U.S. patent application number 14/198510 was filed with the patent office on 2015-09-10 for low cost, high performance and high data throughput server blade.
This patent application is currently assigned to ACQIS LLC. The applicant listed for this patent is William W. Y. Chu. Invention is credited to William W. Y. Chu.
Application Number | 20150254205 14/198510 |
Document ID | / |
Family ID | 50192845 |
Filed Date | 2015-09-10 |
United States Patent
Application |
20150254205 |
Kind Code |
A1 |
Chu; William W. Y. |
September 10, 2015 |
Low Cost, High Performance and High Data Throughput Server
Blade
Abstract
A server blade insertable into a chassis of a blade server
system includes a main circuit board coupled to the chassis upon
insertion, a plurality of connectors residing on the main circuit
board, a plurality of grouped hard disk drives, and a plurality of
computer modules, each insertable into a corresponding one of the
connectors. Each of the grouped hard disk drives couples to one or
more of the computer modules. Each of the grouped hard disk drives
includes a first hard disk drive exposed proximate to a front side
of the chassis, and a second hard disk drive positioned between the
first hard disk drive and a back side of the chassis. A subset of
the grouped hard disk drives includes a first grouped hard disk
drive and a second grouped hard disk drive stacked on the first
grouped hard disk drive.
Inventors: |
Chu; William W. Y.; (Los
Altos, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chu; William W. Y. |
Los Altos |
CA |
US |
|
|
Assignee: |
ACQIS LLC
McKinney
TX
|
Family ID: |
50192845 |
Appl. No.: |
14/198510 |
Filed: |
March 5, 2014 |
Current U.S.
Class: |
710/308 |
Current CPC
Class: |
G06F 13/28 20130101;
G06F 13/4068 20130101; G06F 13/4282 20130101; Y02D 10/151 20180101;
G06F 15/161 20130101; G06F 13/4022 20130101; G06F 13/409 20130101;
Y02D 10/00 20180101; Y02D 10/14 20180101 |
International
Class: |
G06F 13/40 20060101
G06F013/40; G06F 13/42 20060101 G06F013/42; G06F 13/28 20060101
G06F013/28 |
Claims
1. A modular server, comprising: a main circuit board housed in a
chassis, comprising a plurality of connectors residing on the main
circuit board, each adapted to connect to a computer module; and a
plurality of computer modules, each insertable into one of the
plurality of connectors, each computer module comprising an
integrated system on a chip (SoC) comprising a processor and a
memory controller; a main memory coupled to the memory controller;
a first low voltage differential signal (LVDS) channel directly
extending from the SoC, the first LVDS channel comprising two
unidirectional, serial bit channels to transmit data in opposite
directions, wherein the first LVDS channel is configured to convey
a serial bit stream of address and data bits of a Peripheral
Component Interface (PCI) bus transaction; and a second LVDS
channel adapted to couple to the main circuit board through one of
the plurality of connectors, comprising two unidirectional, serial
bit channels to transmit data in opposite directions, wherein the
second LVDS channel conveys a serial bit stream of address and data
bits of a PCI bus transaction.
2. The modular server of claim 1 wherein the main memory comprises
a Small Outline Dual In-line Memory Module (SODIMM) Double Data
Rate (DDR) memory socket and a SODIMM DDR memory module.
3. The modular server of claim 1 wherein each computer module
further comprises a third LVDS channel adapted to couple to the
main circuit board through one of the plurality of connectors,
comprising two unidirectional, serial bit channels to transmit data
in opposite directions, and wherein the third LVDS channel conveys
Ethernet protocol traffic.
4. The modular server of claim 1 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) bus directly extending from the SoC, wherein the SATA bus
couples to the main circuit board through one of the plurality of
connectors of the computer module.
5. The modular server of claim 1 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) flash drive.
6. A modular server, comprising: a main circuit board housed in a
chassis comprising a plurality of connectors residing on the main
circuit board, each adapted to connect to a computer module; and a
plurality of computer modules, each insertable into one of the
plurality of connectors, each computer module comprising an
integrated system on a chip (SoC) comprising a processor, a
graphics controller and a memory controller; a main memory directly
coupled to the integrated SoC; a serial communication link I.sup.2C
bus directly extending from the SoC, coupled to the main circuit
board through one of the plurality of connectors; a first low
voltage differential signal (LVDS) channel directly extending from
the SoC, the first LVDS channel comprising two unidirectional,
serial bit channels to convey data in opposite directions, wherein
the LVDS channel is configured to output a serial bit stream of
address and data bits of a Peripheral Component Interface (PCI) bus
transaction, wherein the first LVDS channel couples directly to the
main circuit board; and a second LVDS channel comprising two
unidirectional, serial bit channels to convey data in opposite
directions; wherein the second LVDS channel couples to the main
circuit board.
7. The modular server of claim 6 wherein the main memory comprises
a Small Outline Dual In-line Memory Module (SODIMM) Double Data
Rate (DDR) memory socket and a SODIMM DDR memory module.
8. The modular server of claim 6 wherein the second LVDS channel
conveys Ethernet protocol traffic.
9. The modular server of claim 6 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) bus directly extending from the SoC, wherein the SATA bus
directly couples to the main circuit board through one of the
plurality of connectors.
10. The modular server of claim 6 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) flash drive.
11. A modular server, comprising: a chassis comprising a power
supply; and a main circuit board housed in the chassis, and coupled
to the power supply, comprising a plurality of connectors residing
on the main circuit board, each adapted to connect to a computer
module; a plurality of computer modules, each insertable into one
of the plurality of connectors for operation and for receiving
power from the power supply, each computer module comprising an
integrated system on a chip (SoC) comprising a processor and a
memory controller; a main memory directly coupled to the memory
controller, comprising a Small Outline Dual In-line Memory Module
(SODIMM) Double Data Rate (DDR) memory socket and a SODIMM DDR
memory module; a first low voltage differential signal (LVDS)
channel directly extending from the SoC, the first LVDS channel
comprising two unidirectional, serial bit channels to convey data
in opposite directions, wherein the LVDS channel is configured to
output a serial bit stream of address and data bits of a Peripheral
Component Interface (PCI) bus transaction, wherein the first LVDS
channel couples directly to the main circuit board.
12. The modular server of claim 11 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) bus, wherein the SATA bus connects to the main circuit board
through one of the plurality of connectors of the computer
module.
13. The modular server of claim 12 wherein the SATA bus interface
connects to a SATA Disk Drive coupled to the main server board.
14. The modular server of claim 12 wherein the computer module
further comprises a second LVDS channel adapted to couple to the
main circuit board through one of the plurality of connectors,
wherein the second LVDS channel comprises two unidirectional,
serial bit channels to transmit data in opposite directions, and
wherein a third LVDS channel conveys Ethernet protocol traffic.
15. The modular server of claim 11 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) flash drive.
16. A modular server, comprising: a main circuit board housed in a
chassis comprising a plurality of connectors residing on the main
circuit board, each adapted to connect to a computer module; an
Ethernet Switching Hub coupled to the main circuit board; a
plurality of computer modules, each insertable into one of the
plurality of connectors, each computer module comprising an
integrated system on a chip (SoC) comprising a processor, a
graphics controller and a memory controller; a main memory directly
coupled to the memory controller, a first low voltage differential
signal (LVDS) channel connected to the main circuit board through
one of the plurality of connectors, wherein the first LVDS channel
comprises two unidirectional, serial bit channels to convey data in
opposite directions, wherein the LVDS channel is configured to
output a serial bit stream of address and data bits of a Peripheral
Component Interface (PCI) bus transaction; and a second LVDS
channel adapted to conveys Ethernet protocol traffic to the
Ethernet Switching Hub with a point-to-point connection through one
of the plurality of connectors, wherein the second LVDS channel
comprises two unidirectional, serial bit channels to transmit data
in opposite directions.
17. The modular server of claim 16 wherein the main memory
comprises a Small Outline Dual In-line Memory Module (SODIMM)
Double Data Rate DDR memory socket and a SODIMM DDR memory
module.
18. The modular server of claim 16 wherein each computer module
further comprises a serial communication link I.sup.2C bus
extending directly from the integrated SoC, adapted to connect to
the main circuit board.
19. The computer module of claim 16 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) bus interface directly extending from the integrated SoC,
wherein the SATA bus interface directly couples to the main circuit
board through one of the plurality of connectors.
20. The computer module of claim 16 wherein one of the computer
modules further comprises a Serial Advanced Attachment Technology
(SATA) flash drive.
21. A modular server, comprising: a chassis comprising a power
supply; and a main circuit board housed in the chassis, comprising
a plurality of connectors residing on the main circuit board, each
adapted to connect to a computer module; a plurality of computer
modules, each insertable into one of the plurality of connectors
for operation and for receiving power from the power supply, each
computer module comprising an integrated system on a chip (SoC)
comprising a processor, a graphics controller and a memory
controller; a main memory directly coupled to the memory
controller; a Serial Advanced Attachment Technology (SATA) bus
interface directly extending from the integrated SoC, wherein the
SATA bus interface directly couples to the main circuit board
through one of the plurality of connectors; and a first low voltage
differential signal (LVDS) channel adapted to connect to the main
circuit board, comprising two unidirectional, serial bit channels
to convey data in opposite directions, wherein the first LVDS
channel is configured to output a serial bit stream of address and
data bits of a Peripheral Component Interface (PCI) bus
transaction.
22. The modular server of claim 21 wherein the SATA bus interface
connects to a SATA Disk Drive coupled to the main server board.
23. The modular server of claim 21 wherein the main memory
comprises a Small Outline Dual In-line Memory Module (SODIMM)
Double Data Rate DDR memory socket and a SODIMM DDR memory
module.
24. The modular server of claim 21 wherein one of the computer
modules further comprises a SATA flash drive.
25. The modular server of claim 21 wherein the computer module
further comprises a serial communication link I.sup.2C bus
extending directly from the integrated SoC, adapted to connect to
the main circuit board.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 13/214,020 filed Aug. 19, 2011, which claims
priority to U.S. Provisional Application Ser. No. 61/375,356, filed
on Aug. 20, 2010, the contents of which are incorporated herein by
reference.
FIELD OF THE INVENTION
[0002] The present invention relates generally to computer servers
and processing. More particularly, the invention relates to low
cost, high performance and high data throughput server blades.
BACKGROUND OF THE INVENTION
[0003] As processing power, memory capacity, and data bandwidth
increases, there are limitations on computing efficiency under a
single operating system (OS) instance. In the server space, one
answer has been virtualization, which allows many OS instances to
share the resources of a few large physical servers. However, for
many consumers, this high level of computing power may not be
necessary. Smaller processors that provide good performance at
lower cost can be used to disaggregate the OS instances onto many
smaller servers, a concept called physicalization that can be an
alternative to virtualization for smaller data centers.
[0004] Certain server applications, such as video streaming, may be
suitable for physicalization due to relatively high input/output
(I/O) bandwidth requirements coupled with relatively low processing
power requirements. However, existing blade servers based on
virtualization may not be well suited for these applications, as
these blade servers may have higher processing power than needed
along with limited I/O bandwidth across the few large physical
servers. In addition, the cost of processors and system components
for traditional server applications tends to decrease more slowly
than the cost of processors and components for high volume consumer
applications. Thus, there remains a need in the blade server space
for compact, low cost, high data throughput computer modules that
incorporate highly integrated consumer processors and system
components for applications such as video streaming.
[0005] It is against this background that a need arose to develop
the server blade described herein.
SUMMARY OF THE INVENTION
[0006] One aspect of the invention relates to a server blade. In
one embodiment, a server blade insertable into a chassis of a blade
server system comprises: (1) a main circuit board coupled to the
chassis upon insertion; (2) a plurality of connectors residing on
the main circuit board; (3) a plurality of grouped hard disk
drives; and (4) a plurality of computer modules, each insertable
into a corresponding one of the plurality of connectors. Each of
the plurality of grouped hard disk drives couples to one or more of
the plurality of computer modules. Each of the plurality of grouped
hard disk drives includes a first hard disk drive exposed proximate
to a front side of the chassis, and a second hard disk drive
positioned between the first hard disk drive and a back side of the
chassis. A first subset of the plurality of grouped hard disk
drives includes a first grouped hard disk drive and a second
grouped hard disk drive stacked on the first grouped hard disk
drive.
[0007] In another embodiment, the server blade insertable into the
chassis of the blade server system comprises: (1) a main circuit
board that couples to the chassis upon insertion; (2) a plurality
of computer modules; (3) a plurality of connectors residing on the
main circuit board, each adapted to connect to a corresponding one
of the plurality of computer modules; and (4) a plurality of
hot-plug hard drive storage modules, each removable from a front
side of the server blade while the server blade is installed in the
chassis. Each of the plurality of hot-plug hard drive storage
modules comprises a frame, a first hard disk drive attached to a
front portion of the frame, and a second hard disk drive attached
to a rear portion of the frame. Each of the first hard disk drive
and the second hard disk drive are coupled to at least one of the
plurality of computer modules.
[0008] In another embodiment, the server blade insertable into the
chassis of the blade server system comprises: (1) a main circuit
board coupled to the chassis upon insertion; (2) a plurality of
connectors disposed on the main circuit board; (3) a plurality of
computer modules, each insertable into a corresponding one of the
plurality of connectors; and (4) a hub disposed on the main circuit
board that couples to the chassis and to a communication controller
included in each of the plurality of computer modules. The hub
processes input data to obtain requests distributed to the
plurality of computer modules, each of the plurality of computer
modules generates an output data stream in response to a
corresponding request, each output data stream has a first
bandwidth higher than a second bandwidth of the corresponding
request, and the hub aggregates the output data streams of the
plurality of computer modules to obtain output data.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 illustrates a top view of a server blade, according
to an embodiment of the invention;
[0010] FIG. 2 illustrates a front view of a server blade, according
to an embodiment of the invention;
[0011] FIG. 3 illustrates a logical view of a computer module,
according to an embodiment of the invention; and
[0012] FIG. 4 illustrates a logical view of a blade server system,
according to an embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0013] Processors designed for use in high volume consumer
applications can provide a higher performance per cost than
processors designed for low volume, high performance server
applications. In addition, aggressive competition in high volume
consumer computer systems can drive cost of processors and
components for consumer applications down more rapidly than that of
high end server processors and components. Embodiments of the
invention include low cost computer modules incorporating these
highly integrated consumer processors and system components, and at
the same time take advantage of blade server design concepts. The
use of a large number of these low cost computer modules within a
blade server system for certain server applications, such as video
streaming applications, can result in reduced cost and increased
performance.
[0014] Referring to FIG. 1, a top view of a server blade 100
according to an embodiment of the invention is illustrated. The
server blade 100 includes a main circuit board 110 that can couple
to a chassis. For example, the main circuit board 110 can insert
into connectors 103A-103N coupled to a backplane or midplane 111.
Computer modules 101 (101A-101H in the illustrated embodiment) are
electrically connected to the main circuit board 100, such as by
inserting into connectors (see FIG. 2) on the main circuit board
110. The computer modules 101 are coupled to a management
controller 112. In one embodiment, a mezzanine plug-on card 105 is
disposed on the main circuit board 110. The mezzanine plug-on card
105 can also insert into one or more connectors 103 to the
backplane or midplane 111.
[0015] For high volume video-streaming server applications,
sufficient hard disk drive data bandwidth and corresponding network
bandwidth is specified at each of the computer modules 110 to
support a large number of real-time video streams. The hard disk
drive data bandwidth can be provided by coupling each of the
computer modules 110 to a corresponding hard disk drive 116
disposed on the server blade 100. In one embodiment, each of the
hard disk drives 116 is coupled to a corresponding one of the
computer modules 110 through a high speed SATA (Serial Advanced
Attachment Technology) Rev. 2 interface. An input/output (IO) hub
324 (see FIG. 3) included in the computer module 110 may provide
one SATA interface port. The SATA interface port included in the
computer module 110 can connect through connectors and the main
circuit board 110 to the corresponding hard disk drive 116. As SATA
Rev. 2 can support 2.4 Gb/s of actual transfer rate, and as
conventional hard disk drives typically can saturate the original
SATA 1.5 Gb/s bandwidth, the bandwidth requirements of each of the
computer modules 110 can be met by the corresponding one of the
hard disk drives 116 over the SATA Rev. 2 interface, and by
corresponding switching bandwidth (see discussion with reference to
FIG. 4). In this embodiment, the effective data bandwidth per
computer module 110 can be approximately 150 Mbyte/s.
[0016] Referring to FIGS. 1 and 2, to increase the effective data
bandwidth per server blade 100, it may be desirable to increase the
number of computer modules 110 and corresponding hard disk drives
116 per server blade 100. At the same time, it may be desirable to
design the server blade 100 to comply with industry standards. For
example, the Server System Infrastructure (SSI) Forum has provided
mechanical, electrical, and power specifications for a standardized
server blade. These specifications include a 407.9 mm blade depth
(corresponding to a length of lateral sides 122 and 124 of the
server blade 100, shown in FIG. 1), a 279.4 mm blade width
(corresponding to a length of front side 120 of the server blade
100, shown in FIG. 1), a 41.7 mm blade height (corresponding to a
height 224 of the server blade 100, shown in FIG. 2), and a maximum
power of 450 Watts. In one embodiment, the front side 120 of the
server blade 100 corresponds to a front side of the main circuit
board 110, and the lateral sides 122 and 124 of the server blade
100 corresponds to lateral sides of the main circuit board 110.
[0017] It can be advantageous to design the server blade 100 to
increase the number of computer modules 110 and corresponding hard
disk drives 116 per server blade 100, taking into account
limitations on blade size associated with mechanical specifications
for server blades such as those of SSI, and other considerations
such as airflow paths for cooling and operational requirements. In
one embodiment, a first side 130 of each computer module 101 has a
length of approximately 62 mm, and a second side 132 of each
computer module 101 has a length of approximately 86 mm. As shown
in FIG. 1, and in an embodiment corresponding to the SSI mechanical
specifications, eight computer modules 101A-101H can be coupled to
the server blade 100. The second side 132 of the computer module
101A is positioned adjacent to the front side 120 of the server
blade 100 so that there is a path for front-to-back airflow over
the computer modules 101. In this embodiment, there is then
sufficient space along the front side 120 of the server blade 100
to dispose two hard disk drives 116A and 116C of typical dimensions
adjacent to the front side 120.
[0018] In one embodiment, each pair of hard disk drives 116 is
included in a corresponding grouped hard disk drive 102. This
structural arrangement is to overcome the limited front surface
area of the server blade 100. For example, grouped hard disk drive
102A includes the hard disk drives 116A and 116B, and grouped hard
disk drive 102B includes the hard disk drives 116C and 116D. The
grouped hard disk drives 102 may be oriented such that the hard
disk drives 116A and 116C are exposed proximate to the front side
120 of the server blade 100, and therefore proximate to a front
side of the chassis to which the server blade 100 is coupled. In
one embodiment, the hard disk drives 116A and 116C may be exposed
at the front side of the chassis to which the server blade 100 is
coupled. The hard disk drive 116B may be positioned between the
hard disk drive 116A and a back side of the chassis to which the
server blade 100 is coupled, and the hard disk drive 116D may be
positioned between the hard disk drive 116C and a back side of the
chassis to which the server blade 100 is coupled. By orienting the
grouped hard disk drives 102A and 102B in this way, four hard disk
drives 116 can be positioned adjacent to the main circuit board
110.
[0019] In addition, referring to FIG. 2, a front view of the server
blade 100 according to an embodiment of the invention is
illustrated. In one embodiment, a grouped hard disk drive 102C may
be stacked on the grouped hard disk drive 102A, and a grouped hard
disk drive 102D may be stacked on the grouped hard disk drive 102B.
The grouped hard disk drives 102C and 102D may be oriented
similarly to the grouped hard disk drives 102A and 102B,
respectively. In this way, eight hard disk drives 116 can be
included in the blade server 100 while maintaining the
front-to-back airflow path over the computer modules 101, and while
staying within the SSI specifications for blade height. Note that
for typical hard disk drive sizes, an SSI specified server blade
can expose at most four hard disk drives 116, in two stacks of two,
at the front side 120 of the main circuit board 110. In one
embodiment, eight hard disk drives 116 may be used to support eight
computer modules 101 (one hard disk drive 116 per computer module
101). This can yield an aggregate hard disk drive data bandwidth of
up to 1.5 Gbyte/s with eight hard disk drives 116 concurrently
being accessed by eight corresponding computer modules 101.
Alternatively, eight hard disk drives 116 may be used to support
four computer modules 101 (for example, the two hard disk drives
116 in one of the grouped hard disk drives 102 per computer module
101).
[0020] Referring to FIG. 1, the grouped hard disk drives 102 may
correspond to hot-plug hard drive storage modules 106 that are
removable from the front side 120 of the server blade 100. In one
embodiment, a hot-plug hard drive storage module 106 includes a
grouped hard disk drive 102, and is positioned similarly on the
main circuit board 110. Frames 107 can be attached to the main
circuit board 110, and each of the hot-plug hard drive storage
modules 106 may be adapted to be placed in a corresponding one of
the frames 107. Each of the hot-plug hard drive storage modules 106
may include a first hard disk drive (such as hard disk drives 116A
and 116C) disposed in a front portion of the frame 107 adjacent to
the front side 120 of the server blade 100, and may include a
second hard disk drive (such as hard disk drives 116B and 116D)
disposed in a rear portion of the frame 107. In one embodiment,
each of the hot-plug hard drive storage modules 106 includes a
connector that supports two SATA connections for the two hard disk
drives 116 to connect to one or two computer modules 101 via the
main circuit board 110. In addition, referring to FIG. 2, in one
embodiment a hot-plug hard drive storage module 106C may be stacked
on the hot-plug hard drive storage module 106A, and a hot-plug hard
drive storage module 106D may be stacked on the hot-plug hard drive
storage module 106B.
[0021] Referring to FIG. 1, at least one of the computer modules
101 may be positioned between the grouped hard disk drive 102A and
the grouped hard disk drive 102B. The grouped hard disk drive 102A
may be positioned proximate to the lateral side 124 of the server
blade 100, and the grouped hard disk drive 102B may be positioned
proximate to the lateral side 122 of the server blade 100. This can
allow airflow from the front side of the chassis to pass between
the grouped hard disk drive 102A and the grouped hard disk drive
102B, so that the front-to-back airflow passes over the computer
modules 101A-101F. In one embodiment, an air baffle 104 disposed on
the main circuit board 110 is positioned to direct the
front-to-back airflow toward the lateral side 124 of the server
blade 100. In this way, airflow can be provided for cooling the
computer modules 101G-101H, which are positioned at least partially
behind the grouped hard disk drive 102A. In this embodiment, the
front-to-back airflow is substantially centrally positioned over
the main circuit board 110. This may facilitate efficient direction
of the airflow toward the computer modules 101G and 101H adjacent
to the lateral side 124 of the server blade 100.
[0022] Alternatively, the grouped hard disk drive 102A may be
positioned next to the grouped hard disk drive 102B, such that the
computer module 101A is positioned adjacent to either the lateral
side 122 or the lateral side 124 of the server blade 100. In this
embodiment, the front-to-back airflow is substantially laterally
positioned over the main circuit board 110.
[0023] In one embodiment, operational status indicators of the hard
disk drives 116 that are displaced from the front side 120 of the
main circuit board 110 (such as the hard disk drives 116B and 116D)
can be provided at a front side 140 of the corresponding grouped
hard disk drives 102. For example, a visual indicator (such as an
LED indicator) that the hard disk drive 116B is operating may be
provided at the front side 140 of the grouped hard disk drive 102A,
along with a visual indicator that the hard disk drive 116A is
operating.
[0024] Referring to FIGS. 1 and 3, a processor 322 (see FIG. 3) on
each of the computer modules 101 may communicate serially (such as
via I.sup.2C) with the management controller 112 on the main
circuit board 110. The management controller 112 can monitor the
operational status of the processors 322. If processor failure is
detected, the management controller 112 can alert an administrator.
Information such as temperature, identification of the computer
module 101, and size of memory or storage device can also be
communicated serially to the management controller 112. A power
switch controlled by the management controller 112 can shut off
power to any one of the computer modules 101. If a failed computer
module 101 is detected, the management controller 112 can alert
high level software to shift the workload of the failed computer
module 101 to another computer module 101, and subsequently shut
off its power so that the failed computer module 101 does not
affect the operation of the rest of the server blade 100. In one
embodiment, the management controller 112 supports at least one of
1:1, 1+1, and N+1 redundancy of the computer modules 101.
Alternatively or in addition, the management controller 112 can
support load-balancing between two or more of the computer modules
101.
[0025] In one embodiment, a battery 114 on the main circuit board
110 can provide power to each of the computer modules 101 for
maintaining data in memory, such as a static CMOS memory, or for
keeping a portion of circuitry on each of the computer modules 101
active when the remainder of the circuitry on the computer modules
101 is powered down. The power from the battery 114 can be kept on
even if the main power to one or more of the computer modules 101
is shut off by the management controller 112 for saving power when
the one or more of the computer modules 101 are not in use. In one
embodiment, two batteries 114 can reside on the main circuit board
110 so that battery power is continuously available during
replacement of one of the two batteries 114.
[0026] Embodiments of the present invention can use different
numbers of computer modules 101 to populate the server blade 100.
Other embodiments can use server blades 100 of different form
factors, electrical, and power specifications. An embodiment of the
present invention uses plug-in computer modules 101 to simplify
manufacturing and facilitate ease of repair. In this embodiment, if
a computer module 101 fails, only the failed computer module 101
needs to be unplugged and replaced, saving the rest of the server
blade 100. This also allows the server blade 100 to be populated
partially with computer modules 101, with the option of plugging in
additional computer modules 101 later.
[0027] Referring to FIG. 2, the grouped hard disk drives 102A and
102C may be proximate to the lateral surface 124 of the server
blade 100, and the grouped hard disk drives 102B and 102D may be
proximate to the lateral surface 122 of the server blade 100. The
computer module 101A may be positioned between the grouped hard
disk drive 102A and the grouped hard disk drive 102B. In one
embodiment, a connector 212 is disposed on the main circuit board
110. The computer module 101A is insertable into the connector 212,
which is adapted to connect to the computer module 101A, and to
couple the computer module 101A to the main circuit board 110. In
one embodiment, the connector 212 may be a vertical connector.
There is a similar connector (not shown) corresponding to each of
the computer modules 101 that is adapted to couple the
corresponding one of the computer modules 101 to the main circuit
board 110.
[0028] Referring to FIG. 3, a logical view of the computer module
101 according to an embodiment of the invention is illustrated. The
computer module 101 includes an integrated system on chip 321
comprising a processor 322 and a memory controller 323, a main
memory 327 coupled to the memory controller 323, an input/output
hub 324, a communication controller 325, and a mass storage device
326. In one embodiment, the main memory 327 is directly coupled to
the memory controller 323.
[0029] Referring to FIGS. 1-3, in one embodiment, the computer
module 101 is low in height to fit within the SSI height limitation
of 41.7 mm. It is contemplated that the computer module 101 may be
of even lower height. One embodiment of the present invention uses
a horizontally fitted double data rate (DDR) DDR2/3 small outline
dual in-line memory module (SODIMM) as the main memory 327 within
the computer module 101 to meet the SSI height limitation. The
SODIMM memory may be a plug-in unit to improve reusability. Another
embodiment uses DDR2/3 Micro-DIMM as the main memory 327 to reduce
the size of the computer module 101. To reduce power consumption,
embodiments of the invention can use low power double data rate
(LPDDR) LPDDR2 memory or future generations of low power DDR memory
with low voltage swing low-voltage differential signaling (LVDS)
data links. In one embodiment, the processor 322 may be a low power
processor or system chip, e.g., system on chip (SOC), that can
operate with a low profile top mounted heat sink to fit within the
SSI height limitation. The low profile heat sink can be sufficient
for air cooling for low power system chips. The computer module 101
can be a small printed circuit board populated on both sides with
major components such as a system chip, the input/output hub 324, a
SODIMM memory horizontal socket, the connector 212 (see FIG. 2) to
the main circuit board 110 of the server blade 100 (see FIG. 1),
and a USB or SATA flash drive as the mass storage device 326. The
flash drive may be a plug-in unit to improve reusability. The
system chip can be soldered directly on the small printed circuit
board to reduce cost and to remove the additional height of an
expensive socket. Without the socket, the top mounted heat sink can
increase in height to increase cooling for the system chip.
[0030] In one embodiment, the computer module 101 includes one USB
flash drive or one solid state drive (SSD). USB 3.0 released in
2008 has a signaling rate of 4.8 Gbit/sec versus 480 Mbit/s for USB
2.0. In one embodiment, a USB 3.0 flash drive interfaces to the
input/output hub 324 or the processor 322 in the computer module
101. In another embodiment, a USB flash drive or a SATA SSD can
serve as local cache on the computer module 101 to store frequently
accessed content and video streams. USB 3.0 connections can have an
effective data bandwidth of over 2.4 Gb/s or 300 MByte/s. A single
SATA SSD can yield an effective data bandwidth of around 150 to 300
MByte/s. In one embodiment, the computer module 101 includes a
flash drive or a local SSD as cache. This can provide a higher
storage data bandwidth than the hard disk drives 116 included in
the server blade 100 (see FIG. 1). In other embodiments, two USB
flash drives or 2 SATA SSDs can be included in a single computer
module 101 to further increase data bandwidth. Either the USB flash
drive or the SATA SSD can be used to store operating system or
virtualization software to allow the computer module 101 to boot up
upon power up.
[0031] Referring to FIG. 4, a logical view of a blade server system
400 according to an embodiment of the invention is illustrated. One
or more main circuit boards 110 couple to a chassis 401 upon
insertion into connectors 103 of the midplane or backplane 111. The
circuit boards 110 can be powered, at least in part, by the power
supply 422. The computer modules 101 each insert into a
corresponding connector 212, and are each coupled to a hard disk
drive 116. The computer modules 101 can be powered, at least in
part, by the power supply 422 via the power regulator 424.
[0032] Referring to FIGS. 3 and 4, in one embodiment, a hub 402 on
the main circuit board 110 couples to the communication controller
325 on each of the computer modules 101. The hub 402 can include
switches such as an Ethernet switch or a PCI Express switch.
Similarly, the hub 412 can include switches such as a 10 Gigabit
Ethernet (10 GbE) switch or a PCI Express switch.
[0033] In one embodiment, two 1 Gigabit Ethernet (GbE) connections
are provided from each computer module 101 to the main circuit
board 110. The two GbE connections can provide approximately 200
Mbyte/s of network bandwidth. These GbE links from each computer
module 101 connect to the Ethernet switching hub 402 on the main
circuit board 110 with separate connections. The Ethernet switch
402 can have 16 GbE ports and 2 10 GbE ports. The 10 GbE ports can
connect to the 10 GbE switch 412 within the console midplane
111.
[0034] Referring to FIGS. 3 and 4, in another embodiment, high
speed PCI Express channels are provided from either the system chip
321 or the input/output hub 325 to provide data communication to
the main circuit board 110, and eventually to an external network.
PCI Express 2.0 can have an effective 400 Mbyte/s per link data
throughput. PCI Express 3.0 can have an effective per link data
throughput about twice that of PCI Express Rev. 2.0. In one
embodiment, a x1 PCI Express 2.0 link is provided from the computer
module 101 coupled through the connector 212 to the PCI Express
switch 402 on the main circuit board 110 of the server blade 100
(see FIG. 1) to serve as the communication channel. A x1 PCI
Express 2.0 channel can provide an approximately 400 Mbyte/s data
transfer rate sufficient to handle the storage data transfer rate
of both the local flash drive and the external SATA hard disk drive
116 for the computer module 101. The PCI Express switch 402
functions similarly to an Ethernet switching hub to direct data
communication between the various PCI Express links. It provides
communication between the computer modules 101 and to one or two x2
PCI Express links that couple to the switch 412 through the
midplane 111 of the blade server system 400. To support fault
tolerance, 2 PCI Express switches 402 can be provided on the main
circuit board 110. Each of the PCI Express switches 402 has a x1
PCI Express link to each of the computer modules 101. The PCI
switch 402 has a x2 PCI Express link to another PCI Express switch
412 in the chassis 401 through the midplane 111. The PCI Express
switch 412 in the chassis 401 then can connect to a 10 GbE
controller (not shown) for external network communication. Other
embodiments are contemplated in which any combination of links of
PCI Express Rev. 2 or Rev. 3 with GbE links are used to carry data
within the chassis 401.
[0035] In one embodiment, input data 410 to the chassis 401 is
processed by the switch 412 to obtain data distributed to each of
the main circuit boards 110. Upon arrival at a main circuit board
110, the data traverses link 414. In one embodiment, the link 414
is a 10 Gigabit Ethernet link or a x2 PCI Express link. The switch
402 processes the input data to the main circuit board 410 to
obtain requests. In a video streaming application, for example,
these requests may be requests for on-demand video programming.
These requests are then distributed by the switch 402 to the
corresponding computer modules 101 via the link 404. In one
embodiment, the link 404 includes 2 GbE links or a x1 PCI Express
2.0 link. Each of the computer modules 101 generates an output data
stream in response to a corresponding request, where the output
data stream has a first bandwidth higher than a second bandwidth of
the corresponding request. For example, the output data stream may
be the requested video stream. In one embodiment, the output data
stream originates on the computer module 101 and traverses the link
404 to the switch 402. The switch 402 then aggregates the output
data streams from the computer modules 101 to obtain output data
that traverses the link 416 to the switch 412, then is output from
the switch 412 as output data 420.
[0036] In one embodiment, each of the computer modules 101 is
connected to the management controller 112 by a link 406. In one
embodiment, the link 406 is a GbE link. The management controller
112 may be connected to an external network via links 418 and 419
and the switch 412, and may be connected to other main circuit
boards 110 within the chassis 401 by the links 418 and 419. In one
embodiment, the links 418 and 419 may be GbE links.
[0037] In one embodiment, remote Keyboard/Video/Mouse (KVM)
functions for each computer module 101 can be supported through
Ethernet communication. A Gigabit Ethernet switch 112 on the main
circuit board 110 can select KVM from a particular computer module
101 by selecting data from a dedicated Ethernet link 406 (such as a
1 GbE link) from the computer module 101. An administrator on an
external network can access the KVM function of each computer
module 101 one at a time through the Ethernet switch 112.
[0038] Referring to FIG. 1, in another embodiment, the multiple
computer module server blade 100 can be used for a multiple client
blade application. Each client can be assigned to one computer
module at a time, e.g. time sharing between multiple clients. To
transmit compressed high performance three-dimensional (3D)
graphics information from the computer module 101 to the remote
client demands high network bandwidth. 3D graphics information from
multiple computer modules 101 can be directed through the high
speed 10 GbE switch 412. In addition, an "eight computer module"
server blade has essentially eight separate computers that can be
assigned individually to each of eight remote clients. If one
computer module 101 fails, a client user can be switched to another
computer module 101 utilizing the Ethernet switching hub 412. In
one embodiment, each computer module 101 can support more than one
client user at a time through virtualization.
[0039] The figures provided are merely representational and may not
be drawn to scale. Certain proportions thereof may be exaggerated,
while others may be minimized. The figures are intended to
illustrate various implementations of the invention that can be
understood and appropriately carried out by those of ordinary skill
in the art.
[0040] The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
invention. However, it will be apparent to one skilled in the art
that specific details are not required in order to practice the
invention. Thus, the foregoing descriptions of specific embodiments
of the invention are presented for purposes of illustration and
description. They are not intended to be exhaustive or to limit the
invention to the precise forms disclosed; obviously, many
modifications and variations are possible in view of the above
teachings. The embodiments were chosen and described in order to
best explain the principles of the invention and its practical
applications, they thereby enable others skilled in the art to best
utilize the invention and various embodiments with various
modifications as are suited to the particular use contemplated. It
is intended that the following claims and their equivalents define
the scope of the invention.
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