U.S. patent application number 14/625480 was filed with the patent office on 2015-08-27 for thermal regulation system for at least one electronic module embedded onboard an aircraft.
The applicant listed for this patent is THALES. Invention is credited to Romain Hodot, Philippe Oconte, Claude Sarno.
Application Number | 20150241144 14/625480 |
Document ID | / |
Family ID | 50877399 |
Filed Date | 2015-08-27 |
United States Patent
Application |
20150241144 |
Kind Code |
A1 |
Sarno; Claude ; et
al. |
August 27, 2015 |
THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE
EMBEDDED ONBOARD AN AIRCRAFT
Abstract
Heat regulation system (1) for at least one equipment item (2)
embedded onboard an aircraft, includes a thermal regulation circuit
(5) connected to the equipment item(s) (2). The thermal regulation
circuit (5) includes a modular thermal regulation device (6)
adapted to receive a modifiable number of thermal regulation
modules (8).
Inventors: |
Sarno; Claude; (Etoile Sur
Rhone, FR) ; Oconte; Philippe; (Livron-Sur-Drome,
FR) ; Hodot; Romain; (Valence, FR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
THALES |
Courbevoie |
|
FR |
|
|
Family ID: |
50877399 |
Appl. No.: |
14/625480 |
Filed: |
February 18, 2015 |
Current U.S.
Class: |
165/80.4 |
Current CPC
Class: |
H05K 7/20681 20130101;
H05K 7/20645 20130101; F28D 1/02 20130101; F28F 9/007 20130101 |
International
Class: |
F28F 9/007 20060101
F28F009/007; F28D 1/02 20060101 F28D001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 21, 2014 |
FR |
1400460 |
Claims
1. Thermal regulation system for at least one equipment item
embedded onboard an aircraft, comprising: a thermal regulation
circuit external to said equipment item(s) and connected to said
equipment item(s), said thermal regulation circuit comprising a
modular thermal regulation device adapted to receive a modifiable
number of thermal regulation modules of different kinds, the
modular thermal regulation device comprising a frame adapted to
receive a modifiable number of thermal regulation modules; and said
thermal regulation circuit comprising at least one thermal
connector connected to an embedded electronic module.
2. System according to claim 1, in which the equipment item(s)
comprise at least one electronic module.
3. System according to claim 2, in which said thermal regulation
circuit comprises a two-phase heat transfer fluid.
4. System according to claim 3, in which at least one thermal
regulation module comprises at least one condenser.
5. System according to claim 2, in which said thermal regulation
circuit comprises a heat transfer fluid.
6. System according to claim 5, in which at least one thermal
regulation module comprises at least one pump.
7. System according to claim 5, in which at least one thermal
regulation module comprises at least one compressor.
8. System according to claim 2, in which said thermal regulation
circuit comprises air as heat transfer fluid.
9. System according to claim 8, in which at least one thermal
regulation module comprises at least one fan.
10. System according to claim 1, comprising at least one frame
adapted to receive a modifiable number of embedded electronic
modules.
11. System according to claim 1, in which said thermal regulation
circuit comprises a two-phase heat transfer fluid.
12. System according to claim 11, in which at least one thermal
regulation module comprises at least one condenser.
13. System according to claim 1, in which said thermal regulation
circuit comprises a heat transfer fluid.
14. System according to claim 13, in which at least one thermal
regulation module comprises at least one pump.
15. System according to claim 13, in which at least one thermal
regulation module comprises at least one compressor.
16. System according to claim 1, in which said thermal regulation
circuit comprises air as heat transfer fluid.
17. System according to claim 16, in which at least one thermal
regulation module comprises at least one fan.
18. Aircraft comprising the thermal regulation system according to
claim 1.
19. Aircraft according to claim 18, in which said thermal
regulation circuit comprises a heat transfer fluid.
20. Aircraft according to claim 18, in which said thermal
regulation circuit comprises air as heat transfer fluid.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a thermal regulation system
for at least one electronic module embedded onboard an
aircraft.
[0003] 2. Description of the Related Art
[0004] The so-called "embedded" electronic hardware is often
required to operate in difficult conditions notably of vibration,
impacts, humidity, acceleration, and confinement (problems of heat
and overheating).
[0005] These difficult conditions tend to cause operating faults in
such electronic hardware, despite all the precautions taken in
their design and their production. This leads to such electronic
hardware being designed to favour trouble-shooting and maintenance
thereof, and, to this end, such electronic hardware has to meet new
standards.
[0006] The electronic hardware used onboard aircraft, with a view
notably to facilitating the exchange of defective hardware,
implement one of the new standards cited above provides for
producing such electronic hardware (often referred to by the term
"modular avionics") in the form of modular structures, called LRM,
an acronym standing for "line replaceable module".
[0007] Such modular structures, hereinafter in the description
called electronic modules, are formed in the form of units,
generally installed in racks that combine a large number of such
electronic modules. Obviously, in smaller aircraft, such as small
aeroplanes or helicopters, the racks are smaller, even
non-existent, and the electronic modules are distributed at
different points of the aircraft.
[0008] This is favourable in terms of simplifying maintenance,
handling and rapid trouble-shooting, but tends to make it more
difficult to discharge the heat produced by the various components
contained in the modules. Furthermore, the electronic components
used are increasingly sophisticated and tend to produce more and
more thermal energy that is difficult to discharge. Systems are
known that are centralized in an aircraft, generally distributing
air, more rarely liquid, to the equipment items, to regulate their
temperature. Such a system is complex, notably with regard to the
distribution lines which are bulky and very long between the
cooling plant, or ECS, an acronym for "Environment Control System",
and the equipment items. Furthermore, the equipment items, notably
the electronic modules for high power levels or hotspots, are noisy
because of the high air velocities in the ducts.
[0009] Local systems are also known that are based on fans,
generally redundant, which lack reliability and create high
pollution risks because of the circulation of the air directly over
the components. Furthermore, the air is released locally and can
overheat the areas concerned (self-overheating). These systems can
also be noisy in high power cases (fan and air noise).
[0010] The increasing power in high-density components (multicore
processors, fpga) creates hotspots, the cooling of which is no
longer compatible with centralized or local standard air cooling
systems. A portion of the power has to be diverted to be dissipated
in more suitable remote areas (size, noise, natural cold spots,
etc.).
SUMMARY OF THE INVENTION
[0011] One aim of the invention is to mitigate these problems.
[0012] One aim of the invention is to provide an adjustable thermal
regulation system, that can be adapted to any type of aircraft,
such as an airliner, a small aeroplane or a helicopter.
[0013] According to one aspect of the invention, there is proposed
a thermal regulation system for at least one equipment item
embedded onboard an aircraft, comprising:
[0014] a thermal regulation circuit external to said equipment
item(s) and connected to said equipment item(s), said thermal
regulation circuit comprising a modular thermal regulation device
adapted to receive a modifiable number of thermal regulation
modules of different kinds, the modular thermal regulation device
comprising a frame adapted to receive a modifiable number of
thermal regulation modules;
[0015] Said thermal regulation circuit comprising at least one
thermal connector connected to an embedded electronic module.
[0016] Such a system makes it possible, at lower cost, to propose a
thermal regulation system that is modular according to the
equipment of the aircraft, and that can be adapted to the size of
the aircraft. For example, it is equally adapted to an aircraft of
large size, and to a small aircraft or a helicopter.
[0017] The modular thermal regulation device can, for example,
comprise a base or rack or frame capable of receiving a modifiable
number of plug-in and removable thermal regulation modules. Thus, a
supplier of electronic equipment can simultaneously supply its
electronic function and the associated thermal regulation module,
the assembly being qualified previously.
[0018] Thus, the modularity is easy to produce.
[0019] It is therefore advantageously possible to cool the hotspots
of electronic modules generally comprising electronic boards
provided with powerful processors locally generating very
significant releases of heat. Such thermal connectors are, for
example, described in the document FR2920946.
[0020] In one embodiment, the equipment item(s) comprise at least
one electronic module.
[0021] A system according to one aspect of the invention is
particularly well suited to thermal regulation for electronic
modules that can release high levels of heat, and even generate
hotspots.
[0022] In one embodiment, the system comprises at least one frame
adapted to receive a modifiable number of embedded electronic
modules.
[0023] Thus, the system is also well suited to large aircraft,
generally comprising one or more frames adapted to receive a
modifiable number of embedded electronic modules. Such a frame is,
for example, described in the document FR2803166.
[0024] According to one embodiment, said thermal regulation circuit
comprises a two-phase heat transfer fluid.
[0025] The use of such a two-phase heat transfer fluid makes it
possible not to have means for circulating the heat transfer fluid,
because the latter circulates by thermodynamic effect.
[0026] In one embodiment, at least one thermal regulation module
comprises at least one condenser.
[0027] Such an embodiment makes it possible to transport heat with
no external forces, and therefore with a lower energy
consumption.
[0028] Furthermore, such systems are passive and therefore have a
greater reliability (no wear elements).
[0029] As a variant, said regulation circuit comprises a heat
transfer fluid.
[0030] For example, at least one thermal regulation module
comprises at least one pump.
[0031] Such an embodiment is easier to design, and can cool modules
of higher power by increasing the pump flow rate (redundancy is
preferable to ensure a better reliability).
[0032] For example, at least one thermal regulation module
comprises at least one compressor.
[0033] Such an embodiment makes it possible to create cold, unlike
the previous systems which ensure a transfer of heat, the
compressor system can, by thermodynamic effect, create cold with
advantageous efficiency.
[0034] These compressor systems can be combined with the systems
previously described, two-phase, or pumped systems for
transportation.
[0035] As a variant, said thermal regulation circuit comprises air
as heat transfer fluid.
[0036] For example, at least one thermal regulation module
comprises at least one fan.
[0037] Such an embodiment makes it possible to use air which is the
element most readily available onboard aircraft, so it may be
interesting to create modular elements distributing air intended to
cool the thermal connector.
[0038] According to another aspect of the invention, there is also
proposed an aircraft comprising a system according to one of the
preceding claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0039] The invention will be better understood on studying a few
embodiments described as non-limiting examples, and illustrated by
the attached drawings in which:
[0040] FIG. 1 schematically illustrates a system according to one
aspect of the invention; and
[0041] FIGS. 2 to 5 illustrate variant embodiments of the
invention.
[0042] In all the Figures, the elements that have identical
references are similar.
DETAILED DESCRIPTION OF THE INVENTION
[0043] FIG. 1 schematically illustrates a thermal regulation system
according to one aspect of the invention.
[0044] A thermal regulation system 1 for at least one electronic
module 2 comprises, in the case in point, a single electronic
module 2, and a frame or rack 3 adapted to receive a modifiable
number of embedded electronic modules 2.
[0045] Such a frame is, for example, described in the French patent
application FR2803166.
[0046] Obviously, the invention applies to any combination of
several electronic modules 2.
[0047] As represented in FIG. 1, at bottom left, an electronic
module 2 comprises a hotspot linked to a thermal connector 4, as
described, for example, in the French patent application
FR2929946.
[0048] Such a thermal connector makes it possible to have, upon a
connection/disconnection, no loss of heat transfer fluid, because
at the male/female interface of the connector, there is no exchange
of fluid, because there is a loop on one side of the connector and
another loop on the other.
[0049] If the heat transfer fluid is two-phase, a thermal connector
4 can include an evaporator.
[0050] The system also comprises a thermal regulation circuit 5
connected to the electronic module(s) 2, using a heat transfer
fluid to regulate the temperature of the electronic modules 2,
notably cool them, because the latter generally comprise electronic
boards provided with powerful processors generating hotspots
releasing a great quantity of heat.
[0051] In the example of FIG. 1, the equipment items represented
are only independent electronic modules, or electronic modules that
are grouped together on a frame 3, but, obviously, the thermal
regulation circuit 5 can also be connected to any other equipment
requiring thermal regulation.
[0052] The thermal regulation system 1 also comprises a modular
device 6, that can, for example, comprise a base or rack 7 adapted
to receive an adjustable or modifiable number of thermal regulation
modules 8.
[0053] Obviously, all the elements of this system are controlled by
an electronic control unit that is not represented in the Figure,
for the feedback of information from a set of sensors, as
conventionally in any thermal regulation system.
[0054] The thermal regulation system 1 therefore comprises a
modular thermal regulation device 6 for which it is possible to
adapt and/or modify the number of thermal regulation modules that
it receives according to the number of equipment items to be
thermally regulated.
[0055] Such a system can be linked to the thermal connectors 4 by
heat transfer fluid circulation pipes or tubes of small section,
which is particularly advantageous when the equipment items to be
thermally regulated are located in areas that have little space
available or when the equipment items to be thermally regulated are
of small size. It is then possible to consider adapting the heat
transfer fluid circulation pipes or tubes, like electric cables,
along partitions or similar.
[0056] Such a system 1 makes it possible to facilitate maintenance,
and can be made redundant to improve the availability and the
reliability of the system.
[0057] In the case of replacement or addition of new equipment
items, notably of electronic modules of increasingly greater power,
therefore releasing increasing amounts of thermal energy, the
system makes it possible to replace and/or add as many thermal
regulation modules as necessary. For example, in the case of the
addition of new equipment items 2, the latter can be linked to new
thermal regulation modules 8 of the thermal regulation system 1,
without the need for intensive intervention on the rest of the
system 1.
[0058] A number of embodiments can be envisaged, notably dependent
on the heat transfer fluid chosen, for the transportation mode
(active or passive) and on the type of cooling (passive, exchanger
or compressor). In other words, for one and the same heat transfer
fluid, the thermal regulation modules 8 can be of different kinds,
so it is possible to combine the following embodiments.
[0059] A first embodiment is illustrated in FIG. 2, for which the
heat transfer fluid is a single-phase liquid, such as water or
glycol. An element 2 to be thermally regulated is linked to the
thermal regulation circuit 5 via the thermal connector 4, the
thermal regulation circuit 5 linking the element 2 to a thermal
regulation module 8. Since the heat transfer fluid is liquid, the
thermal regulation module 8 can comprise at least one pump 9, in
this case two pumps 9, as illustrated in FIG. 2.
[0060] This embodiment presents the advantage of allowing for
significant energy dissipations with production simplicity, because
there are pumps of different sizes according to the flow rates and
head losses to be observed.
[0061] A second embodiment is illustrated in FIG. 3, for which the
heat transfer fluid is pressurized air. An element 2 to be
thermally regulated is linked to the thermal regulation circuit 5
via a thermal connector 4, the thermal regulation circuit 5 linking
the element 2 to a thermal regulation module 8. Since the heat
transfer fluid is pressurized air, the thermal regulation module 8
can comprise at least one fan 10, in this case two fans 10, as
illustrated in FIG. 3.
[0062] This embodiment presents the advantage of not requiring any
additional cooling circuit, the air being able to be tapped
locally, and being available on all carriers.
[0063] A third embodiment is illustrated in FIG. 4 for which the
heat transfer fluid can be a single-phase liquid or air.
[0064] The benefit of using a compressor is that it allows for an
active cooling below room temperature, the transportation of the
heat being performed by a single-phase liquid system or by air, the
preceding embodiments requiring an active moving mechanism (pump or
fans). An element 2 to be thermally regulated is linked to the
thermal regulation circuit 5 via a thermal connector 4, the thermal
regulation circuit 5 linking the element 2 to a thermal regulation
module 8. Since the heat transfer fluid is liquid, the thermal
regulation module 8 can comprise at least one compressor 11, in
this case two compressors 11, as illustrated in FIG. 4.
[0065] This embodiment presents the advantage of being able to
lower the cold point below room temperature.
[0066] A fourth embodiment is illustrated in FIG. 5, for which the
heat transfer fluid is a two-phase system, for example, this system
makes it possible to transport the heat from the dissipative
elements to the cooler without requiring external force to move the
fluid. An element 2 to be thermally regulated is linked to the
thermal regulation circuit 5 via the thermal connector 4, in this
case an evaporator, the thermal regulation circuit 5 linking the
element 2 to a thermal regulation module 8. Since the heat transfer
fluid is two-phase (liquid and gas), the thermal regulation module
8 can comprise at least one condenser 12, as illustrated in FIG.
5.
[0067] This embodiment, employing a passive two-phase thermal
regulation circuit 5 with high conductivity of heat pipe or
two-phase loop type presents the advantage of being totally
passive, i.e. of not requiring any means for circulating the heat
transfer fluid, this circulation being linked to thermal
dynamics.
[0068] A thermal regulation system according to one aspect of the
invention is easy to install and maintain.
[0069] Such a system also makes it possible to take account of the
high power densities within a reduced footprint.
[0070] Such a system further makes it possible, in the case of the
cooling of an equipment item, to separate the area in which the
heat is dissipated from the area in which the cooling is performed,
which makes it possible to have, in proximity to the equipment
items, better environmental conditions for the equipment items. For
example, if the case of a machine containing embedded equipment
items exposed to the sun is taken, the ambient air and the
structure are at very high temperatures, so it may be more
advantageous to isolate the area of the equipment items and cool
them with compressors that can be located at a certain distance
from the hot sources via the thermal connectors.
[0071] Furthermore, in high humidity or salt mist conditions, it
may be advantageous not to blow this air directly over the
components, which would reduce their reliability, whereas the
remote cooling system can be located in an area that is protected
and connected by pipes to the dissipative element.
[0072] Such thermal regulation modules can be used in racks or be
isolated, so they can be series manufactured, which limits the unit
manufacturing cost.
* * * * *