U.S. patent application number 14/222268 was filed with the patent office on 2015-09-24 for nail lamp device.
This patent application is currently assigned to LumiTech Int'l Inc.. The applicant listed for this patent is LumiTech Int'l Inc.. Invention is credited to Kevin WAN.
Application Number | 20150265027 14/222268 |
Document ID | / |
Family ID | 54140848 |
Filed Date | 2015-09-24 |
United States Patent
Application |
20150265027 |
Kind Code |
A1 |
WAN; Kevin |
September 24, 2015 |
NAIL LAMP DEVICE
Abstract
A nail lamp device includes an inner housing having an inner
housing substrate and an inner chamber surrounded by the inner
housing substrate, at least one chip on board (COB) light emitting
diode (LED) module disposed on an inner surface of the inner
housing substrate by pasting-fitted and emitting light toward the
inner chamber, a control module disposed on an outer surface of the
inner housing substrate and electrically connected to the COB LED
module, and an outer housing covering the inner housing and
retaining a front opening of the inner chamber exposed. The COB LED
module used by the nail lamp device is directly disposed on the
inner surface of the inner housing substrate by pasting-fitted and
has a plurality of LED elements arranged in array to accelerate the
time required for the curing reaction of the resin coatings or
glues coated on fingers. Moreover, the wavelength ranges of light
can be selected with high elasticity, so as to enhance utility.
Inventors: |
WAN; Kevin; (Taoyuan,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LumiTech Int'l Inc. |
Taoyuan |
|
TW |
|
|
Assignee: |
LumiTech Int'l Inc.
Taoyuan
TW
|
Family ID: |
54140848 |
Appl. No.: |
14/222268 |
Filed: |
March 21, 2014 |
Current U.S.
Class: |
34/275 |
Current CPC
Class: |
A45D 29/00 20130101;
A45D 44/00 20130101 |
International
Class: |
A45D 29/00 20060101
A45D029/00 |
Claims
1. A nail lamp device, comprising: an inner housing comprising an
inner housing substrate and an inner chamber surrounded by the
inner housing substrate, the inner chamber comprising at least one
front opening, the inner housing substrate comprising an inner
surface and an opposed outer surface, and the inner surface facing
the inner chamber; at least one chip on board (COB) light emitting
diode (LED) module, each of the COB LED modules comprising: a
heat-conductive substrate structure comprising a front side and a
back side, the back side being disposed on the inner surface of the
inner housing substrate by pasting-fitted; and a plurality of LED
elements electrically connected to the front side of the
heat-conductive substrate structure and emitting light toward the
inner chamber; a control module disposed on the outer surface of
the inner housing substrate and electrically connected to the COB
LED module, so as to control the COB LED module; and an outer
housing covering the inner housing and retaining the front opening
of the inner chamber exposed.
2. The nail lamp device according to claim 1, wherein a plurality
of through holes for wires are formed on the inner housing
substrate, and each of the COB LED modules comprises at least two
circuit terminals, such that the circuit terminals and the control
module are electrically connected with a plurality of wires passing
through the through holes for wires.
3. The nail lamp device according to claim 1, wherein the
heat-conductive substrate structure at least comprises: a metal
board having a first surface and an opposed second surface, a
plurality of projections being formed on the first surface, and the
second surface serving as the back side of the heat-conductive
substrate structure; and a circuit board having a plurality of
openings, the circuit board being disposed on the first surface of
the metal board, and surfaces of the projections being exposed via
the openings to serve as a portion of the front side of the
heat-conductive substrate structure, and the LED elements being
disposed on the surfaces of the projections and being electrically
connected to the circuit board with a plurality of wires.
4. The nail lamp device according to claim 3, wherein the metal
board is a copper substrate.
5. The nail lamp device according to claim 1, wherein the COB LED
module is secured on the inner surface of the inner housing
substrate by a locking element.
6. The nail lamp device according to claim 1, wherein a material of
the inner housing substrate is a plastic or a metal.
7. The nail lamp device according to claim 1, wherein a back edge
of the inner housing substrate extends downwards to form a back
plate opposed to the front opening.
8. The nail lamp device according to claim 1, wherein the LED
elements of each of the COB LED modules emit light having a
plurality of wavelength ranges.
9. The nail lamp device according to claim 8, wherein the
wavelength ranges of light correspond to a sort of a resin coating
or a glue coated on nails.
10. The nail lamp device according to claim 8, wherein one
wavelength range of light is between 390 nanometer and 410
nanometer, and the other wavelength range of light is between 320
nanometer and 390 nanometer.
11. The nail lamp device according to claim 1, comprising a
plurality sets of the COB LED modules, and wherein the COB LED
modules have same or different wavelength ranges of light, and the
LED elements of a same COB LED module have the same wavelength
range of light.
12. The nail lamp device according to claim 11, wherein the
wavelength range of light corresponds to a sort of a resin coating
or a glue coated on nails.
13. The nail lamp device according to claim 11, wherein one
wavelength range of light is between 390 nanometer and 410
nanometer, and the other wavelength range of light is between 320
nanometer and 390 nanometer.
14. The nail lamp device according to claim 1, wherein each of the
COB LED modules further comprises a reflective cup secured on the
heat-conductive substrate structure and facing the inner chamber,
and the reflective cup is disposed around the LED elements.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a nail lamp device, and
particularly to a nail lamp device using a chip on board (COB)
light emitting diode (LED) module as a light source.
[0003] 2. Description of the Prior Art
[0004] Beauty is human nature. As people pay more attention on
appearance, people usually put resin coatings with different colors
on nails to increase the gloss and color of nails, or use various
decorative pieces adhered on nails to enhance the richness of
Manicure design. To let resin coatings or glues coated on nails be
cured fast, a nail lamp device is used to irradiate the resin
coatings or glues, so as to accelerate the curing reaction of the
resin coatings or glues.
[0005] FIG. 1 shows a partial structural schematic view of a
conventional nail lamp device. As shown in FIG. 1, a plurality of
openings 12 are formed in an inner housing 10 of a conventional
nail lamp device, and a plurality sets of light source modules 14
are disposed on an outer top 101 and an outer side 102 of the inner
housing 10. Light produced by light sources 141 of the light source
modules 14 is projected into an inner chamber 16 of the inner
housing 10 via the openings 12. To let heat produced by the light
sources 141 of the light source modules 14 be able to be dissipated
efficiently, there is a need to dispose heat-dissipating pieces 18
or heat-dissipating fins. Such a design, which is needed to dispose
heat-dissipating pieces or heat-dissipating fins additionally,
tends to result in a heavy and inconvenient nail lamp device.
Besides, the light source 141 used conventionally is a single lamp.
A single lamp produces light with a narrow angle and low power,
which usually extends the time required for the curing reaction of
the resin coatings or glues, so that time is wasted.
SUMMARY OF THE INVENTION
[0006] To solve the above-mentioned problems, one objective of the
present invention is to provide a nail lamp device, which has a
chip on board (COB) light emitting diode (LED) module directly
disposed on an inner surface of an inner housing substrate by
pasting-fitted, such that a plurality of LED elements emit light
toward an inner chamber. Heat produced by the LED elements may be
directly dissipated to outside via a heat-conductive substrate
structure and the inner housing substrate. Thus, the present
invention has the advantage of lightness and convenience.
[0007] One objective of the present invention is to provide a nail
lamp device, which uses a COB LED module having a plurality of LED
elements arranged in array to emit light with high power, so that a
nail lamp device of the present invention can accelerate the time
required for the curing reaction of the resin coatings or glues
coated on fingers, thus meeting requirements of consumers.
[0008] One objective of the present invention is to provide a nail
lamp device, which uses a COB LED module having LED elements with
different wavelength ranges of light. Based on a sort of the resin
coatings coated by a user, the LED elements with the needed
wavelength ranges of light are driven to emit light by a control
module, thereby irradiating the resin coatings and curing the resin
coatings quickly. The present invention has the advantage that
wavelength ranges of light can be selected with high elasticity, so
as to enhance utility.
[0009] To achieve the above-mentioned objectives, a nail lamp
device of one embodiment of the present invention comprises: an
inner housing comprising an inner housing substrate and an inner
chamber surrounded by the inner housing substrate, the inner
chamber comprising at least one front opening, the inner housing
substrate comprising an inner surface and an opposed outer surface,
and the inner surface facing the inner chamber; at least one COB
LED module, each of the COB LED modules comprising: a
heat-conductive substrate structure having a front side and a back
side, the back side being disposed on the inner surface of the
inner housing substrate by pasting-fitted; and a plurality of LED
elements electrically connected to the front side of the
heat-conductive substrate structure and emitting light toward the
inner chamber; a control module disposed on the outer surface of
the inner housing substrate and electrically connected to the COB
LED module, so as to control the COB LED module; and an outer
housing covering the inner housing and retaining the front opening
of the inner chamber exposed.
[0010] Other advantages of the present invention will become
apparent from the following descriptions taken in conjunction with
the accompanying drawings wherein certain embodiments of the
present invention are set forth by way of illustration and
examples.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The foregoing aspects and many of the accompanying
advantages of this invention will become more readily appreciated
as the same becomes better understood by reference to the following
detailed descriptions, when taken in conjunction with the
accompanying drawings, wherein:
[0012] FIG. 1 shows a partial structural schematic view of a
conventional nail lamp device.
[0013] FIG. 2 shows an exploded structural schematic view of a nail
lamp device according to one embodiment of the present
invention.
[0014] FIG. 3 shows a partial structural schematic view of a nail
lamp device according to one embodiment of the present in vent
on.
[0015] FIG. 4 shows a partial structural schematic view of the COB
LED module according to one embodiment of the present
invention.
[0016] FIG. 5 shows an assembled structural schematic view of a
nail lamp device according to one embodiment of the present
invention.
[0017] FIG. 6 shows an application schematic view of a nail lamp
device according to one embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0018] Detail descriptions are as follows, and the described
preferred embodiments are only illustrating and not a limitation of
the present invention.
[0019] Referring to FIG. 2, FIG. 2 shows an exploded structural
schematic view of a nail lamp device according to one embodiment of
the present invention. As shown in FIG. 2, the nail lamp device
includes an inner housing 22, at least one COB LED module 24, a
control module 26 and an outer housing 28. In one embodiment, the
nail lamp device 20 includes a plurality sets of COB LED modules
24.
[0020] The inner housing 22 includes an inner housing substrate 30
and an inner chamber 32 surrounded by the inner housing substrate
30. The inner chamber 32 includes a front opening 321. The inner
housing substrate 30 includes an inner surface 301 and an opposed
outer surface 302, and the inner surface 301 faces the inner
chamber 32. In one embodiment, referring to FIG. 3 in conjunction,
the inner housing substrate 30 has a planar region 30a, two first
bending regions 30b which extend downward obliquely from two
opposed edges of the planar region 30a respectively, two second
bending regions 30c which extend downward obliquely from an edge of
a first bending region 30b respectively, and two securing portions
30d disposed at an edge of a second bending region 30c
respectively, but is not limited to this. A number of the bending
regions is not limited. Moreover, the overall inner housing
substrate may be designed as an arc shape. Besides, a back plate 34
is extended downward from a back edge of the inner housing
substrate 30 and is opposed to the front opening 321 (as shown in
FIG. 2). A plurality of through holes 36 for wires are formed on
the planar region 30a and the two first bending regions 30b
respectively. In one embodiment, a material of the inner housing
substrate 30 is a plastic or a metal, and the inner surface 301 of
the inner housing substrate 30 is an inner wall with a reflective
property.
[0021] As shown in FIG. 2 and FIG. 3, a plurality sets of the COB
LED modules 24 are disposed on the inner surface 301 of the inner
housing substrate 30 and are distributed on the planar region 30a
and the first bending regions 30b. The COB LED module 24 includes a
heat-conductive substrate structure 38 and a plurality of LED
elements 40. The heat-conductive substrate structure 38 includes a
front side 381 and a back side 382. Referring to FIG. 4 in
conjunction, the plurality of LED elements 40 are disposed on the
front side 381 of the heat-conductive substrate structure 38, and
the COB LED module 24 is disposed on the inner surface 301 of the
inner housing substrate 30 with the back side 382 of the
heat-conductive substrate structure 38 thereof pasting-fitted to
the inner surface 301, such that the plurality of LED elements 40
emit light toward the inner chamber 32. In one embodiment, the COB
LED module 24 is secured on the inner surface 302 of the inner
housing substrate 30 by locking elements 42, such as a plurality of
screws. Moreover, each set of the COB LED module 24 includes two
circuit terminals 44 (as shown in FIG. 4).
[0022] Continuing to refer to FIG. 2 and FIG. 3, the control module
26 is disposed on the outer surface 302 of the inner housing
substrate 30. The two circuit terminals 44 (as shown in FIG. 4) of
each set of the COB LED module 24 are electrically connected to the
control module 26 with a wire 46 passing through the through hole
36 for wires respectively, and light emitting of the COB LED module
24 is controlled by the control module 26.
[0023] Continuing with the foregoing descriptions, in one
embodiment, as shown in FIG. 4, the heat-conductive substrate
structure 38 includes a metal board 52 and a circuit board 54. The
metal board 52 has a first surface 521 and an opposed second
surface 522. A plurality of projections 523 are formed on the first
surface 521. Moreover, the circuit board 54 has a plurality of
openings 541, which positions correspond to the positions of the
projections 523. In addition, the circuit board 54 is disposed on
the first surface 521 of the metal board 52, and surfaces of the
projections 523 are exposed via the openings 541. A second surface
522 of the metal board 52 serves as the back side 382 of the
overall heat-conductive substrate structure 38, so as to be
disposed on the inner surface 301 (as shown in FIG. 3) of the inner
housing substrate 30 (as shown in FIG. 3) by pasting-fitted. In one
embodiment, the exposed surfaces of the projections 523 are in
plane with the surface of the circuit board 54, so as to commonly
serve as the front side 381 of the heat-conductive substrate
structure 38. The plurality of LED elements 40 are disposed on the
exposed surfaces of the projections 523, and are electrically
connected to the circuit board 54 with a plurality of wires 56. In
one embodiment, the metal board 52 is a copper substrate.
[0024] FIG. 5 shows an assembled structural schematic view of a
nail lamp device according to one embodiment of the present
invention. Referring to FIG. 2 and FIG. 5 in conjunction, a shape
of the outer housing 28 corresponds to the geometry of the inner
housing 22, and the outer housing 28 covers the inner housing 22
and retains the front opening 321 exposed. After resin coatings or
glues are coated on nails 48 by a user, as shown in FIG. 6, the
user only needs to put fingers 50 into the inner chamber 32 through
the front opening 321, and drive the COB LED modules 24 to emit
light by an exposed control switch (not shown) of the control
module 26 (as shown in FIG. 5), and the resin coatings or glues on
the fingers 50 may be cured quickly.
[0025] Moreover, in the present invention, the plurality of LED
elements 40 of each of the COB LED modules 24 may be selected to
have a same wavelength range of light, or have many different'
wavelength ranges of light. A selection of the wavelength ranges of
light may depend on a sort of a resin coating or a glue selected to
be used on nails. In one embodiment, the plurality of LED elements
40 of a single COB LED module 24 may be selected to have two
wavelength ranges of light. One wavelength range is between 390
nanometer and 410 nanometer, and the other wavelength range is
between 320 nanometer and 390 nanometer.
[0026] On the other hand, if the plurality of LED elements 40 of a
single COB LED module 24 all use a same wavelength range of light,
a plurality sets of the COB LED modules 24 having different
wavelength ranges of light may be selected to be distributed on the
inner surface 301 (as shown in FIG. 3) of the inner housing
substrate 30 (as shown in FIG. 3). In one embodiment, a plurality
sets of single COB LED module 24 may be selected to have two
wavelength ranges of light. One wavelength range is between 390
nanometer and 410 nanometer, and the other wavelength range is
between 320 nanometer and 390 nanometer.
[0027] In yet one embodiment, each of the COB LED modules may
further includes a reflective cup secured on the heat-conductive
substrate structure and facing the inner chamber, and the
reflective cup is disposed around the LED elements to enhance a
strength of the light of the LED elements in a front direction.
[0028] In the present invention, each of the COB LED modules is
directly disposed on the inner surface of the inner housing
substrate by pasting-fitted, such that a plurality of LED elements
emit light toward the inner chamber. Heat produced by the LED
elements may be directly dissipated to outside via the
heat-conductive substrate structure and the inner housing
substrate. Such a design uses the inner housing substrate to
provide a reflective property and a heat-dissipating function,
eliminating a need of a conventional nail lamp device to dispose
heat-dissipating pieces or heat-dissipating fins, so that the
present invention has the advantage of lightness and convenience.
Furthermore, since each set of the COB LED modules has a plurality
of LED elements arranged in array to emit light with high power, a
nail lamp device of the present invention can accelerate the time
required for the curing reaction of the resin coatings or glues
coated on fingers, thus meeting requirements of consumers. Besides,
in the present invention, since the COB LED module has LED elements
with different wavelength ranges of light, based on a sort of the
resin coating coated by a user, the LED elements with the needed
wavelength ranges of light are driven to emit light by a control
module, thereby irradiating the resin coating and curing the resin
coating quickly. Thus, the present invention also has the advantage
that the wavelength ranges of light can be selected with high
elasticity, so as to enhance utility.
[0029] While the invention can be subject to various modifications
and alternative forms, a specific example thereof has been shown in
the drawings and is herein described in detail. It should be
understood, however, that the invention is not to be limited to the
particular form disclosed, but on the contrary, the invention is to
cover all modifications, equivalents, and alternatives falling
within the spirit and scope of the appended claims.
[0030] Although the present invention has been explained in
relation to its preferred embodiment, it is to be understood that
other modifications and variation can be made without departing
from the spirit and scope of the invention as hereafter
claimed.
* * * * *