U.S. patent application number 14/718191 was filed with the patent office on 2015-09-10 for multiple layer card circuit boards.
The applicant listed for this patent is Dynamics Inc.. Invention is credited to Gautam Batra, David Joseph Hartwick.
Application Number | 20150254546 14/718191 |
Document ID | / |
Family ID | 49777086 |
Filed Date | 2015-09-10 |
United States Patent
Application |
20150254546 |
Kind Code |
A1 |
Hartwick; David Joseph ; et
al. |
September 10, 2015 |
MULTIPLE LAYER CARD CIRCUIT BOARDS
Abstract
A powered card may include a circuit board with multiple layers,
and may include multiple reader communication devices. One of the
layers may include an RFID antenna. The layer including the RFID
antenna may occupy an entire region of a card outside of a region
including a magnetic stripe communication device.
Inventors: |
Hartwick; David Joseph;
(Aliquippa, PA) ; Batra; Gautam; (Sunnyvale,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dynamics Inc. |
Cheswick |
PA |
US |
|
|
Family ID: |
49777086 |
Appl. No.: |
14/718191 |
Filed: |
May 21, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13770553 |
Feb 19, 2013 |
9064195 |
|
|
14718191 |
|
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61666553 |
Jun 29, 2012 |
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Current U.S.
Class: |
235/493 ; 428/43;
428/473.5 |
Current CPC
Class: |
B32B 27/281 20130101;
B32B 2425/00 20130101; G06K 19/0702 20130101; B32B 2307/20
20130101; G06K 19/06206 20130101; Y10T 428/31721 20150401; B32B
3/266 20130101; G06K 19/07749 20130101; Y10T 428/15 20150115; B32B
2457/08 20130101; B32B 27/06 20130101; G06K 19/07722 20130101; G06K
19/042 20130101; G06K 19/07707 20130101 |
International
Class: |
G06K 19/077 20060101
G06K019/077; B32B 27/28 20060101 B32B027/28; B32B 27/06 20060101
B32B027/06; B32B 3/26 20060101 B32B003/26; G06K 19/06 20060101
G06K019/06; G06K 19/04 20060101 G06K019/04 |
Claims
1-19. (canceled)
20. A device comprising: a first layer including a first area, and
a second area, and a second layer including a first electrically
non-conductive area, and a third area, wherein said third area is
aligned with said second area and said first electrically
non-conductive area is aligned with said first area.
21. The device of claim 20, wherein at least a portion of said
first area includes a first component.
22. The device of claim 20, further comprising an intermediate
layer disposed between said first layer and said second layer.
23. The device of claim 20, wherein said first electrically
non-conductive area includes an absence of any material.
24. The device of claim 20, wherein said first electrically
non-conductive area includes one or more cutouts.
25. The device of claim 20, wherein at least a portion of said
first area includes a first component, said first electrically
non-conductive area includes one or more cutouts, and said one or
more cutouts are aligned with said first component.
26. The device of claim 20, wherein said first electrically
non-conductive area includes a substrate without metallization.
27. The device of claim 20, wherein said first electrically
non-conductive area includes a polyimide sheet.
28. The device of claim 20, wherein at least one of said first
area, said second area, and said third area include one or more
additional components.
29. The device of claim 20, wherein said first component is a
magnetic stripe communication device.
30. The device of claim 20, wherein said first layer and said
second layer each independently comprise one or more sublayers.
31. The device of claim 20, further comprising: an intermediate
layer disposed between said first layer and said second layer,
wherein said first layer, said second layer, and said intermediate
layer each independently comprise one or more sublayers.
32. A circuit board comprising: a first layer including a magnetic
stripe communication device; a second layer; and a third layer,
wherein the second layer is between the first layer and the third
layer, and the third layer does not overlap a region of the circuit
board including the magnetic stripe communication device.
33. A device comprising: a circuit board including a first layer, a
second layer, and a third layer, wherein the second layer is
between the first layer and the third layer, a magnetic strip
communication device extends through the first layer, and the third
layer does not overlap a region of the card including the magnetic
stripe communication device.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 61/666,553, titled "MULTIPLE LAYER CARD
CIRCUIT BOARDS," filed Jun. 29, 2012 (Attorney Docket No. D/095
PROV), which is hereby incorporated by reference herein in its
entirety.
BACKGROUND OF THE INVENTION
[0002] Example embodiments relate to transaction cards, devices and
transaction systems.
SUMMARY OF THE INVENTION
[0003] A card may include a dynamic magnetic communications device.
Such a dynamic magnetic communications device may take the form of
a magnetic encoder or a magnetic emulator. A magnetic encoder may
change the information located on a magnetic medium such that a
magnetic stripe reader may read changed magnetic information from
the magnetic medium. A magnetic emulator may generate
electromagnetic fields that directly communicate data to a magnetic
stripe reader. Such a magnetic emulator may communicate data
serially to a read-head of the magnetic stripe reader. A magnetic
emulator may include one or more coils. Each coil may be utilized
to communicate a particular track of magnetic stripe data to a
magnetic stripe track read-head of a magnetic stripe reader. For
example, two coils may be utilized to communicate two tracks of
magnetic stripe data to two read-heads inside a read-head
housing.
[0004] A dynamic magnetic stripe communications device may be
fabricated and assembled on one board at one facility (e.g., as a
component of a card) while a different facility may fabricate and
assemble a different board with, for example, a card's processor,
dynamic magnetic communications device driver circuitry, user
interfaces, read-head detectors, light emitting devices, displays,
batteries, and any other type of sensor, device, or associated
circuitry. The facility fabricating the board having a card's
primary circuitry may receive the board having the dynamic magnetic
stripe communications device from a different facility and a
battery, and may assemble the two boards and the battery
together.
[0005] The combined electronics package may then, for example, be
provided to a lamination facility for lamination. Alternatively,
for example, lamination may occur at the facility that assembled
the dynamic magnetic stripe communications device board and the
primary circuit board together. The laminated card may then be
provided to a personalization facility for personalization. During
personalization, for example, a customer's personal data may be
placed on the exterior of the card (e.g., printed, embossed, or
laser etched) as well as programmed into a processor's memory.
[0006] The primary circuit boards for different types of cards may
be manufactured independently of the dynamic magnetic
communications devices. Accordingly, different facilities may be
dedicated to manufacturing different types of cards. One facility,
for example, may be dedicated to the manufacture of primary card
boards for payment cards having displays. Another facility, for
example, may be dedicated to the manufacture of primary card boards
for security cards not having any displays. In this manner, dynamic
magnetic stripe communications devices may be fabricated at
dedicated facilities in high volume. These dynamic magnetic stripe
communication devices may then be shipped to the various other
facilities fabricating the primary boards for different types of
cards.
[0007] In manufacturing multiple boards dedicated to particular
functions, and later assembling these multiple boards together, for
example, the reliability of the different boards may be tested
separately before assembling. Additionally, for example, the
dynamic magnetic communication device boards may be fabricated in a
higher volume than the boards for the circuitry of any one card. In
doing so, the costs associated with the fabrication of dynamic
magnetic communication device boards may be decreased.
[0008] A primary circuit board may include multiple layers (e.g.,
three layers) and may be configured to support multiple devices.
For example, a multi-layer circuit board may include a processor, a
display, driving circuitry, buffer circuitry, buttons, a memory, a
battery, a radio frequency identification (RFID) chip (and
associated circuitry), an integrated circuit (IC) chip (and
associated circuitry), external connectors, ports, antennas,
electromagnetic field generators (and associated circuitry),
read-head detectors and/or the like.
[0009] The buttons (e.g., one or more buttons) may be part of the
primary circuit board and/or may be separate components. The
buttons may each be associated with a different transaction account
or feature. Alternatively, for example, a card may include a single
button, but that single button may be used to, for example, toggle
between multiple products.
[0010] The processor may be any type of processing device and may
include on-board memory for storing information. Any number of
components may communicate with the processor. For example, one or
more displays may be coupled to the processor. A display driver
circuit may be coupled between the display and the processor. A
memory may be coupled to the processor. The memory may store data
such as discretionary data codes associated with buttons of a card.
Discretionary data codes may be recognized by remote servers to
effect particular actions. For example, a discretionary data code
may be stored in the memory and may be used to cause a third party
service feature to be performed by a remote server.
[0011] A card may include any number of reader communication
devices. For example, a card may include an IC chip (which may be
implemented by the processor), an RFID chip and/or a magnetic
stripe communications device. The IC chip (e.g., an EMV chip) may
be used to communicate information to an IC chip reader through a
connector (contact) or antenna (contactless). The RFID chip may be
used to communicate information to an RFID reader via an antenna.
The magnetic stripe communications device may be included to
communicate information to a magnetic stripe reader. For example, a
magnetic stripe communications device may provide electromagnetic
signals to a magnetic stripe reader.
[0012] The multiple layer circuit board may include read head
detectors configured to sense the presence of a magnetic stripe
reader (e.g., a read-head housing of a magnetic stripe reader).
Information sensed by the read-head detectors may be communicated
to the processor to cause the processor to communicate information
serially from electromagnetic generators to magnetic stripe track
receivers in a read-head housing of a magnetic stripe reader.
Driving circuitry may be utilized by the processor, for example, to
control the electromagnetic generators.
[0013] A circuit board with multiple layers may include devices
distributed across the layers in order to maintain thickness
targets, avoid and/or prevent interference between components,
improve device performance and/or the like. For example, a first
layer of a circuit board may include an RFID chip, buttons, a
processor, an IR transceiver, an application specific integrated
circuit associated with a dynamic magnetic stripe communications
device, battery pads, a test/communication port (e.g., a JTAG
port), an EMV buffer, supporting circuitry, backers and/or the
like. A second layer may include copper supports for the port, a
copper pad operable as a die foundation for the on-board wire
bonded ASIC of the first layer, head readers (e.g., e-sense pads),
supporting circuitry, backers and/or the like. A third layer may
include an external connector (e.g., an EMV connector), an RFID
antenna, supporting circuitry, backers and/or the like.
[0014] Each of the layers of the circuit board may be differently
shaped, include cutouts and/or may be of different sizes. For
example, the first layer of the circuit board may be generally
sized proportionally to a card and may include cutouts (e.g.,
cutouts, etched portions, and/or the like) for a magnetic stripe
communications device and a battery. A border may remain around the
cutout for the magnetic stripe communications device. The cutout
for the battery may not include a border and may result in an "L"
shaped layer. The second layer may be a middle layer of the circuit
board that is generally sized proportionally to a card and may
include a cutout for a battery. The second layer may be, for
example, "L" shaped layer. The third layer of the circuit board may
generally be rectangular and may be sized smaller than a card.
[0015] Prior to or during lamination, the first and second layers
may be aligned such that the magnetic stripe communication device
cutout of the first layer is aligned to the read head detectors of
the second layer, and such that the battery cutouts of the first
and second layers are aligned. The third layer may be positioned to
overlap the first and second layers including the battery cutout
(e.g., may provide a base for the battery), but may not extend into
a region including the cutout for the magnetic stripe communication
device and the read head detectors. The antenna of the third layer
may be along the entire perimeter of the third layer and may be
aligned so as not to interfere with the magnetic stripe
communication device.
[0016] According to at least one example embodiment, the first and
second layer may be on opposite sides of a top sheet, for example,
a polyimide sheet. The cutout of the first layer may be a removal
and/or absence of the first layer such that the sheet is exposed. A
magnetic stripe communications device may be on the sheet. The
third layer may be on, for example, a separate, bottom sheet (e.g.,
polyimide sheet). As one example, the second layer (e.g., a portion
of the second layer) may be directly on the bottom sheet surface
(e.g., no coverlay and/or the like) and the third layer may be on
an opposite side of the bottom sheet from the second layer. The
third layer and the bottom sheet may be a size of a portion of a
card not including a magnetic stripe communications device. An
antenna may occupy some or all of the bottom sheet as part of the
third layer.
[0017] A multiple layer primary circuit board configuration may
decrease a circuit board thickness in the magnetic stripe
communication device region (which may be designed as thin as
possible), may increase and/or maximize an RFID antenna size to
improve communication gain, facilitate the inclusion of three or
more reader communication devices in a single card, and improve
overall communication performance of the reader communication
devices.
[0018] Multiple boards may be soldered together. Different boards
may also be mechanically and electrically coupled together, for
example, via an epoxy or conductive tape. The various components of
a card may be part of different circuit boards and/or separate
components attached to the circuit boards. The separate components
of each card may be, for example, assembled onto the boards. For
example, a microprocessor die may be coupled to contacts of a
portion of a board. The electronics package may then be laminated.
Such a lamination may occur, for example, in an injection molding
process (e.g., a reaction injection molding process) and/or the
like. A laminate may be, for example, a silicon-based material or a
polyurethane-based material.
[0019] Cards may be personalized using various types of wireless
signals. For example, a card may include an infrared sensor. A
personalization machine may include an IR transmitter. The IR
transmitter may communicate personal data, such as one or more
credit and/or debit card numbers, to an IR sensor located on the
card. Similarly, a visible light sensor may be provided on a card
for receiving visible light pulses from a visible light transmitter
that are indicative of personal data for a card. Alternatively or
additionally, for example, a wire-based signal may be provided to a
card for personalization. For example, a card may include an IC
chip that has contacts exposed on the surface of the card.
Electrical connections may be made to such exposed contacts to
provide personal data into the chip. Contacts may be placed on the
card and connected to an embedded, non-exposed microprocessor such
that the microprocessor may receive programming data from a
wire-based connection.
[0020] An adapter may be provided that includes an infrared or
visible light transmitter. Such an adapter may be provided over a
contact for an IC chip communications device. Accordingly, an IC
chip communications device may provide electronic signals to
program, for example, an IC-chip card. However, an adapter may
convert, for example, these electronic signals into visible or
infrared bursts of light. Accordingly, an IC chip programmer may be
utilized to program a card having an infrared or visible light
sensor. Furthermore, for example, an adapter may be placed over a
magnetic stripe encoder or an RFID signal generator that generates
infrared or visible light pulses in response to magnetic stripe
encoding signals or RFID programming signals. Where a card uses
multiple reader communication devices, a processor may couple each
device such that data may be communicated to the card only once
during personalization.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Principles and advantages of the present invention can be
more clearly understood from the following detailed description
considered in conjunction with the following drawings, in which the
same reference numerals denote the same structural elements
throughout, and in which:
[0022] FIG. 1 shows cards and architectures constructed in
accordance with the principles of the present invention;
[0023] FIGS. 2-4 show card layers constructed in accordance with
the principles of the present invention;
[0024] FIG. 5 shows overlaid card layers constructed in accordance
with the principles of the present invention; and
[0025] FIGS. 6 and 7 show cards in accordance with the principles
of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0026] FIG. 1 shows cards and architectures according to example
embodiments. Referring to FIG. 1, card 100 may include, for
example, dynamic magnetic stripe communications device 105, one or
more displays (e.g., dynamic code display 145), permanent
information 147, one or more buttons (e.g., buttons 110, 120, 130
and 135) and/or information 140. Information 140 may be, for
example, a transaction number (e.g., account number), and may be
permanent and/or information in a display. In the case of
information 140 that is permanent, information 140 may be, for
example, printed, embossed and/or laser etched on card 100.
[0027] Permanent information 147 may include, for example,
information specific to a user (e.g., a user's name and/or
username) and/or information specific to a card (e.g., a card issue
date and/or a card expiration date).
[0028] Buttons 110-135 may be mechanical buttons, capacitive
buttons, or a combination of mechanical and capacitive buttons.
Button 110 may be used, for example, to communicate information
through dynamic magnetic stripe communications device 105
indicative of a user's desire to communicate a single track of
magnetic stripe information. Persons skilled in the art will
appreciate that pressing a button (e.g., button 110) may cause
information to be communicated through device 105 when an
associated read-head detector detects the presence of a read-head
of a magnetic stripe reader. Buttons 120, 130 and 135 may be
utilized to communicate (e.g., after a button is pressed and after
a read-head detects a read-head of a reader) information indicative
of a user selection (e.g., to communicate two or more tracks of
magnetic stripe data, to communicate different track data, to
modify tracks of data and/or the like).
[0029] Buttons 110-135 may each be used to associate a feature to a
transaction. For example, each of buttons 110-135 may be associated
to different service provider applications. Each service provider
application may be associated to a different service provider
feature (e.g., different rewards). A user may, for example, press
one or more of buttons 110-135 to choose one or more features for a
particular transaction.
[0030] A user may associate applications to buttons and/or features
to applications, for example, on a graphical user interface (GUI).
The graphical user interface may be, for example, an application
manager provided by one or more entities (e.g., an application
manager provider). The associations may be changed, for example, at
any time, periodically, and/or upon the occurrence of an event.
According to some example embodiments, a user may associate
applications to buttons and/or features to applications by
telephone, by electronic mail and/or any other communication
method.
[0031] Associations between buttons and service provider
applications may be maintained by an ecosystem provider, for
example, within an ecosystem of applications, transactional methods
and types of transactions. When a transactional method (e.g., card
100) is used by a user, the ecosystem provider may receive
transactional data and information indicative of a button selected
by the user. The ecosystem provider may determine the identity of
an application associated to the button, and may communicate some
or all of the information and/or transactional data to the
application and/or the service provider. The service provider
and/or the application may provide a feature associated with the
application based on the information and/or transactional data.
[0032] Different features may be provided based on the use of
different transactional methods and/or transaction types. For
example, suppose a service provider provides a reward feature based
on the use of a particular payment method (e.g., a reward for using
a particular credit card). A user may purchase an item using the
particular payment method (e.g., may select a particular credit
account using buttons 110-135). When the purchase is performed, the
reward may be communicated to the user. As another example, suppose
a service provider provides a reward feature based on a type of
transaction. For example, a reward may be provided for a sale of a
commodity using a particular transaction processor (e.g., issuer,
acquirer and/or payment network). A user may sell a commodity using
a the particular transaction processor (e.g., the ecosystem
provider) and upon completion of the sale a reward may be
communicated to the user.
[0033] Selection of a feature may or may not have a cost associated
with it. If a cost is associated with the feature, for example, the
cost may be added to a customer's statement (e.g., added to a
credit or debit purchase) for a particular transaction. A fixed-fee
and/or variable-fee (e.g., a percentage of the transaction) may
then be removed from the fee charged to the user and distributed
among particular parties, for example, distributed among a card
issuer, application manager provider, ecosystem provider, device
provider, service provider and/or one or more other entities.
Persons skilled in the art in possession of example embodiments
will appreciate that many different fee arrangements are possible,
and that the various providers may be the same and/or different
from each other.
[0034] A cost may be associated to a feature selection, but may not
be a cost to a user. For example, the cost may be a cost to a
service provider (e.g., a third party service provider). The cost
may be provided to other entities, for example, the device
provider, card issuer, card processor, and/or any other entity
(e.g., a card network). For example, a feature provided to a user
acting as a merchant may be an instant rebate provided to the
customer of the user, and a cost of the instant rebate may be a
cost to the rebate provider.
[0035] Display 145 may display, for example, a dynamic verification
code (e.g., a card verification value (CVV) and/or card
identification number (CID)). The dynamic number displayed on
display 145 may change according to various schemes as a security
measure against fraudulent transactions. Any and/or all of the
information provided by a card 100 may be provided via a display.
For example, information 140 may be a dynamic number provided via a
display. The dynamic numbers may change periodically and/or upon
the occurrence of an event such that a previously recorded number
may become unusable. According to at least one example embodiment,
one or both sides of a card 100 may be entirely a display.
[0036] Card 100 and/or a user may communicate a dynamic number to a
processing facility. The processing facility may validate the
dynamic number (e.g., a dynamic credit card number and/or a dynamic
security code). A user may purchase items using a dynamic card and
a processing facility may authorize the purchases upon determining
that the dynamic number is valid. Although example embodiments may
be described with respect to numbers, the scope of example
embodiments includes any distinguishing representation of a
security code and/or account, by any sensory method (e.g., sight,
sound, touch and/or the like). Characters, images, sounds,
textures, letters and/or any other distinguishable representations
are contemplated by example embodiments.
[0037] Architecture 150 may be utilized with any card (e.g., any
card 100). Architecture 150 may include, for example, processor
155, display 157, driving circuitry 167, memory 153, battery 160,
radio frequency identification (RFID) 165, integrated circuit (IC)
chip 163, electromagnetic field generators 173, 175, and 177,
read-head detectors 170 and 180, port 187 (e.g., a joint test
action group (JTAG) port), and an RFID antenna 190.
[0038] Processor 155 may be any type of processing device, for
example, a central processing unit (CPU), an analog signal
processor and/or a digital signal processor (DSP). Processor 155
may be, for example, an application specific integrated circuit
(ASIC). Processor 155 may include on-board memory for storing
information (e.g., drive code). Any number of components may
communicate to processor 155 and/or receive communications from
processor 155. For example, one or more displays (e.g., display
157) may be coupled to processor 155. Persons skilled in the art
will appreciate that components may be placed between particular
components and processor 155. For example, a display driver circuit
may be coupled between display 157 and processor 155.
[0039] Memory 153 may be coupled to processor 155. Memory 153 may
store data, for example, data that is unique to a particular card.
Memory 153 may store any type of data. For example, memory 153 may
store discretionary data codes associated with each of buttons
110-135 of card 100. Discretionary data codes may be recognized by
remote servers to effect particular actions. For example, a
discretionary data code may be stored in memory 153 and may be used
to cause a third party service feature to be performed by a remote
server (e.g., a remote server coupled to a third party service such
as an online voucher and/or coupon provider).
[0040] Different third party features may be, for example,
associated with different buttons and a particular feature may be
selected by pressing an associated button. According to at least
one example embodiment, a user may select a type of payment on card
100 via manual input interfaces. The manual input interfaces may
correspond to displayed options (not illustrated) and/or may be
independent buttons. Selected information may be communicated to a
magnetic stripe reader via a dynamic magnetic stripe communications
device, an RFID antenna and/or the like. Selected information may
also be communicated to a device (e.g., a mobile telephonic device)
including a capacitive sensor and/or other type of touch sensitive
sensor.
[0041] Architecture 150 may include any number of reader
communication devices. For example, architecture 150 may include at
least one of IC chip 163, RFID 165 and a magnetic stripe
communications device. IC chip 163 may be used to communicate
information to an IC chip reader (not illustrated) using, for
example, RFID antenna 190 and/or contact conductive fingers (e.g.,
6 or 8 contact gold fingers). IC chip 152 may be, for example, an
EMV chip. RFID 151 may be used to communicate information to an
RFID reader using RFID antenna 190. RFID 151 may be, for example, a
RFID tag. A magnetic stripe communications device may be included
to communicate information to a magnetic stripe reader. For
example, a magnetic stripe communications device may provide
electromagnetic signals to a magnetic stripe reader.
[0042] Different electromagnetic signals may be communicated to a
magnetic stripe reader to provide different tracks of data. For
example, architecture 150 may include electromagnetic field
generators 173, 175 and 177 to communicate separate tracks of
information to a magnetic stripe reader. Electromagnetic field
generators 173, 175 and 177 may include a coil (e.g., each may
include at least one coil) wrapped around one or more materials
(e.g., a soft-magnetic material and a non-magnetic material). Each
electromagnetic field generator may communicate information, for
example, serially and/or in parallel to a receiver of a magnetic
stripe reader for a particular magnetic stripe track.
[0043] Architecture 150 may include read head detectors 170 and
180. Read-head detectors 170 and 180 may be configured to sense the
presence of a magnetic stripe reader (e.g., a read-head housing of
a magnetic stripe reader). A read-head detector may include, for
example, e-sense pads. Information sensed by the read-head
detectors 170 and 180 may be communicated to processor 155 to cause
processor 155 to communicate information serially from
electromagnetic generators 173, 175, and 177 to magnetic stripe
track receivers in a read-head housing of a magnetic stripe
reader.
[0044] According to at least one example embodiment, a magnetic
stripe communications device may change the information
communicated to a magnetic stripe reader at any time. Processor 155
may, for example, communicate user-specific and card-specific
information using RFID 165, IC chip 163, and/or electromagnetic
generators 173, 175, and 177 to card readers coupled to remote
information processing servers (e.g., purchase authorization
servers). Driving circuitry 167 may be utilized by processor 155,
for example, to control electromagnetic generators 173, 175 and
177.
[0045] Architecture 150 may include, for example, a light sensor
(not illustrated). Architecture 150 may receive information from a
light sensor. Processor 155 may determine information received by a
light sensor.
[0046] FIGS. 2-4 show card layers constructed in accordance with
the principles of the present invention. Referring to FIG. 2, layer
200 of a printed circuit board may include, for example, RFID
antenna 205 and EMV connector 210. Layer 200 may be about 1-3 mils
thick (a mil being 1/1000 of an inch), for example, about 2 mils
thick. Persons of ordinary skill in the art will appreciate that
layer 200 may also include various circuit traces, fill materials,
supports, components, via connections and/or the like which may not
be illustrated for clarity of explanation.
[0047] According to at least one example embodiment, layer 200 may
be one side of a sheet, for example, one side of a polyimide sheet
(e.g., a Kapton sheet). A side of a sheet including RFID antenna
205 and EMV connector 210 may be a bottom layer of a printed
circuit board. A second side of the sheet may include a different
layer. The different layer (not shown) from layer 200 may include
routing traces and/or other elements. According to at least one
example embodiment, the second side of the sheet may not include a
different layer and/or metallization (e.g., copper), for example,
may be bare polyimide.
[0048] An RFID antenna may, for example, be a series of conductive
loops on a border of layer 200. RFID antenna 205 may be operable to
communicate information provided by a processor externally to a
distance of about, for example, 100 millimeters. For example, a
processor may communicate with an RFID device using RFID antenna
205. RFID antenna 205 may be utilized to communicate, for example,
payment card information (e.g., credit card information) to a
reader. Although RFID antenna is described with respect to RFID,
persons of ordinary skill in the art will appreciate that near
field communications provided by an antenna may be used for various
other technologies, for example, contactless EMV.
[0049] RFID antenna 205 may communicate an electromagnetic signal
in response to a signal provided by, for example, an RFID chip
(e.g., an application specific integrated circuit (ASIC) and/or the
like). A size of the conductive loops may be large (e.g., as large
as possible) and may be along edge portions of layer 200 to
maximize and/or increase a size of RFID antenna 205. Persons of
ordinary skill in the art in possession of example embodiments will
appreciate that increased antenna size may correspond to increased
gain. RFID antenna 205 may be monostatic and/or bistatic, and may
be tuned (or tunable) to a specific range of carrier frequencies.
Although FIG. 2 illustrates a helical antenna, other configurations
are contemplated by example embodiments (e.g., patch, crossed
dipole and/or the like).
[0050] EMV connector 210 may be used to connect an EMV chip to an
external device (e.g., an EMV device). For example, EMV connector
210 may include contact pads and/or the like used to connect a
payment card to an EMV device during a transaction. An EMV chip
(e.g., a processor) may be connected to EMV connector 210 via one
or more circuit traces and a buffer, for example, a buffer that
provides electrostatic discharge (ESD) protection and/or
bi-directional control (not illustrated). A card may be operable to
provide contactless EMV communications and, for example, an EMV
chip may be connected by circuit traces to RFID antenna 205
alternatively to and/or additionally to EMV connector 210. An EMV
chip may be a component added to a circuit board including layer
200 and/or may be part of a circuit board layer.
[0051] Referring to FIG. 3, layer 300 may include, for example,
read head detectors 305, pad 310, supports 315 and/or component
cutout 320. Persons of ordinary skill in the art will appreciate
that layer 300 may also include various circuit traces, fill
materials, supports, components, vias, via connections and/or the
like which may not be illustrated for clarity of explanation. A
thickness of layer 300 may be, for example, about 1-4 mils (e.g.,
about 2 mils).
[0052] Persons skilled in the art will appreciate that a read-head
housing of a magnetic stripe reader may be provided with one, two,
or three active read-heads that are each operable to couple with a
separate magnetic track of information. A reader may also have more
than one read-head housing and each read-head housing may be
provided with one, two, or three active read-heads that are
operable to each couple with a separate magnetic track including
information. Such read-head housings may be provided on different
surfaces of a magnetic stripe reader. For example, the read-head
housings may be provided on opposite walls of a trough sized to
accept payment cards. Accordingly, the devices on the opposite
sides of the trough may be able to read a credit card regardless of
the direction that the credit card was swiped.
[0053] A magnetic emulator may be provided and may be positioned on
card such that when card is swiped through a credit card reader,
the magnetic emulator passes underneath, or in the proximity of, a
read-head for a particular magnetic track. An emulator may be large
enough to simultaneously pass beneath, or in the proximity of,
multiple read-heads. Information may be transmitted, for example,
serially to one or more read-heads. Information from different
tracks of data may also be transmitted serially and the magnetic
stripe reader may determine the different data received by
utilizing the starting and/or ending sentinels that define the
information for each track. A magnetic emulator may also transmit a
string of leading and/or ending zeros such that a magnetic reader
may utilize such a string of zeros to provide self-clocking. In
doing so, for example, information may be transmitted serially at
high speeds to a magnetic stripe reader. For example, credit card
information may be transmitted to a magnetic stripe reader at
speeds up to, and/or greater than, about 30 Khz.
[0054] Different emulators may be provided, and positioned, on a
card to each couple with a different read-head and each emulator
may provide different track information to those different
read-heads. Read-head detectors may be utilized to detect when a
read-head is over an emulator such that an emulator is controlled
by a processor to operate when a read-head detector detects the
appropriate presence of a read-head. Power may be saved. The
read-head detector may detect how many read-heads are reading the
card and, accordingly, only communicate with the associated
emulators. Power may be conserved.
[0055] Read-head detectors 305 may be, for example, provided as a
circuit that detects changes in capacitance and/or mechanical
coupling to a conductive material. Read head detectors 305 may be,
for example, e-sense pads and/or the like. A processor may be
provided to, for example, receive information from read-head
detectors 305. Read head detectors 305 may be connected to the
processor via circuit traces and/or the like.
[0056] Pad 310 may be, for example, a die foundation of a chip. For
example, pad 310 may be a copper pad used to support a wire bonded
on-board ASIC chip. Supports 315 may be, for example, supports for
an external connector (e.g., a JTAG port). As one non-limiting
example, supports 315 may be copper pads. Component cutout 320 may
indicate the absence of symmetry in layer 300. For example,
component cutout 320 may be an area not including layer 300 (e.g.,
not including layer 300 and/or a polyimide support layer). Although
example embodiments may describe a component cutout, layer 300 may
be formed without a portion corresponding to component cutout 320,
may be an etched, milled, and/or ablated portion, and/or the like.
A component, for example, a battery, may occupy some or all of a
space provided by component cutout 320.
[0057] According to at least one example embodiment, layer 300 may
be one side of a sheet, for example, one side of a polyimide sheet
(e.g., a Kapton sheet). Layer 300 may be a middle layer of a
printed circuit board. A different side of the sheet from the layer
300 may include a different layer, for example, a top layer. The
different layer (not shown) from layer 300 may include, for
example, an infrared (IR) transceiver, a component cutout, buttons,
a processor, at least one circuit, leads, an EMV buffer, an RFID
chip, a port and/or a component cutout. According to at least one
example embodiment, layer 300 may be a standalone layer, for
example, the only layer of a sheet.
[0058] Referring to FIG. 4, layer 400 may include, for example,
infrared (IR) transceiver 405, magnetic stripe region 410, buttons
415, processor 420, circuit 425, leads 430, EMV buffer 435, RFID
chip 440, port 445 and/or component cutout 450. Persons of ordinary
skill in the art will appreciate that layer 400 may also include
various circuit traces, fill materials, supports, components, via
connections and/or the like which may not be illustrated for
clarity of explanation. A thickness of layer 400 may be, for
example, about 1-4 mils (e.g., about 2.7 mils).
[0059] IR transceiver 405 may include, for example, an IR emitter
and an IR receiver. The IR emitter may be, for example, a light
emitting diode configured to emit IR light upon excitation (e.g.,
application of a voltage across the diode). The IR receiver may be,
for example, a transistor configured to generate a current in the
presence of IR light. For example, the IR receiver may be a bipolar
transistor. According to at least one example embodiment, IR
transceiver 405 may not be a transceiver and may be a
transmitter-receiver. IR transceiver 405 may be connected to, for
example, processor 420 via one or more circuit traces (not
illustrated). IR transceiver 405 may communicate information
to/from an external IR reader and/or to/from processor 420. For
example, IR transceiver 405 may communicate a card account number
to an IR card reader.
[0060] Magnetic stripe region 410 may indicate the absence of a
portion of layer 400. For example, magnetic stripe region 410 may
indicate an area of a sheet (e.g., a polyimide sheet) not including
any metallization (e.g., no copper, coverlay and/or the like). As
another example, magnetic stripe region 410 may indicate the
absence of any material. Although example embodiments may include a
component cutout as a magnetic stripe region, layer 400 may be
formed without a portion corresponding to magnetic stripe region
410, an etched, milled, and/or ablated portion, and/or the like. A
component, for example, a magnetic stripe communication device, may
occupy some or all of a space provided by magnetic stripe region
410 (e.g. directly on a polyimide sheet).
[0061] Buttons 415 may be mechanical buttons, capacitive buttons,
or a combination of mechanical and capacitive buttons. Buttons 415
may be connected to processor 420 via one or more circuit traces
(not illustrated).
[0062] Processor 420 may be, for example, a central processing
unit. For example, processor 420 may be an ultra-low-power mixed
signal microprocessor. Processor 420 may provide various functions
to a powered card including a layer 400. For example, a card EMV
protocol may use processor 420. Processor 420 may include on-board
memory for storing information (e.g., drive code). Any number of
components may communicate to processor 420 and/or receive
communications from processor 420. For example, one or more
displays (not illustrated) and/or one or more memories may be
coupled to processor 420. Persons skilled in the art will
appreciate that components may be placed between particular
components and processor 420. For example, a buffer circuit may be
coupled between processor 420 and an EMV connector.
[0063] Circuit 425 may be, for example, an ASIC. Circuit 425 may be
associated with a magnetic stripe communication device. Leads 430
may be, for example, battery terminal leads to connect a thin film,
flexible battery to power various circuits (e.g., circuitry or
components of various layers including layer 400). EMV buffer 435
may be connected between, for example, an EMV connector and
processor 420. EMV buffer 435 may provide electrostatic discharge
(ESD) protection and/or bi-directional control. RFID chip 440 may
be, for example, connected to an RFID antenna (not illustrated) and
may be operable to communicate, for example, payment card
information (e.g., credit card information) to a reader. Port 445
may be, for example, a JTAG port connected to processor 420 and/or
leads 430 via circuit traces (not illustrated).
[0064] Component cutout 450 may indicate the absence of symmetry in
layer 400. For example, component cutout 450 may be an area not
including layer 400. Although example embodiments may describe a
component cutout, layer 400 may be formed without a portion
corresponding to component cutout 450, may be an etched or
otherwise removed portion and/or the like. A component, for
example, a battery, may occupy some or all of a space provided by
component cutout 450.
[0065] Persons skilled in the art in possession of example
embodiments will appreciate that components of various layers of a
circuit board may be distributed in various ways and remain within
the scope of example embodiments.
[0066] According to at least one example embodiment, layer 400 may
be one side of a sheet, for example, one side of a polyimide sheet
(e.g., a Kapton sheet). Layer 400 may be a top layer of a printed
circuit board. A different side of the sheet from the layer 400 may
include a different layer, for example, a middle layer. The
different layer (not shown) from layer 400 may include, for
example, read head detectors, one or more pads, supports and/or
component cutouts. According to at least one example embodiment,
layer 400 may be a standalone layer, for example, the only layer of
a sheet.
[0067] FIG. 5 shows overlaid card layers constructed in accordance
with the principles of the present invention. Referring to FIG. 5,
a printed circuit board may include multiple layers, for example,
three layers including magnetic stripe cutout 505, read head
detectors 510, antenna 515, buttons 520 and 535, processor 525,
circuit 530, EMV connector 540, EMV buffer 545, leads 550, RFID
chip 560, port 565 and/or component cutouts 555. Persons of
ordinary skill in the art will appreciate that circuit board 500
may include various circuit traces, fill materials, supports,
components, via connections and/or the like which may not be
illustrated for clarity of explanation. Components, such as a
magnetic stripe communication device, battery, backers and/or
buttons, may or may not be part of circuit board 500 (e.g., may be
separate components).
[0068] A first layer may include, for example, component cutouts
505 and/or 555, buttons 520 and 535, processor 525, circuit 530,
EMV buffer circuit 545, leads 550, RFID chip 560 and port 565. A
second layer may include, for example, read head detectors 510, a
connector (not illustrated), supports (not illustrated) and/or
component cutout 555. A third layer may include, for example, RFID
antenna 515 and/or EMV connector 540.
[0069] According to at least one example embodiment, the first and
second layers may be on opposite sides of a same sheet (e.g., a
Kapton sheet). The third layer may be on a different sheet. The
different sheet may only include the third layer and an opposite
side of the sheet from the third layer may not include
metallization (e.g., no coverlay). According to at least one other
example embodiment the opposite side of the sheet from the third
layer may include routing traces, elements, and/or the like (e.g.,
a fourth layer). According to at least one example embodiment, each
layer of a circuit board may be associated with a different
substrate layer.
[0070] Circuit board 500 may include a cutout 555 that may extend
through the first and second layers. A component such as a battery
may be on the third layer and pass through the first and second
layers.
[0071] The third layer may extend to about a portion of the printed
circuit board 500 including read head detectors 510 of the second
layer and/or a magnetic stripe communication device (not
illustrated). For example, a magnetic stripe communication device
may be a component on a polyimide sheet over read head detectors
510 of the second layer and in magnetic stripe cutout 505 of the
first layer. Magnetic stripe region 505 may indicate, for example,
the absence of elements on the first layer opposite the read head
detectors 510. The third layer may not extend into a region
including read head detectors 510 and/or a magnetic stripe
communication device. According to at least one example embodiment,
a sheet including the third layer may not extend into a region
including read head detectors 510 and/or a magnetic stripe
communication device. The sheet may be between the third layer and
the second layer.
[0072] Accordingly, interference between an RFID antenna 515 and a
magnetic stripe communication device and/or read head detectors may
be reduced. RFID antenna 515 may surround an area of a circuit
board 500 not including the magnetic stripe communication device. A
thickness of circuit board 500 may be reduced in an area including
a magnetic stripe communication device and a size of an RFID
antenna increased, as compared to, for example, a circuit board not
including three or more layers. Communications using an RFID
antenna 515 and/or a magnetic stripe communication device may be
improved. For example, circuit board 500 may provide improved
gain.
[0073] FIG. 6 shows a card in accordance with the principles of the
present invention. FIG. 6 may be an example cross-sectional
representation of a card taken in a thickness direction. Referring
to FIG. 6, a card 600 may include, for example, first exterior
layer 610, magnetic stripe communications device 620, first layer
630, second layer 640, third layer 650, second exterior layer 660,
battery 670, region 680 and fill 690.
[0074] Magnetic stripe communications device 620 may be on first
layer 630 (e.g., on a sheet including layer 630). A thickness "g"
of card 600 may be, for example, about 25-40 mils (25-40
thousandths of an inch). For example, card 600 may be about 30-33
mils thick. Card 600 may include layers, components and/or the like
with thicknesses "a"-"f" and "h".
[0075] Each of thicknesses "e" and "f" of exterior layers 610 and
660 may be, for example, about 3-8 mils (e.g., about 6 mils).
Exterior layers 610 and 660 may include a polymer, for example,
polyethelene terephthalate. A thickness "d" of third layer 650 may
be about 1-3 mils (e.g., 2 mils). Thicknesses "b" and "c" of first
and second layers 630 and 640 combined may be about 2-7 mils (e.g.,
about 4.7 mils). A thickness "h" of battery 670 may be about 14-20
mils (e.g., about 17 mils).
[0076] Region 680 may be a region including a material (e.g., an
adhesive) and/or various elements (e.g., wire traces and/or the
like). According to some example embodiments, region 680 may not be
present or may be present as a fill material, and first layer 630
and/or battery 670 may extend to first exterior layer 610.
Thickness "a" of the magnetic stripe communications device portion
620 may be, for example, a thickness of thickness "g" minus the
combined thicknesses "a"-"f" and a thickness (if any) of region
680. Fill 690 may indicate a region of card 600 into which the
third layer 650 does not extend. For example, the third layer 650
may include an RFID antenna and may not extend into a region of
card 600 including a magnetic stripe communication device 620 or
may only partially extend into a region of card 600 including a
magnetic stripe communication device 620. Fill 690 may include, for
example, epoxy.
[0077] As one non-limiting example, to fabricate a card that is
about 30-33 mils thick, for example, exterior layers 610 and 660
may each be about 4-7 mils (e.g., 5 mils). A magnetic stripe
communication device may be about 18-22 mils. A circuit board may
be less than about 10-20 mils (e.g., less than about 16 mils). The
magnetic stripe communication device may be on a portion of a
circuit board layer with a thickness of about 1-3 mils (e.g., about
2 mils). Accordingly, for example, an area of region 680 between a
magnetic stripe communications device and an exterior layer may be
a thickness such that a magnetic stripe communications device, a
circuit board layer (e.g., layer 640) on the magnetic stripe
communication device, and exterior layers 610 and 660, are together
about 30-33 mils thick. For example, region 680 may be about 0-10
mils thick (e.g., about 2 mils).
[0078] Persons of ordinary skill in the art will appreciate that
the relative sizes of elements shown in FIG. 6 are representative
only and depend on, for example, specific design and/or specific
components. For example, magnetic stripe component 620 may be
thicker than battery 670. Further, relative dimensioning may not be
to scale in order to illustrate relative positioning in FIG. 6.
[0079] The volume of the electronics package of a powered card may
be, for example, less than about two tenths of a cubic square inch
(e.g., about less than one tenth of a cubic square inch). Such an
electronics package may include multiple flexible boards, a
battery, dynamic magnetic stripe communications device, magnetic
stripe communications device drive circuitry, and multiple light
emitting diodes, for example. There may be no copper pour in card
600. A thickness of card 600 may be uniform or may vary (e.g., a
flexible card).
[0080] Persons skilled in the art will appreciate that a protective
layer may be placed over exterior layers 610 and 660. Such a layer
may be about 0.5-2 mils thick (e.g., about 1 mil thick).
Accordingly, for example, the combined thickness of two protective
layers may be about 2 mils, the combined thickness of two exterior
layers may be about 8 mils, the thickness of a circuit board layer
including read heads may be 2 mils and the thickness of a magnetic
stripe communication device may be about 18 mils. In order to
maintain a target thickness of about 30 mils (e.g., with a maximum
thickness of about 32 mils including personalization) for a card
600, a third layer (e.g., including an antenna) may not overlap a
region of card 600 including a magnetic stripe communication
device.
[0081] Persons skilled in the art will appreciate that different
components and layers may be of different thicknesses based on the
design of a card, and that example embodiments may be applied in a
wide variety of scenarios to maintain a critical thickness. Persons
skilled in the art will appreciate that an injection molding
process of a substance may allow a substance to fill into the
groove and gaps of an electronics package such that the laminate
may reside, for example, between components of an electronics
package.
[0082] Card 600 may include a permanent magnet that may be, for
example, provided as part of an assembled magnetic stripe
communication device 620. First through third layers 630-650 may
include, for example, capacitive read-head detectors. Battery 670
may be any type of battery, such as, for example, a flexible
lithium polymer battery. Circuitry may be included (not
illustrated), for example, one or more driver circuits (e.g., for a
magnetic communications device), RFIDs, IC chips, light sensors and
light receivers (e.g., for sending and communicating data via
optical information signals), sound sensors and sound receivers, or
any other component or circuitry for card 600. Read-head detectors
for detecting the read-head of a magnetic stripe reader may be
provided, for example, on layer 640 as capacitive touch sensors
(e.g., capacitive-sensing contact plates).
[0083] FIG. 7 shows a card in accordance with the principles of the
present invention. FIG. 7 may include an example plan view of card
700 including regions 705, 710 and 715, and cross-sections
corresponding to the regions.
[0084] Referring to FIG. 7, card 700 may include regions 705, 710
and 715. Region 705 may include, for example, first mask 720, first
conductor 723, second conductor 725, substrate 727, third conductor
730 and second mask 733. Substrate 730 may be, for example,
polyimide (e.g., Kapton). Second conductor 725 and third conductor
730 may be on opposite sides of substrate layer 730. Second
conductor 725 and third conductor 730 may include, for example,
electrically deposited metal (e.g., ED copper). First conductor 723
may be on exposed portions of substrate 727, second conductor 725
and third conductor 730, and may fill vias, depressions and/or the
like. First conductor 723 may be, for example, metal plating (e.g.,
copper plating). Mask 720 and mask 733 may be on first conductor
723. Mask 720 and mask 733 may be, for example, top and bottom
solder masks (e.g., coverlay), respectively.
[0085] Region 710 of card 700 may include, for example, first mask
735, first conductor 755, second conductor 740, first substrate
743, third conductor 745, bonding material 747, second substrate
750, fourth conductor 753 and second mask 757. First substrate 743
and second substrate 750 may be, for example, polyimide (e.g.,
Kapton). Second conductor 740 and third conductor 745 may be on
opposite side surfaces of first substrate 743. Fourth conductor 753
may be on a side surface (e.g., bottom surface) of substrate 750.
Second conductor 740, third conductor 745 and fourth conductor 753
may include, for example, electrically deposited metal (e.g., ED
copper). Bonding material 747 may be between substrate 750 and
third conductor 745. Bonding material 747 may be, for example, a
bonding sheet.
[0086] First conductor 755 may be on exposed portions of substrate
second conductor 740, first substrate 743, third conductor 745,
bonding material 747, second substrate 750 and fourth conductor
753. First conductor 755 may fill vias, depressions and/or the
like. First conductor 755 may be, for example, metal plating (e.g.,
copper plating). First mask 735 and second mask 757 may be on first
conductor 755. First mask 735 and second mask 757 may be, for
example, top and bottom solder masks (e.g., coverlay),
respectively.
[0087] Region 715 of card 700 may include, for example, substrate
760, first conductor 763, second conductor 765 and mask 767. A top
surface of substrate 760 may be exposed. Substrate 70 may be, for
example, a polyimide. First conductor 763 may be on an opposite
side of substrate 760 from the exposed top surface. First conductor
763 may be, for example, electrically deposited copper. Second
conductor 765 may be on first conductor 763. Second conductor 765
may be, for example, copper plating. Mask 767 may be on second
conductor 765. Mask 767 may be a solder mask (e.g., coverlay).
[0088] Persons skilled in the art will understand that although
regions 705, 710 and 715 may be shown with different conductors,
substrates and masks, according to some example embodiments
materials may be common between regions. Persons skilled in the art
will understand that regions 705, 710 and 715 may not be internally
contiguous. For example, region 705 may include a magnetic stripe
communication device cutout, and within such a cutout, substrate
727 may be exposed.
[0089] Persons skilled in the art will understand that various
elements of different example embodiments may be combined in
various ways. Persons skilled in the art will also appreciate that
the present invention is not limited to only the embodiments
described. Instead, the present invention more generally involves
multiple layer card circuit boards. Persons skilled in the art will
also appreciate that the apparatus of the present invention may be
implemented in other ways than those described herein. All such
modifications are within the scope of the present invention, which
is limited only by the claims that follow.
* * * * *