U.S. patent application number 14/595089 was filed with the patent office on 2015-07-16 for surface adhesives for building boards.
The applicant listed for this patent is Saint-Gobain Placo SAS. Invention is credited to Gerald D. Boydston, Robert J. Hauber, Michael S. Urso.
Application Number | 20150197941 14/595089 |
Document ID | / |
Family ID | 53520875 |
Filed Date | 2015-07-16 |
United States Patent
Application |
20150197941 |
Kind Code |
A1 |
Urso; Michael S. ; et
al. |
July 16, 2015 |
Surface Adhesives for Building Boards
Abstract
The present disclosure relates to performance enhancing surface
coatings for building boards. More particularly, the disclosure
relates to the using of building boards employing surface adhesives
to eliminate the need for fasteners in holding building boards in
place after installation.
Inventors: |
Urso; Michael S.; (Lutz,
FL) ; Hauber; Robert J.; (Land O Lakes, FL) ;
Boydston; Gerald D.; (Cody, WY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Saint-Gobain Placo SAS |
Suresnes |
|
FR |
|
|
Family ID: |
53520875 |
Appl. No.: |
14/595089 |
Filed: |
January 12, 2015 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61926524 |
Jan 13, 2014 |
|
|
|
Current U.S.
Class: |
428/339 ;
428/343; 52/506.01 |
Current CPC
Class: |
Y10T 428/28 20150115;
Y10T 428/269 20150115; E04C 2/043 20130101; E04F 13/0887 20130101;
E04F 13/0866 20130101; E04F 13/14 20130101; E04F 13/0885
20130101 |
International
Class: |
E04F 13/08 20060101
E04F013/08; E04F 13/077 20060101 E04F013/077; E04C 2/04 20060101
E04C002/04 |
Claims
1. A building board construction comprising: a gypsum panel
including interior and exterior surfaces and a set gypsum core, the
exterior surface including a dense gypsum layer that includes a
reactive polymer material; an adhesive layer having interior and
exterior surfaces and a thickness within the range of about 0.01
mils to about 500 mils, the interior surface of the adhesive layer
secured to dense gypsum layer, the adhesive layer including a
thermoplastic material that reacts with the polymer material within
the dense gypsum layer, whereby a polymer matrix is formed once the
adhesive layer is secured to the dense gypsum layer; a series of
decorative tiles secured to the exterior surface of the adhesive
layer.
2. The building board construction as described in claim 1 wherein
the thermoplastic material comprises Acrylonitrile butadiene
styrene (ABS).
3. The building board construction as described in claim 1 wherein
the thermoplastic material comprises Ethylene Vinyl Acetate
(EVA).
4. The building board construction as described in claim 1 wherein
the melting point of the adhesive layer is between about 100
degrees Fahrenheit to about 500 degrees Fahrenheit.
5. The building board as described in claim 1 wherein the adhesive
layer is applied via a roller coater immediately following the
initial set of the gypsum panel.
6. A building construction comprising: a building panel including
interior and exterior surfaces, the interior surface including a
polymer material; an adhesive layer secured to the interior surface
of the building panel, the adhesive layer including a thermoplastic
material that is reactive with the polymer material within the
interior surface of the building panel, whereby a polymer matrix is
formed between the adhesive layer and the interior surface; a
building framing member, the adhesive layer functioning the secure
the building panel to the framing member.
7. The building construction as described in claim 6 wherein the
adhesive layer includes a release liner.
8. The building construction as described in claim 6 wherein the
building panel is formed from hydraulic cement.
9. The building construction as described in claim 6 wherein the
building panel is formed from a magnesium based cement.
10. The building board construction as described in claim 6 wherein
the thermoplastic material comprises Acrylonitrile butadiene
styrene (ABS).
11. The building board construction as described in claim 6 wherein
the thermoplastic material comprises Ethylene Vinyl Acetate
(EVA).
12. The building board construction as described in claim 6 wherein
the melting point of the adhesive layer is between about 100
degrees Fahrenheit to about 500 degrees Fahrenheit.
13. A building board construction comprising: a composite building
panel including interior and exterior surfaces; a pressure
sensitive adhesive layer applied to one of the surfaces of the
composite building panel, the adhesive layer including a
thermoplastic material.
14. The building board construction as described in claim 13
wherein the composite building panel includes a fibrous mat on one
of the surfaces and wherein the pressure sensitive adhesive is
applied to the fibrous mat.
15. The building board construction as described in claim 13
wherein the composite building panel includes a paper face on one
of the surfaces and wherein the pressure sensitive adhesive is
applied to paper face.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Application Ser.
No. 61/926,524, filed Jan. 13, 2014, and entitled "Surface
Adhesives for Building Boards," the contents of which are fully
incorporated herein for all purposes.
TECHNICAL FIELD
[0002] This disclosure relates to surface adhesives for building
boards. More particularly, this disclosure relates to building
boards with an applied pressure sensitive adhesive.
BACKGROUND OF THE INVENTION
[0003] Building board, also known as wallboard, plasterboard, or
drywall, is one of the most commonly used building components in
the world today. Building board is frequently used within the
interior or exterior of dwellings. One particularly popular form of
building board is known as gypsum board. Gypsum board is
constructed by depositing a layer of cementitious gypsum slurry
between two opposing paper liners. Gypsum boards generally have a
smooth external surface, a consistent thickness, and allow for the
application of finishing enhancements, such as paint. One drawback
of existing gypsum building boards is that it is often difficult to
secure fasteners into the surface of the board. This complicates
the task of hanging objects, such as pictures or shelving. It also
poses problems for mounting the board on framing members. Gypsum
board can also be used as a backing for tiles. Tile backing board
is often used in high humidity environments such as bathrooms and
pool areas. It is important for tile backing board to provide a
firm hold on the tiles and at the same time be resistant to
moisture.
[0004] One useful development is known as glass reinforced gypsum
(GRG) board. An example of one such board is disclosed in U.S. Pat.
No. 4,265,979 to Baehr et. al. Baehr discloses a paper-free gypsum
board construction. A subsequent improvement is described in
commonly owned U.S. Pat. No. 4,378,452 to Pilgrim. Pilgrim
discloses a GRG board that is faced on one or both sides with a
porous, nonwoven glass mat. The glass mat of Pilgrim is slightly
embedded into the slurry core.
[0005] A further embodiment was realized by embedding the mat
within the core. The creates a thin film of slurry on the outer
surface of the board. Building boards with this construction are
referred to as embedded glass reinforced gypsum (EGRG) boards. EGRG
boards eliminate, or greatly reduce, the presence of exposed fibers
and otherwise provide a smooth working surface.
[0006] Thus, there exists a need in the art to provide building
boards that can be easily and firmly secured to associated framing
members. There also exists a need in the art for building boards
that can easily and firmly hold finishing materials. The present
disclosure fulfills these and other needs in the art by providing a
pressure sensitive adhesive layer on the interior or exterior
surface of a building board.
SUMMARY OF THE INVENTION
[0007] One of the advantages of this invention is realized by
providing building boards that can be easily and firmly attached to
associated framing members.
[0008] Another advantage is attained by including a polymer-based
adhesive on the surface of the board that eliminates the need for
external fasteners.
[0009] Yet another advantage is attained by applying a performance
enhancing layer to the surface of a building board.
[0010] A further advantage is achieved by providing a polymer-based
adhesive over top of a building board.
[0011] An additional advantage is realized by applying a
polymer-based adhesive to the polymer modified dense slurry layer
of a building board, thereby permitting the adhesive to bond to the
slurry layer.
[0012] Various embodiments of the invention may have none, some, or
all of these advantages. Other technical advantages of the present
invention will be readily apparent to one skilled in the art.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] For a more complete understanding of the present disclosure
and its advantages, reference is now made to the following
descriptions, taken in conjunction with the accompanying drawings,
in which:
[0014] FIG. 1 is a perspective view of a building board in
accordance with the present disclosure.
[0015] FIG. 2 is a elevational view of a roller coater for use in
applying the polymer-based adhesive of the present disclosure.
[0016] FIG. 3 is a cross sectional view taken along Line 2-2 of
FIG. 1.
[0017] Similar reference characters refer to similar components
throughout the several views of the drawings.
DETAILED DESCRIPTION OF THE DRAWINGS
[0018] The present disclosure relates to coatings for building
boards. In particular, the disclosure relates to pressure sensitive
adhesives ("PSA"). These PSA coatings can be any of a variety of
polymer based adhesives that are bonded to the surface of the
board. The disclosed PSAs eliminate the need for fasteners, which
are otherwise required to hang objects upon the board or hold
boards in place after installation. The various components of the
present invention, and the manner in which they interrelate, are
described in greater detail hereinafter.
[0019] The PSAs 10 are thermoplastic based surface adhesives within
an inner and an outer surface. The inner surface is adapted to
adhere to an exterior surface of an underlying building board 20.
PSA 10 is preferably applied to the board via a roller coater 40.
In the preferred embodiment, the interior surface of PSA 10 is
adhered to a polymer modified dense gypsum slurry layer (PMDSL) 30
that is formed at the exterior surface of board 20. The PSA may
include reactive and/or nonreactive components that chemically bond
with one or more polymers in PMDSL 30. When the PSA 10 is applied
to the exterior surface of a building board 20, the outer surface
of PSA 10 functions as a binding adhesive for applied finishing
materials. This eliminates the need for secondarily applied
adhesive mechanisms to hold or affix the finishing materials. In
particular, PSA 10 can be used to adhere decorative tiles to a
gypsum wallboard (i.e. tile backing board). The inner surface of
PSA 10 is secured to the exterior surface of the tile backing
board. The outer surface of the PSA 10 would then be used to firmly
secure associated tiles. A release liner may optionally be used to
cover the outer surface of PSA 10 until the tiles are adhered.
[0020] Alternatively, PSA 10 can be secured to the back, or
interior surface, of a building board 20. When applied in this
manner, PSA 10 can be used to secure the building board to studs or
framing members. This eliminates the use of traditional fasteners
like screws or nails. It is also within the scope of the present
disclosure to apply a PSA 10 to both the interior and exterior
faces of board 20.
Roller Coater Applied PSAs.
[0021] The PSAs disclosed herein can be directly applied to the
surface of the underlying building board via one or more heated
roller coaters. This allows the PSAs to be directly applied to the
polymer modified dense gypsum slurry layer (PMSDL) in the
underlying board. The roller coaters can be forward or rearward
driven and may be heated. The rollers are used in applying a strong
or weak chemical bond to the polymeric compound within the PMDSL.
The application and metering roller are heated, and the application
roll hardness is engineered to create the proper uniformity of the
PSA coating applied to the topography of the PMDSL. The heated
roller coater can coat either face of the building board singularly
or simultaneously. The rollers can also apply the PSA in varied
application volumes.
[0022] The pressure of the application roller is capable of
applying varying pressures against the PMDSL to control the
interrupted or continuous application of the PSA. The temperature
of the rollers is selected based upon the rheology of the polymeric
compound and is chosen to provide an engineered continuity of the
PSA being applied. The gap between the application roller and the
metering roller is varied to control the application rate of the
PSA. The application rate can be varied depending upon the inherent
heat, the particular rheology of the PSA, and/or the effect of
desired operating temperature.
Reactive and Nonreactive PSAs.
[0023] The PSAs described herein are preferably applied after being
heated to a liquefied stated. They can consist of reactive and/or
nonreactive polymeric compounds. The nonreactive polymeric
compounds within the PSA are fully polymerized polymeric compounds
that are taken through a phase change to the liquid state thus
allowing their application to the PMDSL. The basic structure of the
original polymer (or polymers) are maintained, however,
crosslinking and other aforementioned chemical bonding will
occur.
[0024] When the PSAs include reactive components, they form a
polymer matrix within the underlying PMDSL. More specifically, the
reactive components within the PSA form a polymer matrix extension
with polymer chains within the PMDSL. The reactive polymeric
compounds within the PSA initiate as monomers and are then heated
to improve kinetics. The reactive compounds subsequently polymerize
upon application to the PMDSL. This polymerization is a result of
their inherent properties.
[0025] The PSAs described herein can consist of one or more of the
following thermoplastic materials, used singularly or in
combination with one another: Acrylonitrile butadiene styrene
(ABS), Celluloid, Cellulose Acetate, Ethylene-Butyl Acrylate,
Ethylene-Methyl Acrylate, Ethylene Vinyl Acetate (EVA), Ethylene
Vinyl Alcohol (EVAL), Fluoroplastics (PTFEs, including FEP, PFA,
CTFE, ECTFE, ETFE), lonomers, Liquid Crystal Polymer (LCP),
Polyacetal (POM or Acetal), Polyacrylates (Melt and Cure Acrylics),
Polyacrylonitrile (PAN or Acrylonitrile), Polyamide (PA or Nylon),
Polyamide-imide (PAI), Polyaryletherketone (PAEK or Ketone),
Polybutyadiene (PBD), Polybutylene (PB), Polybutylene Terephthalate
(PBT), Polybutylene Terephthalate (PET), Polycyclohexylene
Dimethylene Terephthalate (PCT), Polycarbonate (PC), Polyketone
(PK), Polyester, Polyethylene/Polythene/Polyethane, Polyether Block
Amide (PEBA), Polyetheretherketone (PEEK), Polyetherimide (PEI),
Polyethersulfone (PES), Polyethylenechlorinates (PEC), Polyimide
(PI), Polylactic Acid (PLA), Polymethylpentene (PMP), Polyphenylene
Oxide (PPO), Polyphenylene Sulfide (PPS), Polyphthalamide (PPA),
Polypropylene (PP), Polystyrene (PS), Polysulfone (PSU), Polyvinyl
Chloride (PVC), Spectralon, thermoplastic Olefinic Elastomer
(TPO).
[0026] The preferred water vapor permeability of the applied PSA
coating may range from a minimum of 0.01 to a maximum of 98, thus
the coating may be virtually impervious to the transmission of
water vapor movement or completely open to the transmission of
water vapor movement. Thermoplastic PSA translucence may range from
0.001% to 100% translucence.
[0027] The underlying thermoplastic coating and or the
thermoplastic PSA coating may contain filler compounds which are
intended for uses which may include but are not limited to color
(opaque or translucent), UV resistance, tachifying property
enhancement, thermal insulation, thermal conductivity, electrically
conductivity, electrically non-conductivity, water resistance,
water vapor transmission enhancement, water vapor transmission
inhibition, light absorption, light refraction, sound propagation,
sound inhibition, elastomeric enhancement, rigidity enhancement,
impact resistance, puncture resistance, abrasion resistance,
volumizing, densifying, fire resistance, and sound
reverberation.
[0028] The PSA coating upon application may be engineered to offer
desired surface topography that may range from smooth profile
(having surface variations of 0.01 mils or less) to a coarse
profile equivalent to a desired specification. The applied film
thicknesses of the above mentioned PSA may range from a minimum of
0.01 mils to and maximum of 500 mils in thickness. The applied film
thickness may be applied in one or multiple applications at varying
or equivalent application temperatures and varying or equivalent
application speeds. The melt point temperature of the PSA may range
from a minimum of 100 degrees Fahrenheit to a maximum of 500
degrees Fahrenheit. The PSA coating may be applied immediately
following the initial set of the gypsum substrate or anytime
thereafter. The application of the PSA coating to the underlying
substrate may be accomplished by any of the following: gravity fed,
pump fed, forward or reverse roll coaters, or pump fed hot melt
curtain coater. It is also within the scope of the invention to
apply the PSA via hot melt spray systems, such as high pressure,
low volume or low pressure, high volume methods. The PSA coating
may be applied to any or all surfaces of the board. The PSA coating
may be applied by means of continuous or non-continuous process
methods. However, continuous coating methods are preferred.
Mechanics of the Coating Attachment
[0029] Dependent upon rheology, temperature, roller hardness, and
coating volume the PSA may be applied to the upper or lower (face
or back) topography of the building board. In one possible
embodiment, the PSA can be applied so as to mirror the substrate
topography. This mirroring of the topography provides mechanical
bonding whereby the PSA coating attaches itself to the surface of
the PMDSL via simply adhesive properties, by flowing into and
throughout the open topographic areas of the PMDSL surface. This
provides an adhesion and mechanical interlocking that is in reality
a greater contact surface area than visibly evident.
[0030] Due to the polymer contained in the PMDSL, a myriad of
chemical bonding opportunities are available. Correct selection of
the polymeric compounds allow the application of Vanderwal, ionic,
and valent & covalent bonds, and crosslinking bonds between the
PMDSL polymer and the heat applied PSA. The PSA can be applied as a
single layer or as a multilayer laminate. In the preferred
embodiment, the PSA is applied to the PSMDL layer. Alternatively,
the PSA can be applied to the glass face or cementitious pre-coated
glass mat (also known as GRG board). The PSA can also be applied to
paper faced gypsum building panels. It can likewise be applied to
any of a variety of cementitious, hydraulic cement, magnesium
based, or composite based building panels. Composite based building
panels may include, for example, gypsum fiber boards. It can
further be applied to any building panel intended for interior or
exterior lining surfaces. Although these boards may include a
PMDSL, it is within the scope of the present invention to apply the
PSA directly to a glass faced or paper faced board.
[0031] Utilizing the aforementioned bonding, mechanical, and
chemical adhesion properties single or multi PSA laminations may be
incorporated into the resulting composite building panel. These PSA
laminates may be engineered for a variety of different physical
properties and may provide one or more of the follow
characteristics: [0032] Engineered strength [0033] Electrically
generated radiant heat [0034]
Flexibility/impact/abuse/abrasion/sound/thermal/water/mold and
mildew resistance enhancements
[0035] In use, the PSA is applied to the underlying board as noted
above. The PSA can be applied to treated or untreated surfaces. It
may likewise be adhered to prepared or partially prepared building
panels. Thereafter, to aid in storage and transport, the PSA is
covered with a specially treated release sheet. The release sheet
prevents the PSA from adhering to other panels or objects when
placed in stacks for warehousing or sale.
Fillers and Modifiers
[0036] The PSAs described herein may include one or more fillers or
modifiers to increase the physical properties of the resulting
building boards. Both reactive and nonreactive polymeric compounds
provide the ability to suspend and encapsulate performance
enhancing filler and or modifier. These fillers and modifiers may
provide one or more of the following enhancements: [0037]
Electrical conductivity [0038] EMF resistance [0039] Lower
polymeric densities [0040] Sound attenuation [0041] Water
resistance [0042] Intumescent and or fire resistant enhancers
[0043] Heat transfer resistance [0044] Elastomeric performance
enhancers
[0045] The PSA may be applied to the face and or back of building
panels and functions as a binding adhesive for applied finishing
materials. This eliminates the need for secondarily applied
adhesive mechanisms to hold or affix the finishing materials. When
applied to the back of a building panel, the PSA eliminates the use
of traditional fasteners like screws, nails and or both.
[0046] When used as a mechanism applied to the back stud
installation side of the building panel, the PSA offers an improved
affixing, holding, and securing characteristics. This improvement
is realized with both organic and or inorganic structural studs and
or framing members. The PSA can improve pounds force resistance by
between 0.01 times to 100 times than that achieved with traditional
fasteners like nails and or screw.
[0047] Although this disclosure has been described in terms of
certain embodiments and generally associated methods, alterations
and permutations of these embodiments and methods will be apparent
to those skilled in the art. Accordingly, the above description of
example embodiments does not define or constrain this disclosure.
Other changes, substitutions, and alterations are also possible
without departing from the spirit and scope of this disclosure.
* * * * *