U.S. patent application number 14/169448 was filed with the patent office on 2015-08-06 for heat dissipation structure enhancing heat source self heat radiation.
This patent application is currently assigned to Asia Vital Components Co., Ltd.. The applicant listed for this patent is Asia Vital Components Co., Ltd.. Invention is credited to Chih-Ming Chen, Chih-Yeh Lin.
Application Number | 20150219410 14/169448 |
Document ID | / |
Family ID | 53754566 |
Filed Date | 2015-08-06 |
United States Patent
Application |
20150219410 |
Kind Code |
A1 |
Lin; Chih-Yeh ; et
al. |
August 6, 2015 |
Heat Dissipation Structure Enhancing Heat Source Self Heat
Radiation
Abstract
A heat dissipation structure enhancing heat source self heat
radiation includes a heat source and a heat radiation layer formed
on at least one side of an exterior of the heat source. With the
heat dissipation structure, the heat source can have largely
increased self heat radiation efficiency, enabling heat emitted by
the heat source to be quickly dissipated into ambient environment
to avoid heat accumulation on the heat source.
Inventors: |
Lin; Chih-Yeh; (New Taipei
City, TW) ; Chen; Chih-Ming; (New Taipei City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Asia Vital Components Co., Ltd. |
New Taipei City |
|
TW |
|
|
Assignee: |
Asia Vital Components Co.,
Ltd.
New Taipei City
TW
|
Family ID: |
53754566 |
Appl. No.: |
14/169448 |
Filed: |
January 31, 2014 |
Current U.S.
Class: |
165/133 |
Current CPC
Class: |
F28F 2245/06 20130101;
F28F 13/18 20130101 |
International
Class: |
F28F 13/18 20060101
F28F013/18 |
Claims
1. A heat dissipation structure enhancing heat source self heat
radiation, comprising a heat source and a heat radiation layer
formed on at least one side of an exterior of the heat source.
2. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the exterior of the heat
source is made of a material selected from the group consisting of
a ceramic material and a metal material.
3. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat source is
selected from the group consisting of a battery, a semiconductor
element, and an integrated circuit (IC) chip.
4. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
is of a structure selected from the group consisting of a porous
structure, a nanostructure, a porous ceramic structure, and a
porous graphite structure.
5. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
is of a porous structure formed on one side of the heat source by a
process selected from the group consisting of micro arc oxidation
(MAO), plasma electrolytic oxidation (PEO), anodic spark deposition
(ASD), and anodic oxidation by spark deposition (ANOF).
6. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
is of a dimpled structure formed by shot peening.
7. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
8. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
is of a structure selected from the group consisting of a
high-radiation ceramic structure and a high-rigidity ceramic
structure.
9. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 1, wherein the heat radiation layer
is formed on the exterior of the heat source in a manner selected
from the group consisting of bonding, printing and coating.
10. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 2, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
11. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 3, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
12. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 4, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
13. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 5, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
14. The heat dissipation structure enhancing heat source self heat
radiation as claimed in claim 6, wherein the heat radiation layer
has a color selected from the group consisting of a black color, a
near-black color, and any dark colors.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat dissipation
structure enhancing heat source self heat radiation, and more
particularly to a heat dissipation structure that includes a heat
radiation layer formed on an exterior of a heat source to enhance
or increase the self heat radiation performance of the heat
source.
BACKGROUND OF THE INVENTION
[0002] The currently available mobile electronic devices, such as
slim-type notebook computers, tablet computers, smartphones and so
on, all have constantly increased operation speed, which leads to
largely increased heat produced by the semiconductor chip of the
internal computation execution unit of the electronic mobile
devices. On the other hand, all the current mobile electronic
devices have constantly reduced overall thickness to enable
convenient portability thereof. Further, to guard against invasion
by foreign matters and external moisture, the mobile electronic
devices are usually provided with only a headphone jack and
necessary connector jacks without other openings communicable with
an external space for air convection. Due to the largely reduced
overall thickness of the devices, the heat produced by the
computation execution unit and the battery inside the mobile
electronic devices just could not be quickly dissipated into
external environment. The closed narrow internal space of the
mobile electronic devices also causes difficulty in the occurrence
of air convection, so that heat tends to accumulate or gather
inside the mobile electronic devices to seriously affect the
devices' working efficiency or cause a crashed computer due to
overheating. In some worse conditions, the semiconductor chip or
the battery inside the devices is subjected to burnout due to
overheating.
[0003] Some passive heat dissipation elements, such as heat
spreaders, vapor chambers, heat sinks and the like, have been tried
for use inside the mobile electronic devices to dissipate heat. To
use with the current mobile electronic devices that have largely
reduced overall thickness and highly limited internal space, the
above-mentioned heat dissipation elements must also have highly
reduced overall thickness. As a result, the wick structures and
vapor passages in the thickness-reduced heat spreaders and vapor
chambers must also have reduced sizes, which results in lowered
working efficiency of the heat spreaders and vapor chambers in
terms of their general heat transfer capability, preventing the
devices' heat dissipation performance from being effectively
upgraded. In brief, the conventional heat spreaders and vapor
chambers all fail to effectively remove or dissipate the heat from
the mobile electronic devices when the latter's internal
computation execution units have excessively high power. It is
therefore the most important target of mobile electronic device
manufacturers to work out an effective way for dissipating heat
from a closed narrow space.
SUMMARY OF THE INVENTION
[0004] A primary object of the present invention is to provide a
heat dissipation structure that includes a heat radiation layer
formed on an exterior of a heat source to enhance or increase the
self heat radiation performance of the heat source.
[0005] To achieve the above and other objects, the heat dissipation
structure enhancing heat source self heat radiation according to
the present invention includes a heat source and a heat radiation
layer formed on at least one side of an exterior of the heat
source. The present invention is characterized by forming the heat
radiation layer on at least one side of the exterior of the heat
source to enhance the self heat radiation performance of the heat
source. Since the heat radiation layer formed on one side of the
heat source has high heat radiation efficiency, the heat emitted by
the heat source located in the closed narrow space of a mobile
electronic device can still be effectively dissipated through
natural heat radiation and heat convection, so that the heat source
can have largely increased heat dissipation performance.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0007] FIG. 1 is an assembled perspective view of a heat
dissipation structure enhancing heat source self heat radiation
according to a first embodiment of the present invention;
[0008] FIG. 2 is an assembled sectional view of the heat
dissipation structure of FIG. 1; and
[0009] FIG. 3 is an assembled sectional view of a heat dissipation
structure enhancing heat source self heat radiation according to a
second embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] The present invention will now be described with some
preferred embodiments thereof and with reference to the
accompanying drawings. For the purpose of easy to understand,
elements that are the same in the preferred embodiments are denoted
by the same reference numerals.
[0011] Please refer to FIGS. 1 and 2 that are assembled perspective
and sectional views, respectively, of a heat dissipation structure
enhancing heat source self heat radiation according to a first
embodiment of the present invention. For the purpose of clarity and
conciseness, the present invention is also briefly referred to as
the heat dissipation structure and generally denoted by reference
numeral 1 herein. As shown, the heat dissipation structure 1 in the
first embodiment includes a heat source 11 and a heat radiation
layer 12 formed on at least one side of an exterior of the heat
source 11. The heat source 11 can be a battery, a semiconductor
element or an integrated circuit (IC) chip. In the illustrated
first embodiment, the heat source 11 is described as a battery.
However, it is understood the heat source 11 is not limited to a
battery but can be any other self-heat-radiation heat sources.
Further, the exterior of the heat source 11 can be made of a
ceramic material or a metal material.
[0012] The heat radiation layer 12 can be of a porous structure, a
nanostructure, a porous ceramic structure, a porous graphite
structure, a high-radiation ceramic structure, or a high-rigidity
ceramic structure. The heat radiation layer 12 being a porous
structure can be formed on one side of the heat source 11 by micro
arc oxidation (MAO), plasma electrolytic oxidation (PEO), anodic
spark deposition (ASD), or anodic oxidation by spark deposition
(ANOF). Of course, the heat radiation layer 12 can be otherwise
formed on the exterior of the heat source 11 by way of bonding,
printing or coating.
[0013] FIG. 3 is an assembled sectional view of a heat dissipation
structure enhancing heat source self heat radiation according to a
second embodiment of the present invention. As shown, the second
embodiment is structurally similar to the first embodiment, except
that it has a heat radiation layer 12 being a dimpled structure
formed by shot peening.
[0014] In both of the first and the second embodiment, the heat
radiation layer 12 is in a black color, a near-black color, or any
dark color.
[0015] The present invention is highlighted by applying radiation
heat transfer to heat dissipation. As it is known, both heat
conduction and heat convection require a physical matter as a heat
transfer medium to achieve heat energy propagation. However, unlike
the heat conduction and heat convection, heat radiation propagates
heat energy directly without the need of any heat transfer medium,
and is therefore suitable for use in a closed room having very
limited heat dissipation space to transfer internally produced heat
to an outer casing of, for example, a mobile electronic device, for
heat exchange with ambient air.
[0016] Heat radiation means the energy radiated by matters in the
form of electromagnetic waves. Electromagnetic waves propagate at
the speed of light without the need of a transmission medium. All
matters continuously emit heat radiation and also absorb heat
radiation from external environment. A matter's ability to emit
heat has relation to the matter's surface temperature, color and
coarseness. The present invention employs the above-mentioned
principles to provide the heat radiation layer 123 with good
natural heat radiation ability. That is, the heat radiation layer
123 has increased heat dissipation area and enables upgraded heat
dissipation efficiency. In addition to the temperature, the heat
radiation intensity of a matter's surface also has relation to the
matter's surface properties. For example, a matter having a
black-colored surface tends to absorb and emit heat radiation more
easily. Therefore, the heat radiation layer 123 of the present
invention is black or black-colored to further enhance its heat
radiation efficiency.
[0017] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention
that is intended to be limited only by the appended claims.
* * * * *