U.S. patent application number 14/740292 was filed with the patent office on 2015-10-01 for speaker module.
The applicant listed for this patent is Wistron Corporation. Invention is credited to Hung-Li Chen, Jyun-Shuo Liang, Tsung-Hsien Tsai.
Application Number | 20150281814 14/740292 |
Document ID | / |
Family ID | 52776671 |
Filed Date | 2015-10-01 |
United States Patent
Application |
20150281814 |
Kind Code |
A1 |
Liang; Jyun-Shuo ; et
al. |
October 1, 2015 |
SPEAKER MODULE
Abstract
A speaker module is provided. The speaker module includes a
speaker unit, a box and a shape memory alloy. The box has a rear
wall and an opening. The shape memory alloy connects the speaker
unit and the rear wall.
Inventors: |
Liang; Jyun-Shuo; (New
Taipei City, TW) ; Tsai; Tsung-Hsien; (New Taipei
City, TW) ; Chen; Hung-Li; (New Taipei City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Wistron Corporation |
New Taipei City |
|
TW |
|
|
Family ID: |
52776671 |
Appl. No.: |
14/740292 |
Filed: |
June 16, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14148727 |
Jan 7, 2014 |
|
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|
14740292 |
|
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Current U.S.
Class: |
181/199 |
Current CPC
Class: |
H04R 1/2811 20130101;
H04N 5/23287 20130101; G03B 2205/0076 20130101; H04N 5/2257
20130101; H04R 1/02 20130101; G03B 13/36 20130101; H04R 1/026
20130101; H04R 1/2842 20130101; G02B 7/022 20130101; G02B 7/09
20130101; G03B 3/10 20130101; H04N 5/2254 20130101; G02B 7/023
20130101; H04R 1/028 20130101; G03B 5/06 20130101; H04R 1/345
20130101; G02B 7/026 20130101; H04R 1/025 20130101 |
International
Class: |
H04R 1/02 20060101
H04R001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 8, 2013 |
TW |
102136403 |
Claims
1. A speaker module, comprising: a speaker unit; a box, having a
rear wall and an opening; and a first shape memory alloy,
connecting the speaker unit and the rear wall.
2. The speaker module according to claim 1, further comprising two
screws, one end of each of the screws being a stopper end and the
other end of each of the screws being a thread end, wherein the
thread ends of the screws are locked to the rear wall, both sides
of the speaker unit have a through hole respectively, and each of
the screws passes through one of the through holes.
3. The speaker module according to claim 2, further comprising four
resilient sleeves arranged on the screws in pairs, wherein the
resilient sleeves on each of the screws are respectively situated
between the stopper end and the speaker unit or between the rear
wall and the speaker unit.
4. The speaker module according to claim 3, further comprising a
second shape memory alloy connecting the speaker unit and the rear
wall, wherein the screws, the first shape memory alloy and the
second shape memory alloy are disposed on the rear wall in a row,
and the first shape memory alloy and the second memory alloy are
situated between the screws.
5. The speaker module according to claim 4, wherein the rear wall
has two screw barrels disposed thereon, and the thread end of each
of the screws is locked into one of the screw barrels.
6. The speaker module according to claim 5, wherein the box further
has an annular sidewall connecting between the rear wall and the
opening, and the annular sidewall has telescopic creases.
7. The speaker module according to claim 1, wherein the first shape
memory alloy is spring-like or cylindrical.
8. The speaker module according to claim 1, wherein the box further
has an annular sidewall connecting between the rear wall and the
opening, wherein the annular sidewall has telescopic creases.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of and claims
the priority benefit of a prior application Ser. No. 14/148,727,
filed on Jan. 7, 2014, now allowed. The prior application Ser. No.
14/148,727 claims the priority benefit of Taiwan application serial
no. 102136403, filed on Oct. 8, 2013. The entirety of each of the
above-mentioned patent applications is hereby incorporated by
reference herein and made a part of this specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a speaker module, and more
particularly to a speaker module adopting a shape memory alloy.
[0004] 2. Description of Related Art
[0005] With the development of technology, consumers have higher
and higher expectations for entertaining functions of electronic
products. Nowadays, almost all electronic products require a lens
and a speaker so that users may take pictures, have video
communication with others, listen to music and view videos, etc. at
any time. However, when mounted in an electronic device, current
lens modules are not able to rotate or shift left or right without
the whole electronic device being turned, not to say adjusting
focal distances. On the other hand, when mounted in an electronic
device, current speaker modules are not able to adjust the output
orientation of sounds without the whole electronic device being
turned. Therefore, traditional lens and speaker in electronic
devices are considerably limited in use.
SUMMARY OF THE INVENTION
[0006] A lens module is provided, capable of solving the problem of
limited use of traditional lenses in electronic devices.
[0007] A speaker module is provided, capable of solving the problem
of limited use of traditional speakers in electronic devices.
[0008] The lens module includes a lens stand, a base and a first
shape memory alloy. The first shape memory alloy connects the lens
stand and the base.
[0009] According to an embodiment, the lens module further
comprises two screws, both ends of each screw are a stopper end and
a thread end, wherein the thread end of the screw is locked to the
base, both sides of the lens stand have a through hole
respectively, and each screw passes through one of the through
holes.
[0010] According to an embodiment, the lens module further
comprises four resilient sleeves arranged on each screw in pairs,
wherein the resilient sleeves on each screw are situated between
the stopper end and the lens stand and between the base and the
lens stand respectively.
[0011] According to an embodiment, the lens module further
comprises a second shape memory alloy connecting the lens stand and
the base, wherein the screws, the first shape memory alloy and the
second shape memory alloy are disposed on the base in a row, and
the first shape memory alloy and the second memory alloy are
situated between the screws.
[0012] According to an embodiment, the base has two screw barrels
disposed thereon, and the thread end of each screw is locked into
one of the screw barrels.
[0013] According to an embodiment, the lens stand has at least one
lens and an image sensing element.
[0014] According to an embodiment, the lens stand has at least one
lens, while the base has an image sensing element.
[0015] According to an embodiment, the first shape memory alloy is
spring-like or cylindrical.
[0016] The speaker module includes a speaker unit, a box and a
first shape memory alloy. The box has a rear wall and an opening.
The first shape memory alloy connects the speaker unit and the rear
wall.
[0017] According to an embodiment, the speaker module further
comprises two screws, both ends of each screw are a stopper end and
a thread end, wherein the thread end of the screw is locked to the
rear wall, both sides of the speaker unit have a through hole
respectively, and each screw passes through one of the through
holes.
[0018] According to an embodiment, the speaker module further
comprises four resilient sleeves arranged on each screw in pairs,
wherein the resilient sleeves on each screw are situated between
the stopper end and the speaker unit and between the rear wall and
the speaker unit respectively.
[0019] According to an embodiment, the speaker module further
comprises a second shape memory alloy connecting the speaker unit
and the rear wall, wherein the screws, the first shape memory alloy
and the second shape memory alloy are disposed on the rear wall in
a row, and the first shape memory alloy and the second memory alloy
are situated between the screws.
[0020] According to an embodiment, the rear wall has two screw
barrels disposed thereon, and the thread end of each screw is
locked into one of the screw barrels.
[0021] According to an embodiment, the box further has an annular
sidewall connecting between the rear wall and the opening, wherein
the annular sidewall has telescopic creases.
[0022] According to an embodiment, the first shape memory alloy is
spring-like or cylindrical.
[0023] According to an embodiment, the box further has an annular
sidewall connecting between the rear wall and the opening, wherein
the annular sidewall has telescopic creases.
[0024] Based on the above, in the lens module, relative positions
of the lens stand and the base are changed by simply adjusting the
size of the shape memory alloy. In the speaker module, relative
positions of the speaker unit and the rear wall are changed by
simply adjusting the size of the shape memory alloy. Thereby,
convenience in using the lens module and the speaker module mounted
in the electronic device is enhanced.
[0025] To make the above features and advantages of the present
invention more comprehensible, several embodiments accompanied with
drawings are described in detail as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the disclosure.
[0027] FIG. 1 is a schematic view of a lens module according to one
embodiment.
[0028] FIG. 2 is a schematic view of a lens module according to
another embodiment.
[0029] FIG. 3 is a schematic view of a lens module according to yet
another embodiment.
[0030] FIG. 4 is an exploded view of the lens module in FIG. 3.
[0031] FIG. 5 is a flowchart of an actuating example of the lens
module.
[0032] FIGS. 6A to 6D are schematic views of four states of the
lens module.
[0033] FIG. 7 is a circuit diagram that shows a connection by a
first shape memory alloy in FIG. 3.
[0034] FIGS. 8A-8C are circuit diagrams of three embodiments of the
current source in FIG. 7.
[0035] FIG. 9 is a schematic view of a speaker module according to
an embodiment.
[0036] FIG. 10 is a schematic view of a speaker module according to
another embodiment.
DESCRIPTION OF EMBODIMENTS
[0037] A speaker module is provided. Although belonging to
different genres of products, both use a shape memory alloy to
connect to two elements between which distance needs to be
adjusted, for example, connecting a lens stand and a base, or
connecting a speaker unit and a rear wall. Similarly, based on the
characteristic that the size of the shape memory alloy varies with
temperature, the distance between the two elements connected by the
shape memory alloy becomes adjustable. Therefore, after the lens
module and the speaker module are assembled in an electronic
device, relative positions between the lens stand and the speaker
unit in the electronic device can still be adjusted, so as to
achieve focusing lens and adjusting the output direction of
sounds.
[0038] FIG. 1 is a schematic view of a lens module according to one
embodiment. Referring to FIG. 1, a lens module 100A of the present
embodiment includes a lens stand 110A, a base 120A and a first
shape memory alloy 130A. The first shape memory alloy 130A connects
the lens stand 110A and the base 120A. The first shape memory alloy
130A is made of shape memory alloy. The shape memory alloy is
formed by depositing more than two different metal atoms. Since the
size and structure of the metal atoms differ, conditions for
forming the alloy differ. Thereby, different crystalline structures
are formed, including an "austenite structure" and a "martensite
structure," while the transition between the two structures is
called "austenite phase change." The shape memory alloy has
"martensite phase change," and the alloy transforms from the
"martensite structure" to the "austenite structure" and restores to
the original shape when heated to the phase change temperature.
Therefore, upon being supplied with power, the temperature of the
first shape memory alloy 130A rises and reaches a stable
temperature after a certain period of time. At this moment, the
length of the first shape memory alloy 130A also differs from the
length prior to power supply. Thereby, the purpose of adjusting the
distance between the lens stand 110A and the base 120A is achieved.
With the difference in the current applied to the first shape
memory alloy 130A, the stable temperature finally achieved by the
first shape memory alloy 130A differs. Therefore, adjusting the
current applied to the first shape memory alloy 130A adjusts the
length of the first shape memory alloy 130A.
[0039] When the lens module 100A is assembled in the electronic
device (not shown), the lens module 100A is secured on a shell of
the electronic device via the base 120A. When the temperature of
the first shape memory alloy 130A is changed, even if the relative
distance between the electronic device and the object to be focused
on does not change, the relative distance between the lens stand
110A and the object to be focused on can still be changed, thereby
achieving the purpose such as focusing.
[0040] The present embodiment takes the example that the first
memory shape memory alloy 130A has a cylindrical profile, and also
that the lens module has only one first shape memory alloy 130A,
but the invention is not limited thereto. The lens stand 110A of
the present embodiment has, for example, at least one lens 114 and
an image sensing element 116. In other words, a constant relative
position is kept between the lens 114 and the image sensing element
116 of the present embodiment. However, in a lens module 100B of
FIG. 2, the lens stand 110B merely has at least one lens 114, while
the base 120B has an image sensing element 124. That is, when the
length of the first shape memory alloy 130A is changed, the
distance between the lens 114 and the image sensing element 124
also changes.
[0041] FIG. 3 is a schematic view of a lens module according to yet
another embodiment, while FIG. 4 is an exploded view of the lens
module in FIG. 3. Referring to FIGS. 3 and 4, a lens module 100C of
the present embodiment is similar to the lens module 100A of FIG.
1, and merely the differences are elaborated herein. The lens
module 100C of the present embodiment further includes two screws
140. Both ends of each screw 140 are a stopper end 142 and a thread
end 144. The thread end 144 of the screw 140 is locked to a base
120C. Both sides of a lens stand 110C have a through hole 112
respectively. Each screw 140 passes through one through hole 112.
By means of the arrangement of the screw 140, the lens stand 110C
is able to slide between the stopper end 142 of the screw 140 and
the base 120C.
[0042] In the present embodiment, the lens module may further
include four resilient sleeves 150. Two resilient sleeves 150 are
arranged on each screw 140. One resilient sleeve 150 on each screw
140 is situated between the stopper end 142 and the lens stand
110C, while the other resilient sleeve 150 is situated between the
base 120C and the lens stand 110C. The resilient sleeves 150 are
able to serve as buffers between the stopper end 142 and the lens
stand 110C and between the base 120C and the lens stand 110C.
[0043] In the present embodiment, the lens module 100C includes a
first shape memory alloy 130B and a second shape memory alloy 160,
both connecting the lens stand 110C and the base 120C. The present
embodiment takes the example that the first shape memory alloy 130B
and the second shape memory alloy 160 are spring-like. The screw
140, the first shape memory alloy 130B and the second shape memory
alloy 160 are disposed on the base 120C in a row, and the first
shape memory alloy 130B and the second shape memory alloy 160 are
situated between the two screws 140. The base 120C of the present
embodiment, for example, has two screw barrels 122. The thread end
144 of each screw 140 is locked into one screw barrel 122.
[0044] Next, we take the lens module 100C for example to describe
the actuating manner of the lens module. FIG. 5 is a flowchart of
an actuating example of the lens module, while FIGS. 6A to 6D are
schematic views of four states of the lens module. Referring to
FIG. 5, after the actuating process of the lens module starts, the
user first decides whether to adjust the focal distance of the lens
module, which is a step S110. If yes, a step S122 is entered,
wherein power is supplied to both the first shape memory alloy 130B
and the second shape memory alloy 160 to change the temperatures of
the first shape memory alloy 130B and the second shape memory alloy
160 simultaneously and thereby change the lengths of both, for
example, changing from the state in FIG. 6A to the state in FIG.
6B. If not, a step S124 is entered, wherein power is not supplied
to the first shape memory alloy 130B and the second shape memory
alloy 160, for example, maintaining the state in FIG. 6A.
[0045] After the steps S122 and S124, the user further decides
whether to adjust the orientation of the lens stand of the lens
module, which is a step S130. If not, the process returns to the
step S110. If yes, a step S140 is entered, wherein, for example,
the user decides whether to adjust the orientation of the lens
stand to face toward the right-hand side of FIG. 6B. If yes, a step
S152 is entered, wherein power continues to be supplied to the
first shape memory alloy 130B and stops to be supplied to the
second shape memory alloy 160. Thereby, the lens module changes
from the state in FIG. 6B into the state in FIG. 6C, i.e. adjusting
the orientation of the lens stand 110C to face toward the
right-hand side in FIG. 6C. If not, a step S154 is entered, wherein
power continues to be supplied to the second shape memory alloy 160
and stops to be supplied to the first shape memory alloy 130B.
Thereby, the lens module changes from the state in FIG. 6B into the
state in FIG. 6D, i.e. adjusting the orientation of the lens stand
110C to face toward the left-hand side in FIG. 6D. After the steps
S152 or S154, the process may return to the step S 110. It should
be noted that although FIG. 5 takes the example that the user first
decides whether to adjust the focal distance of the lens module, in
other embodiments, the user may also first decide whether to adjust
the orientation of the lens stand, or the user may complete at once
provision of his commands about adjusting the focal distance and
the orientation before the lens module actuates.
[0046] In the lens module 100C of FIG. 3, example is taken by
having two shape memory alloys to achieve the possibility that the
lens stand 110C has translational motion in one orientation and to
obtain a degree of freedom of the rotating motion of the lens stand
110C. However, in other embodiments, the degree of freedom of
motions of the lens stand 110C may certainly be increased by adding
the number of the shape memory alloys, by changing the manner of
connecting the shape memory alloys with the lens stand 110C and the
base 120C, or by other manners.
[0047] FIG. 7 is a circuit diagram that shows a connection by a
first shape memory alloy in FIG. 3. Referring to FIG. 7, the first
shape memory alloy 130B forms a loop with, for example, a current
source 172 and a switch 174. When the switch 174 is turned on, the
current source 172 provides current to the first shape memory alloy
130B to raise the temperature thereof, so that the size of the
first shape memory alloy 130B is changed. When the switch 174 is
turned off, the current source 172 could not provide current to the
first shape memory alloy 130B, and the temperature of the first
shape memory alloy 130B lowers down, so that the size of the first
shape memory alloy 130B is changed.
[0048] FIGS. 8A-8C are circuit diagrams of three embodiments of the
current source in FIG. 7. The current source 172 in FIG. 7 may
adopt a variety of designs, such as a micro-current source in FIG.
8A, a proportional current source in FIG. 8B or a current mirror in
FIG. 8C.
[0049] FIG. 9 is a schematic view of a speaker module according to
an embodiment. Referring to FIG. 9, the speaker module 200A of the
present embodiment includes a speaker unit 210A, a box 220A and a
first shape memory alloy 230A. The box 220A has a rear wall 222A
and an opening 224A. The first shape memory alloy 230A connects the
speaker unit 210A and the rear wall 222A. Upon being supplied with
power, the temperature of the first shape memory alloy 230A rises
and reaches a stable temperature after a certain period of time. At
this moment, the length of the first shape memory alloy 230A also
differs from the length prior to power supply. Thereby, the
distance between the speaker unit 210A and the rear wall 222A is
adjusted, and thereby the volume of the resonant cavity between the
speaker unit 210A and the rear wall 222A is adjusted to achieve the
purpose of adjusting tone quality. With the difference in the
current applied to the first shape memory alloy 230A, the stable
temperature finally achieved by the first shape memory alloy 230A
differs. Therefore, adjusting the current applied to the first
shape memory alloy 230A adjusts the length of the first shape
memory alloy 230A. The first memory shape memory alloy 230A of the
present embodiment takes a cylindrical profile for example, and the
present embodiment takes having only one first shape memory alloy
230A for example, but the invention is not limited thereto.
[0050] FIG. 10 is a schematic view of a speaker module according to
another embodiment. Referring to FIG. 10, the lens module 200B of
the present embodiment is similar to the speaker module 200A of
FIG. 9, and merely the differences are elaborated herein. Therein,
part of the elements are similar to the elements of the lens module
of FIG. 4. Please refer thereto to understand relevant details. The
speaker module 200B of the present embodiment further includes two
screws 140. Both ends of each screw 140 are a stopper end 142 and a
thread end 144. The thread end 144 of the screw 140 (referring to
FIG. 4) is locked to a rear wall 222B, and both sides of a speaker
unit 210B have one through hole 212B respectively. Each screw 140
passes through one through hole 212B. By means of the arrangement
of the screw 140, the speaker unit 210B is able to slide between
the stopper end 142 of the screw 140 and the rear wall 222B.
[0051] In the present embodiment, the speaker module 200B further
includes four resilient sleeves 150. Two resilient sleeves 150 are
arranged on each screw 140. One resilient sleeve 150 on each screw
140 is situated between the stopper end 142 and the speaker unit
210B, while the other resilient sleeve 150 is situated between the
rear wall 222B and the speaker unit 210B.
[0052] In the present embodiment, the speaker module 200B includes
a first shape memory alloy 230B and a second shape memory alloy
230C, both connecting the speaker unit 210B and the rear wall 222B.
The present embodiment takes the example that the first shape
memory alloy 230B and the second shape memory alloy 230C are
spring-like. The screw 140, the first shape memory alloy 230B and
the second shape memory alloy 230C are disposed on the rear wall
222B in a row, and the first shape memory alloy 230B and the second
shape memory alloy 230C are situated between the two screws 140. In
the present embodiment, the rear wall 222B has two screw barrels
222B1 disposed thereon, and the thread end 144 (referring to FIG.
4) of each screw 140 is locked into one screw barrel 222B1.
[0053] A box 220B of the present embodiment further has an annular
sidewall 226 connected between the rear wall 222B and the opening
224B, and the annular sidewall 226 has telescopic creases 228. By
means of the telescopic creases 228, when the sizes of the first
shape memory alloy 230B and the second shape memory alloy 230C
changes, the volume of the resonant cavity between the speaker unit
210A and the rear wall 222A has a larger possibility of variation.
In addition, the manner of actuation as illustrated in FIG. 5 may
also be applied to the speaker module 200B of the present
embodiment, that is, the orientation of the speaker unit 210A of
the speaker module 200B may similarly be adjusted by using the
first shape memory alloy 230B and the second shape memory alloy
230C, so as to change the output direction of sounds.
[0054] Based on the above, in the lens module, the shape memory
alloy connects the lens stand and the base, and therefore relative
positions of the lens stand and the base are changed by simply
adjusting the size of the shape memory alloy. In the speaker
module, the shape memory alloy connects the speaker unit and the
rear wall, and therefore relative positions of the speaker unit and
the rear wall are changed by simply adjusting the size of the shape
memory alloy. Thereby, operations such as focusing, rotating,
adjusting the volume of the resonant cavity may be performed on the
lens module and the speaker module mounted in the electronic
device, which increases the convenience in use.
[0055] Although the invention has been described with reference to
the above embodiments, it will be apparent to one of ordinary skill
in the art that modifications to the described embodiments may be
made without departing from the spirit and scope of the invention.
Accordingly, the scope of the invention will be defined by the
attached claims and not by the above detailed descriptions.
* * * * *