganic filler, wherein the inorganic filler
includes at least two alumina (Al.sub.2O.sub.3) groups classified
according to a particle size.
[0024] The resin composition one exemplary embodiment of the
present invention may include a resin at a content of 3% by weight
to 40% by weight, preferably 3% by weight to 30% by weight, and
more preferably 3% by weight to 20% by weight, based on the total
weight of the resin composition. When the resin is included at a
content of 3% by weight or less based on the total weight of the
resin composition, an adhesive property may be degraded. When the
resin is included at a content of 40% by weight or more based on
the total weight of the resin composition, it may be difficult to
adjust the thickness. In this case, the resin composition may
include a crystalline epoxy resin at a content of 3% by weight or
more, based on the total weight of the resin composition. When the
crystalline epoxy resin is included at a content of less than 3% by
weight based on the total weight of the resin composition, the
resin composition may not be crystallized, and thus a thermal
conduction effect may be reduced.
[0025] Here, the crystalline epoxy resin may be a mesogenic
compound represented by the following Formula 1. Mesogen is a
fundamental unit of a liquid crystal, and includes a rigid
structure. For example, the mesogen may include a rigid structure
like biphenyl, phenyl benzoate, naphthalene, etc.
##STR00003##
[0026] In Formula 1, R.sup.1 to R.sup.14 may each independently be
selected from the group consisting of H, Cl, Br, F, a
C.sub.1-C.sub.3 alkyl, a C.sub.2-C.sub.3 alkene, and a
C.sub.2-C.sub.3 alkyne, and m and n may each be 1, 2 or 3.
[0027] The crystalline epoxy resin may be represented by the
following Formula 2.
##STR00004##
[0028] The epoxy equivalent weight of the epoxy compound
(hereinafter referred to as 4,4'-biphenolether diglycidyl ether) of
Formula 2 may be in a range of 120 to 300, preferably 150 to 200.
For the physical properties of the epoxy compound of Formula 2, the
epoxy compound had a melting point of 158.degree. C., and the
.sup.1H NMR (CDCL.sub.3-d6, ppm) results are as below: 6=8.58 (s,
2H), 6=8.17-8.19 (d, 4H), 6=7.99-8.01 (d, 4H), 6=7.33 (s, 4H),
6=4.69-4.72 (d, 1H), 6=4.18-4.22 (m, 1H), 6=3.36-3.40 (m, 1H),
6=2.92-2.94 (m, 1H) and 6=2.74-2.77 (m, 1H). The melting point was
measured at a heating rate of 10.degree. C./min using a
differential scanning calorimetry device (DSC Q100 commercially
available from TA Instruments Ltd.). The NMR measurement was
performed using H-NMR after the epoxy compound is dissolved in
CDCL.sub.3-d6.
[0029] The epoxy compound of Formula 2 is crystalline at room
temperature. The expression of crystallinity may be confirmed using
the endothermic peaks of crystals in differential scanning
calorimetric analysis. In this case, the endothermic peak may be
shown as a plurality of peaks or broad peaks, the lowest
temperature of the endothermic peak may be greater than or equal to
60.degree. C., preferably 70.degree. C., and the highest
temperature of the endothermic peak may be less than or equal to
120.degree. C., preferably 100.degree. C.
[0030] Meanwhile, the resin composition may further include another
typical amorphous epoxy resin containing two or more epoxy groups
in the molecule in addition to the crystalline epoxy compound of
Formula 1 or 2. When the resin composition further includes the
amorphous epoxy resin in addition to the crystalline epoxy resin,
room-temperature stability may be improved.
[0031] For example, the amorphous epoxy resin may include at least
one selected from the group consisting of bisphenol A, bisphenol F,
3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenyl methane,
4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxydiphenyl sulfide,
4,4'-dihydroxydiphenyl ketone, fluorene bisphenol,
4,4'-biphenol-3,3',5,5'-tetramethyl-4,4'-dihydroxybiphenyl,
2,2'-biphenol, resorcinol, catechol, t-butylcatechol, hydroquinone,
t-butylhydroquinone, 1,2-dihydroxynaphthalene,
1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene,
1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene,
1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene,
2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene,
2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene,
2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, an allylated or
polyallylated compound of the dihydroxynaphthalene, a divalent
phenol such as allylated bisphenol A, allylated bisphenol F, or
allylated phenol novolac, or a trivalent or more phenol such as
phenol novolac, bisphenol A novolac, o-cresol novolac, m-cresol
novolac, p-cresol novolac, xylenol novolac, poly-p-hydroxystyrene,
tris-(4-hydroxyphenyl)methane,
1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, phloroglucinol,
pyrogallol, t-butylpyrogallol, allylated pyrogallol, polyallylated
pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone,
phenol aralkyl resin, naphthol aralkyl resin, or
dicyclopentadiene-based resin, a glycidyl-esterified compound
derived from a halogenated bisphenol such tetrabromobisphenol A,
and a mixture thereof.
[0032] The resin composition according to one exemplary embodiment
of the present invention may include at least one resin selected
from the group consisting of triethylenediamine, diphenylphosphine,
tetraphenylborate, and a mixture thereof.
[0033] The resin composition according to one exemplary embodiment
of the present invention may include the curing agent at a content
of 0.5% by weight to 30% by weight, based on the total weight of
the resin composition. When the curing agent is included at a
content of 0.5% by weight or less based on the total weight of the
resin composition, an adhesive property may be degraded. On the
other hand, when the curing agent is included at a content of 30%
by weight or more based on the total weight of the resin
composition, it may be difficult to adjust the thickness. The
curing agent included in the resin composition may be
4,4'-diaminodiphenyl sulfone represented by the following Formula
3. The curing agent of Formula 3 may react with the epoxy resin of
Formula 2 to improve thermal stability of the epoxy resin
composition.
##STR00005##
[0034] In addition to the 4,4'-diaminodiphenyl sulfone, the resin
composition may further include at least one selected from the
group consisting of a phenolic curing agent, an amine-based curing
agent, and an acid anhydride-based curing agent.
[0035] For example, the phenolic curing agent may include at least
one selected from the group consisting of bisphenol A, bisphenol F,
4,4'-dihydroxydiphenyl methane, 4,4'-dihydroxydiphenyl ether,
1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis(4-hydroxyphenoxy)benzene,
4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone,
4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxybiphenyl,
2,2'-dihydroxybiphenyl, 10-(2,5-dihydroxyphenyl)-1
OH-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolac, bisphenol
A novolac, o-cresol novolac, m-cresol novolac, p-cresol novolac,
xylenol novolac, poly-p-hydroxystyrene, hydroquinone, resorcinol,
catechol, t-butylcatechol, t-butylhydroquinone, phloroglucinol,
pyrogallol, t-butylpyrogallol, allylated pyrogallol, polyallylated
pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone,
1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene,
1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene,
1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene,
1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene,
2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene,
2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene,
2,8-dihydroxynaphthalene, an allylated or polyallylated compound of
the dihydroxynaphthalene, allylated bisphenol A, allylated
bisphenol F, allylated phenol novolac, allylated pyrogallol, and a
mixture thereof.
[0036] For example, the amine-based curing agent may include an
aliphatic amine, a polyether polyamine, an alicyclic amine, an
aromatic amine, etc. The aliphatic amine may include at least one
selected from the group consisting of ethylenediamine,
1,3-diaminopropane, 1,4-diaminopropane, hexamethylenediamine,
2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine,
diethylenetriamine, iminobis propylamine,
bis(hexamethylene)triamine, triethylenetetramine,
tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethyl
ethylenediamine, tetra(hydroxyethyl)ethylenediamine, etc. The
polyether polyamine may include at least one selected from the
group consisting of triethylene glycol diamine, tetraethylene
glycol diamine, diethylene glycol bis(propylamine),
polyoxypropylene diamine, a polyoxypropylene triamine, and a
mixture thereof. The alicyclic amine may include at least one
selected from the group consisting of isophorone diamine, methacene
diamine, N-aminoethylpiperazine,
bis(4-amino-3-methyldicyclohexyl)methane,
bis(aminomethyl)cyclohexane,
3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane,
norbornene diamine, etc. The aromatic amine may include at least
one selected from the group consisting of
tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine,
m-phenylenediamine, o-phenylenediamine, p-phenylenediamine,
2,4-diaminoanisole, 2,4-toluenediamine, 2,4-diaminodiphenylmethane,
4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane,
2,4-diaminodiphenylsulfone, m-aminophenol, m-aminobenzylamine,
benzyldimethylamine, 2-dimethylaminomethyl)phenol, triethanolamine,
methylbenzylamine, .alpha.-(m-aminophenyl)ethylamine,
.alpha.-(p-aminophenyl)ethylamine,
diaminodiethyldimethyldiphenylmethane,
.alpha.,.alpha.'-bis(4-aminophenyl)-p-diisopropylbenzene, and a
mixture.
[0037] For example, the acid anhydride-based curing agent may
include at least one selected from the group consisting of a
dodecenyl succinic anhydride, a polyadipic anhydride, a polyazelaic
anhydride, a polysebacic anhydride, a poly(ethyl octadecanoic
diacid) anhydride, a poly(phenyl hexadecane diacid) anhydride, a
methyltetrahydrophthalic anhydride, a methylhexahydrophthalic
anhydride, a hexahydrophthalic anhydride, a methyl himic anhydride,
a tetrahydrophthalic anhydride, a trialkyl tetrahydrophthalic
anhydride, a methylcyclohexene dicarboxylic anhydride, a
methylcyclohexene tetracarboxylic anhydride, a phthalic anhydride,
a trimellitic anhydride, a pyromellitic anhydride, a benzophenone
tetracarboxylic anhydride, ethylene glycol bistrimellitate, a
chlorendic anhydride, a nadic anhydride, a methyl nadic anhydride,
a
5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic
anhydride, a 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene
succinic dianhydride, a
1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic
dianhydride, and a mixture thereof.
[0038] The resin composition according to one exemplary embodiment
of the present invention may include at least one curing agent
selected from the group consisting of ethylenediamine,
1,3-diaminopropane, methanediamine, m-phenylenediamine,
triethanolamine, and a mixture thereof.
[0039] The resin composition may further include a curing
accelerator.
[0040] The resin composition according to one exemplary embodiment
of the present invention may include the inorganic filler at a
content of 40% by weight to 96.5% by weight, based on the total
weight of the resin composition. When the inorganic filler is
includes at a content of less than 40% by weight, high thermal
conductivity, low thermal expansibility, and high-temperature
thermal resistance of the resin composition may not be ensured. The
high thermal conductivity, low thermal expansibility and
high-temperature thermal resistance are improved as the inorganic
filler is added at an increasing amount. The high thermal
conductivity, low thermal expansibility and high-temperature
thermal resistance are not improved according to the volume
fraction of the inorganic filler, but start to be dramatically
improved when the inorganic filler is added at a certain amount.
However, when the inorganic filler is included at a content of
greater than 96.5% by weight, formability is deteriorated due to an
increase in viscosity.
[0041] The inorganic filler includes alumina (Al.sub.2O.sub.3). In
this case, the alumina used as the inorganic filler may include at
least two groups classified according to a particle size. For
example, the inorganic filler may include an alumina group having a
particle diameter of 0.1 .mu.m or more and less than 10 .mu.m,
preferably 0.5 .mu.m to 5 .mu.m, an alumina group having a particle
diameter of 10 .mu.m or more and less than 30 .mu.m, preferably 15
.mu.m to 25 .mu.m, and an alumina group having a particle diameter
of 30 .mu.m or more and 60.0 .mu.m or less, preferably 30.0 .mu.m
to 45.0 .mu.m.
[0042] The alumina group having a particle diameter of 0.1 .mu.m or
more and less than 10 .mu.m may be included at a content of 10% by
weight to 66.5% by weight, based on the total weight of the resin
composition. The alumina group having a particle diameter of 10
.mu.m or more and less than 30 .mu.m may be included at a content
of 10% by weight to 66.5% by weight, based on the total weight of
the resin composition. The alumina group having a particle diameter
of 30 .mu.m or more and 60.0 .mu.m or less may be included at a
content of 20% by weight to 76.5% by weight, preferably 30% by
weight to 70% by weight, and more preferably 40% by weight to 65%
by weight, based on the total weight of the resin composition.
[0043] A content ratio, that is, a weight ratio, of the alumina
group having a particle diameter of 0.1 .mu.m or more and less than
10 .mu.m and the alumina group having a particle diameter of 10
.mu.m or more and less than 30 .mu.m may be in a range of 1:1 to 2,
and a content ratio of the alumina group having a particle diameter
of 0.1 .mu.m or more and less than 10 .mu.m and the alumina group
having a particle diameter of 30 .mu.m or more and 60.0 .mu.m or
less may be in a range of 1:1.5 to 5.5. When the alumina groups are
included within this content ratio range, the volume ratio may be
improved using the alumina having a higher particle size (for
example, an alumina group having a particle diameter of 30.0 .mu.m
to 60.0 .mu.m), and a contact path for heat transfer may be
maximized by uniformly filling voids with alumina having a small or
medium particle size (for example, an alumina group having a
particle diameter of 0.1 .mu.m or more and less than 10 .mu.m, and
an alumina group having a particle diameter of 10 .mu.m or more and
less than 30 .mu.m) to reduce the voids. Therefore, thermal
conductivity may be improved.
[0044] Also, when the alumina having a higher particle size (for
example, an alumina group having a particle diameter of 30.0 .mu.m
to 60.0 .mu.m) is included at a higher content than the alumina
having a small or medium particle size (for example, an alumina
group having a particle diameter of 0.1 .mu.m or more and less than
10 .mu.m, and an alumina group having a particle diameter of 10
.mu.m or more and less than 30 .mu.m), the thermal conductivity may
be further improved.
[0045] Meanwhile, the resin composition according to one exemplary
embodiment of the present invention may include an additive at a
content of 0.1% by weight to 2% by weight, preferably 0.5% by
weight to 1.5% by weight, based on the total weight of the resin
composition. For example, the additive may be phenoxy, or a
hyperbranched polyester. When the additive is added at a content of
less than 0.1% by weight, it is difficult to realize desired
properties (for example, adhesivity). On the other hand, when the
additive is added at a content of greater than 2% by weight,
formability is deteriorated due to an increase in viscosity.
[0046] A prepreg may be prepared by coating or impregnating a fiber
base or a glass base with the resin composition according to one
exemplary embodiment of the present invention and semi-curing the
resin composition by heating.
[0047] The resin composition according to one exemplary embodiment
of the present invention may be applied to printed circuit boards.
FIG. 1 is a cross-sectional view of a printed circuit board
according to one exemplary embodiment of the present invention.
[0048] Referring to FIG. 1, the printed circuit board 100 includes
a metal plate 110, an insulating layer 120, and a circuit pattern
130.
[0049] The metal plate 110 may be made of at least one selected
from the group consisting of copper, aluminum, nickel, gold,
platinum, and an alloy thereof.
[0050] The insulating layer 120 made of the resin composition
according to one exemplary embodiment of the present invention is
formed on the metal plate 110.
[0051] The circuit pattern 130 is formed on the insulating layer
120.
[0052] When the resin composition according to one exemplary
embodiment of the present invention is used for the insulating
layer, the printed circuit board having excellent heat dissipation
performance may be obtained.
[0053] Hereinafter, the present invention will be described in
further detail in conjunction with Examples and Comparative
Examples.
Example 1
[0054] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 11% by weight of a hyperbranched polyester, 25% by weight
of alumina having a particle size of 33 .mu.m, 30% by weight of
alumina having a particle size of 24 .mu.m, and 15% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Example 1.
Example 2
[0055] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 11% by weight of a hyperbranched polyester, 20% by weight
of alumina having a particle size of 33 .mu.m, 30% by weight of
alumina having a particle size of 24 .mu.m, and 20% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Example 2.
Example 3
[0056] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 11% by weight of a hyperbranched polyester, 30% by weight
of alumina having a particle size of 33 .mu.m, 20% by weight of
alumina having a particle size of 24 .mu.m, and 20% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Example 3.
Example 4
[0057] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 11% by weight of a hyperbranched polyester, 35% by weight
of alumina having a particle size of 33 .mu.m, 21% by weight of
alumina having a particle size of 24 .mu.m, and 14% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Example 4.
Example 5
[0058] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 6% by weight of a hyperbranched polyester, 50% by weight
of alumina having a particle size of 33 .mu.m, 15% by weight of
alumina having a particle size of 24 .mu.m, and 10% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Example 5.
Comparative Example 1
[0059] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 1% by weight of a hyperbranched polyester, 10% by weight
of alumina having a particle size of 33 .mu.m, 10% by weight of
alumina having a particle size of 24 .mu.m, and 60% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Comparative Example 1.
Comparative Example 2
[0060] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 16% by weight of a hyperbranched polyester, 5% by weight
of alumina having a particle size of 33 .mu.m, 10% by weight of
alumina having a particle size of 24 .mu.m, and 50% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Comparative Example 2.
Comparative Example 3
[0061] A solution formulated from 11% by weight of the crystalline
epoxy compound of Formula 2, 8% by weight of 4,4'-diaminodiphenyl
sulfone, 3% by weight of a hyperbranched polyester, 60% by weight
of alumina having a particle size of 24 .mu.m, and 18% by weight of
alumina having a particle size of 0.5 .mu.m to 5 .mu.m was
prepared, and then stirred at room temperature for 5 minutes to
obtain a resin composition of Comparative Example 3.
[0062] Thermal conductivity of the epoxy resin compositions of
Example 1 to 5 and Comparative Example 1 to 3 was measured by means
of a transient hot-wire method using a thermal conductivity meter
(LFA447 commercially available from Netzsch-Geratebau GmbH.). The
measured results are listed in Table 1.
TABLE-US-00001 TABLE 1 Experiment No. Thermal conductivity (W/m K)
Example 1 8.0 Example 2 7.8 Example 3 8.3 Example 4 8.9 Example 5
9.8 Comparative Example 1 3 Comparative Example 2 4 Comparative
Example 3 6
[0063] As listed in Table 1, it could be seen that the resin
compositions of Examples 1 to 5, which included alumina having a
particle size of 33 .mu.m at 20% by weight or more, alumina having
a particle size of 24 .mu.m at 10% by weight or more, and alumina
having a particle size of 0.5 .mu.m to 5 .mu.m at 10% by weight or
more in addition to the crystalline epoxy compound of Formula 2 and
4,4'-diaminodiphenyl sulfone, had higher thermal conductivity than
the resin compositions of Comparative Examples 1 to 3 which
included alumina having a particle size of 24 .mu.m at 10% by
weight or more, and alumina having a particle size of 0.5 .mu.m to
5 .mu.m at 10% by weight or more, but included alumina having a
particle size of 33 .mu.m at less than 20% by weight.
[0064] In particular, it could be seen that, when the content ratio
of the alumina having a particle size of 0.5 .mu.m to 5 .mu.m and
the alumina having a particle size of 24 .mu.m was 1:1 and the
content ratio of the alumina having a particle size of 0.5 .mu.m to
5 .mu.m and the alumina having a particle size of 33 .mu.m was
1:1.5 as in Example 3, the content ratio of the alumina having a
particle size of 0.5 .mu.m to 5 .mu.m and the alumina having a
particle size of 24 .mu.m was 1:1.5 and the content ratio of the
alumina having a particle size of 0.5 .mu.m to 5 .mu.m and the
alumina having a particle size of 33 .mu.m was 1:2.5 as in Example
4, and the content ratio of the alumina having a particle size of
0.5 .mu.m to 5 .mu.m and the alumina having a particle size of 24
.mu.m was 1:1.5 and the content ratio of the alumina having a
particle size of 0.5 .mu.m to 5 .mu.m and the alumina having a
particle size of 33 .mu.m was 1:5 as in Example 5, the resin
compositions especially higher thermal conductivity than the resin
compositions in which the content ratio of the alumina having a
particle size of 0.5 .mu.m to 5 .mu.m and the alumina having a
particle size of 24 .mu.m fell out of 1:1 to 2, or the content
ratio of the alumina having a particle size of 0.5 .mu.m to 5 .mu.m
and the alumina having a particle size of 33 .mu.m fell out of
1:1.5 to 5.5 as in Example 1 or 2.
[0065] Although the preferred embodiments of the present invention
have been shown and described in detail, it would be appreciated by
those skilled in the art that modifications and changes may be made
in these embodiments without departing from the scope of the
invention, the scope of which is defined in the claims and their
equivalents.
* * * * *