U.S. patent application number 14/082340 was filed with the patent office on 2015-05-21 for magnetic recording disk drive with write driver to write head transmission line with multiple segments having different numbers of conductive traces.
This patent application is currently assigned to HGST Netherlands B.V.. The applicant listed for this patent is HGST Netherlands B.V.. Invention is credited to John Thomas Contreras, Kazuhiro Nagaoka, Nobumasa Nishiyama, Eiji Soga, Rehan Zakai.
Application Number | 20150138663 14/082340 |
Document ID | / |
Family ID | 53054664 |
Filed Date | 2015-05-21 |
United States Patent
Application |
20150138663 |
Kind Code |
A1 |
Contreras; John Thomas ; et
al. |
May 21, 2015 |
MAGNETIC RECORDING DISK DRIVE WITH WRITE DRIVER TO WRITE HEAD
TRANSMISSION LINE WITH MULTIPLE SEGMENTS HAVING DIFFERENT NUMBERS
OF CONDUCTIVE TRACES
Abstract
A multiple-segment transmission line in a hard disk drive
enables a wider optimization range of the slope, duration and
amplitude of the transmission line overshoot (TLO) wave shape.
There is a first segment with two traces for connection to the
write driver circuitry, an end segment with two traces for
connection to the write head and at least two intermediate
segments. The number of traces in a segment is different from the
number of traces in the segments to which the segment is
immediately connected. There is an even number of traces in each
segment and the traces in each segment are interleaved. The number
of segments and the number of traces in each segment can be
selected to achieve the desired impedance levels for the different
segments to achieve the desired wave shape for the TLO. All of the
traces on the transmission line are preferably coplanar.
Inventors: |
Contreras; John Thomas;
(Palo Alto, CA) ; Nishiyama; Nobumasa;
(Yokohama-shi, JP) ; Soga; Eiji; (Sagamihara-shi,
JP) ; Nagaoka; Kazuhiro; (Fujisawa-shi, JP) ;
Zakai; Rehan; (San Ramon, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HGST Netherlands B.V. |
Amsterdam |
|
NL |
|
|
Assignee: |
HGST Netherlands B.V.
Amsterdam
NL
|
Family ID: |
53054664 |
Appl. No.: |
14/082340 |
Filed: |
November 18, 2013 |
Current U.S.
Class: |
360/46 |
Current CPC
Class: |
G11B 5/486 20130101;
H05K 2201/09509 20130101; H05K 1/0245 20130101; H05K 1/056
20130101; H05K 2203/0323 20130101; H05K 2201/09554 20130101; H05K
2201/09236 20130101; G11B 5/4853 20130101; G11B 5/484 20130101;
H05K 1/0265 20130101; H05K 2201/09627 20130101; H05K 1/0228
20130101; H05K 1/025 20130101; G11B 5/4846 20130101 |
Class at
Publication: |
360/46 |
International
Class: |
G11B 5/02 20060101
G11B005/02 |
Claims
1. In a magnetic recording disk drive having write driver circuitry
and an inductive write head, a transmission line between the write
driver circuitry and the write head comprising: multiple connected
transmission line segments, each segment comprising a number of
electrically conductive +W traces for positive write signals and an
equal number of electrically conductive traces -W traces for
negative write signals interleaved with the +W traces, the
transmission line including a first segment with two traces for
connection to the write driver circuitry, an end segment with two
traces for connection to the write head, and at least two
intermediate segments, wherein the number of traces in each
intermediate segment is greater than two and different from the
number of traces in the segments to which it is immediately
connected.
2. The transmission line of claim 1 further comprising a substrate
and an insulator layer on the substrate, wherein the electrically
conductive traces are formed on the insulator layer.
3. The transmission line of claim 2 further comprising segment
interconnects between the segments, each interconnect including an
electrically conductive island beneath the insulator layer and a
plurality of electrically conducting vias connecting said island to
selected ones of said traces.
4. The transmission line of claim 3 wherein the traces in the
segments are coplanar across the segment interconnects.
5. The transmission line of claim 1 wherein the number of traces in
each intermediate segment is selected from 4, 6 and 8.
6. The transmission line of claim 1 wherein an intermediate segment
connected to said first segment contains 4 traces and wherein an
intermediate segment connected to said end segment contains 6
traces.
7. A system for interconnection of a magnetic recording disk drive
write driver to a magnetic recording disk drive write head
comprising: a write driver; an inductive write head; a transmission
line connecting the write driver to the write head, the
transmission line comprising multiple connected transmission line
segments, each segment comprising a number of electrically
conductive +W traces for positive write signals and an equal number
of electrically conductive -W traces for negative write signals
interleaved with the +W traces, the transmission line including a
pad segment with two traces for connection to the write driver
circuitry, a gimbal segment with two traces for connection to the
write head, and at least two intermediate segments, wherein the
number of traces in each intermediate segment is greater than two
and different from the number of traces in the segments to which it
is immediately connected, and wherein all of said traces are
coplanar; and wherein said at least two intermediate segments
further comprise an electrically conductive substrate, an insulator
layer on the substrate, the traces being formed on the insulator
layer, and an interconnect between said at least two intermediate
segments, the interconnect comprising an electrically conductive
island of substrate beneath the insulator layer and a plurality of
electrically conducting vias connecting said island to selected
ones of said traces.
8. The system of claim 7 wherein the traces in the segments are
coplanar across the segment interconnects.
9. The system of claim 7 wherein the number of traces in each
intermediate segment is selected from 4, 6 and 8.
10. The system of claim 7 wherein an intermediate segment connected
to said first segment contains 4 traces and wherein an intermediate
segment connected to said end segment contains 6 traces.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates generally to the interconnect between
the read/write circuitry and the read/write head in a magnetic
recording hard disk drive (HDD), and more particularly to an
interconnect with a multiple-segment transmission line for
optimizing transmission line overshoot (TLO) of the write current
pulses.
[0003] 2. Description of the Related Art
[0004] In magnetic recording HDDs, the read/write head is formed on
an air-bearing slider that rides on a thin film of air above the
rotating disk. A mechanical suspension comprised of a flexure with
a gimbal at its end connects the slider to the disk drive's
actuator arm. The slider is attached to the gimbal that allows for
slight movement on the air bearing as the disk rotates. A
transmission line provides electrical connection from the
read/write circuitry, typically in a read pre-amplifier/write
driver module or chip, through a short flex cable and suspension to
the read and write elements on the slider. A suspension that
integrates the mechanical connection with the electrical connection
is called an integrated lead suspension (ILS) that is connected
between the flex cable and connection pads on the slider. A typical
ILS is a generally flexible laminate of a conductive metal
substrate like stainless steel, an insulating dielectric layer like
polyimide, and electrically conductive copper lines or traces
patterned on the dielectric layer. The transmission line for the
signals from the write driver to the write head thus include
electrically conductive traces on the flex cable and the ILS.
[0005] The write driver circuitry typically provides a single-point
input to the transmission line for each of the positive and
negative write signals (+W and -W). The write driver circuitry
provides current through the transmission line to the write element
or head. The write driver circuitry power supply voltage and
performance of the current through the write head depends on the
characteristic impedance of the transmission line because the
launch voltage at the write driver's output directly depends on the
write-current signal times the characteristic impedance.
[0006] In current HDDs, boosts or overshoot of the write current
pulses to the write head are used to overcome the relatively slow
magnetic response of the head and media, i.e., the magnetic
recording layer on the disk. Thus, the overshoot is required to
create the precise magnetic write field profile with sharp field
gradient, i.e., the correct magnetic "footprint", in the disk
media. The lack of a precise magnetic footprint can cause problems
at low and high data rates. Therefore, the overshoot of the write
current pulses is typically required at all times. The typical
solution to achieving fast magnetic flux reversals is to use
electronics in the write driver circuitry to create write current
overshoot. However, the use of electronics can be a limiting factor
as data rates are increased and power supply voltages are reduced,
which limits the write driver's current drive capability. Another
approach for achieving faster magnetic flux reversals uses
transmission line reflections. This inherent transmission line
overshoot (TLO) approach reduces the overshoot requirement from the
write driver circuitry.
[0007] What is needed is a HDD with a write driver to write head
transmission line with multiple segments that enable optimization
of the TLO wave shape.
SUMMARY OF THE INVENTION
[0008] Embodiments of the invention relate to a multiple-segment
transmission line in a HDD that enables a wider optimization range
of the TLO wave shape, specifically the slope, duration and
amplitude of the TLO. There is a first segment with two traces for
connection to the write driver circuitry, an end segment with two
traces for connection to the write head and at least two
intermediate segments. The number of traces in a segment is
different from the number of traces in the segments to which the
segment is immediately connected. There is an even number of traces
in each segment and the traces in each segment are interleaved. The
number of segments and the number of traces in each segment can be
selected to achieve the desired impedance levels for the different
segments to achieve the desired wave shape for the TLO. All of the
traces on the transmission line are preferably coplanar which is
made possible by the use of multiple coplanar crossover
interconnects.
[0009] For a fuller understanding of the nature and advantages of
the present invention, reference should be made to the following
detailed description taken together with the accompanying
figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a top plan view of a head/disk assembly (HDA) of a
hard disk drive and illustrates an integrated lead suspension (ILS)
having a transmission line according to the prior art.
[0011] FIG. 2A is a plan view of the ILS and read/write chip
showing a four-interleave transmission line between the read/write
chip and the gimbal portion of the ILS according to the prior
art.
[0012] FIG. 2B is an expanded sectional view through section 2B-2B
of the ILS in FIG. 2A to illustrate its laminated construction.
[0013] FIG. 2C is a plan view of a portion of the ILS showing an
end with the interleaved connection of the +W and -W signal lines
to the pads.
[0014] FIG. 3 is a schematic representation of the differential
signal mode and illustrates the transmission line with
characteristic impedance Z.sub.0 between the write driver circuitry
and the write head according to the prior art.
[0015] FIG. 4 is a graph of normalized write current as a function
of time for a multiple-segment transmission line with segments
having different impedance values as a result of having traces with
different widths, using a four interleave type structure for all
segments along the entire length, according to the prior art.
[0016] FIG. 5A is a plan view of the ILS according to the invention
showing the multiple-segment transmission line according to the
invention.
[0017] FIG. 5B is an enlarged view of the flex cable pad segment of
the ILS shown in FIG. 5A.
[0018] FIG. 5C is an enlarged view of the interconnect between the
first and second intermediate segments of the ILS shown in FIG.
5A.
[0019] FIG. 5D is an enlarged view of the gimbal segment of the ILS
shown in FIG. 5A.
[0020] FIG. 6 is a sectional view along section 6-6 of the
interconnect of FIG. 5C showing the multiple coplanar crossover
interconnect.
[0021] FIG. 7 is a graph of normalized write current as a function
of time for a multiple-segment transmission line, with two segments
going from 4 interleaved traces to 6 interleaved traces, according
to the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0022] FIG. 1 is a top plan view of a head/disk assembly (HDA) of a
hard disk drive 10. The hard disk drive 10 has at least one load
beam assembly 20 having an integrated lead suspension (ILS) 30
according to the prior art with an array of electrically conductive
lines or traces 32 that connect to a read/write head 29. The load
beam assemblies 20 are attached to rigid arms 22 connected to an
E-block 24. The disk drive 10 includes a rigid base 12 supporting a
spindle 14 that supports a stack of disks, including top disk 16.
The spindle 14 is rotated by a spindle motor (not shown) for
rotating the disks in the direction shown by curved arrow 17. Disk
drive 10 also includes a rotary actuator assembly 40 rotationally
mounted to the base 12 at a pivot point 41. The actuator assembly
40 is a voice coil motor (VCM) actuator that includes a magnet
assembly 42 fixed to base 12 and a voice coil 43. When energized by
control circuitry (not shown) the voice coil 43 moves and thereby
rotates E-block 24 with attached arms 22 and load beam assemblies
20 to position the heads 29 to the data tracks on the disks. The
traces 32 connect at one end to the read/write head 29 and at its
other end through a short flex cable to read/write circuitry
contained in an electrical module or chip 50 secured to a side of
the E-block 24. The chip 50 includes a read preamplifier/write
driver circuit.
[0023] FIG. 2A is a plan view according to the prior art of the ILS
30 and chip 50 showing the transmission line that connects the chip
50 with the read/write head. The ILS 30 includes a transmission
line 31 between a gimbal portion 51 and a flex cable pad portion
52. The ILS 30 is a laminate comprised of three layers: an
electrically conductive substrate, an insulating dielectric layer,
a conductive layer for the electrical traces or lines, and an
optional insulating dielectric cover layer. The gimbal portion 51
supports a slider (not shown) that contains the read/write heads 29
(FIG. 1) and has conductive traces 53 leading to pads 55 for
electrical connection to pads on the slider. The ILS 30 has an
electrical connection end 34 that is connected to traces 53 on
gimbal portion 51. The flex cable pad portion 52 has a plurality of
electrical connection pads, like pads 54, 56 that are electrically
connected to chip 50 via a flex cable 60. The flex cable 60
connects the chip 50 mounted on the side of the E-block 24 (FIG. 1)
to the pads, like pads 54, 56 on the ILS 30. Only the negative
write (-W) and positive (+W) electrical leads 58, 59, respectively,
are depicted to simplify the illustration in FIG. 2A. The ILS 30
has an electrical connection end 36 that is connected to pads 54,
56 on flex cable pad portion 52. A plurality of interleaved
electrically conductive traces or lines 32, extend generally
parallel to one another along the body of the ILS 30 between the
flex cable pad portion 52 and the gimbal portion 51. The lines 32
form part of the transmission line 31 of the ILS 30 from the write
driver in chip 50 to the write head on the slider attached to
gimbal end 51. The other part of the transmission line from the
write driver in chip 50 to the write head is the transmission line
37 on flex cable 60, specifically lines 58, 59. The ILS 30 also
includes conductive traces or lines 57 that connect the read
preamplifier in chip 50 with the read head on the slider attached
to gimbal end 51.
[0024] FIG. 2B is an expanded sectional view through section 2B-2B
of transmission line segment 31 in FIG. 2A and shows its laminated
construction. The transmission line segment 31 includes a generally
planar support member 61, a plurality of four interleaved
electrically conductive write traces or lines, like lines 71, 73 in
a first set and lines 72, 74 in a second set, and an optional
insulating dielectric cover layer 66. The lines 71-74 carry
differential write signals (+W and -W) with the signals being
interleaved. Interleaving means that the +W and -W signal traces
are adjacent one another, as shown in FIG. 2B. The support member
61 includes a conductive base or substrate 62, typically formed of
metal like stainless steel, and an insulator layer 64, formed of a
dielectric material like polyimide, between the traces 71-74 and
substrate 62. The support substrate 62 is typically about 18
microns thick and the insulating dielectric layer 64 is typically
about 10 microns thick. The optional dielectric cover layer 66 is
also typically formed of polyimide to a thickness of about 15
microns over the tops of the lines 71-74. The write lines are
typically formed of copper and are shown as being divided into four
interleaved lines along the entire length of transmission line
31.
[0025] FIG. 2C is a plan view of a portion of ILS 30 showing end 36
and the manner in which the four interleaved lines (71, 73 and 72,
74) are connected to the two write leads 81, 89. Pad 54 is
connected to the +W signal and is connected via lead 81 directly to
lines 71 and 73. Pad 56 is connected to the -W signal and is
connected directly via lead 89 to line 74 and then through vias
74a, 72a to line 72. Each signal from the write driver circuitry in
chip 50 (FIG. 2A) is thus fanned out into two lines, with the +W
and -W signals being interleaved along the transmission line 31 as
shown.
[0026] FIG. 3 is a schematic illustration of the interconnect
between the write driver circuitry and the write head according to
the prior art. The write driver operates at a voltage V.sub.drive
and has a resistance R.sub.VD, represented by two resistors, each
with resistance R.sub.WD/2. The write driver circuitry is required
to supply a wideband signal, typically with relevant frequency
content from as low as 0.01 GHz up to 2.0 GHz or higher in future
higher data rate hard disk drive systems. The write driver
circuitry is connected to the transmission line 37 of flex cable 60
(FIG. 2A) and the write head is connected to the transmission line
31 of the ILS 30 (FIG. 2A). In current disk drives, boosts or
overshoot of the write current pulses to the write head are used to
create precise magnetic footprints in the disk media. This
precision is required at low data rates and at high data rates.
Typically, the relatively slow magnetic flux reversal in the head
and media is the bottleneck to achieving higher performance in data
rates and areal densities.
[0027] Transmission line overshoot (TLO) uses transmission line
reflections to achieve faster magnetic flux reversals and is
described by Jury, J. C. et al. "Designing Disk Drive Interconnects
to Obtain a Desired Transmitted Write Current Waveform", IEEE
TRANSACTIONS ON MAGNETICS, VOL. 38, NO. 1, JANUARY 2002 pp. 55-60.
TLO reduces the overshoot requirement from the write driver
circuitry. A multiple-segment transmission line to achieve TLO is
described in U.S. Pat. Nos. 7,460,338 B2 and 7,417,818 B2, both
assigned to Hitachi. Each segment may have a different impedance
value as a result of varying the widths of the traces or the
thicknesses of the interconnections between the multiple segments.
The impedance values of the segments can thus be selected to
achieve the desired amplitude of TLO. FIG. 4 shows the normalized
write current with TLO as a function of time for a multiple-segment
transmission line with segments having different impedance values
as a result of having traces with different widths, using a four
interleave type structure for all segments along the entire length.
The TLO wave shape is determined primarily by the signal path's
impedance value and delay of multiple segments. The four interleave
line structure has limited impedance range, typically about 37 to
65 Ohm.
[0028] For various design reasons it is desirable to be able to
modify the wave shape of the TLO, for example its slope and
duration, as well as its amplitude. The present invention provides
a wider impedance range for the multiple-segment transmission line
that enables a wider optimization range of the TLO wave shape.
[0029] FIG. 5A is a plan view of the ILS 130 according to the
invention showing the transmission line 131 that connects the write
driver circuitry with the read/write head. The transmission line
131 is a multiple-segment transmission line with a first or flex
cable pad segment 131a, an end or gimbal segment 131b and two
intermediate segments 131c, 131d. Like the prior art ILS, the ILS
130 is a laminate comprised of three layers: an electrically
conductive substrate, an insulating dielectric layer, a conductive
layer for the electrical traces or lines, and an optional
insulating dielectric cover layer.
[0030] The flex cable pad segment 131a, shown in the enlarged view
of FIG. 5B, has a plurality of electrical connection pads, like
pads 154, 156, that are electrically connected to a chip (not
shown) that contains the write driver circuitry via a flex cable
(not shown). The pad segment 131a is connected to the first
intermediate segment 131c by a segment interconnect 301. The pad
segment 131a has two traces 200, 250 for the +W and -W signals that
divide into 4 interleaved traces at the interconnect 301. Thus the
first intermediate segment 131c contains two +W traces (205, 210)
and two -W traces (255, 260) that are interleaved.
[0031] The first intermediate segment 131c, shown in the enlarged
view of FIG. 5C, is connected to the second intermediate segment
131d by a segment interconnect 302. The two +W traces (205, 210)
and two -W traces (255, 260) in the first intermediate segment 131c
divide into 6 interleaved traces at the interconnect 302, which
increases the impedance range down to 20 Ohm. Thus the second
intermediate segment 131d contains three +W traces (215, 220, 225)
and three -W traces (265, 270, 275) that are interleaved.
[0032] The second intermediate segment 131d, shown in the enlarged
view of FIG. 5D, is connected to the end or gimbal segment 131b by
a segment interconnect 303. The three +W traces (215, 220, 225) and
three -W traces (265, 270, 275) merge into two traces in the gimbal
segment 131b at the interconnect 303. Thus the gimbal segment
contains a single +W trace 230 and a single -W trace 280 that
become connected to the write head (not shown) on the slider (not
shown).
[0033] In the embodiment shown and described with FIGS. 5A-5D,
there are only two intermediate segments and the number of traces
in the segments goes in the order from 2 to 4 to 6 to 2. The number
of traces in a segment is thus different from the number of traces
in the segments to which the segment is immediately connected.
However, there may be more than two intermediate segments and the
number of traces in each segment and the order of the segments with
different numbers of traces can be other than as shown. For
example, there could be four intermediate segments with the order
going from 2 to 6 to 8 to 4 to 6 to 2. There is an even number of
traces in each segment and the traces in each segment are
interleaved. The number of segments and the number of traces in
each segment can be selected to achieve the desired impedance
levels for the different segments to achieve the desired wave shape
for the TLO.
[0034] All of the traces on the transmission line 131 are
preferably coplanar. This is made possible by the use of multiple
coplanar crossover interconnects. FIG. 6 is a section along section
6-6 of the interconnect 302 of FIG. 5C. Referring now to FIGS. 5C
and 6, the ILS 130 includes an electrically conductive substrate
350, an insulator layer 352 on substrate 350, the electrically
conductive traces, like traces 205, 255, 260 and 225 on the
insulator layer 352, and an optional insulating cover layer 354.
Traces 255 and 260 from the first intermediate segment 131c merge
at the interconnect 302 and continue to divide into -W traces 265,
270, 275 at the interconnect 302, as shown in FIG. 5C. The +W
traces 205 and 225 are coplanar with the -W traces. As shown in
FIG. 6, trace 205 from first intermediate segment 131c is connected
to an electrically conductive via 302a which is connected to an
electrically isolated island 350a of substrate material. Similarly,
trace 225 of second intermediate segment 131d is connected to an
electrically conductive via 302b which is connected to island 350a.
Thus electrical connection is made from the +W traces 205, 210 of
the segment 131c to the traces 215, 220, 225 of segment 131d while
permitting these traces to be coplanar with the -W traces 265, 270,
275.
[0035] FIG. 7 shows the normalized write current with overshoot as
a function of time for a multiple-segment transmission line
according to the invention. The TLO wave shape (line 350) is for a
multiple-segment transmission line with two intermediate segments
going from 4 interleaved traces to 6 interleaved traces. The TLO
wave shape of line 350 is substantially different from the TLO wave
shape (line 360) of FIG. 4, which is for a multiple-segment
transmission line with segments having traces with different
widths, using a four interleave type structure for all segments
along the entire length. The segment change from 4 interleaved
traces to 6 interleaved traces creates a significant impedance step
to induce more TLO amplitude and shorter duration (wave shape 350)
than can be achieved with a uniform 4-interleave structure. Thus
the multiple-segment transmission line with segments having
different numbers of interleaved traces enables optimization of the
different wave shape parameters, such as TLO slope, amplitude and
duration.
[0036] While the present invention has been particularly shown and
described with reference to the preferred embodiments, it will be
understood by those skilled in the art that various changes in form
and detail may be made without departing from the spirit and scope
of the invention. Accordingly, the disclosed invention is to be
considered merely as illustrative and limited in scope only as
specified in the appended claims.
* * * * *