U.S. patent application number 14/723626 was filed with the patent office on 2015-09-17 for epitaxial growth systems.
The applicant listed for this patent is EPISTAR CORPORATION. Invention is credited to Chung-Ying CHANG, Tzu-Ching YANG.
Application Number | 20150259826 14/723626 |
Document ID | / |
Family ID | 50605264 |
Filed Date | 2015-09-17 |
United States Patent
Application |
20150259826 |
Kind Code |
A1 |
YANG; Tzu-Ching ; et
al. |
September 17, 2015 |
EPITAXIAL GROWTH SYSTEMS
Abstract
Disclosed is about an epitaxial growth system, including an
epitaxial growth reactor chamber; a susceptor disposed in the
epitaxial growth reactor chamber, wherein the susceptor includes a
top surface and a side surface; a plurality of wafer fixing
elements disposed on the top surface, and each of the wafer fixing
elements has a boundary; a plurality of first heating elements
directly under the susceptor arranged in parallel to the top
surface; and a second heating element disposed directly under the
outermost first heating element; wherein no other heating elements
are disposed directly under the first heating elements other than
the outermost first heating element; and wherein the first and the
second heating elements are independently controllable.
Inventors: |
YANG; Tzu-Ching; (Hsinchu,
TW) ; CHANG; Chung-Ying; (Hsinchu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
EPISTAR CORPORATION |
Hsinchu |
|
TW |
|
|
Family ID: |
50605264 |
Appl. No.: |
14/723626 |
Filed: |
May 28, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13021330 |
Feb 4, 2011 |
9068264 |
|
|
14723626 |
|
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Current U.S.
Class: |
118/725 |
Current CPC
Class: |
C30B 25/12 20130101;
C23C 16/4585 20130101; C30B 25/10 20130101; C23C 16/4586
20130101 |
International
Class: |
C30B 25/10 20060101
C30B025/10; C30B 25/14 20060101 C30B025/14; C30B 25/12 20060101
C30B025/12 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 4, 2010 |
TW |
099202372 |
Claims
1. An epitaxial growth system, comprising: an epitaxial growth
reactor chamber; a susceptor disposed in the epitaxial growth
reactor chamber, wherein the susceptor includes a top surface and a
side surface; a plurality of wafer fixing elements disposed on the
top surface, and each of the wafer fixing elements has a boundary;
a plurality of first heating elements directly under the susceptor
arranged in parallel to the top surface; and a second heating
element disposed directly under the outermost first heating
element; and no other heating elements are disposed directly under
the first healing elements other than the outermost first heating
element; wherein the first and the second heating elements are
independently controllable.
2. The system as claimed in claim 1, further comprising a rotation
device connected to a geometry center of the susceptor.
3. The system as claimed in claim 1, further comprising a plurality
of gas input elements disposed in the epitaxial growth reactor
chamber for providing process gases during an epitaxy process.
4. The system as claimed in claim 1, wherein the susceptor
comprises: a first sidewall corresponding to the outermost first
heating element; and a second sidewall not corresponding to the
outermost first heating element; wherein the first sidewall is
thinner than the second sidewall.
5. The system as claimed in claim 1, wherein an edge part of the
susceptor corresponding to the outermost first heating element of
the first heating elements is thinner than a part of the susceptor
not corresponding to the outermost first heating element.
6. The system as claimed in claim 1, wherein a first minimum
distance between the second heating element and the side surface is
greater than or equal to a second minimum distance between the
boundary of the outermost wafer fixing element and the side
surface; and a difference between the first minimum distance and
the second minimum distance is less than or equal to 5 mm.
7. The system as claimed in claim 1, wherein each of the first
heating elements is apart from the top surface with a first
distance, and the first distances of the first heating elements are
substantially the same.
8. An epitaxial growth system, comprising: an epitaxial growth
reactor chamber; a susceptor disposed in the epitaxial growth
reactor chamber, wherein the susceptor includes a top surface and a
side surface; a plurality of wafer fixing elements disposed on the
top surface, and each of the wafer fixing elements having a
boundary; a plurality of first heating elements being apart from
the top surface with a first distance, wherein the first distances
of the first healing elements are substantially the same; a second
heating element being apart from the top surface with a second
distance less than the first distance; and a third heating element
directly under the second healing element, and no other heating
elements are disposed directly under the plurality of first heating
elements other than the second heating element; wherein the first,
the second and the third heating elements are independently
controllable.
9. The system as claimed in claim 8, wherein a first minimum
distance between the second heating element and the side surface is
greater than or equal to a second minimum distance between the
boundary of the outermost wafer fixing element and the side
surface; and a difference between the first minimum distance and
the second minimum distance is less than or equal to 5 mm.
10. The system as claimed in claim 8, further comprising a rotation
device connected to a geometry center of the susceptor.
11. The system as claimed in claim 8, further comprising a
plurality of gas input elements disposed in the epitaxial growth
reactor chamber for providing process gases during an epitaxy
process.
12. The system as claimed in claim 8, wherein the susceptor
comprises: a first sidewall corresponding to the second heating
element; and a second sidewall not corresponding to the second
heating element; wherein the first sidewall is thinner than the
second sidewall.
Description
REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation application of U.S.
patent application Ser. No. 13/021,330, entitled "EPITAXIAL GROWTH
SYSTEMS", filed Feb. 4, 2011, now pending, which claims the right
of priority based on Taiwan application Serial No. 099202372, filed
on Feb. 4, 2010, and the entire contents of both applications are
hereby incorporated by reference.
TECHNICAL FIELD
[0002] The disclosure relates to an epitaxial growth system, and
more particularly to an epitaxial growth system with high heating
uniformity.
DESCRIPTION OF BACKGROUND ART
[0003] The semiconductor optoelectronic devices contribute to data
transmission and energy conversion along with the advance of
technology. For example, the semiconductor optoelectronics devices
can be applied in systems such as the optical fiber communication,
optical storage, military system, and the like. In general, the
processes of forming semiconductor optoelectronic devices include
forming wafer, growing epitaxy layers, growing, thin films,
diffusion/ion implantation, photolithography, etching, and the
like.
[0004] In the described processes, growing epitaxy layers are
generally performed by a chemical vapor deposition (CVD) system or
a molecular beam epitaxy (MBE) system. The CVD system is preferred
in this industry because of its faster production rate compared
with the MBE system.
[0005] FIG. 1 shows a cross-sectional diagram of major parts of a
conventional epitaxial growth system chemical vapor deposition
system 1 for semiconductor optoelectronic devices. In system 1, a
base plate 101 is combined with an enclosure 102 to form a sealed
reactor chamber 103. A susceptor 104 is contained in the reactor
chamber 103. The susceptor 104 has a horizontal supporting surface
105 with a plurality of wafer fixing elements (not shown) thereon.
The wafer fixing elements fix a plurality of wafers 106 on the sup
eating surface 105, and the fixed wafers 106 can be subsequently
processed by epitaxial growth. In addition, several inductive coils
107 are disposed under the supporting surface 105 to heat the
wafers thereon. The inductive coils 107 are supplied with
electricity, and thereby form an electromagnetic induction to heat
the wafer 106 on the susceptor 104. In this system, the inductive
cells 107 are arranged in curve relative to the supporting surface
105. Therefore, the wafers 106 can be uniformly heated by the
inductive coils 107. In other words, a rotation device 108 is set
as a reference to separate the inductive coils 107 to left and
right parts. The remote portion of the inductive coils 107 (far
away from the reference) are apart from the supporting surface 105
with a shorter distance, and the center portion of the inductive
coils 107 (near the reference) are apart from the supporting
surface 105 with a larger distance. In addition, the rotation
device 108 is connected to the center of the susceptor 104 such
that the susceptor 104 can be rotated. Therefore, the wafers 106
fixed on different locations of the susceptor 104 can be heated
with higher uniformity. The internal part of the rotation device
108 can be further connected to a gas line 109, thereby connecting
to an external gas supply system. The gas line is used to input a
gas to the reactor chamber for the epitaxial growth.
Simultaneously, the susceptor 104 is rotated by the rotation device
108, and uniformly heated by the lower heating system. Afterwards,
an epitaxy layer is formed on the surface of the wafers 106.
[0006] In the conventional epitaxial growth system 1 for
semiconductor optoelectronic devices, the upper wafers 106 are
heated by electromagnetic induction of the inductive coils 107. The
inductive coils 107 are arranged in curve related to the supporting
surface 105. The curved degree of the arrangement is defined by the
distance between the inductive coils 107 and the upper wafers 106,
and the density of the arrangement is defined by the distance of
the inductive coils therebetween. The temperature uniformity
depends on the curved degree and the density of the arrangement so
the temperature tuning is quite complicated. When the device
material and/or the epitaxy reaction temperature are changed, the
whole arrangement of the inductive coils 107 has to be
correspondingly tuned. Moreover, if the temperature uniformity of
the wafers 106 is tuned by increasing/decreasing the applied
electromagnetic energy, the temperature is dramatically interfered
with the circumstance temperature. In short, it is difficult to
control the healing uniformity of the wafers 106.
SUMMARY OF THE DISCLOSURE
[0007] The present disclosure provides several epitaxial growth
systems.
[0008] An epitaxial growth system in accordance with an embodiment
of the disclosure includes an epitaxial growth reactor chamber; a
susceptor disposed in the epitaxial growth reactor chamber, wherein
the susceptor includes a top surface and a side surface; a
plurality of wafer fixing elements disposed on the top surface, and
each of the wafer fixing elements has a boundary: a plurality of
first heating elements directly under the susceptor arranged in
parallel to the top surface; and a second healing element disposed
directly under the outermost first heating element; wherein no
other heating elements are disposed directly under the first
heating elements other than the outermost first heating element;
and wherein the first and the second healing elements are
independently controllable.
[0009] An epitaxial growth system in accordance with an embodiment
of the disclosure includes an epitaxial growth reactor chamber; a
susceptor disposed in the epitaxial growth reactor chamber, wherein
the susceptor includes a top surface and a side surface; a
plurality of wafer fixing elements disposed on the top surface, and
each of the wafer fixing elements having a boundary; a plurality of
first heating elements being apart from the top surface with a
first distance, wherein the first distances of the first heating
elements are substantially the same; a second heating element being
apart from the top surface with a second distance less than the
first distance; and a third heating element directly under the
second heating element, and no other heating elements are disposed
directly under the plurality of first heating elements other than
the second heating element; wherein the first, the second and the
third heating elements are independently controllable.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 illustrates a conventional epitaxial growth system
for semiconductor optoelectronic devices;
[0011] FIG. 2 illustrates an epitaxial growth system for
semiconductor optoelectronic devices in accordance with an
embodiment of the disclosure.
[0012] FIG. 3 illustrates a partial enlarged diagram of an
epitaxial growth system for semiconductor optoelectronic devices in
accordance with an embodiment of the disclosure;
[0013] FIGS. 4A-4B illustrate partial lop views of susceptors of
epitaxial growth systems for semiconductor optoelectronic devices
in accordance with embodiments of the disclosure; and
[0014] FIGS. 5A-5H illustrate partial enlarged diagrams of healing
parts of epitaxial growth systems for semiconductor optoelectronic
devices in accordance with embodiments of the disclosure.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0015] The embodiments are described hereinafter in accompany with
drawings.
[0016] FIG. 2 shows a major reactor part of an epitaxial growth
system 2 for semiconductor optoelectronic devices in one embodiment
of the disclosure. In the epitaxial growth system 2, a base plate
201 is combined with an enclosure 202 to form a sealed reactor
chamber 203. The epitaxial growth is performed in the reactor
chamber 203. A susceptor 204 is contained in the reactor chamber
203. The susceptor 201 has a horizontal supporting surface 205 with
a plurality of water fixing elements (not shown) thereon. The wafer
fixing elements fix a plurality of wafers 206 on the supporting
surface 205. Several first heating elements 207 are disposed under
the supporting surface 205 of the epitaxial growth system 2, and
the first heating elements 207 are substantially arranged in
parallel to the supporting surface 205. For example, the first
heating elements can be tungsten healing lines and the like. The
temperature of the tungsten heating lines is increased during a
heating process, such that a temperature difference is occurred
between the tungsten heating lines and the upper susceptor 204. The
heat can be transferred from the first heating elements 207 to the
susceptor 204 by convection and/or radiation. Because the heating
process is based on the temperature difference, the temperature
control of the upper susceptor is easier. As a result, the
arrangement of the first heating elements 207 can be simple, and
there is no need to have a complicated geometry shape (e.g. curve
in FIG. 1). Furthermore, the first healing elements 207 can be
optionally connected to different temperature controllers (not
shown) set by segment, thereby heating the first heating elements
207 to different temperatures, respectively. The temperature of the
first heating elements 207 can be directly tuned by different
temperature controllers to uniformly heating the wafers 206.
Similarly, the rotation device 208 set in geometry center of the
susceptor 204 may rotate the susceptor 204, and the wafers 206 on
different locations of the susceptor 204 are heated with higher
uniformity. The internal part of the reactor chamber 203 can be
further connected to gas lines 209, thereby connecting to an
external gas supply system. The gas lines 209 are used to input a
gas to the reactor chamber 203 for the epitaxial growth.
Simultaneously, the susceptor 204 is rotated by the rotation device
208, and uniformly healed by the lower heating system. Afterwards,
an epitaxy layer is formed on the surface of the wafers 206.
[0017] FIG. 3 shows a partial enlarged diagram of the epitaxial
growth system 2 in one embodiment of the disclosure. Obviously, the
susceptor 204 includes a supporting surface 205, and the first
heating elements 207 are disposed under and arranged in parallel to
the susceptor 204. The epitaxial growth system efficiency is
determined by the number of the wafers fixed on the supporting
surface 205 per process. In other words, the wafers should be
arranged in densest way to occupy the maximum area of the
supporting surface 205. Accordingly, if the boundary 212 of the
wafer fixing elements 210 and the rim 211 of the supporting surface
205 are closer, the utilization of the surface area of the
susceptor 204 is higher.
[0018] FIG. 4A shows a top view of a supporting surface 405 in one
embodiment of the disclosure. Several wafers 406 are disposed on
the supporting surface 405 for epitaxial growth. In this manner,
wafer fixing elements (not shown) are disposed on the supporting
surface 405, such as cavities corresponding to a wafer shape, to
hold and fix the wafers.
[0019] For enhancing the surface area utilization of the susceptor,
FIG. 4B shows a top view of another supporting surface 405 in one
embodiment of the disclosure. The wafers 406 are much densely
arranged on the supporting surface 405 for epitaxial growth. In
this manner, wafer fixing elements (not shown) are disposed on the
supporting surface 405, such as cavities corresponding to a wafer
shape, to hold and fix the wafers. The difference between FIGS. 4A
and 4B is the number of wafers on the supporting surface. The area
utilization of the susceptor 405 in FIG. 4B is higher than that of
FIG. 4A. The number of wafers 406 is thirty-one in FIG. 4A and
thirty-seven in FIG. 4B, respectively. In FIG. 4B, the boundary 412
of the outermost wafer fixing element is closer to the rim 411 of
the supporting surface 405. In other word, the wafers occupy more
area of the supporting surface 405 in FIG. 4B.
[0020] FIGS. 5A and 5B show different heating structures
corresponding to the embodiment shown in FIG. 4B. As described
above, the boundary 412 of the outermost wafer fixing element 410
should be close to the rim 411 of the supporting surface 405 so the
area utilization of the susceptor surface is improved. However, the
susceptor 404 has an unavoidable thickness. The first heating
element 407 and the susceptor 404 must have a safety distance to
prevent the first heating element 407 from damaging the susceptor
404 during heating process. FIG. 5A shows part of the heating
structure close to the rim 411 of the supporting surface 405. In
FIG. 5A, a wafer fixing element 410 is disposed on the supporting
surface 405, and the wafer fixing element 410 has a closest
approach (e.g. boundary 412) to the rim 411 of the supporting
surface 405, wherein the boundary 412 and the rim 411 have a
minimum distance D. Several first healing elements 407, four in
this embodiment, are disposed under the susceptor 404 and arranged
in parallel to the supporting surface 405. Considering the sidewall
thickness of the susceptor 404 and the safety distance between the
first heating elements 407 and the susceptor 404, the first heating
element 407 and the rim 411 should have a minimum distance L.
Because the sidewall of the susceptor limits the location of the
first heating element 407, the minimum distance L cannot be less
than the minimum distance D. As proven in experiments, the
difference between the minimum distances L and D is less than or
equal to 5 mm and greater than or equal to 0, in the condition of
the minimum distance L greater than or equal to the minimum
distance D, so the outermost pan of the wafers (i.e. the boundary
412 of the wafer fixing element 410) are sufficiently heated for
the epitaxial growth. Moreover, several second heating elements 413
can be further disposed under the first healing elements 407 and
arranged vertically to the supporting surface 405. The second
heating elements 413 may assist in providing heat to the side of
the susceptor, such that the temperature of the side of the
susceptor and the whole temperature uniformity are less influenced
by the radiated cooling in the circumstance. Note that the first
heating elements 407 and the second heating elements 413 can be
selectively heated by different temperature controllers,
respectively, such that the wafers has higher heating uniformity
due to different temperature adjustment by segment. In this
embodiment, the susceptor 404 can be a thermally conductive
material, such as silicon carbide, graphite, boron nitride, or
combinations thereof. The first and/or second heating elements can
be a thermally stable material, such as tungsten heating lines.
[0021] FIG. 5B shows part of the heating structure close to the rim
411 of the supporting surface 405 in another embodiment of the
disclosure. In FIG. 5B, a wafer fixing element 410 is disposed on
the supporting surface 405, and the wafer fixing element 410 has a
closest approach (e.g. boundary 412) to the rim 411 of the
supporting surface 405, wherein the boundary 412 and the rim 411
have a minimum distance D. Several first heating elements 407,
three in this embodiment, are disposed under the susceptor 404 and
arranged in parallel to the supporting surface 405. In addition, a
second heating element 407' is further disposed near the rim 411 of
the supporting surface 405. Compared with the first heating element
407, the second heating element 407' is closer to the supporting
surface 405. Therefore, the upper wafers near the rim 411 can be
sufficiently heated by the closer healing source (e.g. the second
heating element 407').
[0022] Moreover, several third heating elements 414 can be further
disposed under the second heating elements 407' and arranged
vertically to the supporting surface 405. The third heating
elements 414 may assist in providing heat to the side of the
susceptor, such that the temperature of the side of the susceptor
and the whole temperature uniformity are less influenced by the
radiated cooling in the circumstance. Note that the first heating
elements 407, the second heating element 407', and the third
heating elements 413 can be selectively heated by different
temperature controllers, respectively, such that the wafers has
higher heating uniformity due to different temperature adjustment
by segment. Similarly, considering the sidewall thickness of the
susceptor 404 and the safety distance between the second healing
element 407' and the susceptor 404, the second healing element 407'
and the rim 411 should have a minimum distance L' Because the
sidewall of the susceptor limits the location of the second healing
element 407', the minimum distance L' cannot be less than the
minimum distance D. As proven in experiments, the difference
between the minimum distances L' and D is less than or equal to 5
mm and greater than or equal to 0, in the condition of the minimum
distance L' greater than or equal to the minimum distance D. In
those experiments, the outermost part of the wafers and the rim 411
of the wafer fixing element 410 are sufficiently heated to process
the epitaxial growth. In this embodiment, the susceptor 404 can be
a thermally conductive material, such as silicon carbide, graphite,
boron nitride, or combinations thereof. The first, second, and/or
third heating elements can be a thermally stable material, such as
tungsten heating lines.
[0023] As shown in the described embodiments, the boundary 412 of
the wafer fixing elements and the rim 411 of the supporting surface
have a minimum distance D, and the first heating element may align
with the boundary 412 of the wafer fixing elements. Preferably, D
is a minimum value and L is equal to D. When the distance D between
the outermost boundary 412 of the wafer fixing element 410 and the
rim 411 of the supporting surface is minimized, it is dangerous to
dispose the first healing element 407 under the susceptor 404 and
aligning to the rim 411 of the supporting surface. The danger is
caused by luck of the safety distance between the sidewall of the
susceptor 404 and the first heating element 407. To overcome the
safety problems, the described system is further adjusted in other
embodiments. As shown in FIGS. 5C and 5D, part of the sidewall 415
of the susceptor 404 corresponding to the outermost first heating
element 407 (or second heating element 407') is thinner than
another part of the sidewall 416 of the susceptor 404 distanced
away from the thinner part of the sidewall 415 and not
corresponding to the outermost first heating element 407 (or second
heating element 407'). As such, the outermost first heating element
407 (or second healing element 407') can be disposed farther to
align the boundary 412 of the wafer fixing elements. Therefore, the
wafers surface is heated with higher uniformity.
[0024] In other embodiment, an edge part 417 of the susceptor 404
corresponding to the outermost first heating element 407 is thinner
than another part 418 of the susceptor 404, as shown in FIG. 5E.
Similarly, an edge part 417 of the susceptor 404 corresponding to
the second heating element 407' is thinner than another part 418 of
the susceptor 404, as shown in FIG. 5F. The thinner edge 417 (as
shown in FIGS. 5E-5F) can be combined with the thinner sidewall 415
(as shown in FIGS. 5C-5D) to form the susceptors 404 as shown in
FIGS. 5G-5H.
[0025] More specifically, with reference to FIG. 5H, several first
heating elements 407 are disposed under the susceptor 404 and
arranged in parallel to the supporting surface 405. Each of the
first heating elements 407 is apart from the supporting surface 405
with a first distance and the first distance for each of the first
heating elements 407 to the supporting surface 405 are
substantially the same. The second heating element 407' is disposed
near the rim 411 of the supporting surface 405, and compared with
the first healing element 407, the second heating element 407' is
closer to the supporting surface 405. Moreover, several third
heating elements 414 are disposed under the second heating elements
407' and arranged in a direction vertically to the supporting
surface 405. The third heating elements 414 may assist in providing
heat to the side of the susceptor 404, such that the temperature of
the side of the susceptor 404 and the whole temperature uniformity
are less influenced by the radiated cooling in the circumstance.
The wafer fixing element 410 is disposed on the supporting surface
405, and the wafer fixing element 410 has a closest approach (e.g.
boundary 412) to the rim 411 of the supporting surface 405, wherein
the boundary 412 and the rim 411 have a minimum distance D. The
second heating element 407' and the rim 411 should have a minimum
distance L'.
[0026] In the disclosure, the first heating elements are disposed
under and arranged in parallel to the susceptor, such that the
upper wafers can be directly heated with higher uniformity. In
addition, the waters can be effectively arranged on the supporting
surface by adjusting the relative position of the lower healing
element boundary and the upper wafer fixing element boundary. In
conclusion, the disclosure improves the mass production.
[0027] The foregoing description has been directed lo the specific
embodiments of this disclosure. It is apparent; however, that other
alternatives and modifications may be made to the embodiments
without escaping the spirit and scope of the disclosure.
* * * * *