U.S. patent application number 14/687536 was filed with the patent office on 2015-08-06 for composite and method for making the same.
The applicant listed for this patent is Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to CHENG-SHI CHEN, HUANN-WU CHIANG, YUAN-YUAN FENG, TING-TING GE, GUANG-HUI LI, DAI-YU SUN, YU-QIANG WANG.
Application Number | 20150218710 14/687536 |
Document ID | / |
Family ID | 48582024 |
Filed Date | 2015-08-06 |
United States Patent
Application |
20150218710 |
Kind Code |
A1 |
CHIANG; HUANN-WU ; et
al. |
August 6, 2015 |
COMPOSITE AND METHOD FOR MAKING THE SAME
Abstract
A composite includes a substrate and at least a resin
composition formed on the substrate. A surface of the substrate is
defined a plurality of micro-pores therein. The resin composition
is coupled to the surface having the micro-pores by the resin
composition filling and hardening within the micro-pores. The resin
composition contains crystalline thermoplastic synthetic resins. A
method for making the composite is also described.
Inventors: |
CHIANG; HUANN-WU; (New
Taipei, TW) ; CHEN; CHENG-SHI; (New Taipei, TW)
; FENG; YUAN-YUAN; (Shenzhen, CN) ; WANG;
YU-QIANG; (Shenzhen, CN) ; GE; TING-TING;
(Shenzhen, CN) ; SUN; DAI-YU; (Shenzhen, CN)
; LI; GUANG-HUI; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Fu Tai Hua Industry (Shenzhen) Co., Ltd.
HON HAI PRECISION INDUSTRY CO., LTD. |
Shenzhen
New Taipei |
|
CN
TW |
|
|
Family ID: |
48582024 |
Appl. No.: |
14/687536 |
Filed: |
April 15, 2015 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
13403528 |
Feb 23, 2012 |
|
|
|
14687536 |
|
|
|
|
Current U.S.
Class: |
216/39 |
Current CPC
Class: |
B29K 2305/02 20130101;
B29C 45/14311 20130101; C23F 4/02 20130101; B29K 2305/00 20130101;
Y10T 428/249953 20150401; B29C 45/14778 20130101 |
International
Class: |
C23F 4/02 20060101
C23F004/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 15, 2011 |
CN |
201110420534.6 |
Claims
1. A method for making a composite, comprising: providing a
substrate; laser etching the substrate to form a plurality of
micro-pores in a surface of the substrate; and inserting the
substrate in a mold and molding crystalline thermoplastic synthetic
resin on the surface of the substrate, wherein the micro-pores form
the composite by the resin composition filling and hardening within
the micro-pores.
2. The method as claimed in claim 1, wherein diameter of the
micro-pores is in a range of about 1 .mu.m-100 .mu.m, depth of the
micro-pores is in a range of about 1 .mu.m-200 .mu.m, and each two
adjacent micro-pores have a space between them of about 10
.mu.m-200 .mu.m.
3. The method as claimed in claim 1, wherein the laser etching
process is carried out using a laser machine having the parameters
of, power: 10 W-30 W, frequency: 20 KHZ-60 KHZ, and step length:
0.005 .mu.m-0.1 .mu.m.
4. The method as claimed in claim 1, wherein the substrate is made
of metal, glass, or ceramic.
5. The method as claimed in claim 1, wherein the metal is stainless
steel, aluminum alloy, magnesium alloy, or copper alloy.
6. The method as claimed in claim 1, wherein the crystalline
thermoplastic synthetic resin is polyphenylene sulfide, polyamide,
polybutylene terephthalate, or polyethylene terephthalate.
7. The method as claimed in claim 1, wherein a portion of the
crystalline thermoplastic synthetic resin insert in and fill the
micro-pores of the substrate.
8. The method as claimed in claim 1, wherein the micro-pores are
regularly distributed in an array in the surface of the
substrate.
9. The method as claimed in claim 1, wherein the micro-pores are
irregularly distributed in the surface of the substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of U.S. Ser.
No. 13/403,528, filed Feb. 23, 2012, the contents of which are
hereby incorporated by reference. The patent application Ser. No.
13/403,528 in turn claims the benefit of priority under 35 USC 119
from Chinese Patent Application 201110420534.6, filed on Aug. 4,
2010.
FIELD
[0002] The subject matter herein generally relates to composites,
particularly to a composite having high bonding strength and a
method for making the composite.
BACKGROUND
[0003] Adhesives, for combining heterogeneous materials in the form
of a metal and a synthetic resin are in demand in a wide variety of
technical fields and industries, such as the automotive and
household appliance fields. However, the bonding strength of the
metal and resin is weak. Furthermore, adhesives are generally only
effective in a narrow temperature range of about -50.degree. C. to
about 100.degree. C., which means they are not suitable in
applications where operating or environmental temperatures may fall
outside of the range. Due to the above reason, other bonding
methods have been applied that do not involve the use of an
adhesive. One example of such methods is by forming bonds through
injection molding or other similar process. However, the bonding
strength of the metal and resin can be further improved.
BRIEF DESCRIPTION OF THE FIGURES
[0004] Many aspects of the disclosure can be better understood with
reference to the following FIGures. The components in the FIGures
are not necessarily drawn to scale, the emphasis instead being
placed upon clearly illustrating the principles of the disclosure.
Moreover, in the drawings like reference numerals designate
corresponding parts throughout the several views.
[0005] FIG. 1 is a cross-sectional view of an exemplary embodiment
of a composite.
[0006] FIG. 2 is a scanning electron microscopy view of an
exemplary embodiment of a substrate being laser etched.
[0007] FIG. 3 is a scanning electron microscopy view of a
cross-section at the combine of the substrate and the resin
composition.
[0008] FIG. 4 is a scanning electron microscopy view of a surface
of the substrate combining to the resin composition.
[0009] FIG. 5 is a cross-sectional view of a mold of the composite
shown in FIG. 1.
[0010] FIG. 6 is a flow chart of making the composite.
DETAILED DESCRIPTION
[0011] FIG. 1 shows a composite 100 according to an exemplary
embodiment. The composite 100 includes a substrate 11, and at least
a resin composition 13 formed on the substrate 11.
[0012] The substrate 11 can be made of metal, glass, or ceramic.
The metal can be stainless steel, magnesium alloy, or copper
alloy.
[0013] Referring to FIG. 2, a plurality of micro-pores 111 are
defined in a surface of the substrate 11. The pore diameter of the
micro-pores 111 can be in a range of about 1 micrometer (.mu.m) to
about 100 .mu.m, and the pore depth of the micro-pores 111 can be
in a range of about 1 .mu.m-about 200 .mu.mm. Each two adjacent
micro-pores 111 have a space between them of about 10 .mu.m-about
200 .mu.m.
[0014] The pore diameter and the pore depth of the micro-pores 111,
and the space of each two micro-pores 111 can be adjusted.
[0015] In the embodiment, the micro-pores 111 are regularly
distributed in an array in the surface of the substrate 11.
Alternately, the micro-pores 111 can be irregularly distributed in
the surface of the substrate 11.
[0016] Referring to FIGS. 3 and 4, the resin composition 13 is
coupled to the surface of the substrate 11 having the micro-pores
111 and fills the micro-pores 111. That is, a portion of the resin
composition 13 insert in the micro-pores 111, which causes a
locking/catching effect and strongly bonding the resin composition
13 to the substrate 11.
[0017] The resin composition 13 can be coupled to the substrate 11
by molding. The resin composition 13 can be made up of crystalline
thermoplastic synthetic resins having high fluidity. In the
exemplary embodiment, polyphenylene sulfide (PPS), polyamide (PA),
polybutylene terephthalate (PBT), or polyethylene terephthalate
(PET) can be selected as the molding materials for the resin
composition 13. The resin composition 13 can bond firmly with the
substrate 11. The molding materials can be added with some
fiberglass to improve the property for molding.
[0018] Referring to FIG. 6, a flow chart is presented in accordance
with an example embodiment of a method 30 for making the composite
100 which may include the following steps. The example method 30 is
provided by way of example, as there are a variety of ways to carry
out the method. The method 30 described below can be carried out
using the configurations illustrated in FIG. 6, for example, and
various elements of the figure are referenced in explaining example
method 30. Each block shown in FIG. 6 represents one or more
processes, methods or subroutines, carried out in the example
method 30.
[0019] At block 31, a substrate 11 is provided.
[0020] At block 32, the substrate 11 is cleaned. The cleaning
process can be carried out by dipping the substrate 11 in a water
solution containing Na.sup.+. The water solution can contain sodium
carbonate, sodium phosphate, and sodium silicate. The sodium
carbonate may have a mass concentration of about 30 g/L-about 50
g/L. The sodium phosphate may have a mass concentration of about 30
g/L-about 50 g/L. The sodium silicate may have a mass concentration
of about 3 g/L-about 5 g/L. During the dipping process, the water
solution may keep at about 50.degree. C.-about 60.degree. C. The
dipping process may last about 5 min-about 15 min. After that, the
substrate 11 is rinsed.
[0021] At block 33, the substrate 11 is laser etched to form the
micro-pores 111 in a surface of the substrate 11. The laser etching
process can be carried out using a laser machine having the
parameters of, power: about 10 W-about 30 W, frequency: about 20
KHZ-about 60 KHZ, and step length: about 0.005 .mu.m-about 0.1
.mu.m.
[0022] At block 34, an injection mold 20 as is shown in FIG. 5 is
provided. The injection mold 20 includes a core insert 23 and a
cavity insert 21. The core insert 23 defines several gates 231, and
a first cavity 233. The cavity insert 21 defines a second cavity
211 for receiving the substrate 11. The substrate 11 having the
micro-pores 111 is located in the second cavity 211, and molten
resin is injected through the gates 231 to coat the surface of the
substrate 11 and fill the micro-pores 111, and finally fill the
first cavity 233 to form the resin composition 13, as such, the
composite 100 is formed. The molten resin can be crystalline
thermoplastic synthetic resins having high fluidity, such as PPS,
PA, PBT, or PET. During the molding process, the injection mold 20
keeps a temperature of about 120.degree. C.-about 140.degree.
C.
[0023] Tensile strength and shear strength of the composite 100
have been tested. The tests indicated that the shear strength of
the composite 100 was about 20 MPa-about 30 MPa, and the tensile
strength of the composite 100 was about 8 MPa-about 16 MPa.
Furthermore, the composite 100 has been subjected to a temperature
humidity bias test (72 hours, 85.degree. C., relative humidity:
85%) and a thermal shock test (48 hours, -40.degree. C.-85.degree.
C., 4 hours/cycle, 12 cycles total), such testing did not result in
decreased the shear strength and the tensile strength of the
composite 100.
[0024] The exemplary method of forming the micro-pores 111 is very
effectively comparing to the conventional chemical etching,
electrochemical etching or anodizing treating, and simultaneously
fit for multiple materials.
[0025] It is believed that the exemplary embodiment and its
advantages will be understood from the foregoing description, and
it will be apparent that various changes may be made thereto
without departing from the spirit and scope of the disclosure or
sacrificing all of its advantages, the examples hereinbefore
described merely being preferred or exemplary embodiment of the
disclosure.
* * * * *