U.S. patent application number 14/553288 was filed with the patent office on 2015-06-04 for data processing device.
This patent application is currently assigned to Semiconductor Energy Laboratory Co., Ltd.. The applicant listed for this patent is Semiconductor Energy Laboratory Co., Ltd.. Invention is credited to Yoshiharu HIRAKATA, Shunpei YAMAZAKI.
Application Number | 20150154730 14/553288 |
Document ID | / |
Family ID | 53265734 |
Filed Date | 2015-06-04 |
United States Patent
Application |
20150154730 |
Kind Code |
A1 |
HIRAKATA; Yoshiharu ; et
al. |
June 4, 2015 |
DATA PROCESSING DEVICE
Abstract
A novel human interface with excellent operability is provided.
A novel data processing device with excellent operability is
provided. A novel data processing device, a novel display device,
or the like is provided. An input and output device is supplied
with image data and supplies sensing data, and an arithmetic device
supplies the image data and is supplied with the sensing data. The
input and output device includes a plurality of display portions
that display display data and a sensing portion that senses an
object obscuring one of the display portions, and includes one
region provided with the one of the display portions and the
sensing portion, another region provided with the other display
portions, and a curved portion between the one region and the other
region. The arithmetic device includes an arithmetic portion and a
memory portion that stores a program to be executed by the
arithmetic portion.
Inventors: |
HIRAKATA; Yoshiharu; (Ebina,
JP) ; YAMAZAKI; Shunpei; (Setagaya, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Semiconductor Energy Laboratory Co., Ltd. |
Atsugi-shi |
|
JP |
|
|
Assignee: |
Semiconductor Energy Laboratory
Co., Ltd.
|
Family ID: |
53265734 |
Appl. No.: |
14/553288 |
Filed: |
November 25, 2014 |
Current U.S.
Class: |
345/520 |
Current CPC
Class: |
G06T 1/20 20130101 |
International
Class: |
G06T 1/20 20060101
G06T001/20; G06F 13/24 20060101 G06F013/24 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 2, 2013 |
JP |
2013-249677 |
Claims
1. A data processing device comprising: an input and output device
comprising a first region, a second region, and a first curved
portion between the first region and the second region; and an
arithmetic device comprising an arithmetic portion and a memory
portion which is configured to store a program to be executed by
the arithmetic portion, wherein the first region comprises a first
display portion and a first sensing portion, wherein the second
region comprises a second display portion and a second sensing
portion, wherein the first sensing portion is configured to sense
an object obscuring the first display portion and supply first
sensing data to the arithmetic portion, wherein the second sensing
portion is configured to sense an object obscuring the second
display portion and supply second sensing data to the arithmetic
portion, wherein the arithmetic portion is configured to generate
first image data and second image data based on the first sensing
data, wherein the first image data is supplied to the first display
portion, and wherein the second image data is supplied to the
second display portion.
2. A data processing device comprising: an input and output device
comprising a first region, a second region, a first curved portion
between the first region and the second region, a third region, and
a second curved portion between the first region and the third
region; and an arithmetic device comprising an arithmetic portion
and a memory portion which is configured to store a program to be
executed by the arithmetic portion, wherein the first region
comprises a first display portion and a first sensing portion,
wherein the second region comprises a second display portion,
wherein the third region comprises a terminal, wherein the first
sensing portion is configured to sense an object obscuring the
first display portion and supply first sensing data to the
arithmetic portion, wherein the arithmetic portion is configured to
generate first image data and second image data based on the first
sensing data, wherein the first image data and the second image
data are supplied to the terminal, wherein the terminal is
configured to supply the first image data and the second image data
to the first region, and wherein the first region is configured to
supply the second image data to the second region.
3. A data processing device comprising: an input and output device
comprising a first region, a second region, and a first curved
portion between the first region and the second region; and an
arithmetic device comprising an arithmetic portion and a memory
portion which is configured to store a program to be executed by
the arithmetic portion, wherein the first region comprises a first
display portion and a first sensing portion, wherein the second
region comprises a second display portion, wherein the first
sensing portion is configured to sense an object obscuring the
first display portion and supply first sensing data to the
arithmetic portion, wherein the arithmetic portion is configured to
generate first image data and second image data based on the first
sensing data, wherein the first image data is supplied to the first
display portion, wherein the second image data is supplied to the
second display portion, and wherein the program comprises: a first
step of acquiring initial data including status data; a second step
of allowing an interrupt processing; a third step of acquiring
predetermined data; a fourth step of selecting a fifth step when
the status data shows a first status or a sixth step when the
status data shows a second status; the fifth step of generating the
first image data based on the predetermined data and displaying the
first image data on the first display portion; the sixth step of
generating the second image data based on the predetermined data
and displaying the second image data on the second display portion;
a seventh step of selecting an eighth step when a termination
instruction is supplied in the interrupt processing or the third
step when no termination instruction is supplied in the interrupt
processing; and the eighth step of terminating the program.
4. The data processing device according to claim 1, wherein the
arithmetic portion is configured to generate the first image data
and the second image data based on the second sensing data.
5. The data processing device according to claim 4, wherein the
first region is foldable so that the first display portion faces
inward.
6. The data processing device according to claim 4, wherein the
first region is foldable so that the first display portion faces
outward.
7. The data processing device according to claim 1, wherein the
first region further comprises a first positional data input
portion, wherein the second region further comprises a second
positional data input portion, wherein the first positional data
input portion is overlapped with the first display portion, wherein
the second positional data input portion is overlapped with the
second display portion, wherein the first positional data input
portion is configured to supply first positional data to the
arithmetic device, and wherein the second positional data input
portion is configured to supply second positional data to the
arithmetic device.
8. The data processing device according to claim 1, wherein the
program comprises: a first step of acquiring initial data including
status data; a second step of allowing an interrupt processing; a
third step of acquiring predetermined data; a fourth step of
selecting a fifth step when the status data shows a first status or
a sixth step when the status data shows a second status; the fifth
step of generating the first image data based on the predetermined
data and displaying the first image data on the first display
portion; the sixth step of generating the second image data based
on the predetermined data and displaying the second image data on
the second display portion; a seventh step of selecting an eighth
step when a termination instruction is supplied in the interrupt
processing or the third step when no termination instruction is
supplied in the interrupt processing; and the eighth step of
terminating the program, and wherein the interrupt processing
comprises: a ninth step of acquiring the first sensing data and the
second sensing data; a tenth step of determining candidate data
based on the first sensing data and the second sensing data; an
eleventh step of selecting a twelfth step when the candidate data
differs from the status data or the ninth step when the candidate
data is the same as the status data; the twelfth step of updating
the status data with the candidate data; and a thirteenth step of
returning from the interrupt processing.
9. The data processing device according to claim 2, wherein the
second region further comprises a second sensing portion which is
configured to sense an object obscuring the second display portion
and supply second sensing data to the arithmetic portion, and
wherein the arithmetic portion is configured to generate the first
image data and the second image data based on the second sensing
data.
10. The data processing device according to claim 2, wherein the
first region is foldable.
11. The data processing device according to claim 10, wherein the
first region is foldable so that the first display portion faces
inward.
12. The data processing device according to claim 10, wherein the
first region is foldable so that the first display portion faces
outward.
13. The data processing device according to claim 2, wherein the
first region further comprises a first positional data input
portion, wherein the second region further comprises a second
positional data input portion, wherein the first positional data
input portion is overlapped with the first display portion, wherein
the second positional data input portion is overlapped with the
second display portion, wherein the first positional data input
portion is configured to supply first positional data to the
arithmetic device, and wherein the second positional data input
portion is configured to supply second positional data to the
arithmetic device.
14. The data processing device according to claim 9, wherein the
program comprises: a first step of acquiring initial data including
status data; a second step of allowing an interrupt processing; a
third step of acquiring predetermined data; a fourth step of
selecting a fifth step when the status data shows a first status or
a sixth step when the status data shows a second status; the fifth
step of generating the first image data based on the predetermined
data and displaying the first image data on the first display
portion; the sixth step of generating the second image data based
on the predetermined data and displaying the second image data on
the second display portion; a seventh step of selecting an eighth
step when a termination instruction is supplied in the interrupt
processing or the third step when no termination instruction is
supplied in the interrupt processing; and the eighth step of
terminating the program, and wherein the interrupt processing
comprises: a ninth step of acquiring the first sensing data and the
second sensing data; a tenth step of determining candidate data
based on the first sensing data and the second sensing data; an
eleventh step of selecting a twelfth step when the candidate data
differs from the status data or the ninth step when the candidate
data is the same as the status data; the twelfth step of updating
the status data with the candidate data; and a thirteenth step of
returning from the interrupt processing.
15. The data processing device according to claim 3, wherein the
second region further comprises a second sensing portion which is
configured to sense an object obscuring the second display portion
and supply second sensing data to the arithmetic portion, and
wherein the arithmetic portion is configured to generate the first
image data and the second image data based on the second sensing
data.
16. The data processing device according to claim 3, wherein the
first region is foldable.
17. The data processing device according to claim 16, wherein the
first region is foldable so that the first display portion faces
inward.
18. The data processing device according to claim 16, wherein the
first region is foldable so that the first display portion faces
outward.
19. The data processing device according to claim 3, wherein the
first region further comprises a first positional data input
portion, wherein the second region further comprises a second
positional data input portion, wherein the first positional data
input portion is overlapped with the first display portion, wherein
the second positional data input portion is overlapped with the
second display portion, wherein the first positional data input
portion is configured to supply first positional data to the
arithmetic device, and wherein the second positional data input
portion is configured to supply second positional data to the
arithmetic device.
20. The data processing device according to claim 15, wherein the
interrupt processing comprises: a ninth step of acquiring the first
sensing data and the second sensing data; a tenth step of
determining candidate data based on the first sensing data and the
second sensing data; an eleventh step of selecting a twelfth step
when the candidate data differs from the status data or the ninth
step when the candidate data is the same as the status data; the
twelfth step of updating the status data with the candidate data;
and a thirteenth step of returning from the interrupt processing.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] One embodiment of the present invention relates to a method
and a program for processing and displaying image information, and
a device including a storage medium in which the program is stored.
In particular, one embodiment of the present invention relates to a
method for processing and displaying image data by which an image
including information processed by a data processing device
provided with a display portion is displayed, a program for
displaying an image including information processed by a data
processing device provided with a display portion, and a data
processing device including a storage medium in which the program
is stored.
[0003] Note that one embodiment of the present invention is not
limited to the above technical field. The technical field of one
embodiment of the invention disclosed in this specification and the
like relates to an object, a method, or a manufacturing method. In
addition, one embodiment of the present invention relates to a
process, a machine, manufacture, or a composition of matter.
Specifically, examples of the technical field of one embodiment of
the present invention disclosed in this specification include a
semiconductor device, a display device, a light-emitting device, a
power storage device, a memory device, a method for driving any of
them, and a method for manufacturing any of them.
[0004] 2. Description of the Related Art
[0005] The social infrastructures relating to means for
transmitting information have advanced. This has made it possible
to acquire, process, and send out many pieces and various kinds of
information with the use of a data processing device not only at
home or office but also at other visiting places.
[0006] With this being the situation, portable data processing
devices are under active development.
[0007] Portable data processing devices are often used while being
carried around, and force might be accidentally applied, by
dropping for example, to the data processing devices and to display
devices included in them. As an example of a display device that is
not easily broken, a display device having high adhesiveness
between a structure body by which a light-emitting layer is divided
and a second electrode layer is known (Patent Document 1).
[0008] For example, a cellular phone is known in which a display
device is provided on a front side and on an upper side in the
longitudinal direction of a housing (Patent Document 2).
Patent Documents
[Patent Document 1] Japanese Published Patent Application No.
2012-190794
[Patent Document 2] Japanese Published Patent Application No.
2010-153813
SUMMARY OF THE INVENTION
[0009] An object of one embodiment of the present invention is to
provide a novel human interface with excellent operability. Another
object is to provide a novel data processing device with excellent
operability. Another object is to provide a novel data processing
device, a novel display device, or the like.
[0010] Note that the descriptions of these objects do not disturb
the existence of other objects. Note that in one embodiment of the
present invention, there is no need to achieve all the objects.
Note that other objects will be apparent from and can be derived
from the description of the specification, the drawings, the
claims, and the like.
[0011] One embodiment of the present invention is a data processing
device including an input and output device supplied with first
image data and second image data and capable of supplying first
sensing data, and an arithmetic device capable of supplying the
first image data and the second image data and supplied with the
first sensing data.
[0012] The input and output device includes a first display portion
supplied with and capable of displaying the first image data, a
second display portion supplied with and capable of displaying the
second image data, a first sensing portion capable of sensing an
object obscuring the first display portion and supplying the first
sensing data, a first region provided with the first display
portion, a second region provided with the second display portion,
and a first curved portion between the first region and the second
region.
[0013] The arithmetic device includes an arithmetic portion and a
memory portion capable of storing a program to be executed by the
arithmetic portion. The arithmetic portion is capable of generating
the first image data or the second image data based on the first
sensing data.
[0014] The above-described data processing device of one embodiment
of the present invention includes the input and output device
supplied with image data and capable of supplying sensing data, and
the arithmetic device capable of supplying the image data and
supplied with the sensing data. The input and output device
includes a plurality of display portions capable of displaying
display data and a sensing portion capable of sensing an object
obscuring one of the plurality of display portions, and includes
one region provided with the one of the plurality of display
portions and the sensing portion, another region provided with the
other display portions, and a curved portion between the one region
and the other region. The arithmetic device includes the arithmetic
portion and the memory portion capable of storing a program to be
executed by the arithmetic portion. Thus, image data based on
sensing data supplied from the one region can be generated and
displayed on the one region and/or the other region. Consequently,
a novel data processing device can be provided.
[0015] In the above-described data processing device of one
embodiment of the present invention, the input and output device
may include a second sensing portion capable of sensing an object
obscuring the second display portion and supplying second sensing
data. The arithmetic device is supplied with the second sensing
data. The arithmetic portion is capable of generating the first
image data and/or the second image data based on the first sensing
data and/or the second sensing data.
[0016] In the above-described structure, the above-described data
processing device of one embodiment of the present invention may
include the second display portion, the second sensing portion
capable of sensing an object obscuring the second display portion,
and the second region provided with the second display portion and
the second sensing portion. Thus, image data based on sensing data
supplied from one of the regions can be generated and displayed by
the input and output device. Consequently, a novel data processing
device can be provided.
[0017] In the above-described data processing device of one
embodiment of the present invention, the first region can be folded
or unfolded.
[0018] The data processing device of one embodiment of the present
invention includes the first region which can be folded or
unfolded. Accordingly, the data processing device can be used with
the first region having a highly portable size or a highly
browsable size. Consequently, a novel data processing device can be
provided.
[0019] Another embodiment of the present invention is a data
processing device including an input and output device supplied
with first image data and second image data and capable of
supplying first sensing data, and an arithmetic device capable of
supplying the first image data and the second image data and
supplied with the first sensing data.
[0020] The input and output device includes a terminal supplied
with the first image data and the second image data, a first
display portion supplied with and capable of displaying the first
image data, a second display portion supplied with and capable of
displaying the second image data, a first sensing portion capable
of sensing an object obscuring the first display portion and
supplying the first sensing data, a first region provided with the
first display portion, a second region provided with the second
display portion, a third region provided with the terminal, a first
curved portion between the first region and the second region, and
a second curved portion between the first region and the third
region. The third region is capable of supplying the first image
data and the second image data. The first region is supplied with
the first image data and the second image data and is capable of
supplying the second image data. The second region is supplied with
the second image data.
[0021] In the data processing device, an arithmetic portion is
capable of generating the first image data or the second image data
based on the first sensing data.
[0022] The above-described data processing device of one embodiment
of the present invention includes the first region provided with
the first display portion, the second region provided with the
second display portion, the third region provided with the
terminal, the first curved portion between the first region and the
second region, and the second curved portion between the first
region and the third region. Accordingly, the terminal is capable
of supplying the first image data and the second image data. The
first region is capable of displaying the first image data and
supplying the second image data, and the second region is capable
of displaying the second image data. Consequently, a novel data
processing device can be provided.
[0023] In the above-described data processing device of one
embodiment of the present invention, the input and output device
may be capable of supplying first positional data and second
positional data. The arithmetic device may be supplied with the
first positional data and the second positional data. The input and
output device may include a first positional data input portion
capable of supplying the first positional data and a second
positional data input portion capable of supplying the second
positional data. The first region may include the first positional
data input portion overlapping with the first display portion. The
second region may include the second positional data input portion
overlapping with the second display portion.
[0024] In the above-described data processing device of one
embodiment of the present invention, the first region includes the
first positional data input portion overlapping with the first
display portion, and the second region includes the second
positional data input portion overlapping with the second display
portion. Accordingly, image data based on positional data supplied
from one data input portion can be generated and displayed on the
first display portion or the second display portion. Consequently,
a novel data processing device can be provided.
[0025] Another embodiment of the present invention is the
above-described data processing device with a program including a
first step of acquiring initial data including status data; a
second step of allowing an interrupt processing; a third step of
acquiring predetermined data; a fourth step of selecting a fifth
step when the status data shows a first status or a sixth step when
the status data shows a second status; the fifth step of generating
first image data based on the predetermined data and displaying the
first image data on the first display portion; the sixth step of
generating second image data based on the predetermined data and
displaying the second image data on the second display portion; a
seventh step of selecting an eighth step when a termination
instruction is supplied in the interrupt processing or the third
step when no termination instruction is supplied in the interrupt
processing; and the eighth step of terminating the program.
[0026] The interrupt processing includes a ninth step of acquiring
first sensing data and second sensing data; a tenth step of
determining candidate data based on the first sensing data and the
second sensing data; an eleventh step of selecting a twelfth step
when the candidate data differs from the status data or the ninth
step when the candidate data is the same as the status data; the
twelfth step of updating the status data with the candidate data;
and a thirteenth step of returning from the interrupt
processing.
[0027] In the above-described data processing device of one
embodiment of the present invention, the program includes the step
of determining candidate data by acquiring the first sensing data
and the second sensing data; the step of updating the status data
with the candidate data when the status data differs from the
candidate data; and the step of generating and displaying image
data including predetermined data based on the updated status data.
Thus, an image including the predetermined data which is based on
the status data can be generated and displayed on a predetermined
region. Consequently, a novel data processing device can be
provided.
[0028] According to one embodiment of the present invention, a
novel human interface with excellent operability can be provided. A
novel data processing device with excellent operability can be
provided. A novel data processing device, a novel display device,
or the like can be provided. Note that the description of these
effects does not disturb the existence of other effects. One
embodiment of the present invention does not necessarily achieve
all the above effects. Other effects will be apparent from and can
be derived from the description of the specification, the drawings,
the claims, and the like.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] FIG. 1 is a block diagram illustrating a structure of a data
processing device of an embodiment.
[0030] FIGS. 2A, 2B, 2C1, 2C2, and 2D are schematic diagrams
illustrating a structure of a data processing device of an
embodiment.
[0031] FIGS. 3A1, 3A2, 3A3, 3B, and 3C are schematic diagrams
illustrating a structure of a data processing device of an
embodiment.
[0032] FIG. 4 is a block diagram illustrating a structure of a data
processing device of an embodiment.
[0033] FIGS. 5A1, 5A2, 5B, 5C, and 5D are schematic diagrams
illustrating a structure of a data processing device of an
embodiment.
[0034] FIGS. 6A1, 6A2, 6B1, and 6B2 are schematic diagrams
illustrating a structure of a data processing device of an
embodiment.
[0035] FIG. 7 is a flowchart illustrating a program stored in a
memory portion of a data processing device of an embodiment.
[0036] FIG. 8 is a flowchart illustrating a program stored in a
memory portion of a data processing device of an embodiment.
[0037] FIGS. 9A to 9C illustrate a structure of a touch panel that
can be used in a data processing device of an embodiment.
[0038] FIGS. 10A and 10B illustrate a structure of a touch panel
that can be used in a data processing device of an embodiment.
[0039] FIGS. 11A to 11C each illustrate a structure of a touch
panel that can be used in a data processing device of an
embodiment.
[0040] FIGS. 12A to 12C each illustrate a structure of a touch
panel that can be used in a data processing device of an
embodiment.
[0041] FIGS. 13A to 13D illustrate a method for manufacturing a
bendable or foldable device of an embodiment.
[0042] FIGS. 14A to 14D illustrate a method for manufacturing a
bendable or foldable device of an embodiment.
[0043] FIGS. 15A to 15D illustrate a method for manufacturing a
bendable or foldable device of an embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0044] A data processing device of one embodiment of the present
invention includes an input and output device supplied with image
data and capable of supplying sensing data, and an arithmetic
device capable of supplying the image data and supplied with the
sensing data. The input and output device includes a plurality of
display portions capable of displaying display data and a sensing
portion capable of sensing an object obscuring one of the plurality
of display portions, and includes one region provided with the one
of the display portions and the sensing portion, another region
provided with the other display portions, and a curved portion
between the one region and the other region. The arithmetic device
includes an arithmetic portion and a memory portion capable of
storing a program to be executed by the arithmetic portion.
[0045] Thus, image data based on sensing data supplied from a first
region can be generated and displayed on the first region and/or a
second region. As a result, a novel human interface with excellent
operability can be provided. A novel data processing device with
excellent operability can be provided. A novel data processing
device, a novel display device, or the like can be provided.
[0046] Embodiments will be described in detail with reference to
the drawings. Note that the present invention is not limited to the
following description, and it will be easily understood by those
skilled in the art that various changes and modifications can be
made without departing from the spirit and scope of the present
invention. Therefore, the present invention should not be construed
as being limited to the description in the following embodiments.
Note that in the structures of the invention described below, the
same portions or portions having similar functions are denoted by
the same reference numerals in different drawings, and description
of such portions is not repeated.
Embodiment 1
[0047] In this embodiment, a structure of a data processing device
of one embodiment of the present invention will be described with
reference to FIG. 1 and FIGS. 2A, 2B, 2C1, 2C2, and 2D.
[0048] FIG. 1 is a block diagram illustrating a structure of a data
processing device 100 of one embodiment of the present
invention.
[0049] FIG. 2A is a schematic diagram illustrating the appearance
of the data processing device 100 of one embodiment of the present
invention, and FIG. 2B is a cross-sectional view illustrating a
cross-sectional structure along a cutting-plane line X1-X2 in FIG.
2A.
[0050] FIG. 2C1 is a schematic diagram illustrating the appearance
of a positional data input portion and a display portion which can
be used in the data processing device 100.
[0051] FIG. 2C2 is a schematic diagram illustrating the appearance
of a proximity sensor 142 which can be used in the positional data
input portion.
[0052] FIG. 2D is a cross-sectional view illustrating a
cross-sectional structure of the proximity sensor 142 along a
cutting-plane line X3-X4 in FIG. 2C2.
Example 1 of Structure of Data Processing Device
[0053] The data processing device 100 described in this embodiment
includes an input and output device 120 that is supplied with first
image data V1 and second image data V2 and supplies first sensing
data S1, and an arithmetic device 110 that supplies the first image
data V1 and the second image data V2 and is supplied with the first
sensing data S1 (see FIG. 1).
[0054] The input and output device 120 includes a first display
portion 130(1) that is supplied with and displays the first image
data V1, a second display portion 130(2) that is supplied with and
displays the second image data V2, and a first sensing portion
150(1) that senses an object obscuring the first display portion
130(1) and supplies the first sensing data S1. The input and output
device 120 also includes a first region 120(1) provided with the
first display portion 130(1) and the first sensing portion 150(1),
a second region 120(2) provided with the second display portion
130(2), and a first curved portion 120c(1) between the first region
120(1) and the second region 120(2) (see FIG. 1 and FIGS. 2A and
2B).
[0055] The arithmetic device 110 includes an arithmetic portion 111
and a memory portion 112 that stores a program to be executed by
the arithmetic portion 111. The arithmetic portion 111 generates
the first image data V1 or the second image data V2 based on the
first sensing data S1 (see FIG. 1).
[0056] The above-described data processing device of one embodiment
of the present invention includes the input and output device 120
that is supplied with image data and supplies sensing data, and the
arithmetic device 110 that supplies the image data and is supplied
with the sensing data. The input and output device 120 includes a
plurality of display portions that display display data and a
sensing portion that senses an object obscuring one of the display
portions, and includes one region provided with the one of the
display portions and the sensing portion, another region provided
with the other display portions, and a curved portion between the
one region and the other region. The arithmetic device includes an
arithmetic portion and a memory portion that stores a program to be
executed by the arithmetic portion. Thus, image data based on
sensing data supplied from the one region can be generated and
displayed on the one region and/or the other region. Consequently,
a novel data processing device can be provided.
[0057] The input and output device 120 may be configured to supply
first positional data L1 and second positional data L2, and the
arithmetic device 110 may be configured to be supplied with the
first positional data L1 and the second positional data L2 (see
FIG. 1).
[0058] The input and output device 120 may include a positional
data input portion 140 capable of supplying positional data. For
example, the first region 120(1) may include a first positional
data input portion 140(1) overlapping with the first display
portion 130(1), and the second region 120(2) may include a second
positional data input portion 140(2) overlapping with the second
display portion 130(2).
[0059] The first positional data input portion 140(1) may be
configured to supply the first positional data L1, and the second
positional data input portion 140(2) may be configured to supply
the second positional data L2.
[0060] The data processing device 100 described in this embodiment
as an example can generate image data based on positional data
supplied from the positional data input portion and display it on
the first display portion or the second display portion.
Consequently, a novel data processing device can be provided.
[0061] The input and output device 120 may include an input and
output portion 145 that supplies and is supplied with data and a
communication portion 160 that supplies and is supplied with
communication data COM.
[0062] The arithmetic device 110 may include a transmission path
114 that supplies and is supplied with data, and an input and
output interface 115 that supplies and is supplied with data.
[0063] Individual components included in the data processing device
are described below. Note that these portions cannot be clearly
distinguished and one portion also serves as another portion or
includes part of another portion in some cases.
[0064] For example, a touch panel in which a display portion
overlaps with a touch sensor serves as the positional data input
portion 140 as well as a display portion 130.
[0065] Note that although this embodiment describes a touch sensor
having a structure where the positional data input portion 140 is
placed on a display surface side of the display portion 130 as an
example, one embodiment of the present invention is not limited to
this structure. Specifically, the display portion 130 may be placed
on a sensing surface side of the positional data input portion 140,
or the display portion 130 and the positional data input portion
140 may be integrated into one unit. In other words, either an
on-cell touch panel or an in-cell touch panel may be employed.
<<Entire Structure>>
[0066] The data processing device 100 includes the input and output
device 120 and the arithmetic device 110 (see FIG. 1).
<<Input and Output Device>>
[0067] The input and output device 120 includes the display portion
130 and a sensing portion 150. The input and output device 120 is
supplied with the first image data V1 and the second image data V2
and supplies the first sensing data S1 and the second sensing data
S2.
[0068] The input and output device 120 may include the positional
data input portion 140, the input and output portion 145, and the
communication portion 160.
[0069] The input and output device 120 includes the first region
120(1), the second region 120(2), the first curved portion 120c(1),
and a second curved portion 120c(2) (see FIGS. 2A and 2B).
<<Curved Portion>>
[0070] A portion showing the most significant change in curvature
between the first region 120(1) and the second region 120(2) is
referred to as the first curved portion 120c(1). In the case where
the input and output device 120 has a curved surface that includes
the first region 120(1) and the second region 120(2), and the first
region 120(1) and the second region 120(2) are continuous, for
example, the first curved portion 120c(1) includes a portion with
the smallest curvature radius that appears in a section of the
curved surface. The curvature radius of the curved portion is 10 mm
or less, preferably 8 mm or less, further preferably 5 mm or less,
particularly preferably 4 mm or less.
[0071] The first curved portion 120c(1) and/or the second curved
portion 120c(2) may have a display portion and a positional data
input portion that overlaps with the display portion. With such a
structure, positional data supplied from the first curved portion
120c(1) and/or the second curved portion 120c(2) may be used
instead of the second positional data L2.
<<First Region>>
[0072] The first region 120(1) includes the first display portion
130(1) and the first sensing portion 150(1).
[0073] The first region 120(1) may include the first positional
data input portion 140(1).
<<Second Region>>
[0074] The second region 120(2) includes the second display portion
130(2).
[0075] The second region 120(2) may also include the second
positional data input portion 140(2) and/or a second sensing
portion 150(2) that senses an object obscuring the second
region.
[0076] Although the example in which the input and output device
120 has two second regions 120(2) is shown in FIG. 2B, one
embodiment of the present invention is not limited to this example.
The input and output device 120 may have only one second region
120(2), or three or more second regions 120(2).
[0077] For example, two second regions 120(2) may be arranged to
face each other (see FIG. 2B). The distance between the two second
regions 120(2) is, for example, 17 cm or shorter, preferably 9 cm
or shorter, further preferably 7 cm or shorter. When the distance
is short, the thumb of the holding hand can be used to obtain
positional data in a large area of the first positional data input
portion 140(1).
<<Display Portion>>
[0078] There is no particular limitation on the display portion 130
as long as the display portion 130 can display supplied image data
(see FIG. 2C1).
[0079] The display portion 130 includes the first display portion
130(1) and the second display portion 130(2).
[0080] The first display portion 130(1) displays the first image
data V1 that is supplied thereto, and the second display portion
130(2) displays the second image data V2 that is supplied
thereto.
[0081] The first display portion 130(1) and the second display
portion 130(2) may be driven as one display portion. For example,
one driver circuit may supply signals to select scan lines.
[0082] The first display portion 130(1) and the second display
portion 130(2) may be driven as different display portions. For
example, separate driver circuits may be provided for the display
portions, and the driver circuits may supply signals to select scan
lines to the corresponding display portions.
[0083] For example, when the data processing device 100 is in a
standby state, only the second display portion 130(2) may be
driven, and drive of the first display portion 130(1) may be
stopped. Stopping drive of the first display portion 130(1) can
reduce power consumption.
[0084] Note that a flexible display portion which can be bent at a
position overlapping with the first curved portion 120c(1) can be
used as the display portion 130. Specific examples of structures
that can be employed in the display portion 130 are described in
Embodiments 4 to 6.
<<Sensing Portion>>
[0085] The sensing portion 150 senses the states of the data
processing device 100 and the circumstances and supplies sensing
data (see FIG. 1).
[0086] The sensing portion 150 includes the first sensing portion
150(1), and the first sensing portion senses an object obscuring
the first display portion 130(1). Then, the first sensing portion
150(1) supplies the first sensing data S1 including data about
whether the first display portion 130(1) is obscured or not.
[0087] For example, any of a variety of sensing elements such as a
photoelectric conversion element, an imaging element, a magnetic
sensor, and a proximity sensor can be used in the first sensing
portion 150(1).
[0088] Specifically, a photoelectric conversion element 150PD is
provided in the first region 120(1) so as to sense the intensity of
light incident from a side where the first display portion 130(1)
displays image data (see FIG. 2A).
[0089] This enables the photoelectric conversion element 150PD to
sense that the first region is covered with a protective case or
cover for the data processing device 100, clothes, or the like.
[0090] Note that the first sensing portion 150(1) is not
necessarily provided in the first region 120(1) and may be provided
in another place as long as the first sensing portion 150(1) can
sense an object obscuring the first display portion 130(1). For
example, the first sensing portion 150(1) may be provided in the
second region, or data supplied from another device may be used as
the first sensing data S1.
[0091] Specifically, a sensing element capable of sensing a much
wider range with use of a fish-eye lens may be provided in the
second region and used as the first sensing portion 150(1).
Alternatively, an image taken by a monitoring camera may be
obtained through a communication network and used as the first
sensing data S1.
[0092] Note that the sensing portion 150 may sense acceleration, a
direction, pressure, a global positioning system (GPS) signal,
temperature, humidity, or the like and supply data thereon.
<<Positional Data Input Portion>>
[0093] The positional data input portion 140 senses an approaching
object and supplies positional data of the approaching object to
the arithmetic device 110. Note that when the positional data input
portion 140 is positioned closer to the user than the display
portion 130 is, the positional data input portion 140 has a
light-transmitting property.
[0094] For example, the user of the data processing device 100 can
give a variety of operating instructions to the data processing
device 100 by making his/her finger, palm, or the like in proximity
to the positional data input portion 140. For example, an operating
instruction including a termination instruction (an instruction to
terminate the program) can be supplied.
[0095] For example, the proximity sensors 142 may be arranged in a
matrix over a flexible substrate 141 to constitute the positional
data input portion 140 (see FIGS. 2C1, 2C2, and 2D).
[0096] The positional data input portion 140 includes the first
positional data input portion 140(1) and the second positional data
input portion 140(2).
[0097] The first positional data input portion 140(1) supplies the
first positional data L1, and the second positional data input
portion 140(2) supplies the second positional data L2.
[0098] The first positional data input portion 140(1) and the
second positional data input portion 140(2) may be driven as one
positional data input portion.
[0099] The positional data input portion 140 may be divided into
the first positional data input portion 140(1) and the second
positional data input portion 140(2) which are partially driven. In
other words, the second positional data input portion 140(2) may be
driven independently of the first positional data input portion
140(1).
[0100] Here, X1-X2 direction is set as a row direction, and the
direction crossing the row direction is set as a column direction.
A plurality of scan lines extending in the row direction so as to
cross the first positional data input portion 140(1) and the second
positional data input portion 140(2), a plurality of signal lines
extending in the column direction, and the proximity sensors 142
each electrically connected to one scan line and one signal line
are provided in a matrix.
[0101] The positional data input portion 140 may be partially
driven in the following manner: a proximity sensor connected to a
first signal line provided in the first positional data input
portion 140(1) and a proximity sensor connected to a second signal
line provided in the second positional data input portion 140(2)
are driven independently of each other.
[0102] Specifically, when only the first positional data input
portion 140(1) is used, only the proximity sensor provided in the
first positional data input portion 140(1) and connected to the
first signal line is driven.
[0103] Specifically, when only the second positional data input
portion 140(2) is used, only the proximity sensor provided in the
second positional data input portion 140(2) and connected to the
second signal line is driven.
[0104] Note that the scan line is shared by the first positional
data input portion 140(1) and the second positional data input
portion 140(2); thus, the proximity sensor provided in the first
positional data input portion 140(1) and the proximity sensor
provided in the second positional data input portion 140(2) are
driven at different times.
[0105] For example, in the case where the data processing device
100 is used with its housing 101 being held by the user's hand,
only the first positional data input portion 140(1) may be driven
and drive of the second positional data input portion 140(2) may be
stopped. Stopping drive of the second positional data input portion
140(2) can reduce malfunctions due to the second positional data L2
supplied from the second positional data input portion 140(2) as a
result of sensing the hand holding the data processing device
100.
[0106] For example, in the case where the sum of power consumed by
the first positional data input portion 140(1) and power consumed
by the second positional data input portion 140(2) is larger than
power consumed by the first positional data input portion 140(1),
only the second positional data input portion 140(2) may be driven
and drive of the first positional data input portion 140(1) may be
stopped in a standby state of the data processing device 100.
Stopping drive of the first positional data input portion 140(1)
can reduce power consumption.
[0107] The proximity sensor 142 senses proximity or touch of an
object (e.g., a finger or a palm), and a capacitor or an imaging
element can be used as the proximity sensor. Note that a substrate
provided with capacitors arranged in a matrix can be referred to as
a capacitive touch sensor, and a substrate provided with an imaging
element can be referred to as an optical touch sensor.
[0108] For the flexible substrate 141, a resin that is thin enough
to have flexibility can be used. Specific examples of the resin
include a polyester, a polyolefin, a polyamide (such as a nylon or
an aramid), a polyimide, a polycarbonate, and an acrylic resin.
[0109] Additionally, as a normal non-flexible substrate, a glass
substrate, a quartz substrate, a semiconductor substrate, or the
like can be used.
[0110] Note that a flexible positional data input portion which can
be bent at a position overlapping with the first curved portion
120c(1) can be used as the positional data input portion 140.
Specific examples of structures that can be employed in the
positional data input portion 140 are described in Embodiments 4 to
6.
<<Communication Portion>>
[0111] The communication portion 160 supplies the data COM supplied
by the arithmetic device 110 to a device or a communication network
outside the data processing device 100. Furthermore, the
communication portion 160 acquires the data COM from the device or
communication network outside the data processing device 100 and
supplies the data COM.
[0112] The data COM can include a variety of instructions or the
like in addition to audio data, image data, and the like. For
example, the data COM can include an operating instruction to make
the arithmetic portion 111 generate or delete the first image data
V1 and the second image data V2.
[0113] A communication unit for connection to the external device
or external communication network, e.g., a hub, a router, or a
modem, can be used for the communication portion 160. Note that the
connection method is not limited to a method using a wire, and a
wireless method (e.g., radio wave or infrared rays) may be
used.
<<Input and Output Portion>>
[0114] As the input and output portion 145, for example, a camera,
a microphone, a read-only external memory portion, an external
memory portion, a scanner, a speaker, or a printer can be used (see
FIG. 1).
[0115] Specifically, as the camera, a digital camera, a digital
video camera, or the like can be used.
[0116] As the external memory portion, a hard disk, a removable
memory, or the like can be used. As the read-only external memory
portion, a CD-ROM, a DVD-ROM, or the like can be used.
<<Arithmetic Device>>
[0117] The arithmetic device 110 includes the arithmetic portion
111 and the memory portion 112. The arithmetic device 110 supplies
the first image data V1 and the second image data V2 and is
supplied with the first sensing data S1 and the second sensing data
S2 (see FIG. 1).
[0118] For example, the arithmetic device 110 supplies the first
image data V1 and the second image data V2 including an image used
for operation of the data processing device 100.
[0119] Note that the first image data V1 is displayed on the first
display portion 130(1), and the second image data V2 is displayed
on the second display portion 130(2).
[0120] The arithmetic device 110 may be configured to be supplied
with the first positional data L1 and the second positional data
L2. For example, by touching a position of the first positional
data input portion 140(1) overlapping with the image used for
operation, which is displayed on the first display portion 130(1),
with a finger or the like, the user of the data processing device
100 can supply an operating instruction associated with the image
to the arithmetic device 110. Similarly, by touching a position of
the second positional data input portion 140(2) overlapping with
the image used for operation, which is displayed on the second
display portion 130(2), with a finger or the like, the user of the
data processing device 100 can supply an operating instruction
associated with the image to the arithmetic device 110.
[0121] The arithmetic device 110 may further include the
transmission path 114 and the input and output interface 115.
<<Arithmetic Portion>>
[0122] The arithmetic portion 111 executes the program stored in
the memory portion 112. For example, in response to supply of
positional data that is associated with a position in which an
image used for operation is displayed, the arithmetic portion 111
executes a program associated in advance with the image.
<<Memory Portion>>
[0123] The memory portion 112 stores the program to be executed by
the arithmetic portion 111.
[0124] Note that an example of the program to be executed by the
arithmetic device 110 is described in Embodiment 3.
<<Input and Output Interface and Transmission
Path>>
[0125] The input and output interface 115 supplies data and is
supplied with data.
[0126] The transmission path 114 can supply data, and the
arithmetic portion 111, the memory portion 112, and the input and
output interface 115 are supplied with the data. In addition, the
arithmetic portion 111, the memory portion 112, and the input and
output interface 115 can supply data, and the transmission path 114
is supplied with the data.
[0127] The data processing device 100 includes the arithmetic
device 110, the input and output device 120, and the housing 101
(see FIG. 2B).
<<Housing>>
[0128] The housing 101 protects the arithmetic device 110 and the
like from external stress.
[0129] The housing 101 can be formed using metal, plastic, glass,
ceramics, or the like.
Example 2 of Structure of Data Processing Device
[0130] Another structure of a data processing device of one
embodiment of the present invention will be described with
reference to FIGS. 3A1, 3A2, 3A3, 3B, and 3C.
[0131] FIGS. 3A1, 3A2, 3A3, 3B, and 3C illustrate a structure of a
data processing device 100B of one embodiment of the present
invention.
[0132] FIGS. 3A1 and 3A2 are front and rear perspective views,
respectively, of the data processing device 100B of one embodiment
of the present invention. FIG. 3A3 is a top view thereof.
[0133] FIG. 3B is a schematic diagram illustrating the appearance
of the positional data input portion 140 and the display portion
130 which can be used in the data processing device 100B.
[0134] FIG. 3C illustrates a usage state of the data processing
device 100B.
[0135] The data processing device 100B described in this embodiment
differs from the data processing device 100 described with
reference to FIGS. 2A, 2B, 2C1, 2C2, and 2D, in including the
second sensing portion 150(2) that senses an object obscuring the
second display portion 130(2) and supplies the second sensing data
S2. Different parts are described in detail below, and the above
description is referred to for the other similar parts.
[0136] In the data processing device 100B described in this
embodiment, the input and output device 120 includes the second
sensing portion 150(2) that senses an object obscuring the second
display portion 130(2) and supplies the second sensing data S2.
[0137] The arithmetic device 110 is supplied with the second
sensing data S2.
[0138] The arithmetic portion 111 generates the first image data V1
and/or the second image data V2 based on the first sensing data S1
and/or the second sensing data S2.
[0139] The data processing device 100B described in this embodiment
can generate image data based on sensing data supplied from one
region and display it on the input and output device. Consequently,
a novel data processing device can be provided.
[0140] When the data processing device 100B is put in a breast
pocket of user's clothes with the second region 120(2) facing
upward, the user can easily see text or image information displayed
on the second region 120(2) while the data processing device 100B
is placed in the pocket (see FIG. 3C).
[0141] For example, the user can see, from above, the second region
120(2) displaying the phone number, name, and the like of the
caller of an incoming call.
[0142] Note that the data processing device 100B can be provided
with a vibration sensor or the like and a memory device that stores
a program for shifting a mode into an incoming call rejection mode
in accordance with vibration sensed by the vibration sensor or the
like. Thus, the user can shift the mode into the incoming call
rejection mode by tapping the data processing device 100B over
his/her clothes so as to apply vibration.
<<Display Portion>>
[0143] There is no particular limitation on the display portion 130
as long as the display portion 130 can display supplied image data
(see FIG. 3B). For example, the display portion that can be used in
the data processing device 100 can be used in the data processing
device 100B.
[0144] The display portion 130 includes the first display portion
130(1) and the second display portion 130(2). Note that a plurality
of second display portions 130(2) may be provided.
[0145] The first display portion 130(1) displays the first image
data V1 that is supplied thereto, and the second display portion
130(2) displays the second image data V2 that is supplied
thereto.
[0146] The first display portion 130(1) and the second display
portion 130(2) may be driven as one display portion. For example,
one driver circuit may supply signals to select scan lines.
[0147] The first display portion 130(1) and the second display
portion 130(2) may be driven as different display portions. For
example, separate driver circuits may be provided for the display
portions, and the driver circuits may supply signals to select scan
lines to the corresponding display portions.
[0148] For example, when the data processing device 100B is in a
standby state, only the second display portion 130(2) may be
driven, and drive of the first display portion 130(1) may be
stopped. Stopping drive of the first display portion 130(1) can
reduce power consumption.
[0149] Note that a flexible display portion which can be bent at
positions overlapping with the first curved portion 120c(1) and the
second curved portion 120c(2) can be used as the display portion
130. Specific examples of structures that can be employed in the
display portion 130 are described in Embodiments 4 to 6.
<<Sensing Portion>>
[0150] The sensing portion 150 senses the states of the data
processing device 100B and the circumstances and supplies sensing
data (see FIG. 1 and FIGS. 3A1 and 3A2).
[0151] The sensing portion 150 includes the first sensing portion
150(1) and the second sensing portion 150(2). The first sensing
portion senses an object obscuring the first display portion
130(1), and the second sensing portion senses an object obscuring
the second display portion 130(2). Then, the first sensing portion
150(1) supplies the first sensing data S1 including data about
whether the first display portion 130(1) is obscured or not, and
the second sensing portion 150(2) supplies the second sensing data
S2 including data about whether the second display portion 130(2)
is obscured or not. Note that in the case where a plurality of
second display portions are provided, the second sensing data
includes data about whether any one of the second display portions
is obscured or not.
[0152] A sensing element that can be used in the first sensing
portion 150(1) can be used in the second sensing portion 150(2).
For example, a photoelectric conversion element provided so as to
sense an object obscuring the second display portion 130(2) can be
used in the second sensing portion 150(2).
[0153] Specifically, a photoelectric conversion element 150PD(1) is
provided in the first region 120(1) so as to sense the intensity of
light incident from a side where the first region 120(1) displays
an image, and a photoelectric conversion element 150PD(2) is
provided in the second region 120(2) so as to sense the intensity
of light incident from a side where the second display portion
130(2) displays an image (see FIG. 3A1 or 3A2).
[0154] This makes it possible to sense that the first region
including the photoelectric conversion element 150PD(1) and/or the
second region including the photoelectric conversion element
150PD(2) of the data processing device 100B are/is covered with a
protective case or cover for the data processing device 100B,
clothes, or the like.
[0155] The sensing portion 150 may be configured to sense an object
obscuring another display portion.
<<Positional Data Input Portion>>
[0156] There is no particular limitation on the positional data
input portion 140 as long as the positional data input portion 140
can supply positional data (see FIG. 3B). For example, the
positional data input portion that can be used in the data
processing device 100 can be used in the data processing device
100B.
[0157] Note that a flexible positional data input portion which can
be bent at a position overlapping with the first curved portion
120c(1) can be used as the positional data input portion 140.
Specific examples of structures that can be employed in the
positional data input portion 140 are described in Embodiments 4 to
6.
[0158] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 2
[0159] In this embodiment, a structure of a data processing device
of one embodiment of the present invention will be described with
reference to FIG. 4 and FIGS. 5A1, 5A2, 5B, 5C, and 5D.
[0160] FIG. 4 illustrates that a display portion 130, a positional
data input portion 140, and a sensing portion 150 of a data
processing device 100C of one embodiment of the present invention
differ from those of the data processing device 100 illustrated in
FIG. 1.
[0161] FIGS. 5A1, 5A2, 5B, 5C, and 5D illustrate a structure of the
data processing device 100C of one embodiment of the present
invention.
[0162] FIG. 5A1 is a top view of the data processing device 100C in
an unfolded state, and FIG. 5A2 is a bottom view of the data
processing device 100C in the unfolded state.
[0163] FIG. 5B is a side view of the data processing device 100C,
and FIG. 5C is a side view including a cross section taken along a
cutting-plane line Y1-Y2 in FIG. 5A1.
[0164] FIGS. 6A1, 6A2, 6B1, and 6B2 illustrate the data processing
device 100C in half-folded states. FIGS. 6A1 and 6A2 are side views
illustrating a folded state in which a display portion in a first
region 120(1) faces inward. FIGS. 6B1 and 6B2 are side views
illustrating a folded state in which the display portion in the
first region 120(1) faces outward.
Example 3 of Structure of Data Processing Device
[0165] The data processing device 100C described in this embodiment
(see FIG. 4) differs from the data processing device 100 described
in Embodiment 1 with reference to FIG. 1, in the following points:
the input and output device 120 is supplied with first image data
V1 (V1 includes V1a and V1b) and the second image data V2 and
supplies first positional data L1 (L1 includes L1a and L1b), the
second positional data L2, first sensing data S1 (S1 includes S1a
and S1b), and the second sensing data S2; the first display portion
130(1) includes a display portion 130(1a) and a display portion
130(1b); the first positional data input portion 140(1) includes a
positional data input portion 140(1a) and a positional data input
portion 140(1b); the first sensing portion 150(1) includes a
sensing portion 150(1a) and a sensing portion 150(1b); and the
first region 120(1) includes the input and output device that can
be folded or unfolded. Different parts are described in detail
below, and the above description is referred to for the other
similar parts.
[0166] The input and output device 120 includes the first region
120(1) and the second region 120(2). The first region 120(1)
includes the region 120(1a) and the region 120(1b). The first
region 120(1) can be folded at a portion between the region 120(1a)
and the region 120(1b) (see FIG. 4).
[0167] The region 120(1a) includes the display portion 130(1a) and
the positional data input portion 140(1a), and the region 120(1b)
includes the display portion 130(1b) and the positional data input
portion 140(1b) (see FIG. 4 and FIG. 5C).
[0168] The second region 120(2) includes the display portion 130(2)
and the positional data input portion 140(2).
[0169] The sensing portion 150 includes the sensing portion
150(1a), the sensing portion 150(1b), and the sensing portion
150(2). The sensing portion 150(1a) is provided in a housing 15a so
as to be able to sense an object obscuring the display portion in
the region 120(1a), and the sensing portion 150(1b) is provided in
a housing 15b so as to be able to sense an object obscuring the
display portion in the region 120(1b) (see FIG. 5A1).
[0170] FIGS. 6A1 and 6A2 are side views of the data processing
device 100C in a half-folded state in which the sensing portion
150(1a) is located on the inner side. The region 120(1a) faces the
region 120(1b), and the region 120(1a) is obscured by the region
120(1b). The region 120(1b) is obscured by the region 120(1a).
[0171] The second region 120(2) of the data processing device 100C
in this folded state can display an image in one direction
indicated by an arrow in FIG. 6A1.
[0172] The folded state in which the first region 120(1) faces
inward can be found from the sensing data S1a supplied from the
sensing portion 150(1a) and/or the sensing data S1b supplied from
the sensing portion 150(1b). Then, drive of an obscured portion of
the first display portion 130(1) may be stopped. This can reduce
power consumption.
[0173] FIGS. 6B1 and 6B2 illustrate the data processing device 100C
in a half-folded state in which the sensing portion 150(1a) is
located on the outer side. A back side of the region 120(1a) faces
a back side of the region 120(1b), and the region 120(1a) or the
region 120(1b) is not obscured by the other region.
[0174] The first region 120(1) of the data processing device 100C
in this folded state can display an image in three directions
indicated by arrows in FIG. 6B2. In addition, the second region
120(2) can display an image in another direction.
[0175] The orientation of the data processing device 100C or the
like can be found from the sensing data S1a supplied from the
sensing portion 150(1a), the sensing data S1b supplied from the
sensing portion 150(1b), or sensing data supplied from a gravity
sensor or a gyro sensor. Then, a portion where display is not
necessary in the first region 120(1) may be determined from a
combination of these pieces of sensing data, and its drive may be
stopped. This can reduce power consumption.
[0176] The data processing device 100C includes the first region
120(1) which can be folded or unfolded. Accordingly, the data
processing device 100C can be used with the first region having a
highly portable size or a highly browsable size. Consequently, a
novel data processing device can be provided.
[0177] The data processing device 100C includes the input and
output device 120 that is supplied with the first image data V1 and
the second image data V2 and supplies the first sensing data S1,
and an arithmetic device 110 that supplies the first image data V1
and the second image data V2 and is supplied with the first sensing
data S1 (see FIG. 4).
[0178] The input and output device 120 includes a terminal 125 that
is supplied with the first image data V1 and the second image data
V2, the first display portion 130(1) that is supplied with and
displays the first image data V1, the second display portion 130(2)
that is supplied with and displays the second image data V2, and
the first sensing portion 150(1) that senses an object obscuring
the first display portion 130(1) and supplies the first sensing
data S1 (FIG. 4 and FIG. 5C).
[0179] The input and output device 120 also includes the first
region 120(1) provided with the first display portion 130(1), the
second region 120(2) provided with the second display portion
130(2), a third region 120(3) provided with the terminal 125, the
first curved portion 120c(1) between the first region 120(1) and
the second region 120(2), and the second curved portion 120c(2)
between the first region 120(1) and the third region 120(3) (FIG.
5C).
[0180] The third region 120(3) supplies the first image data V1 and
the second image data V2. The first region 120(1) is supplied with
the first image data V1 and the second image data V2 and supplies
the second image data V2. The second region 120(2) is supplied with
the second image data V2 (FIG. 5D).
[0181] The arithmetic portion 111 generates the first image data V1
or the second image data V2 based on the first sensing data S1.
[0182] The data processing device 100C includes the first region
120(1) provided with the first display portion 130(1), the second
region 120(2) provided with the second display portion 130(2), the
third region 120(3) provided with the terminal 125, the first
curved portion 120c(1) between the first region 120(1) and the
second region 120(2), and the second curved portion 120c(2) between
the first region 120(1) and the third region 120(3). Accordingly,
the terminal 125 can supply the first image data V1 and the second
image data V2. The first region 120(1) can display the first image
data V1 and supplies the second image data V2, and the second
region 120(2) can display the second image data V2. Consequently, a
novel data processing device can be provided.
[0183] Individual components included in the data processing device
100C are described below. Note that these portions cannot be
clearly distinguished and one portion also serves as another
portion or includes part of another portion in some cases.
[0184] The data processing device 100C differs from the data
processing device described in Embodiment 1 in that a foldable
housing is included and that the first region 120(1) can be folded.
Different parts are described in detail below, and the above
description is referred to for the other similar parts.
<<Entire Structure>>
[0185] The data processing device 100C includes the input and
output device 120, and the input and output device 120 includes the
first region 120(1) which can be folded or unfolded. In the input
and output device 120, the second region 120(2) is provided such
that the first curved portion 120c(1) is located between the first
region 120(1) and the second region 120(2), and the third region
120(3) is provided such that the second curved portion 120c(2) is
located between the first region 120(1) and the third region 120(3)
(see FIG. 4 and FIGS. 5A1, 5A2, 5B, 5C, and 5D). Note that a signal
line is provided in the first region 120(1), the second region
120(2), and the third region 120(3), and the first region 120(1) is
electrically connected to the second region 120(2) and the third
region 120(3).
[0186] The first region 120(1) can be folded or unfolded and is
held in a foldable housing.
[0187] Note that the sensing portion 150(1a) and the sensing
portion 150(1b) may be provided.
<<Housing>>
[0188] The housing allows the first region 120(1) to be folded or
unfolded.
[0189] For example, the data processing device 100C includes
housings 13a and 13b which are flexible and the housings 15a and
15b which are less flexible than the housings 13a and 13b.
[0190] A flexible member or a hinge can be used for the foldable
housing. Note that the housing may be folded or unfolded by a
method using user's hands, a spring, a motor, a piezoelectric
element, or the like.
[0191] Specifically, a resin, a rubber, a silicone rubber, or the
like can be used for the flexible member. Alternatively, a metal,
an alloy, an engineering plastic, or the like can be used for the
hinge.
[0192] The data processing device 100C may include a housing that
is more rigid than the foldable housing.
[0193] The housing 13a is shaped so as not to obscure the first
region 120(1) and the second region 120(2) (see FIG. 5A1), and the
display portion 130 and the positional data input portion 140 are
provided between the housing 13a and the housing 13b (see FIG.
5B).
[0194] The housings 13a and 13b connect the housings 15a and 15b
(see FIGS. 5A1 and 5A2).
[0195] The housing 15a is shaped so as not to obscure the first
region 120(1) (see FIGS. 5A1 and 5C).
[0196] In the housing 15a, the arithmetic device 110 is stored. The
arithmetic device 110 includes the terminal that supplies the first
image data V1 and the second image data V2 and is supplied with the
first sensing data S1.
[0197] The housing 15b has an opening so as not to obscure the
first region 120(1) and the second region 120(2). Specifically, the
housing 15a has an opening so as not to obscure the first region
120(1), and the housing 15b has an opening at a right-hand side
surface so as not to obscure the second region 120(2).
[0198] Note that a user of the data processing device 100C can hold
the data processing device 100C with the other hand such that the
second region 120(2) is positioned on a left-hand side.
[0199] The first image data V1 or the second image data V2 may be
generated on the basis of sensing data about the orientation of the
data processing device 100C which is supplied from the sensing
portion 150. Accordingly, favorable display can be performed
according to which hand is used to hold the data processing device
100C. For example, a user can hold the housing 15a with his/her
left hand so that his/her right hand can be used to supply
positional data from the positional data input portion 140(2) in
the second region 120(2).
<<Display Portion and Positional Data Input
Portion>>
[0200] The input and output device 120 includes the first region
120(1) that can be folded. Note that the first region 120(1)
includes the first display portion 130(1) and the first sensing
portion 150(1).
[0201] For example, an input and output device including a flexible
substrate and a thin film element formed over the flexible
substrate can be used as the input and output device 120.
[0202] With the use of a foldable input and output device in the
first region 120(1) and the second region 120(2), the first region
120(1) and the second region 120(2) can be integrated. Note that
specific examples of structures that can be employed in the
foldable input and output device 120 are described in Embodiments 4
to 6.
[0203] The input and output device 120 includes the terminal 125 in
the third region 120(3). The third region 120(3) includes the
terminal 125 that is supplied with the first image data V1 and the
second image data V2 and supplies the first sensing data S1 (see
FIG. 5D).
[0204] The input and output device 120 includes a plurality of
wirings. For example, a wiring 126 is electrically connected to the
terminal 125, through which a signal, a power supply potential, or
the like can be supplied to the terminal.
[0205] Specifically, through a wiring in the third region 120(3),
the first image data V1 and the second image data V2 supplied
thereto are supplied to the first region 120(1). Through a wiring
in the first region 120(1), the second image data V2 supplied
thereto is supplied to the second region 120(2).
[0206] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 3
[0207] In this embodiment, a structure of a data processing device
of one embodiment of the present invention will be described with
reference to FIGS. 7 and 8.
[0208] FIG. 7 is a flowchart showing a program for the data
processing device of one embodiment of the present invention. FIG.
8 is a flowchart illustrating an interrupt processing of the
program described with reference to FIG. 7.
Example 1 of Structure of Data Processing Device
[0209] The data processing devices 100, 100B, and 100C described in
this embodiment each include the memory portion 112 that stores the
program including the following steps.
<<First Step>>
[0210] In a first step, initial data including status data is
acquired (S1 in FIG. 7).
[0211] The initial data used in a later step is acquired. For
example, as the status data, predetermined data may be used, or
sensing data supplied from the sensing portion may be used.
<<Second Step>>
[0212] In a second step, an interrupt processing is allowed (S2 in
FIG. 7). Note that when the interrupt processing is allowed, the
arithmetic portion 111 can receive an instruction to execute the
interrupt processing. The arithmetic portion 111 that has received
the instruction to execute the interrupt processing stops the main
processing and executes the interrupt processing. For example, the
arithmetic portion 111 that has received an event associated with
the instruction executes the interrupt processing, and stores the
execution result in the memory portion. Then, the arithmetic
portion 111 that has returned from the interrupt processing can
resume the main processing on the basis of the execution result of
the interrupt processing.
<<Third Step>>
[0213] In a third step, predetermined data is acquired (S3 in FIG.
7).
[0214] Predetermined data which is the basis of first image data or
second image data generated in a later step is acquired. For
example, image data or text data whose size has not yet been
optimized for the first region 120(1) or the second region 120(2)
is acquired. Note that an operating instruction or data supplied in
the interrupt processing is reflected in the third and subsequent
steps.
<<Fourth Step>>
[0215] In a fourth step, a fifth step is selected when the status
data shows a first status, or a sixth step is selected when the
status data shows a second status (S4 in FIG. 7).
[0216] For example, the fifth step is selected when the first
region 120(1) is not obscured according to the status data
determined on the basis of the first sensing data S1 supplied from
the first sensing portion 150(1), or the sixth step is selected
when the first region 120(1) is obscured.
<<Fifth Step>>
[0217] In the fifth step, the first image data V1 is generated on
the basis of the data acquired in the third step, and the first
image data V1 is displayed on the first display portion 130(1) (S5
in FIG. 7).
[0218] For example, the first image data V1 is generated such that
text information is displayed in a single line or a plurality of
lines. It can also be generated on the basis of the orientation or
size of the first display portion 130(1) or a preferred design set
by a user.
<<Sixth Step>>
[0219] In the sixth step, the second image data V2 is generated on
the basis of the data acquired in the third step, and the second
image data V2 is displayed on the second display portion 130(2) (S6
in FIG. 7).
[0220] For example, the second image data V2 is generated such that
text information is displayed so as to move from one side to the
other. It can also be generated on the basis of the orientation or
size of the second display portion 130(2) or a preferred design set
by a user.
<<Seventh Step>>
[0221] In a seventh step, an eighth step is selected when a
termination instruction is supplied in the interrupt processing, or
the third step is selected when no termination instruction is
supplied in the interrupt processing (S7 in FIG. 7).
<<Eighth Step>>
[0222] In the eighth step, the program terminates (S8 in FIG.
7).
<<Interrupt Processing>>
[0223] The interrupt processing includes the following steps.
<<Ninth Step>>
[0224] In a ninth step, the first sensing data S1 and the second
sensing data S2 are acquired (T9 in FIG. 8)
[0225] Specifically, the first sensing data S1 supplied from the
first sensing portion 150(1) and the second sensing data S2
supplied from the second sensing portion 150(2) are acquired using
a timer or the like.
<<Tenth Step>>
[0226] In a tenth step, candidate data based on the first sensing
data S1 is determined (T10 in FIG. 8).
<<Eleventh Step>>
[0227] In an eleventh step, a twelfth step is selected when the
candidate data differs from the status data, or the ninth step is
selected when the candidate data is the same as the status data
(T11 in FIG. 8).
<<Twelfth Step>>
[0228] In the twelfth step, the status data is updated with the
candidate data (T12 in FIG. 8).
[0229] For example, the status data is updated when there is a
change in the first sensing data S1.
<<Thirteenth Step>>
[0230] In a thirteenth step, the operation returns from the
interrupt processing (T13 in FIG. 8).
[0231] Note that the status data updated in the interrupt
processing is reflected in the third and subsequent steps. The
operation proceeds to the eighth step and terminates when a
termination instruction is supplied in the interrupt
processing.
[0232] In the above-described data processing device of one
embodiment of the present invention, the program includes the step
of determining the candidate data by acquiring the first sensing
data; the step of updating the status data with the candidate data
when the status data differs from the candidate data; and the step
of generating and displaying image data including predetermined
data based on the updated status data. Thus, an image including the
predetermined data which is based on the status data can be
displayed on a predetermined region. Consequently, a novel data
processing device can be provided.
[0233] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 4
[0234] In this embodiment, a structure of a bendable or foldable
touch panel that can be used in the display portion 130 and the
positional data input portion 140 of the data processing device of
one embodiment of the present invention will be described with
reference to FIGS. 9A to 9C.
[0235] FIG. 9A is a top view illustrating the structure of the
touch panel that can be used in the data processing device of one
embodiment of the present invention.
[0236] FIG. 9B is a cross-sectional view taken along cutting-plane
lines A-B and C-D in FIG. 9A.
[0237] FIG. 9C is a cross-sectional view taken along a
cutting-plane line E-F in FIG. 9A.
<Top View>
[0238] A touch panel 300 described as an example in this embodiment
includes a display portion 301 (see FIG. 9A).
[0239] The display portion 301 includes a plurality of pixels 302
and a plurality of imaging pixels 308. The imaging pixels 308 can
sense a touch of a finger or the like on the display portion 301.
Thus, a touch sensor can be formed using the imaging pixels
308.
[0240] Each of the pixels 302 includes a plurality of sub-pixels
(e.g., a sub-pixel 302R). In the sub-pixels, light-emitting
elements and pixel circuits that can supply electric power for
driving the light-emitting elements are provided.
[0241] The pixel circuits are electrically connected to wirings
through which selection signals and image signals are supplied.
[0242] The touch panel 300 is provided with a scan line driver
circuit 303g(1) that can supply selection signals to the pixels 302
and an image signal line driver circuit 303s(1) that can supply
image signals to the pixels 302.
[0243] The imaging pixels 308 include photoelectric conversion
elements and imaging pixel circuits that drive the photoelectric
conversion elements.
[0244] The imaging pixel circuits are electrically connected to
wirings through which control signals and power supply potentials
are supplied.
[0245] Examples of the control signals include a signal for
selecting an imaging pixel circuit from which a recorded imaging
signal is read, a signal for initializing an imaging pixel circuit,
and a signal for determining the time for an imaging pixel circuit
to sense light.
[0246] The touch panel 300 is provided with an imaging pixel driver
circuit 303g(2) that can supply control signals to the imaging
pixels 308 and an imaging signal line driver circuit 303s(2) that
reads out imaging signals.
<Cross-Sectional View>
[0247] The touch panel 300 includes a substrate 310 and a counter
substrate 370 opposite to the substrate 310 (see FIG. 9B).
[0248] By using a flexible material for the substrate 310 and the
counter substrate 370, the touch panel 300 can have
flexibility.
[0249] Note that when the flexible touch panel 300 is changed in
shape, stress is applied to a functional element provided in the
touch panel 300. A functional element is preferably positioned in
the center between the substrate 310 and the counter substrate 370
because a change in shape of the functional element can be
prevented.
[0250] Furthermore, the substrate 310 is preferably formed using a
material whose coefficient of linear expansion is substantially
equal to that of the counter substrate 370. For example, the
coefficients of linear expansion of the materials are preferably
lower than or equal to 1.times.10.sup.-3/K, further preferably
lower than or equal to 5.times.10.sup.-5/K, and still further
preferably lower than or equal to 1.times.10.sup.-5/K.
[0251] For example, materials that include polyester, polyolefin,
polyamide (e.g., nylon, aramid), polyimide, polycarbonate, or a
resin having an acrylic bond, a urethane bond, an epoxy bond, or a
siloxane bond can be used for the substrate 310 and the counter
substrate 370.
[0252] The substrate 310 is a stacked body in which a substrate
310b having flexibility, a barrier film 310a that prevents
unintentional diffusion of impurities to the light-emitting
elements, and a resin layer 310c that attaches the barrier film
310a to the substrate 310b are stacked.
[0253] The counter substrate 370 is a stacked body including a
substrate 370b having flexibility, a barrier film 370a that
prevents unintentional diffusion of impurities to the
light-emitting elements, and a resin layer 370c that attaches the
barrier film 370a to the substrate 370b (see FIG. 9B).
[0254] A sealant 360 attaches the counter substrate 370 to the
substrate 310. The sealant 360, also serving as an optical adhesive
layer, has a refractive index higher than that of air. The pixel
circuits and the light-emitting elements (e.g., a first
light-emitting element 350R) are provided between the substrate 310
and the counter substrate 370.
<<Structure of Pixel>>
[0255] Each of the pixels 302 includes the sub-pixel 302R, a
sub-pixel 302G, and a sub-pixel 302B (see FIG. 9C). The sub-pixel
302R includes a light-emitting module 380R, the sub-pixel 302G
includes a light-emitting module 380G, and the sub-pixel 302B
includes a light-emitting module 380B.
[0256] For example, the sub-pixel 302R includes the first
light-emitting element 350R and the pixel circuit that can supply
electric power to the first light-emitting element 350R and
includes a transistor 302t (see FIG. 9B). The light-emitting module
380R includes the first light-emitting element 350R and an optical
element (e.g., a first coloring layer 367R).
[0257] The first light-emitting element 350R includes a first lower
electrode 351R, an upper electrode 352, and a layer 353 containing
a light-emitting organic compound between the first lower electrode
351R and the upper electrode 352 (see FIG. 9C).
[0258] The layer 353 containing a light-emitting organic compound
includes a light-emitting unit 353a, a light-emitting unit 353b,
and an intermediate layer 354 between the light-emitting units 353a
and 353b.
[0259] The first coloring layer 367R of the light-emitting module
380R is provided on the counter substrate 370. The coloring layer
transmits light of a particular wavelength and is, for example, a
layer that selectively transmits light of red, green, or blue
color. A region that transmits light emitted from the
light-emitting element as it is may be provided.
[0260] The light-emitting module 380R, for example, includes the
sealant 360 that is in contact with the first light-emitting
element 350R and the first coloring layer 367R.
[0261] The first coloring layer 367R is positioned in a region
overlapping with the first light-emitting element 350R.
Accordingly, part of light emitted from the first light-emitting
element 350R passes through the sealant 360 that also serves as an
optical adhesive layer and through the first coloring layer 367R
and is emitted to the outside of the light-emitting module 380R as
indicated by arrows in FIGS. 9B and 9C.
<<Structure of Display Panel>>
[0262] The touch panel 300 includes a light-blocking layer 367BM on
the counter substrate 370. The light-blocking layer 367BM is
provided so as to surround the coloring layer (e.g., the first
coloring layer 367R).
[0263] The touch panel 300 includes an anti-reflective layer 367p
positioned in a region overlapping with the display portion 301. As
the anti-reflective layer 367p, a circular polarizing plate can be
used, for example.
[0264] The touch panel 300 includes an insulating film 321. The
insulating film 321 covers the transistor 302t. Note that the
insulating film 321 can be used as a layer for planarizing
unevenness caused by the pixel circuits. An insulating film on
which a layer that can prevent diffusion of impurities to the
transistor 302t and the like is stacked can be used as the
insulating film 321.
[0265] The touch panel 300 includes the light-emitting elements
(e.g., the first light-emitting element 350R) over the insulating
film 321.
[0266] The touch panel 300 includes, over the insulating film 321,
a partition wall 328 that overlaps with an end portion of the first
lower electrode 351R (see FIG. 9C). In addition, a spacer 329 that
controls the distance between the substrate 310 and the counter
substrate 370 is provided over the partition wall 328.
<<Structure of Image Signal Line Driver Circuit>>
[0267] The image signal line driver circuit 303s(1) includes a
transistor 303t and a capacitor 303c. Note that the driver circuit
can be formed in the same process and over the same substrate as
those of the pixel circuits.
<<Structure of Imaging Pixel>>
[0268] The imaging pixels 308 each include a photoelectric
conversion element 308p and an imaging pixel circuit for sensing
light received by the photoelectric conversion element 308p. The
imaging pixel circuit includes a transistor 308t.
[0269] For example, a PIN photodiode can be used as the
photoelectric conversion element 308p.
<<Other Components>>
[0270] The touch panel 300 includes a wiring 311 through which a
signal is supplied. The wiring 311 is provided with a terminal 319.
Note that an FPC 309(1) through which a signal such as an image
signal or a synchronization signal is supplied is electrically
connected to the terminal 319.
[0271] Note that a printed wiring board (PWB) may be attached to
the FPC 309(1).
[0272] Transistors formed in the same process can be used as the
transistor 302t, the transistor 303t, the transistor 308t, and the
like.
[0273] Transistors of a bottom-gate type, a top-gate type, or the
like can be used.
[0274] Any of various kinds of semiconductors can be used in the
transistors. For example, an oxide semiconductor, single crystal
silicon, polysilicon, amorphous silicon, or the like can be
used.
[0275] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 5
[0276] In this embodiment, a structure of a bendable or foldable
touch panel that can be used in the data processing device of one
embodiment of the present invention will be described with
reference to FIGS. 10A and 10B and FIGS. 11A to 11C.
[0277] FIG. 10A is a perspective view of a touch panel 500
described as an example in this embodiment. Note that FIGS. 10A and
10B illustrate only main components for simplicity. FIG. 10B is a
developed perspective view of the touch panel 500.
[0278] FIGS. 11A to 11C are cross-sectional views of the touch
panel 500 taken along line X1-X2 in FIG. 10A.
[0279] The touch panel 500 includes a display portion 501 and a
touch sensor 595 (see FIG. 10B). The touch panel 500 includes a
substrate 510, a substrate 570, and a substrate 590. Note that the
substrate 510, the substrate 570, and the substrate 590 each have
flexibility.
[0280] The display portion 501 includes the substrate 510, a
plurality of pixels over the substrate 510, a plurality of wirings
511 through which signals are supplied to the pixels, and an image
signal line driver circuit 503s(1). The plurality of wirings 511
are led to a peripheral portion of the substrate 510, and parts of
the plurality of wirings 511 form a terminal 519. The terminal 519
is electrically connected to an FPC 509(1).
<Touch Sensor>
[0281] The substrate 590 includes the touch sensor 595 and a
plurality of wirings 598 electrically connected to the touch sensor
595. The plurality of wirings 598 are led to a peripheral portion
of the substrate 590, and parts of the plurality of wirings 598
form a terminal. The terminal is electrically connected to an FPC
509(2). Note that in FIG. 10B, electrodes, wirings, and the like of
the touch sensor 595 provided on the back side of the substrate 590
(the side facing the substrate 510) are indicated by solid lines
for clarity.
[0282] As the touch sensor 595, a capacitive touch sensor can be
used. Examples of the capacitive touch sensor are a surface
capacitive touch sensor and a projected capacitive touch
sensor.
[0283] Examples of the projected capacitive touch sensor are a self
capacitive touch sensor and a mutual capacitive touch sensor, which
differ mainly in the driving method. The use of a mutual capacitive
type is preferable because multiple points can be sensed
simultaneously.
[0284] An example of using a projected capacitive touch sensor is
described below with reference to FIG. 10B.
[0285] Note that a variety of sensors that can sense proximity or
touch of a sensing target such as a finger can be used.
[0286] The projected capacitive touch sensor 595 includes
electrodes 591 and electrodes 592. The electrodes 591 are
electrically connected to any of the plurality of wirings 598, and
the electrodes 592 are electrically connected to any of the other
wirings 598.
[0287] The electrodes 592 each have a shape of a plurality of
quadrangles arranged in one direction with one corner of a
quadrangle connected to one corner of another quadrangle as
illustrated in FIGS. 10A and 10B.
[0288] The electrodes 591 each have a quadrangular shape and are
arranged in a direction intersecting with the direction in which
the electrodes 592 extend.
[0289] A wiring 594 electrically connects two electrodes 591
between which the electrode 592 is positioned. The intersecting
area of the electrode 592 and the wiring 594 is preferably as small
as possible. Such a structure allows a reduction in the area of a
region where the electrodes are not provided, reducing unevenness
in transmittance. As a result, unevenness in luminance of light
passing through the touch sensor 595 can be reduced.
[0290] Note that the shapes of the electrodes 591 and the
electrodes 592 are not limited thereto and can be any of a variety
of shapes. For example, a structure may be employed in which the
plurality of electrodes 591 are arranged so that gaps between the
electrodes 591 are reduced as much as possible, and the electrodes
592 are spaced apart from the electrodes 591 with an insulating
layer interposed therebetween to have regions not overlapping with
the electrodes 591. In this case, it is preferable to provide,
between two adjacent electrodes 592, a dummy electrode electrically
insulated from these electrodes because the area of regions having
different transmittances can be reduced.
[0291] The structure of the touch sensor 595 is described with
reference to FIGS. 11A to 11C.
[0292] The touch sensor 595 includes the substrate 590, the
electrodes 591 and the electrodes 592 provided in a staggered
arrangement on the substrate 590, an insulating layer 593 covering
the electrodes 591 and the electrodes 592, and the wiring 594 that
electrically connects the adjacent electrodes 591 to each
other.
[0293] A resin layer 597 attaches the substrate 590 to the
substrate 570 so that the touch sensor 595 overlaps with the
display portion 501.
[0294] The electrodes 591 and the electrodes 592 are formed using a
light-transmitting conductive material. As a light-transmitting
conductive material, a conductive oxide such as indium oxide,
indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide to
which gallium is added can be used. Note that a film including
graphene may be used as well. The film including graphene can be
formed, for example, by reducing a film containing graphene oxide.
As a reducing method, a method with application of heat or the like
can be employed.
[0295] The electrodes 591 and the electrodes 592 may be formed by
depositing a light-transmitting conductive material on the
substrate 590 by a sputtering method and then removing an
unnecessary portion by any of various patterning techniques such as
photolithography.
[0296] Examples of a material for the insulating layer 593 are a
resin such as an acrylic resin or an epoxy resin, a resin having a
siloxane bond, and an inorganic insulating material such as silicon
oxide, silicon oxynitride, or aluminum oxide.
[0297] Openings reaching the electrodes 591 are formed in the
insulating layer 593, and the wiring 594 electrically connects the
adjacent electrodes 591. A light-transmitting conductive material
can be favorably used as the wiring 594 because the aperture ratio
of the touch panel can be increased. Moreover, a material with
higher conductivity than the conductivities of the electrodes 591
and 592 can be favorably used for the wiring 594 because electric
resistance can be reduced.
[0298] One electrode 592 extends in one direction, and a plurality
of electrodes 592 are provided in the form of stripes.
[0299] The wiring 594 intersects with the electrode 592.
[0300] Adjacent electrodes 591 are provided with one electrode 592
provided therebetween. The wiring 594 electrically connects the
adjacent electrodes 591.
[0301] Note that the plurality of electrodes 591 are not
necessarily arranged in the direction orthogonal to one electrode
592 and may be arranged to intersect with one electrode 592 at an
angle of less than 90 degrees.
[0302] One wiring 598 is electrically connected to any of the
electrodes 591 and 592. Part of the wiring 598 functions as a
terminal. For the wiring 598, a metal material such as aluminum,
gold, platinum, silver, nickel, titanium, tungsten, chromium,
molybdenum, iron, cobalt, copper, or palladium or an alloy material
containing any of these metal materials can be used.
[0303] Note that an insulating layer that covers the insulating
layer 593 and the wiring 594 may be provided to protect the touch
sensor 595.
[0304] A connection layer 599 electrically connects the wiring 598
to the FPC 509(2).
[0305] As the connection layer 599, any of various anisotropic
conductive films (ACF), anisotropic conductive pastes (ACP), or the
like can be used.
[0306] The resin layer 597 has a light-transmitting property. For
example, a thermosetting resin or an ultraviolet curable resin can
be used; specifically, a resin such as an acrylic resin, a urethane
resin, an epoxy resin, or a resin having a siloxane bond can be
used.
<Display Portion>
[0307] The display portion 501 includes a plurality of pixels
arranged in a matrix. Each of the pixels includes a display element
and a pixel circuit for driving the display element.
[0308] In this embodiment, an example of using an organic
electroluminescent element that emits white light as a display
element will be described; however, the display element is not
limited to such an element.
[0309] For example, organic electroluminescent elements that emit
light of different colors may be included in sub-pixels so that the
light of different colors can be emitted from the respective
sub-pixels.
[0310] Other than organic electroluminescent elements, any of
various display elements such as display elements (electronic ink)
that perform display by an electrophoretic method, an electronic
liquid powder method, an electrowetting method, or the like; MEMS
shutter display elements; optical interference type MEMS display
elements; and liquid crystal elements can be used. Furthermore,
this embodiment can be used in a transmissive liquid crystal
display, a transflective liquid crystal display, a reflective
liquid crystal display, a direct-view liquid crystal display, or
the like. In the case of a transflective liquid crystal display or
a reflective liquid crystal display, some of or all of pixel
electrodes function as reflective electrodes. For example, some or
all of pixel electrodes are formed to contain aluminum, silver, or
the like. In such a case, a memory circuit such as an SRAM can be
provided under the reflective electrodes, leading to lower power
consumption. A structure suitable for employed display elements can
be selected from a variety of structures of pixel circuits.
[0311] In the display portion, an active matrix method in which an
active element is included in a pixel or a passive matrix method in
which an active element is not included in a pixel can be used.
[0312] In an active matrix method, as an active element (a
non-linear element), not only a transistor but also various active
elements (non-linear elements) can be used. For example, a metal
insulator metal (MIM), a thin film diode (TFD), or the like can
also be used. Since such an element has few numbers of
manufacturing steps, manufacturing cost can be reduced or yield can
be improved. Alternatively, since the size of the element is small,
the aperture ratio can be improved, so that power consumption can
be reduced or higher luminance can be achieved.
[0313] As a method other than the active matrix method, the passive
matrix method in which an active element (a non-linear element) is
not used can also be used. Since an active element (a non-linear
element) is not used, the number of manufacturing steps is small,
so that manufacturing cost can be reduced or yield can be improved.
Alternatively, since an active element (a non-linear element) is
not used, the aperture ratio can be improved, so that power
consumption can be reduced or higher luminance can be achieved, for
example.
[0314] Flexible materials can be favorably used for the substrate
510 and the substrate 570.
[0315] Materials with which unintended passage of impurities is
inhibited can be favorably used for the substrate 510 and the
substrate 570. For example, materials with a vapor permeability of
lower than or equal to 10.sup.-5 g/m.sup.2day, preferably lower
than or equal to 10.sup.-6 g/m.sup.2day can be favorably used.
[0316] The substrate 510 can be favorably formed using a material
whose coefficient of linear expansion is substantially equal to
that of the substrate 570. For example, the coefficients of linear
expansion of the materials are preferably lower than or equal to
1.times.10.sup.-5/K, further preferably lower than or equal to
5.times.10.sup.-5/K, and still further preferably lower than or
equal to 1.times.10.sup.-5/K.
[0317] The substrate 510 is a stacked body in which a substrate
510b having flexibility, a barrier film 510a that prevents
unintentional diffusion of impurities to the light-emitting
elements, and a resin layer 510c that attaches the barrier film
510a to the substrate 510b are stacked.
[0318] For example, materials that include polyester, polyolefin,
polyamide (e.g., nylon, aramid), polyimide, polycarbonate, or a
resin having an acrylic bond, a urethane bond, an epoxy bond, or a
siloxane bond can be used for the resin layer 510c.
[0319] The substrate 570 is a stacked body including a substrate
570b having flexibility, a barrier film 570a that prevents
unintentional diffusion of impurities to the light-emitting
elements, and a resin layer 570c that attaches the barrier film
570a to the substrate 570b.
[0320] A sealant 560 attaches the substrate 570 to the substrate
510. The sealant 560 has a refractive index higher than that of
air. In the case where light is extracted to the sealant 560 side,
the sealant 560 serves as an optical adhesive layer. The pixel
circuits and the light-emitting elements (e.g., a first
light-emitting element 550R) are provided between the substrate 510
and the substrate 570.
<<Structure of Pixel>>
[0321] A pixel includes a sub-pixel 502R, and the sub-pixel 502R
includes a light-emitting module 580R.
[0322] The sub-pixel 502R includes the first light-emitting element
550R and the pixel circuit that can supply electric power to the
first light-emitting element 550R and includes a transistor 502t.
The light-emitting module 580R includes the first light-emitting
element 550R and an optical element (e.g., a first coloring layer
567R).
[0323] The first light-emitting element 550R includes a lower
electrode, an upper electrode, and a layer containing a
light-emitting organic compound between the lower electrode and the
upper electrode.
[0324] The light-emitting module 580R includes the first coloring
layer 567R on the light extraction side. The coloring layer
transmits light of a particular wavelength and is, for example, a
layer that selectively transmits light of red, green, or blue
color. Note that in another sub-pixel, a region that transmits
light emitted from the light-emitting element as it is may be
provided as well.
[0325] In the case where the sealant 560 is provided on the light
extraction side, the sealant 560 is in contact with the first
light-emitting element 550R and the first coloring layer 567R.
[0326] The first coloring layer 567R is positioned in a region
overlapping with the first light-emitting element 550R.
Accordingly, part of light emitted from the first light-emitting
element 550R passes through the first coloring layer 567R and is
emitted to the outside of the light-emitting module 580R as
indicated by an arrow in FIG. 11A.
<<Structure of Display Portion>>
[0327] The display portion 501 includes a light-blocking layer
567BM on the light extraction side. The light-blocking layer 567BM
is provided so as to surround the coloring layer (e.g., the first
coloring layer 567R).
[0328] The display portion 501 is provided with an anti-reflective
layer 567p positioned in a region overlapping with pixels. As the
anti-reflective layer 567p, a circular polarizing plate can be
used, for example.
[0329] The display portion 501 includes an insulating film 521. The
insulating film 521 covers the transistor 502t. Note that the
insulating film 521 can be used as a layer for planarizing
unevenness caused by the pixel circuits. A stacked film including a
layer that can prevent diffusion of impurities can be used as the
insulating film 521. This can prevent the reliability of the
transistor 502t or the like from being lowered by unintentional
diffusion of impurities.
[0330] The display portion 501 includes the light-emitting elements
(e.g., the first light-emitting element 550R) over the insulating
film 521.
[0331] The display portion 501 includes, over the insulating film
521, a partition wall 528 that overlaps with an end portion of the
lower electrode. In addition, a spacer that controls the distance
between the substrate 510 and the substrate 570 is provided over
the partition wall 528.
<<Structure of Scan Line Driver Circuit>>
[0332] A scan line driver circuit 503g(1) includes a transistor
503t and a capacitor 503c. Note that the driver circuit can be
formed in the same process and over the same substrate as those of
the pixel circuits.
<<Other Components>>
[0333] The display portion 501 includes the wiring 511 through
which a signal is supplied. The wiring 511 is provided with the
terminal 519. Note that the FPC 509(1) through which a signal such
as an image signal or a synchronization signal is supplied is
electrically connected to the terminal 519.
[0334] Note that a printed wiring board (PWB) may be attached to
the FPC 509(1).
[0335] The display portion 501 includes wirings such as scan lines,
signal lines, and power supply lines. Any of various conductive
films can be used as the wirings.
[0336] Specifically, a metal element selected from aluminum,
chromium, copper, tantalum, titanium, molybdenum, tungsten, nickel,
yttrium, zirconium, silver, and manganese; an alloy including any
of the above-described metal elements; an alloy including any of
the above-described metal elements in combination; or the like can
be used. In particular, one or more elements selected from
aluminum, chromium, copper, tantalum, titanium, molybdenum, and
tungsten are preferably included. In particular, an alloy of copper
and manganese is suitably used in microfabrication with the use of
a wet etching method.
[0337] Specifically, a two-layer structure in which a titanium film
is stacked over an aluminum film, a two-layer structure in which a
titanium film is stacked over a titanium nitride film, a two-layer
structure in which a tungsten film is stacked over a titanium
nitride film, a two-layer structure in which a tungsten film is
stacked over a tantalum nitride film or a tungsten nitride film, a
three-layer structure in which a titanium film, an aluminum film,
and a titanium film are stacked in this order, or the like can be
used.
[0338] Specifically, a stacked structure in which an alloy film or
a nitride film containing one or more elements selected from
titanium, tantalum, tungsten, molybdenum, chromium, neodymium, and
scandium is stacked over an aluminum film can be used.
[0339] Alternatively, a light-transmitting conductive material
including indium oxide, tin oxide, or zinc oxide may be used.
Modification Example 1 of Display Portion
[0340] Any of various kinds of transistors can be used in the
display portion 501.
[0341] A structure in which bottom-gate transistors are used in the
display portion 501 is illustrated in FIGS. 11A and 11B.
[0342] For example, a semiconductor layer containing an oxide
semiconductor, amorphous silicon, or the like can be used in the
transistor 502t and the transistor 503t shown in FIG. 11A.
[0343] For example, a film represented by an In-M-Zn oxide that
contains at least indium (In), zinc (Zn), and M (M is a metal such
as Al, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) is preferably included.
Alternatively, both In and Zn are preferably contained.
[0344] As a stabilizer, gallium (Ga), tin (Sn), hafnium (Hf),
aluminum (Al), zirconium (Zr), or the like can be given. As another
stabilizer, lanthanoid such as lanthanum (La), cerium (Ce),
praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu),
gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho),
erbium (Er), thulium (Tm), ytterbium (Yb), or lutetium (Lu) can be
given.
[0345] As an oxide semiconductor included in an oxide semiconductor
film, any of the following can be used, for example: an
In--Ga--Zn-based oxide, an In--Al--Zn-based oxide, an
In--Sn--Zn-based oxide, an In--Hf--Zn-based oxide, an
In--La--Zn-based oxide, an In--Ce--Zn-based oxide, an
In--Pr--Zn-based oxide, an In--Nd--Zn-based oxide, an
In--Sm--Zn-based oxide, an In--Eu--Zn-based oxide, an
In--Gd--Zn-based oxide, an In--Tb--Zn-based oxide, an
In--Dy--Zn-based oxide, an In--Ho--Zn-based oxide, an
In--Er--Zn-based oxide, an In--Tm--Zn-based oxide, an
In--Yb--Zn-based oxide, an In--Lu--Zn-based oxide, an
In--Sn--Ga--Zn-based oxide, an In--Hf--Ga--Zn-based oxide, an
In--Al--Ga--Zn-based oxide, an In--Sn--Al--Zn-based oxide, an
In--Sn--Hf--Zn-based oxide, an In--Hf--Al--Zn-based oxide, and an
In--Ga-based oxide.
[0346] Note that here, an "In--Ga--Zn-based oxide" means an oxide
containing In, Ga, and Zn as its main components and there is no
limitation on the ratio of In:Ga:Zn. The In--Ga--Zn-based oxide may
contain another metal element in addition to In, Ga, and Zn.
[0347] For example, a semiconductor layer containing
polycrystalline silicon that is obtained by crystallization process
such as laser annealing can be used in the transistor 502t and the
transistor 503t shown in FIG. 11B.
[0348] A structure in which top-gate transistors are used in the
display portion 501 is shown in FIG. 11C.
[0349] For example, a semiconductor layer including polycrystalline
silicon, a single crystal silicon film that is transferred from a
single crystal silicon substrate, or the like can be used in the
transistor 502t and the transistor 503t shown in FIG. 11C.
[0350] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 6
[0351] In this embodiment, a structure of a bendable or foldable
touch panel that can be used in a data processing device of one
embodiment of the present invention will be described with
reference to FIGS. 12A to 12C.
[0352] FIGS. 12A to 12C are cross-sectional views illustrating a
touch panel 500B.
[0353] The touch panel 500B described in this embodiment is
different from the touch panel 500 described in Embodiment 5 in
that the display portion 501 displays supplied image data on the
side where the transistors are provided and that the touch sensor
is provided on the substrate 510 side of the display portion.
Different parts are described in detail below, and the above
description is referred to for the other similar parts.
<Display Portion>
[0354] The display portion 501 includes a plurality of pixels
arranged in a matrix. Each of the pixels includes a display element
and a pixel circuit for driving the display element.
<<Structure of Pixel>>
[0355] A pixel includes a sub-pixel 502R, and the sub-pixel 502R
includes a light-emitting module 580R.
[0356] The sub-pixel 502R includes a first light-emitting element
550R and a pixel circuit that can supply electric power to the
first light-emitting element 550R and includes a transistor
502t.
[0357] The light-emitting module 580R includes the first
light-emitting element 550R and an optical element (e.g., a first
coloring layer 567R).
[0358] The first light-emitting element 550R includes a lower
electrode, an upper electrode, and a layer containing a
light-emitting organic compound between the lower electrode and the
upper electrode.
[0359] The light-emitting module 580R includes the first coloring
layer 567R on the light extraction side. The coloring layer
transmits light of a particular wavelength and is, for example, a
layer that selectively transmits light of red, green, or blue
color. Note that in another sub-pixel, a region that transmits
light emitted from the light-emitting element as it is may be
provided as well.
[0360] The first coloring layer 567R is positioned in a region
overlapping with the first light-emitting element 550R. The first
light-emitting element 550R shown in FIG. 12A emits light to the
side where the transistor 502t is provided. Accordingly, part of
light emitted from the first light-emitting element 550R passes
through the first coloring layer 567R and is emitted to the outside
of the light-emitting module 580R as indicated by an arrow in FIG.
12A.
<<Structure of Display Portion>>
[0361] The display portion 501 includes a light-blocking layer
567BM on the light extraction side. The light-blocking layer 567BM
is provided so as to surround the coloring layer (e.g., the first
coloring layer 567R).
[0362] The display portion 501 includes an insulating film 521. The
insulating film 521 covers the transistor 502t. Note that the
insulating film 521 can be used as a layer for planarizing
unevenness caused by the pixel circuits. A stacked film including a
layer that can prevent diffusion of impurities can be used as the
insulating film 521. This can prevent the reliability of the
transistor 502t or the like from being lowered by unintentional
diffusion of impurities from the first coloring layer 567R, for
example.
<Touch Sensor>
[0363] A touch sensor 595 is provided on the substrate 510 side of
the display portion 501 (see FIG. 12A).
[0364] A resin layer 597 is provided between the substrate 510 and
the substrate 590 and attaches the touch sensor 595 to the display
portion 501.
Modification Example 1 of Display Portion
[0365] Any of various kinds of transistors can be used in the
display portion 501.
[0366] A structure in which bottom-gate transistors are used in the
display portion 501 is illustrated in FIGS. 12A and 12B.
[0367] For example, a semiconductor layer containing an oxide
semiconductor, amorphous silicon, or the like can be used in the
transistor 502t and the transistor 503t shown in FIG. 12A. In the
transistors, a channel formation region may be sandwiched between
upper and lower gate electrodes, in which case variations in
characteristics of the transistors can be prevented and thus the
reliability can be increased.
[0368] For example, a semiconductor layer containing
polycrystalline silicon or the like can be used in the transistor
502t and the transistor 503t shown in FIG. 12B.
[0369] A structure in which top-gate transistors are used in the
display portion 501 is shown in FIG. 12C.
[0370] For example, a semiconductor layer including polycrystalline
silicon, a transferred single crystal silicon film, or the like can
be used in the transistor 502t and the transistor 503t shown in
FIG. 12C.
[0371] Note that this embodiment can be combined with any of the
other embodiments in this specification as appropriate.
Embodiment 7
[0372] In this embodiment, a method for manufacturing a bendable or
foldable device that can be used in a data processing device of one
embodiment of the present invention, an electronic device, or the
like will be described with reference to FIGS. 13A to 13D, FIGS.
14A to 14D, and FIGS. 15A to 15D. Note that examples of the
bendable or foldable device include a display device, a
light-emitting device, an input device, and the like. Examples of
the input device include a touch sensor, a touch panel, and the
like. Examples of the light-emitting device include an organic EL
panel, a lighting device, and the like. Examples of the display
device include a light-emitting device, an organic EL panel, a
liquid crystal display device, and the like. Note that a function
of the input device such as a touch sensor may be provided in a
display device or a light-emitting device. For example, a counter
substrate (e.g., a substrate not provided with a transistor) of a
display device or a light-emitting device may be provided with a
touch sensor. Alternatively, an element substrate (e.g., a
substrate provided with a transistor) of the display device or the
light-emitting device may be provided with a touch sensor. Still
alternatively, the counter substrate and the element substrate of
the display device or the light-emitting device may be provided
with touch sensors.
[0373] First, a separation layer 703 is formed over a formation
substrate 701, and a layer 705 to be separated (hereinafter
referred to as a layer 705) is formed over the separation layer 703
(FIG. 13A). In addition, a separation layer 723 is formed over a
formation substrate 721, and a layer 725 to be separated
(hereinafter referred to as a layer 725) is formed over the
separation layer 723 (FIG. 13B).
[0374] For example, when a tungsten film is used as the separation
layer, a tungsten oxide film can be formed between the layer to be
separated and the tungsten film by an oxidation method such as
performing plasma treatment on the tungsten film with a gas
containing oxygen such as N.sub.2O, annealing the tungsten film in
a gas atmosphere containing oxygen, or forming a tungsten film by
sputtering or the like in a gas atmosphere containing oxygen.
[0375] At the time of a separating and transferring process of the
tungsten oxide film, it is preferable that the tungsten oxide film
include tungsten oxide with a composition in which the ratio of
oxygen to tungsten is lower than 3. In the case where tungsten
oxide is W.sub.nO.sub.(3n-1) or W.sub.nO.sub.(3n-2), which is a
homologous series, shear is easily caused by heating because there
is a crystal optical shear plane therein. Forming the tungsten
oxide film by N.sub.2O plasma treatment enables separation of the
layer to be separated from the substrate with a weak force.
[0376] Alternatively, the tungsten oxide film can be directly
formed without forming the tungsten film. For example, only the
tungsten oxide film may be formed as the separation layer by
performing plasma treatment on a sufficiently thin tungsten film
with a gas containing oxygen, annealing a sufficiently thin
tungsten film in a gas atmosphere containing oxygen, or forming the
oxide tungsten film by sputtering or the like in a gas atmosphere
containing oxygen.
[0377] When the separation is caused at the interface between the
tungsten film and the tungsten oxide film or within the tungsten
oxide film, the tungsten oxide film is left on the side of the
layer to be separated in some cases. The left tungsten oxide film
might adversely affect the properties of a transistor. Thus, a step
of removing the left tungsten oxide film is preferably performed
after the step of separating the separation layer and the layer to
be separated. Note that the above method for separation from the
substrate does not necessarily require N.sub.2O plasma treatment,
so that the step of removing the tungsten oxide film can also be
omitted. In that case, the device can be fabricated more
simply.
[0378] In one embodiment of the present invention, a tungsten film
with a thickness of greater than or equal to 0.1 nm and less than
200 nm is formed over the substrate.
[0379] As the separation layer, a film containing molybdenum,
titanium, vanadium, tantalum, silicon, aluminum, or an alloy
thereof can be used, besides a tungsten film. Furthermore, it is
also possible to use a stack of such a film and its oxide film. The
separation layer is not limited to an inorganic film, and an
organic film such as polyimide may be used.
[0380] In the case of using an organic resin for the separation
layer, a process temperature needs to be lower than or equal to
350.degree. C. when low-temperature polysilicon is used as an
active layer of a transistor. Thus, dehydrogenation baking for
silicon crystallization, hydrogenation for termination of defects
in silicon, or activation of a doped region cannot be performed
sufficiently, so that the performance of the transistor is limited.
On the other hand, in the case of using an inorganic film, the
process temperature is not limited to 350.degree. C., and excellent
characteristics of a transistor can be obtained.
[0381] In the case of using the organic resin for the separation
layer, the organic resin or a functional element is damaged in some
cases by laser irradiation at the time of crystallization; thus, it
is preferable to use an inorganic film for the separation layer
because such a problem is not caused.
[0382] Furthermore, in the case of using the organic resin for the
separation layer, the organic resin shrinks by laser irradiation
for separating the resin and contact failure is caused in the
contact portion of the terminal of an FPC or the like, which makes
it difficult for functional elements with many terminals in a
high-definition display, or the like to be separated and
transferred with high yield. In the case of using an inorganic film
for the separation layer, there is no such limitation, and
functional elements with many terminals of a high-definition
display or the like can be separated and transferred with high
yield.
[0383] In the method for separating a functional element from a
substrate of one embodiment of the present invention, an insulating
layer and a transistor can be formed over a formation substrate at
a temperature of lower than or equal to 600.degree. C. In that
case, high-temperature polysilicon can be used for a semiconductor
layer. With use of a conventional production line for
high-temperature polysilicon, a semiconductor device with a high
operation speed, a high gas barrier property, and high reliability
can be mass-produced. In that case, with use of the insulating
layer and the transistor formed through a process at 600.degree. C.
or lower, insulating layers having an excellent gas barrier
property formed at a temperature of lower than or equal to
600.degree. C. can be provided above and below an organic EL
element. Accordingly, entry of impurities such as moisture into the
organic EL element or the semiconductor layer can be suppressed,
whereby an extraordinarily reliable light-emitting device can be
obtained as compared with the case of using the organic resin or
the like as the separation layer.
[0384] Alternatively, the insulating layer and the transistor can
be formed over the formation substrate at 500.degree. C. or lower.
In that case, low-temperature polysilicon or an oxide semiconductor
can be used for the semiconductor layer, and mass production is
possible with use of a conventional production line for
low-temperature polysilicon. Also in that case, with use of the
insulating layer and the transistor formed through the process at
500.degree. C. or lower, insulating layers having an excellent gas
barrier property formed at 500.degree. C. or lower can be provided
above and below the organic EL element. Accordingly, the entry of
impurities such as moisture into the organic EL element or the
semiconductor layer is suppressed, whereby a highly reliable
light-emitting device can be obtained as compared with the case of
using the organic resin as the separation layer.
[0385] Alternatively, the insulating layer and the transistor can
be formed over the formation substrate at 400.degree. C. or lower.
In that case, amorphous silicon or an oxide semiconductor can be
used for the semiconductor layer, and mass production is possible
with use of a conventional production line for amorphous silicon.
Also in that case, with use of the insulating layer and the
transistor formed through the process at 400.degree. C. or lower,
insulating layers having an excellent gas barrier property formed
at 400.degree. C. or lower can be provided above and below the
organic EL element. Accordingly, the entry of impurities such as
moisture into the organic EL element or the semiconductor layer can
be suppressed, whereby a reliable light-emitting device can be
obtained as compared with the case of using the organic resin or
the like as the separation layer.
[0386] Next, the formation substrate 701 and the formation
substrate 721 are attached to each other by using a bonding layer
707 and a frame-like bonding layer 711 so that the surfaces over
which the layers to be separated are formed face each other, and
then, the bonding layer 707 and the frame-like bonding layer 711
are cured (FIG. 13C). Here, the frame-like bonding layer 711 and
the bonding layer 707 in a region surrounded by the frame-like
bonding layer 711 are provided over the layer 725 and after that,
the formation substrate 701 and the formation substrate 721 face
each other and are attached to each other.
[0387] Note that the formation substrate 701 and the formation
substrate 721 are preferably attached to each other in a
reduced-pressure atmosphere.
[0388] Note that although FIG. 13C illustrates the case where the
separation layer 703 and the separation layer 723 are different in
size, separation layers having the same size as illustrated in FIG.
13D may be used.
[0389] The bonding layer 707 is provided to overlap with the
separation layer 703, the layer 705, the layer 725, and the
separation layer 723. Then, edges of the bonding layer 707 are
preferably positioned inside an area between at least edges of
either the separation layer 703 or the separation layer 723 (the
separation layer which is desirably separated from the substrate
first). Accordingly, strong adhesion between the formation
substrate 701 and the formation substrate 721 can be suppressed;
thus, a decrease in yield of a subsequent separating process can be
suppressed.
[0390] Next, a first trigger 741 for separation from the substrate
is formed by laser irradiation (FIGS. 14A and 14B).
[0391] Either the formation substrate 701 or the formation
substrate 721 may be separated first. In the case where the
separation layers differ in size, a substrate over which a larger
separation layer is formed may be separated first or a substrate
over which a smaller separation layer is formed may be separated
first. In the case where an element such as a semiconductor
element, a light-emitting element, or a display element is formed
over only one of the substrates, the substrate on the side where
the element is formed may be separated first or the other substrate
may be separated first. Here, an example in which the formation
substrate 701 is separated first is described.
[0392] A region where the bonding layer 707 in a cured state or the
frame-like bonding layer 711 in a cured state, the layer 705, and
the separation layer 703 overlap with one another is irradiated
with laser light. Here, the bonding layer 707 is in a cured state
and the frame-like bonding layer 711 is not in a cured state, and
the bonding layer 707 in a cured state is irradiated with laser
light (see an arrow P3 in FIG. 14A).
[0393] Part of the layer 705 is removed; thus, the first trigger
741 for separation from the substrate can be formed (see a region
surrounded by a dashed line in FIG. 14B). At this time, not only
the layer 705 but also the separation layer 703, the bonding layer
707, or another layer included in the layer 705 may be partly
removed.
[0394] It is preferred that laser light irradiation be performed
from the side of the substrate provided with the separation layer
that is desirably separated. In the case where a region where the
separation layer 703 and the separation layer 723 overlap with each
other is irradiated with laser light, the formation substrate 701
and the separation layer 703 can be selectively separated by
cracking only the layer 705 of the layers 705 and 725 (see the
region surrounded by the dotted line in FIG. 14B).
[0395] When a trigger for separation from the substrate is formed
in both the layer 705 on the separation layer 703 side and the
layer 725 on the separation layer 723 side in the case where the
region where the separation layer 703 and the separation layer 723
overlap with each other is irradiated with laser light, it might be
difficult to selectively separate one of the formation substrates.
Therefore, laser light irradiation conditions are restricted so
that only one of the layers to be separated is cracked, in some
cases. The method for forming the first trigger 741 for separation
from the substrate is not limited to laser light irradiation, and
the first trigger 741 may be formed by a sharp knife such as a
cutter.
[0396] Then, the layer 705 and the formation substrate 701 are
separated from each other from the first trigger 741 for separation
from the substrate (FIGS. 14C and 14D). Consequently, the layer 705
can be transferred from the formation substrate 701 to the
formation substrate 721.
[0397] The layer 705 that is separated from the formation substrate
701 in the step in FIG. 14D is attached to a substrate 731 with a
bonding layer 733, and the bonding layer 733 is cured (FIG.
15A).
[0398] Next, a second trigger 743 for separation from the substrate
is formed by a sharp knife such as a cutter (FIGS. 15B and 15C).
The method for forming the second trigger 743 for separation from
the substrate is not limited to a sharp knife such as a cutter, and
the second trigger 743 may be formed by laser light irradiation or
the like.
[0399] In the case where the substrate 731 on the side where the
separation layer 723 is not provided can be cut by a knife or the
like, a cut may be made in the substrate 731, the bonding layer
733, and the layer 725 (see arrows P5 in FIG. 15B). Consequently,
part of the layer 725 can be removed; thus, the second trigger 743
for separation from the substrate can be formed (see a region
surrounded by a dashed line in FIG. 15C).
[0400] In the case where there is a region in which the formation
substrate 721 and the substrate 731 are attached to each other
using the bonding layer 733 without overlapping with the separation
layer 723 as illustrated in FIGS. 15B and 15C, yield of a
subsequent process of separation from the substrate might be
decreased depending on the degree of adhesion between the formation
substrate 721 and the substrate 731. Therefore, a cut is preferably
made in a frame shape in a region where the bonding layer 733 in a
cured state and the separation layer 723 overlap with each other to
form the second trigger 743 for separation from the substrate in
the form of a solid line. This can improve the yield of the process
of separation from the substrate.
[0401] Then, the layer 725 and the formation substrate 721 are
separated from each other from the second trigger 743 for
separation from the substrate (FIG. 15D), so that the layer 725 can
be transferred from the formation substrate 721 to the substrate
731.
[0402] For example, in the case where the tungsten oxide film,
which is tightly anchored by N.sub.2O plasma or the like is formed
on an inorganic film such as a tungsten film, adhesion can be
relatively high in deposition. After that, when a separation
trigger is formed, cleavage occurs therefrom, whereby a layer to be
separated can be easily separated from a formation substrate and
transferred to another substrate.
[0403] The formation substrate 721 and the layer 725 may be
separated from each other by filling the interface between the
separation layer 723 and the layer 725 with a liquid such as water.
A portion between the separation layer 723 and the layer 725
absorbs a liquid through a capillarity action. Accordingly, an
adverse effect on the functional element such as an FET included in
the layer 725 due to static electricity caused at the time of
separation from the substrate (e.g., a phenomenon in which a
semiconductor element is damaged by static electricity) can be
suppressed.
[0404] When a bond of M-O--W (M represents a given element) is
divided by application of physical force, a liquid is absorbed into
the gap, whereby the bond becomes bonds of M-OH HO--W with a longer
bond distance and the separation is promoted.
[0405] Note that a liquid may be sprayed in an atomized form or in
a vaporized form. Examples of liquids include pure water, an
organic solvent, a neutral, alkali, or acid aqueous solution, and
an aqueous solution in which a salt is dissolved.
[0406] The temperature of the liquid and the substrate at the time
of dynamic separation is set in the range from room temperature to
120.degree. C., and preferably set to 60.degree. C. to 90.degree.
C.
[0407] In the method for separation from a substrate in one
embodiment of the present invention described above, separation of
the formation substrate is performed in such a manner that the
second trigger 743 for separation from the substrate is formed by a
sharp knife or the like so that the separation layer and the layer
to be separated are made in a separable state. This can improve the
yield of the process of separation from the substrate.
[0408] In addition, bonding of a substrate with which a device is
to be formed can be performed after the following procedure: a pair
of formation substrates each provided with a layer to be separated
are attached to each other and the formation substrates are
individually separated. Therefore, formation substrates having low
flexibility can be attached to each other when the layers to be
separated are attached to each other, whereby alignment accuracy at
the time of attachment can be improved compared with the case where
flexible substrates are attached to each other.
[0409] In the method for separation from a substrate in one
embodiment of the present invention, a layer to be separated over
an oxide layer includes a first layer and a second layer from which
hydrogen is released by heat treatment. In addition, WO.sub.3 in
the oxide layer can be reduced by hydrogen released by heat
treatment from the layer to be separated, so that the oxide layer
can have a high WO.sub.2 content. Consequently, separation from a
substrate can be facilitated.
[0410] This embodiment can be implemented in appropriate
combinations with any of the other embodiments and examples
described in this specification.
[0411] This application is based on Japanese Patent Application
serial no. 2013-249677 filed with Japan Patent Office on Dec. 2,
2013, the entire contents of which are hereby incorporated by
reference.
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