U.S. patent application number 14/460554 was filed with the patent office on 2015-06-11 for semiconductor device and method of manufacturing the same.
The applicant listed for this patent is JAEHOON JANG, DAEWOONG KANG, HYUNMOG PARK, JoongShik SHIN, CHADONG YEO. Invention is credited to JAEHOON JANG, DAEWOONG KANG, HYUNMOG PARK, JoongShik SHIN, CHADONG YEO.
Application Number | 20150162343 14/460554 |
Document ID | / |
Family ID | 53271973 |
Filed Date | 2015-06-11 |
United States Patent
Application |
20150162343 |
Kind Code |
A1 |
PARK; HYUNMOG ; et
al. |
June 11, 2015 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract
A {111} plane of a substrate having a silicon crystal structure
meets a top surface of the substrate to form an interconnection
line on the top surface. A first stacked structure and a second
stacked structure is formed on the substrate. Each of the first and
the second stacked structures includes gate electrodes stacked on
the substrate. A transistor is disposed on the substrate and
positioned between the first stacked structure and the second
stacked structure. The transistor includes a gate electrode
extending in a first direction, a source region and a drain region.
The source and the drain regions are disposed at both sides of the
gate electrode in a second direction crossing the first direction.
The interconnection line is extended at an angle with respect to
the second direction.
Inventors: |
PARK; HYUNMOG; (Seoul,
KR) ; KANG; DAEWOONG; (Seoul, KR) ; YEO;
CHADONG; (Gyeonggi-do, KR) ; JANG; JAEHOON;
(Gyeonggi-do, KR) ; SHIN; JoongShik; (Gyeonggi-do,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PARK; HYUNMOG
KANG; DAEWOONG
YEO; CHADONG
JANG; JAEHOON
SHIN; JoongShik |
Seoul
Seoul
Gyeonggi-do
Gyeonggi-do
Gyeonggi-do |
|
KR
KR
KR
KR
KR |
|
|
Family ID: |
53271973 |
Appl. No.: |
14/460554 |
Filed: |
August 15, 2014 |
Current U.S.
Class: |
257/329 ;
438/198 |
Current CPC
Class: |
H01L 27/11529 20130101;
H01L 29/045 20130101; H01L 27/11556 20130101; H01L 27/11582
20130101; H01L 27/11573 20130101; H01L 29/4966 20130101; H01L 29/16
20130101; H01L 27/1157 20130101; H01L 27/11524 20130101; H01L
27/11575 20130101 |
International
Class: |
H01L 27/115 20060101
H01L027/115; H01L 29/16 20060101 H01L029/16; H01L 21/02 20060101
H01L021/02; H01L 29/49 20060101 H01L029/49; H01L 21/768 20060101
H01L021/768; H01L 29/04 20060101 H01L029/04; H01L 23/528 20060101
H01L023/528 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 5, 2013 |
KR |
10-2013-0150782 |
Claims
1. A semiconductor device comprising: a substrate having a {111}
plane of a silicon crystal structure and a top surface, wherein the
{111} plane meets the top surface to form an interconnection line
on the top surface; a first stacked structure and a second stacked
structure formed on the substrate, wherein each of the first and
the second stacked structures includes a plurality of gate
electrodes stacked on the semiconductor substrate; and a transistor
disposed between the first stacked structure and the second stacked
structure on the substrate, wherein the transistor includes a gate
electrode extending in a first direction, a source region and a
drain region, wherein the source and the drain regions are disposed
at both sides of the gate electrode in a second direction crossing
the first direction, and wherein the interconnection line is
extended at an angle with respect to the second direction.
2. The device of claim 1, wherein the angle is greater than about 0
degree and is less than or equal to about 45 degree.
3. The device of claim 1, wherein the plurality of gate electrodes
are extended in a third direction crossing the interconnection line
at about 45 degree.
4. The device of claim 1, wherein the plurality of gate electrodes
are extended in a third direction crossing the first direction and
the second direction.
5. The device of claim 1, wherein the first stacked structure
includes an stepped end where each of the plurality of gate
electrodes includes an exposed region where a contact hole is
disposed on the exposed region, and wherein the stepped end of the
first stacked structure is adjacent to the transistor.
6. The device of claim 1, further comprising a vertical structure
penetrating the plurality of gate electrodes.
7. The device of claim 6, wherein each of the first and second
stacked structures further comprises a plurality of insulating
layers, wherein each of the plurality of insulating layers is
interposed between two adjacent gate electrodes of the plurality of
the gate electrodes.
8. The device of claim 7, further comprising a plurality of
horizontal structures, wherein each of the plurality of horizontal
structures is disposed between each of the plurality of gate
electrodes and each of the plurality of insulating layers and
between the plurality of gate electrodes and the vertical
structure.
9. The device of claim 6, wherein the plurality of gate electrodes
comprises a metallic material.
10. The device of claim 1, wherein if top surface of the substrate
has a {100} plane, a direction of the interconnection line is
<110>.
11. A method of manufacturing a semiconductor device, the method
comprising: forming a device isolation layer defining a peripheral
active pattern in a substrate; forming a peripheral gate electrode
crossing the peripheral active pattern in a first direction;
forming source and drain regions in the peripheral active pattern
at both sides of the peripheral gate electrode, wherein the source
and drain regions are arranged in a second direction crossing the
first direction; and forming a stacked structure on a top surface
of the substrate, wherein the stacked structure includes a
plurality of gate electrodes vertically stacked on the top surface
of the substrate, wherein an intersection line is extended at an
angle with respect to the second direction, wherein the
intersection line is a line where a {111} plane of the silicon
crystal structure and the top surface of the substrate meet.
12. The method of claim 11, wherein an orientation of the
intersection line is <110> if the top surface of the
substrate has a {100} plane.
13. The method of claim 11, wherein the angle is greater than about
0.degree. and is smaller than or equal to about 45.degree..
14. The method of claim 11, wherein the substrate is a wafer having
a flat zone of a {100} plane, and wherein the second direction is
substantially parallel to a <100> direction.
15. The method of claim 11, wherein the substrate is a wafer having
a flat zone of a {110} plane, and wherein the second direction is
substantially parallel to a <100> direction.
16. The method of claim 11, wherein the plurality of gate
electrodes are extended in a third direction crossing the
interconnection line at about 45 degree.
17. The method of claim 11, wherein the plurality of gate
electrodes are extended in a third direction crossing the first
direction and the second direction.
18. A semiconductor device comprising: a peripheral circuit
structure disposed on a first substrate having a silicon crystal
structure, wherein a {111} plane of the first substrate meets a top
surface of the first substrate to form an interconnection line on
the top surface; a cell array structure disposed on the peripheral
circuit structure; and a second substrate interposed between the
peripheral circuit structure and the cell array structure, wherein
the cell array structure includes a plurality of gate electrode
stacked on the second substrate, wherein the peripheral circuit
structure comprises a transistor having a gate electrode, a source
region and a drain region, wherein the gate electrode is extended
in a first direction and the source and the drain regions are
disposed at both sides of the gate electrode in a second direction
crossing the first direction, wherein the intersection line is
extended at an angle with respect to the second direction.
19. The device of claim 18, wherein the angle is greater than about
0 degree and is less than or equal to about 45 degree.
20. The device of claim 18, wherein if top surface of the substrate
has a {100} plane, a direction of the interconnection line is
<110>.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority under 35 U.S.C. .sctn.119
to Korean Patent Application No. 10-2013-0150782, filed on Dec. 5,
2013 in the Korean Intellectual Property Office, the disclosure of
which is incorporated by reference herein in its entirety.
TECHNICAL FIELD
[0002] The present disclosure herein relates to a semiconductor
device and a method of manufacturing the same.
DISCUSSION OF RELATED ART
[0003] Memory cells arranged in three dimensions have been proposed
to increase integration density of memory cells. Such
three-dimensional arrangement of memory cells may involve
vertically stacking. Such stacking may create higher structural
stress on a substrate.
SUMMARY
[0004] According to an exemplary semiconductor device of the
present inventive concept, a {111} plane of a substrate having a
silicon crystal structure meets a top surface of the substrate to
form an interconnection line on the top surface. A first stacked
structure and a second stacked structure is formed on the
substrate. Each of the first and the second stacked structures
includes a plurality of gate electrodes stacked on the substrate. A
transistor is disposed on the substrate and positioned between the
first stacked structure and the second stacked structure. The
transistor includes a gate electrode extending in a first
direction, a source region and a drain region. The source and the
drain regions are disposed at both sides of the gate electrode in a
second direction crossing the first direction. The interconnection
line is extended at an angle with respect to the second
direction.
[0005] According to an exemplary method of manufacturing a
semiconductor device, a device isolation layer defining a
peripheral active pattern is formed in a substrate. A peripheral
gate electrode crossing the peripheral active pattern is formed in
a first direction. Source and drain regions are formed in the
peripheral active pattern at both sides of the peripheral gate
electrode. The source and drain regions are arranged in a second
direction crossing the first direction. A stacked structure is
formed on a top surface of the substrate. The stacked structure
includes a plurality of gate electrodes vertically stacked on the
top surface of the substrate. An intersection line where a {111}
plane of the silicon crystal structure and the top surface of the
substrate meet is extended at an angle with respect to the second
direction.
[0006] According to an exemplary semiconductor device, a peripheral
circuit structure is disposed on a first substrate having a silicon
crystal structure. A {111} plane of the first substrate meets a top
surface of the first substrate to form an interconnection line on
the top surface. A cell array structure is disposed on the
peripheral circuit structure. A second substrate is interposed
between the peripheral circuit structure and the cell array
structure. The cell array structure includes a plurality of gate
electrode stacked on the second substrate. The peripheral circuit
structure comprises a transistor having a gate electrode, a source
region and a drain region. The gate electrode is extended in a
first direction. The source and the drain regions are disposed at
both sides of the gate electrode in a second direction crossing the
first direction. The intersection line is extended at an angle with
respect to the second direction.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] These and other features of the inventive concept will
become more apparent by describing in detail exemplary an exemplary
embodiment thereof with reference to the accompanying drawings of
which:
[0008] FIG. 1 is a layout of a semiconductor device according to an
exemplary embodiment of the present inventive concept;
[0009] FIG. 2 is a schematic circuit diagram illustrating a cell
array of a semiconductor memory device according to an exemplary
embodiment of the present inventive concept;
[0010] FIG. 3 is a plan view of a semiconductor device according to
an exemplary embodiment of the present inventive concept;
[0011] FIG. 4 is a sectional view taken along lines I-I', II-II',
III-III', IV-IV', and V-V' of FIG. 3 illustrating a semiconductor
device according to an exemplary embodiment of the present
inventive concept;
[0012] FIG. 5 is a conceptual view illustrating a portion A of FIG.
3;
[0013] FIGS. 6 to 9 are sectional views taken along lines I-I',
II-II', and III-III' of FIG. 3 illustrating a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the present inventive concept;
[0014] FIG. 10 is a plan view of a semiconductor device according
to an exemplary embodiment of the present inventive concept;
[0015] FIG. 11 is a plan view illustrating a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the present inventive concept;
[0016] FIG. 12 is a sectional view of a semiconductor device
according to an exemplary embodiment of the present inventive
concept;
[0017] FIG. 13 is a sectional view illustrating a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the present inventive concept;
[0018] FIG. 14 is a block diagram of a memory system including a
three-dimensional semiconductor memory device according to an
exemplary embodiment of the present inventive concept;
[0019] FIG. 15 is a block diagram illustrating a memory card
including a three-dimensional semiconductor memory according to an
exemplary embodiment of the present inventive concept; and
[0020] FIG. 16 is a block diagram illustrating an information
processing system including a three-dimensional memory device
according to an exemplary embodiment of the present inventive
concept.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0021] Exemplary embodiments of the inventive concept will be
described below in detail with reference to the accompanying
drawings. However, the inventive concept may be embodied in
different forms and should not be construed as limited to the
embodiments set forth herein. In the drawings, the thickness of
layers and regions may be exaggerated for clarity. It will also be
understood that when an element is referred to as being "on"
another element or substrate, it may be directly on the other
element or substrate, or intervening layers may also be present. It
will also be understood that when an element is referred to as
being "coupled to" or "connected to" another element, it may be
directly coupled to or connected to the other element, or
intervening elements may also be present. Like reference numerals
may refer to the like elements throughout the specification and
drawings.
[0022] FIG. 1 is a view illustrating a layout of a semiconductor
device according to an exemplary embodiment of the inventive
concept.
[0023] Referring to FIG. 1, a semiconductor substrate 100 includes
a cell region and a peripheral region PR. The cell region includes
a first cell region CR1 and a second cell region CR2. The first
cell region CR1 and the second cell region CR2 are spaced from each
other with the peripheral region PR therebetween. Alternatively,
the cell regions CR1 and CR2 may be adjacent to each other, and the
peripheral region PR may be provided at one side or both sides of
the cell regions. The peripheral region PR may be a row decoder
region, for example. A memory cell array including memory cells may
be arranged in the first and second cell regions CR1 and CR2, and
peripheral circuits may be arranged in the peripheral region
PR.
[0024] FIG. 2 is a schematic circuit diagram illustrating a cell
array of a semiconductor memory device according to an exemplary
embodiment of the present invention.
[0025] Referring to FIG. 2, the cell array of the semiconductor
memory device includes common source lines CSL, bit lines BL, and
cell strings CSTR between the common source lines CSL and the bit
lines BL.
[0026] The common source lines CSL may be a conductive thin film
disposed on a substrate or an impurity region formed in a
substrate. The bit lines BL may be conductive patterns (e.g.,
metallic lines) disposed on the substrate, being spaced from the
substrate. The bit lines BL are arranged two-dimensionally and the
cell strings CSTR are connected in parallel to each of the bit
lines BL. The cell strings CSTR may be commonly connected to the
common source lines CSL. For example, the cell strings CSTR may be
disposed between the bit lines BL and the common source lines CSL.
The common source line CSL may be provided in plurality and may be
two-dimensionally arranged. The common source lines CSL may be
commonly supplied with a voltage. Alternatively, each of the common
source lines CSL may be independently supplied with a voltage.
[0027] Each of the cell strings CSTR includes a ground selection
transistor GST connected to the common source line CSL, a string
selection transistor SST connected to the bit line BL, and memory
cell transistors MCT between the ground selection transistor GST
and the string selection transistor SST. The ground selection
transistor GST, the string selection transistor SST, and the memory
cell transistors MCT are connected in series to each other.
[0028] The common source lines CSL may be commonly connected to
sources of the ground selection transistors GST. Furthermore,
ground selection lines GSL, word lines WL0 to WL3, and string
selection lines SSL, which are disposed between the common source
lines CSL and the bit lines BL, serve as gate electrodes of the
ground selection transistors GST, the memory cell transistors MCT,
and the string selection transistors SST. Additionally, each of the
memory cell transistors MCT may include a data storage element.
[0029] FIG. 3 is a plan view of a semiconductor device according to
an exemplary embodiment of the inventive concept. FIG. 4 is a
sectional view taken along lines I-I', II-II', III-III', IV-IV',
and V-V' of FIG. 3 according to an exemplary embodiment of the
inventive concept. FIG. 5 is a conceptual view illustrating a
portion A of FIG. 3.
[0030] Referring to FIGS. 3 and 4, the semiconductor substrate 100
includes a first cell region CR1, a second cell region CR2, and a
peripheral region PR therebetween. The semiconductor substrate 100
may be a silicon substrate.
[0031] A first cell array structure CAS1 may be disposed in the
first cell region CR1 and a second cell array structure CAS2 may be
disposed in the second cell region CR2. A peripheral logic
structure PLS may be disposed in the peripheral region PR. The
first cell array structure CAS1 and the second cell array structure
CAS2 may have structures symmetric to each other with respect to
the peripheral region PR.
[0032] The first cell array structure CAS1 may include a first
stacked structure SS1 and a first vertical structure VS1. The first
stacked structure SS1 includes insulating layers IL and first gate
electrodes EL1 that are alternately and repeatedly stacked on the
semiconductor substrate 100. The first vertical structure VS1
penetrates the first stacked structure SS1 toward the substrate
100.
[0033] The first stacked structure SS1 is line-shaped, extending in
a first direction D1. The first stacked structure SS1 may have a
stepped structure for electrical connections between the first gate
electrodes EL1 and the peripheral logic structure PLS. Thicknesses
of the insulating layers IL may be substantially identical to each
other. Alternatively, at least one insulating layer IL may be
different in thickness from the other insulating layers IL. End
portions of the first gate electrodes EL1 form a stepped structure.
For example, the end portions of the first gate electrodes EL1 are
further extended toward the peripheral region PR as the first gate
electrodes EL1 become closer to the top surface of the
semiconductor substrate 100. Accordingly, sidewalls of the first
gate electrodes EL1 toward the peripheral region PR may be disposed
in different horizontal positions along the first direction D1.
[0034] The first vertical structure VS1 penetrates the first
stacked structure SS1 to be connected to the semiconductor
substrate 100. The first vertical structure VS1 includes a vertical
semiconductor pattern VSP and a vertical insulator VI. The vertical
semiconductor pattern VSP penetrates the first stacked structure
SS1 to be electrically connected to the semiconductor substrate
100. The vertical insulator VI is disposed between the vertical
semiconductor pattern VSP and the first stacked structure SS1.
First vertical structures VS1, when viewed from the above, are
arranged in a straight line along the first direction D1 as shown
in FIG. 3. Alternatively, the first vertical structures VS1, when
viewed from the above, may be arranged in a zigzag form along the
first direction D1.
[0035] The vertical semiconductor pattern VSP includes a first
semiconductor pattern 122 and a second semiconductor pattern 120.
The first semiconductor pattern 122 is disposed on an inner wall of
the first stacked structure SS1. The first semiconductor pattern
122 may be pipe-shaped or macaroni-shaped having open top and
bottom ends. The first semiconductor pattern 122 is spaced from the
semiconductor substrate 100 without being in contact with the
semiconductor substrate 100. The second semiconductor pattern 120
may pillar-shaped, filling the inside of the vertical semiconductor
pattern VSP. The second semiconductor pattern 120 is disposed on
the inner wall of the first semiconductor pattern 122 and the
semiconductor substrate 100. The bottom surface of the second
semiconductor pattern 120 is positioned to be lower than the top
surface of the semiconductor substrate 100. For example, the second
semiconductor pattern 120 is partly inserted into the semiconductor
substrate 100. The second semiconductor pattern may electrically
connect the first semiconductor pattern 122 and the semiconductor
substrate 100.
[0036] The first and second semiconductor patterns 122 and 120 may
include a semiconductor material. For example, the first and second
semiconductor patterns 122 and 120 may include Si, Ge, or a mixture
thereof, or may be a semiconductor doped with an impurity or an
intrinsic semiconductor. Additionally, the first and second
semiconductor patterns 122 and 120 may have at last one of
single-crystal, amorphous, and polycrystalline structures.
[0037] The vertical insulator VI is disposed between the first
stacked structure SS1 and the vertical semiconductor pattern VSP.
The vertical insulator VI may pipe-shaped or macaroni-shaped having
open top and bottom ends. The first semiconductor pattern 122 is
spaced from the semiconductor substrate 100 by the bottom part of
the vertical insulating layer VI.
[0038] The vertical insulator VI may include a memory element of a
flash memory device. For example, the vertical insulator VI may
include a charge storage layer of a flash memory device.
Alternatively, the vertical insulator VI may include a charge
storage layer and a tunnel insulating layer, which are stacked
sequentially. The tunnel insulating layer may directly contact the
vertical semiconductor pattern VSP and the charge storage layer may
be disposed between the tunnel insulating layer and the first gate
electrodes EL1. Alternatively, the vertical insulator VI may
further include a blocking insulating layer disposed between the
charge storage layer and the first gate electrodes EL1.
[0039] The charge storage layer may include at least one of a
silicon nitride layer, a silicon oxynitride layer, a Si-rich
nitride layer, a nanocrystalline Si layer, and a laminated trap
layer. The tunnel insulating layer may include a material having an
energy band gap greater than that of the charge storage layer. For
example, the tunnel insulating layer may be a silicon oxide layer.
The blocking insulating layer may include a material having an
energy band gap greater than that of the charge storage layer. For
example, the blocking insulating layer may be a silicon oxide
layer, a silicon nitride layer, and/or a silicon oxynitride
layer.
[0040] The first cell array structure CAS1 further includes first
horizontal structures HS1. The first horizontal structures HS1 are
disposed between the first gate electrodes EL1 and the insulating
layers IL, and between the first gate electrodes EL1 and the
vertical insulator VI. The first horizontal structures HS1 are not
connected to each other. The inventive concept is not limited
thereto, and the first horizontal structures HS1 may connected to
each other in a sinuous manner. In this case, the first horizontal
structures HS1 may be further disposed between the insulating
layers IL and electrode patterns 132. The electrode patterns 132
will be described below. The first horizontal structures HS1 may be
formed of at least one thin film layer. For example, the first
horizontal structures HS1 may include a blocking insulating layer
of a charge trap type flash memory transistor.
[0041] Common source regions CSL are disposed between two adjacent
first stacked structures SS1 on the semiconductor substrate 100.
The common source regions CSL may be line-shaped extending in the
first direction D1. The common source regions may be arranged along
a second direction intersecting the first direction D1. For
example, the common source regions and the first stacked structures
SS1 may be alternately arranged along the second direction.
[0042] A lower insulating layer 105 is disposed between the
semiconductor substrate 100 and the first stacked structure SS1.
For example, the lower insulating layer 105 may be a silicon oxide
layer. The lower insulating layer 105 may be thinner than the
insulating layers IL.
[0043] A conductive pad 130 penetrates the first stacked structure
SS1 to be connected to the first vertical semiconductor pattern
VSP1. The conductive pad 130 may be an impurity region doped with
an impurity or may include a conductive material.
[0044] Electrode patterns 132 may be disposed between two adjacent
first stacked structures SS1. The electrode patterns 132 are
disposed on the common source regions CSL. Alternatively, the
electrode patterns 132 may be a portion of the common source
regions CSL. The electrode patterns 132 may include a metal layer
or a metal-silicide layer. Insulating spacers 133 are disposed
between the electrode patterns 132 and the first gate electrodes
EL1. As such, the electrode patterns 132 are electrically insulated
from the first gate electrodes EL1 by the insulating spacers 133.
The insulating spacers 133 may include at least one of a silicon
oxide layer, a silicon nitride layer, and a silicon oxynitride
layer.
[0045] The second cell array structure CAS2 includes a second
stacked structure SS2 where insulating layers IL and second gate
electrodes EL2 are alternately and repeatedly stacked on the
semiconductor substrate 100 and a second vertical structure VS2
penetrating the second stacked structure SS2.
[0046] The second stacked structure SS2 may be line-shaped
extending in the first direction D1, and may have a stepped
structure for electrical connections between the second gate
electrodes EL2 and the peripheral logic structure PLS. For example,
end portions of the second gate electrodes EL2 have a stepped
structure. For example, the end portions of the second gate
electrodes EL2 are further extended toward the peripheral region PR
as the second gate electrodes EL2 become closer to the top surface
of the semiconductor substrate 100. Accordingly, sidewalls of the
second gate electrodes EL2 toward the peripheral PR may be disposed
in different horizontal positions along the first direction.
[0047] The second vertical structure VS2 penetrates the second
stacked structure SS2 to be connected to the semiconductor
substrate 100. The second vertical structure VS2 may include
substantially the same structure as the first vertical structure
VS1. The second vertical structures VS2, when viewed from the
above, are arranged in a straight line along the first direction D1
as shown in FIG. 3. Alternatively, the second vertical structures
VS2, when viewed from the above, may be arranged in a zigzag form
along the first direction D1.
[0048] The second cell array structure CAS2 includes second
horizontal structures HS2. The second horizontal structures HS2 are
disposed between the second gate electrodes EL2 and the insulating
layers IL, and between the second gate electrodes EL2 and the
vertical insulator VI. The second horizontal structures HS2 may
have substantially the same configuration as the first horizontal
structure HS1.
[0049] Other elements of the first cell region CR1 are included in
the second cell region CR2. For example, common source regions CSL
in the second cell region CR2 are disposed between two adjacent
second stacked structures SS2 on the semiconductor substrate 100. a
lower insulating layer 105 of the second cell region CR2 may be
disposed between the semiconductor substrate 100 and the second
stacked structure SS2. A conductive pad 130 of the second cell
region CR2 may penetrate the second stacked structure SS2 to be
connected to the second vertical semiconductor pattern VSP2.
Electrode patterns 132 of the second cell region CR2 may be
disposed between two adjacent second stacked structures SS2.
[0050] The peripheral logic structure PLS may include N-type Metal
Oxide Semiconductor (NMOS) and/or P-type Metal Oxide Semiconductor
(PMOS) transistors electrically connected to the cell array
structures CAS1 and/or CAS2. For example, a device isolation layer
PI defining a peripheral active pattern PA is disposed on the
semiconductor substrate 100 in the peripheral region PR. The
peripheral logic structure PLS includes a peripheral gate structure
PGS extending in the first direction D1, as crossing the peripheral
active pattern PA, source and drain regions 170 formed in the
peripheral active pattern PA at both sides of the peripheral gate
structure PGS, and a peripheral insulating pattern 172 covering the
peripheral gate structure PGS and the source and drain regions 170.
The peripheral gate structure PGS includes a gate dielectric
pattern 160, a peripheral gate electrode 162, and a peripheral
capping pattern 164, which are sequentially stacked on the
semiconductor substrate 100. The peripheral gate structure PGS
further includes a gate spacer 166 on both sidewalls of the
peripheral gate electrode 162.
[0051] Referring to FIG. 5, the peripheral active pattern PA is
formed on a straight line parallel to a reference axis a of the
second direction D2. The semiconductor substrate 100 may include a
silicon crystal structure. The reference axis a of the peripheral
active pattern PA, when viewed from the above, intersects at an
oblique angle .theta. with an intersection line L where a {111}
plane P of the silicon crystal structure meets with a top surface
100U of the semiconductor substrate 100. The oblique angle .theta.
between the reference axis a of the peripheral active pattern PA
and the intersection line L may be greater than 0.degree. and be
less than or equal to about 45.degree.. The oblique angle .theta.
may include an angle error of .+-.1.degree. which may occur when a
wafer is formed. The source and drain regions 170 formed in the
peripheral active pattern PA is spaced from each other along the
second direction D2.
[0052] While each of the stacked structures SS1 and SS2 is formed
on the semiconductor substrate 100 of the cell regions CR1 and CR2,
a tensile stress F may be applied to the semiconductor substrate
100 in the peripheral region PR. The tensile stress F may result
from layers that are vertically stacked on the semiconductor
substrate 100 in the cell regions CR1 and CR2. When the tensile
stress F is applied to the semiconductor substrate 100 in the
peripheral area PR, bonding between silicon atoms on a {111} plane
P of the silicon crystal structure may be broken. For example,
dangling bond between silicon atoms on the {111} plane P may be
formed and electrons may move easily through the dangling bond.
[0053] From a planar point of view, when one pair of source and
drain regions 170 formed in one peripheral active pattern PA is
disposed on the intersection line L and thus the source and drain
regions 170 are connected to each other by the intersection line L,
a current path connecting the source and drain regions 170 may
occur along the intersection line L by the dangling bond between
silicon atoms on the {111} surface P. Accordingly, leakage current
may occur between the source and drain regions 170.
[0054] According to an embodiment of the inventive concept, the one
pair of source and drain regions 170 formed in one peripheral
active pattern PA may be disposed on the reference axis a from a
planar point of view and the reference axis a of the peripheral
active pattern PA may form an oblique angle with the intersection
line L. For example, the source and drain regions 170 may not be
connected to each other by the intersection line L. Accordingly,
even when dangling bond between silicon atoms on the {111} plane P
is formed, a current path connecting the source and drain regions
170 may not occur. Accordingly, a semiconductor device having
reduced leakage current may be provided.
[0055] Referring back to FIGS. 3 and 4, a buried insulating layer
114 covering the cell array structures CAS1 and CAS2 and the
peripheral logic structure PLS is disposed on the semiconductor
substrate 100. The buried insulating layer 114 includes a
planarized top surface, covering the end portions of the first and
second stacked structures SS1 and SS2. An interlayer insulating
layer 115 is disposed on the buried insulating layer 114.
[0056] Bit lines BL crossing each of the stacked structures SS1 and
SS2 and extending in the second direction D2 are disposed on the
interlayer insulating layer 115 in the cell regions CR1 and CR2.
The bit lines BL are electrically connected to the vertical
structures VS1 and VS2 through bit line contact plugs 140.
[0057] Furthermore, a wiring structure that electrically connects
the cell array structures CAS1 and CAS2 and the peripheral logic
structure PLS may be disposed on the interlayer insulating layer
115 in the cell regions CR1 and CR2. For example, cell plugs 150
penetrate the buried insulating layer 114 to be connected to the
end portions of the gate electrodes EL1 and EL2. As the cell plugs
150 are closer to the peripheral region PR, the vertical length of
the cell plugs 150 increase. Cell connection lines 154, disposed on
the interlayer insulating layer 115, are electrically connected to
the cell plugs 150 through cell contacts 152. The cell contacts 152
penetrates the interlayer insulating layer 115 to connect the cell
plugs 150 and the cell connection lines 154.
[0058] A peripheral wire 182 is disposed on the interlayer
insulating layer 115 in the peripheral region PR. The peripheral
wire 182 may be provided in plurality. The peripheral wires 182 may
be electrically connected to the peripheral gate structure PGS and
the source and drain regions 170 through peripheral contact plugs
180 and peripheral contact pads 181 penetrating the buried
insulating layer 114.
[0059] FIGS. 6 to 9 are sectional views taken along lines I-I',
II-I', and III-III' of FIG. 3 and illustrate a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the inventive concept.
[0060] Referring to FIG. 6, a semiconductor substrate 100 having a
silicon crystal structure may be provided. For example, the
semiconductor substrate 100 may be a silicon wafer. The
semiconductor substrate 100 may have a flat zone formed on a {100}
plane of a silicon crystal structure, as shown in FIG. 3. However,
the semiconductor substrate 100 may have a flat zone formed on a
{110} plane of a silicon crystal structure. This case will be
described with reference to FIG. 10.
[0061] The semiconductor substrate 100 includes a cell region CR
and a peripheral region PR. A device isolation layer PI defining a
peripheral active pattern PA is formed on the semiconductor
substrate 100 in the peripheral region PR. As shown in FIGS. 3 and
5, the peripheral active pattern PA is extended along the reference
axis a that is in parallel to the second direction D2. The
peripheral gate structure PGS is extended in the first direction D1
crossing the second direction D2. In this case, source/drain
regions 170 are disposed at both sides of the peripheral gate
structure PGS along the reference axis a. The reference axis a may
be in parallel to a <100> direction of the semiconductor
substrate 100.
[0062] The reference axis a, as described with reference to FIG. 5,
crosses at an oblique angle .theta. the intersection line L where
the {111} plane P meets the top surface 100U of the {100} plane in
the semiconductor substrate 100. In this case, the intersection
line L has a <110> crystallographic direction, and thus the
oblique angle .theta. between the reference axis a and the
intersection line L is about 45.degree.. The inventive concept is
not limited thereto, and the oblique angle .theta. may be greater
than about 1.degree. and less than about 45.degree.. The oblique
angle .theta. may include an angle error of .+-.1.degree. which may
occur when a wafer is formed.
[0063] The peripheral gate structure PGS crossing the peripheral
active pattern PA and extending in the first direction D1
perpendicular to the second direction D2 is formed on the
semiconductor substrate 100 in the peripheral area PR. The forming
of the peripheral gate structure PGS may include sequentially
stacking a peripheral gate dielectric layer, a peripheral gate
electrode layer, and a peripheral capping layer on the
semiconductor substrate 100 and forming a peripheral gate
dielectric pattern 160, a peripheral gate electrode 162, and a
peripheral capping pattern 164 by patterning the peripheral capping
layer, the peripheral gate electrode layer, and the peripheral gate
dielectric layer. The forming of the peripheral gate structure PGS
further includes forming a peripheral gate spacer 166 on both
sidewalls of the peripheral gate electrode 162. The peripheral gate
electrode 162 may include poly silicon doped with an impurity or a
metallic material. The peripheral gate dielectric pattern 160 may
include silicon oxide formed by a thermal oxidation process. The
peripheral capping pattern 164 may include silicon nitride, for
example, and the peripheral gate spacer 166 may include silicon
oxide and/or silicon nitride.
[0064] Source and drain regions 170 are formed in the peripheral
active pattern PA at both sides of the peripheral gate structure
PGS. The forming of the source and drain regions 170 may include
injecting an impurity onto the semiconductor substrate 100 at both
sides of the peripheral gate structure PGS. For example, the source
and drain regions 170 are arranged along the reference axis a of
the peripheral active pattern PA that is in parallel to the second
direction D2. Accordingly, the source and drain regions 170 need
not be arranged in parallel to a direction where the intersection
line L is extended.
[0065] A peripheral insulating pattern 172 covering the peripheral
gate structure PGS and the source and drain regions 170 is formed
on the semiconductor substrate 100 in the peripheral region PR. The
peripheral insulating pattern 172 may be formed of a silicon oxide,
for example. The peripheral gate structure PGS, the source and
drain regions 170, and the peripheral insulating pattern 172
constitutes a peripheral logic structure PLS.
[0066] A thin film structure TS where sacrificial layers 107 and
insulating layers IL are alternately and repeatedly deposited is
formed on the semiconductor substrate 100 in the cell region
CR.
[0067] The sacrificial layers 107 may be formed of a material
having etch selectivity with respect to the insulating layers IL.
According to an embodiment of the inventive concept, the
sacrificial layers 107 and the insulating layers IL may have a high
etch selectivity in a wet etching process using chemical solution
and have a low etch selectivity in a dry etching process using
etching gas.
[0068] The sacrificial layers 107 may be formed to have
substantially the same thickness as each other. Alternatively, the
inventive concept is not limited thereto, and the sacrificial
layers 107 may include at least one sacrificial layer different in
thickness from other sacrificial layers. For example, the uppermost
and lowermost sacrificial layers 170 among the sacrificial layers
170 may be formed to be thinner than the sacrificial layers 170
therebetween. The insulating layers IL may have substantially the
same thickness as each other or may include at least one insulating
layer different in thickness from other insulating layers.
[0069] An end portion of the thin film structure TS adjacent to the
peripheral region PR may have a stepped structure. For example, as
the insulating layers IL and the sacrificial layers 107 become
increasingly closer to the top surface of the semiconductor
substrate 100, the end portion of the insulating layers IL and the
sacrificial layers 107 are extended further toward the peripheral
region PR. As the sacrificial layers 107 become increasingly
distant from the top surface of the semiconductor substrate 100,
the distance between sidewalls of the sacrificial layers 107 and
the peripheral region PR is increased. For example, the forming of
the thin film structure TS may include alternately forming
insulating layers IL and sacrificial layers 107 on the
semiconductor substrate 100. The insulating layers IL and the
sacrificial layers 107 may be patterned by repeatedly etching the
insulting layers IL and the sacrificial layers 107 using a mask
pattern. The horizontal area of the mask pattern (not shown) may be
reduced such that the end portions of the insulating layers IL are
sequentially exposed in the etching process and the stepped
structure is formed at the end portion of the thin film structure
TS. The insulating layers IL and the sacrificial layers 107 may be
anisotropically etched. After the forming of the peripheral logic
structure PLS and the thin film structure TS, a buried insulating
layer 114 is formed on the semiconductor substrate 100. The buried
insulating layer 114 covers the thin film structure TS having the
stepped structures formed in the cell region CR and the peripheral
logic structure PLS formed the peripheral region PR through a
deposition technique. A planarization process may be performed on
the buried insulating layer 114. Accordingly, the buried insulating
layer 114 may have a planarized top surface. For example, the
buried insulating layer 114 may be formed of oxide including a High
Density Plasma (HDP) oxide layer, TetraEthylOrthosilicate (TEOS),
Plasma Enhanced TetraEthylOrthoSilicate (PE-TEOS), 03-Tetra
EthylOrthoSilicate (TEOS), Undoped Silicate Glass (USG),
PhosphoSilicate Glass (PSG), Borosilicate Glass (BSG),
BoroPhosphoSilicate Glass (BPSG), Fluoride Silicate Glass (FSG),
Spin On Glass (SOG), Tonen SilaZene (TOSZ), or a mixture thereof.
Alternatively, the buried insulating layer 114 may include a
silicon nitride, a silicon oxynitride, or a low-k material.
[0070] Referring to FIG. 7, a vertical structure VS penetrating the
thin film structure TS is formed on the semiconductor substrate 100
in the cell region CR. The forming of the vertical structure VS may
include forming a through hole 110 penetrating the thin film
structure TS to expose the semiconductor substrate 100 and forming
a vertical insulator VI and a vertical semiconductor pattern VSP in
the through hole 110.
[0071] The forming of the through hole 110 may include forming a
mask pattern (not shown) on the thin film structure TS and
anisotropically etching the thin film structure TS by using the
mask pattern (not shown) as an etching mask. During the anisotropic
etching process, the top of the semiconductor substrate 100 may be
over-etched, and accordingly, the top surface of the semiconductor
substrate 100 exposed by the through hole 110 may be recessed in a
predetermined depth. The inner sidewall of the through hole 110 may
be sloped such that the through hole 110 becomes narrower
downwardly. The through holes 110, when viewed from the above, are
arranged in a straight line or in a zigzag manner along the first
direction D1.
[0072] The forming of the vertical insulator VI and the vertical
semiconductor pattern VSP may include forming the vertical
insulator VI and a first semiconductor pattern 122 filling a
portion of the through hole 110 and exposing the top surface of the
semiconductor substrate 100 and forming a second semiconductor
pattern 120 filling the remaining of the through hole 10.
[0073] The forming of the vertical insulator VI and the first
semiconductor pattern 122 may include sequentially forming a
vertical insulating layer and a first semiconductor layer covering
the inner wall of the through hole 110 and anisotropically etching
the vertical insulating layer and the first semiconductor
layer.
[0074] The vertical insulating layer and the first semiconductor
layer may be formed to fill a portion of the through hole 110. The
total thicknesses of the vertical insulating layer and the first
semiconductor layer may be less than half the width of the through
hole 110. For example, the through hole 110 need not be completely
filled with the vertical insulating layer and the first
semiconductor layer. Furthermore, the vertical insulating layer may
cover the top surface of the semiconductor substrate 100 exposed by
the through hole 110. The vertical insulating layer may be formed
of thin films that may be deposited through a plasma enhanced CVD,
physical CVD, or Atomic Layer Deposition (ALD) technique, for
example.
[0075] The vertical insulating layer may include a charge storage
layer used as a memory element of a flash memory device. For
example, the charge storage layer may be a trap insulating layer or
an insulating layer including conductive nano dots. Alternatively,
the vertical insulating layer may include a thin film for phase
change memory or a thin film for variable resistance memory.
[0076] The vertical insulating layer may include a blocking
insulating layer, a charge storage layer, and a tunnel insulating
layer, which are sequentially stacked. The blocking insulating
layer may cover the sidewalls of the sacrificial layers 107 and the
insulating layers IL exposed by the through hole 110 and the top
surface of the semiconductor substrate 100. The blocking insulating
layer may be formed of a silicon oxide layer. For example, the
charge storage layer may include a trap insulating layer or an
insulating layer including conductive nano dots. For example, the
charge storage layer may include at least one of a silicon nitride
layer, a silicon oxynitride layer, a Si-rich nitride layer, a
nanocrystalline Si layer, and a laminated trap layer. The tunnel
insulating layer may be formed of one of materials having a greater
energy band gap than that of the charge storage layer. For example,
the tunnel insulating layer may be a silicon oxide layer.
[0077] The first semiconductor layer may be formed on the vertical
insulating layer. The first semiconductor layer may be a
semiconductor material layer (for example, a polycrystalline
silicon layer, a single crystal silicon layer, or an amorphous
silicon layer), which may be formed using one of ALD or CVD
technique.
[0078] After the vertical insulating layer and the first
semiconductor layer are formed sequentially, the semiconductor
substrate 100 may be exposed by anisotropically etching the first
semiconductor layer and the vertical insulating layer. Accordingly,
the first semiconductor pattern 122 and the vertical insulator VI
may be formed in the inner wall of the through hole 110. The
vertical insulator VI and the first semiconductor pattern 122 may
be formed in a cylindrical form having both ends opened. While the
first semiconductor layer and the vertical insulating layer are
anisotropically etched, as a result of over-etch, the top surface
of the semiconductor substrate 100 exposed by the first
semiconductor pattern 122 and the vertical insulating layer VI may
be recessed.
[0079] Moreover, during the anisotropic etching process, a portion
of the vertical insulating layer below the first semiconductor
pattern 122 need not be etched, because the vertical insulator VI
may have a bottom disposed between the bottom surface of the first
semiconductor pattern 122 and the top surface of the semiconductor
substrate 100.
[0080] Furthermore, while the first semiconductor layer and the
vertical insulating layer are anisotropically etched, the top
surface of the buried insulating layer 114 may be exposed.
Accordingly, the vertical insulator VI and the first semiconductor
pattern 122 may be locally formed in the through hole 110.
[0081] The forming of the second semiconductor pattern 120 may
include forming a second semiconductor layer filling the remaining
of the through hole 110 and planarizing the second semiconductor
layer.
[0082] For example, a second semiconductor layer may be formed in
the through hole 110 having the vertical insulator VI and the first
semiconductor pattern 122. The second semiconductor layer may
connect the semiconductor substrate 100 and the first semiconductor
pattern 122. The second semiconductor layer, for example, may
include a polycrystalline silicon layer, a single crystal silicon
layer, or an amorphous silicon layer. Then, by exposing the top
surface of the buried insulating layer 114 after planarizing the
second semiconductor layer, the second semiconductor pattern 120 is
locally formed in the through hole 110.
[0083] The second semiconductor pattern 120 may be formed in a
pillar form filling the through hole 110. Alternatively, the second
semiconductor pattern 120 may have a pipe form with one end closed,
a hollow cylindrical form with one end closed, or a cup form.
[0084] The first semiconductor pattern 122 and the second
semiconductor pattern 120 are defined as the vertical semiconductor
pattern VSP and the vertical insulator VI and the vertical
semiconductor pattern VSP are defined as the vertical structure
VS.
[0085] Then, a conductive pad 130 connected to the vertical
semiconductor pattern VSP is formed. The conductive pad 130 may be
formed by recessing the top end of the vertical structure VS and
then filling the recessed area with a conductive material.
Alternatively, the conductive pad 130 may be formed to be doped
with a different conductive type impurity than the first and second
semiconductor patterns 122 and 120. A diode may be formed by the
interface between the conductive pad 130 and the vertical structure
VS.
[0086] Referring to FIG. 8, a trench 131 exposing the semiconductor
substrate 100 is formed by patterning the thin film structure
TS.
[0087] The trench 131 may expose the sidewalls of the sacrificial
layers 107 and the insulating layers IL, being spaced apart from
the vertical structure VS. The trench 131, when viewed from the
above, may be formed in a line form or a rectangular form. The
trench 131 exposes the top surface of the semiconductor substrate
100. The trench 131 may be formed by performing an anisotropic
etching process and the top of the semiconductor substrate 100 may
be over-etched by the etching process.
[0088] The thin film structure TS, when viewed from the above, may
be divided into line forms by the trench 131. For example, the
trench 131 penetrates the thin film structure TS, and the line
forms are separated by the trench 131. Each of the line forms may
include the sacrificial layers 107 and the insulating layers IL
patterned by the trench. The sacrificial layers 107, the insulating
layers IL and the substrate 100 may be exposed by the trench
131.
[0089] Then, by removing the sacrificial layers 107 exposed by the
trench 131, recess regions R are formed between the insulating
layers IL patterned by the trench 131.
[0090] For example, the recess regions R may be formed by
isotropically etching the sacrificial layers 107. The etching
conditions may have etch selectivity of the sacrificial layers 107
with respect to the insulating layers IL and the vertical insulator
VI. The sacrificial layers 107 are completely removed by the
isotropic etching process. For example, when the sacrificial layers
107 are a silicon nitride layer and the insulating layers IL is a
silicon oxide layer, the etching process may be performed by using
an etchant including phosphate.
[0091] Referring to FIG. 9, horizontal structures HS and gate
electrodes EL are formed in the recess regions R. The horizontal
structures HS are conformally formed on the inner walls of the
recess regions R. The gate electrodes EL are disposed on the
horizontal structures HS, filling the remaining spaces of the
recess regions R.
[0092] The forming of the horizontal structures HS and the gate
electrodes EL may include forming a horizontal insulating layer and
a conductive layer that sequentially cover the recess regions R and
locally forming the horizontal structures HS and the gate
electrodes EL in the recess regions R by removing the horizontal
insulating layer and the conductive layer in the trench 131.
[0093] The horizontal insulating layer may be formed at least one
thin film layer, like the vertical insulating layer. For example,
the horizontal insulating layer may include a blocking insulating
layer of a charge trap type flash memory. For example, the blocking
insulating layer may be formed of high-k dielectric layers such as
an aluminum oxide layer and a hafnium oxide layer.
[0094] The forming of the conductive layer may include sequentially
depositing a barrier metallic layer and a metallic layer. The
barrier metallic layer may include a metallic nitride layer formed
of TiN, TaN, or WN and the metallic layer may include a metallic
material such as W, Al, Ti, Ta, Co, or Cu.
[0095] A stacked structure SS includes the gate electrodes EL and
the insulating layers IL stacked on each other. The stacked
structure SS, the vertical structure VS, and the horizontal
structures HS may constitute cell array structures CAS1 and CAS2,
as shown in FIG. 3.
[0096] A common source region CSL is formed on the substrate 100.
For example, after the forming of the gate electrodes EL, the
common source region CSL may be formed on the semiconductor
substrate 100. Alternatively, the common source region CSL may be
formed by performing an ion implantation process on the
semiconductor substrate 100 exposed by the trench 131. Furthermore,
an electrode pattern 132 is formed in the trench 131. The electrode
pattern 132 may include metal and metal silicide. An insulating
spacer 133 is formed between the electrode pattern 132 and the gate
electrodes EL. The insulating spacer 133 electrically separates the
gate electrodes EL from the electrode pattern 132. The insulating
spacer 133 may include at least one of a silicon oxide layer, a
silicon nitride layer, and a silicon oxynitride layer.
[0097] Referring back to FIGS. 3 and 4, a bit line contact plug 140
is formed to the conductive pad 130 and a bit line BL. The bit line
contact plug 140 is formed on the cell array structures CAS1 and
CAS2. The bit line BL is electrically connected to the first and
second semiconductor patterns 122 and 120 through the bit line
contact plug 140. The bit line BL is spaced apart from the cell
array structures CAS1 and CAS2 by an interlayer insulating layer
115.
[0098] Furthermore, a wiring structure for electrically connecting
the cell array structure CAS and the peripheral logic structure PLS
is formed on the interlayer insulating layer 115 of the cell
regions CR1 and CR2. The wiring structure may include cell plugs
150. The cell plugs 150 penetrating the buried insulating layer 114
are connected to the end portions of the gate electrodes EL. As the
cell plugs 150 become closer to the peripheral region PR, the
vertical length of the cell plugs 150 increases. The wiring
structure further include cell connection lines 154 that are
electrically connected to the cell plugs 150 through the cell
contacts 152. The cell connection lines 154 are formed on the
interlayer insulating layer 115.
[0099] The wiring structure further includes a peripheral wire 182
that is formed on the interlayer insulating layer 115 in the
peripheral region PR. Although not shown in the drawing, the
peripheral wires 182 may be electrically connected to the
peripheral gate structure PGS and the source and drain regions 170
through the peripheral contact plugs 180 and the peripheral contact
pads 181 penetrating the buried insulating layer 114.
[0100] FIG. 10 is a plan view of a semiconductor device according
to an exemplary embodiment of the inventive concept. The same
reference numerals may refer to the same configuration of the
semiconductor device of FIGS. 3 to 5 and thus, the descriptions
thereof may be omitted. Sectional views of FIG. 10 taken along
lines I-I', II-II', III-III', IV-IV', and V-V' are substantially
identical to those of FIG. 4.
[0101] Referring to FIGS. 4 and 10, the semiconductor substrate 100
includes a first cell region CR1, a second cell region CR2, and a
peripheral region PR therebetween. The semiconductor substrate 100
may be a silicon substrate.
[0102] A first cell array structure CAS1 is disposed in the first
cell region CR1 of the semiconductor substrate 100. A second cell
array structure CAS2 is disposed in the second cell region CR2 of
the semiconductor substrate 100. A peripheral logic structure PLS
is disposed in the peripheral region PR of the semiconductor
substrate 100. The first cell array structure CAS1 may be
substantially symmetric to the second cell array structure CAS2
with respect to the peripheral region PR.
[0103] The first cell array structure CAS1 includes a first stacked
structure SS1 where insulating layers IL and first gate electrodes
EL1 are alternately and repeatedly stacked on the semiconductor
substrate 100. A first vertical structure VS1 penetrates the first
stacked structure SS1. The first stacked structure SS1 is
linear-shaped, extending in a first direction D1. The second cell
array structure CAS2 includes a second stacked structure SS2 where
insulating layers IL and second gate electrodes EL2 are alternately
and repeatedly stacked on the semiconductor substrate 100. A second
vertical structure VS2 penetrates the second stacked structure SS2.
The second stacked structure SS2 is line-shaped, extending in the
first direction D1.
[0104] A device isolation layer PI defining a peripheral active
pattern PA may be disposed on the semiconductor substrate 100 in
the peripheral region PR, as shown in FIG. 4. The peripheral logic
structure PLS includes a peripheral gate structure PGS crossing the
peripheral active pattern PA, source and drain regions 170 formed
in the peripheral active pattern PA at both sides of the peripheral
gate structure PGS, and a peripheral insulating pattern 172
covering the peripheral gate structure PGS and the source and drain
regions 170. The peripheral gate structure PGS extends in a third
direction D3 that intersects the first direction D1 and a second
direction D2 intersecting the first direction D1.
[0105] Referring back to FIGS. 5 and 10, the peripheral active
pattern PA extends along a reference axis a of a fourth direction
D4 that intersects the first direction D1, the second direction D2,
and the third direction D3. The semiconductor substrate 100 may
have a silicon crystal structure. The reference axis a of the
peripheral active pattern PA crosses at an oblique angle .theta.
with an intersection line L where a {111} plane P of the silicon
crystal structure meets a top surface 100U of the semiconductor
substrate 100. The angle .theta. between the reference axis a of
the peripheral active pattern PA and the intersection line L may be
greater than 0.degree. and be less than or equal to about
45.degree.. The angle .theta. may include an angle error of
.+-.1.degree. which may occur when a wafer is manufactured. The
source and drain regions 170 formed in the peripheral active
pattern PA, when viewed from the above, are spaced apart from each
other along the fourth direction D4.
[0106] FIG. 11 is a plan view illustrating a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the inventive concept. Sectional views of FIG. 11
taken along lines I-I', II-II', and III-III' are substantially
identical to those of FIG. 6. The same reference numerals may refer
to the same configuration of the semiconductor device of FIGS. 6 to
9 and thus, the descriptions thereof may be omitted.
[0107] Referring to FIGS. 6 and 11, a semiconductor substrate 100
having a silicon crystalline structure may be provided. For
example, the semiconductor substrate 100 may be a silicon wafer.
The semiconductor substrate 100 may have a flat zone formed on a
{110} plane of the silicon crystal structure, as shown in FIG.
10.
[0108] The semiconductor substrate 100 includes a cell region CR
and a peripheral region PR. A device isolation layer PI defining a
peripheral active pattern PA is formed on the semiconductor
substrate 100 in the peripheral region PR. The peripheral active
pattern PA, as described with reference to FIGS. 5 and 10, extends
along a reference axis a of a fourth direction D4. The reference
axis a may be parallel to a <100> direction of the silicon
crystal structure. An intersection line L is a line where a {111}
plane P of the silicon crystal structure meets with a top surface
100U of the semiconductor substrate 100. The oblique angle .theta.
between the reference axis a of the peripheral active pattern PA
and the intersection line L may be greater than about 0.degree. and
be less than or equal to about 45.degree.. The oblique angle
.theta. may include an angle error of .+-.1.degree. which may occur
when a wafer is formed.
[0109] A peripheral gate structure PGS crossing the peripheral
active pattern PA and extending in a third direction D3
substantially perpendicular to the fourth direction D4 is formed on
the semiconductor substrate 100 in the peripheral area PR. Source
and drain regions 170 are formed in the peripheral active pattern
PA at both sides of the peripheral gate structure PGS. For example,
a pair of source and drain regions 170 is formed along the
reference axis a at both sides of the peripheral gate structure
PGS, and the source and drain regions 170 are spaced apart from
each other in the fourth direction D4. The reference axis a is in
parallel to the fourth direction D4. For example, the source and
drain regions 170 need not be arranged in a direction where the
intersection line L is extended.
[0110] A thin film structure TS where sacrificial layers 107 and
insulating layers IL are alternately and repeatedly deposited may
be formed on the semiconductor substrate 100 in the cell region CR.
An end portion of the thin film structure TS may have a cascade
structure. The thin film structure may be formed to have outer
walls TSw extending along the first direction D1 that intersects
the third direction D3 and the fourth direction D4 from a planar
point of view.
[0111] After the forming of the peripheral logic structure PLS and
the thin film structure TS, a buried insulating layer 114 may be
formed on the semiconductor substrate 100. Processes after this are
identical to those in the method of manufacturing a semiconductor
device described with reference to FIGS. 7 to 9.
[0112] FIG. 12 is a sectional view of a semiconductor device
according to an exemplary embodiment of the inventive concept. The
same reference numerals may refer to the same elements of the
semiconductor device of FIGS. 3 to 5 and thus, the descriptions
thereof may be omitted.
[0113] Referring to FIG. 12, the semiconductor device includes a
peripheral logic structure PLS on a semiconductor substrate 100, a
cell array structure CAS disposed on the peripheral logic structure
PLS, and an intermediate substrate 102 interposed between the
peripheral logic structure PLS and the cell array structure CAS.
For example, the semiconductor substrate 100 may be a silicon
substrate. A device isolation layer PI defining a peripheral active
pattern PA is formed on the semiconductor substrate 100.
[0114] Referring to FIGS. 5 and 12, the peripheral logic structure
PLS includes a peripheral gate structure PGS crossing the
peripheral active pattern PA, source and drain regions 170 formed
in the peripheral active pattern PA at both sides of the peripheral
gate structure PGS, and a peripheral insulating pattern 172
covering the peripheral gate structure PGS and the source and drain
regions 170.
[0115] For example, the source and drain regions 170 of the
peripheral active pattern PA, when viewed from the above, are
arranged in a reference axis a and are disposed at both sides of
the peripheral gate structure PGS. The semiconductor substrate 100
may have a silicon crystal structure. The reference axis a of the
peripheral active pattern PA may form an oblique angle .theta. with
an intersection line L where a {111} plane P and a top surface 100U
of the silicon semiconductor substrate 100 meet. The oblique angle
.theta. may be greater than about 0.degree. and be less than or
equal to about 45.degree.. The oblique angle .theta. may include an
angle error of .+-.1.degree. which may occur when a wafer is
manufactured. The source and drain regions 170 formed in a
peripheral active pattern PA are spaced apart from each other along
the reference axis a and accordingly, the source and drain regions
170 are not arranged along the intersection line L.
[0116] A peripheral wire 182 is disposed on the semiconductor
substrate 100. The peripheral wire 182 is connected to the source
and drain regions 170 through the peripheral contact plug 180
penetrating the peripheral insulating pattern 172. The peripheral
gate structure PGS may form a current path between the source and
drain regions 170. The gate structure PGS, and the source and drain
regions 170 may constitute a transistor. Leakage current of the
transistor may be reduced when the current path between the source
and drain regions 170 is not on {111}plane where a highest leakage
current path may be formed.
[0117] The cell array structure CAS is disposed on the intermediate
substrate 102. The cell array structure CAS includes a stacked
structure SS wherein insulating layers IL and gate electrodes EL
are alternately and repeatedly stacked on the intermediate
substrate 102.
[0118] The cell array structure CAS includes a vertical structure
VS penetrating the stacked structure SS to be connected to the
intermediate substrate 102. The vertical structure VS includes a
vertical semiconductor pattern VSP penetrating the stacked
structure SS to be electrically connected to the intermediate
substrate 102 and a vertical insulating layer VI between the
vertical semiconductor pattern VSP and the stacked structure SS.
The vertical semiconductor pattern VSP includes a first
semiconductor pattern 122 and a second semiconductor pattern
120.
[0119] The cell array structure CAS includes horizontal structures
HS disposed between the gate electrodes EL and the insulating
layers IL. The horizontal structures HS are disposed between the
gate electrodes EL and the vertical insulator VI and between the
gate electrodes EL and the insulating layers IL.
[0120] A lower insulating layer 105 is disposed between the
intermediate substrate 102 and the stacked structure SS. A
conductive pad 130 penetrates the stacked structure SS to be
connected to the vertical semiconductor pattern VSP. Common source
regions CSL are disposed on the intermediate substrate 102 at both
sides of the stacked structure SS. Electrode patterns 132 are
disposed at both sides of the stacked structure SS to cover the
common source regions CSL. An insulating spacer 133 is disposed
between the electrode patterns 132 and the gate electrodes EL.
[0121] A bit line crossing the stacked structure SS is disposed on
the stacked structure SS. The bit line BL is electrically connected
to the conductive pad 130 through a bit line contact plug 140 and
is spaced apart from the stacked structure SS by an interlayer
insulating layer 115.
[0122] FIG. 13 is a sectional view illustrating a method of
manufacturing a semiconductor device according to an exemplary
embodiment of the inventive concept. The same reference numerals
may refer to the same elements of the semiconductor device of FIGS.
6 to 9 and thus, descriptions thereof may be omitted.
[0123] Referring to FIG. 13, a semiconductor substrate 100 having a
silicon crystal structure is provided. For example, the
semiconductor substrate 100 may be a silicon wafer. A device
isolation layer PI defining a peripheral active pattern PA is
formed on the semiconductor substrate 100.
[0124] As described with reference to FIG. 5, the peripheral active
pattern PA, when viewed from the above, may have a reference axis a
along which the source and the drain regions are aligned. For
example, the reference axis a may cross an intersection line L at
an oblique angle .theta. therebetween. The intersection line L is a
line where a {111} plane P of the silicon crystal structure and a
top surface 100U of the semiconductor substrate 100 meet. The angle
.theta. between the reference axis a of the peripheral active
pattern PA and the intersection line L may be an angle between
about 0.degree. and about 45.degree., or may be about 45.degree..
The angle .theta. may include an angle error of .+-.1.degree. which
may occur when a wafer is manufactured.
[0125] A peripheral gate structure PGS crossing the peripheral
active pattern PA is formed on the semiconductor substrate 100.
Source and drain regions 170 are formed in the peripheral active
pattern PA at both sides of the peripheral gate structure PGS. The
source and drain regions 170 formed in a peripheral active pattern
PA, as described with reference to FIG. 5, are spaced apart from
each other along the reference axis a. For example, the source and
drain regions 170 are not arranged along the intersection line
L.
[0126] A peripheral wire 182 electrically connected to the
peripheral gate structure and the source and drain regions 170
through a peripheral contact plug 180 is formed on the
semiconductor substrate 100. Then, a peripheral insulating pattern
182 covering the peripheral gate structure PGS, the source and
drain regions 170, the peripheral contact plug 180, and the
peripheral wire 182 is formed on the semiconductor substrate 100.
By performing a planarization process on the peripheral insulating
pattern 182, the peripheral insulating pattern 172 has a planarized
top surface. The peripheral gate structure PGS, the source and
drain regions 170, and the peripheral insulating pattern 172 are
defined as a peripheral logic structure.
[0127] An intermediate substrate 102 is formed on the peripheral
insulating pattern 172. The intermediate substrate 102 may be
formed of a semiconductor layer having a single crystal or
polycrystalline structure. For example, the intermediate substrate
102 may be formed of a poly silicon layer. The intermediate
substrate 102 may be formed by performing a deposition process such
as CVD, for example.
[0128] A lower insulating layer 105 is formed on the intermediate
substrate 102 and a thin film structure TS is formed by alternately
and repeatedly depositing sacrificial layers 107 and insulating
layers IL on the lower insulating layer 105.
[0129] Processes after this are identical to those in the method of
manufacturing a semiconductor device described with reference to
FIGS. 7 to 9.
[0130] According to an exemplary embodiment of the inventive
concept, the peripheral active pattern PA having the reference axis
a in one direction from a planar point of view may be formed on the
semiconductor substrate including a silicon crystal structure. The
source and drain regions 170 formed in a peripheral active pattern
PA may be spaced apart from each other along the reference axis a
of the peripheral active pattern PA from a planar point of view.
The reference axis a of the peripheral active pattern PA may form
an oblique angle with the intersection line L where the {111} plane
P of a silicon crystal structure and the top surface of the
semiconductor substrate meet. The source and drain regions 170 need
not be arranged in a direction where the intersection line L is
extended. Accordingly, even when a dangling bond is formed between
silicon atoms in the {111} plane, a current path connecting the
source and drain regions 170 does not occur, so that a leakage
current may be decreased between the source and drain regions 170.
Therefore, a semiconductor device having reduced leakage current
may be provided.
[0131] FIG. 14 is a schematic block diagram of a memory system
including a three-dimensional semiconductor memory device according
to an exemplary embodiment of the inventive concept.
[0132] Referring to FIG. 14, the memory system 1100 may be applied
to a PDA, a portable computer, a web tablet, a wireless phone, a
mobile phone, a digital music player, a memory card, or all devices
transmitting/receiving information in a wireless environment.
[0133] The memory system 1100 includes a controller 1110, an
input/output device 1120 such as a keypad, a keyboard, and a
display, a memory 1130, an interface 1140, and a bus 1150. The
memory 1130 and the interface 1140 communicate with each other
through the bus 1150.
[0134] The controller 1110 includes at least one micro processor, a
digital signal processor, a micro controller, and other process
devices similar thereto. The memory 1130 may be used for storing
instructions executed by the controller 1110. The input/output
device 1120 may receive/output data or signals from/to the outside
of the memory system 1100. For example, the input/output device
1120 may include a keyboard, a keypad, or a display device.
[0135] The memory 1130 includes a three-dimensional semiconductor
memory device according to an exemplary embodiment of the inventive
concept. The memory 1130 may further include various memories such
as a random access volatile memory.
[0136] The interface 1140 may transmit data to a communication
network or receive data from a network.
[0137] A three-dimensional semiconductor memory device or a memory
system according to an exemplary embodiment of the inventive
concept may be mounted through various types of packages. For
example, a three-dimensional semiconductor memory device or a
memory system according to an embodiment of the inventive concept
may be packaged and mounted through package methods, for example,
PoP (Package on Package), Ball grid arrays (BGAs), Chip scale
packages (CSPs), Plastic Leaded Chip Carrier (PLCC), Plastic Dual
In-Line Package (PDIP), Die in Waffle Pack, Die in Wafer Form, Chip
On Board (COB), Ceramic Dual In-Line Package (CERDIP), Plastic
Metric Quad Flat Pack (MQFP), Thin Quad Flatpack (TQFP), Small
Outline (SOIC), Shrink Small Outline Package (SSOP), Thin Small
Outline (TSOP), Thin Quad Flatpack (TQFP), System In Package (SIP),
Multi Chip Package (MCP), Wafer-level Fabricated Package (WFP), and
Wafer-Level Processed Stack Package (WSP).
[0138] FIG. 15 is a schematic block diagram illustrating a memory
card including a three-dimensional semiconductor memory according
to an exemplary embodiment of the inventive concept.
[0139] Referring to FIG. 15, the memory card 1200 which may store a
large amount of data includes a flash memory device 1210. The flash
memory device 1210 includes a three-dimensional semiconductor
memory device according to an exemplary embodiment of the inventive
concept. The memory card 1200 includes a memory controller 1220 for
controlling general data exchange between a host and the flash
memory device 1210.
[0140] A static random access memory (SRAM) 1221 may serve as an
operating memory of a processing unit 1222. A host interface 1223
may allow a host to access the memory card 1200 using a data
exchange protocol. An error correction block 1224 may detect and
correct an error in data read from the flash memory device 1210.
The memory interface 1225 may allow the memory card 1200 to access
the flash memory device 1210. The processing unit 1222 may perform
a general control operation for data exchange of the memory
controller 1220. The memory card 1200 may further include read only
memory (ROM) (not shown) storing code data for interfacing with a
host.
[0141] FIG. 16 is a schematic block diagram illustrating an
information processing system including a three-dimensional memory
device according to an exemplary embodiment of the inventive
concept.
[0142] Referring to FIG. 16, a flash memory device 1311 is mounted
to an information processing system such as a mobile device or a
desktop computer. The flash memory device 1311 includes a
three-dimensional semiconductor memory device according to an
exemplary embodiment of the inventive concept. The information
processing system 1300 includes a flash memory system 1310, a modem
1320, a CPU 1330, a RAM 1340, and a user interface 1350, each of
which is connected to a bus 1360. The flash memory system 1310 may
be configured substantially identical to the above-mentioned memory
system or flash memory system. The flash memory system 1310 may
store data processed by the CPU 1330 or inputted from the outside.
Here, the flash memory system 1310 may serve as a semiconductor
disk device (SSD) and in this case, the information processing
system 1300 may store a large amount of data in the flash memory
system 1310. If the flash memory system 1310 is reliable, a high
speed data exchange function of the information processing system
1300 may be performed using less circuitry for error correction.
The information processing system 1300 may further include an
application chipset, a camera image processor (CIS), and/or an
input/output device.
[0143] According to an exemplary embodiment of the inventive
concept, one pair of source and drain regions formed in a
peripheral active pattern need not be arranged in an intersection
line where a {111} plane of a silicon crystal structure in a
semiconductor substrate meets a top surface of the semiconductor
substrate. Accordingly, a current path between the source and drain
regions may be avoided to be formed on the {111} plane, and thus
leakage current may be reduced.
[0144] While the present inventive concept has been shown and
described with reference to exemplary embodiments thereof, it will
be apparent to those of ordinary skill in the art that various
changes in form and detail may be made therein without departing
from the spirit and scope of the inventive concept as defined by
the following claims.
* * * * *