U.S. patent application number 14/286965 was filed with the patent office on 2015-06-18 for electronic packaged device and manufacturing method thereof.
This patent application is currently assigned to UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.. The applicant listed for this patent is UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.. Invention is credited to JEN-CHUN CHEN, PAI-SHENG SHIH.
Application Number | 20150173258 14/286965 |
Document ID | / |
Family ID | 53370263 |
Filed Date | 2015-06-18 |
United States Patent
Application |
20150173258 |
Kind Code |
A1 |
CHEN; JEN-CHUN ; et
al. |
June 18, 2015 |
ELECTRONIC PACKAGED DEVICE AND MANUFACTURING METHOD THEREOF
Abstract
A manufacturing method of electronic packaged device includes
the following. A plurality of electronic components is disposed on
a substrate carrier. An encapsulating member is disposed on the
substrate carrier and covers the electronic components. The
substrate carrier is separated from the encapsulating member. A
plurality of first trenches is arranged on a first surface of the
encapsulating member. Conductive material is disposed onto the
first surface and into the first trenches to form a conductive
layer. The conductive layer is patterned on the first surface to
form a circuit layer. The circuit layer includes at least one
grounding pad. A plurality of second trenches is arranged on a
second surface of the encapsulating member. At least one shielding
structure is formed in the first trenches and the second trenches.
An electromagnetic shielding layer is connected to the grounding
pad.
Inventors: |
CHEN; JEN-CHUN; (NANTOU
COUNTY, TW) ; SHIH; PAI-SHENG; (NANTOU COUNTY,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD. |
SHANGHAI |
|
CN |
|
|
Assignee: |
UNIVERSAL SCIENTIFIC INDUSTRIAL (
SHANGHAI ) CO., LTD.
SHANGHAI
CN
|
Family ID: |
53370263 |
Appl. No.: |
14/286965 |
Filed: |
May 23, 2014 |
Current U.S.
Class: |
361/753 ;
29/846 |
Current CPC
Class: |
H05K 9/0037 20130101;
H01L 2224/04105 20130101; H05K 1/181 20130101; H05K 9/0039
20130101; H01L 24/96 20130101; H01L 24/19 20130101; H05K 2201/09036
20130101; H05K 9/0022 20130101; Y10T 29/49155 20150115; H01L
2924/3025 20130101; H01L 2924/1815 20130101; H05K 9/0064 20130101;
H01L 21/568 20130101; H05K 2201/10371 20130101; H01L 24/97
20130101; H05K 13/046 20130101 |
International
Class: |
H05K 13/04 20060101
H05K013/04; H05K 9/00 20060101 H05K009/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 13, 2013 |
TW |
102146149 |
Claims
1. An electronic package device manufacturing method, comprising:
configuring a plurality of electronic components on a surface of a
substrate carrier; forming an encapsulating member on the surface
of the substrate carrier to cover the electronic components;
separating the substrate carrier from the encapsulating member;
forming a plurality of first trenches and a plurality of first
grounding trenches on a first surface of the encapsulating member;
disposing conductive material on the first surface of the
encapsulating member, in the first trenches, and in the first
grounding trenches to form a conductive layer and a plurality of
grounding structures; patterning the conductive layer on the first
surface to form a circuit layer, wherein the circuit layer includes
at least one grounding pad electrically connected to the grounding
structures; forming a plurality of second trenches on a second
surface of the encapsulating member corresponding to the first
trenches, the second surface being opposite the first surface of
the encapsulating member; forming conductive material in the second
trenches, and electrically connecting the conductive material in
the second trenches and the conductive material in the first
trenches to cooperatively form at least one shielding structure in
the first and the second trenches; separating the encapsulating
member into a plurality of packaged units by cutting through the
grounding structures of the encapsulating member; and forming an
electromagnetic shielding layer on external surfaces of the
packaged units with conductive material; wherein the
electromagnetic shielding layer is electrically connected to the
grounding pads.
2. The method as recited in claim 1, wherein the formation of the
second trenches comprising: removing portions of the encapsulating
member from the second surface so as to interconnect the first and
the second trenches and define at least two encapsulating
compartments.
3. The method as recited in claim 1, further comprising: forming a
plurality of through holes by removing portions of the
encapsulating member in the first trenches after the step of
forming the first trenches and the first grounding trenches.
4. The method as recited in claim 3, wherein the step of disposing
conductive material on the first surface of the encapsulating
member and in the first trenches further comprising: providing
suction through the through holes from the second surface of the
encapsulating member.
5. The method as recited in claim 4, wherein the step of forming
the second trenches comprising: removing portions of the
encapsulating member from the second surface proximate to the
through holes to remove the through holes and interconnect the
first and the second trenches.
6. The method as recited in claim 1 further comprising: forming a
protective layer to cover the encapsulating member before the step
of forming the first trenches and the first grounding trenches.
7. The method as recited in claim 6 further comprising: removing
the protective layer after the step of forming the first trenches
and the first grounding trenches.
8. The method as recited in claim 1 further comprising: forming a
protective layer to cover the circuit layer before the step of
forming the second trenches corresponding to the first trenches on
the second surface of the encapsulating member.
9. The method as recited in claim 8 further comprising: removing
the protective layer after the step of forming an electromagnetic
shielding layer on external surfaces of the packaged units with
conductive material.
10. The method as recited in claim 1, wherein the first trenches
and the second trenches have different depths.
11. An electronic package device manufacturing method, comprising:
configuring a plurality of electronic components on a surface of a
substrate carrier; forming an encapsulating member on the surface
of the substrate carrier to cover the electronic components;
separating the substrate carrier from the encapsulating member;
forming a plurality of first trenches and a plurality of first
grounding trenches on a first surface of the encapsulating member;
disposing conductive material on the first surface of the
encapsulating member, in the first trenches and in the first
grounding trenches to form a conductive layer; patterning the
conductive layer on the first surface to form a circuit layer,
wherein the circuit layer includes at least one grounding pad;
forming a plurality of second trenches on a second surface of the
encapsulating member corresponding to the first trenches, and
forming a plurality of second grounding trenches on a second
surface of the encapsulating member corresponding to the first
grounding trenches; forming conductive material in the second
trenches, electrically connecting the conductive material in the
second trenches and the conductive material in the first trenches
to cooperatively form at least one shielding structure in the first
and the second trenches, forming conductive material in the second
grounding trenches, and electrically connecting the conductive
material in the second grounding trenches and the conductive
material in the first grounding trenches to cooperatively form a
plurality of grounding structures in the first and the second
grounding trenches; and separating the encapsulating member into a
plurality of packaged units by cutting through the grounding
structures of the encapsulating member; wherein the packaged units
have an electromagnetic shielding layer covering the encapsulating
member and electrically connected to the grounding pads.
12. The method as recited in claim 11, wherein the step of forming
the second trenches and the second grounding trenches comprising:
removing portions of the encapsulating member from the second
surface thereof to interconnect the first and the second trenches,
and removing portions of the encapsulating member from the second
surface thereof to interconnect the first and the second grounding
trenches.
13. The method as recited in claim 11 further comprising: forming a
protective layer to cover the encapsulating member before the step
of forming the first trenches and the first grounding trenches.
14. The method as recited in claim 13 further comprising: removing
the protective layer after the step of forming the first trenches
and the first grounding trenches.
15. The method as recited in claim 11, wherein the first trenches
and the second trenches have different depths.
16. An electronic packaged device, comprising: a circuit layer
including at least one grounding pad; a plurality of electronic
components electrically connected to the circuit layer; an
encapsulating member covering at least one electronic component,
the encapsulating member having portions defining a trench to
separate the encapsulating member into at least two encapsulating
compartments; at least one grounding structure electrically
connected to the grounding pad; a shielding structure arranged
between the encapsulating compartments; and an electromagnetic
shielding layer disposed on the external surfaces of encapsulating
member and electrically connect to the grounding pad.
17. The method as recited in claim 16, wherein the trench is
defined as a first trench and a second trench, the first trench is
formed on a bottom surface of the encapsulating member, the second
trench is formed on a top surface of the encapsulating member, and
the first trench and the second trench inwardly extend into the
encapsulating member.
18. The method as recited in claim 17, wherein the shielding
structure includes a first portion and a second portion, the first
portion is defined as conductive material filled in the first
trench, and the second portion is defined as conductive material
covering outer surface of the second trench, the first portion is
electrically connected to the second portion, and the second
portion is electrically connected to the electromagnetic shielding
layer.
19. The method as recited in claim 16, wherein the shielding
structure is defined as conductive material filled in the trench,
and the shielding structure is electrically connected to the
electromagnetic shielding layer.
20. The method as recited in claim 16, wherein at least one
encapsulating compartment accommodates at least one electronic
component.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The instant disclosure relates to an electronic packaged
device and the manufacturing method thereof.
[0003] 2. Description of Related Art
[0004] Most electronic packaging devices use a variety of packaging
materials to package electronic components. Since electronic
products have more and more functions, thus the electronic
components in the electronic packaging devices corresponding
increases as well. Accordingly, electromagnetic interferences
between different electronic components occur more often than
ever.
[0005] Typically, in order to reduce various electromagnetic
interference and radio frequency interferences generated by
electronic components, an electromagnetic interference (EMI) layer
is designed in the electronic packaging to isolate different
electronic components. Alternatively, an external metal cover
(Metal lid) is installed on the electronic packaging.
[0006] However, in the climate of miniaturization, the overall
packaging density of electronic packaging dramatically increases.
As a result, designing electromagnetic shielding layer in
electronic packaging is becoming relatively more difficult.
Alternatively, a metal cover installed on the electronic packaging
increases the overall package volume.
[0007] To address the above issues, the inventor strives via
associated experience and research to present the instant
disclosure, which can effectively improve the limitation described
above.
SUMMARY OF THE INVENTION
[0008] An embodiment of the instant disclosure provide an
electronic packaging device which includes a shielding structure
for prevent electromagnetic interferences between electronic
components.
[0009] The electronic packaged device includes a circuit layer, a
plurality of electronic components, an encapsulating member, a
shielding structure, at least one grounding structure, and an
electromagnetic shielding layer. The circuit layer includes at
least one grounding pad. The electronic components and the circuit
layer are electrically connected. The encapsulating member covers
at least one electronic component. A trench is formed on the
encapsulating member to partition into at least two encapsulating
compartments. The shielding structure is interposed between
different encapsulating compartments, and the shielding structure
is electrically connected to the grounding pad. The electromagnetic
shielding layer is formed on the external surface of encapsulating
member and electrically connected to the grounding pad.
[0010] An embodiment of the instant disclosure provides an
electronic package device manufacturing method including disposing
a plurality of electronic components on a surface of a substrate
carrier. Disposing an encapsulating member on the surface of the
substrate carrier to cover the electronic components. Separating
the substrate carrier from the encapsulating member. Forming a
plurality of first trenches and a plurality of first grounding
trenches on a first surface of the encapsulating member. Disposing
conductive material on the first surface of the encapsulating
member, in the first trenches and in the first grounding trenches
to form a conductive layer and a plurality of grounding structures.
Patterning the conductive layer on the first surface of the
encapsulating member to form a circuit layer. The circuit layer
including at least one grounding pad, which electrically connected
to the grounding structures. Forming a plurality of second trenches
on a second surface of the encapsulating member corresponding to
the first trenches, the second surface being opposite the first
surface of the encapsulating member. Forming conductive material in
the second trenches, and electrically connecting to the conductive
material in the first trenches to cooperatively form at least one
shielding structure in the first and the second trenches.
Separating the encapsulating member into a plurality of packaged
units by cutting through the grounding structures from the second
surface of the encapsulating member. Forming an electromagnetic
shielding layer on external surfaces of the packaged units with
conductive material. The electromagnetic shielding layer is
electrically connected to the grounding pads.
[0011] Another embodiment of the instant disclosure provides a
manufacturing method of electronic package device, including
configuring a plurality of electronic components on a surface of a
substrate carrier. Disposing an encapsulating member on the surface
of the substrate carrier to cover the electronic components.
Separating the substrate carrier from the encapsulating member.
Forming a plurality of first trenches and a plurality of first
grounding trenches on a first surface of the encapsulating member.
Disposing conductive material on the first surface of the
encapsulating member, in the first trenches and in the first
grounding trenches to form a conductive layer. Patterning the
conductive layer on the first surface of the encapsulating member
to form a circuit layer. The circuit layer including at least one
grounding pad, which electrically connected to the grounding
structures. Forming a plurality of second trenches on a second
surface of the encapsulating member corresponding to the first
trenches, forming a plurality of second grounding trenches on a
second surface of the encapsulating member corresponding to the
first grounding trenches, the second surface being opposite the
first surface of the encapsulating member. Forming conductive
material in the second trenches, and electrically connecting to the
conductive material in the first trenches to cooperatively form at
least one shielding structure in the first and the second trenches.
Forming conductive material in the second grounding trenches, and
electrically connecting to the conductive material in the first
grounding trenches to cooperatively form a plurality of grounding
structures in the first and the second grounding trenches.
Separating the encapsulating member into a plurality of packaged
units by cutting through the grounding structures from the second
surface of the encapsulating member. Forming an electromagnetic
shielding layer on the external surfaces of the packaged unit with
conductive material, and the electromagnetic shielding layer is
electrically connected to the grounding pads.
[0012] In summary, the instant disclosure provides a manufacturing
method of package device, in which electronic components are fixed
onto a substrate carrier, and an encapsulating member is disposed
on the surface of the substrate carrier to cover the electronic
components. The substrate carrier is then separated from the
encapsulating member. First trench is then formed on a first
surface of the encapsulating member. Conductive material is
disposed on the first surface of the encapsulating member and the
outer surface of the first trench to form a conductive layer. The
conductive layer is patterned to form a circuit layer, so that the
circuit layer is formed directly on the encapsulating member
instead of a circuit board to reduce the volume of the packaging.
Successively, second trench is formed on the second surface of the
encapsulating member. The second trench and the first trench are
interconnected. A shielding structure is then formed in the first
and the second trenches to reduce the electromagnetic and radio
frequency interferences between encapsulating compartments. An
electromagnetic shielding layer is then formed and is electrically
connected to grounding pads.
[0013] The electronic packaged device of the instant disclosure
includes an encapsulating member and a shielding structure. The
shielding structure is interposed between different encapsulating
compartments to reduce the electromagnetic and radio frequency
interferences between encapsulating compartments. The shielding
structure can transmit electromagnetic interfering signals to the
surrounding via grounding pads, and enhance the effects of
electromagnetic shielding for the electronic packaged device.
[0014] In order to further understand the instant disclosure, the
following embodiments and illustrations are provided. However, the
detailed description and drawings are merely illustrative of the
disclosure, rather than limiting the scope being defined by the
appended claims and equivalents thereof.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIGS. 1A to 1K are cross-sectional views illustrating steps
of an electronic packaged device manufacturing method in accordance
with a first embodiment of the instant disclosure;
[0016] FIGS. 2A to 2C are cross-sectional views illustrating steps
of the electronic packaged device manufacturing method in
accordance with a second embodiment of the instant disclosure;
[0017] FIGS. 3A to 3D are cross-sectional views illustrating steps
of the electronic packaged device manufacturing method in
accordance with a third embodiment of the instant disclosure;
and
[0018] FIG. 4 is a schematic diagram of an electronic packaged
device in accordance with the first embodiment of the instant
disclosure
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Please refer to FIGS. 1A to 1K as schematic diagrams
illustrating steps of an electronic packaged device manufacturing
method in accordance with a first embodiment of the instant
disclosure.
[0020] As shown in FIG. 1A, a plurality of electronic components
120 is configured on a surface of a substrate carrier B1. Adhesives
A1 are applied onto the surface of the substrate carrier B1 to fix
the electronic components 120 on the substrate carrier B1. Notably,
the electronic components 120 can be chips, transistors, diodes,
capacitors, inductors, or the like. The adhesives A1 can be glue,
double sided tape, adhesive inks or the like. However, the coupling
between the electronic components 120 and the substrate carrier B1
is not limited to the examples provided herein.
[0021] Please refer to FIG. 1B. An encapsulating member 130 is
disposed on the surface of the substrate carrier to cover the
electronic components 120. Typically, the encapsulating member 130
can be molding sealant or prepreg adhesives. The encapsulating
member 130 is at least partially adhered to the substrate carrier's
B1 surface and covers the electronic components 120. The
encapsulating member 130 has a first surface S1 and a second
surface S2 opposite the first surface S1. In the instant
embodiment, the first surface S1 is the bottom surface of the
encapsulating member 130 and the second surface S2 is the top
surface of the encapsulating member 130. However, the first surface
S1 can be the top surface of the encapsulating member 130 and the
second surface S2 is the bottom surface of the encapsulating member
130 in another embodiment, and is not limited to the examples
provided herein.
[0022] Please refer to FIG. 1C. The adhesives A1 are removed to
separate the substrate carrier B1 from the encapsulating member
130. Typically, the adhesives can be mechanically removed by
scraping or sanding as well as thermally treating the adhesives to
remove the adhesiveness. Alternatively, solvents can be used to
remove adhesives, but the removal of adhesives is not limited to
the examples provided herein.
[0023] Please refer to FIG. 1D. The manufacturing method of the
electronic packaged device can further include forming a protective
layer P1 covering over the encapsulating member 130. Specifically,
before forming trenches on the surface of the encapsulating member
130, the protective layer P1 is formed on the surface of the
encapsulating member 130 covering thereof at desired positions
where the trenches are to be formed, in which minimizes
contamination to post-processing procedures or structures by
particles or powder generated during the formation of the trenches.
Typically, the protective layer P1 can be insulating ink coating or
photoresist, but not limited to the examples provided herein. In
the instant embodiment, the protective layer P1 is formed on the
first surface S1.
[0024] Please refer to FIG. 1E. A plurality of first trenches T1
and a plurality of first grounding trenches G1 are formed in the
encapsulating member 130. Specifically, the first trenches T1 and
first grounding trenches G1 are formed by laser L1 ablation through
the surface of the protective layer P1 to portions of the
encapsulating member 130. A packaged unit U1 is defined as a
pre-determined region where a single packaged unit is obtained from
the post process of singularization, and the single packaged unit
is the electronic packaged device. Specifically, the first trenches
T1 are arranged at the regions between electronic components 120,
and the first grounding trenches G1 are arranged between the
packaged units U1. Notably, the first trenches T1 and first
grounding trenches G1 are not formed through the second surface S2
of the encapsulating member 130.
[0025] To accommodate the specifications of electromagnetic
shielding and various configurations of the electronic components
120, the first trenches T1 can be of various shapes and bends to
divide into three or more encapsulating compartments 130a in an
embodiment but is not limited to the example provided herein.
[0026] After the first trenches T1 and first grounding trenches G1
are formed by laser L1 ablation, the protective layer P1 is
removed. Notably, during the laser ablation process, powder or
particles are generated when portions of the encapsulating member
130 are being removed to form the first trenches T1 and the first
grounding trenches G1. Majority of those particles tends to stick
onto the surface of the protective layer P1. As a result, solvent
can be used to remove the protective layer P1 as well as the
particles.
[0027] Please refer to FIG. 1F. Conductive material is disposed
onto the first surface S1 of the encapsulating member 130 and
filled into the first trenches T1 as well as the first grounding
trenches G1. Specifically, the conductive material is disposed by
spray coating, printing, electroplating or injection onto the first
surface S1 of the encapsulating member 130, the first trenches T1,
and the first grounding trenches G1 to at least cover the surface
of the first trenches T1 and the first grounding trenches G1. In
the instant embodiment, the conductive material covers the first
surface S1 to form a conductive layer 110'. Moreover, the
conductive material is also filled into the first trenches T1 and
the first grounding trenches G1 to form a plurality of grounding
structures 160. Successively, the conductive material is cured for
solidification.
[0028] Please refer to FIG. 1G. The conductive layer 110' on the
first surface S1 is patterned to form a circuit layer 110. The
circuit layer 110 includes at least one grounding pad 112
electrically connected to the grounding structure 160. The circuit
layer 110 also includes the ground connections to active components
and passive components. Notably, the circuit layer 110 is a
re-distribution layer. In other words, the circuit layer 110 is
arranged on the bottom surface of the packaged unit U1, whereas the
grounding pad 112 is re-layout on the surrounding of the bottom
surface of the packaged unit U1 in the instant embodiment. However,
the grounding pad 112 can be arranged elsewhere due to various
designs of the grounding circuits, and the arrangement of the
grounding pad 112 is not limited to the examples provided
herein.
[0029] Please refer to FIG. 1H. A plurality of second trenches T2
corresponding to the first trenches T1 is formed on the second
surface S2 of the encapsulating member 130. Before the plurality of
second trenches T2 is formed on the second surface S2 of the
encapsulating member 130, a protective layer P1 can be formed to
cover the surface of the circuit layer 110. Notably, in the
following process of electromagnetic shielding formation, the
protective layer P1 can be first formed to cover the circuit layer
110 in order to prevent short circuiting due to contamination of
the circuit layer 110. Successively, removing portions of the
encapsulating member 130 via laser L1 ablation to form the second
trenches T2. In the instant embodiment, the depths of the first
trenches T1 and the second trenches T2 vary, where the depth of the
first trenches T1 is about 70% of the depth of the encapsulating
member 130. The first and the second trenches are interconnected to
divide the encapsulating member 130 into at least two encapsulating
compartments 130a.
[0030] Please refer to FIG. 1I. Forming at least one shielding
structure 140 in the first trenches T1 as well as the second
trenches T2. In the instant embodiment, conductive material 151 is
spray coated or sputtered onto the second surface S2 and onto outer
surface of the second trenches T2. The conductive material on the
surface of the second trench T2 and the conductive material in the
first trench T1 are electrically connected to form the shielding
structure 140. Notably, the shielding structure 140 and the
grounding pas 113 can be electrically connected according to the
various grounding circuit designs.
[0031] Please refer to FIG. 1J. The encapsulating member 130 is cut
at the second surface S2 corresponding to the grounding structures
160 to divide into the plurality of packaged units U1.
[0032] Please refer to FIG. 1K. The electromagnetic shielding layer
150 is formed to cover the encapsulating member 130. Since the
plurality of packaged units U1 are formed by cutting the
encapsulating member 130 at the second surface S2 corresponding to
the grounding structures 160, the grounding structures 160 are
exposed at the sides of the packaged units U1. The exposed sides
and top outer surfaces, also denoted as the external sides, of the
packaged units U1 are spray coated or sputter with conductive
material thereon to form a continuous layer of electromagnetic
shielding layer 150 across the exposed sides and top outer
surfaces, or the external sides, of the packaged units U1. However,
the formation of the electromagnetic shielding layer 150 is not
limited to example provided herein. Notably, the electromagnetic
shielding layer 150, the grounding structure 160 and the grounding
pads 112 are electrically connected. The protective layer P1 is
then removed with solvents to simultaneously remove powder or
particles on the protective layer P1. The electronic packaged
device 100 is substantially provided.
[0033] Notably, the electronic packaged device manufacturing method
can be applied to wafer level chip scale package (WLCSP) to package
chips without the need of a substrate carrier or PCB, which
improves upon the need to have electrically connection with the
substrate carrier as in the conventional flip chip or wire bonding
technology and also reduces the overall packaging volume. Moreover,
the electromagnetic shielding layer 150 and the grounding pads 112
of the instant disclosure are electrically connected to reduce the
effects of electromagnetic and radio frequency interferences.
[0034] FIGS. 2A to 2C are schematic diagrams illustrating steps of
the electronic packaged device manufacturing method in accordance
with a second embodiment of the instant disclosure. The differences
between the electronic packaged device method of the first and the
second embodiments are further discloses as follows.
[0035] Please refer to FIG. 1G in conjunction with FIG. 2A as a
continuation of the manufacturing method for the second embodiment.
A plurality of second trenches T2 and a plurality of second
grounding trenches G2 are formed on the second surface S2 of the
encapsulating member 130. Specifically, laser L1 ablation is
applied to removed portions of the encapsulating member 130 to form
the second trenches T2 and second grounding trenches G2 in the
second embodiment. Notably, the second trenches T2 correspond to
and are interconnected to the first trenches T1, whereas the second
grounding trenches G2 corresponding to the first grounding trenches
G1 are electrically and physically connected to the first grounding
trenches G1 to divide into at least two encapsulating compartments
130a.
[0036] Please refer to FIG. 2B. Conductive material 151 is formed
on the second surface S2, and in the second trenches T2 as well as
second grounding trenches G2 of the encapsulating member 130.
Specifically, conductive material 151 is spray coated or sputter or
injection or printing on the second surface S2, and in the second
trenches T2 as well as second grounding trenches G2 of the
encapsulating member 130. The conductive material 151 formed on the
second surface S2 of the encapsulating member 130 is an
electromagnetic shielding layer 150, whereas the conductive
material 151 formed in the second trenches T2 and the conductive
material 151 formed in the first trenches T1 are interconnected to
form at least one shielding structure 240, meanwhile, the
conductive material 151 formed in the second grounding trenches G2
and the conductive material 151 formed in the first grounding
trenches G1 are electrically connected to form a plurality of
grounding structures 260. Successively, the grounding structures
260 of the encapsulating member 130 are cut through from the second
surface S2 to divide into a plurality of packaged units U1.
[0037] Please refer to FIG. 2C. The electromagnetic shielding layer
150 covering the second surface S2 are physically connected to the
shielding structures 240 and the grounding structures 260 disposed
on sides of the electronic packaged devices 200, whereas the
electromagnetic shielding layer 150, the shielding structures 240,
and the grounding structures 260 are electrically connected to each
other. The electromagnetic shielding layer 150 on the surface of
the packaged units U1 provides electromagnetic shielding via the
grounding structures 260. The electromagnetic shielding layer 150
covers the encapsulating member 130 and is electrically connected
to the grounding pads 112.
[0038] Notably in the second embodiment, the shielding structure
240 and the grounding structure 260 are first formed on the sides
of the uncut electronic packaged device 200 and then are cut to
form the plurality of electronic packaged devices 200, the
protective layer P1 is not necessary formed on outer surface of the
circuit layer 110 when the second trenches T2 are being formed.
FIGS. 3A to 3D are schematic diagrams illustrating steps of the
electronic packaged device manufacturing method in accordance with
a third embodiment of the instant disclosure. The differences
between the electronic packaged device method of the third and the
second embodiments are further discloses as follows. Please refer
to FIGS. 3A to 3D.
[0039] Please refer to FIG. 1E in conjunction with FIG. 3A as a
continuation of the manufacturing method for the instant
embodiment. A plurality of through holes V1 is formed on the first
trenches T1 via laser L1 ablation. The through holes V1 have small
diameters and formed from the first trenches T1 through the
encapsulating member 130 and to the second surface S2. Notably, the
diameters of the through holes V1 range from about 20 to 40 microns
(.mu.m).
[0040] Please refer to FIG. 3B. Conductive material is disposed on
the first surface S1 and into the first trenches T1 as well as in
to the first grounding trenches G1. Specifically, conductivies
materials are spray coated, printed, sputter, or injected on the
first surface S1 of the encapsulating member 130 as well as filling
in the first trenches T1 and the first grounding trenches G1 to
form the conductive layer 110'. Suction is then provided from the
second surface S2 of the encapsulating member 130 via the through
holes V1, such that the conductive material can smoothly flow into
the the first trenches T1. In the instant embodiment, the
conductive material covers the first trenches T1, the surface of
the first grounding trenches G1, as well as filling in the first
trenches T1 and the first grounding trenches G1 to form the
plurality of grounding structures 160. Successively, the conductive
material is cured for solidification.
[0041] Please refer to FIG. 3C. The conductive layer 110' of the
first surface S1 of the encapsulating member 130 is patterned to
form a circuit layer 110. The circuit layer 110 includes at least
one grounding pad 112 electrically connected to the grounding
structure 160. Notably, the circuit layer 110 is a re-distribution
layer in the instant embodiment.
[0042] Please refer to FIG. 3D. Second trenches T2 are formed on
the second surface S2 of the encapsulating member 130. The second
trenches T2 are formed by removing portions of the encapsulating
member 130 from the position proximate to the through holes V1. The
second trenches T2 and the first trenches T1 are electrically
connected. In the instant embodiment, the width of the first and
the second trenches T1, T2 are identical. However, the width of the
first and second trenches T1, T2 can be different and are not
limited to the examples provides herein.
[0043] Please refer to FIGS. 1I to IK as a continuation of the
manufacturing method in FIG. 3D for the instant embodiment.
[0044] Please refer to FIG. 4 as a schematic diagram of an
electronic packaged device in accordance with the first embodiment
of the instant disclosure. The electronic packaged device 100
includes a circuit layer 110, a plurality of electronic components
120, an encapsulating member 130, a shielding structure 140, at
least one grounding structure 160, and a electromagnetic shielding
layer 150. The electronic components 120 and the circuit layer 110
are electrically connected. The encapsulating member 130 covers at
least one electronic component 120 and includes at least two
encapsulating compartments 130a. The shielding structure 140 is
interposed between different encapsulating compartments 130a, and
the electromagnetic shielding layer 150 is formed on the
encapsulating member 130.
[0045] The circuit layer 110 includes grounding pads 112 and
electric circuits. In the instant embodiment, the circuit layer 110
is a redistribution layer so the grounding pads 112 are re-layout
proximate to the surrounding of the bottom surface of the packaged
units U1. The grounding pads 112 and the electric circuits can be
configured according to the arrangement of the electronic
components.
[0046] Electronic components 120 can be of various kinds and are
not necessarily identical. Examples of electronic components 120
can be chips, transistors, diodes, capacitors, inductors or the
like. As shown in FIG. 4, the electronic components 120 can be
various sizes and shapes or types, and are not limited to the
examples provides herein.
[0047] The encapsulating member 130 includes a first surface S1 and
an oppositely arranged second surface S2. In the instant
embodiment, the first surface S1 is the bottom surface of the
encapsulating member 130 and is in contact with the circuit layer
110, whereas the second surface S2 is the top surface of the
encapsulating member 130. Notably, the first trenches T1 and the
second trenches T2 are respectively formed on the first surface S1
and the second surface S2 of the encapsulating member 130. The
first trenches T1 and the second trenches T2 inwardly extend in the
encapsulating member 130, such that the first and the second
trenches T1, T2 are interconnected. The first and the second
trenches T1, T2 cooperatively defines a region therebetween as a
trench F1. In other words, the trench F1 extend through the top
surface (second surface S2) of the encapsulating member 130 to the
bottom surface (first surface S1) of the encapsulating member 130
to divide into at least two encapsulating compartments 130a.
[0048] In the instant embodiment, the encapsulating member 130
includes two encapsulating compartments 130a each covering at least
one electronic component 120. However, the encapsulating member 130
can include three or more encapsulating compartments 130a that can
cover the electronic components 120, but the number of components
is not limited to the examples provided herein.
[0049] Notably, the encapsulating member 130 can be molding sealant
to prevent unnecessary electrical connectivity, short circuiting,
or the like. The encapsulating member 130 can be pre-impregnated
material (prepreg) such as glass fiber prepreg, carbon fiber
prepreg, epoxy resin, or the like.
[0050] The shielding structure 140 is disposed in the trench F1
between the encapsulating compartments 130a. Specifically, the
shielding structure 140 is disposed in the encapsulating member 130
and extends from the top surface to the bottom surface of the
encapsulating member 130, such that various encapsulating
compartments 130a can be divided. In the instant embodiment, the
shielding structure 140 includes a first portion 140a and a second
portion 140b. Conductive material 151 is spray coated, printed,
sputter, or injected into the first trench T1 to form the first
portion 140a, whereas conductive material 151 is spray coated or
sputter on the outer surface of the second trench T2 to form the
second portion 104b. Notably, the conductive material on the outer
surface of the second trench T2 is electrically connected to the
conductive material in the first trench T1 In other words, the
first portion 140a and the second portion 140b are electrically
connected to form the shielding structure 140.
[0051] Notably, the shielding structure 140 reduces electromagnetic
and radio frequency interferences between the encapsulating
compartments 130a. The shielding structure 140 provides further
electromagnetic shielding of the electronic packaged device by
transmitting electromagnetic interferences to the ground via the
grounding pads 112, and further enhances the effects of
electromagnetic shielding between electronic components 120 covered
in the encapsulating compartments 130a.
[0052] Notably, the shielding structure 140 is made of metal such
as copper, aluminum, silver, nickel or the like. However, the
shielding structure 140 can also be conductive polymers such as
polyaniline (PAn), polypyrrole (PYy), polythiophene (PTh) or the
like, and is not limited to the examples provided herein.
[0053] The electromagnetic shielding layer 150 is formed on the
second surface S2 and the exposed sides of the encapsulating member
130. The electromagnetic shielding layer 150 is electrically
connected to the second portion 140b of the shielding structure
140. Specifically, the electromagnetic shielding layer 150 reduces
surrounding electromagnetic interferences from the electronic
components 120. In the instant embodiment, the grounding structure
160 is exposed at the cut sides of the encapsulating member 130 and
is electrically connected to the grounding pads 112. The
electromagnetic shielding layer 150 covers the top outer surface
and exposed sides (the top outer surface and the exposed sides are
denoted as the external sides) of the encapsulating member 130. In
another embodiment, the electromagnetic shielding layer 150 covers
exposed sides of the grounding pads 112 and electrically connected
to the grounding structure 160 and the grounding pads 112, such
that the electromagnetic shielding layer 150 can transmit
electromagnetic interfering signals to the grounding pads 112 of
the circuit layer 110, and enhance electromagnetic shielding
effects for the electronic packaged device. However, the
electromagnetic shielding layer 150 can also cover only the top
surface and the exposed sides of the encapsulating member 30 while
not extended to the grounding pads 112. As a result, the
electromagnetic shielding layer 150 can transmit electromagnetic
interfering signals to the ground via the grounding structure
160.
[0054] The structure of the electronic packaged device in
accordance with the instant disclosure can be applied to wafer
level chip scale package (WLCSP) to package chips without the need
of a substrate carrier or PCB, which improves upon the need to have
electrically connection with the substrate carrier as in the
conventional flip chip or wire bonding technology and also reduces
the overall packaging volume. Moreover, the electromagnetic
shielding layer 150 and the grounding pads 112 of the instant
disclosure are electrically connected to reduce the effects of
electromagnetic and radio frequency interferences.
[0055] Please refer to FIG. 2C as schematic diagrams illustrating
the structure of the electronic packaged device in accordance with
the second embodiment of the instant disclosure. The electronic
packaged device 200 and the electronic packaged device 100 are
similar, so the differences will be disclosed as follow.
[0056] In the instant embodiment, the shielding structure 240 is
formed by spray coating, sputtering, printing, injection or the
like to fill the trench F1 with conductive material. The shielding
structure 240 extends from the first surface S1 (bottom surface) to
the second surface S2 (top surface) of the encapsulating member 130
and is electrically connected to the electromagnetic shielding
layer 150.
[0057] Moreover, the electromagnetic shielding layer 150 covers the
second surface S2 of the encapsulating member 130 to electrically
connect to the shielding structure 240, and the electromagnetic
shielding layer 150 is physically and electrically connected to the
grounding structure 260 at the sides of the electronic packaged
device 200. The sides of the electronic packaged device 200 are
electromagnetic shielded by the grounding structure 260. The
electromagnetic shielding layer 150 covers the encapsulating member
130 and is electrically connected to the grounding pads 112.
[0058] In summary, the instant disclosure provides a package device
manufacturing method. Electronic components are fixed onto a
substrate carrier by adhesives, and an encapsulating member is
disposed on the surface of the substrate carrier to cover the
electronic components. The substrate carrier is then separated from
the encapsulating member. First trench is then formed on a first
surface of the encapsulating member. Conductive material is
disposed on the first surface and the outer surface of the first
trench to form a conductive layer. The conductive layer is
patterned to form a circuit layer, so that the circuit layer is
formed directly on the encapsulating member instead of a circuit
board to reduce the volume of the packaging. Successively, second
trench is formed on the second surface of the encapsulating member.
The second trench and the first trench are interconnected. A
shielding structure is then formed in the first and the second
trenches to reduce the electromagnetic and radio frequency
interferences between encapsulating compartments. An
electromagnetic shielding layer is then formed and is electrically
connected to grounding pads.
[0059] The electronic packaged device of the instant disclosure
includes an encapsulating member and a shielding structure. The
shielding structure is interposed between different encapsulating
compartments to reduce the electromagnetic and radio frequency
interferences between encapsulating compartments. The shielding
structure can transmit electromagnetic interfering signals to the
surrounding via grounding pads, and enhance electromagnetic
shielding for the electronic packaged device.
[0060] The figures and descriptions supra set forth illustrated the
preferred embodiments of the instant disclosure; however, the
characteristics of the instant disclosure are by no means
restricted thereto. All changes, alternations, combinations or
modifications conveniently considered by those skilled in the art
are deemed to be encompassed within the scope of the instant
disclosure delineated by the following claims.
* * * * *