U.S. patent application number 14/106207 was filed with the patent office on 2015-06-18 for integrated heat exchange assembly and an associated method thereof.
This patent application is currently assigned to General Electric Company. The applicant listed for this patent is General Electric Company. Invention is credited to Pramod Chamarthy, Shakti Singh Chauhan, Hendrik Pieter Jacobus de Bock, Tao Deng, Graham Charles Kirk, David Shannon Slaton, Stanton Earl Weaver, JR..
Application Number | 20150173243 14/106207 |
Document ID | / |
Family ID | 52278345 |
Filed Date | 2015-06-18 |
United States Patent
Application |
20150173243 |
Kind Code |
A1 |
Chauhan; Shakti Singh ; et
al. |
June 18, 2015 |
Integrated heat exchange assembly and an associated method
thereof
Abstract
A heat exchange assembly for dissipating heat from a hot
component of a circuit card is disclosed. The heat exchange
assembly includes a support structure having a first support end, a
second support end, and a support portion extending between the
first support end and the second support end. The support structure
further includes a plurality of first projections protruding from a
portion of a surface of the support structure, corresponding to the
support portion. Further, the heat exchange assembly includes a
vapor chamber having a casing and a wick disposed within the
casing. The vapor chamber is coupled to a surface of the support
structure.
Inventors: |
Chauhan; Shakti Singh;
(Guilderland, NY) ; de Bock; Hendrik Pieter Jacobus;
(Clifton Park, NY) ; Kirk; Graham Charles; (Milton
Keynes, GB) ; Weaver, JR.; Stanton Earl; (Broadalbin,
NY) ; Slaton; David Shannon; (Huntsville, AL)
; Deng; Tao; (Shanghai, CN) ; Chamarthy;
Pramod; (Revere, MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
General Electric Company |
Schenectady |
NY |
US |
|
|
Assignee: |
General Electric Company
Schenectady
NY
|
Family ID: |
52278345 |
Appl. No.: |
14/106207 |
Filed: |
December 13, 2013 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H05K 7/20336 20130101; H01L 21/4882 20130101; H01L 23/427 20130101;
F28D 15/04 20130101; F28D 15/0275 20130101; H01L 23/36 20130101;
H01L 23/40 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20; F28D 15/04 20060101 F28D015/04 |
Claims
1. A system comprising: a support structure having a first support
end, a second support end, a support portion extending between the
first support end and the second support end, and a plurality of
first projections protruding from a portion of a surface of the
support structure, corresponding to the support portion, wherein
the support structure is a primary heat sink; and a vapor chamber
having a casing and a wick disposed within the casing, coupled to
the surface of the support structure.
2. The system of claim 1, wherein the support portion comprises a
recess, wherein the vapor chamber is disposed within the
recess.
3. The system of claim 2, wherein the casing comprises a first
projected end portion extending along a first direction, a second
projected end portion extending along a second direction opposite
to the first direction, and a mid projected portion disposed
between the first projected end portion and the second projected
end portion.
4. The system of claim 3, wherein each portion from the first
projected end portion and the second projected end portion has a
first thickness, and the mid projected portion has a second
thickness different from the first thickness.
5. The system of claim 3, wherein the first projected end portion
comprises a first end projection disposed overlapping the first
support end and the second projected end portion comprises a second
end projection disposed overlapping the second support end.
6. The system of claim 5, wherein first projected end portion
comprises a third end projection extending perpendicular from the
first end projection and a fourth end projection extending
perpendicular from the second end projection and parallel to the
third end projection.
7. The system of claim 6, further comprising a first clamping
device extending through a first through-hole formed in the first
end projection, the third end projection, and the first support end
and a second clamping device extending through a second
through-hole formed in the second end projection, the fourth end
projection, and the second support end.
8. The system of claim 7, wherein the third end projection and the
fourth end projection are configured to support a hot component of
a circuit card.
9. The system of claim 5, wherein the first projected end portion
further comprises a first extension portion extending from the
first end projection, beyond and perpendicular to the first support
end and the second projected end portion further comprises a second
extension portion extending from the second end projection, beyond
and perpendicular to the second support end.
10. The system of claim 9, further comprising a first wedge lock
component coupled to the first extension portion and a second wedge
lock component coupled to the second extension portion.
11. The system of claim 10, further comprising a secondary heat
sink coupled to the support portion of the support structure, the
first wedge lock component, and the second wedge lock component via
a plurality of wedges.
12. The system of claim 5, wherein each end from the first support
end and the second support end comprises a wedge lock recess.
13. The system of claim 12, further comprising a secondary heat
sink clamped to the support portion of the support structure and
the wedge lock recess via a plurality of wedges.
14. The system of claim 1, wherein the casing comprises a plurality
of second projections extending from one side to another side of
the casing, wherein each second projection has a through-hole.
15. The system of claim 14, wherein each first projection is
coupled to the through-hole of the corresponding second projection
of the casing.
16. The system of claim 15, further comprising a plurality of
spring loaded clamping devices, each spring loaded clamping device
is configured to clamp a circuit card to the corresponding first
projection among the plurality of first projections.
17. The system of claim 1, wherein the casing comprises a first
projected end portion extending along a first direction, a second
projected end portion extending along a second direction opposite
to the first direction, and a mid projected portion disposed
between the first projected end portion and the second projected
end portion.
18. The system of claim 17, wherein each portion from the first
projected end portion and the second projected end portion has a
first thickness, and the mid projected portion has a second
thickness different from the first thickness, wherein the first
projected end portion comprises a first end projection disposed
overlapping the first support end and the second projected end
portion comprises a second end projection disposed overlapping the
second support end.
19. The system of claim 1, further comprising a plurality of spring
loaded clamping devices, each spring loaded clamping device is
configured to clamp a circuit card to the corresponding first
projection among the plurality of first projections.
20. The system of claim 1, further comprising a first threaded
insert disposed within a blind-hole formed in each support end from
the first support end and the second support end of the support
structure, a second threaded insert disposed within a through-hole
formed in each projected end portion from a first projected end
portion and a second projected end portion of the casing, and a
threaded stud coupled to the first threaded insert and the second
threaded insert.
21. The system of claim 1, further comprising a first threaded
insert disposed within a first blind-hole formed in each support
end from the first support end and the second support end, a second
threaded insert disposed within a second blind-hole formed in each
projected end portion from a first projected end portion and a
second projected end portion, a first threaded stud coupled to the
first threaded insert and the second threaded insert, a third
threaded insert disposed within a third blind-hole formed in each
support end from the first support end and the second support end,
a circuit card having a fourth blind-hole, and a second threaded
stud coupled to the third threaded insert and the fourth
blind-hole.
22. The system of claim 1, further comprising: a threaded insert
disposed within a first through-hole formed in each projected end
portion from a first projected end portion and a second projected
end portion of the casing, and a threaded stud coupled to each
projected end portion via the threaded insert, a second
through-hole formed in each support end from the first and second
support ends, and a blind-hole formed in a circuit card.
23. The system of claim 1, further comprising: a threaded insert
diposed within a first through-hole formed in each projected end
portion from a first projected end portion and a second projected
end portion of the casing, and a hollow threaded screw coupled to
each projected end portion via the threaded insert, and a second
through-hole formed in each support end from the first and second
support ends, and another threaded screw coupled to a third
through-hole formed in a circuit card, to a threaded hollow portion
of the hollow threaded screw.
24. The system of claim 1, further comprising a plurality of
cross-bars, wherein each cross-bar among the plurality of cross
bars, comprises a hole for encompassing a corresponding projection
among the plurality of first projections.
25. A method comprising: absorbing heat from a hot component by
conduction through an evaporator portion of a vapor chamber,
wherein the vapor chamber includes a casing and a wick disposed
within the casing; vaporizing a working fluid disposed within the
casing, using the absorbed heat, to generate a vaporized working
fluid; transporting the vaporized working fluid from the evaporator
portion to a condenser portion of the vapor chamber; and condensing
the vaporized working fluid via the condenser portion by
dissipating the absorbed heat along a plurality of directions in
the casing, to a support structure; wherein the support structure
is a primary heat sink and includes a first support end, a second
support end, a support portion extending between the first support
end and the second support end, and a plurality of first
projections protruding from a portion of a surface of the support
structure, corresponding to the support portion; wherein the vapor
chamber is coupled to the surface of the support structure.
26. The method of claim 25, wherein condensing the vaporized
working fluid comprises dissipating the absorbed heat along the
plurality of directions in a first end projection of a first
projected end portion disposed extending along a first direction
and a second end projection of a second projected end portion
disposed extending along a second direction opposite to the first
direction of the casing.
27. The method of claim 26, wherein condensing the vaporized
working fluid further comprises dissipating the absorbed heat along
the plurality of directions in a third end projection disposed
extending perpendicular from the first end projection and a fourth
end projection disposed extending perpendicular from the second end
projection and parallel to the third end projection.
28. The method of claim 26, wherein condensing the vaporized
working fluid further comprises dissipating the absorbed heat from
the support structure to a secondary heat sink.
29. The method of claim 25, wherein condensing the vaporized
working fluid comprises dissipating the absorbed heat along the
plurality of directions in the support portion of the vapor
chamber.
30. A system comprising: a hot component coupled to a circuit card
having a plurality of holes, wherein the hot component and the
circuit card are disposed within a housing; a support structure
having a first support end, a second support end, a support portion
extending between the first support end and the second support end,
and a plurality of first projections protruding from a portion of a
surface of the support structure, corresponding to the support
portion, wherein the support structure is a primary heat sink; a
vapor chamber having a casing and a wick disposed within the
casing, coupled to the surface of the support structure, wherein
the vapor chamber is coupled to the hot component via a thermal
interface material, wherein the casing comprises a first projected
end portion extending along a first direction, a second projected
end portion extending along a second direction opposite to the
first direction, and a mid projected portion disposed between the
first projected end portion and the second projected end portion;
and a plurality of spring loaded clamping devices, each spring
loaded clamping device is coupled via a corresponding hole from the
plurality of holes to a corresponding first projection from the
plurality of first projections so as to clamp the circuit card to
the support structure.
31. The system of claim 30, wherein the casing comprises a
plurality of second projections extending from one side to another
side of the casing, wherein each second projection has a
through-hole.
32. The system of claim 31, wherein each first projection is
coupled to the through-hole of the corresponding second projection
of the casing.
Description
BACKGROUND
[0001] The present patent application relates generally to a heat
exchange assembly, and more particularly, to an integrated heat
exchange assembly having a support structure and a vapor chamber
disposed over a hot component of a circuit card, for dissipation of
generated heat.
[0002] Electrical devices often produce heat during operation that
needs to be dissipated. A heat dissipation device includes a heat
exchange assembly having a heat spreader coupled to a hot component
of an electrical device, so as to dissipate the heat generated from
the hot component to a heat sink via the heat spreader. The heat
spreader typically includes a solid plate made of copper or
aluminum material. The heat spreader generally dissipates heat by
transferring heat along a tortuous heat path from the hot component
to the heat sink via the heat spreader. Such devices have a limited
heat transfer capacity because of a longer heat travel path from
the hot component to the heat sink and limitations on the maximum
temperature logic devices can experience without sacrificing
reliability.
[0003] During assembling of such a heat exchange assembly within a
housing of an electrical device, non-planarity and height
mismatches between the housing and the components may also occur.
Due to the limited flexibility of the heat spreader, the heat sink,
and the planar architecture of the housing, a thermal interface
material may be disposed between the hot component and the heat
spreader. Such a thermal interface material has to be thick and
compliant, resulting in substantial thermal resistance, which
reduces the efficiency of heat transfer from the hot component to
the heat sink.
[0004] Accordingly, there is a need for an improved heat exchange
assembly.
BRIEF DESCRIPTION
[0005] In accordance with one exemplary embodiment, a heat exchange
assembly is disclosed. The heat exchange assembly includes a
support structure having a first support end, a second support end,
a support portion extending between the first support end and the
second support end, and a plurality of first projections protruding
from a portion of a surface of the support structure, corresponding
to the support portion. In such embodiments, the support structure
is a primary heat sink. The heat exchange assembly further includes
a vapor chamber having a casing and a wick disposed within the
casing. The vapor chamber is coupled to a surface of the support
structure.
[0006] In accordance with another exemplary embodiment, a method of
dissipating heat from a hot component of a circuit card is
disclosed. The method includes absorbing heat from a hot component
by conduction through an evaporator portion of a vapor chamber.
Further, the method includes evaporating a working fluid disposed
within the casing, using the absorbed heat, so as to generate a
vaporized working fluid. The method further includes transporting
the vaporized working fluid from the evaporator portion to a
condenser portion of the vapor chamber. Further, the method
includes condensing the vaporized working fluid via the condenser
portion by dissipating the absorbed heat along a plurality of
directions in the casing, to a support structure.
[0007] In accordance with yet another exemplary embodiment, an
electrical device having a heat exchange assembly is disclosed. The
electrical device includes a hot component coupled to a circuit
card having a plurality of holes. The hot component and the circuit
card are disposed within a housing. Further, the electrical device
includes a support structure having a first support end, a second
support end, a support portion extending between the first support
end and the second support end, and a plurality of first
projections protruding from a portion of a surface of the support
structure, corresponding to the support portion. The electrical
device further includes a vapor chamber having a casing and a wick
disposed within the casing. The vapor chamber is coupled to a
surface of the support structure. The electrical device further
includes a plurality of spring loaded clamping devices. Each spring
loaded clamping device is coupled to a corresponding hole in the
corresponding first projection so as to clamp the circuit card to
the support structure. Further, the vapor chamber is coupled to the
hot component via a thermal interface material. In such
embodiments, the casing further includes a first projected end
portion extending along a first direction, a second projected end
portion extending along a second direction opposite to the first
direction, and a mid projected portion disposed between the first
projected end portion and the second projected end portion.
DRAWINGS
[0008] These and other features and aspects of embodiments of the
present disclosure will become better understood when the following
detailed description is read with reference to the accompanying
drawings in which like characters represent like parts throughout
the drawings, wherein:
[0009] FIG. 1a illustrates a schematic front sectional view of a
support structure in accordance with an exemplary embodiment;
[0010] FIG. 1b illustrates a top view of the support structure in
accordance with the exemplary embodiment of FIG. 1a;
[0011] FIG. 2a illustrates a schematic front sectional view of a
vapor chamber in accordance with an exemplary embodiment;
[0012] FIG. 2b illustrates a top view of the vapor chamber in
accordance with the exemplary embodiment of FIG. 2a;
[0013] FIG. 3a illustrates a top view of the heat exchange assembly
having the support structure and the vapor chamber in accordance
with the exemplary embodiments of FIGS. 1a, 1b, 2a, and 2b;
[0014] FIG. 3b illustrates a schematic front sectional view of a
heat exchange assembly having the support structure and the vapor
chamber in accordance with the exemplary embodiment of FIG. 3a;
[0015] FIG. 4 illustrates a schematic front sectional view of a
heat exchange assembly in accordance with another exemplary
embodiment;
[0016] FIG. 5 illustrates a schematic front sectional view of a
heat exchange assembly in accordance with yet another exemplary
embodiment;
[0017] FIG. 6 illustrates a schematic front sectional view of a
heat exchange assembly in accordance with yet another exemplary
embodiment;
[0018] FIG. 7 illustrates a schematic front sectional view of the
heat exchange assembly in accordance with the exemplary embodiment
of FIG. 5;
[0019] FIG. 8 illustrates a schematic front sectional view of a
heat exchange assembly in accordance with yet another exemplary
embodiment;
[0020] FIG. 9 illustrates a schematic front sectional view of the
heat exchange assembly coupled to a heat sink in accordance with
the exemplary embodiments of FIGS. 3a, and 3b;
[0021] FIG. 10a illustrates a schematic front sectional view of a
support structure in accordance with yet another exemplary
embodiment;
[0022] FIG. 10b illustrates a top view of the support structure in
accordance with the exemplary embodiment of FIG. 10a;
[0023] FIG. 11a illustrates a perspective side view of a vapor
chamber in accordance with yet another exemplary embodiment;
[0024] FIG. 11b illustrates a top view of the vapor chamber in
accordance with the exemplary embodiment of FIG. 11a;
[0025] FIG. 12a illustrates a top view of a heat exchange assembly
in accordance with the exemplary embodiments of FIGS. 10a, 10b,
11a, and 11b;
[0026] FIG. 12b illustrates a schematic front sectional view of a
heat exchange assembly in accordance with the exemplary embodiment
of FIG. 12a;
[0027] FIG. 13 illustrates a schematic front sectional view of a
heat exchange assembly coupled to an electrical device in
accordance with the exemplary embodiments of FIGS. 12a and 12b;
[0028] FIG. 14 illustrates a schematic front sectional view of a
heat exchange assembly coupled to an electrical device in
accordance with the exemplary embodiment of FIG. 6;
[0029] FIG. 15 illustrates a schematic front sectional view of the
heat exchange assembly and the electrical device coupled to a
housing in accordance with the exemplary embodiment of FIG. 13;
[0030] FIG. 16a illustrates a portion of the heat exchange assembly
having a support structure coupled to a vapor chamber in accordance
with yet another exemplary embodiment;
[0031] FIG. 16b illustrates a portion of a heat exchange assembly
having a support structure coupled to a vapor chamber which is
coupled to an electrical device in accordance with yet another
exemplary embodiment;
[0032] FIG. 16c illustrates a portion of a heat exchange assembly
having a support structure coupled to a vapor chamber which is
coupled to an electrical device in accordance with yet another
exemplary embodiment;
[0033] FIG. 16d illustrates a portion of a heat exchange assembly
having a support structure coupled to a vapor chamber which is
coupled to an electrical device in accordance with yet another
exemplary embodiment;
[0034] FIG. 17a illustrates a top view of a heat exchange assembly
having a support structure and a vapor chamber in accordance with
yet another exemplary embodiment; and
[0035] FIG. 17b illustrates a schematic front sectional view of a
heat exchange assembly having the support structure and the vapor
chamber in accordance with the exemplary embodiment of FIG.
17a.
DETAILED DESCRIPTION
[0036] While only certain features of embodiments have been
illustrated and described herein, many modifications and changes
will occur to those skilled in the art. It is, therefore, to be
understood that the appended claims are intended to cover all such
modifications and changes as falling within the spirit of the
invention.
[0037] Embodiments discussed herein disclose a heat exchange
assembly. More particularly, certain embodiments disclose a heat
exchange assembly having a support structure and a vapor chamber.
The support structure, for example, is a primary heat sink having a
first support end, a second support end, a support portion
extending between the first support end and the second support end,
and a plurality of first projections protruding from a portion of a
surface of the support structure, corresponding to the support
portion. The vapor chamber includes a casing and a wick disposed
within the casing. The vapor chamber is coupled to the surface of
the support structure. The heat exchange assembly is coupled to a
hot component of a circuit card, for dissipating heat from the hot
component.
[0038] More particularly, certain embodiments disclose a method for
dissipating heat from a hot component of a circuit card.
Specifically, the method involves absorbing heat from the hot
component by conducting the heat through an evaporator portion of a
vapor chamber. The method further involves vaporizing a working
fluid disposed within a casing of the vapor chamber so as to
generate a vaporized working fluid. Further, the vaporized working
fluid is transported from the evaporator portion to a condenser
portion of the vapor chamber via a transport portion. In some
embodiments, the vaporized working fluid may be transported from
the evaporator portion to one or more condenser portions of the
vapor chamber. The method further involves condensing the vaporized
working fluid via the condenser portion by dissipating the absorbed
heat along a plurality of directions in the casing to a support
structure.
[0039] FIG. 1a represents a schematic front sectional view of a
support structure 100, for example, a primary heat sink, in
accordance with an exemplary embodiment. The support structure 100
includes a first support end 102, a second support end 104, a
support portion 106, and a plurality of first projections 118.
[0040] In the illustrated embodiment, the support portion 106
extends between the first and second support ends 102, 104. The
plurality of first projections 118 protrude outwards from the
support portion 106. More specifically, the plurality of first
projections 118 protrude from a portion 107 of a surface 109 of the
support structure 100. The first support end 102 has a first wedge
lock recess 114 and the second support end 104 has a second wedge
lock recess 116. More specifically, the first and second wedge lock
recesses 114, 116 are disposed on a surface 111 of the support
structure 100. Each first projection 118 has a length "L.sub.1",
and the support portion 106, the first and second support ends 102,
104 have a thickness "T.sub.1". In the illustrated embodiment,
specifically, the plurality of first projections 118 protrude
orthogonally from the support portion 106. The number of first
projections 118 may vary depending upon the application and design
criteria.
[0041] The first and second wedge lock recesses 114, 116 are used
for locking the support structure 100 to a housing of an electrical
device (not shown in FIG. 1a). The plurality of first projections
118 enables holding a circuit card (not shown in FIG. 1a) of the
electrical device.
[0042] In one embodiment, the first and second support ends 102,
104 are formed separately from the support portion 106. In such
embodiments, a first peripheral end 110 of the support portion 106
is coupled to the first support end 102 and a second peripheral end
112 of the support portion 106 is coupled to the second support end
104 by welding, brazing, bolting, or the like. In one embodiment,
the first and second support ends 102, 104 are made of a first
material and the support portion 106 is made of a second material
different from the first material. The first material and the
second material may include aluminum nitride, copper, and the like.
In another embodiment, the first and second support ends 102, 104
and the support portion 106 are formed together as an integral
component. In such embodiments, the first and second support ends
102, 104 and the support portion 106 are formed of the same
material. In some other embodiment, the support structure 100 may
include a third support end and a fourth support end extending from
remaining peripheral ends of the support portion 106 and projecting
perpendicular to the first and second support ends 102, 104. The
number of such support ends of the support structure 100 may vary
depending on the application and design criteria.
[0043] FIG. 1b illustrates a top view of the support structure 100
in accordance with an exemplary embodiment. The support structure
100 has a width "W.sub.1". In the illustrated embodiment, as
discussed herein, the surface 111 of the support structure 100 has
the first wedge lock recess 114 and the second wedge lock recess
116.
[0044] FIG. 2a illustrates a schematic front sectional view of a
vapor chamber 120 in accordance with an exemplary embodiment. The
vapor chamber 120 includes a casing 122 and a wick 124 disposed
within the casing 122.
[0045] The vapor chamber 120 includes an evaporator portion 126, a
condenser portion 128, and a transport portion 130 extending
between the evaporator portion 126 and the condenser portion 128.
Further, the vapor chamber 120 includes a working fluid 132 filled
within a cavity 134 of the vapor chamber 120. The working fluid 132
may include water or alcohol depending on the application and
design criteria.
[0046] The casing 122 includes a first projected end portion 142
extending along a first direction 144 and a second projected end
portion 146 extending along a second direction 148 opposite to the
first direction 144. Further, the casing 122 includes a mid
projected portion 150 disposed between the first projected end
portion 142 and the second projected end portion 146. The mid
projected portion 150 substantially spans the evaporator portion
126 of the vapor chamber 120.
[0047] The first projected end portion 142 and the second projected
end portion 146 have a first thickness "T.sub.1" and the mid
projected portion 150 has a second thickness "T.sub.2" different
from the first thickness "T.sub.1". The different thicknesses
"T.sub.1" and "T.sub.2" facilitate the vapor chamber 120 to
accommodate a hot component (not shown in FIG. 1b) of varying
height.
[0048] The wick 124 includes a plurality of sintered layers 152,
154 disposed one above the other for vaporizing the working fluid
132 in the evaporator portion 126 and condensing the vaporized
working fluid 132 in the condenser portion 128. Each sintered layer
152, 154 may have a varying pore size and porosity (not shown in
FIG. 1b) depending on the application and design criteria.
[0049] In some other embodiments, the vapor chamber 120 may include
a third projected end portion and a fourth projected end portion
extending from remaining peripheral ends of the casing 122 and
projecting perpendicular to the first and second projected end
portions 142, 146. The number of such projected end portions of the
vapor chamber 120 may vary depending on the application and design
criteria.
[0050] FIG. 2b illustrates a top view of the vapor chamber 120 in
accordance with the exemplary embodiment of FIG. 2a. In the
illustrated embodiment, the vapor chamber 120 has an evaporator
portion 126 at a middle portion 127 and the condenser portions 128
at peripheral ends 129a, 129b of the casing 122.
[0051] FIG. 3a illustrates a schematic top view of the heat
exchange assembly 160 having the support structure 100 and the
vapor chamber 120 in accordance with the exemplary embodiments of
FIGS. 1a, 1b, 2a, and 2b. In the illustrated embodiment, the vapor
chamber 120 extends between the first support end 102 and the
second support end 104 of the support structure 100 and are
surrounded by the plurality of first projections 118.
[0052] FIG. 3b illustrates a sectional front view along an axis
3b-3b of the heat exchange assembly 160 having the support
structure 100 and the vapor chamber 120 in accordance with the
exemplary embodiment of FIG. 3a.
[0053] In the illustrated embodiment, the vapor chamber 120 is
coupled to the surface 109 of the support structure 100 such that a
first end projection 142a of the first projected end portion 142 of
the casing 122 overlaps the first support end 102 of the support
structure 100 and a second projection 146a of the second projected
end portion 146 of the casing 122 overlaps the second support end
104 of the support structure 100. In the illustrated embodiment,
the thickness "T.sub.1" of the casing is different than the length
"L.sub.1" of the plurality of first projections 118 of the support
structure 100. The length "L.sub.1" of the support structure 100 is
greater than the thickness "T.sub.1" of the casing 122.
[0054] FIG. 4 illustrates a schematic front sectional view of a
heat exchange assembly 260 in accordance with another exemplary
embodiment. In the illustrated embodiment, the heat exchange
assembly 260 includes a support structure 200 and a vapor chamber
220. The support structure 200 includes a first support end 202, a
second support end 204, and a support portion 206 having a recess
208 formed between the first support end 202 and the second support
end 204. The support structure 200 further includes a plurality of
first projections 218 protruding from a portion 207 of a surface
209 of the support structure 200, corresponding to the support
portion 206.
[0055] In the illustrated embodiment, the vapor chamber 220
includes a casing 222 and a wick 224 disposed within the casing
222. The casing 222 has a rectangular shape. The casing 222
includes a first half casing portion 238 and a second half casing
portion 240 coupled to each other by welding, brazing, bolting, or
the like. Each half casing portion 238, 240 has a U-shape. The
vapor chamber 220 is disposed within the recess 208 such that the
plurality of first projections 218 are disposed surrounding the
vapor chamber 220. The first support end 202 has a first wedge lock
recess 214 and the second support end 204 has a second wedge lock
recess 216. The casing 222 of the vapor chamber 220 further
includes a mid projected portion 250 disposed at an evaporator
portion 226 of the vapor chamber 220. The first and second support
ends 202, 204 of the support structure 200 have a thickness
"T.sub.1" and the vapor chamber 220 has a thickness "T.sub.2"
different from the thickness "T.sub.1". The different thicknesses
"T.sub.1" and "T.sub.2" facilitate coupling of the vapor chamber
220 to the support structure 200.
[0056] FIG. 5 illustrates a schematic front sectional view of a
heat exchange assembly 360 in accordance with another exemplary
embodiment. In the illustrated embodiment, the heat exchange
assembly 360 includes a support structure 300 and a vapor chamber
320. The vapor chamber 320 includes a casing 322 and a wick 324
disposed within the casing 322. The casing 322 includes a first
projected end portion 342 extending along a first direction 344 and
a second projected end portion 346 extending along a second
direction 348 opposite to the first direction 344. A first end
projection 342a of the first projected end portion 342 of the
casing 322 overlaps a first support end 302 of the support
structure 300 and a second end projection 342b of the second
projected end portion 346 of the casing 322 overlaps a second
support end 304 of the support structure 300. The support structure
300 includes a plurality of first projection 318 having a length
"L.sub.1" and the casing 322 having a thickness "T.sub.0". The
length "L.sub.1" is different from the thickness "T.sub.0" so as to
facilitate mounting of a hot component of a circuit card (not shown
in FIG. 5) to the heat exchange assembly 360. The first support end
302 has a first wedge lock recess 314 and the second support end
304 has a second wedge lock recess 316.
[0057] The first and second projected end portions 342, 346 have a
first thickness "T.sub.1" and a mid projected portion 350 has a
second thickness "T.sub.2" different from the first thickness
"T.sub.1". The different thicknesses "T.sub.1" and "T.sub.2"
facilitate the vapor chamber 320 to accommodate the hot component
(not shown in FIG. 5) of varying height. The first and second
support ends 302, 304 have a first thickness "T.sub.3" and the
support portion 306 has a second thickness "T.sub.4" different from
the first thickness "T.sub.3".
[0058] FIG. 6 illustrates a schematic front sectional view of a
heat exchange assembly 460 in accordance with another exemplary
embodiment. In the illustrated embodiment, the heat exchange
assembly 460 includes a support structure 400 and a vapor chamber
420. The support structure 400 includes a first support end 402 and
a second support end 404. The vapor chamber 420 includes a casing
422 having a first projected end portion 442 and a second projected
end portion 446. The first projected end portion 442 includes a
first end projection 442a and the second projected end portion 446
includes a second end projection 446a.
[0059] The first projected end portion 442 further includes a third
end projection 442b extending perpendicular from the first end
projection 442a. The second projected end portion 446 further
includes a fourth projected end portion 446b extending
perpendicular from the second end projection 446a and parallel to
the third end projection 442b. The third end projection 442b and
the fourth end projection 446b are configured to support a hot
component of a circuit card (not shown in FIG. 6). A first
through-hole 462 is formed extending through the first support end
402 of the support structure 400, the first end projection 442a,
and the third end projection 442b of the vapor chamber 420. A
second through-hole 464 is formed extending through the second
support end 404 of the support structure 400, the second end
projection 446a, and the fourth end projection 446b of the vapor
chamber 420. The plurality of first projections 418 have a length
"L.sub.1" and the casing 422 has a thickness "T.sub.1". The length
"L.sub.1" is equal to the thickness "T.sub.1" so as to facilitate
mounting of the hot component of the circuit card to the heat
exchange assembly 460.
[0060] FIG. 7 illustrates a schematic front sectional view of the
heat exchange assembly 360 in accordance with the exemplary
embodiment of FIG. 5. In the illustrated embodiment, the first
projected end portion 342 further includes a third end projection
342b extending perpendicular from the first end projection 342a.
The second projected end portion 346 further includes a fourth
projected end portion 346b extending perpendicular from the second
end projection 346a and parallel to the third end projection 342b.
The third end projection 342b and the fourth end projection 346b
are configured to support a hot component of a circuit card (not
shown in FIG. 7). The plurality of first projection 318 have a
length "L.sub.1" and the casing 322 has a thickness "T.sub.1". The
length "L.sub.1" is equal to the thickness "T.sub.1" so as to
facilitate mounting of the hot component of the circuit card to the
heat exchange assembly 360.
[0061] FIG. 8 illustrates a schematic front sectional view of a
heat exchange assembly 560 in accordance with yet another exemplary
embodiment. In the illustrated embodiment, the heat exchange
assembly 560 includes a support structure 500 and a vapor chamber
520. The vapor chamber 520 includes a casing 522 having a first
projected end portion 542 and a second projected end portion 546.
The first projected end portion 542 includes a first end projection
542a and the first extension portion 542b extending from the first
end projection 542a, beyond and perpendicular to a first support
end 502 of the support structure 500. Similarly, the second
projected end portion 546 includes a second end projection 546a and
a second extension portion 546b extending from the second end
projection 546a, beyond and perpendicular to a second support end
504 of the support structure 500. The heat exchange assembly 560
further includes a first wedge lock component 514 coupled to the
first extension portion 542b and a second wedge lock component 516
coupled to the second extension portion 546b. The heat exchange
assembly 560 further includes a secondary heat sink 570 coupled to
a surface 511 of the support structure 500, the first wedge lock
component 514, and the second wedge lock component 516, via a
plurality of wedges 576 disposed in the first wedge lock component
514 and the second wedge lock component 516.
[0062] FIG. 9 illustrates a schematic front sectional view of the
heat exchange assembly 160 coupled to a secondary heat sink 170 in
accordance with the exemplary embodiments of FIGS. 3a, and 3b. In
the illustrated embodiment, the secondary heat sink 170 is clamped
to a support surface 111 of the support structure 100, the first
wedge lock recess 114, and the second wedge lock recess 116, via a
plurality of wedges 176 disposed in the first wedge lock recess 114
and the second wedge lock recess 116. Similarly, with reference to
FIGS. 4 and 5, the heat exchange assembly 260, 360 may include a
secondary heat sink (not shown) clamped to respective support
portions 206, 306 of the support structures 200, 300, the first
wedge lock recesses 214, 314, and the second wedge lock recesses
216, 316, via a plurality of wedges (not shown).
[0063] FIG. 10a illustrates a schematic front sectional view of a
support structure 600 in accordance with yet another exemplary
embodiment. The support structure 600 includes a first support end
602, a second support end 604, and a support portion 606 having a
recess 608 formed between the first support end 602 and the second
support end 604. The support structure 600 further includes a
plurality of first projections 618 protruding from a portion 607 of
a surface 609 of the support structure 600, corresponding to the
support portion 606. The first support end 602 includes a first
wedge lock recess 614 and the second support end 604 includes a
second wedge lock recess 616.
[0064] FIG. 10b illustrates a top view of the support structure 600
in accordance with the exemplary embodiment of FIG. 10a. The
illustrated embodiment shows the first wedge lock recess 614, the
second wedge lock recess 616, and the plurality of first
projections 618.
[0065] FIG. 11a is a perspective side view of a vapor chamber 620
in accordance with yet another exemplary embodiment. The vapor
chamber 620 includes a casing 622 and a wick 624 disposed within
the casing 622. The casing 622 includes a first projected end
portion 642, a second projected end portion 646, a plurality of mid
projected portions (not shown in FIG. 11a), and a plurality of
second projections 690. The plurality of second projections 690
extend from one side 692 to another side 694 of the casing 622.
Each projection among the plurality of second projections 690 has a
through-hole 696. The plurality of second projections 690 are
disposed surrounding an evaporator portion 626 of the vapor chamber
620 and provide structural stability to the vapor chamber 620.
[0066] FIG. 11b illustrates a schematic top view of the vapor
chamber 620 in accordance with the exemplary embodiment of FIG.
11a. The vapor chamber 620 includes the plurality of mid projected
portions 650 proximate to the evaporator portion 626. The plurality
of mid projected portions 650 are disposed over a hot component of
a circuit card (not shown in FIGS. 11a, 11b). A working fluid 632a
(shown in FIG. 11a) in the evaporator portion 626, absorbs heat
from the hot component and generates a vaporized working fluid 632b
(shown in FIG. 11a). The vaporized working fluid 632b is
transported to a condenser portion 628 via a transport portion 630,
along a plurality of directions 698. The vaporized working fluid
632b is condensed so as to regenerate the working fluid 632a in the
condenser portion 628 by dissipating heat to the primary heat sink
and/or secondary heat sink (not shown in FIGS. 11a, 11b). The
regenerated working fluid 632a is once again re-circulated to the
evaporator portion 626, for absorbing the heat further from the hot
component.
[0067] FIG. 12a illustrates a top view of the heat exchange
assembly 660 in accordance with the exemplary embodiments of FIGS.
10a, 10b, 11a, 11b. In the illustrated embodiment, the vapor
chamber 620 includes the plurality of mid projected portions 650
disposed proximate to the evaporator portion 626 of the vapor
chamber 620.
[0068] FIG. 12b illustrates a schematic front sectional view along
an axis 12b-12b of the heat exchange assembly 660 in accordance
with the exemplary embodiment of FIG. 12a. The support structure
600 is disposed over the vapor chamber 620 such that first support
end 602 and the second support end 604 overlaps the first projected
end portion 642 and the second projected end portion 646
respectively. Further, each first projection 618 is coupled to the
corresponding second projection 690 via the respective through-hole
696 (as shown in FIG. 12a).
[0069] FIG. 13 illustrates a schematic front sectional view of the
heat exchange assembly 660 coupled to an electrical device 672 in
accordance with the exemplary embodiments of FIGS. 12a and 12b.
[0070] The heat exchange assembly 660 includes the support
structure 600 and the vapor chamber 620. The support structure 600
is disposed on the vapor chamber 620 such that the first support
end 602 and the second support end 604 of the support structure 600
overlaps the first projected end portion 642 and the second
projected end portion 646 respectively of the vapor chamber 620.
Further, each first projection 618 is coupled to the respective
through-hole 696 in the corresponding second projection 690.
[0071] The electrical device 672 includes a circuit card 674 (PCB)
coupled to an electrical component or a hot component 676 coupled
via a ball grid array (BGA) 678. In one embodiment, the electrical
device 672 is a computer or a common line replaceable unit ("LRU)
and the like. The hot component 676 may be a passive device such as
a memory unit, or an active unit such as a graphical processing
unit (GPU) or a central processing unit (CPU).
[0072] In the illustrated embodiment, the heat exchange assembly
660 further includes a plurality of spring loaded clamping devices
682. As discussed previously, each first projection 618 is coupled
to the through-hole 696 of the corresponding second projection 690
of the casing 622. Further, each spring loaded clamping device 682
is coupled to a corresponding hole 691 in a corresponding first
projection 618 so as to clamp the circuit card 674 to the support
structure 600. The heat exchange assembly 660 further includes an
additional spring loaded clamping device 682a. Each spring loaded
clamping device 682 and the additional spring loaded clamping
device 682a are mounted on a beam 684 having a plurality of hinges
686 for flexibly supporting the circuit card 674. Each spring
loaded clamping device 682, 682a along with the corresponding hinge
686 can move up and down so as to accommodate the height variation
of the respective hot component 676 during assembling of the heat
exchange device 660.
[0073] In the illustrated embodiment, the heat exchange assembly
660 also includes a thermal interface material (herein after
referred as "TIM") 688 disposed on the hot component 676 to enable
thermal conductivity between the hot component 676 and at least one
of the first projected end portion 642, the second projected end
portion 646, and the mid projected portion 650 of the vapor chamber
620. In another embodiment, at least one of the first projected end
portion 642, the second projected end portion 646, and the mid
projected portion 650 may be mounted directly on the hot component
676.
[0074] The third projection 642b and the fourth projection 646b are
configured to hold the circuit card 674 which support the hot
component 676.
[0075] FIG. 14 represents a schematic front sectional view of the
heat exchange assembly 460 coupled to an electrical device 472 in
accordance with the exemplary embodiment of FIG. 6. As discussed
previously, the heat exchange assembly 460 includes the support
structure 400 and the vapor chamber 420.
[0076] The vapor chamber 420 is disposed within the recess 408 of
the support structure 400 such that the first projected end portion
442 of the vapor chamber 420 overlaps the first support end 402 and
the second projected end portion 446 overlaps the second support
end 404. A first clamping device 466 is coupled to the first
through-hole 462 formed extending through the first support end 402
of the support structure 400, the first projection 442a and the
third projection 442b of the vapor chamber 420. A second clamping
device 468 is coupled to the second through-hole 464 formed
extending through the second support end 404 of the support
structure 400, and the second projection 446a, the fourth
projection 446b of the vapor chamber 420. The heat exchange
assembly 460 further includes a plurality of spring loaded clamping
devices 482. Each spring loaded clamping device 482 is coupled to a
corresponding hole 491 in a corresponding first projection 418 of
the support structure 400, so as to clamp the circuit card 474 to
the support structure 400. The third projection 442b and the fourth
projection 446b are configured to hold the circuit card 474 which
support the hot component 476 of the electrical device 472.
[0077] FIG. 15 represents a schematic front sectional view of the
heat exchange assembly 660 and the electrical device 672 coupled to
a housing 710 in accordance with the exemplary embodiment of FIG.
13.
[0078] The heat exchange assembly 660 has the primary heat sink 600
and the vapor chamber 620 coupled to each other. The primary heat
sink 600 has the first wedge lock recess 614 and the second wedge
lock recess 616 formed in the first support end 602 and the second
support end 604 respectively. The vapor chamber 620 is disposed
within the recess 608 of the support portion 606 of the primary
heat sink 600. The secondary heat sink 670 is disposed over the
support portion 606 of the primary heat sink 600. The vapor chamber
620 is disposed on the hot component 676 of the circuit card 674.
The electrical device 672 is supported by the third and fourth
projections 642b, 646b of the casing 622 of the vapor chamber 620.
Wedges 714 are coupled to the first wedge lock recess 614 and the
second wedge lock recess 616 so as to hold the heat exchange
assembly 660, the secondary heat sink 670, and the electrical
device 672 together.
[0079] During operation, the hot component 676 generates heat 716.
The generated heat 716 is absorbed by the mid projected portion 650
and then conducted through the evaporator portion 626 of the vapor
chamber 620. A working fluid 632a of the vapor chamber 620 absorbs
the heat 716 resulting in vaporization of the working fluid 632a
and generation of a vaporized working fluid 632b. The vaporized
working fluid 632b is transported from the evaporator portion 626
to a condenser portion 628 via a transport portion 630 of the vapor
chamber 620. Further, the vaporized working fluid 632b is condensed
to regenerate the working fluid 632a in the condenser portion 628
by dissipating the absorbed heat 716 along a plurality of
directions 718 in the casing 622.
[0080] In the illustrated embodiment, the condensation of the
vaporized working fluid 632b includes dissipating the absorbed heat
716 to the support structure 600, along one or more directions
718a, 718b, 718c, 718d, 718e, 718g, 718h. The absorbed heat 716 is
further dissipated from the support structure 600 to the secondary
heat sink 670, along one or more directions 718a, 718c, 718e. The
absorbed heat 716 is later dissipated to the housing 710, along one
or more directions 718g, 718d, 718h, 718b.
[0081] In another embodiment, the condensation of the vaporized
working fluid 632b includes dissipating the absorbed heat 716 to a
first projected end portion 642, along one or more directions 718g,
718d and to a second projected end portion, 646, along one or more
directions 718h, 718b. Further, the absorbed heat 716 is dissipated
from a third projection 642b and a fourth projection 646b to the
housing 710, along one or more directions 718d, 718h, 718b. It
should be specifically noted herein the various directions
indicated herein are only for illustrative and descriptive purposes
and should not be construed as a limitation of the invention.
[0082] FIG. 16a illustrates a portion 821 of a heat exchange
assembly 860 having a support structure coupled to a vapor chamber
in accordance with yet another exemplary embodiment. The support
structure includes the first support end 802 and the vapor chamber
includes the first projected end portion 842. The first support end
802 includes a blind-hole 859a formed in a surface 809 of the
support structure. A first threaded insert 856a is disposed in the
blind-hole 859a. Similarly, the first projected end portion 842
includes a through-hole 859b. A second threaded insert 856b is
inserted into the through-hole 859b. Further, a threaded stud 858
is coupled to the first support end 802 and the first projected end
portion 842 via the first and second threaded inserts 856a, 856b so
as to couple the support structure to the vapor chamber.
[0083] In one embodiment, the first and second threaded inserts
856a, 856b are made of a first material and the first support end
802 is made of a second material different from the first material.
The vapor chamber is made of a third material different from the
first material. The first, second, and third materials may include
aluminum nitride, copper, or the like.
[0084] FIG. 16b illustrates a portion 921 of a heat exchange
assembly 960 having a support structure coupled to a vapor chamber
which is coupled to an electrical device in accordance with yet
another exemplary embodiment. In the illustrated embodiment, the
support structure includes a first support end 902, the vapor
chamber includes a first projected end portion 942, and the
electrical device includes a circuit card 974. The portion 921
further includes a first threaded insert 956a, a second threaded
insert 956b, a third threaded insert 956c, a first threaded stud
958a, and a second threaded stud 958b. The first support end 902
includes a first blind-hole 959a formed in a surface 909 of the
support structure. A first threaded insert 956a is disposed in the
first blind-hole 959a and the first projected end portion 942
includes a second blind-hole 959b formed in a surface 955 of the
vapor chamber. Similarly, the first projected end portion 942
further includes a third blind-hole 959c formed in a surface 957 of
the vapor chamber. A second threaded insert 956b and a third
threaded insert 956c are inserted into the first blind-hole 959b
and the third blind-hole 959c respectively. Further, the first
threaded stud 958a is coupled to the first support end 902 and the
first end projection 942a via the first and second threaded inserts
956a, 956b so as to couple the support structure 900 to the vapor
chamber 920. The second threaded stud 958b is coupled via the third
threaded insert 956c to the first projected end portion 942 and a
fourth blind-hole 959d formed in a circuit card 974 of the
electrical device so as to couple the electrical device to the heat
exchange assembly 960.
[0085] FIG. 16c illustrates a portion 1021 of a heat exchange
assembly 1060 having a support structure coupled to a vapor chamber
which is coupled to an electrical device in accordance with yet
another exemplary embodiment. In the illustrated embodiment, the
support structure includes a first support end 1002, the vapor
chamber includes a first projected end portion 1042, and the
electrical device includes a circuit card 1074. The first projected
end portion 1042 includes a first through-hole 1059a, the first
support end 1002 includes a second through-hole 1059b, and the
circuit card 1074 includes a blind-hole 1059c. A threaded insert
1056 is disposed into the first through-hole 1059a. A threaded stud
1058 is coupled to the first projected end portion 1042 via the
threaded insert 1056 and to the second through-hole 1059b formed in
the first support end 1002 so as to couple the support structure to
the vapor chamber. Further, the threaded stud 1058 is coupled to
the blind-hole 1059c formed in the circuit card 1074 so as to
couple the electrical device to the heat exchange assembly
1060.
[0086] FIG. 16d illustrates a portion 1121 of a heat exchange
assembly 1160 having a support structure coupled to a vapor chamber
which is coupled to an electrical device in accordance with yet
another exemplary embodiment. In the illustrated embodiment, the
support structure includes a first support end 1102, the vapor
chamber includes a first projected end portion 1142, and the
electrical device includes a circuit card 1174. The first projected
end portion 1142 includes a first through-hole 1159a, the first
support end 1102 includes a second through-hole 1159b, and the
circuit card 1172 includes a third through-hole 1159c. A threaded
insert 1156 is inserted into the first through-hole 1159a. A hollow
threaded screw 1158a is coupled to the first projected end portion
1142 via the threaded insert 1156 and to the first support end 1102
via the second through-hole 1159b so as to couple the vapor chamber
to the support structure. Similarly, a threaded screw 1158b is
coupled to the third through-hole 1159c formed in the circuit card
1174 and to a threaded hollow portion 1159d of the hollow threaded
screw 1158a so as to couple the electrical device to the heat
exchange assembly 1160.
[0087] FIG. 17a illustrates a schematic top view of a heat exchange
assembly 1260 having a support structure 1200 and a vapor chamber
1220 in accordance with yet another exemplary embodiment. In the
illustrated embodiment, the support structure 1200 includes a
plurality of cross-bars 1217 having a plurality of holes 1215. Each
projection among a plurality of first projections 1218 extend
through a corresponding hole among the plurality of holes 1215 The
vapor chamber 1220 extends between a first support end 1202 and a
second support end 104 of the support structure 1200 and is
surrounded by the plurality of cross-bars 1217.
[0088] FIG. 17b illustrates a sectional front view along an axis
17b-17b of the heat exchange assembly 1260 having the support
structure 1200 and the vapor chamber 1220 in accordance with the
exemplary embodiments of FIG. 17a.
[0089] In accordance with embodiments discussed herein, the
exemplary heat exchange assembly facilitates an efficient way of
dissipating heat from a hot component to a housing of an electrical
device. Further, a spring loaded clamping device and a wedge lock
clamping device allows accommodating dimensional tolerances of the
hot component during assembling of the heat exchange assembly.
Further, a first support end and a second support end of a support
structure allows easy clamping of the heat exchange assembly to the
housing of the electrical device. The plurality of second
projections provide structural support to a vapor chamber and
further enable to couple the support structure to the electrical
device.
* * * * *