U.S. patent application number 14/184433 was filed with the patent office on 2015-08-20 for thermal module assembling structure.
This patent application is currently assigned to Asia Vital Components Co., Ltd.. The applicant listed for this patent is Asia Vital Components Co., Ltd.. Invention is credited to Kuo-Sheng Lin, Sheng-Huang Lin.
Application Number | 20150233646 14/184433 |
Document ID | / |
Family ID | 53797801 |
Filed Date | 2015-08-20 |
United States Patent
Application |
20150233646 |
Kind Code |
A1 |
Lin; Sheng-Huang ; et
al. |
August 20, 2015 |
THERMAL MODULE ASSEMBLING STRUCTURE
Abstract
A thermal module assembling structure includes a heat
dissipation board and at least one heat pipe. The heat dissipation
board has a receiving channel for fitting the heat pipe
therethrough. Two sides of upper side of the receiving channel are
respectively formed with two ribs. The ribs horizontally protrude
and extend toward the middle of the receiving channel to face the
heat pipe fitted in the receiving channel. At least one deformed
recess is formed on an upper surface of each of the ribs, whereby
the lower surfaces of the ribs and a surface of the heat pipe are
deformed to form at least one deformed connection section between
the lower surfaces of the ribs and the surface of the heat pipe. By
means of the restriction of the deformed connection section, the
heat pipe is prevented from being extracted out of the receiving
channel.
Inventors: |
Lin; Sheng-Huang; (New
Taipei City, TW) ; Lin; Kuo-Sheng; (New Taipei City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Asia Vital Components Co., Ltd. |
New Taipei City |
|
TW |
|
|
Assignee: |
Asia Vital Components Co.,
Ltd.
New Taipei City
TW
|
Family ID: |
53797801 |
Appl. No.: |
14/184433 |
Filed: |
February 19, 2014 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28D 15/0275 20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 15/04 20060101 F28D015/04 |
Claims
1. A thermal module assembling structure comprising: a heat
dissipation board having a receiving channel formed in the heat
dissipation board for a heat pipe to fit through the receiving
channel, two sides of upper side of the receiving channel being
respectively formed with ribs, the ribs horizontally protruding and
extending toward the middle of the receiving channel, each rib
having an upper surface and a lower surface, the lower surface
facing a surface of the heat pipe, at least one deformed recess
being formed on the upper surface of each of the ribs, wherein the
lower surfaces of the ribs and the surface of the heat pipe are
deformed to correspondingly form at least one deformed connection
section between the lower surfaces of the ribs and the surface of
the heat pipe.
2. The thermal module assembling structure as claimed in claim 1,
wherein the deformed connection section is substantially normal to
an axis of the heat pipe.
3. The thermal module assembling structure as claimed in claim 2,
wherein the deformed connection section includes a deformed raised
portion and a deformed recessed portion, the deformed raised
portion being formed on the lower surface of the rib, the deformed
recessed portion being formed on the surface of the heat pipe.
4. The thermal module assembling structure as claimed in claim 3,
wherein the deformed raised portion and the deformed recessed
portion are tightly fitted and engaged with each other.
5. A thermal module assembling structure comprising a heat
dissipation board having a receiving channel for receiving therein
a heat pipe, two sides of upper side of the receiving channel being
respectively formed with two ribs, the ribs horizontally extending
for restricting the heat pipe in the receiving channel, the thermal
module assembling structure being characterized in that each rib
has an upper surface and a lower surface, at least one deformed
recess being formed on the upper surface of each of the ribs,
wherein the lower surfaces of the ribs and a surface of the heat
pipe are deformed to correspondingly form at least one deformed
connection section between the lower surfaces of the ribs and the
surface of the heat pipe, by means of the restriction of the
deformed connection section, the heat pipe is prevented from being
extracted out of the receiving channel.
6. The thermal module assembling structure as claimed in claim 5,
wherein the heat pipe is defined with a lengthwise direction and
the deformed connection section is substantially normal to the
lengthwise direction of the heat pipe.
7. The thermal module assembling structure as claimed in claim 5,
wherein the deformed connection section includes a deformed raised
portion and a deformed recessed portion, the deformed raised
portion being formed on the lower surface of the rib, the deformed
recessed portion being formed on the surface of the heat pipe.
8. The thermal module assembling structure as claimed in claim 7,
wherein the deformed raised portion and the deformed recessed
portion are tightly fitted and engaged with each other.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to a thermal module
assembling structure, and more particularly to a thermal module
assembling structure in which the heat dissipation board and the
heat pipe are deformed to restrict each other.
[0003] 2. Description of the Related Art
[0004] A prior art discloses a heat dissipation substrate
structure. A heat pipe is embedded in the heat dissipation
substrate and then riveted with the heat dissipation substrate by
means of mechanical riveting. After riveted, the rivet is closed up
to keep the surface of the heat dissipation substrate a plane face.
The heat dissipation substrate includes a receiving channel formed
in the heat dissipation substrate structure for receiving the heat
pipe. Two ribs are formed on two sides of the receiving channel in
immediate adjacency to each other. The two ribs are higher than the
surface of the heat dissipation substrate structure. Two material
escape receptacles are formed in the heat dissipation substrate
structure in immediate adjacency to outer sides of the ribs
respectively. Accordingly, when the heat pipe is embedded into the
heat dissipation substrate and riveted with the heat dissipation
substrate by means of mechanical riveting, the ribs hold the heat
pipe and the material escape receptacles receive the residual metal
produced in the mechanical riveting and close-up process of the
ribs. Therefore, the surface of the heat dissipation substrate
structure can keep plane.
[0005] The above heat dissipation substrate structure is able to
prevent the heat pipe from being extracted out of the substrate.
However, in practice, the ribs and the receiving channel simply
embrace the circumferential surface of the heat pipe. Therefore,
the heat pipe is still likely to be extracted out of the receiving
channel in the lengthwise direction of the receiving channel, (that
is, the axial direction of the heat pipe).
SUMMARY OF THE INVENTION
[0006] It is therefore a primary object of the present invention to
provide a thermal module assembling structure. In the thermal
module assembling structure, the mating faces of the two ribs on
two sides of the receiving channel of the heat dissipation board
and the heat pipe in the receiving channel are locally deformed to
form at least one deformed connection section for tightly fitting
and connecting the heat pipe with the ribs.
[0007] It is a further object of the present invention to provide
the above thermal module assembling structure in which the deformed
connection section between the mating faces of the ribs and the
heat pipe is substantially normal to the axis of the heat pipe so
as to apply an interference force to the heat pipe to prevent the
heat pipe from being extracted out of the receiving channel along
the length thereof.
[0008] To achieve the above and other objects, the thermal module
assembling structure of the present invention includes a heat
dissipation board having a receiving channel formed in the heat
dissipation board for a heat pipe to fit through the receiving
channel. Two sides of upper side of the receiving channel are
respectively formed with ribs, which horizontally protrude and
extend toward the middle of the receiving channel. Each rib has an
upper surface and a lower surface. The lower surface faces a
surface of the heat pipe. At least one deformed recess is formed on
the upper surface of each of the ribs, whereby the lower surfaces
of the ribs and the surface of the heat pipe are deformed to form
at least one deformed connection section between the lower surfaces
of the ribs and the surface of the heat pipe.
[0009] In the above thermal module assembling structure, the
deformed connection section is substantially normal to an axis of
the heat pipe.
[0010] In the above thermal module assembling structure, the
deformed connection section includes a deformed raised portion and
a deformed recessed portion. The deformed raised portion is formed
on the lower surface of the rib. The deformed recessed portion is
formed on the surface of the heat pipe.
[0011] In the above thermal module assembling structure, the
deformed raised portion and the deformed recessed portion are
tightly fitted and engaged with each other to restrict each
other.
[0012] By means of the restriction of the deformed connection
section, the heat pipe is truly prevented from being extracted out
of the receiving channel along the length of the receiving
channel.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein:
[0014] FIG. 1 is a perspective exploded view of the heat
dissipation board and heat pipe of the present invention;
[0015] FIG. 2A is a perspective assembled view of the heat
dissipation board and heat pipe of the present invention;
[0016] FIG. 2B is a view showing that the ribs are formed with
deformed recesses;
[0017] FIG. 2C is a sectional view taken along line 2C-2C of FIG.
2B;
[0018] FIG. 2D is an enlarged view of circled area of FIG. 2C;
[0019] FIG. 3A is a perspective view of a second embodiment of the
deformed recesses of the present invention;
[0020] FIG. 3B is a perspective view of a third embodiment of the
deformed recesses of the present invention;
[0021] FIG. 3C is a perspective view of a fourth embodiment of the
deformed recesses of the present invention;
[0022] FIG. 3D is a perspective view of a fifth embodiment of the
deformed recesses of the present invention; and
[0023] FIG. 3E is a perspective view of a sixth embodiment of the
deformed recesses of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] The embodiments of the present invention will be described
hereinafter with reference to the drawings, wherein the same
components are denoted with the same reference numerals.
[0025] Please refer to FIGS. 1, 2A, 2B, 2C and 2D. FIG. 1 is a
perspective exploded view of the heat dissipation board and heat
pipe of the present invention. FIG. 2A is a perspective assembled
view of the heat dissipation board and heat pipe of the present
invention. FIG. 2B is a view showing that the ribs are formed with
deformed recesses. FIG. 2C is a sectional view taken along line
2C-2C of FIG. 2B. FIG. 2D is an enlarged view of circled area of
FIG. 2C.
[0026] As shown in FIGS. 1 and 2A. The thermal module assembling
structure of the present invention includes a heat dissipation
board 10 and a heat pipe 20. The heat dissipation board 10 has a
receiving channel 11 formed in the heat dissipation board 10. The
heat pipe 20 is fitted through the receiving channel 11 and
connected with the heat dissipation board 10 by means of press fit.
The heat dissipation board 10 is made of metal or alloy material
with good thermal conductivity, such as copper, aluminum, gold or
silver. The heat pipe 20 can be entirely fitted through the
receiving channel 11. Alternatively, only one end of the heat pipe
20 is fitted through the receiving channel 11 (as shown in FIG.
2A). According to the cross section, the heat pipe 20 can be
flat-plate heat pipe, circular heat pipe or semicircular heat pipe.
According to the configuration, the heat pipe 20 can be a straight
heat pipe or a curved heat pipe.
[0027] Basically, the heat pipe 20 is a closed chamber containing
therein a working fluid. By means of continuous liquid-vapor phase
change circulation of the working fluid in the chamber and the
convection of the going vapor and coming liquid between the heat
absorption end and the heat dissipation end, the heat can be
quickly spread through the surface of the chamber to transfer the
heat. The operation principle of the heat pipe is that the
liquid-phase working fluid absorbs heat at the heat absorption end
and evaporates into vapor-phase working fluid. In the instant of
evaporation, a local high pressure is created in the chamber to
urge the vapor-phase working fluid to flow to the heat dissipation
end at high speed. After the vapor-phase working fluid condenses
into liquid-phase working fluid at the heat dissipation end, due to
the gravity/capillary attraction/centrifugal force of the capillary
structure in the chamber, the liquid-phase working fluid flows back
to the heat absorption end to recycle the operation. Therefore, in
operation of the heat pipe, the airflow is driven by the air
pressure difference, while the liquid flow is driven by a suitable
backflow drive force adopted or designed according to the operation
state in use. The heat pipe is formed as a closed chamber by means
of the pipe body structure. The pipe body not only should be able
to structurally bear the difference between internal pressure and
external pressure, but also serves as a medium material for
conducting heat into and out of the chamber. Currently, the
material of the pipe bodies of most of the small-size heat pipes
applied in the electronic heat dissipation field is copper. In
consideration of weight or cost, some other heat pipes are made of
copper pipe or titanium pipe.
[0028] Two sides of upper side of the receiving channel 11 are
respectively formed with ribs 12. The ribs 12 horizontally protrude
and extend along a surface 13 of the heat dissipation board 10
toward the middle of the receiving channel 11. Each rib 12 has an
upper surface 121 and a lower surface 122. The upper surface 121 is
positioned on the same level as the surface 13 of the heat
dissipation board 10. The lower surface 122 faces a surface 21 of
the heat pipe 20 fitted through the receiving channel 11. As shown
in FIGS. 2B, 2C and 2D, at least one deformed recess 123 is formed
on the upper surface 121 of each of the ribs 12 by means of
mechanical processing (pressing, rolling or riveting). In this
case, the lower surface 122 of the rib 12 and the surface 21 (not
shown) of the heat pipe 20 in contact with the lower surface 122
are deformed. Accordingly, at least one deformed connection section
30 is correspondingly formed between the lower surface 122 of the
rib 12 and the surface 21 of the heat pipe 20. In this embodiment,
there are multiple deformed recesses 123 arranged along the length
of the rib 12 at intervals. The deformed recesses 123 make the
lower surfaces 122 of the ribs 12 and the surface 21 of the heat
pipe 20 deformed to correspondingly form multiple deformed
connection sections 30 between the lower surfaces 122 of the ribs
12 and the surface 21 of the heat pipe 20. Substantially, the
deformed connection sections 30 are normal to an axis of the heat
pipe 20 (as shown in FIGS. 2C and 2D).
[0029] As aforesaid, the deformed recesses 123 are arranged along
the length of the rib 12 at intervals (as shown in FIG. 2B).
However, the arrangement of the deformed recesses 123 is not
limited to the above. Alternatively, the deformed recesses can be
continuous linear recesses or elongated recesses arranged section
by section or partially formed on the rib according to
requirements. In another embodiment, as shown in FIG. 3A, the
deformed recesses 123a are disposed on the front edge and rear edge
of the rib 12. In still another embodiment, as shown in FIG. 3B,
the deformed recesses 123b are disposed at the middle of the rib
12. In still another embodiment, as shown in FIG. 3C, the deformed
recesses 123c are disposed on the front section and rear section of
the rib 12. In still another embodiment, as shown in FIG. 3D, the
deformed recesses 123d are elongated recesses formed on the rib 12
section by section. In still another embodiment, as shown in FIG.
3E, the deformed recesses 123e are elongated recesses extending
from the front edge to the rear edge of the rib 12.
[0030] It should be especially noted that as shown in FIGS. 2B, 2C
and 2D, multiple deformed connection sections 30 are locally formed
between the mating faces of the ribs 12 and the heat pipe 20 and
arranged along the length of the ribs 12 at intervals (as shown in
FIGS. 2C and 2D). Each deformed connection section 30 includes a
deformed raised portion 31 and a deformed recessed portion 32. The
deformed raised portion 31 is formed on the lower surface 122 of
the rib 12. The deformed recessed portion 32 is formed on the
surface 21 of the heat pipe 20. By means of the restriction and
tight fit and engagement between the deformed raised portion 31 and
the deformed recessed portion 32, the surface 21 of the heat pipe
20 fitted in the receiving channel 11 of the heat dissipation board
10 is interfered with. The interference force is normal to the axis
of the heat pipe 20 so that the heat pipe 20 is prevented from
being extracted out of the receiving channel 11 along the length
thereof (in a direction parallel to the axis of the heat pipe
20).
[0031] In conclusion, in the present invention, the mating faces of
the ribs 12 on two sides of the receiving channel 11 of the heat
dissipation board 10 and the heat pipe 20 are locally (or
continuously) deformed to form at least one deformed connection
section 30 for tightly fitting and connecting the heat pipe 20 with
the ribs 12. The deformed connection section 30 is substantially
normal to the axis of the heat pipe 20 so as to apply an
interference force to the heat pipe 20 to prevent the heat pipe 20
from being extracted out of the receiving channel 11 along the
length thereof (in a direction parallel to the axis of the heat
pipe 20).
[0032] The present invention has been described with the above
embodiments thereof and it is understood that many changes and
modifications in the above embodiments can be carried out without
departing from the scope and the spirit of the invention that is
intended to be limited only by the appended claims.
* * * * *