U.S. patent application number 14/631267 was filed with the patent office on 2015-09-03 for arrangement having an electrical component and a heat exchanger.
The applicant listed for this patent is Mahle Behr GmbH & Co. KG. Invention is credited to Oliver Heeg, Thomas Himmer, Stefan Hirsch, Christopher Laemmle, Volker Schall.
Application Number | 20150247684 14/631267 |
Document ID | / |
Family ID | 53801445 |
Filed Date | 2015-09-03 |
United States Patent
Application |
20150247684 |
Kind Code |
A1 |
Himmer; Thomas ; et
al. |
September 3, 2015 |
ARRANGEMENT HAVING AN ELECTRICAL COMPONENT AND A HEAT EXCHANGER
Abstract
An arrangement may include an electrical component and a heat
exchanger arranged on the electrical component for controlling a
temperature of the component. An electrically insulating isolation
layer may be arranged at least partially between the heat exchanger
and the component. The isolation layer may be connected to at least
one of the component and the heat exchanger via a materially
cohesive connection.
Inventors: |
Himmer; Thomas;
(Reichenbach, DE) ; Schall; Volker; (Hemmingen,
DE) ; Laemmle; Christopher; (Stuttgart, DE) ;
Hirsch; Stefan; (Stuttgart, DE) ; Heeg; Oliver;
(Schwieberdingen, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Mahle Behr GmbH & Co. KG |
Stuttgart |
|
DE |
|
|
Family ID: |
53801445 |
Appl. No.: |
14/631267 |
Filed: |
February 25, 2015 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
F28F 3/12 20130101; Y02E
60/10 20130101; H01M 10/613 20150401; F28F 2265/24 20130101; H05K
7/20472 20130101; H01M 10/653 20150401; H01M 10/658 20150401; F28D
2021/0043 20130101 |
International
Class: |
F28F 9/007 20060101
F28F009/007 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 3, 2014 |
DE |
102014203846.4 |
Claims
1. An arrangement, comprising: an electrical component and a heat
exchanger arranged on the electrical component for controlling a
temperature of the electrical component, and an electrically
insulating isolation layer arranged at least partially between the
heat exchanger and electrical component wherein the isolation layer
is connected to at least one of the electrical component and the
heat exchanger via a materially cohesive connection.
2. The arrangement according to claim 1, wherein the isolation
layer is soldered in a plurality of sections for the materially
cohesive connection.
3. The arrangement according to claim 1, wherein the isolation
layer has a metal coating on at least one side.
4. The arrangement according to claim 1, wherein the isolation
layer has a copper sheet oxidised thereon.
5. The arrangement according to claim 2, wherein the isolation
layer includes a solder material for soldering.
6. The arrangement according to claim 1, wherein the isolation
layer is integrated at least partially on at least one of the heat
exchanger and the electrical component for the materially cohesive
connection.
7. The arrangement according to claim 1, wherein the isolation
layer is connected to at least one of the heat exchanger and the
electrical component via a nanofoil to define the materially
cohesive connection.
8. The arrangement according to claim 1, wherein the isolation
layer contains a ceramic.
9. The arrangement according to claim 1, wherein the isolation
layer contains a glass material.
10. The arrangement according to claim 1, wherein the isolation
layer contains a silicon resin varnish.
11. The arrangement according to claim 1, wherein the isolation
layer includes at least one of a metal sheet and a metal coating
disposed on a side facing the heat exchanger.
12. The arrangement according to claim 1, wherein the electrical
component is an electrical energy storage device.
13. The arrangement according to claim 1, wherein the isolation
layer has a thickness of less than 2 mm.
14. The arrangement according to claim 1, wherein the isolation
layer has a thickness of about 0.05 mm to 1.0 mm.
15. The arrangement according to claim 1, wherein the isolation
layer is a ceramic foil, wherein a solder material is disposed at
least partially on the ceramic foil for the materially cohesive
connection.
16. The arrangement according to claim 2, wherein the isolation
layer includes a metal coating disposed on at least one side
thereof.
17. The arrangement according to claim 3, wherein the isolation
layer contains at least one of a ceramic material, a glass
material, and a silicon resin varnish.
18. The arrangement according to claim 4, wherein the isolation
layer contains at least one of a ceramic material, a glass
material, and a silicon resin varnish.
19. The arrangement according to claim 18, wherein the isolation
layer is connected to at least one of the heat exchanger and the
electrical component via a nanofoil.
20. An arrangement for a vehicle, comprising: an electrical
component; a heat exchanger mounted to the electrical component
configured to control a temperature of the electrical component;
and an isolation layer arranged between the electrical component
and the heat exchanger, wherein the isolation layer includes a
first oxidized copper sheet on a side facing the electrical
component and a second oxidized copper sheet on a side facing the
heat exchanger, the isolation layer further including a metal layer
disposed between the second copper sheet and the heat exchanger,
wherein the isolation layer is connected to at least the heat
exchanger via a materially cohesive connection.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to German Patent
Application No. 10 2014 203 846.4, filed Mar. 3, 2014, the contents
of which are hereby incorporated by reference in their
entirety.
TECHNICAL FIELD
[0002] The present invention relates to an arrangement having an
electrical component and a heat exchanger for the temperature
control of the electrical component.
BACKGROUND
[0003] Electrical components, in particular electrical energy
storage devices, for example rechargeable or non-rechargeable
batteries, are used in many applications. In many of these
applications it is necessary to bring the electrical components to
a desired temperature level before, during or after operation and
to keep it at such a temperature level. To implement a
corresponding temperature control of the electrical components,
heat exchangers are commonly used, which can be configured in
particular as heat exchanger plates. To prevent the heat exchanger
and surrounding objects being energised, i.e. the transmission of
electrical current and electrical voltage to the heat exchanger and
objects, it is desirable to create electrical insulation between
the electrical component and the generally electrically conductive
heat exchanger. Such energisation can occur in particular if the
electrical component and/or the heat exchanger is damaged, for
example in an accident, in particular when used in a motor vehicle.
To this end, electrically insulating isolation layers are usually
used, which are arranged between the electrical component and the
heat exchanger.
[0004] DE 10 2011 109 969 A1 discloses using a thermally conductive
foil consisting of a plastic or ceramic as the isolation layer.
[0005] DE 10 2010 034 082 A1 proposes a thermally conductive foil
or an electrically insulating, thermally conductive paste as the
isolation layer.
[0006] The disadvantage of arrangements of electrical component and
heat exchanger known from the prior art is that the connection or
arrangement of the isolation layer is associated with high
production costs and/or assembly costs. The isolation layers also
have high thermal resistances, which result in inefficient
temperature control of the electrical component. In addition, these
arrangements have the disadvantage that thermal deformation of the
electrical component and/or of the heat exchanger can occur owing
to the compound of the isolation layer and/or of the temperature
control system, which deformation can lead to corresponding damage
and/or losses of mechanical contact in the arrangement.
SUMMARY
[0007] The present invention is concerned with the problem of
specifying an improved or at least alternative embodiment for an
arrangement of the above-mentioned type, which in particular has
low production costs and/or an extended service life and/or more
efficient temperature control and/or more efficient electrical
insulation between the electrical component and the heat
exchanger.
[0008] This problem is solved according to the invention by the
subject matter of the independent claim. Advantageous embodiments
form the subject matter of the dependent claims.
[0009] The present invention is based on the general concept of
connecting an isolation layer, which is arranged between the
electrical component and the heat exchanger in an arrangement of an
electrical component and a heat exchanger that controls the
temperature of the electrical component, in a materially cohesive
manner to the heat exchanger and/or to the electrical component.
The materially cohesive connection allows inexpensive production
and assembly of the arrangement. Furthermore, a stable connection
between the isolation layer and/or the electrical component and/or
the heat exchanger can be realised thereby, so that the service
life and stability of the arrangement is improved. The isolation
layer is used for electrical insulation between the electrical
component, or component for short, and the heat exchanger. In
addition, the isolation layer is preferably thermally conductive
and has a low thermal resistance, so that the heat exchanger
between the component and the heat exchanger is impaired as little
as possible by the isolation layer. The form-fitting connection of
the isolation layer helps to minimise impairment of or even improve
the thermal conduction between the heat exchanger and the
component.
[0010] The materially cohesive connection of the isolation layer is
preferably implemented on the heat exchanger side. This means that
the isolation layer is connected in a materially cohesive manner to
the heat exchanger at least in some regions. The arrangement can be
assembled in such a manner that the isolation layer is already
connected to the heat exchanger. Of course, it is also possible to
connect the isolation layer in materially cohesive manner to the
component, so that the isolation layer is already connected to the
component before assembly of the arrangement. It is also
conceivable that the isolation layer is a part or constituent of
the heat exchanger or component owing to the corresponding
materially cohesive connection.
[0011] Such a materially cohesive connection of the isolation layer
can for example take place by adhesive bonding of the isolation
layer. Adhesive bonding of the isolation layer allows a simple
and/or inexpensive connection of the isolation layer. To this end,
an inorganic adhesive, in particular an inorganic adhesive cement,
is preferably used. It is also conceivable to use an organic
adhesive that contains in particular silicone. The adhesive bonding
of the isolation layer can likewise take place with the aid of a
hot adhesive film. To improve the heat exchange, the adhesive
preferably contains thermally conductive constituents, in
particular thermally conductive particles.
[0012] In a preferred embodiment, the isolation layer is soldered,
at least in some sections, for a materially cohesive connection.
Soldering of the isolation layer is an inexpensive type of
connection, which entails advantageous thermal conductivity
properties. The soldering of the isolation layer can be implemented
in any desired manner. In particular, the soldering can take place
in air, in a protective gas, in particular argon and nitrogen, or
in a vacuum.
[0013] Any desired types of soldering agents or solder for short
can be used to solder the isolation layer. This includes in
particular metals and metal alloys. In particular, the solder can
contain silver, copper, zinc, tin, gold, silicon, aluminium and
titanium. It is also conceivable to mix an oxide with the solder.
The solder can be present in any desired form. It is conceivable to
use the solder as a film or a paste. It is also conceivable to
place, spread or spray the solder onto the corresponding
surface.
[0014] The isolation layer can have a coating of metal, at least on
one side. This means that the isolation layer can be metallised, at
least on one side. The metallisation of the isolation layer in
particular serves the purpose of realising an improved materially
cohesive connection and/or an improved thermal conductivity. The
metal coating or metallisation can be applied in a pointlike,
line-like or segment-like manner. It is also conceivable to provide
the isolation layer areally with such a metal layer, at least in
some regions.
[0015] In further configurations, the isolation layer has at least
one copper sheet oxidised thereon, which can also be oxidised on
the isolation layer in a point-like, line-like, segment-like or
areal manner. The copper sheet is preferably direct bonded copper.
It is thus possible to produce a stable connection of the isolation
layer and to make the thermal conductivity as effective as
possible. In particular, the copper sheet makes it possible by
means of the corresponding materially cohesive connection, to
improve the conductivity owing to the fewest or lowest contact
losses possible.
[0016] The metal layer and/or the copper sheet is preferably
applied on the side of the isolation layer that faces the heat
exchanger in order to avoid electrical contact between the
electrical components and the isolation layer. The metal layer or
copper sheet also serves the purpose of improving the diffusion
barrier and of corrosion protection.
[0017] In preferred embodiments, the isolation layer contains the
solder for soldering. This can be realised by adding solder to the
isolation layer. It is also conceivable to use the metal coating
and/or the copper sheet as solder. The solder can also contain
glass or be configured as solder glass, so that the isolation layer
corresponding contains glass. The provision of the isolation layer
with solder results in the simplification of the production of the
materially cohesive connection, since the use of special and
external solder can be omitted.
[0018] To improve the connection of the solder and/or metal coating
and/or copper sheet to the isolation layer, adhesion agents or
adhesion promoters can also be provided. The adhesion agent or
adhesion promoter is in particular applied to the isolation layer.
The isolation layer can also contain adhesion promoters or adhesion
agents.
[0019] The materially cohesive connection of the isolation layer
can also be realised by producing the isolation layer on the heat
exchanger and/or component, at least in some sections. In this case
configurations are preferred in which the isolation layer is
produced on the heat exchanger, in order to avoid damage to or
adverse effects on the component. The production of the isolation
layer on the heat exchanger or component at least in some sections
means in particular that no separate connection, for example by
soldering or adhesive bonding, is necessary. This results in
reduced production costs. Furthermore, the production of the
isolation layer on the heat exchanger or component results in an
improved connection, so that the connection has improved stability
and/or the thermal conductivity is improved. To this end, it is in
particular conceivable to sinter, cast, fire, injection-mould the
isolation layer.
[0020] The isolation layer can in principle be produced from any
desired material or from any desired material composition. This
includes for example ceramic, which is a suitable material for the
isolation layer owing to its electrically insulating property with
at the same time good thermal conductivity. The isolation layer
then contains ceramic and is preferably configured as a ceramic.
The ceramic is preferably present as a plate or preferably as a
foil. Metal oxides, for example aluminium oxide, zirconium oxide
and zirconium-reinforced aluminium oxide can be used as the
ceramic. It is likewise conceivable to use metal nitrides, such as
silicon nitride or aluminium nitride, as the ceramic. Hard
porcelain or cordierite can likewise be used. Of course, it is also
conceivable that the ceramic is composed of a mixture of the said
materials. The ceramic can then be composed of solid particles,
binders and/or solvents. For example, organic polymers are used as
binders and volatile organic agents are used as solvents.
[0021] The ceramic-containing isolation layer or the isolation
layer consisting of ceramic can be produced on the component or
heat exchanger. Production preferably takes place on the heat
exchanger. It is likewise possible to sinter the ceramic after it
is applied to the heat exchanger or sinter it thereon. To this end,
any desired sintering method can be used, for example hot pressing
and/or spark plasma sintering (SPS).
[0022] In other embodiments, the isolation layer can be produced on
the heat exchanger or component by applying such an isolation layer
as a diamond coating, preferably on the heat exchanger. To this
end, a microplasma diamond coating is preferably used, for example
by means of chemical vapour deposition (CVD).
[0023] In further preferred embodiments, the materially cohesive
connection of the isolation layer is realised by means of a
nanofoil. The use of the nanofoil allows low voltages and/or
currents to be used for the materially cohesive connection of the
isolation layer, so that a protective connection takes place and
damage to the isolation layer and/or heat exchanger and/or
component is avoided or at least reduced. "Soldering with
lightning" in particular is used to connect the isolation layer by
means of the nanofoil.
[0024] In further embodiments, the isolation layer can contain
glass and in particular be present as a glass foil or glass paste.
In this case, the isolation layer that is in the form of a glass
foil or glass paste is preferably soldered to the heat exchanger.
It is also conceivable that the isolation layer is present as a
glaze and is fired onto the component, but preferably onto the heat
exchanger. A cost-effective and simple connection of the isolation
layer is thus realised. The glass-containing isolation layer can
also have adhesion promoters and/or solvents and/or binders.
[0025] In other embodiments, the isolation layer contains a silicon
resin varnish. The silicon resin varnish preferably contains an
epoxy resin. The silicon resin varnish is in particular in the form
of a 2-component silicon resin varnish, in particular polyurethane
and polysilazen. It is in particular conceivable for the isolation
layer to be such a silicon resin varnish. The isolation layer is in
this case connected with a corresponding heat treatment, as a
result of which the silicon resin varnish connects to the heat
exchanger or component. A protective and simple connection of the
isolation layer is thereby possible.
[0026] The materially cohesive connection types of the isolation
layer as explained above can each be present separately in order to
realise the most inexpensive and/or thermally conductive isolation
layer possible between the component and the heat exchanger, with
an improved service life. Of course, it is also possible to combine
said connection types as desired, where possible.
[0027] To reduce the negative effect of the isolation layer on heat
exchange between the component and the heat exchanger, the
isolation layer is preferably thin. The isolation layer in
particular has thicknesses of less than 2 mm, preferably less than
1 mm, and very preferably between 0.05 mm and 1 mm.
[0028] The component can be any electrical component. In
particular, the component can be used in mobile applications, for
example in a vehicle. The component can be an electrical consumer,
an electrical energy storage device or an electrical converter. The
electrical component can in particular be a rechargeable or
non-rechargeable battery.
[0029] If the electrical insulation is insufficient, there is a
risk of a short circuit between the component and the heat
exchanger. The isolation layer is then advantageous configured in
such a manner that sufficient electrical insulation is ensured
between the component and the heat exchanger. "Sufficient" in this
case depends in particular on the application. With an electrical
component that is used in a high-voltage range in a vehicle, in
which electrical voltages of approx. 400 V occur, the isolation
layer is for example configured in such a manner that it has a
dielectric strength of approx. 1.5 KV-4 KV. To ensure the
electrical insulation between the component and the heat exchanger,
it can be necessary, in particular with thin isolation foils, for
the isolation foil to be arranged areally and in particular over
the entire area between the heat exchanger and the component.
[0030] The heat exchanger can be realised in any desired manner as
long as it ensures heat exchange with the component. Heat exchange
between the component and the heat exchanger is preferably realised
as temperature control of the component, with which the component
is cooled as required. This can be necessary in a component
configured as an energy storage device in a vehicle, for example
during operation of the vehicle, in order to prevent overheating of
the component. The heat exchanger can likewise be used to heat up
the component as required. Such a case can arise for example during
or before starting of the corresponding application, in particular
of the associated vehicle.
[0031] The heat exchanger is preferably plate-shaped, so that heat
exchange having the highest possible efficiency and/or over the
greatest possible area can take place between the heat exchangers
or heat plate and the component. It is also conceivable for a
fluid, in particular a coolant, to flow through the heat exchanger,
in particular the heat plate. In these cases, there is an increased
risk of energisation of the heat exchanger and of constituents
connected to the heat exchanger, so electrical insulation between
the component and the heat exchanger is more important.
[0032] Further important features and advantages of the invention
can be found in the subclaims, the drawings and the associated
description of the figures using the drawings.
[0033] It is self-evident that the above-mentioned features and
those still to be explained below can be used not only in the
combination given in each case but also in other combinations or
alone without departing from the scope of the present
invention.
[0034] Preferred exemplary embodiments of the invention are shown
in the drawings and are explained in more detail in the description
below, the same reference symbols referring to the same or similar
or functionally equivalent components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0035] In the figures,
[0036] FIG. 1 schematically shows a section through an
arrangement,
[0037] FIG. 2-FIG. 5 each schematically show an exploded diagram of
a detail of FIG. 1.
DETAILED DESCRIPTION
[0038] FIG. 1 shows an arrangement 1 having an electrical component
2 and a heat exchanger 3. The electrical component 2 is in the
present case configured purely by way of example as a battery 4 or
rechargeable battery 4'. The heat exchanger 3 is configured as a
heat exchanger plate 5 and has a plurality of flow ducts 6, through
which a coolant can flow. In the section shown, the electrical
component 2, or component 2 for short, and the heat exchanger 3 are
rectangular and dimensioned such that the mutually facing sides of
the component 2 and of the heat exchanger 3 cover each other. The
heat exchanger 3 is used for the temperature control of the
component 2, in particular for cooling of the component 2. If the
current-carrying or live component 2 is damaged, energisation of
the heat exchanger 3 can occur, so the heat exchanger 3 is supplied
with current or is live. In order to prevent or reduce such a risk,
an electrically insulating isolation layer 7 is arranged between
the component 2 and the heat exchanger 3. In the example shown, the
isolation layer 7 separates the component 2 and the heat exchanger
3 over the entire contact area in order to prevent a corresponding
electrical short circuit between the component 2 and the heat
exchanger 3.
[0039] The isolation layer 7 is according to the invention
connected in a materially cohesive manner to the component 2 or to
the heat exchanger 3, the materially cohesive connection preferably
being realised on the heat exchanger side. The isolation layer 7 is
preferably formed as a foil 8 that has a thickness between 0.05 mm
and 1 mm. The isolation layer 7 contains glass or ceramic. The
isolation layer 7 can also have a silicon resin varnish 9.
[0040] FIGS. 2 to 5 show exploded diagrams of the arrangement 1, in
which the component 2 is not shown.
[0041] In the exemplary embodiment shown in FIG. 2, the isolation
layer 7 is formed as a ceramic foil 10. The materially cohesive
connection of the ceramic foil 10 to the heat exchanger 3 takes
place by soldering the ceramic foil 10 to the heat exchanger 3. To
this end, a solder 11 is used, which is arranged areally between
the ceramic foil 10 and the heat exchanger 3. The solder 11 can in
this case be present in the form of a solder foil 11' or a solder
paste 11''. The solder 11 can be spread or sprayed onto the ceramic
foil 10 or heat exchanger 3 and then used for soldering. For
example, metals that can be mixed with oxides are used as solder
materials. It is also conceivable to use a glass-containing solder
11 or a solder glass 11'''.
[0042] In the variant shown in FIG. 3, a layer of adhesion promoter
12 is also provided, which is applied to the side of the isolation
layer 7 that faces the heat exchanger 3 and/or to the side of the
heat exchanger 3 that faces the isolation layer 7. The adhesion
promoter 12 improves the adhesion of the solder 11 or of the
isolation layer 7 to the heat exchanger 3. In this case it is also
possible to provide the solder 11 with such an adhesion promoter
12. The adhesion promoter 12 is distributed uniformly over the
respective area in order to ensure a homogeneous connection.
[0043] In the exemplary embodiment shown in FIG. 4, the isolation
layer 7 is provided with a metal coating 13 on both sides, that is
on the side facing the heat exchanger 3 and on the side facing the
component 2. The metal coating 13 can be realised as a
metallisation of the corresponding surfaces of the isolation layer
7 and in the example shown in distributed in a segment-like and
homogeneous manner on the isolation layer 7. The thermal
conductivity of the arrangement, in particular the thermal
conductivity between the heat exchanger 3 and the isolation layer 7
and between the isolation layer 7 and the component 2, is improved
by the application of the metal layer 13 to the isolation layer
7.
[0044] The metal layer 13 can also contain the solder 11, this
being the case only if the metallisation is applied to the side of
the isolation layer 7 that faces the heat exchanger 3, owing to the
materially cohesive connection of the isolation layer 7 that is
realised on the heat exchanger side. In this case, the areal solder
11 shown in FIG. 4 can be omitted, so that the production and
assembly of the arrangement is simplified.
[0045] In the exemplary embodiment shown in FIG. 5, the isolation
layer 7 is provided on both sides with a copper sheet 14 oxidised
thereon, which is in each case oxidised on the isolation layer 7 in
a segment-like and homogeneous manner. The copper sheet 14 oxidised
thereon is preferably present as direct bonded copper 15. The
connection of the isolation layer 7 and the thermal conductivity
can thus be further improved. In the example shown in FIG. 5, an
additional such metal layer 13 is applied to the copper sheet 14 on
the side of the isolation layer 7 that faces the heat exchanger 3.
In this case the metal layer 13 can in particular contain the
solder 11, so that the solder 11 shown in FIG. 5 can be
omitted.
[0046] In the variants shown above, adhesion promoters 12 can also
be used, which for example allow an improved adhesion of the metal
layer 13 or of the copper sheet 14 to the isolation layer 7.
[0047] Alternatively to the embodiments shown in FIGS. 4 and 5, the
isolation layer 7 can be provided with solder 11 in order to
dispense with the use of additional solder 11.
[0048] In the arrangement 1 shown in FIG. 1, the materially
cohesive connection of the isolation layer 7 can also be realised
by producing the isolation layer 7 on the component 2 or on the
heat exchanger 3, preferably on the heat exchanger 3. The isolation
layer 7, in particular the ceramic foil 10, can be produced by
producing the ceramic foil 10 on the heat exchanger 3 by means of a
sintering method, in particular press sintering.
[0049] As a further alternative for the materially cohesive
connection of the isolation layer 7, a nanofoil 16 can be used
instead of the solder 11 shown in FIG. 2. In this case the
materially cohesive connection of the isolation layer 7 to the heat
exchanger 3 or component 2 is realised by the use of low electrical
currents or voltages ("soldering with lightning"). As mentioned
above, the isolation layer 7 is connected in a materially cohesive
manner to the heat exchanger 3. Then the side of the heat exchanger
3 that has the isolation layer 7 is brought into contact with the
component 2, so that both electrical insulation is realised between
the heat exchanger 3 and the component 2 and heat exchange is
possible between the heat exchanger 3 and the electrical component
2.
* * * * *