U.S. patent application number 14/620706 was filed with the patent office on 2015-08-20 for light emitting device package, backlight unit, lighting device and its manufacturing method.
The applicant listed for this patent is LUMENS CO., LTD. Invention is credited to Yungeon CHO, Kangmin HAN, Seunghoon LEE, Seunghyun OH.
Application Number | 20150236203 14/620706 |
Document ID | / |
Family ID | 53027058 |
Filed Date | 2015-08-20 |
United States Patent
Application |
20150236203 |
Kind Code |
A1 |
OH; Seunghyun ; et
al. |
August 20, 2015 |
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND
ITS MANUFACTURING METHOD
Abstract
Disclosed are a light emitting device package, a backlight unit,
and a lighting device which are usable for a display or lighting,
and a method of manufacturing the light emitting device package.
The light emitting device package includes: a substrate; a light
emitting device seated on the substrate; a reflecting member
provided on the substrate and provided with a reflector cup
surrounding a lateral circumference of the light emitting device; a
transparent encapsulant charged in the reflector cup of the
reflecting member in a flow state and hardened, and provided with a
concave phosphor accommodating space in an upper surface thereof;
and a phosphor charged in the phosphor accommodating space in a
flow state and hardened.
Inventors: |
OH; Seunghyun; (Gwangju-si,
KR) ; LEE; Seunghoon; (Yongin-si, KR) ; CHO;
Yungeon; (Osan-si, KR) ; HAN; Kangmin;
(Suwon-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LUMENS CO., LTD |
Yongin-si |
|
KR |
|
|
Family ID: |
53027058 |
Appl. No.: |
14/620706 |
Filed: |
February 12, 2015 |
Current U.S.
Class: |
362/611 ; 257/98;
438/27 |
Current CPC
Class: |
H01L 33/24 20130101;
H01L 33/54 20130101; H01L 33/60 20130101; G02B 6/0073 20130101;
H01L 2924/181 20130101; H01L 33/507 20130101; H01L 33/505 20130101;
H01L 2933/0033 20130101; H01L 2933/0041 20130101; H01L 2924/181
20130101; H01L 2933/005 20130101; H01L 2924/00012 20130101; H01L
33/502 20130101; H01L 2224/16245 20130101; H01L 2933/0058
20130101 |
International
Class: |
H01L 33/24 20060101
H01L033/24; H01L 33/50 20060101 H01L033/50; H01L 33/54 20060101
H01L033/54; F21V 8/00 20060101 F21V008/00; H01L 33/60 20060101
H01L033/60 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 17, 2014 |
KR |
10-2014-0017961 |
Claims
1. A light emitting device package, comprising: a substrate; a
light emitting device seated on the substrate; a reflecting member
provided on the substrate and provided with a reflector cup
surrounding a lateral circumference of the light emitting device; a
transparent encapsulant charged in the reflector cup of the
reflecting member in a flow state and hardened, and provided with a
concave phosphor accommodating space in an upper surface thereof;
and a phosphor charged in the phosphor accommodating space in a
flow state and hardened, wherein a length of the phosphor is larger
than a width of the light emitting device, and a part of a boundary
of the phosphor is partially inserted into an inclined surface of
the concave phosphor accommodating space of the transparent
encapsulant.
2. The light emitting device package of claim 1, wherein the
phosphor has a crescent moon shape in which a cross section at a
center portion has a larger thickness than a thickness of a cross
section at a boundary portion thereof.
3. A backlight unit, comprising: a substrate; a light emitting
device seated on the substrate; a reflecting member provided on the
substrate and provided with a reflector cup surrounding a lateral
circumference of the light emitting device; a transparent
encapsulant charged in the reflector cup of the reflecting member
in a flow state and hardened, and provided with a concave phosphor
accommodating space in an upper surface thereof; a phosphor charged
in the phosphor accommodating space in a flow state and hardened;
and a light guide plate provided at an optical path of the light
emitting device, wherein a length of the phosphor is larger than a
width of the light emitting device, and a part of a boundary of the
phosphor is partially inserted into an inclined surface of the
concave phosphor accommodating space of the transparent
encapsulant.
4. A method of manufacturing a light emitting device package,
comprising: preparing a substrate; providing a reflecting member on
the substrate so that a reflector cup is formed; seating a light
emitting device on the substrate inside the reflector cup; charging
a transparent encapsulant in the reflector cup of the reflecting
member in a flow state so that a concave phosphor accommodating
space is formed in an upper surface of the transparent encapsulant;
charging a phosphor in the phosphor accommodating space in a flow
state before the transparent encapsulant is hardened; and thermally
hardening the transparent encapsulant and the phosphor, wherein the
charging of the phosphor includes charging the phosphor so that a
width of the phosphor is larger than a width of the light emitting
device, and a part of a boundary of the phosphor is partially
inserted into an inclined surface of the concave phosphor
accommodating space of the transparent encapsulant.
5. The method of claim 4, further comprising: rotating the
substrate by using centrifugal force after the charging of the
phosphor.
6. The method of claim 5, wherein in the rotating of the substrate,
a rotation speed or a rotation time for rotating the substrate is
larger than a deformation value by which the phosphor or the
transparent encapsulant begins to be deformed by the centrifugal
force and smaller than a separation value by which the phosphor and
the transparent encapsulant are separated from the reflector cup.
Description
CROSS REFERENCE TO RELATED PATENT APPLICATION
[0001] This application claims priority to and the benefit of
Korean Patent Application No. 10-2014-0017961 filed in the Korean
Intellectual Property Office on Feb. 17, 2014, the entire contents
of which are incorporated herein by reference.
BACKGROUND
[0002] 1. Field
[0003] The present invention relates to a light emitting device
package, a backlight unit, a lighting device, and a method of
manufacturing the light emitting device package, and more
particularly, to a light emitting device package, a backlight unit,
and a lighting device which are usable for a display or lighting,
and a method of manufacturing the light emitting device
package.
[0004] 2. Description of Related Technology
[0005] A light emitting diode (LED) refers to a sort of
semiconductor device which is capable of implementing light with
various colors by configuring a light emitting source by forming a
PN diode of a compound semiconductor. The light emitting device has
an advantage in that the light emitting device has a long lifespan,
may be implemented to be small and light, and is drivable at a low
voltage. Further, the LED is strong against impact and vibration,
does not require a preheating time and complex driving, and may be
embedded in a substrate or a lead frame and then packaged in
various forms, so that the LED may be modulated for various
purposes and applied to a backlight unit, various lighting devices,
or the like.
SUMMARY
[0006] When a light emitting device package in the related art is
utilized as a direct type backlight, the light emitting device
package is distributed in a wide area through a secondary lens, and
in this case, when a width (half-width) or an area of a light
distribution curve is small based on a light emitting axis, it may
be easy to control light.
[0007] However, when a phosphor is formed by dispensing a
fluorescent material mixed with an epoxy inside a reflector cup of
a reflecting member in the light emitting device package in the
related art, a width (half-width) or an area of a light
distribution curve is increased based on a light emitting axis, so
that it is difficult to control light, and as a result, there is a
problem in that a mura phenomenon or a yellow ring phenomenon is
generated in a display panel.
[0008] In order to solve the problem in the related art, in the
light emitting device package in the related art, the package is
formed by attaching a phosphor shaped like a sheet and the same
thickness to the light emitting device, but in this case, a peeling
phenomenon is generated in a boundary surface between the sheet and
the light emitting device due to various foreign substances,
bubbles, or the like, or there is inconvenience in that a separate
phosphor sheet for each light emitting device in accordance with a
standard essentially needs to be ordered and manufactured in
advance in order to operate a production line of a factory.
[0009] The present invention has been made in an effort to provide
a light emitting device package, a backlight unit, a lighting
device, and a method of manufacturing the light emitting device
package, in which it is easy to control light, it is possible to
prevent a mura phenomenon and a yellow ring phenomenon, and a
phosphor may be firmly and elaborately fixed to prevent a peeling
phenomenon of the phosphor, and which achieve excellent durability,
and are applicable to all of the packages with various standards in
a manufacturing field without a necessity of preparing a separate
phosphor sheet to improve versatility. However, the aforementioned
objects are illustrative, and the scope of the present invention is
not limited by the aforementioned objects.
[0010] An embodiment of the present invention provides a light
emitting device package, including: a substrate; a light emitting
device seated on the substrate; a reflecting member provided on the
substrate and provided with a reflector cup surrounding a lateral
circumference of the light emitting device; a transparent
encapsulant charged in the reflector cup of the reflecting member
in a flow state and hardened, and provided with a concave phosphor
accommodating space in an upper surface thereof; and a phosphor
charged in the phosphor accommodating space in a flow state and
hardened.
[0011] The phosphor may have a crescent moon shape in which a cross
section at a center portion is thick and a cross section at a
boundary portion is thin, and have a larger length than a width of
the light emitting device.
[0012] A part of a boundary of the phosphor may be partially
inserted into an inclined surface of the transparent
encapsulant.
[0013] Another embodiment of the present invention provides a
backlight unit, including: a substrate; a light emitting device
seated on the substrate; a reflecting member provided on the
substrate and provided with a reflector cup surrounding a lateral
circumference of the light emitting device; a transparent
encapsulant charged in the reflector cup of the reflecting member
in a flow state and hardened, and provided with a concave phosphor
accommodating space in an upper surface thereof; a phosphor charged
in the phosphor accommodating space in a flow state and hardened;
and a light guide plate provided at an optical path of the light
emitting device.
[0014] Still another embodiment of the present invention provides a
lighting device, including: a substrate; a light emitting device
seated on the substrate; a reflecting member provided on the
substrate and provided with a reflector cup surrounding a lateral
circumference of the light emitting device; a transparent
encapsulant charged in the reflector cup of the reflecting member
in a flow state and hardened, and provided with a concave phosphor
accommodating space in an upper surface thereof; and a phosphor
charged in the phosphor accommodating space in a flow state and
hardened.
[0015] Yet another embodiment of the present invention provides a
method of manufacturing a light emitting device package, including:
preparing a substrate; providing a reflecting member on the
substrate so that a reflector cup is formed; seating a light
emitting device on the substrate inside the reflector cup; charging
a transparent encapsulant in the reflector cup of the reflecting
member in a flow state so that a concave phosphor accommodating
space is formed in an upper surface of the transparent encapsulant;
firstly thermally hardening the transparent encapsulant; charging a
phosphor in the phosphor accommodating space in a flow state; and
secondly thermally hardening the phosphor.
[0016] In the charging of the transparent encapsulant, the
transparent encapsulant may be insufficiently supplied to the
reflector cup, with a smaller quantity than a quantity, with which
the reflector cup is fully filled, so that the concave phosphor
accommodating space is formed in the upper surface of the
transparent encapsulant, and in the charging of the phosphor, the
phosphor may be insufficiently supplied to the phosphor
accommodating space, with a smaller quantity than a quantity, with
which the phosphor accommodating space is fully filled, so that the
phosphor has a crescent moon shape in which a cross section at a
center portion is thick and a cross section at a boundary portion
is thin.
[0017] The method may further include: firstly vibrating the
substrate so that the transparent encapsulant is widely applied
onto the reflector cup after the charging of the transparent
encapsulant; and secondly vibrating the substrate so that the
phosphor is widely applied onto the phosphor accommodating space
after the charging of the phosphor.
[0018] Still yet another embodiment of the present invention
provides a method of manufacturing a light emitting device package,
including: preparing a substrate; providing a reflecting member on
the substrate so that a reflector cup is formed; seating a light
emitting device on the substrate inside the reflector cup; charging
a transparent encapsulant in the reflector cup of the reflecting
member in a flow state so that a concave phosphor accommodating
space is formed in an upper surface of the transparent encapsulant;
charging a phosphor in the phosphor accommodating space in a flow
state; rotating the substrate by using centrifugal force; and
thermally hardening the transparent encapsulant and the
phosphor.
[0019] In the rotating of the substrate, a rotation speed or a
rotation time for rotating the substrate may be larger than a
deformation value by which the phosphor or the transparent
encapsulant begins to be deformed by the centrifugal force and
smaller than a separation value by which the phosphor and the
transparent encapsulant are separated from the reflector cup.
[0020] According to the embodiments of the present invention, it is
possible to decrease a width (half-width) or an area of a light
distribution curve based on a light emitting axis by optimizing a
shape of a phosphor, so that it is easy to control light, and it is
possible to prevent a mura phenomenon and a yellow ring phenomenon,
firmly and elaborately fix the phosphor to prevent a peeling
phenomenon of the phosphor, achieve excellent durability, and apply
the present invention to all of the packages having various
standards in a manufacturing field without a necessity of preparing
a separate phosphor sheet, thereby improving versatility. The scope
of the present invention is not limited by the effects as a matter
of course.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a perspective view illustrating a light emitting
device package according to an embodiment of the present
invention.
[0022] FIG. 2 is a cross-sectional view taken along line II-II of
the light emitting device package of FIG. 1.
[0023] FIG. 3 is a cross-sectional view illustrating a light
emitting device package according to another embodiment of the
present invention.
[0024] FIGS. 4 to 8 are cross-sectional views sequentially
illustrating a process of manufacturing the light emitting device
package of FIG. 2.
[0025] FIG. 9 is a cross-sectional view illustrating a backlight
unit according to an embodiment of the present invention.
[0026] FIGS. 10 to 16 are cross-sectional views sequentially
illustrating a process of manufacturing the light emitting device
package of FIG. 3.
[0027] FIG. 17 is a flowchart illustrating a method of
manufacturing a light emitting device package according to the
embodiment of the present invention.
[0028] FIG. 18 is a flowchart illustrating a method of
manufacturing a light emitting device package according to another
embodiment of the present invention.
[0029] FIG. 19 is a flowchart illustrating a method of
manufacturing a light emitting device package according to yet
another embodiment of the present invention.
DETAILED DESCRIPTION
[0030] Hereinafter, various embodiments of the present invention
will be described in detail with reference to the accompanying
drawings.
[0031] The embodiments of the present invention are provided for
more fully describing the present invention to those skilled in the
art, and the embodiments below may be modified in various forms,
and the scope of the present invention is not limited to the
embodiments below. Rather, these embodiments are provided such that
this disclosure will be thorough and complete and will fully convey
the spirit of the present invention to those skilled in the art.
Further, in the drawings, a thickness or a size of each layer is
exaggerated for convenience and clarity of description.
[0032] FIG. 1 is a perspective view illustrating a light emitting
device package 100 according to an embodiment of the present
invention. FIG. 2 is a cross-sectional view taken along line II-II
of the light emitting device package 100 of FIG. 1.
[0033] First, as illustrated in FIGS. 1 and 2, the light emitting
device package 100 according to the embodiment of the present
invention may generally include a substrate 10, a light emitting
device 20, a reflecting member 30, a transparent encapsulant 40,
and a phosphor 50.
[0034] Here, as illustrated in FIGS. 1 and 2, the substrate 10 may
include a lead frame provided with a first electrode 11 at one side
and a second electrode 12 at the other side relative to an
electrode separating space.
[0035] The substrate 10 may be made of a material having
appropriate mechanical strength and insulation property or a
conductive material so as to support or accommodate the light
emitting device 20, the reflecting member 30, the transparent
encapsulant 40, and the phosphor 50.
[0036] For example, an insulation-processed metal substrate, such
as aluminum, copper, zinc, tin, lead, gold, and silver, may be
applied to the substrate 10, and a plate-shaped substrate or a lead
frame-shaped substrate may be applied to the substrate 10.
[0037] The substrate 10 may be a printed circuit board (PCB) in
which an epoxy-based resin sheet are formed in a multilayer.
Further, the substrate 10 may be a flexible printed circuit board
(FPCB) formed of a flexible material.
[0038] A synthetic resin substrate made of resin and glass epoxy,
or a ceramic substrate in consideration of thermal conductivity is
applicable to the substrate 10.
[0039] The substrate 10 may be partially or entirely formed of one
or more selected from an epoxy mold compound (EMC), polyimide (PI),
ceramic, graphene, glass synthetic fiber, and combinations thereof
so as to enhance processibility.
[0040] In the meantime, as illustrated in FIGS. 1 and 2, the light
emitting device 20 may be a flip chip type light emitting diode
(LED) having a first pad and a second pad.
[0041] The light emitting device 20 may be formed of a
semiconductor as illustrated in FIG. 1. For example, LEDs formed of
a nitride semiconductor and emitting blue, green, red, and yellow
light, an LED emitting ultraviolet light, an LED emitting infrared
light, and the like may be applied to the light emitting device
20.
[0042] A light emitting device having a predetermined wavelength
according to a use, such as a display use or a lighting use, may be
selected for the light emitting device 20.
[0043] Here, an insulating substrate, a conductive substrate, or a
semiconductor substrate may be used as a growth substrate if
necessary.
[0044] A sapphire substrate, a silicon carbide (SiC) substrate, and
the like are mainly used as a heterogeneous substrate, and a
sapphire substrate is more widely utilized than an expensive
silicon carbide substrate.
[0045] When the growth substrate is removed, another supporting
substrate may be used, and in order to improve light efficiency of
an LED chip at an opposite side of the original growth substrate,
the supporting substrate may be bonded by using a reflective metal
or a reflective structure may be inserted into a center of an
adhesive layer.
[0046] Patterning of the growth substrate forms concave-convex
portions or an inclined surface on a main surface (a surface or
both surfaces) or a lateral surface of the substrate before or
after an LED structure is grown, thereby improving light extraction
efficiency.
[0047] Although not illustrated in the drawings, the light emitting
device 20 may be a flip chip type including a signal transmitting
medium, such as a pump or a solder, in addition to the pad, and in
addition, all of a light emitting device, in which a bonding wire
is applied to a terminal or a bonding wire is partially applied
only to a first terminal or a second terminal, a horizontal light
emitting device, a vertical light emitting device, and the like may
be applied as the light emitting device 20.
[0048] One light emitting device 20 may be provided on the
substrate 10 as illustrated in FIGS. 1 and 2, and in addition, a
plurality of light emitting devices 20 may be provided on the
substrate 10.
[0049] Meanwhile, as illustrated in FIG. 1, the reflecting member
30 may be a member that is provided on the substrate 10, and is
provided with a reflector cup 31 surrounding a lateral
circumference of the light emitting device 20 and an electrode
separating portion 32 that fills the electrode separating
space.
[0050] Here, in the reflecting member 30, the electrode separating
portion 32 and the reflector cup 31 may be integrally molded by a
mold.
[0051] Meanwhile, as illustrated in FIG. 1, the transparent
encapsulant 40 may be charged in the reflector cup 31 of the
reflecting member 30 in a flow state and hardened, and provided
with a concave phosphor accommodating space in an upper surface 40a
thereof, and may be formed of one or more selected from silicon,
transparent epoxy, a phosphor, which are materials having
relatively small and fine particles, and a combination thereof.
[0052] Meanwhile, as illustrated in FIGS. 1 and 2, the phosphor 50
may be charged in the phosphor accommodating space in a flow state
and hardened.
[0053] The phosphor 50 may include materials, such as a quantum dot
(QD), and the phosphor and the QD may be mixed and used or
separately used in the LED.
[0054] The phosphor 50 may be sprayed and applied onto the LED chip
or the light emitting device.
[0055] In order to make a difference in light efficiency and a
light distribution characteristic, a photoconversion material may
be positioned by a remote type, and in this case, the
photoconversion material is positioned together with a material,
such as a transmissive polymer and glass, according to durability
and heat resistance.
[0056] The phosphor applying technique is most important in
determining a light characteristic in the light emitting device, so
that control techniques for a thickness of a phosphor applied
layer, uniform distribution of a phosphor, and the like have been
variously researched. The QD may also be positioned on the LED chip
or the light emitting device by the same method as that of the
phosphor, and may be positioned between glass or transmissive
polymer materials to convert light.
[0057] As illustrated in FIG. 2, the phosphor 50 may have a
crescent moon shape in which a thickness T1 of a cross section at a
center portion is large and a thickness T2 of a cross section at a
boundary portion is small, and a length L1 thereof may be larger
than a width W1 of the light emitting device 20.
[0058] Accordingly, the light passing through the center portion of
the phosphor 50 having the large thickness T1 has a high
probability of meeting phosphor particles, so that a quantity or
intensity of white light is large, and the light passing through
the boundary portion of the phosphor 50 having the small thickness
T2 has a low probability of meeting phosphor particles, so that a
quantity or intensity of white light is small. Accordingly, it is
possible to decrease a width (half-width) or an area of a light
distribution curve relative to a light emitting axis, so that it is
possible to control light and thus it is possible to prevent a mura
phenomenon and a yellow ring phenomenon of the display panel.
[0059] That is, when the phosphor in the related art, which is
shaped like a sheet and has a uniform thickness, is used, the
phosphor has the same thickness, but an optical path at a boundary
of the phosphor is relatively and substantially long, so that a
mura phenomenon and a yellow ring phenomenon that a bright and
yellow ring is viewed in a boundary area of a light distribution
curve is generated. However, in the light emitting device package
100 of the present embodiment, since the phosphor 50 has a crescent
moon shape in which the thickness T1 of the cross section at the
center portion of the phosphor 50 is large and the thickness T2 of
the cross section at the boundary portion thereof is small, an
optical length is uniform over the entire area, so that a uniform
color and brightness are shown even in the boundary area of the
light distribution curve, thereby preventing the mura phenomenon
and the yellow ring phenomenon.
[0060] Here, the shape of the phosphor 50 is not limited to the
crescent moon shape. That is, all kinds of thickness variable
shape, such as a semicircle shape, a convex lens shape, an old moon
shape, and a streamlined shape, in which the thickness T1 of the
cross section at the center portion of the phosphor 50 is large and
the thickness T2 of the boundary portion thereof is small, may be
applied to the shape of the phosphor 50.
[0061] Since the length L1 of the phosphor 50 of the present
invention is larger than the width W1 of the light emitting device
20, it is possible to maximally suppress light, which leaks without
passing through the phosphor 50 at a corner of the light emitting
device 20 to prevent even a color mura phenomenon at the
boundary.
[0062] FIG. 3 is a cross-sectional view illustrating a light
emitting device package 200 according to another embodiment of the
present invention.
[0063] As illustrated in FIG. 3, a phosphor 50 of the light
emitting device package 200 according to another embodiment of the
present invention has a larger width W2 than a width W1 of a light
emitting device 20, so that the phosphor 50 may have a shape in
which a part of a boundary is partially inserted into an inclined
surface 40b of a transparent encapsulant 40.
[0064] The phosphor 50 may generally have a convex lens shape in
which a cross section at a center portion has a large thickness and
a cross section at a boundary portion has a small thickness.
[0065] Accordingly, the light passing through the center portion of
the phosphor 50 having the large thickness T1 has a high
probability of meeting phosphor particles, so that a quantity or
intensity of white light is large, and light passing through the
border portion of the phosphor 50 having the small thickness T2 has
a low probability of meeting phosphor particles, so that a quantity
or intensity of white light is small. Accordingly, it is possible
to decrease a width (half-width) or an area of a light distribution
curve based on a light emitting axis, so that it is possible to
control light and thus it is possible to prevent a mura phenomenon
and a yellow ring phenomenon of the display panel.
[0066] That is, in the light emitting device package 200 of the
present embodiment, since the phosphor 50 has the convex lens shape
in which the thickness T1 of the cross section at the center
portion is large and the thickness T2 of the cross section at the
boundary portion is small, an optical length may be uniform over
the entire area and thus a uniform color and brightness are shown
even in a boundary area of a light distribution curve may be shown,
thereby preventing the mura phenomenon and the yellow ring
phenomenon.
[0067] Similar to FIG. 2, as illustrated in FIG. 3, since the width
W2 of the phosphor 50 of the present invention is larger than the
width W1 of the light emitting device 20, it is possible to
maximally suppress light, which leaks without passing through the
phosphor 50 at a corner of the light emitting device 20 to prevent
even a color mura phenomenon at the boundary.
[0068] FIGS. 4 to 8 are cross-sectional views sequentially
illustrating a process of manufacturing the light emitting device
package 100 of FIG. 2.
[0069] A process of manufacturing the light emitting device package
100 of FIG. 2 will be sequentially described with reference to
FIGS. 4 to 8. First, as illustrated in FIG. 4, the substrate 10
including the first electrode 11 and the second electrode 12 may be
prepared.
[0070] Next, as illustrated in FIG. 5, the reflector cup 31 and the
electrode separating portion 32 of the reflecting member 30 may be
integrally molded by a mold.
[0071] Next, as illustrated in FIG. 6, the light emitting device 20
may be seated on the substrate 10 so that a first pad of the light
emitting device 20 is electrically connected to the first electrode
11 and a second pad of the light emitting device 20 is electrically
connected to the second electrode 12.
[0072] Subsequently, as illustrated in FIG. 7, the transparent
encapsulant 40 may be applied or dispensed and charged in the
reflector cup 31 of the reflecting member 30 in a flow state so
that a concave phosphor accommodating space is formed in an upper
surface 40a, and the transparent encapsulant 40 may be firstly
thermally hardened so that the transparent encapsulant 40 is
hardened.
[0073] Here, when the transparent encapsulant 40 is applied or
dispensed in the reflector cup 31 of the reflecting member 30 in
the flow state, the transparent encapsulant 40 is supplied to the
reflector cup 31 with a smaller quantity than a quantity, with
which the reflector cup 31 is fully filled, and then a vibration
may be firstly applied to the substrate 10 so that the transparent
encapsulant 40 may be evenly distributed on a lower surface and a
lateral surface of the reflector cup 31.
[0074] Next, as illustrated in FIG. 8, the phosphor 50 may be
applied or dispensed and charged in the phosphor accommodating
space in a flow state, and the phosphor 50 may be secondly
thermally hardened so that the phosphor 50 is hardened.
[0075] Here, when the phosphor 50 is applied or dispensed and
charged, the phosphor 50 is supplied to the phosphor accommodating
space with a smaller quantity than a quantity with which the
phosphor accommodating space is fully filled, and then a vibration
may be secondly applied to the substrate 10 so that the phosphor 50
may be evenly distributed in the upper surface 40a of the
transparent encapsulant 40.
[0076] Accordingly, as illustrated in FIG. 8, through the
aforementioned process, the transparent encapsulant 40 may be
provided with the concave phosphor accommodating space in the upper
surface 40a thereof, and the phosphor 50 may be formed in a
crescent moon shape in which a cross section at a center portion
has a large thickness and a cross section at a boundary portion has
a small thickness.
[0077] FIG. 9 is a cross-sectional view illustrating a backlight
unit 1000 according to an embodiment of the present invention.
[0078] As illustrated in FIG. 9, the backlight unit 1000 according
to an embodiment of the present invention may include a substrate
10, a light emitting device 20 seated on the substrate 10, a
reflecting member 30 provided on the substrate 10 and provided with
a reflector cup 31 surrounding a lateral circumference of the light
emitting device 20, a transparent encapsulant 40 charged in the
reflector cup 31 of the reflecting member 30 in a flow state and
hardened, and provided with a concave phosphor accommodating space
in an upper surface thereof, a phosphor 50 charged in the phosphor
accommodating space in a flow state and hardened, and a light guide
plate 60 provided at an optical path of the light emitting device
20.
[0079] Here, the substrate 10, the light emitting device 20, the
reflecting member 30, the transparent encapsulant 40, and the
phosphor 50 may have the same configurations and functions as those
of the light emitting device packages 100 and 200 according to the
embodiments of the present invention illustrated in FIGS. 1 to 8.
Accordingly, detailed descriptions thereof will be omitted.
[0080] The light guide plate 60 may be an optical member which may
be made of a transmissive material so as to guide the light
generated in the light emitting device 20.
[0081] The light guide plate 60 may be provided at a path of the
light generated in the light emitting device 20 and transmit the
light generated in the light emitting device 20 to a wider
area.
[0082] Here, although not illustrated in the drawings, various
diffusion sheets, prism sheets, filters, and the like may be
additionally provided in an upper portion of the light guide plate
60. Further, various display panels, such as an LCD panel, may be
provided in the upper portion of the light guide plate 60.
[0083] Meanwhile, although not illustrated in the drawings, the
embodiments of the present invention may include a lighting device
including the aforementioned light emitting device package 100.
Here, constituent elements of the lighting device according to the
embodiment of the present invention may have the same
configurations and functions as those of the aforementioned light
emitting package of the embodiment of the present invention.
Accordingly, detailed descriptions thereof will be omitted.
[0084] FIGS. 10 to 16 are cross-sectional views sequentially
illustrating a process of manufacturing the light emitting device
package 200 of FIG. 3.
[0085] A process of manufacturing the light emitting device package
200 of FIG. 3 will be sequentially described with reference to
FIGS. 10 to 16. First, as illustrated in FIG. 10, the substrate 10
including the first electrode 11 and the second electrode 12 may be
prepared.
[0086] Next, as illustrated in FIG. 11, the reflector cup 31 and
the electrode separating portion 32 of the reflecting member 30 may
be integrally molded by a mold.
[0087] Next, as illustrated in FIG. 12, the light emitting device
20 may be seated on the substrate 10 so that a first pad of the
light emitting device 20 is electrically connected to the first
electrode 11 and a second pad of the light emitting device 20 is
electrically connected to the second electrode 12.
[0088] Next, as illustrated in FIG. 13, the transparent encapsulant
40 may be charged in the reflector cup 31 of the reflecting member
30 in a flow state so that a concave phosphor accommodating space
is formed in the upper surface 40a thereof.
[0089] Here, when the transparent encapsulant 40 is applied or
dispensed in the reflector cup 31 of the reflecting member 30 in
the flow state, the transparent encapsulant 40 is supplied to the
reflector cup 31 with a smaller quantity than a quantity, with
which the reflector cup 31 is fully filled, and then a vibration
may be firstly applied to the substrate 10 so that the transparent
encapsulant 40 may be evenly distributed on a lower surface and a
lateral surface of the reflector cup 31.
[0090] Next, as illustrated in FIG. 14, the phosphor 50 may be
charged in the phosphor accommodating space in a flow state.
[0091] Here, both of the transparent encapsulant 40 and the
phosphor 50 are in a flow state, and the width W2 of the phosphor
50 is larger than the width W1 of the light emitting device 20, so
that the phosphor 50 may have a shape in which a part of the
boundary is partially inserted into the inclined surface 40b of the
transparent encapsulant 40.
[0092] Next, as illustrated in FIG. 15, the substrate 10 may be
held in a centrifugal rotating (separating) device and the like,
and rotated (revolved) with a rotation radius R about a rotation
center C by centrifugal force.
[0093] Here, a rotation speed or a rotation time for rotating the
substrate 10 may be larger than a deformation value by which the
phosphor 50 or the transparent encapsulant 40 begins to be deformed
by the centrifugal force but smaller than a separation value by
which the phosphor 50 and the transparent encapsulant 40 are
separated from the reflector cup 31.
[0094] A rotation direction of the substrate 10 may also vary
greatly, such as in a vertical direction, a horizontal direction,
and an inclined direction, and the substrate 10 may be rotated
without the rotation radius R or rotated with the rotation radius R
in various sizes.
[0095] For example, when the rotation speed or the rotation time is
excessively small, it is impossible to use the centrifugal force
enough to widely spread the phosphor 50, and when the rotation
speed or the rotation time is excessively large, the phosphor 50
and the transparent encapsulant 40 may be separated from the
reflector cup 31.
[0096] Accordingly, the rotation speed or the rotation time may be
optimized and determined by a characteristic, such as viscosity or
a flow property, of the phosphor 50 and the transparent encapsulant
40, a processing environment, such as a processing temperature or a
processing pressure, and the like.
[0097] Here, the end portion of the phosphor 50 may be generally
horizontally spread by the centrifugal force. Here, the transparent
encapsulant 40 and the phosphor 50 may be thermally hardened while
the centrifugal force is applied.
[0098] Accordingly, as illustrated in FIG. 16, through the
aforementioned process, the transparent encapsulant 40 may be
provided with the concave phosphor accommodating space in the upper
surface 40a thereof, and the phosphor 50 may be formed in a shape
in which a part of the boundary is partially inserted into the
inclined surface 40b of the transparent encapsulant 40.
[0099] FIG. 17 is a flowchart illustrating a method of
manufacturing the light emitting device package 100 according to
the embodiment of the present invention.
[0100] As illustrated in FIGS. 2, 4 to 9, and 17, the method of
manufacturing the light emitting device package 100 according to
the embodiment of the present invention may include preparing a
substrate 10 (S11), providing a reflecting member 30 on the
substrate 10 so that a reflector cup 31 is formed (S12), seating a
light emitting device 20 on the substrate 10 inside the reflector
cup 31 (S13), charging a transparent encapsulant 40 in the
reflector cup 31 of the reflecting member 30 in a flow state so
that a concave phosphor accommodating space is formed in an upper
surface 40a (S14), firstly thermally hardening the transparent
encapsulant 40 so that the transparent encapsulant 40 is hardened
(S15), charging a phosphor 50 in a flow state in the phosphor
accommodating space (S16), and secondly thermally hardening the
phosphor 50 so that the phosphor 50 is hardened (S17).
[0101] Here, in the charging of the transparent encapsulant 40
(S14), the transparent encapsulant 40 may be insufficiently
supplied to the reflector cup 31 with a smaller quantity than a
quantity with which the reflector cup 31 is fully filled, so that
the concave phosphor accommodating space is formed in the upper
surface 41a, and in the charging of the phosphor 50 (S16), the
phosphor 50 may be insufficiently supplied to the phosphor
accommodating space, with a smaller quantity than a quantity with
which the phosphor accommodating space is fully filled, so that the
phosphor 50 has a crescent moon shape in which a cross section at a
center portion is thick and a cross section at a boundary portion
is thin.
[0102] FIG. 18 is a flowchart illustrating a method of
manufacturing the light emitting device package 200 according to
another embodiment of the present invention.
[0103] As illustrated in FIG. 18, the method of manufacturing the
light emitting device package 200 according to the embodiment of
the present invention may include preparing a substrate 10 (S11),
providing a reflecting member 30 on the substrate 10 so that a
reflector cup 31 is formed (S12), seating a light emitting device
20 on the substrate 10 inside the reflector cup 31 (S13), charging
a transparent encapsulant 40 in the reflector cup 31 of the
reflecting member 30 in a flow state so that a concave phosphor
accommodating space is formed in an upper surface 40a (S14),
firstly vibrating the substrate 10 so that the transparent
encapsulant 40 is widely applied onto the reflector cup 31 (S18),
firstly thermally hardening the transparent encapsulant 40 so that
the transparent encapsulant 40 is hardened (S15), charging a
phosphor 50 in a flow state in the phosphor accommodating space
(S16), secondly vibrating the substrate 10 so that the phosphor 50
is widely applied onto the phosphor accommodating space (S19), and
secondly thermally hardening the phosphor 50 so that the phosphor
50 is hardened (S17).
[0104] FIG. 19 is a flowchart illustrating a method of
manufacturing a light emitting device package 300 according to yet
another embodiment of the present invention.
[0105] As illustrated in FIGS. 3, 10 to 16, and 19, the method of
manufacturing the light emitting device package 300 according to
the embodiment of the present invention may include preparing a
substrate 10 (S21), providing a reflecting member 30 on the
substrate 10 so that a reflector cup 31 is formed (S22), seating a
light emitting device 20 on the substrate 10 inside the reflector
cup 31 (S23), charging a transparent encapsulant 40 in the
reflector cup 31 of the reflecting member 30 in a flow state so
that a concave phosphor accommodating space is formed in an upper
surface 40a (S24), charging a phosphor 50 in a flow state in the
phosphor accommodating space (S25), rotating the substrate 10 by
centrifugal force (S26), and thermally hardening the transparent
encapsulant 40 and the phosphor 50 (S27).
[0106] Here, in the rotating of the substrate 10 (S26), a rotation
speed or a rotation time for rotating the substrate 10 may be
larger than a deformation value by which the phosphor 50 or the
transparent encapsulant 40 begins to be deformed by centrifugal
force and smaller than a separation value by which the phosphor 50
and the transparent encapsulant 40 are separated from the reflector
cup 31.
[0107] According to the aforementioned manufacturing methods, it is
possible to form a phosphor structure similarly shaped like a sheet
on a light emitting device by using a liquid phosphor injection
method in the related art even without using a phosphor sheet,
thereby economically manufacturing a phosphor structure free from a
problem according to the application of the phosphor sheet.
[0108] The present invention has been described with reference to
the embodiments illustrated in the drawings, but the embodiments
are only illustrative, and it would be appreciated by those skilled
in the art that various modifications and equivalent embodiments
may be made. Therefore, the true technical scope of the present
should be defined by the technical spirit of the appended
claims.
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