U.S. patent application number 14/692755 was filed with the patent office on 2015-10-22 for kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods.
The applicant listed for this patent is SHENZHEN FISHER INDUSTRIAL CO., LTD. Invention is credited to Cheng-Gui LIU, Xian-Fei WAN, Ren-Liang XIAO, Chang-Wu YANG, Hua-Guo YIN, Chang-Hou ZHAO.
Application Number | 20150299536 14/692755 |
Document ID | / |
Family ID | 46618869 |
Filed Date | 2015-10-22 |
United States Patent
Application |
20150299536 |
Kind Code |
A1 |
XIAO; Ren-Liang ; et
al. |
October 22, 2015 |
KIND OF LIGHT-HEAT DUAL CURING ANISOTROPIC CONDUCTIVE ADHESIVE,
ANISOTROPIC CONDUCTIVE FILM AND THEIR PREPARATION METHODS
Abstract
A kind of light-heat dual curing anisotropic conductive adhesive
includes light curing activated monomer 15.0-18.0%, light-cured
resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer
5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles
4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent
12.0-16.0%, wherein the components are counted according to weight
percentage. The present invention also discloses a kind of
light-heat dual curing anisotropic conductive film (ACF) and its
preparation methods. Ultraviolet light curing method is applied to
produce ACF can avoid using solvent to protect the natural
environment. When using ACF, heat curing method is then applied to
guarantee the quality of banding and the reliability.
Inventors: |
XIAO; Ren-Liang; (Guangdong,
CN) ; ZHAO; Chang-Hou; (Guangdong, CN) ; LIU;
Cheng-Gui; (Guangdong, CN) ; WAN; Xian-Fei;
(Guangdong, CN) ; YANG; Chang-Wu; (Guangdong,
CN) ; YIN; Hua-Guo; (Guangdong, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN FISHER INDUSTRIAL CO., LTD |
Guangdong |
|
CN |
|
|
Family ID: |
46618869 |
Appl. No.: |
14/692755 |
Filed: |
April 22, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14128629 |
Dec 23, 2013 |
|
|
|
PCT/CN2013/074658 |
Apr 24, 2013 |
|
|
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14692755 |
|
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Current U.S.
Class: |
428/40.2 ;
252/514; 428/345 |
Current CPC
Class: |
C09J 7/35 20180101; H01L
2924/07811 20130101; C09J 7/22 20180101; Y10T 428/1471 20150115;
B05D 5/12 20130101; C09J 2203/326 20130101; C09J 11/00 20130101;
H01L 2224/29386 20130101; H01L 2224/29344 20130101; C09J 175/14
20130101; C08K 5/0025 20130101; Y10T 428/2809 20150115; C08K 7/18
20130101; B05D 7/04 20130101; B05D 3/067 20130101; H01L 2224/2929
20130101; C09J 163/00 20130101; H01L 2224/29386 20130101; C08K
2003/0831 20130101; H01L 2924/00 20130101; H01L 2924/00014
20130101; H01L 2924/0665 20130101; H01L 2924/05442 20130101; C09J
9/02 20130101; H01L 2224/2929 20130101; H01L 2224/29344 20130101;
C09J 4/06 20130101; C08K 3/08 20130101; B05D 3/065 20130101; B05D
5/10 20130101; H01L 24/29 20130101; H01L 2924/07811 20130101 |
International
Class: |
C09J 163/00 20060101
C09J163/00; C09J 9/02 20060101 C09J009/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 17, 2012 |
CN |
201210153970.6 |
Claims
1. A kind of light-heat dual curing anisotropic conductive adhesive
including: light curing activated monomer 15.0-18.0.degree. %,
light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%,
elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive
particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat
curing agent 12.0-16.0%, wherein the above-mentioned components are
counted according to weight percentage.
2. The light-heat dual curing anisotropic conductive adhesive
according to the claim 1, wherein said conductive adhesive
furtherly includes plasticizer whose weight percentage is
3.0-6.0%.
3. The light-heat dual curing anisotropic conductive adhesive
according to the claim 1, wherein said conductive adhesive
furtherly includes coupling agent whose weight percentage is
0.5-1.0%.
4. The light-heat dual curing anisotropic conductive adhesive
according to the claim 1, wherein said conductive adhesive
furtherly includes leveling agent whose weight percentage is
0.5-1.5%.
5. The light-heat dual curing anisotropic conductive adhesive
according to the claim 1, wherein said conductive adhesive
furtherly includes antioxidant whose weight percentage is
0.5-1.0%.
6. A kind of light-heat dual curing anisotropic conductive film
comprising a plastic film basic material and a conductive adhesive
layer, and a kind of light-heat dual curing anisotropic conductive
adhesive being coated on the plastic film basic material and then
being cured with ultraviolet light to form said conductive adhesive
layer; Said light-heat dual curing anisotropic conductive adhesive
consisting of light curing activated monomer 15.0-18.0%,
light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%,
elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles
8.0-15.0%, conductive particles 4.0-18.0%, light curing agent
3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent
0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein
the above-mentioned components are counted according to weight
percentage.
7. The light-heat dual curing anisotropic conductive film according
to the claim 6, wherein the conductive film furtherly comprises a
protective film that is covered on the conductive adhesive
layer.
8. The light-heat dual curing anisotropic conductive film according
to the claim 6, wherein the material of the above-mentioned plastic
film basic material is polyethylene terephthalate.
9. The light-heat dual curing anisotropic conductive film according
to the claim 7, wherein the material of the above-mentioned plastic
film basic material is polyethylene terephthalate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of application
Ser. No. 14/128,629 filed on Dec. 23, 2013 which is a continuation
of International application No. PCT/CN2013/074658 filed on Apr.
24, 2013 which claims priority to Chinese Patent Application Serial
No. 201210153970.6 filed on May 17, 2012.
FIELD OF THE PRESENT INVENTION
[0002] The present invention relates to micro-electronic packaging
technology field, in particular to a kind of light-heat dual curing
anisotropic conductive adhesive, anisotropic conductive film and
their preparation methods.
BACKGROUND OF THE PRESENT INVENTION
[0003] Anisotropic conductive film (ACF) has both unilateral
conduction function and adhesion function. Currently, ACF is used
for COG, TCP/COF, COB and FPC, in particular for the electric
connection between IC and ITO glass. It can connect a lot of
minuscule wires which traditional connectors can not connect.
[0004] Anisotropic conductive films are mainly applied to the
products such as mobile handhelds, cell phones, digital cameras,
computers, printers, keyboards, consumer electronics, TVs, GPS
products, electronic dictionaries and so on.
[0005] Traditional ACF consists of thermosetting resin, conducting
particles, curing agent, plasticizer and so on. When producing ACF,
firstly, we dissolve the above-mentioned components in toluene,
butanone or other volatile solvents to make a lot of anisotropic
conductive adhesive (ACA). Secondly, we coat the above-mentioned
ACA on a plastic film, then blow plenty of hot air to dry the ACA.
Then the above-mentioned solvent is removed, and the ACF is
produced. Then we cut the ACF to make up anisotropic conductive
adhesive film (ACF). During the course of production, plenty of
polluted harmful waste gas will affect the health of the
workers.
[0006] The Chinese patent CN1926675A and the Chinese patent
CN1367219A both disclose a kind of light curing anisotropic
conductive adhesive (ACA) or light curing anisotropic conductive
film (ACF). Those patents use light curing technology when using
some ACF to connect some electric components. The ACA only can be
used to connect transparent electrode (for example ITO glass), but
can not be used to connect non-transparent electrode (for example
plasma panel ADD etc). The Chinese patent CN101724361 discloses the
method about using heat curing to promote light curing, but it does
not apply light curing technology to produce ACF. The adhesion
strength of light curing is not as good as heat curing. In recent
years, in micro-electronic packaging technology field, the
connecting technology between those electronic components such as
PCB terminals and IC chips develops to be integrated,
high-performance, multi-lead, and of narrow space length. The
requirements about the performance of the ACF is more and more
high. Light curing can not meet the requirements about high bond
strength.
SUMMARY OF THE PRESENT INVENTION
[0007] The technical problem to be solved by the present invention
is to overcome serious environmental pollution due to using solvent
during the course of producing ACF under the traditional
technology. The present invention applies light-heat dual curing
technology to produce ACF. Applying light curing method to
producing ACF can avoid using solvent to protect the natural
environment. Applying heat curing method for electric connection
can get high adhesion strength between the electric components.
[0008] In order to solve the technical problem, the present
invention puts forward the following technical solution: a kind of
light-heat dual curing anisotropic conductive adhesive includes:
light curing activated monomer 15.0-18.0%, light-cured resin
4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%,
insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%,
light curing agent 3.0-5.0% and latent heat curing agent
12.0-16.0%, wherein the above-mentioned components are counted
according to weight percentage.
[0009] The further improvement of the technical solution is: the
conductive adhesive furtherly includes plasticizer whose weight
percentage is 3.0-6.0%.
[0010] The further improvement of the technical solution is: the
conductive adhesive furtherly includes coupling agent whose weight
percentage is 0.5-1.0%.
[0011] The further improvement of the technical solution is: the
conductive adhesive furtherly includes leveling agent whose weight
percentage is 0.5-1.5%.
[0012] The further improvement of the technical solution is: the
conductive adhesive furtherly includes antioxidant whose weight
percentage is 0.5-1.0%.
[0013] In order to solve the technical problem, the present
invention puts forward the following technical solution: a kind of
light-heat dual curing anisotropic conductive film comprising a
plastic film basic material and a conductive adhesive layer, and a
kind of light-heat dual curing anisotropic conductive adhesive
being coated on the plastic film basic material and then being
cured with ultraviolet light to form said conductive adhesive
layer;
[0014] Said light-heat dual curing anisotropic conductive adhesive
consisting of light curing activated monomer 15.0-18.0%,
light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%,
elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles
8.0-15.0%, conductive particles 4.0-18.0%, light curing agent
3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent
0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein
the above-mentioned components are counted according to weight
percentage.
[0015] The further improvement of the technical solution is: the
conductive film furtherly comprises a protective film that is
covered on the conductive adhesive layer.
[0016] The further improvement of the technical solution is: the
material of the above-mentioned plastic film basic material is
polyethylene terephthalate.
[0017] The further improvement of the technical solution is: the
material of the above-mentioned plastic film basic material is
polyethylene terephthalate.
[0018] In order to solve the technical problem, the present
invention puts forward the following technical solution: a kind of
preparation method of the light-heat dual curing anisotropic
conductive film according to the claim 6 comprises:
[0019] Step one, weigh light curing activated monomer 15.0-18.0%,
light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%,
elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles
8.0-15.0%, conductive particles 4.0-18.0%, light curing agent
3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent
0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein
the above-mentioned components are counted according to weight
percentage;
[0020] Step two, put the solid-state light-cured resin,
thermosetting resin and elastomer in a dispersing mixer, then heat
them to melt to form a mixture, wherein the melting temperature is
between 130.degree. C. to 150.degree. C.;
[0021] Step three, put the liquid-state light curing activated
monomer and plasticizer in the above-mentioned mixture, wherein the
temperature is below 80.degree. C.;
[0022] Step four, put the leveling agent, antioxidant and
insulating nanoparticles in the above-mentioned mixture one by
one;
[0023] Step five, put the conductive particles in the
above-mentioned mixture;
[0024] Step six, put the light curing agent, latent heat curing
agent and coupling agent in the above mixture, so that a light-heat
dual curing anisotropic conductive adhesive is produced;
[0025] Step seven, coat the above-mentioned conductive adhesive on
a plastic film basic material with a coating machine;
[0026] step eight, the semi-finished product which is gotten in
step seven is cured and is dried with a UV curing machine to form a
conductive adhesive layer, so that a light-heat dual curing
anisotropic conductive film is produced;
[0027] Step nine, the semi-finished product which is gotten in step
eight is cut roughly and carefully with a slitting machine and is
rolled to get a kind of anisotropic conductive adhesive film.
[0028] In order to solve the technical problem, the present
invention puts forward the following technical solution: a kind of
preparation method of the light-heat dual curing anisotropic
conductive film according to the claim 7 comprises:
[0029] Step one, weigh light curing activated monomer 15.0-18.0%,
light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%,
elastomer 5.0-10.0%, plasticizer 3.0-6.0%, insulating nanoparticles
8.0-15.0%, conductive particles 4.0-18.0%, light curing agent
3.0-5.0%, latent heat curing agent 12.0-16.0%, coupling agent
0.5-1.0%, leveling agent 0.5-1.5% and antioxidant 0.5-1.0%, wherein
the above-mentioned components are counted according to weight
percentage;
[0030] Step two, put the solid-state light-cured resin,
thermosetting resin and elastomer in a dispersing mixer, then heat
them to melt to form a mixture, wherein the melting temperature is
between 130.degree. C. to 150.degree. C.;
[0031] Step three, put the liquid-state light curing activated
monomer and plasticizer in the above-mentioned mixture, wherein the
temperature is below 80.degree. C.;
[0032] Step four, put the leveling agent, antioxidant and
insulating nanoparticles in the above-mentioned mixture one by
one;
[0033] Step five, put the conductive particles in the
above-mentioned mixture;
[0034] Step six, put the light curing agent, latent heat curing
agent and coupling agent in the above mixture, so that a light-heat
dual curing anisotropic conductive adhesive is produced;
[0035] Step seven, coat the above-mentioned conductive adhesive on
a plastic film basic material with a coating machine;
[0036] Step eight, the semi-finished product which is gotten in
step seven is cured and is dried with a UV curing machine to form a
conductive adhesive layer, so that a light-heat dual curing
anisotropic conductive film is produced;
[0037] Step nine, a protective film is covered on the conductive
adhesive layer, so that a light-heat dual curing anisotropic
conductive film is produced;
[0038] Step ten, the semi-finished product which is gotten in step
nine is cut roughly and carefully with a slitting machine and is
rolled to get a kind of anisotropic conductive adhesive film.
[0039] The present invention has many advantages than prior arts.
Ultraviolet light curing method is applied to produce ACF can avoid
using solvent to protect the natural environment. When using ACF,
heat curing method is then applied to get high adhesion
strength.
BRIEF DESCRIPTION OF THE DRAWINGS
[0040] FIG. 1 is a sectional view of the first kind of light-heat
dual curing anisotropic conductive film in accordance with the
present invention.
[0041] FIG. 2 is a diagrammatic view of the preparation method of
the first kind of light-heat dual curing anisotropic conductive
film in accordance with the present invention.
[0042] FIG. 3 is a sectional view of the second kind of light-heat
dual curing anisotropic conductive film in accordance with the
present invention.
[0043] FIG. 4 is a diagrammatic view of the preparation method of
the second kind of light-heat dual curing anisotropic conductive
film in accordance with the present invention.
[0044] FIG. 5 is a sectional view of the rotation and revolution
speed ratio adjustable defoaming-stirring machine in accordance
with the present invention.
[0045] FIG. 6 is a structural view of the rotation and revolution
speed ratio adjustable defoaming-stirring machine in accordance
with the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0046] The present invention discloses a kind of light-heat dual
curing anisotropic conductive adhesive. The anisotropic conductive
adhesive consists of the following components, which are counted
according to weight percentage: [0047] light curing activated
monomer 15.0-18.0%; [0048] light-cured resin 4.5-12.5%; [0049]
thermosetting resin 20.0-25.0%; [0050] elastomer 5.0-10.0%: [0051]
plasticizer 3.0-6.0%; [0052] insulating nanoparticles 8.0-15.0%;
[0053] conductive particles 4.0-18.0% [0054] light curing agent
3.0-5.0% [0055] latent heat curing agent 12.0-16.0%; [0056]
coupling agent 0.5-1.0% [0057] leveling agent 0.5-1.5%; and [0058]
antioxidant 0.5-1.0%.
[0059] The above-mentioned light curing agent and latent heat
curing agent both are a kind of free-radical type curing agent, or
a kind of ionic type curing agent, or a kind of latent curing agent
that is the mixture of a kind of free-radical type curing agent and
a kind of ionic type curing agent.
[0060] The above-mentioned light curing activated monomer consists
of a kind of the following substance or at least two kinds of the
following substances: hydroxyethyl methylacrylate; hydroxypropyl
methyl acrylate; isopropyl methacrylate ester; ethoxy ethoxy
acrylate; lauryl acid methacrylate; ethylene glycol phenyl ether
acrylate; 2-dimethyl propyl ester two acrylate; tricyclic decane
two methanol two acrylate; ethylene oxide bisphenol A two acrylic
ester; 2-methyl-1,3 propylene glycol two acrylate; 2 (3) propylene
glycol acrylate; three (2-hydroxyethyl)isocyanurate three acrylate;
ethylene oxide (propylene oxide) three hydroxy methyl propane three
acrylate; propoxylated glyceryl triacrylate; two-four three
trimethylolpropane acrylate; (b) oxide pentaerythritol four
acrylate; dipentaerythritol pentaacrylate; dipentaerythritol
hexaacrylate.
[0061] The above-mentioned light-cured resin consists of a kind of
the following substance or at least two kinds of the following
substances: unsaturated polyester; epoxy-acrylic resin;
polyurethane acrylic resin; polyester acrylic resin; polyether
acrylic resin; acrylate functionalized polyacrylic resin;
polyolefin resin containing unsaturated double bond; all kinds of
epoxy resins; epoxy functionalized polysiloxane resin; resin with
vinyl ether functional group.
[0062] The above-mentioned light curing agent consists of a kind of
the following substance or at least two kinds of the following
substances: benzoin ether derivatives, benzil derivatives, two
alkoxy acetophenone, alpha hydroxy alkyl benzene ketone, alpha
amine alkyl benzene ketone, acyl phosphine oxide, aryl peroxy ester
compounds, benzoylformic acid ester, benzophenone, tertiary amine,
thioxanthone, tertiary amine, anthraquinone, tertiary amine,
diphenyliodonium salt.
[0063] The above-mentioned thermosetting resin consists of a kind
of the following substance or at least two kinds of the following
substances: glycidyl ether type epoxy resin, glycidyl ester type
epoxy resin, glycidyl amine type epoxy resin, cycloaliphatic epoxy
resin, linear aliphatic epoxy compound.
[0064] The above-mentioned latent heat curing agent consists of a
kind of the following substance or at least two kinds of the
following substances: dicyandiamide, 1-benzyl-2-2 imidazole, 2
mi-AER331 epoxy adduct, microcapsule-type curing agent,
BF3MEA\2MZ-AZINE, double cyano malonitrile, diallyl melamine,
Poly(piperidine kwai diacid)hydrazide, boron trifluoride benzyl
amine complex compound.
[0065] The above-mentioned elastomer consists of a kind of the
following substance or at least two kinds of the following
substances: epoxy-terminated nitrile rubber, polyurethane rubber,
hydroxyl-terminated liquid NBR, hydroxyl nitrile rubber,
hydroxyl-terminated polybutadiene, thiokol, acrylic rubber.
[0066] The above-mentioned conductive particles consist of a kind
of the following substances: the composite conductive particles,
which are prepared by the means that the surfaces of polymer
microspheres are coated with copper, nickel, gold, silver, tin,
zinc, iron, tungsten, or molybdenum.
[0067] The above-mentioned insulating nanoparticles consist of a
kind of the following substance or at least two kinds of the
following substances: nano-ceramic powder, nano-SiO2, nano-TiO2,
nanometer calcium carbonate.
[0068] The above-mentioned plasticizer consists of a kind of the
following substance or at least two kinds of the following
substances: phthalates (including phthalate, terephthalate, and
isophthalate), aliphatic dibasic acid esters (including adipate,
azelate, and sebate), phosphate (including aliphatic alcohol
phosphate, phenol phosphate, and chlorine phosphate), polyol ester
(including glycerol triacetate, diethylene glycol benzoate and so
on), benzene polycarboxylic acid esters (including trioctyl
trimellitate, trihexyl trimellitate, and tetraoctyl pyromellitate),
citric esters (including triethyl citrate, acetyl triethyl citrate,
tributyl citrate, acetyl citrate (2-ethyl ester and so on),
polyester (including Poly(1,2-propylene glycol adipate),
propanediol sebacate polyester, phthalic polyester and so on),
epoxy plasticizer (including epoxidized soybean oil, epoxy flaxseed
oil, butyl epoxy stearate, octyl epoxy stearate, epoxy
triglyceride, di(2-Ethylhexyl)-4,5-epoxytetrahydrophthalate and so
on), chlorine plasticizer (including chlorinated paraffin,
methylpentachlorostearate), reactive plasticizer (including dibutyl
maleate, dioctyl maleate, acrylic polyol ester, methyl acrylic
polyol ester, fumarate, itaconate, unsaturated polyester resin and
so on).
[0069] The above-mentioned leveling agent consists of a kind of the
following substance or at least two kinds of the following
substances: polydimethyl siloxane and polymethyl phenyl
siloxane.
[0070] The above-mentioned coupling agent consists of a kind of the
following substance or at least two kinds of the following
substances:
trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]-silane,
.gamma.-(glycidoxypropyl)trimethoxy silane, .gamma.-methacryloxy
propyl trimethoxy silane.
[0071] The above-mentioned antioxidant consists of a kind of the
following substance or at least two kinds of the following
substances: aromatic amine antioxidants, hindered phenol
antioxidant, secondary antioxidant.
[0072] A kind of preparation method of the above-mentioned
light-heat dual curing anisotropic conductive adhesive includes the
following steps:
[0073] Step one: weigh light curing activated monomer 15.0-18.0%,
light-cured resin 4.5-12.5%, light curing agent 3.0-5.0%,
thermosetting resin 20.0-25.0%, latent heat curing agent
12.0-16.0%, elastomer 5.0-10.0%, plasticizer 3.0-6.0%, conductive
particles 4.0-18.0%, insulating nanoparticles 8.0-15.0%, coupling
agent 0.5-1.0%, leveling agent 0.5-1.5%; antioxidant 0.5-1.0%, and
the above-mentioned components are counted according to weight
percentage;
[0074] Step two: put the solid-state light-cured resin,
thermosetting resin and elastomer in a dispersing mixer, then heat
them to melt to form a mixture, and the melting temperature is
between 130.degree. C. to 150.degree. C.;
[0075] Step three: put the liquid-state light curing activated
monomer and plasticizer in the above-mentioned mixture, and the
temperature is below 80.degree. C.;
[0076] Step four: put the leveling agent, antioxidant and
insulating nanoparticles in the above-mentioned mixture one by
one;
[0077] Step five: put the conductive particles in the
above-mentioned mixture;
[0078] Step six: put the light curing agent, latent heat curing
agent and coupling agent in the above mixture, then the light-heat
dual curing anisotropic conductive adhesive is produced.
[0079] As shown in FIG. 1 and FIG. 3, the present invention also
discloses two kinds of light-heat dual curing anisotropic
conductive films.
[0080] As shown in FIG. 1, the first kind of light-heat dual curing
anisotropic conductive film comprises a plastic film basic material
100 and a conductive adhesive layer 200. The above-mentioned
light-heat dual curing anisotropic conductive adhesive is coated on
the plastic film basic material 100 and then is cured with
ultraviolet light to form the above-mentioned conductive adhesive
layer 200.
[0081] The material of the above-mentioned plastic film basic
material 100 is PET (polyethylene terephthalate).
[0082] As shown in FIG. 2, a kind of preparation method of the
above-mentioned first kind of light-heat dual curing anisotropic
conductive film includes the following steps:
[0083] Step one: prepare the above-mentioned light-heat dual curing
anisotropic conductive adhesive according to the above-mentioned
preparation method;
[0084] Step two: coat the above-mentioned conductive adhesive on
the plastic film basic material 100 with a coating machine;
[0085] Step three: the semi-finished product which is gotten in
step two is cured and is dried with a UV curing machine to form a
conductive adhesive layer 200, then a kind of light-heat dual
curing anisotropic conductive film is produced in accordance with
the present invention;
[0086] Step four: the semi-finished product which is gotten in step
three is cut roughly and carefully with a slitting machine and is
rolled to get a kind of anisotropic conductive adhesive film
(ACF).
[0087] As shown in FIG. 3, the second kind of light-heat dual
curing anisotropic conductive film comprises a plastic film basic
material 100, a conductive adhesive layer 200 and a protective film
300. The above-mentioned light-heat dual curing anisotropic
conductive adhesive is coated on the plastic film basic material
100 and then is cured with ultraviolet light to form the
above-mentioned conductive adhesive layer 200.
[0088] The material of the above-mentioned plastic film basic
material 100 is PET (polyethylene terephthalate).
[0089] As shown in FIG. 4, a kind of preparation method of the
above-mentioned second kind of light-heat dual curing anisotropic
conductive film includes the following steps:
[0090] Step one: prepare the above-mentioned light-heat dual curing
anisotropic conductive adhesive according to the above-mentioned
preparation method;
[0091] Step two: defoam the above-mentioned conductive adhesive,
and then coat the above-mentioned conductive adhesive on the
plastic film basic material 100 with a coating machine;
[0092] Step three: the semi-finished product which is gotten in
step two is cured and is dried with a UV curing machine to form a
conductive adhesive layer 200;
[0093] Step four: a protective film 300 is covered on the
conductive adhesive layer 200, then a light-heat dual curing
anisotropic conductive film is produced in accordance with the
present invention;
[0094] Step five: the semi-finished product which is gotten in step
four is cut roughly and carefully with a slitting machine and then
is rolled to get a kind of anisotropic conductive adhesive film
(ACF).
[0095] In the above-mentioned step two, as shown in FIG. 5 and FIG.
6, when defoaming the conductive adhesive, a rotation and
revolution speed ratio adjustable defoaming-stirring machine is
used. The defoaming-stirring machine comprises a first motor 1, a
cup sleeve bracket 2, a permanent magnetic levitation bearing 3, a
second motor 4, a second motor synchronous wheel 5, a magnetic
levitation bearing synchronous wheel 6, a bevel gear 7, three
synchronous wheel belts 8, two bevel gear synchronous wheels 9,
four bearings 10, two mixing cup sleeves 11, two cup sleeve
synchronous wheels 12.
[0096] The first motor 1 comprises a rotation shaft 18. When the
first motor 1 is turned on, the rotation shaft 18 will rotate.
[0097] The cup sleeve bracket 2 is fixed to the distal end of the
rotation shaft 18. The cup sleeve bracket 2 comprises a bottom
plate 22 and two oblique plates 24. The two oblique plates 24
oblique upper direction extend respectively from the two ends of
the bottom plate 22, and there is an angle of 135 degrees between
every oblique plate 24 and the bottom plate 22.
[0098] The rotation shaft 18 is connected below the bottom plate
22.
[0099] When the rotation shaft 18 rotates, the cup sleeve bracket 2
will rotate together.
[0100] The permanent magnetic levitation bearing 3 is fixed around
the rotation shaft 18. The permanent magnetic levitation bearing 3
comprises a central magnet 31, an upper magnet 32, a lower magnet
33, and a suspended magnet 34.
[0101] The central magnet 31 is fixed to the rotation shaft 18. The
upper end of the central magnet 31 is N pole, and the lower end of
the central magnet 31 is S pole.
[0102] The upper magnet 32 is fixed to the base of the bottom plate
22 of the cup sleeve bracket 2. The upper end of the upper magnet
32 is S pole, and the lower end of the upper magnet 32 is N
pole.
[0103] The lower magnet 33 is sleeved on the rotation shaft 18 and
is under the upper magnet 32. The upper end of the lower magnet 33
is S pole, and the lower end of the lower magnet 33 is N pole.
[0104] The suspended magnet 34 is sleeved outside of the central
magnet 31 and the rotation shaft 18. The suspended magnet 34 is
placed between the upper magnet 32 and the lower magnet 33. The
suspended magnet 34 does not contact the central magnet 31, the
rotation shaft 18, the upper magnet 32 and the lower magnet 33. The
upper end of the suspended magnet 34 is N pole, and the lower end
of the suspended magnet 34 is S pole.
[0105] The upper end of the suspended magnet 34, the upper end of
the central magnet 31 and the lower end of the upper magnet 32 are
all N poles, and the lower end of the suspended magnet 34, the
lower end of the central magnet 31 and the upper end of the lower
magnet 33 are all S poles. Because the same poles repel each other,
the suspended magnet 34 does not contact the other components and
suspends in the air, so the suspended magnet 34 will not receive
any friction force when it rotates.
[0106] The second motor 4 comprises a rotation shaft 42. When the
second motor 4 is turned on, the rotation shaft 42 will rotate.
[0107] The second motor synchronous wheel 5 is fixed to the distal
end of the rotation shaft 42.
[0108] The magnetic levitation bearing synchronous wheel 6 is
sleeved on the suspended magnet 34.
[0109] The bevel gear 7 comprises a first gear 72 and two second
gears 74.
[0110] The first gear 72 is sleeved on the suspended magnet 34 and
is above the magnetic levitation bearing synchronous wheel 6.
[0111] The two second gears 74 are fixed to the two ends of the
first gear 72. The first gear 72 can transmit force to the two
second gears 74 to make them rotate.
[0112] One of the three synchronous wheel belts 8 is fixed between
the second motor synchronous wheel 5 and the magnetic levitation
bearing synchronous wheel 6.
[0113] The two bevel gear synchronous wheels 9 are respectively
fixed to the two second gears 74.
[0114] The four bearings 10 are respectively fixed to the cup
sleeve bracket 2. Two bearings 10 of the above-mentioned four
bearings 10 are connected to the two bevel gear synchronous wheels
9.
[0115] The two mixing cup sleeves 11 are respectively fixed to the
upper ends of the other two bearing 10. So the two mixing cup
sleeves 11 can be rotatablely fixed to the cup sleeve bracket
2.
[0116] The two cup sleeve synchronous wheels 12 are respectively
fixed to the lower ends of the other two bearings 10.
[0117] The other two synchronous wheel belts 8 are respectively
fixed between the two bevel gear synchronous wheels 9 and the two
cup sleeve synchronous wheels 12.
[0118] When the first motor 1 is turned on, the rotation shaft 18
will rotate to make the cup sleeve bracket 2 rotate synchronously.
The two mixing cup sleeves 11 rotate together with the cup sleeve
bracket 2, and the rotation shaft 18 is the axis of rotation, so
this kind of movement of the two mixing cup sleeves 11 is called
"revolution".
[0119] When the second motor 4 is turned on, the rotation shaft 42
will rotate. The second motor synchronous wheel 5 rotates to make
the magnetic levitation bearing synchronous wheel 6 rotate by the
transmission of the synchronous wheel belt 8. Then, the suspended
magnet 34 and the first gear 72 rotate synchronously. The first
gear 72 pushes the two second gears 74 to rotate. When the second
gears 74 rotates, the two bevel gear synchronous wheels 9 rotate
synchronously to make the two cup sleeve synchronous wheels 12
rotate by the transmission of the two synchronous wheel belts 8,
then the two mixing cup sleeves 11 rotate. This kind of movement of
the two mixing cup sleeves 11 is called "rotation".
Embodiment 1
[0120] Weigh the following components according to the lower
table.
TABLE-US-00001 Content Components (W %) light curing activated
hydroxyethyl methylacrylate 16.0 monomer light-cured resin
Ethoxylated bisphenol A two methyl 4.5 acrylate (SR348)
thermosetting resin tetraphenol ethane tetraglycidyl 23.5 ether
epoxy resin (EPON-1301) elastomer epoxy-terminated nitrile 10.0
rubber(NBR-1704) plasticizer polypropylene glycol diglycidyl ether
6.0 (RF-PPD1217) insulating nanoparticles nano-SiO2 15.0 conductive
particles Conductive gold balls (10 .mu.m) 4.0 light curing agent
Epoxy group phenyl ethyl copper 3.0 Irgacure651 latent heat curing
agent modified dicyandiamide (asahi 16.0 chemical industry
AEHD-610) coupling agent trimethoxy[2-(7-oxabicyclo 1.0
[4.1.0]hept-3-yl)ethyl]-Silane leveling agent solydimethyl siloxane
0.5 antioxidant 2,6-2 tertiary butyl phenol 0.5 (T502A)
[0121] Put the solid-state light-cured resin, thermosetting resin
and elastomer in a dispersing mixer, then heat them to melt to form
a mixture, and the melting temperature is between 130.degree. C. to
150.degree. C.;
[0122] Put the liquid-state light curing activated monomer,
plasticizer in the above-mentioned mixture, and the temperature is
below 80.degree. C.;
[0123] Put the leveling agent, antioxidant and insulating
nanoparticles in the above-mentioned mixture one by one;
[0124] Put the conductive particles in the above-mentioned
mixture;
[0125] Put the light curing agent, latent heat curing agent and
coupling agent in the above mixture, then the light-heat dual
curing anisotropic conductive adhesive is produced.
[0126] Coat the above-mentioned conductive adhesive on a plastic
film basic material 100 with a coating machine;
[0127] The semi-finished product which is gotten in step two is
cured and is dried with a UV curing machine to form a conductive
adhesive layer 200;
[0128] A protective film 300 is covered on the conductive adhesive
layer 200, then a light-heat dual curing anisorropic conductive
film is produced in accordance with the present invention.
[0129] The conductive film produced by the embodiment has the
following physical and chemical parameters.
TABLE-US-00002 Items Units ACF10 remarks standard The Pitch .mu.m
100 specifications minimum Bump space .mu.m 50 connection circuit
thickness .mu.m 25 width mm 1.2, 1.5, 2.0, 3.0 Other width can be
customized Length m 50, 100 color -- gray Dish heart diameter mm
.sup. 18.5 Conductive particles particle .mu.m 10 polymer
microspheres size which are plated with density Particle 320k Ni/Au
number/ mm.sup.3 properties contact resistance .OMEGA. .ltoreq.5
All ITO/TCP electrodes, 1.5 mm bonding insulation resistance
.OMEGA. .gtoreq.10.sup.9 space length 50 .mu.m, 2.5 mm bonding
peeling strength(20.degree. C.) kN/m 1.2 ITO glasses/ working range
temperature .degree. C. -40-100 Electric A/mm.sup.2 Equal and below
50 current voltage V Equal and below 50 bonding Precompression
temperature .degree. C. 70-80 The temperature of ACF requirements
when pre-compressing pressure MPa 0.2-0.5 time s 1-2 compression
temperature .degree. C. 170-190 The temperature of ACF when
compressing pressure MPa 2-5 time s 10-20 storage requirements
sealed package -- -10-5.degree. C., seven months unpackaged --
25.degree. C., below 70% RH, one month
Embodiment 2
[0130] Weigh the following components according to the lower
table.
TABLE-US-00003 Content Components (W %) light curing activated
2-dimethyl propyl ester two acrylate, 18.0 monomer light-cured
resin Two shrinkage three glycol dimethyl 9.5 acrylate (SR205)
thermosetting resin tetraphenol ethane tetraglycidyl ether 20.0
epoxy resin (EPON-1301) elastomer Epoxy acrylate rubber (ACM62) 5.0
plasticizer polypropylene glycol diglycidyl ether 3.0 RF-PPD1217
insulating nanoparticles nano-CaCO.sub.3 8.0 conductive particles
conductive gold balls(4 .mu.m) 18.0 light curing agent DMPA
Irgacure651 4.0 latent heat curing agent Huntsman product DY9577
12.0 coupling agent trimethoxy[2-(7-oxabicyclo 0.5
[4.1.0]hept-3-yl)ethyl]-Silane leveling agent
Polyphenylmethylsiloxane 1.0 antioxidant nonyl-n-benzenamin KT5535
1.0
[0131] Put the solid-state light-cured resin, thermosetting resin
and elastomer in a dispersing mixer, then heat them to melt to form
a mixture, and the melting temperature is between 130.degree. C. to
150.degree. C.;
[0132] Put the liquid-state light curing activated monomer and
plasticizer in the above-mentioned mixture, and the temperature is
below 80.degree. C.;
[0133] Put the leveling agent, antioxidant and insulating
nanoparticles in the above-mentioned mixture one by one;
[0134] Put the conductive particles in the above-mentioned
mixture;
[0135] Put the light curing agent, latent heat curing agent and
coupling agent in the above mixture, then the light-heat dual
curing anisotropic conductive adhesive is produced.
[0136] Coat the above-mentioned conductive adhesive on a plastic
film basic material 100 with a coating machine;
[0137] The semi-finished product which is gotten in step two is
cured and is dried with a UV curing machine to form a conductive
adhesive layer 200;
[0138] A protective film 300 is covered on the conductive adhesive
layer 200, then a light-heat dual curing anisotropic conductive
film is produced in accordance with the present invention.
[0139] The conductive film produced by the embodiment has the
following physical and chemical parameters.
TABLE-US-00004 Items Units ACF04 remarks standard The Pitch .mu.m
50 specifications minimum Bump space .mu.m 20 connection circuit
thickness .mu.m 20 width mm 1.2, 1.5, 2.0, 3.0 Other width can be
customized Length m 50, 100 color -- gray Dish heart diameter mm
18.5 Conductive particles particle .mu.m 4 polymer microspheres
size which are plated with density Particle 480k Ni/Au number/
mm.sup.3 properties contact resistance .OMEGA. .ltoreq.5 All
ITO/TCP electrodes, 1.5 mm bonding insulation resistance .OMEGA.
.gtoreq.10.sup.3 space length 50 .mu.m, 2.5 mm bonding peeling
strength (20.degree. C.) kN/m 1.2 ITO glasses/FPC working range
temperature .degree. C. -40-100 Electric A/mm.sup.2 Equal and below
50 current voltage V Equal and below 50 bonding Precompression
temperature .degree. C. 70 .+-. 10 The temperature of ACF
requirements when pre-compressing pressure MPa 1-2 time s 2-4
compression temperature .degree. C. 180 .+-. 10 190 .+-. 10 The
temperature of ACF when compressing pressure MPa 2-3 2-3 time s 15
10 storage requirements scaled -- -10-5.degree. C., seven months
package unpackaged -- 25.degree. C., below 70% RH, one month
Embodiment 3
[0140] Weigh the following components according to the lower
table.
TABLE-US-00005 Content Components (W %) light curing Lauric acid
(meth) acrylate 16.0 activated monomer light-cured resin
Polyurethane acrylic resin BK-2308 4.5 thermosetting resin
P-aminophenol three glycidyl epoxy resin 23.5 elastomer
hydroxyl-terminated NBR CTBN1300X18 10.0 plasticizer polypropylene
glycol diglycidyl ether 6.0 insulating Nano-ceramic powder 15.0
nanoparticles conductive particles Conductive gold balls (9 .mu.m)
4.0 light curing agent HCPK Irgacure184 3.0 latent heat modified
dicyandiamide (Aradur2844) 16.0 curing agent coupling agent
.gamma.-methacryloxypropyltrimethoxysilane 1.0 leveling agent
polymethylphenyl silicone 0.5 antioxidant 4,4-methylene (2,6-2
tertiary butyl 0.5 phenol) T511
[0141] Put the solid-state light-cured resin, thermosetting resin
and elastomer in a dispersing mixer, then heat them to melt to form
a mixture, and the melting temperature is between 130.degree. C. to
150.degree. C.;
[0142] Put the liquid-state light curing activated monomer and
plasticizer in the above-mentioned mixture, and the temperature is
below 80.degree. C.;
[0143] Put the leveling agent, antioxidant and insulating
nanoparticles in the above-mentioned mixture one by one;
[0144] Put the conductive particles in the above-mentioned
mixture;
[0145] Put the light curing agent, latent heat curing agent,
coupling agent in the above mixture, then the light-heat dual
curing anisotropic conductive adhesive is produced.
[0146] Coat the above-mentioned conductive adhesive on a plastic
film basic material 100 with a coating machine;
[0147] The semi-finished product which is gotten in step two is
cured and is dried with a UV curing machine to form a conductive
adhesive layer 200;
[0148] A protective film 300 is covered on the conductive adhesive
layer 200, then a light-heat dual curing anisotropic conductive
film is produced in accordance with the present invention.
[0149] The conductive film produced by the embodiment has the
following physical and chemical parameters.
TABLE-US-00006 Items Units ACF09 remarks standard The Pitch .mu.m
100 specifications minimum Bump space .mu.m 50 connection circuit
thickness .mu.m 25 width mm 1.2, 1.5, 2.0, 3.0 Other width can be
customized Length m 50, 100 color -- gray Dish heart diameter mm
.sup. 18.5 Conductive particles particle .mu.m 9 polymer
microspheres size which are plated with density Particle 170k Ni/Au
number/ mm.sup.3 properties contact resistance .OMEGA. .ltoreq.5
All ITO/TCP electrodes, 1.5 mm bonding insulation resistance
.OMEGA. .gtoreq.10.sup.9 space length 50 .mu.m, 2.5 mm bonding
peeling strength(20.degree. C.) kN/m 1.2 ITO glasses/ working range
temperature .degree. C. -40-100 Electric A/mm.sup.2 Equal and below
50 current voltage V Equal and below 50 bonding Precompression
temperature .degree. C. 70-80 The temperature of ACF requirements
when pre-compressing pressure MPa 0.2-0.5 time s 1-2 compression
temperature .degree. C. 170-190 The temperature of ACF when
compressing pressure MPa 2-5 time s 10-20 storage requirements
sealed package -- -10-5.degree. C., seven months unpackaged --
25.degree. C., below 70% RH, one month
* * * * *