U.S. patent application number 14/503419 was filed with the patent office on 2015-05-28 for heat dissipating device and heat dissipating fin.
The applicant listed for this patent is Cooler Master (Hui Zhou) Co., Ltd.. Invention is credited to Chia-Yu Lin, Tao Song, Qingsong Zhang.
Application Number | 20150144307 14/503419 |
Document ID | / |
Family ID | 50512981 |
Filed Date | 2015-05-28 |
United States Patent
Application |
20150144307 |
Kind Code |
A1 |
Lin; Chia-Yu ; et
al. |
May 28, 2015 |
HEAT DISSIPATING DEVICE AND HEAT DISSIPATING FIN
Abstract
A heat dissipating device includes a heat dissipating fin and a
heat pipe. The heat dissipating fin includes a fin body, a through
hole and a closed ring-shaped portion, wherein the through hole is
formed on the fin body, the closed ring-shaped portion extends from
a periphery of the through hole and has a first U-shaped protruding
ear, and the first U-shaped protruding ear has a first opening. The
heat pipe has a heat dissipating end and a heat absorbing end,
wherein the heat dissipating end is opposite to the heat absorbing
end and is disposed in the through hole and the closed ring-shaped
portion. After punching the closed ring-shaped portion, the first
opening of the first U-shaped protruding ear shrinks, such that the
closed ring-shaped portion fixes the heat dissipating end in a
tight-fitting manner.
Inventors: |
Lin; Chia-Yu; (Huizhou,
CN) ; Zhang; Qingsong; (Huizhou, CN) ; Song;
Tao; (Huizhou, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Cooler Master (Hui Zhou) Co., Ltd. |
Huizhou |
|
CN |
|
|
Family ID: |
50512981 |
Appl. No.: |
14/503419 |
Filed: |
October 1, 2014 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28F 2275/122 20130101;
H05K 7/2039 20130101; F28F 2275/127 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H05K 7/20336 20130101; H01L
21/4882 20130101; H01L 23/427 20130101; H01L 2924/0002 20130101;
F28F 1/325 20130101; F28F 1/32 20130101; H01L 23/3672 20130101;
F28D 15/0233 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
H05K 7/20 20060101
H05K007/20; F28F 3/00 20060101 F28F003/00; F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 25, 2013 |
CN |
201320751706.2 |
Claims
1. A heat dissipating device comprising: a heat dissipating fin
comprising a fin body, a through hole and a closed ring-shaped
portion, the through hole being formed on the fin body, the closed
ring-shaped portion extending from a periphery of the through hole
and having a first U-shaped protruding ear, the first U-shaped
protruding ear having a first opening; and a heat pipe having a
heat dissipating end and a heat absorbing end, the heat dissipating
end being opposite to the heat absorbing end, the heat dissipating
end being disposed in the through hole and the closed ring-shaped
portion, after punching the closed ring-shaped portion, the first
opening of the first U-shaped protruding ear shrinks, such that the
closed ring-shaped portion fixes the heat dissipating end in a
tight-fitting manner.
2. The heat dissipating device of claim 1, wherein the closed
ring-shaped portion further has a second U-shaped protruding ear,
the second U-shaped protruding ear has a second opening, after
punching the closed ring-shaped portion, the second opening of the
second U-shaped protruding ear shrinks, such that the closed
ring-shaped portion fixes the heat dissipating end in the
tight-fitting manner.
3. The heat dissipating device of claim 2, wherein the first
U-shaped protruding ear is opposite to the second U-shaped
protruding ear.
4. The heat dissipating device of claim 1, wherein the heat
dissipating fin further comprises a recess formed on the fin body,
and the heat absorbing end is fixed in the recess.
5. A heat dissipating fin comprising: a fin body; a through hole
formed on the fin body; and a closed ring-shaped portion extending
from a periphery of the through hole and having a first U-shaped
protruding ear, the first U-shaped protruding ear having a first
opening.
6. The heat dissipating fin of claim 5, wherein the closed
ring-shaped portion further has a second U-shaped protruding ear,
and the second U-shaped protruding ear has a second opening.
7. The heat dissipating fin of claim 6, wherein the first U-shaped
protruding ear is opposite to the second U-shaped protruding
ear.
8. The heat dissipating fin of claim 5, further comprising a recess
formed on the fin body.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a heat dissipating device and a
heat dissipating fin and, more particularly, to a heat dissipating
device utilizing a closed ring-shaped portion to fix a heat pipe on
a heat dissipating fin.
[0003] 2. Description of the Prior Art
[0004] Heat dissipating device is a significant component for
electronic products. When an electronic product is operating, the
current in circuit will generate unnecessary heat due to impedance.
If the heat is accumulated in the electronic components of the
electronic product without dissipating immediately, the electronic
components may get damage due to the accumulated heat. Therefore,
the performance of heat dissipating device is a significant issue
for the electronic product.
[0005] So far the heat dissipating device used in the electronic
product usually consists of a heat pipe, a heat dissipating fin and
a heat dissipating fan, wherein one end of the heat pipe contacts
the electronic component, which generates heat during operation,
the other end of the heat pipe is connected to the heat dissipating
fin, and the heat dissipating fan blows air to the heat dissipating
fin, so as to dissipate heat. In the prior art, there are two
methods for connecting the heat pipe and the heat dissipating fin,
as follows. The first method is to fix the heat pipe in a through
hole of the heat dissipating fin directly in a tight-fitting
manner. However, when the heat pipe is inserted into the through
hole by the first method, the heat pipe and the heat dissipating
fin may pull and drag each other, such that a surface of the heat
pipe may be scratched, the heat dissipating fin may deform or the
through hole may crack. Accordingly, the yield rate of the first
method is low. The second method is to connect the heat pipe and
the through hole of the heat dissipating fin in a loose-fitting
manner, wherein a thermal conductive adhesive or a solder paste is
filled in a gap between the heat pipe and the heat dissipating fin.
The second method has to form a groove on each of the heat
dissipating fins to communicate with the through holes and then
fill the thermal conductive adhesive or the solder paste in the
groove. Afterward, the heat pipe is inserted into the through hole.
Then, the thermal conductive adhesive or the solder paste are
heated to be converted form solid into liquid and then cooled to be
converted form liquid into solid, such that the thermal conductive
adhesive or the solder paste is filled in the gap between the heat
pipe and the heat dissipating fin. However, the process of the
second method is complicated and additional thermal conductive
adhesive or solder paste may be remained on the heat dissipating
fin, such that the appearance is not good and the thermal impedance
increases accordingly. Furthermore, the manufacturing time is long,
so the manufacturing efficiency is low.
SUMMARY OF THE INVENTION
[0006] The invention provides a heat dissipating device utilizing a
closed ring-shaped portion to fix a heat pipe on a heat dissipating
fin, so as to solve the aforesaid problems.
[0007] According to an embodiment of the invention, a heat
dissipating device comprises a heat dissipating fin and a heat
pipe. The heat dissipating fin comprises a fin body, a through hole
and a closed ring-shaped portion, wherein the through hole is
formed on the fin body, the closed ring-shaped portion extends from
a periphery of the through hole and has a first U-shaped protruding
ear, and the first U-shaped protruding ear has a first opening. The
heat pipe has a heat dissipating end and a heat absorbing end,
wherein the heat dissipating end is opposite to the heat absorbing
end, and the heat dissipating end is disposed in the through hole
and the closed ring-shaped portion. After punching the closed
ring-shaped portion, the first opening of the first U-shaped
protruding ear shrinks, such that the closed ring-shaped portion
fixes the heat dissipating end in a tight-fitting manner.
[0008] According to another embodiment of the invention, a heat
dissipating fin comprises a fin body, a through hole and a closed
ring-shaped portion, wherein the through hole is formed on the fin
body, the closed ring-shaped portion extends from a periphery of
the through hole and has a first U-shaped protruding ear, and the
first U-shaped protruding ear has a first opening.
[0009] As mentioned in the above, the invention utilizes the closed
ring-shaped portion to fix the heat pipe on the heat dissipating
fin through a punching process. An operator may insert the heat
dissipating end of the heat pipe into the through hole and the
closed ring-shaped portion of the heat dissipating fin in a
loose-fitting manner and then punch the closed ring-shaped portion.
After punching the closed ring-shaped portion, the opening of the
U-shaped protruding ear of the closed ring-shaped portion shrinks,
such that the closed ring-shaped portion fixes the heat dissipating
end of the heat pipe in the tight-fitting manner. Accordingly, the
invention can connect the heat pipe and the heat dissipating fin
tightly and improve the yield rate and the efficiency of
manufacturing the heat dissipating device.
[0010] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a perspective view illustrating a heat dissipating
device according to a first embodiment of the invention.
[0012] FIG. 2 is a perspective view illustrating the heat
dissipating device shown in FIG. 1 from another viewing angle.
[0013] FIG. 3 is an exploded view illustrating the heat dissipating
device shown in FIG. 1 before a punching process.
[0014] FIG. 4 is a front view illustrating the heat dissipating
device shown in FIG. 1.
[0015] FIG. 5 is a front view illustrating the heat dissipating
device shown in FIG. 4 before the punching process.
[0016] FIG. 6 is a front view illustrating a heat dissipating
device before the punching process according to a second embodiment
of the invention.
DETAILED DESCRIPTION
[0017] Referring to FIGS. 1 to 5, FIG. 1 is a perspective view
illustrating a heat dissipating device 1 according to a first
embodiment of the invention, FIG. 2 is a perspective view
illustrating the heat dissipating device 1 shown in FIG. 1 from
another viewing angle, FIG. 3 is an exploded view illustrating the
heat dissipating device 1 shown in FIG. 1 before a punching
process, FIG. 4 is a front view illustrating the heat dissipating
device 1 shown in FIG. 1, and FIG. 5 is a front view illustrating
the heat dissipating device 1 shown in FIG. 4 before the punching
process.
[0018] As shown in FIGS. 1 to 4, the heat dissipating device 1 of
the invention comprises a plurality of heat dissipating fins 10 and
a plurality of heat pipes 12, wherein the number of the heat
dissipating fins 10 and the number of the heat pipes 12 can be
determined according to practical applications and are not limited
to the embodiment shown in FIGS. 1 to 3. The heat dissipating fin
10 comprises a fin body 100, a plurality of through holes 102, a
plurality of closed ring-shaped portions 104 and a plurality of
recesses 106, wherein the through holes 102 and the recesses 106
are formed on the fin body 100, and the closed ring-shaped portions
104 extend from a periphery of the through holes 102. It should be
noted that the number of the through holes 102, the number of the
closed ring-shaped portions 104 and the number of the recesses 106
can be determined according to practical applications and are not
limited to the embodiment shown in FIGS. 1 to 3.
[0019] In this embodiment, the closed ring-shaped portion 104 has a
first U-shaped protruding ear 1040 and a second U-shaped protruding
ear 1042, wherein the first U-shaped protruding ear 1040 is
opposite to the second U-shaped protruding ear 1042. As shown in
FIG. 5, before punching the closed ring-shaped portion 104, the
first U-shaped protruding ear 1040 has a first opening 1044 and the
second U-shaped protruding ear 1042 has a second opening 1046.
[0020] The heat pipe 12 has a heat dissipating end 120 and a heat
absorbing end 122, wherein the heat dissipating end 120 is opposite
to the heat absorbing end 122. It should be noted that the
structure and the principle of the heat pipe 12 are well known by
one skilled in the art, so the related explanation will not be
depicted herein.
[0021] As shown in FIG. 5, an operator may insert the heat
dissipating end 120 of the heat pipe 12 into the through hole 102
and the closed ring-shaped portion 104 of the heat dissipating fin
10 in a loose-fitting manner and fix the heat absorbing end 122 of
the heat pipe 12 in the recess 106 by welding, engaging or other
manners. Afterward, the closed ring-shaped portion 104 is punched.
As shown in FIG. 4, after punching the closed ring-shaped portion
104, the first opening 1044 of the first U-shaped protruding ear
1040 and the second opening 1046 of the second U-shaped protruding
ear 1042 of the closed ring-shaped portion 104 shrink, such that
the closed ring-shaped portion 104 fixes the heat dissipating end
120 of the heat pipe 12 in a tight-fitting manner. Accordingly, the
invention can connect the heat pipe 12 and the heat dissipating fin
10 tightly and improve the yield rate and the efficiency of
manufacturing the heat dissipating device 1.
[0022] Referring to FIG. 6 along with FIG. 5, FIG. 6 is a front
view illustrating a heat dissipating device 1' before the punching
process according to a second embodiment of the invention. The
difference between the heat dissipating device 1' and the aforesaid
heat dissipating device 1 is that the closed ring-shaped portion
104' of the heat dissipating fin 10' of the heat dissipating device
1' only has the first U-shaped protruding ear 1040 without the
aforesaid second U-shaped protruding ear 1042. It should be noted
that the same elements in FIG. 6 and FIG. 5 are represented by the
same numerals, so the repeated explanation will not be depicted
herein again.
[0023] As mentioned in the above, the invention utilizes the closed
ring-shaped portion to fix the heat pipe on the heat dissipating
fin through a punching process. An operator may insert the heat
dissipating end of the heat pipe into the through hole and the
closed ring-shaped portion of the heat dissipating fin in a
loose-fitting manner and then punch the closed ring-shaped portion.
After punching the closed ring-shaped portion, the opening of the
U-shaped protruding ear of the closed ring-shaped portion shrinks,
such that the closed ring-shaped portion fixes the heat dissipating
end of the heat pipe in the tight-fitting manner. Accordingly, the
invention can connect the heat pipe and the heat dissipating fin
tightly and improve the yield rate and the efficiency of
manufacturing the heat dissipating device.
[0024] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *