U.S. patent application number 14/409725 was filed with the patent office on 2015-07-16 for pipe embedded structure and method of manufacturing the same.
This patent application is currently assigned to NHK Spring Co., Ltd.. The applicant listed for this patent is NHK Spring Co., Ltd.. Invention is credited to Masaru Akabayashi, Shogo Mori, Yuichiro Yamauchi.
Application Number | 20150198387 14/409725 |
Document ID | / |
Family ID | 49881982 |
Filed Date | 2015-07-16 |
United States Patent
Application |
20150198387 |
Kind Code |
A1 |
Mori; Shogo ; et
al. |
July 16, 2015 |
PIPE EMBEDDED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Abstract
A pipe embedded structure includes: a pipe made of a metal or an
alloy, and having a periphery forming a circular shape; a base
material made of a metal or an alloy, including a recessed portion
having an inner wall on which a part of the periphery abuts and in
which the pipe is fitted; and a deposited layer formed by
accelerating powder formed of a metal or an alloy together with a
gas in a state where the pipe is fitted into the recessed portion,
and spraying and depositing the powder on surfaces of the pipe and
the base material while maintaining a solid phase state of the
powder, wherein a ratio h/R of a protruding amount h by which the
pipe protrudes from the surface of the base material and a
curvature R of the periphery is not smaller than 0.3 and not
greater than 0.7.
Inventors: |
Mori; Shogo; (Kanagawa,
JP) ; Yamauchi; Yuichiro; (Kanagawa, JP) ;
Akabayashi; Masaru; (Kanagawa, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NHK Spring Co., Ltd. |
Yokohama-shi |
|
JP |
|
|
Assignee: |
NHK Spring Co., Ltd.
Yokohama-shi
JP
|
Family ID: |
49881982 |
Appl. No.: |
14/409725 |
Filed: |
July 1, 2013 |
PCT Filed: |
July 1, 2013 |
PCT NO: |
PCT/JP2013/068077 |
371 Date: |
December 19, 2014 |
Current U.S.
Class: |
165/168 ;
427/180 |
Current CPC
Class: |
F28F 3/12 20130101; F28F
2275/02 20130101; F28F 1/20 20130101; F28F 1/00 20130101; C23C
24/04 20130101; F28F 2255/146 20130101; F28D 2021/0029
20130101 |
International
Class: |
F28F 3/12 20060101
F28F003/12; C23C 24/04 20060101 C23C024/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 3, 2012 |
JP |
2012-149972 |
Claims
1. A pipe embedded structure comprising: a pipe made of a metal or
an alloy, and having a periphery forming a circular shape in a
transverse section; a base material made of a metal or an alloy,
comprising a recessed portion having an inner wall on which a part
of the periphery abuts and in which the pipe is fitted; and a
deposited layer formed by accelerating powder formed of a metal or
an alloy together with a gas in a state where the pipe is fitted
into the recessed portion, and spraying and depositing the powder
on surfaces of the pipe and the base material while maintaining a
solid phase state of the powder, wherein a ratio h/R of a
protruding amount h by which the pipe protrudes from the surface of
the base material and a curvature R of the periphery is not smaller
than 0.3 and not greater than 0.7.
2. The pipe embedded structure according to claim 1, wherein, in
the transverse section of the pipe, a clearance of the recessed
portion and the pipe is not smaller than 0 mm and not greater than
0.05 mm.
3. The pipe embedded structure according to claim 1, wherein the
pipe is formed of stainless steel, a copper alloy, a nickel alloy,
tantalum, niobium, titanium, aluminum, or an aluminum alloy.
4. The pipe embedded structure according to claim 1, wherein the
base material is formed of copper, a copper alloy, aluminum, or an
aluminum alloy.
5. The pipe embedded structure according to claim 4, wherein the
powder is formed of copper or aluminum.
6. A method of manufacturing a pipe embedded structure, the method
comprising: a base material forming step of forming, in a base
material made of a metal or an alloy, a recessed portion having an
inner wall on which a part of a periphery of a pipe abuts, the pipe
being made of a metal or an alloy and having the periphery forming
a circular shape in a transverse section; and a deposited layer
forming step of forming a deposited layer by fitting the pipe into
the recessed portion, accelerating powder formed of a metal or an
alloy together with a gas, and spraying and depositing the powder
on surfaces of the pipe and the base material while maintaining a
solid phase state of the powder, wherein the base material forming
step causes a ratio h/R of a protruding amount h by which the pipe
protrudes from the surface of the base material and a curvature R
of the periphery to be not smaller than 0.3 and not greater than
0.7.
7. The method of manufacturing a pipe embedded structure according
to claim 6, wherein the base material forming step causes a
clearance of a width of the recessed portion in the transverse
section of the pipe and an outer diameter of the pipe to be not
smaller than 0 mm and not greater than 0.05 mm.
8. The pipe embedded structure according to claim 2, wherein the
pipe is formed of stainless steel, a copper alloy, a nickel alloy,
tantalum, niobium, titanium, aluminum, or an aluminum alloy.
9. The pipe embedded structure according to claim 2, wherein the
base material is formed of copper, a copper alloy, aluminum, or an
aluminum alloy.
10. The pipe embedded structure according to claim 3, wherein the
base material is formed of copper, a copper alloy, aluminum, or an
aluminum alloy.
11. The pipe embedded structure according to claim 8, wherein the
base material is formed of copper, a copper alloy, aluminum, or an
aluminum alloy.
12. The pipe embedded structure according to claim 9, wherein the
powder is formed of copper or aluminum.
13. The pipe embedded structure according to claim 10, wherein the
powder is formed of copper or aluminum.
14. The pipe embedded structure according to claim 11, wherein the
powder is formed of copper or aluminum.
Description
FIELD
[0001] The present invention relates to a pipe embedded structure
in which a pipe is embedded in a metal member, the pipe circulating
a temperature adjustment medium, such as a cooling gas or cooling
water, and a method of manufacturing the pipe embedded
structure.
BACKGROUND
[0002] Structures (hereinafter, referred to as pipe embedded
structures) in which a pipe, which circulates a fluid is embedded
in a metal member are used in various uses, such as a process of
manufacturing products including semiconductors, liquid crystal
display devices, and optical disks. For example, a pipe embedded
structure in which a heating medium (coolant) is circulated in the
pipe is used as a temperature adjustment device (cold plate, or the
like) that adjusts (cools or heats) the temperature of a substrate
(for example, see Patent Literature 1). Further, a pipe embedded
structure in which a gas containing a predetermined constituent is
circulated in a passage is sometimes used as a shower plate that
supplies the gas to a substrate.
[0003] Such pipe embedded structures are conventionally
manufactured such that the pipe that circulates a fluid, and the
metal member in which a recessed portion having a shape
corresponding to the pipe is formed by drilling or the like are
separately made, and the pipe is fitted into the recessed portion
in the metal member.
[0004] Further, in recent years, a technology of embedding a pipe
in a metal member by a so-called cold spray method has been
proposed, the cold spray method being to spray metal powder on a
base material while maintaining a solid phase state of the metal
powder, and to deposit the metal on the base material, thereby to
form a structure (for example, see Patent Literature 2).
CITATION LIST
Patent Literature
[0005] Patent Literature 1: Japanese Laid-open Patent Publication
No. 2009-13497 [0006] Patent Literature 2: Japanese Laid-open
Patent Publication No. 2011-238705
SUMMARY
Technical Problem
[0007] In the pipe embedded structures, if a gap exists between the
pipe and the metal member, the thermal resistance becomes large,
and the thermal conductivity and the thermal uniformity between the
fluid circulated in the pipe and the metal member are deteriorated.
Further, a foreign body may enter the gap therebetween, or the pipe
may be shaky in the recessed portion due to the gap. However, it is
difficult to bond them adhering to each other by only the method of
simply fitting the pipe in the recessed portion, which is provided
in the metal member, so as not to cause the gap between an inner
wall of the recessed portion and an external wall of the pipe.
[0008] On this point, with the cold spray method, a dense metal
coating film can be deposited around the pipe. Therefore, a
structure having excellent thermal conductivity can be made.
However, even in this case, adhesive properties of the metal
coating film to the pipe may be deteriorated because a local gap is
caused around the pipe, depending on a condition, such as the shape
of the pipe or an angle at which the metal powder is sprayed on the
pipe and the base material.
[0009] The present invention has been made in view of the
foregoing, and an objective is to provide a pipe embedded structure
with improved adhesive properties between a pipe that forms a
passage and a metal member, and a method of manufacturing the pipe
embedded structure.
Solution to Problem
[0010] To solve the above-described problem and achieve the object,
a pipe embedded structure according to the present invention
includes: a pipe made of a metal or an alloy, and having a
periphery forming a circular shape in a transverse section; a base
material made of a metal or an alloy, including a recessed portion
having an inner wall on which a part of the periphery abuts and in
which the pipe is fitted; and a deposited layer formed by
accelerating powder formed of a metal or an alloy together with a
gas in a state where the pipe is fitted into the recessed portion,
and spraying and depositing the powder on surfaces of the pipe and
the base material while maintaining a solid phase state of the
powder, wherein a ratio h/R of a protruding amount h by which the
pipe protrudes from the surface of the base material and a
curvature R of the periphery is not smaller than 0.3 and not
greater than 0.7.
[0011] In the above-described pipe embedded structure, in the
transverse section of the pipe, a clearance of the recessed portion
and the pipe is not smaller than 0 mm and not greater than 0.05
mm.
[0012] In the above-described pipe embedded structure, the pipe is
formed of stainless steel, a copper alloy, a nickel alloy,
tantalum, niobium, titanium, aluminum, or an aluminum alloy.
[0013] In the above-described pipe embedded structure, the base
material is formed of copper, a copper alloy, aluminum, or an
aluminum alloy.
[0014] In the above-described pipe embedded structure, the powder
is formed of copper or aluminum.
[0015] A method of manufacturing a pipe embedded structure
according to the present invention includes: a base material
forming step of forming, in a base material made of a metal or an
alloy, a recessed portion having an inner wall on which a part of a
periphery of a pipe abuts, the pipe being made of a metal or an
alloy and having the periphery forming a circular shape in a
transverse section; and a deposited layer forming step of forming a
deposited layer by fitting the pipe into the recessed portion,
accelerating powder formed of a metal or an alloy together with a
gas, and spraying and depositing the powder on surfaces of the pipe
and the base material while maintaining a solid phase state of the
powder, wherein the base material forming step causes a ratio h/R
of a protruding amount h by which the pipe protrudes from the
surface of the base material and a curvature R of the periphery to
be not smaller than 0.3 and not greater than 0.7.
[0016] In the above-described method of manufacturing a pipe
embedded structure, the base material forming step causes a
clearance of a width of the recessed portion in the transverse
section of the pipe and an outer diameter of the pipe to be not
smaller than 0 mm and not greater than 0.05 mm.
Advantageous Effects of Invention
[0017] According to the present invention, the recessed portion
having the ratio h/R not smaller than 0.3 and not greater than 0.7
is formed on the base material, the ratio h/R being a ratio of the
protruding amount h of the pipe that forms a passage from the base
material, and the curvature R of the periphery of the pipe, the
pipe is fitted into the recessed portion, and the deposited layer
is formed on the surfaces of the pipe and the base material by a
so-called cold spray method. Therefore, a dense deposited layer can
be formed around the pipe that protrudes from the base material,
and the adhesive properties between the pipe and the metal member
can be improved.
BRIEF DESCRIPTION OF DRAWINGS
[0018] FIG. 1 is a cross sectional view illustrating a structure of
a pipe embedded structure according to an embodiment of the present
invention.
[0019] FIG. 2 is a flowchart illustrating a method of manufacturing
the pipe embedded structure illustrated in FIG. 1.
[0020] FIG. 3A is a schematic diagram for describing process S1
illustrated in FIG. 2.
[0021] FIG. 3B is a schematic diagram for describing process S2
illustrated in FIG. 2.
[0022] FIG. 3C is a schematic diagram for describing process S3
illustrated in FIG. 2.
[0023] FIG. 4 is a schematic diagram illustrating an overview of a
cold spray device.
[0024] FIG. 5 is a SEM image illustrating a deposited layer in a
first example.
[0025] FIG. 6 is a SEM image illustrating a deposited layer in a
second example.
[0026] FIG. 7A is a SEM image illustrating a deposited layer in a
first comparative example.
[0027] FIG. 7B is a schematic diagram illustrating a positional
relationship between a pipe and a base material in the first
comparative example.
[0028] FIG. 8A is a SEM image illustrating a deposited layer in a
second comparative example.
[0029] FIG. 8B is a schematic diagram illustrating a positional
relationship between a pipe and a base material in the second
comparative example.
[0030] FIG. 9 is an optical photograph illustrating a deposited
layer in a third example.
[0031] FIG. 10 is an optical photograph illustrating a deposited
layer in a fourth example.
[0032] FIG. 11 is an optical photograph illustrating a deposited
layer in a third comparative example.
DESCRIPTION OF EMBODIMENTS
[0033] Hereinafter, embodiments for implementing the present
invention will be described in detail with reference to the
drawings. Note that the present invention is not limited by the
following embodiments. Further, the drawings referred in the
following description merely schematically illustrate the shape,
the size, and the positional relationship to the extent that the
content of the present invention can be understood. That is, the
present invention is not limited only by the shape, the size, and
the positional relationship exemplarily illustrated in the
drawings.
Embodiment
[0034] FIG. 1 is a cross sectional view illustrating a structure of
a pipe embedded structure according to an embodiment of the present
invention. As illustrated in FIG. 1, a pipe embedded structure 1
according to the present embodiment includes: a pipe 10 made of a
metal or an alloy and having a periphery that forms a circular
shape in a transverse section; a base material 11 made of a metal
or an alloy, including a recessed portion 11a to which the pipe is
fitted; and a deposited layer 12 made of a metal or an alloy and
formed on the pipe 10 and the base material 11. Such a pipe
embedded structure 1 circulates a desired fluid (a liquid or a gas)
in the pipe 10, and is used as a temperature adjustment device (for
example, a cold plate), a fluid supply device (for example, a
shower plate), or the like.
[0035] The pipe 10 is a pipe having a tube shaped cross section
with an outer diameter p and a curvature R of the periphery. Note
that the thickness of the pipe 10 is appropriately determined
according to the use or the material.
[0036] The shape of the pipe 10 in a length direction (a direction
into which the fluid is circulated) is not especially limited, and
the planar shape of the pipe 10 as viewed from above of the pipe
embedded structure 1 can be various shapes, such as a linear shape,
a spiral shape or a meandering shape.
[0037] The material of the pipe 10 is selected according to the
fluid to be circulated in the pipe 10 or the use of the pipe
embedded structure 1. For example, when a liquid or a gas having
corrosion properties is circulated, a metal or an alloy having
corrosion resistance, such as stainless steel, a copper alloy, a
nickel alloy, tantalum, niobium, or titanium, is used. Further,
when city water or sea water is circulated as cooling water, a
material having favorable thermal conductivity, such as stainless
steel, of the above-described materials, is used. Meanwhile, when
process cooling water (PCW), an organic solvent, an inert gas, or
the like is circulated, the corrosion resistance is not essential,
and aluminum or an aluminum alloy having excellent thermal
conductivity can be used.
[0038] The base material 11 is a bulk material formed of a metal or
a metal alloy having favorable thermal conductivity, such as
copper, a copper alloy, aluminum, or an aluminum alloy. The
recessed portion 11a is formed such that an upper surface 11b of
the base material 11 is drilled in a groove manner. Note that the
planar shape of the recessed portion 11a on the upper surface 11b
corresponds to the planar shape of the pipe 10.
[0039] The recessed portion 11a has an inner wall on which a part
of the periphery of the pipe 10 abuts. The transverse section shape
of the inner wall of the recessed portion 11a is an arc shape along
the periphery of the pipe 10. The depth d of the recessed portion
11a is defined such that a ratio h/R of a height (hereinafter,
referred to as protruding amount) h by which the pipe 10 protrudes
from the upper surface 11b, and the curvature R of the periphery of
the pipe 10 becomes not smaller than 0.3 and not greater than 0.7.
Further, the width of the recessed portion 11a has a maximum value
w (w.apprxeq..phi.) at a height corresponding to the curvature R,
based on a deepest portion of the recessed portion 11a, and the
recessed portion 11a opens from the height to an upper portion
while maintaining the maximum value w. Further, a clearance w-.phi.
of the recessed portion 11a and the pipe 10 falls within a range
from 0 to 0.05 mm, both inclusive.
[0040] The deposited layer 12 is formed by a so-called cold spray
method. Here, the cold spray method is a coating film forming
method, which accelerates powder made of a metal or an alloy
together with a gas, and sprays the powder with the gas on a
surface of a base (the pipe 10 and the base material 11 in the
present embodiment) while maintaining a solid phase state of the
powder, thereby to deposit the powder. The deposited layer 12
formed by the cold spray method does not have phase transformation,
and oxidization is suppressed. Therefore, the deposited layer 12
has high thermal conductivity. Further, when the powder collides
with the base or the coating film deposited on the base before,
plastic deformation is caused between the powder and the base, and
anchor effect can be obtained. In addition, oxide coating films of
both sides are destroyed and metallic bond by newly formed surfaces
is caused. Therefore, the adhesive strength of the powder with the
base becomes strong, and a coating film with suppressed thermal
resistance can be formed.
[0041] Such a deposited layer 12 is formed of a metal or an alloy
having favorable thermal conductivity, such as copper or
aluminum.
[0042] Next, a method of manufacturing the pipe embedded structure
1 will be described. FIG. 2 is a flowchart illustrating a method of
manufacturing the pipe embedded structure 1. Further, FIGS. 3A to
3C are schematic diagrams for describing the method of
manufacturing the pipe embedded structure 1.
[0043] First, in process S1, the groove-shaped recessed portion 11a
is formed on a surface of a bulk material 13 made of a metal or an
alloy by drilling, and the base material 11 is made, as illustrated
in FIG. 3A.
[0044] Next, in process S2, the pipe 10 is fitted into the recessed
portion 11a, as illustrated in FIG. 3B.
[0045] Further, in process S3, the deposited layer 12 is formed on
the surfaces of the pipe 10 and the base material 11 by the cold
spray method, as illustrated in FIG. 3C.
[0046] FIG. 4 is a schematic diagram illustrating an overview of a
cold spray device used in process S3. As illustrated in FIG. 4, a
cold spray device 20 includes a gas heater 21, a powder supply
device 22, a gas nozzle 24, and valves 25 and 26. The gas heater 21
heats a compressed gas. The powder supply device 22 houses powder
(hereinafter, may be simply referred to as powder) 28 of the
material of the deposited layer 12, and supplies the powder 28 to a
spray gun 23. The gas nozzle 24 jets the heated compressed gas and
the powder 28 supplied thereto to a base 27. The valves 25 and 26
respectively adjust supply amounts of the compressed gas to the gas
heater 21 and to the powder supply device 22.
[0047] As the compressed gas, helium, nitrogen, oxygen, or the like
is used. The compressed gas supplied to the gas heater 21 is
50.degree. C. or more, for example, and is heated to a temperature
in a range lower than a melting point of the powder 28, and is then
supplied to the spray gun 23. The heating temperature of the
compressed gas is favorably 300 to 900.degree. C. Meanwhile, the
compressed gas supplied to the powder supply device 22 supplies the
powder 28 in the powder supply device 22 to the spray gun 23 such
that the amount of the powder 28 becomes a predetermined discharge
amount.
[0048] The heated compressed gas is caused to form ultrasonic flow
(about 340 m/s or more) by the gas nozzle 24 having a widening
shape from an inlet toward an outlet. The gas pressure of the
compressed gas at this time is favorably about 1 to 5 MPa. By
adjusting the pressure of the compressed gas to the range, the
adhesive strength of the powder (coating film) with respect to the
base 27 can be improved. More favorably, the processing is
performed at a pressure of about 2 to 4 MPa. The powder 28 supplied
to the spray gun 23 is accelerated by being put into the ultrasonic
flow of the compressed gas, collides with the base 27 at a high
speed while remaining in the solid phase state, and is deposited on
the base 27. Note that the cold spray device is not limited to the
cold spray device 20 illustrated in FIG. 4 as long as the device
can cause the powder 28 to collide with the base 27 while
maintaining the solid phase state of the powder 28, and form a
coating film.
[0049] In such a cold spray device 20, as the base 27, the base
material 11 obtained such that the pipe 10 is fitted into the
recessed portion 11a is arranged, and the coating film is formed on
the surfaces of the pipe 10 and the base material 11. At this time,
the powder 28 enters regions 14 between vicinities of upper ends of
the recessed portion 11a and the pipe 10, and forms the coating
film.
[0050] As described above, by forming the deposited layer 12 to
have a desired thickness, the pipe embedded structure 1 illustrated
in FIG. 1 is completed. Note that, as illustrated in FIG. 3C, a
part of the pipe 10 rises more than the upper surface 11b of the
base material, and thus the deposited layer 12 has a shape rising
on an upper portion of the pipe 10. Therefore, the deposited layer
12 is formed thicker, and then an unnecessary portion is removed by
cutting or the like, so that the surface of the deposited layer 12
may be flattened.
[0051] Next, the relationship between the transverse section of the
pipe 10 and the recessed portion 11a provided in the base material
11 will be described.
[0052] In the cold spray method, typically, the powder 28, which is
jetted through the gas nozzle 24 into one direction, is caused to
collide with the base 27, and the coating film is formed.
Therefore, the coating film cannot be formed on a shaded portion
with respect to the jetting direction of the powder 28. Further,
formation of the coating film becomes more difficult as a forming
surface of the coating film becomes closer to parallel to the
jetting direction of the powder 28. Therefore, the inventors of the
present application have diligently performed experiments in order
to obtain conditions for forming a dense and uniform deposited
layer 12 at side portions of the pipe 10, that is, in the
vicinities of interfaces between the pipe 10 and the base material
11 when the deposited layer 12 is formed by the cold spray
method.
[0053] As a result, the inventors of the present application have
found out that, when manufacturing the pipe embedded structure 1 in
which the pipe 10 having a periphery that forms a circular shape in
a transverse section is embedded, the inventors can form the dense
and uniform deposited layer 12 adhering to the pipe 10 and the base
material 11 by providing the recessed portion 11a that satisfies
following conditions (1) and (2) to the base material 11.
(1) The radio h/R of the protruding amount h by which the pipe 10
protrudes from the surface of the base material 11, and the
curvature R of the periphery of the pipe 10 is caused to be from
0.3 to 0.7, both inclusive. (2) The clearance .DELTA. of the
recessed portion 11a and the pipe 10 is caused to be from 0 to 0.05
mm, both inclusive.
[0054] According to the present embodiment, the recessed portion
defined by the above-described conditions is formed in the base
material, the pipe is fitted into the recessed portion, and the
deposited layer is formed by the cold spray method, whereby the
dense and uniform deposited layer adhering to the pipe and the base
material can be formed around the pipe. Therefore, when the pipe
embedded structure having the adhesive properties improved as
described above is used as a temperature adjustment device or a
shower plate, temperature adjustment efficiency can be improved by
the favorable thermal conductivity and thermal uniformity. Note
that, in this case, it is favorable to use the deposited layer 12
side as a thermal conduction surface.
Example
[0055] Hereinafter, examples and comparative examples will be
described with reference to FIGS. 5 to 11.
[0056] First, first and second examples and first and second
comparative examples will be described. FIGS. 5, 6, 7A, and 8A are
SEM images of the pipe 10, the base material 11, and the deposited
layer 12 imaged from a direction perpendicular to the transverse
section of the pipe 10, when forming the deposited layer 12 while
changing the ratio h/R. Note that, in FIGS. 5, 6, 7A, and 8A, an
interface between a side surface and an upper surface of the base
material 11 is illustrated by a single-dotted chain line. Further,
a part of an outer diameter of the pipe 10 is supplemented by a
broken line. FIGS. 7B and 8B are schematic diagrams illustrating
the positional relationship between the pipe 10 and the base
material 11 in the first and second comparative examples.
[0057] Samples were made with following materials and conditions in
the first and second examples and the first and second comparative
examples.
[0058] The base material: a copper alloy plate having 40
mm.times.40 mm and the thickness of 10 mm
[0059] The pipe: a copper alloy having the outer diameter .phi.=6
mm and the curvature R of the periphery=3 mm
[0060] The material of the deposited layer: copper powder having an
average particle diameter of 26.18 .mu.m
[0061] The clearance of the recessed portion provided in the base
material and the pipe: .DELTA.=0 mm
First Example
[0062] The ratio h/R was 0.67. As a result, the dense and uniform
deposited layer 12 having a sufficient thickness at the side
portions of the pipe 10 was able to be formed, as illustrated in
FIG. 5.
Second Example
[0063] The ratio h/R was 0.33. As a result, the dense and uniform
deposited layer 12 having a sufficient thickness at the side
portions of the pipe 10 was able to be formed, as illustrated in
FIG. 6.
First Comparative Example
[0064] The ratio h/R was 1 (the protruding amount h=the curvature
R), that is, the recessed portion 11a having a depth corresponding
to half of the outer diameter .phi. of the pipe 10 was formed in
the base material 11, and just half of the pipe 10 was housed in
the recessed portion 11a. In this case, as illustrated in FIG. 7B,
end portions of the side portions of the pipe 10 that protrudes
from the upper surface 11b of the base material 11 were nearly
parallel to the jetting direction of the powder, and the powder was
not able to adhere to the portions. Therefore, as illustrated in
FIG. 7A, the deposited layer 12 was not able to be formed on the
side portions of the pipe 10, and cracking was caused between the
deposited layer 12 formed on the pipe 10 and the deposited layer 12
formed on the base material 11.
Second Comparative Example
[0065] The ratio h/R was 0 (the protruding amount h=0), that is,
the recessed portion 11a having a depth corresponding to the outer
diameter p of the pipe 10 was formed in the base material 11, and
the entire pipe 10 was housed in the recessed portion 11a. In this
case, as illustrated in FIG. 8B, a deep gap was caused between the
inner wall of the recessed portion 11a and the pipe 10, and the
powder was not able to be sufficiently filled. Therefore, as
illustrated in FIG. 8A, a sufficient deposited layer 12 was not be
able to be formed on the side portions of the pipe 10, and cracking
was caused between the deposited layer 12 formed on the pipe 10 and
the deposited layer 12 formed on the base material 11.
[0066] Next, third and fourth examples and a third comparative
example will be described. FIGS. 9 to 11 are optical photographs
illustrating the deposited layer 12 when the clearance .DELTA. of
the recessed portion 11a and the pipe 10 was changed. These optical
photographs are polished surfaces of the deposited layer 12 imaged
from an upper surface side. The polished surfaces were obtained
such that the deposited layer 12 was sufficiently (from an upper
end surface of the pipe 10 to the height exceeding 1 mm) formed on
the pipe 10, the deposited layer 12 was then cut at the height of 1
mm from the upper end surface of the pipe 10 by milling, and the
deposited layer 12 was further polished.
[0067] In the third and fourth examples and the third comparative
example, samples were made with following materials and
conditions.
[0068] The base material: the copper alloy plate having 40
mm.times.40 mm and the thickness of 10 mm
[0069] The pipe: a copper alloy having the outer diameter .phi.=6
mm and the curvature R of the periphery=3 mm
[0070] The material of the deposited layer: copper powder having an
average particle diameter of 26.18 .mu.m
[0071] The ratio h/R=0.5
Third Example
[0072] The clearance .DELTA. was 0 mm. As a result, a dense and
uniform deposited layer 12 smoothly continuous with a region on the
pipe 10 and a region on the base material 11 was able to be formed,
as illustrated in FIG. 9.
Fourth Example
[0073] The clearance .DELTA. was 0.05 mm. As a result, a dense and
uniform deposited layer 12 smoothly continuous with a region on the
pipe 10 and a region on the base material 11 was able to be formed,
although interface lines of surfaces were observed between the
region on the pipe 10 and the region on the base material 11, as
illustrated in FIG. 10.
Third Comparative Example
[0074] The clearance .DELTA. was 0.10 mm. In this case, cracking
was observed between a region on the pipe 10 and a region on the
base material 11, as illustrated in FIG. 11.
REFERENCE SIGNS LIST
[0075] 1 Pipe embedded structure [0076] 10 Pipe [0077] 11 Base
material [0078] 11a Recessed portion [0079] 11b Upper surface
[0080] 12 Deposited layer [0081] 13 Bulk material [0082] 14 Regions
[0083] 20 Cold spray device [0084] 21 Gas heater [0085] 22 Powder
supply device [0086] 23 Spray gun [0087] 24 Gas nozzle [0088] 25
and 26 Valve [0089] 27 Base [0090] 28 Powder
* * * * *