U.S. patent application number 14/135662 was filed with the patent office on 2015-06-25 for integration of ge-containing fins and compound semiconductor fins.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. The applicant listed for this patent is INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Kevin K. Chan, Cheng-Wei Cheng, Young-Hee Kim, Masaharu Kobayashi, Effendi Leobandung, Dae-Gyu Park, Devendra K. Sadana.
Application Number | 20150179739 14/135662 |
Document ID | / |
Family ID | 53267985 |
Filed Date | 2015-06-25 |
United States Patent
Application |
20150179739 |
Kind Code |
A1 |
Chan; Kevin K. ; et
al. |
June 25, 2015 |
INTEGRATION OF GE-CONTAINING FINS AND COMPOUND SEMICONDUCTOR
FINS
Abstract
A stack of a germanium-containing layer and a dielectric cap
layer is formed on an insulator layer. The stack is patterned to
form germanium-containing semiconductor fins and
germanium-containing mandrel structures with dielectric cap
structures thereupon. A dielectric masking layer is deposited and
patterned to mask the germanium-containing semiconductor fins,
while physically exposing sidewalls of the germanium-containing
mandrel structures. A ring-shaped compound semiconductor fin is
formed around each germanium-containing mandrel structure by
selective epitaxy of a compound semiconductor material. A center
portion of each germanium-containing mandrel can be removed to
physically expose inner sidewalls of the ring-shaped compound
semiconductor fin. A high-mobility compound semiconductor layer can
be formed on physically exposed surfaces of the ring-shaped
compound semiconductor fin. The dielectric masking layer and fin
cap dielectrics can removed to provide germanium-containing
semiconductor fins and compound semiconductor fins.
Inventors: |
Chan; Kevin K.; (Staten
Island, NY) ; Cheng; Cheng-Wei; (White Plains,
NY) ; Kim; Young-Hee; (Mohegan Lake, NY) ;
Kobayashi; Masaharu; (Yorktown Heights, NY) ;
Leobandung; Effendi; (Stormville, NY) ; Park;
Dae-Gyu; (Poughquaq, NY) ; Sadana; Devendra K.;
(Pleasantville, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
Armonk |
NY |
US |
|
|
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
53267985 |
Appl. No.: |
14/135662 |
Filed: |
December 20, 2013 |
Current U.S.
Class: |
257/623 ;
438/479 |
Current CPC
Class: |
H01L 29/785 20130101;
H01L 29/16 20130101; H01L 29/0692 20130101; H01L 21/845 20130101;
H01L 27/1211 20130101; H01L 21/308 20130101 |
International
Class: |
H01L 29/06 20060101
H01L029/06; H01L 29/16 20060101 H01L029/16; H01L 21/308 20060101
H01L021/308; H01L 29/78 20060101 H01L029/78 |
Claims
1. A semiconductor structure comprising: a ring-shaped compound
semiconductor fin comprising a compound semiconductor material and
located on an insulator layer; and a pair of germanium-containing
semiconductor material portions in contact with sidewalls of said
ring-shaped compound semiconductor fin.
2. The semiconductor structure of claim 1, wherein said ring-shaped
compound semiconductor fin comprises: a pair of lengthwise
semiconductor fin sections that are parallel to each other; and a
pair of widthwise semiconductor fin sections.
3. The semiconductor structure of claim 2, wherein inner sidewalls
of said pair of widthwise semiconductor fin sections and end
portions of inner sidewalls of said pair of lengthwise
semiconductor fin sections are in contact with said pair of
germanium-containing semiconductor material portions.
4. The semiconductor structure of claim 1, further comprising a
compound semiconductor material layer comprising another compound
semiconductor material and in epitaxial alignment with said
ring-shaped compound semiconductor fin and sidewall surfaces of
said pair of germanium-containing semiconductor material
portions.
5. The semiconductor structure of claim 4, wherein said compound
semiconductor material layer is not in physical contact with top
surfaces of said pair of germanium-containing semiconductor
material portions.
6. The semiconductor structure of claim 4, wherein said another
compound semiconductor material of said compound semiconductor
material layer has a greater electrical conductivity than said
compound semiconductor material of said ring-shaped compound
semiconductor fin.
7. The semiconductor structure of claim 4, wherein said ring-shaped
compound semiconductor fin is encapsulated by said compound
semiconductor material layer, said pair of germanium-containing
semiconductor material portions, and said insulator layer.
8. The semiconductor structure of claim 4, wherein said another
compound semiconductor material of said compound semiconductor
material layer is epitaxially aligned to said compound
semiconductor material and to a semiconductor material in said pair
of germanium-containing semiconductor material portions.
9. The semiconductor structure of claim 1, wherein said pair of
germanium-containing semiconductor material portions comprises a
material selected from germanium and a silicon-germanium alloy.
10. The semiconductor structure of claim 1, further comprising
semiconductor fins located on said insulator layer and having a
same composition as said pair of germanium-containing semiconductor
material portions.
11. A method of forming a semiconductor structure comprising:
forming a germanium-containing mandrel structure on an insulator
layer; forming a ring-shaped compound semiconductor fin comprising
a compound semiconductor material around said germanium-containing
mandrel structure by selective epitaxy of a compound semiconductor
material; and removing a portion of said germanium-containing
mandrel structure, wherein remaining portions of said
germanium-containing mandrel structure constitute a pair of
germanium-containing semiconductor material portions in contact
with sidewalls of said ring-shaped compound semiconductor fin.
12. The method of claim 11, further comprising forming a compound
semiconductor material layer comprising another compound
semiconductor material directly on said ring-shaped compound
semiconductor fin.
13. The method of claim 12, wherein said another compound
semiconductor material is in epitaxial alignment with said
ring-shaped compound semiconductor fin.
14. The method of claim 12, wherein said another compound
semiconductor material is deposited by a selective epitaxy
process.
15. The method of claim 12, further comprising: forming at least
one dielectric mandrel cap over said germanium-containing mandrel
structure; and etching a physically exposed portion of said at
least one dielectric mandrel cap and said portion of said
germanium-containing mandrel structure while a masking layer covers
end portions of said at least one dielectric mandrel cap.
16. The method of claim 12, wherein said another compound
semiconductor material is deposited on sidewalls of said pair of
germanium-containing semiconductor material portions.
17. The method of claim 16, wherein said another compound
semiconductor material, is in epitaxial alignment with a
germanium-containing semiconductor material in said pair of
germanium-containing semiconductor material portions.
18. The method of claim 12, wherein said another compound
semiconductor material of said compound semiconductor material
layer has a greater electrical conductivity than said compound
semiconductor material of said ring-shaped compound semiconductor
fin.
19. The method of claim 11, wherein said pair of
germanium-containing semiconductor material portions comprises a
material selected from germanium and a silicon-germanium alloy.
20. The method of claim 11, further comprising forming
semiconductor fins on said insulator layer, said semiconductor fins
having a same composition as said germanium-containing mandrel
structure.
Description
BACKGROUND
[0001] The present disclosure relates to a semiconductor structure,
and particularly to a semiconductor structure including compound
semiconductor fins, and a method of manufacturing the same.
[0002] A finFET is field effect transistor including a channel
located in a semiconductor fin having a height that is greater than
a width. FinFETs employ vertical surfaces of semiconductor fins to
effectively increase a device area without increasing the physical
layout area of the device. Fin-based devices are compatible with
fully depleted mode operation if the lateral width of the fin is
thin enough. For these reasons, fin-based devices can be employed
in advanced semiconductor chips to provide high performance
devices.
[0003] Germanium-containing semiconductor materials and compound
semiconductor materials provide distinct advantages in different
aspects of device performance. However, formation of
germanium-containing semiconductor fins and compound semiconductor
fins on a silicon substrate has been a challenge because of large
lattice mismatches of germanium and compound semiconductor
materials with respect to silicon.
SUMMARY
[0004] A stack of a germanium-containing layer and a dielectric cap
layer is formed on an insulator layer. The stack is patterned to
form germanium-containing semiconductor fins and
germanium-containing mandrel structures with dielectric cap
structures thereupon. A dielectric masking layer is deposited and
patterned to mask the germanium-containing semiconductor fins,
while physically exposing sidewalls of the germanium-containing
mandrel structures. A ring-shaped compound semiconductor fin is
formed around each germanium-containing mandrel structure by
selective epitaxy of a compound semiconductor material. A center
portion of each germanium-containing mandrel can be removed to
physically expose inner sidewalls of the ring-shaped compound
semiconductor fin. Remaining portions of the germanium-containing
mandrel structures can be employed as anchor structures that
provide adhesion to the insulator layer. A high-mobility compound
semiconductor layer can be formed on physically exposed surfaces of
the ring-shaped compound semiconductor fin. The dielectric masking
layer and fin cap dielectrics can removed to provide
germanium-containing semiconductor fins and compound semiconductor
fins.
[0005] According to an aspect of the present disclosure, a
semiconductor structure includes a ring-shaped compound
semiconductor fin containing a compound semiconductor material and
located on an insulator layer, and a pair of germanium-containing
semiconductor material portions in contact with sidewalls of the
ring-shaped compound semiconductor fin.
[0006] According to another aspect of the present disclosure, a
method of forming a semiconductor structure is provided. A
germanium-containing mandrel structure is formed on an insulator
layer. A ring-shaped compound semiconductor fin including a
compound semiconductor material around the germanium-containing
mandrel structure is formed by selective epitaxy of a compound
semiconductor material. A portion of the germanium-containing
mandrel structure is removed. Remaining portions of the
germanium-containing mandrel structure constitute a pair of
germanium-containing semiconductor material portions in contact
with sidewalls of the ring-shaped compound semiconductor fin.
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
[0007] FIG. 1A is a top-down view of an exemplary semiconductor
structure after formation of a dielectric cap layer on a
semiconductor-on-insulator (SOI) substrate including a
germanium-containing semiconductor layer according to an embodiment
of the present disclosure.
[0008] FIG. 1B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
1A.
[0009] FIG. 2A is a top-down view of the exemplary semiconductor
structure after formation of stacks of a germanium-containing
semiconductor fin and a dielectric fin cap and stacks of a
germanium-containing semiconductor portion and a dielectric
material portion according to an embodiment of the present
disclosure.
[0010] FIG. 2B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
2A.
[0011] FIG. 3A is a top-down view of the exemplary semiconductor
structure after formation of a dielectric material layer according
to an embodiment of the present disclosure.
[0012] FIG. 3B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
3A.
[0013] FIG. 4A is a top-down view of the exemplary semiconductor
structure after formation of an organic planarization layer (OPL),
an anti-reflective coating (ARC) layer, and a photoresist layer and
lithographic patterning of the photoresist layer according to an
embodiment of the present disclosure.
[0014] FIG. 4B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
4A.
[0015] FIG. 5A is a top-down view of the exemplary semiconductor
structure after formation of stacks of a germanium-containing
mandrel structure, a first dielectric mandrel cap, and a second
dielectric mandrel cap according to an embodiment of the present
disclosure.
[0016] FIG. 5B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
5A.
[0017] FIG. 6A is a top-down view of the exemplary semiconductor
structure after removal of the OPL according to an embodiment of
the present disclosure.
[0018] FIG. 6B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
6A.
[0019] FIG. 7A is a top-down view of the exemplary semiconductor
structure after formation of ring-shaped compound semiconductor
fins according to an embodiment of the present disclosure.
[0020] FIG. 7B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
7A.
[0021] FIG. 8A is a top-down view of the exemplary semiconductor
structure after removal of a center portion of each stack of the
first dielectric mandrel cap and the second dielectric mandrel cap
employing a patterned photoresist layer as an etch mask according
to an embodiment of the present disclosure.
[0022] FIG. 8B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
8A.
[0023] FIG. 9A is a top-down view of the exemplary semiconductor
structure after removal of a center portion of each
germanium-containing mandrel structure and subsequent removal of
the patterned photoresist layer according to an embodiment of the
present disclosure.
[0024] FIG. 9B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
9A.
[0025] FIG. 9C is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane C-C' of FIG.
9A.
[0026] FIG. 10A is a top-down view of the exemplary semiconductor
structure after formation of a high-mobility compound semiconductor
layer according to an embodiment of the present disclosure.
[0027] FIG. 10B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
10A.
[0028] FIG. 11A is a top-down view of the exemplary semiconductor
structure after removal of the dielectric material layer, the
dielectric fin caps, and remaining portions of the first and second
dielectric mandrel caps according to an embodiment of the present
disclosure.
[0029] FIG. 11B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
11A.
[0030] FIG. 11C is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane C-C' of FIG.
11A.
[0031] FIG. 12A is a top-down view of the exemplary semiconductor
structure after formation of gate structures and gate spacers
according to an embodiment of the present disclosure.
[0032] FIG. 12B is a vertical cross-sectional view of the exemplary
semiconductor structure along the vertical plane B-B' of FIG.
12A.
DETAILED DESCRIPTION
[0033] As stated above, the present disclosure relates to a
semiconductor structure including compound semiconductor fins, and
a method of manufacturing the same. Aspects of the present
disclosure are now described in detail with accompanying figures.
It is noted that like reference numerals refer to like elements
across different embodiments. The drawings are not necessarily
drawn to scale. As used herein, ordinals such as "first" and
"second" are employed merely to distinguish similar elements, and
different ordinals may be employed to designate a same element in
the specification and/or claims.
[0034] Referring to FIGS. 1A and 1B, an exemplary semiconductor
structure according to an embodiment of the present disclosure
includes a semiconductor-on-insulator (SOI) substrate 8. The SOI
substrate 8 can include a vertical stack, from bottom to top, of a
handle substrate 10, an insulator 20, and a germanium-containing
semiconductor layer 30L. As used herein, a "germanium-containing
semiconductor" refers to a semiconductor material that includes
germanium or a semiconductor alloy of germanium. As used herein, a
semiconductor or a semiconductor material refers to a material that
can have a resistivity in a range from 1.times.10.sup.-3 Ohm-cm to
3.times.10.sup.3 Ohm-cm upon suitable doping with a p-type dopant
or an n-type dopant. Semiconductor materials include elemental
semiconductor materials such as silicon and germanium, a
semiconductor alloy including silicon and/or germanium, III-V
compound semiconductor materials as known in the art, II-VI
compound semiconductor materials as known in the art, and organic
semiconductor materials as known in the art.
[0035] The handle substrate 10 can include a semiconductor
material, a conductive material, and/or a dielectric material. The
handle substrate 10 provides mechanical support to the buried
insulator layer 20 and the germanium-containing semiconductor layer
30L. The thickness of the handle substrate 10 can be from 30
microns to 2 mm, although lesser and greater thicknesses can also
be employed.
[0036] The insulator layer 20 includes an insulator material. As
used herein, an insulator material refers to a material having a
resistivity greater than 3.times.10.sup.3 Ohm-cm. The insulator
layer 20 can include a dielectric material such as silicon oxide,
silicon nitride, silicon oxynitride, sapphire, or a combination
thereof, or can include an intrinsic semiconductor material such as
intrinsic InP or intrinsic Si. The thickness of the buried
insulator layer 20 can be from 50 nm to 5 microns, although lesser
and greater thicknesses can also be employed. In one embodiment,
the insulator layer 20 and the handle substrate 10 can be a single
contiguous structure including a same insulator material, i.e., the
handle substrate 10 and the insulator layer 20 can be merged into a
single insulating layer including a same insulating material.
[0037] The germanium-containing semiconductor material within the
germanium-containing semiconductor layer 30L can be germanium, a
silicon-germanium alloy, a germanium-carbon alloy, a
silicon-germanium-carbon alloy, or a layered stack thereof. The
germanium-containing semiconductor material in the
germanium-containing semiconductor layer 30L can be intrinsic,
p-doped, or n-doped. In one embodiment, the germanium-containing
semiconductor material in the germanium-containing semiconductor
layer 30L can be single crystalline. In one embodiment, the
germanium-containing semiconductor material in the
germanium-containing semiconductor layer 30L can be intrinsic
germanium, p-doped germanium, n-doped germanium, an intrinsic
silicon-germanium alloy, a p-doped silicon-germanium alloy, or an
n-doped silicon-germanium alloy. The atomic concentration of
germanium in the germanium-containing semiconductor layer 30L can
be in a range from 10% to 100%, although lesser germanium
concentrations can also be employed. The thickness of the
germanium-containing semiconductor layer 30L can be in a range from
5 nm to 200 nm, although lesser and greater thicknesses can also be
employed.
[0038] A dielectric cap layer 40L can be formed directly on the top
surface of the germanium-containing semiconductor layer 30L. The
dielectric cap layer 40L includes an amorphous dielectric material
such as silicon oxide, silicon nitride, a silicon oxynitride, a
dielectric metal oxide, a dielectric metal oxynitride, or a
vertical stack thereof. The dielectric cap layer 40L can be formed,
for example, by chemical vapor deposition (CVD) or atomic layer
deposition (ALD). In one embodiment, the dielectric cap layer 40L
can be a silicon nitride layer. The thickness of the dielectric cap
layer 40L can be, for example, in a range from 1 nm to 30 nm,
although lesser and greater thicknesses can also be employed.
[0039] Referring to FIGS. 2A and 2B, stacks of a
germanium-containing semiconductor fin 30 and a dielectric fin cap
40 and a stack of a germanium-containing semiconductor portion 32P
and a dielectric material portion 40P are formed by patterning the
vertical stack of the germanium-containing semiconductor layer 30L
(See FIG. 1B) and the dielectric cap layer 40L (See FIG. 1B). As
used herein, a "semiconductor fin" refers to a contiguous structure
including a semiconductor material and including at least one pair
of substantially vertical sidewalls that are parallel to each
other. As used herein, a surface is "substantially vertical" if
there exists a vertical plane from which the surface does not
deviate by more than three times the root mean square roughness of
the surface. As used herein, a "dielectric fin" refers to a
contiguous structure including a dielectric material and including
at least one pair of substantially vertical sidewalls that are
parallel to each other. As used herein, a dielectric fin cap refers
to a dielectric fin that functions as a cap structure, i.e.,
located on top of another structure.
[0040] Patterning the vertical stack of the germanium-containing
semiconductor layer 30L and the dielectric cap layer 40L can be
performed, for example, by applying a photoresist layer 37 over the
top surface of the dielectric cap layer 40L, lithographically
patterning the photoresist layer 37, and transferring the pattern
in the photoresist layer 37 into the dielectric cap layer 40L and
the germanium-containing semiconductor layer 30L by an anisotropic
etch such as a reactive ion etch. The remaining portions of the
germanium-containing semiconductor layer 30L in a first device
region R1 constitute the germanium-containing semiconductor fins
30. The remaining portions of the germanium-containing
semiconductor layer 30L in a second device region R2 constitutes
the germanium-containing semiconductor portion 32P. The remaining
portions of the dielectric cap layer 40L in the first device region
R1 constitute the dielectric fin caps 40. The remaining portion of
the dielectric cap layer 40L in the second device region R2
constitutes the dielectric material portion 40P. The photoresist
layer 37 can be subsequently removed, for example, by ashing.
[0041] In one embodiment, each germanium-containing semiconductor
fin 30 can laterally extend along a lengthwise direction. As used
herein, a lengthwise direction of a structure refers to the
direction along which the moment of inertia of the structure
becomes a minimum.
[0042] Referring to FIGS. 3A and 3B, a dielectric material layer
50L is formed on physically exposed surfaces of the insulator layer
20, the germanium-containing semiconductor fins 30, the dielectric
fin caps 40, the germanium-containing semiconductor portion 32P,
and the dielectric material portion 40P. The dielectric material
layer 50L includes a dielectric material such as silicon nitride,
silicon oxide, silicon oxynitride, a dielectric metal oxide, a
dielectric metal oxynitride, or a combination thereof. The
dielectric material layer 50L can be deposited conformally or
non-conformally, provided that all sidewall surfaces of, the
germanium-containing semiconductor fins 30, the dielectric fin caps
40, the germanium-containing semiconductor portion 32P, and the
dielectric material portion 40P are covered by the dielectric
material layer 50L. The dielectric material layer 50L can be
deposited, for example, by chemical vapor deposition (CVD) or
atomic layer deposition (ALD). The thickness of the horizontal
portions of the dielectric material layer 50L can be in a range
from 1 nm to 30 nm, although lesser and greater thicknesses can
also be employed. In one embodiment, the dielectric material layer
50L can be a silicon nitride layer.
[0043] Referring to FIGS. 4A and 4B, an optional organic
planarization layer (OPL) 55L, an optional anti-reflective coating
(ARC) layer 56, and a photoresist layer 57 can be applied over the
dielectric material layer 50L. In one embodiment, the optional OPL
55L and the optional ARC layer 56 may be omitted, and the
photoresist layer 57 can be applied directly on the top surface of
the dielectric material layer 50L. The OPL 55L can include any
organic planarization material for a trilayer lithography process
as known in the art. The ARC layer 56 can include any
antireflective coating material for a trilayer lithography process
as known in the art. The photoresist layer 57 is lithographically
patterned to cover an entirety of the first device region R1 and to
cover a subset of the area of the second device region R2. In one
embodiment, the shapes of patterned portions of the photoresist
layer 57 in the second device region can be rectangles having a
width that is approximately the same as the target spacing between
a pair of compound semiconductor fins to be subsequently
formed.
[0044] Referring to FIGS. 5A and 5B, the pattern in the photoresist
layer 57 is transferred through the optional ARC layer 56 (See FIG.
4B) and the optional OPL 55L (See FIG. 4B), if present, and through
the dielectric material layer 50L (See FIG. 4B), the dielectric
material portion 40P, and the germanium-containing semiconductor
portion 32P by a series of anisotropic etch processes.
Specifically, the series of anisotropic etch processes can
sequentially etch portions, which are not initially masked by the
patterned photoresist layer 57, of the optional ARC layer 56 (if
present), the optional OPL 55L (if present), the dielectric
material layer 50L, the dielectric material portion 40P, and the
germanium-containing semiconductor portion 32P. In one embodiment,
the photoresist layer 57 and the ARC layer 56 may be consumed
during the series of anisotropic etch processes and only portions
of the OPL 55L may remain at the end of the series of anisotropic
etch processes. In another embodiment, portions of the photoresist
layer 57 and/or portions of the ARC layer 56 may remain after the
series of anisotropic etch processes.
[0045] Remaining portions of the dielectric material layer 50L, the
dielectric material portion 40P, and the germanium-containing
semiconductor portion 32P in the second device region R2 constitute
stacks of a germanium-containing mandrel structure 32, a first
dielectric fin cap 42, and a second dielectric fin 52. Each second
dielectric fin 52 is a remaining portion of the dielectric material
layer 50L. Each first dielectric fin 42 is a remaining portion of
the dielectric material portion 40P. Each germanium-containing
mandrel structure 32 is a remaining portion of the
germanium-containing semiconductor portion 32P.
[0046] In one embodiment, the anisotropic etch processes that etch
the material of the dielectric material portion 40P and the
material of the germanium-containing semiconductor portion 32P can
be selective to the material of the insulator layer 20. In this
case, the top surface of the insulator layer 20 can be planar after
formation of the stacks of the germanium-containing mandrel
structures 32 and the at least one dielectric mandrel caps (42,
52).
[0047] Referring to FIGS. 6A and 6B, any remaining portions of the
photoresist layer 57, the ARC layer 56, and the OPL 55L can be
subsequently removed, for example, by ashing. Each
germanium-containing mandrel structure 32 is formed on the
insulator layer 20. At least one dielectric mandrel cap (42, 52) is
formed over the germanium-containing mandrel structure 32. Within
each stack of a germanium-containing mandrel structure 32, a first
dielectric mandrel cap 42, and a second dielectric mandrel cap 52,
sidewall surfaces of the germanium-containing mandrel structure 32,
the first dielectric mandrel cap 42, and the second dielectric
mandrel cap 52 can be vertically coincident. As used herein, two or
more surfaces are vertically coincident if there exists a vertical
plane that includes the two or more surfaces.
[0048] Referring to FIGS. 7A and 7B, ring-shaped compound
semiconductor fins 60 are formed by selective epitaxy of a first
compound semiconductor material directly on the sidewall surfaces
of the germanium-containing mandrel structures 32. As used herein,
a "ring-shaped" element refers to an element that is topologically
homeomorphic to a torus, i.e., may be contiguously stretched into a
shape of a torus without forming, or destroying a singularity. As
used herein, a "compound semiconductor fin" refers to a
semiconductor fin including a compound semiconductor material.
Thus, a ring-shaped compound semiconductor fin 60 is a ring-shaped
structure that includes a compound semiconductor material and
including at least one pair of substantially vertical sidewalls
that are parallel to each other.
[0049] The first compound semiconductor material in the ring-shaped
compound semiconductor fins 60 can be, for example, a III-V
compound semiconductor material or a II-V compound semiconductor
material. In one embodiment, each germanium-containing mandrel
structure 32 can include a single crystalline germanium-containing
semiconductor material, and the first compound semiconductor
material of each ring-shaped compound semiconductor fin 60 can be a
single crystalline compound semiconductor material in epitaxial
alignment with the single crystalline germanium-containing
semiconductor material.
[0050] Each ring-shaped compound semiconductor fin 60 includes a
pair of lengthwise semiconductor fin sections (60L1, 60L2) that are
parallel to each other and extending along the lengthwise direction
of a germanium-containing mandrel structure 32, and a pair of
widthwise semiconductor fin sections (60W1, 60W2) that are parallel
to each other and extending along a horizontal direction that is
perpendicular to the direction of the germanium-containing mandrel
structure 32. Each pair of lengthwise semiconductor fin sections
(60L1, 60L2) include a first lengthwise semiconductor fin section
60L1 contacting a lengthwise sidewall of the germanium-containing
mandrel structure 32, and a second lengthwise semiconductor fin
section 60L2 contacting another lengthwise sidewall of the
germanium-containing mandrel structure 32. Each pair of widthwise
semiconductor fin sections (60W 1, 60W2) include a first widthwise
semiconductor fin section 60W1 contacting a widthwise sidewall of
the germanium-containing mandrel structure 32, and a second
widthwise semiconductor fin section 60W2 contacting another
widthwise sidewall of the germanium-containing mandrel structure
32. Each ring-shaped compound semiconductor fin 60 is in physical
contact with the insulator layer 20.
[0051] Methods of performing a selective epitaxy process are known
in the art. For example, U.S. Pat. No. 4,902,643 to Shimawaki and
U.S. Pat. No. 4,826,784 to Salerno et al. disclose selective
epitaxy processes for depositing a compound semiconductor material.
In general, compound semiconductor materials can be grown on single
crystalline semiconductor surfaces provided that the crystal
structures match and the lattice mismatch is less than a level that
disrupts epitaxial alignment among atoms.
[0052] In one embodiment, the first compound semiconductor material
of the ring-shaped compound semiconductor fins 60 can be a III-V
compound semiconductor material. The first compound semiconductor
material may, or may not, be doped with p-type dopants and/or
n-type dopants. In one embodiment, the first compound semiconductor
material can be a single crystalline III-V compound semiconductor
material that contacts, and is in epitaxial alignment with, the
single crystalline material of a germanium-containing mandrel
structure 32. In one embodiment, the first compound semiconductor
material can be single crystalline GaAs or single crystalline
InGaAs.
[0053] The ring-shaped compound semiconductor fins 60 can be formed
as an intrinsic semiconductor material, or can be formed with
in-situ doping with p-type dopants or n-type dopants. If the
ring-shaped compound semiconductor fins 60 is doped, the dopant
concentration within the ring-shaped compound semiconductor fins 60
can be in a range from 1.0.times.10.sup.14/cm.sup.3 to
3.0.times.10.sup.18/cm.sup.3, although lesser and greater dopant
concentrations can also be employed. The lateral thickness 1t of
each portion of the ring-shaped compound semiconductor fins 60 can
be in a range from 3 nm to 30 nm, although lesser and greater
lateral thicknesses can also be employed.
[0054] In one embodiment, the outer sidewalls of the
germanium-containing mandrel structure 32 can be vertical surfaces
that are crystallographic facets of the germanium-containing
mandrel structure 32. In this case, the inner and outer sidewalls
of the ring-shaped compound semiconductor fins 60 can be vertical
crystallographic facets of the first compound semiconductor
material of the ring-shaped compound semiconductor fins 60.
[0055] Referring to FIGS. 8A and 8B, a photoresist layer 67 is
applied over the exemplary semiconductor structure, and is
lithographically patterned to cover the first device region R1 and
end portions of each assembly (32, 42, 52, 60; See FIGS. 7A and 7B)
of a germanium-containing mandrel structure 32, at least one
dielectric mandrel caps (42, 52), and a ring-shaped compound
semiconductor fin 60. Within each assembly (32, 42, 52, 60), all of
the widthwise semiconductor fin sections (60W1, 60W2), end portions
of the lengthwise semiconductor fin sections (60L1, 60L2), and end
portions of the at least one dielectric mandrel caps (42, 52) that
are proximal to the widthwise semiconductor fin sections (60W 1,
60W2) are covered by the patterned photoresist layer 67, while
middle portions of the at least one dielectric mandrel caps (42,
52) and the at least one dielectric mandrel caps (42, 52) are not
covered by the patterned photoresist layer 67.
[0056] The physically exposed portions of the at least one
dielectric mandrel cap (42, 52) and the germanium-containing
mandrel structures 32 are removed while the patterned photoresist
layer 67 covers end portions of the at least one dielectric mandrel
cap (42, 52). For example, an etch is performed employing the
patterned photoresist layer 67 as an etch mask to remove physically
exposed portions of the at least one dielectric mandrel cap (42,
52) selective to the first compound semiconductor material of the
ring-shaped compound semiconductor fins 60. In one embodiment, the
etch can be an anisotropic etch such as a reactive ion etch. In one
embodiment, the etch may, or may not, be selective to the material
of the insulator layer 20. In one embodiment, the etch is selective
to the first compound semiconductor material of the ring-shaped
compound semiconductor fins 60 and the material of the insulator
layer 20. In one embodiment, the etch can employ a plasma of a gas
selected from CCl.sub.2F.sub.2, CHF.sub.3, SiF.sub.4, and
SF.sub.6.
[0057] Subsequently, physically exposed portions of the
germanium-containing mandrel structures 32 are etched by an etch
that is selective to the first compound semiconductor material of
the ring-shaped compound semiconductor fins 60 and the material of
the insulator layer 20. The etch can be an isotropic etch or an
anisotropic etch. An exemplary etch chemistry that can be employed
to etch the germanium-containing material of the
germanium-containing mandrel structures 32 is a combination of HF
and an oxidant such as H.sub.2O.sub.2 or O.sub.2.
[0058] Referring to FIGS. 9A-9C, the patterned photoresist layer 67
can be removed, for example, by ashing. Within an area enclosed by
a ring-shaped compound semiconductor fin 60, remaining portions of
the germanium-containing mandrel structures 32 constitute a pair of
germanium-containing semiconductor material portions 33 in contact
with sidewalls of the ring-shaped compound semiconductor fin 60.
Remaining portions of the at least one dielectric mandrel cap (42,
52) constitute at least one dielectric cap portions (42P, 52P). The
dielectric cap portions (42P, 52P) can include first dielectric cap
portions 42P and second dielectric cap portions 52P. In one
embodiment, a pair of stacks including, from bottom to top, a
germanium-containing semiconductor material portion 33, a first
dielectric cap portion 42, and a second dielectric cap portion 52
can be formed within each area enclosed by a ring-shaped compound
semiconductor fin 60. Inner sidewalls of a pair of widthwise
semiconductor fin sections (60W 1. 60W2) and end portions of inner
sidewalls of a pair of lengthwise semiconductor fin sections (60L1,
60L2) can be in contact with a pair of germanium-containing
semiconductor material portions 33.
[0059] Referring to FIGS. 10A and 10B, a compound semiconductor
material layer 70 including a second compound semiconductor
material can be deposited on the surfaces each ring-shaped compound
semiconductor fins 60 by another selective epitaxy process. The
compound semiconductor material layer 70 can be a high-mobility
compound semiconductor layer providing a higher mobility than the
first compound semiconductor material within the ring-shaped
compound semiconductor fins 60. In other words, the second compound
semiconductor material of the compound semiconductor material
layers 70 can have a greater electrical conductivity than the first
compound semiconductor material of the ring-shaped compound
semiconductor fins 60. The thickness of the compound semiconductor
material layer, as measured on a sidewall of a ring-shaped compound
semiconductor fins 60, a top surface of a ring-shaped compound
semiconductor fins 60, or a sidewall surface of a
germanium-containing semiconductor material portion 33, can be in a
range from 0.5 nm to 10 nm, although lesser and greater thicknesses
can also be employed.
[0060] In one embodiment, the first compound semiconductor material
can be GaAs and the second compound semiconductor material can be
InGaAs. In another embodiment, the first and second compound
semiconductor materials can be InGaAs having different atomic
ratios between In and Ga such that the second compound
semiconductor material has a greater conductivity than the first
compound semiconductor material.
[0061] In one embodiment, the second compound semiconductor
material of each compound semiconductor material layer 70 can be in
epitaxial alignment with a ring-shaped compound semiconductor fin
60 in contact with the compound semiconductor material layer 70.
Further, the second compound semiconductor material can be
deposited on sidewalls of a pair of germanium-containing
semiconductor material portions 33 (See FIG. 9C) in contact with
the ring-shaped compound semiconductor fin 60, and can be in
epitaxial alignment with the germanium-containing semiconductor
material in the pair of germanium-containing semiconductor material
portions 33. Thus, the second compound semiconductor material of
the compound semiconductor material layers 70 can be epitaxially
aligned to the first compound semiconductor material and to the
semiconductor material in the germanium-containing semiconductor
material portions 33.
[0062] The compound semiconductor material layers 70 are not in
physical contact with top surfaces of the germanium-containing
semiconductor material portions 33. Each ring-shaped compound
semiconductor fin 60 is encapsulated by a compound semiconductor
material layer 70, a pair of germanium-containing semiconductor
material portions 33, and the insulator layer 20. As used herein,
an element is encapsulated by a set of elements if each and every
surface of the element is in physical contact with a surface of one
of the set of elements.
[0063] The germanium-containing semiconductor fins 30 are located
on the insulator layer 20, and have a same composition as the
germanium-containing semiconductor material portions 33. As
discussed above, the germanium-containing semiconductor material
portions 33 and the germanium-containing semiconductor fins 30 may
include a material selected from germanium and a silicon-germanium
alloy.
[0064] Referring to FIGS. 11A-11C, the dielectric material layer
50L (See FIGS. 10A and 10B), the dielectric material portions 40P
(See FIGS. 10A and 10B), and the dielectric cap portions (42P, 52P;
See FIGS. 9A and 9C), which are remaining portions of the first and
second dielectric mandrel caps (42, 52: See FIGS. 7A and 7B), are
removed selective to the germanium-containing semiconductor
material of the germanium-containing semiconductor fins 30 and the
germanium-containing semiconductor material portions 33 and the
second compound semiconductor material of the compound
semiconductor material layers 70. The removal of the dielectric
material layer 50L, the dielectric material portions 40P, and the
dielectric cap portions (42P, 52P) can be performed by an isotropic
etch such as a wet etch. For example, if the dielectric material
layer 50L, the dielectric material portions 40P, and the dielectric
cap portions (42P, 52P) include silicon nitride, hot phosphoric
etch can be employed to remove the dielectric materials of the
dielectric material layer 50L, the dielectric material portions
40P, and the dielectric cap portions (42P, 52P) selective to the
semiconductor materials of the germanium-containing semiconductor
fins 30, the germanium-containing semiconductor material portions
33, and the compound semiconductor material layers 70.
[0065] Referring to FIGS. 12A and 12B, gate structures (80A, 80B,
82A, 82B) can be formed across the germanium-containing
semiconductor fins 30 and each combination of a ring-shaped
compound semiconductor fin 60 and a compound semiconductor layer
70. The gate structures (80A, 80B, 82A, 82B) can include a first
gate structure (80A, 82A) that includes a first gate dielectric 80A
and a first gate electrode 82A, and a second gate structure (80B,
82B) that includes a second gate dielectric 80B and a second gate
electrode 82B. The first gate structure (80A, 82A) can straddle one
or more of the germanium-containing semiconductor fins 30. The
second gate structure (80B, 82B) can straddle one or more of the
combination of a ring-shaped compound semiconductor fin 60 and a
compound semiconductor layer 70. Optionally, a first gate spacer
86A can be formed around the first gate structure (80A, 82A), and a
second gate spacer 86B can be formed around the second gate
structure (80B, 82B). Various portions of each germanium-containing
semiconductor fins 30 and each combination of a ring-shaped
compound semiconductor fin 60 and a compound semiconductor layer 70
can be doped to form source regions and drain regions to form
various fin field effect transistors.
[0066] The germanium-containing semiconductor material portions 33
can provide greater adhesion strength to the insulator layer 20
than the ring-shaped compound semiconductor fins 60 or the compound
semiconductor layers 70. Thus, the germanium-containing
semiconductor material portions 33 function as anchor structures
that prevent delamination of the ring-shaped compound semiconductor
fins 60 or the compound semiconductor layers 70 from the insulator
layer during, and after, the processing steps of the present
disclosure.
[0067] The methods of the present disclosure provide a combination
of first-type fin field effect transistors containing at least one
channel region that includes a germanium-containing material, and a
second-type fin field effect transistor containing at least one
channel region that includes a compound semiconductor material.
Thus, two types of fin field effect transistors including a
germanium-containing material and a compound semiconductor
material, respectively, can be formed on the same substrate.
[0068] While the disclosure has been described in terms of specific
embodiments, it is evident in view of the foregoing description
that numerous alternatives, modifications and variations will be
apparent to those skilled in the art. Each of the embodiments
described herein can be implemented individually or in combination
with any other embodiment unless expressly stated otherwise or
clearly incompatible. Accordingly, the disclosure is intended to
encompass all such alternatives, modifications and variations which
fall within the scope and spirit of the disclosure and the
following claims.
* * * * *