U.S. patent application number 14/552269 was filed with the patent office on 2015-04-09 for apparatus for fabricating organic light emitting display panel and method of fabricating organic light emitting display panel using the same.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Dong-Sul Kim, Byung-Chul Lee, Jae-Ha Lim, Jae-Seok Park, Jin-Han Park.
Application Number | 20150096489 14/552269 |
Document ID | / |
Family ID | 47741918 |
Filed Date | 2015-04-09 |
United States Patent
Application |
20150096489 |
Kind Code |
A1 |
Lee; Byung-Chul ; et
al. |
April 9, 2015 |
APPARATUS FOR FABRICATING ORGANIC LIGHT EMITTING DISPLAY PANEL AND
METHOD OF FABRICATING ORGANIC LIGHT EMITTING DISPLAY PANEL USING
THE SAME
Abstract
An apparatus for fabricating an organic light emitting display
panel is disclosed. In one embodiment, the apparatus includes i) a
first roll around which a film is wound to be continuously drawn,
ii) a second roll arranged to face the first roll and around which
the film is continuously wound, iii) a plurality of chambers
disposed between the first and second rolls and through which the
film passes, and in which laser induced thermal imaging (LITI) is
performed on a substrate by forming a transfer layer on the film,
and iv) a gate unit installed at least one of the chambers and
disposed at at least one of a film inlet and a film output of the
chambers that are installed, to maintain a substantially vacuum
state in the chambers during passing of the film.
Inventors: |
Lee; Byung-Chul;
(Yongin-city, KR) ; Park; Jae-Seok; (Yongin-city,
KR) ; Lim; Jae-Ha; (Yongin-city, KR) ; Park;
Jin-Han; (Yongin-city, KR) ; Kim; Dong-Sul;
(Yongin-city, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-city |
|
KR |
|
|
Family ID: |
47741918 |
Appl. No.: |
14/552269 |
Filed: |
November 24, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13480167 |
May 24, 2012 |
8916018 |
|
|
14552269 |
|
|
|
|
Current U.S.
Class: |
118/50.1 |
Current CPC
Class: |
B05C 1/0813 20130101;
B05C 1/0834 20130101; H01L 51/56 20130101 |
Class at
Publication: |
118/50.1 |
International
Class: |
B05C 1/08 20060101
B05C001/08 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 29, 2011 |
KR |
10-2011-0086564 |
Claims
1. An apparatus for fabricating an organic light emitting display
panel, the apparatus comprising: a first roll around which a film
is wound to be substantially continuously drawn; a second roll
arranged to face the first roll and around which the film is
substantially continuously wound; a plurality of chambers disposed
between the first and second rolls and through which the film
passes, and in which laser induced thermal imaging (LITI) is
performed on a substrate based on a transfer layer formed on the
film; and a gate unit installed in at least one of the chambers and
disposed at at least one of a film inlet and a film output of the
chambers that are installed, to maintain a substantially vacuum
state in the chambers during passing of the film.
2. The apparatus of claim 1, wherein the chambers comprise a first
chamber configured to receive the film released from the first
roll, wherein the first chamber comprises a deposition unit
configured to form the transfer layer on a first surface of the
film, and wherein the first chamber is configured to output the
film on which the transfer film is formed.
3. The apparatus of claim 2, wherein the deposition unit comprises:
a plurality of support rolls configured to support a second surface
of the film, wherein the second surface is opposing the first
surface; a plurality of auxiliary rolls supporting an area other
than a deposition area of the first surface of the film; and a
deposition source configured to eject a material for the transfer
layer toward the first surface of the film.
4. The apparatus of claim 2, wherein the chambers comprise a second
chamber arranged close to the first chamber and configured to
receive the film output from the first chamber, wherein the second
chamber comprises a combination unit configured to make the film
and the substrate closely contact each other such that the transfer
layer of the film faces the substrate, and wherein the second
chamber is further configured to output the film and substrate.
5. The apparatus of claim 4, wherein the combination unit comprises
a i) substrate input device configured to make the substrate input
into the second chamber contact the film and ii) a plurality of
upper and lower combination rolls which support the film and
substrate from the upper and lower sides, respectively, and wherein
at least one of the upper and lower combination rolls has an
indented central portion.
6. The apparatus of claim 4, wherein the chambers comprise a third
chamber arranged close to the second chamber and configured to
receive the film and substrate output from the second chamber,
wherein the third chamber comprises a transfer unit configured to
transfer the transfer layer to the substrate based on a laser beam
irradiated onto the film or the substrate, and wherein the third
chamber is further configured to output the film and substrate.
7. The apparatus of claim 6, wherein the transfer unit comprises i)
a beam irradiator configured to irradiate a laser beam onto the
film or the substrate, ii) a mask interposed between the beam
irradiator and the film or the substrate, and iii) an aligner
configured to align the mask and the substrate.
8. The apparatus of claim 6, wherein the chambers comprise a fourth
chamber arranged close to the third chamber and configured to
receive the film and substrate output from the third chamber,
wherein the fourth chamber comprises a detachment unit configured
to detach the substrate from the film, and wherein the fourth
chamber is further configured to output the substrate.
9. The apparatus of claim 8, wherein the second roll is disposed in
the fourth chamber.
10. The apparatus of claim 8, wherein the detachment unit comprises
a detachment roll that winds the film in a direction to be
separated from the substrate.
11. The apparatus of claim 1, wherein the substrate is disposed
above the film.
12. The apparatus of claim 1, wherein the gate unit comprises i) a
pair of gate blocks arranged facing each other and driven to
approach and be separated from each other, ii) a plurality of pad
units disposed on surfaces of the gate blocks facing each other and
supporting the film, and iii) a plurality of vacuum suction holes
installed in the gate blocks and the pads to respectively
correspond to the pad units.
13. The apparatus of claim 12, wherein each of the pad units
further comprises a suction unit having an edge extending close to
the film, and wherein the edge is configured to be elastically
deformed based on a pressure applied from the film.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 13/480,167 filed on May 24, 2012, which claims the benefit
of Korean Patent Application No. 10-2011-0086564, filed on Aug. 29,
2011, in the Korean Intellectual Property Office, the disclosure of
which is incorporated herein in its entirety by reference.
BACKGROUND
[0002] 1. Field
[0003] The described technology generally relates to an apparatus
for fabricating an organic light emitting display panel and a
method of fabricating an organic light emitting display panel using
the same.
[0004] 2. Description of the Related Technology
[0005] Organic light emitting displays having merits such as a fast
response speed, low power consumption, and a wide viewing angle
have been extensively used as motion picture displays. Also,
organic light emitting displays may be fabricated in a low
temperature environment and a fabrication process thereof is
simplified because it is based on existing semiconductor process
technologies. Accordingly, they have drawn attention as next
generation flat panel displays.
SUMMARY
[0006] One inventive aspect is an apparatus for fabricating an
organic light emitting display panel, which may improve a process
yield, and a method of fabricating an organic light emitting
display panel using the same.
[0007] Another aspect is an apparatus for fabricating an organic
light emitting display panel, which may reduce a defect due to air
generated in the atmosphere, and a method of fabricating an organic
light emitting display panel using the same.
[0008] Another aspect is an apparatus for fabricating an organic
light emitting display panel which includes a first roll around
which a film is wound to be continuously drawn, a second roll
arranged to face the first roll and around which the film is
continuously wound, a plurality of chambers disposed between the
first roll and the second roll and through which the film passes,
and in which laser induced thermal imaging (LITI) is performed on a
substrate by forming a transfer layer on the film, and a gate unit
installed at least one of the plurality of chambers and disposed at
at least one of a film inlet and a film output of the plurality of
chambers that are installed, to maintain an inner vacuum degree
during passing of the film.
[0009] The plurality of chambers may include a first chamber, into
which the film released from the first roll is input, having a
deposition unit for forming a transfer layer on one surface of the
film and outputting a film on which the transfer film is formed to
the outside.
[0010] The deposition unit may include a plurality of support rolls
supporting the other surface of the film, a plurality of auxiliary
rolls supporting an area other than a deposition area of one
surface of the film, and a deposition source ejecting a material
for a transfer layer toward the one surface of the film.
[0011] The plurality of chambers may include a second chamber
arranged close to the first chamber, into which the film output
from the first chamber is input, having a combination unit making
the film and the substrate closely contact each other such that the
transfer layer of the film faces the substrate, and outputting the
film and the substrate closely contacting each other, to the
outside.
[0012] The combination unit may include a substrate input device
making the substrate input into the second chamber contact the film
and a plurality of upper and lower combination rolls, each
supporting the film and the substrate contacting each other from
the upper and lower sides, wherein at least one of the upper and
lower combination rolls has an indented central portion.
[0013] The plurality of chambers may include a third chamber
arranged close to the second chamber, into which the film and the
substrate contacting each other and output from the second chamber
are input, having a transfer unit transferring the transfer layer
to the substrate by irradiating a laser beam onto the film or the
substrate, and outputting the film and the substrate closely
contacting each other, to the outside.
[0014] The transfer unit may include a beam irradiator irradiating
a laser beam onto the film or the substrate, a mask interposed
between the beam irradiator and the film or the substrate, and an
aligner aligning the mask and the substrate.
[0015] The plurality of chambers may include a fourth chamber
arranged close to the third chamber, into which the film and the
substrate contacting each other and output from the third chamber
are input, having a detachment unit detaching the substrate from
the film, and outputting the substrate, to the outside.
[0016] The second roll may be disposed in the fourth chamber.
[0017] The detachment unit may include a detachment roll that winds
the film in a direction to be separated from the substrate.
[0018] The substrate may be disposed above the film.
[0019] The gate unit may include a pair of gate blocks arranged
facing each other and driven to approach and be separated from each
other, a plurality of pad units disposed on surfaces of the gate
blocks facing each other and supporting the film, and a plurality
of vacuum suction holes installed in the gate blocks and the pads
to respectively correspond to the plurality of pad units.
[0020] Each of the plurality of pad units may further include a
suction unit having an edge extending close to the film, the edge
being elastically deformed by pressure of the film.
[0021] Another aspect is a method of fabricating an organic light
emitting display panel which includes preparing a first roll around
which a film is wound, continuously drawing the firm from the first
roll, forming a transfer layer on the film, and allow the film to
pass through a plurality of chambers during which laser induced
thermal imaging (LITI) is performed to transfer the transfer layer
to a substrate, maintaining a degree of vacuum of each of the
plurality of chambers when the film passes through the plurality of
chambers through a gate unit installed at at least one of the
plurality of chambers and disposed at at least one of a film inlet
and a film outlet of each of the plurality of chambers that are
installed, and continuously winding the film passing through the
plurality of chambers around a second roll that is arranged
corresponding to the first roll.
[0022] The plurality of chambers may include a first chamber into
which the film released from the first roll is input, and a
transfer layer is formed on one surface of the film in the first
chamber.
[0023] The forming of the transfer layer may include supporting the
other surface of the film using a plurality of support rolls,
supporting an area other than a deposition area of one surface of
the film using a plurality of auxiliary rolls, and ejecting a
material for the transfer layer toward one surface of the film
using a deposition source.
[0024] The plurality of chambers may include a second chamber
arranged close to the first chamber, into which the film output
from the first chamber is input, and the film and the substrate
closely contact each other in the second chamber such that the
transfer layer of the film faces the substrate.
[0025] The making of the film and the substrate closely contact
each other may include the substrate input into the second chamber
contacting the film using a substrate input device, and supporting
the film and the substrate contacting each other respectively from
upper and lower sides using a plurality of upper and lower
combination rolls, wherein at least one of the upper and lower
combination rolls has an indented central portion.
[0026] The plurality of chambers may include a third chamber
arranged close to the second chamber, into which the film and the
substrate contacting each other and output from the second chamber
are input, and the transfer layer is transferred to the substrate
by irradiating a laser beam onto the film or the substrate in the
third chamber.
[0027] The transferring of the transfer layer to the substrate may
include aligning a mask and the substrate, and irradiating a laser
beam onto the film or the substrate.
[0028] The plurality of chambers may include a fourth chamber
arranged close to the third chamber, into which the film and the
substrate contacting each other and output from the third chamber
are input, and the substrate is detached from the film in the
fourth chamber.
[0029] The second roll may be disposed in the fourth chamber.
[0030] In the detaching of the substrate from the film, a
detachment roll supporting the film may wind the film in a
direction to be separated from the substrate.
[0031] The substrate may be disposed above the film.
[0032] The gate unit may include a pair of gate blocks arranged
facing each other and driven to approach and be separated from each
other, a plurality of pad units disposed on surfaces of the gate
blocks facing each other and supporting the film, and a plurality
of vacuum suction holes installed in the gate blocks and the pads
to respectively correspond to the plurality of pad units, and in a
state in which the pair of gate blocks approaching each other
support the film between the plurality of pad units, an interval
between the plurality of pad units becomes vacuum through the
plurality of vacuum suction holes.
[0033] Each of the plurality of pad units may further include a
suction unit having an edge extending close to the film, the edge
being elastically deformed by pressure of the film.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1 is a cross sectional view schematically illustrating
a structure of an organic light emitting display panel fabricated
by an apparatus for fabricating an organic light emitting display
panel and a method of fabricating an organic light emitting display
panel using the same, according to an embodiment.
[0035] FIG. 2 is a cross sectional view of a donor film provided in
a roll-to-roll type according to an embodiment.
[0036] FIG. 3 is a view schematically illustrating a structure of
an apparatus for fabricating an organic light emitting display
panel according to an embodiment.
[0037] FIG. 4 is a view schematically illustrating a structure of a
loading chamber of FIG. 3.
[0038] FIG. 5 is a view schematically illustrating a structure of a
first chamber of FIG. 3.
[0039] FIG. 6 is a view schematically illustrating a structure of a
deposition unit of FIG. 5.
[0040] FIG. 7 is a view schematically illustrating a structure of a
second chamber of FIG. 3.
[0041] FIG. 8 is a view schematically illustrating a structure of
an upper combination roll and a lower combination roll FIG. 7.
[0042] FIG. 9 is a view schematically illustrating a structure of a
third chamber of FIG. 3.
[0043] FIG. 10 is a view schematically illustrating a structure of
a mask, a first camera unit, and a second camera unit of FIG.
9.
[0044] FIG. 11 is a view schematically illustrating a structure of
a fourth chamber of FIG. 3.
[0045] FIG. 12 is a view schematically illustrating a structure of
a gate unit.
[0046] FIG. 13 is a magnified cross sectional view of a portion A
of FIG. 12.
DETAILED DESCRIPTION
[0047] A method of patterning an organic light emitting layer
includes laser induced thermal imaging (LITI). The LITI is a method
of converting laser irradiated from a light source into thermal
energy and transferring a pattern forming material to a target
substrate using the thermal energy, thereby forming a pattern. To
use the method, a donor film on which a transfer layer is formed, a
light source, and a target substrate are needed.
[0048] According to the LITI, the donor film covers the whole of
the target substrate that is a receptor and the donor film and the
target substrate are fixed on a stage. Laser transfer is performed
on the donor film so that patterning is completed.
[0049] However, some processes of the LITI are performed in a near
vacuum and some other processes are performed at atmospheric
pressure. Accordingly, voids may be generated as air is trapped
between the donor film and the target substrate during the
combining of the donor film and the target substrate. Thus,
combination defects are generated. Also, when the donor film and
the target substrate are detached from each other, organic
substances adhere to the donor film due to air filling the gap
between the donor film and the target substrate. As a result,
manufacturing yield is reduced and process time is prolonged.
[0050] Throughout the description, the terms such as "first" and
"second" are used herein merely to describe a variety of
constituent elements, but the constituent elements are not limited
by the terms. The terms are used only for the purpose of
distinguishing one constituent element from another constituent
element. For example, a first constituent element may be referred
to as a second constituent element, and vice versa.
[0051] The terms used in the present specification are used for
explaining embodiments. Thus, the expression of singularity in the
present specification includes the expression of plurality unless
clearly specified otherwise in context. Also, the terms such as
"include" or "comprise" may be construed to denote a certain
characteristic, number, step, operation, constituent element, or a
combination thereof, but may not be construed to exclude the
existence of or a possibility of addition of one or more other
characteristics, numbers, steps, operations, constituent elements,
or combinations thereof.
[0052] Embodiments will be described in detail with reference to
the attached drawings. Like reference numerals in the drawings
denote like elements.
[0053] FIG. 1 is a cross sectional view schematically illustrating
a structure of an organic light emitting display panel 100
fabricated by an apparatus for fabricating an organic light
emitting display panel and a method of fabricating an organic light
emitting display panel using the same, according to an embodiment.
Referring to FIG. 1, the organic light emitting display panel 100
includes a first substrate 101. The first substrate 101 may be
formed of an insulation substrate such as glass or plastic. A metal
substrate having an insulation processed surface may also be
used.
[0054] A buffer layer 102 is formed on a first substrate 101. The
buffer layer 102 is formed of an organic substance, an inorganic
substance, or has a structure in which an organic substance and an
inorganic substance are alternately deposited. The buffer layer 102
performs a function of blocking oxygen and moisture and
simultaneously a function of preventing dispersion of moisture or
impurity generated from the first substrate 101.
[0055] A semiconductor active layer 103 having a predetermined
pattern is formed on the buffer layer 102. The semiconductor active
layer 103 may be formed of amorphous silicon or polycrystal
silicon. The semiconductor active layer 103 may also be formed of
an oxide semiconductor. For example, the semiconductor active layer
103 may be a G-I--Z--O layer [(In2O3)a(Ga2O3)b(ZnO)c layer] (a, b,
and c are real numbers respectively satisfying conditions of
a.gtoreq.0, b.gtoreq.0, and c>0). Also, the semiconductor active
layer 103 may be formed of an organic semiconductor material.
[0056] A source region 104 and a drain region 105 are formed on the
semiconductor active layer 103. A channel region 106 is an area
between the source region 104 and the drain region 105. The
semiconductor active layer 103 is covered by a gate insulation
layer 107. The gate insulation layer 107 may be formed of a single
layer of SiO.sub.2 or a dual layer of SiO.sub.2 and SiN.sub.x.
[0057] A gate electrode 108 is formed in a predetermined region on
an upper surface of the gate insulation layer 107. The gate
electrode 108 is connected to a gate line (not shown) that applies
a thin film transistor on/off signal. The gate electrode 108 may be
formed of a single metal or multiple metals and may be formed of a
monolayer film of Mo, MoW, Cr, Al, Al alloy, Mg, Al, Ni, W, Au, or
the like, or a multilayer film of a combination thereof.
[0058] An interlayer insulating layer 109 is formed on an upper
surface of the gate electrode 108. A source electrode 110 is
electrically connected to the source region 104 via a contact hole.
A drain electrode 111 is electrically connected to the drain region
105.
[0059] A protection layer, or a passivation and/or planarization
layer, 112 is formed on upper surfaces of the source electrode 110
and the drain electrode 111. The protection layer 112 may be formed
of an organic material such as acryl or benzocyclobutene (BCB), or
an inorganic material such as SiN.sub.x, and a variety of
modifications, for example, a single layer, or a dual or multiple
layer, may be available.
[0060] A first electrode 115 of an organic light emitting device
114 is formed on an upper surface of the protection layer 112. A
pixel defining layer (PDL) 113, which may be formed of an organic
and/or inorganic material, is formed to cover the edge of the first
electrode 115. The first electrode 115 is electrically connected to
one of the source electrode 110 and the drain electrode 111.
[0061] An organic layer 116 is formed on an upper surface of the
first electrode 115. A second electrode 117 of the organic light
emitting device 114 is formed on an upper surface of the organic
layer 116.
[0062] Of the electrodes of the organic light emitting device 114,
the first electrode 115 functions as an anode electrode and may be
formed of various conductive materials. In the present embodiment,
the first electrode 115 may be formed in a transparent electrode or
a reflection electrode.
[0063] For example, the first electrode 115, when used as a
transparent electrode, may be formed of ITO, IZO, ZnO, or
In.sub.2O.sub.3. When the first electrode 115 is used as a
reflection electrode, a reflection layer is formed of Ag, Mg, Al,
Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and then a layer
formed of ITO, IZO, ZnO, or In.sub.2O.sub.3 is formed on the
reflection layer.
[0064] Of the electrodes of the organic light emitting device 114,
the second electrode 117 functions as a cathode electrode and may
be formed as a transparent electrode or a reflection electrode.
When the second electrode 117 is used as a transparent electrode,
metal having a low work function, that is, Li, Ca, LiF/Ca, LiF/Al,
Al, Ag, Mg, or a compound thereof is deposited on the organic layer
116 to have a thin thickness and then an auxiliary electrode layer
or a bus electrode line may be formed using a material for forming
a transparent electrode.
[0065] When used as a reflection electrode, the second electrode
117 is formed by depositing Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or
a compound thereof on an entire surface of the display.
[0066] The first electrode 115, when formed in a transparent
electrode or a reflection electrode, may have a shape corresponding
to an opening shape of each subpixel. The second electrode 117 may
be formed by depositing a transparent electrode or a reflection
electrode on an entire surface of a display area. The second
electrode 117 may not be necessarily deposited on an entire surface
and may be formed in a variety of patterns. The first electrode 115
and the second electrode 117 may be deposited at the opposite
positions.
[0067] A small molecular or polymer organic layer may be used for
the organic layer 116. When a small molecular organic material is
in use, the organic layer 116 may include a hole injection
transport layer (HITL), an emission layer (EML), and an electron
injection transport layer (ETL), which are deposited in a single or
complex structure. Also, various usable organic materials such as
copper phthalocyanine (CuPc),
N,N'-Di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB),
tris-8-hydroxyquinoline aluminum (Alq3) may be used for the organic
layer 116. These small molecular organic materials may be formed by
a method such as a vacuum deposition method.
[0068] When a polymer organic material is in use, the organic layer
116 may include the HITL and the EML. PEDOT is used as the HITL and
a polymer organic material such as a poly-phenylenevinylene (PPV)
based material or a polyfluorene based material is used as the EML,
which may be formed by screen printing or an inkjet print
method.
[0069] The organic layer 116 is not limited to the above
description and a variety of embodiments thereof may be
available.
[0070] A second substrate 118 is provided above the organic light
emitting device 114. The second substrate 118 may be a glass
substrate or a plastic substrate. The organic light emitting device
114 may be sealed from the external atmosphere by using a thin film
covering the organic light emitting device 114, instead of the
second substrate 118.
[0071] In the present specification, a substrate 120 refers to a
substrate in a state before the organic layer 116 including the EML
is formed. The substrate 120 may include a state in which the HITL
is formed in the organic layer 116.
[0072] FIG. 2 is a cross sectional view of a donor film 200
provided in a roll-to-roll type according to an embodiment.
Referring to FIG. 2, the donor film 200 includes a base film 203, a
transfer layer 205 disposed above the base film 203, and a
photothermal conversion layer 204 arranged between the base film
203 and the transfer layer 205. As a laser beam is irradiated
toward the donor film 200, the photothermal conversion layer 204
converts light energy into thermal energy and thus the transfer
layer 205 is transferred to the substrate 120. A function layer for
performing a particular function such as blocking moisture may be
further provided at any one of an upper surface of the transfer
layer 205, between the transfer layer 205 and the photothermal
conversion layer 204, and the photothermal conversion layer 204 and
the base film 203.
[0073] In the present specification, a state in which the transfer
layer 205 is not formed is referred to as a first film 201 and a
state in which the transfer layer 205 is completely formed is
referred to as a second film 202.
[0074] In one embodiment, an organic light emitting display panel
is fabricated in a laser induced thermal imaging (LITI) method
while the donor film 200 continuously passes through a plurality of
chambers.
[0075] FIG. 3 is a view schematically illustrating a structure of
an apparatus for fabricating an organic light emitting display
panel according to an embodiment. Referring to FIG. 3, the
apparatus for fabricating an organic light emitting display panel
includes first, second, third, and fourth chambers 310, 320, 330,
and 340 that are continuously arranged. A loading chamber 350 and
an unloading chamber 360 are respectively communicated with the
first chamber 310 and the fourth chamber 340. In one embodiment,
the first to fourth chambers 310-340 are separate vacuum
chambers.
[0076] FIG. 4 is a view schematically illustrating a structure of
the loading chamber 350 of FIG. 3. The loading chamber 350 is
communicated with the first chamber 310 and provides the first film
201 to the first chamber 310. At least one first roll 205 is
arranged in the loading chamber 350.
[0077] The loading chamber 350 may include a loadlock chamber to
facilitate detachment and installation of the first roll 205. When
a first roll 205a being in use is replaced with a new one, the
replacement may be performed during a product maintenance (PM)
operation after only the loading chamber 350 performs a vent
operation. That is, a first film 201b of a first roll 205b that has
been in a ready state is combined to the first film 201a of the
first roll 205a that is performing a process and then the first
film 201a is cut off at a cutting point C2. Thereafter, the loading
chamber 350 is vacuum pumped.
[0078] FIG. 5 is a view schematically illustrating a structure of
the first chamber 310 of FIG. 3. The first chamber 310 includes a
deposition unit 315 that is installed inside. The first film 201
enters through one side of the first chamber 310 from the loading
chamber 350.
[0079] The deposition unit 315 forms a second film 202 by forming
the transfer layer 205 on one surface of the first film 201. The
second film 202 is output to the outside of the first chamber 310
through the other side of the first chamber 310. The deposition
unit 315 includes a plurality of support rolls 311, a plurality of
auxiliary rolls 312, and a deposition source 314. The support roll
311 is connected to a separate driving source (not shown) to be
rotated in one direction, and may support a lower surface of the
first film 201.
[0080] The auxiliary roll 312 may support an upper surface of the
first film 201. As illustrated in FIG. 6, an indented portion 313
is formed at a central portion of the auxiliary roll 312 so as to
support other areas except for a deposition area of the upper
surface of the first film 201 so that the transfer layer 205 formed
on the upper surface of the first film 201 may be prevented from
being damaged. The auxiliary roll 312 may be disposed outside an
area where a material for the transfer layer 205 is output from the
deposition source 314.
[0081] The deposition source 314 disposed above the first film 201
ejects the material for the transfer layer 205 toward the upper
surface of the first film 201. The first chamber 310 may be in a
vacuum state.
[0082] Although in the embodiment illustrated in FIGS. 5 and 6, the
deposition source 314 is disposed above the first film 201 and
forms the transfer layer 205 on the upper surface of the first film
201, the deposition source 314 may be disposed under the first film
201 to form the transfer layer 205 on the lower surface of the
first film 201.
[0083] FIG. 7 is a view schematically illustrating a structure of
the second chamber 320 of FIG. 3. The second chamber 320 is
disposed close to the first chamber 310 and the second film 202
output from the first chamber 310 is input into the second film 202
through one side thereof. A combination unit 328 is provided in the
second chamber 320. The combination unit 328 closely presses the
second film in the second chamber 320 against the substrate 120.
The second film 202 closely contacting the substrate 120 is output
to the outside through the outside of the second chamber 320.
[0084] The combination unit 328 includes a substrate input device
329, a plurality of upper combination rolls 326, and a plurality of
lower combination rolls 325. The substrate input device 329
includes a support unit 321 for supporting the substrate 120 that
is input into the second chamber 320 through a separate input door
and a transfer unit 322 for receiving the substrate 120 from the
support unit 321 and transferring the substrate 120. The transfer
unit 322 includes a plurality of driving rollers 324 and a
receiving unit 323 for receiving the support unit 321. The support
unit 321 may be provided by a plurality of pins. As each of the
pins is inserted in the receiving unit 323 so that the substrate
120 is accommodated on the second film 202 placed on the driving
rollers 324.
[0085] As the driving rollers 324 are rotated to transfer the
second film 202 toward the upper and lower combination rolls 326
and 325, the upper combination rolls 326 support the substrate 120
and the lower combination rolls 325 support the second film 202.
The combination rolls 326 and 325 press the second film 202 and the
substrate 120 interposed therebetween to closely contact each
other. As illustrated in FIG. 8, each of the upper combination
rolls 326 has an indented portion 327 at a central portion thereof
that is indented slightly less than the thickness of the substrate
120. Accordingly, the central portion of each of the upper
combination rolls 326 supports the substrate 120 by pressing the
upper surface of the substrate 120.
[0086] The second chamber 320 may be in a vacuum state equal to or
less than a degree of a vacuum of the first chamber 310. In the
embodiment of FIGS. 7 and 8, although the substrate 120 is
accommodated on the upper surface of the second film 202, however,
the substrate 120 may also be accommodated on the upper surface of
the second film 202.
[0087] FIG. 9 is a view schematically illustrating a structure of
the third chamber 330 of FIG. 3. Referring to FIG. 9, the third
chamber 330 is disposed close to the second chamber 320 and the
second film 202 closely contacted by the substrate 120 output from
the second chamber 320 is input into the third chamber 330. A
transfer unit 336 for transferring the transfer layer 205 to the
substrate 120 by irradiating laser onto the second film 202 or the
substrate 120 is installed in the third chamber 330. The transfer
unit 336 includes a beam irradiator 335 for irradiating a laser
beam onto the second film 202 or the substrate 120, a mask 332
interposed between the beam irradiator 335 and the second film 202
or the substrate 120, and an aligner 337 for aligning the mask 332
and the substrate 120.
[0088] The substrate 120 and the second film 202 are transferred by
a plurality of driving rollers 331 in the third chamber 330 to the
left side in FIG. 9 and accommodated on the mask 332. A pattern for
transmitting a laser beam is formed in the mask 332 as illustrated
in FIG. 10. The pattern corresponds to a pixel pattern formed on
the substrate 120.
[0089] The mask 332 and the substrate 120 are aligned by the
aligner 337. First, a first camera unit 333 recognizes an align
mark formed on the substrate 120 and a second camera unit 334 for
recognizing a start point of a pixel aligns the mask 332 to the
substrate 120. A separate driving apparatus is connected to the
mask 332 so that the mask 332 may be aligned to the substrate 120
through fine adjustment of the mask 332.
[0090] After the alignment of the mask 332 and the substrate 120, a
laser beam is irradiated by the beam irradiator 335 so that the
transfer layer 205 formed on the second film 202 is transferred to
the substrate 120. The third chamber 330 may be in a vacuum state
substantially equal to or less than a degree of a vacuum of the
second chamber 320.
[0091] Although FIG. 9 illustrates that the beam irradiator 335 is
disposed inside the third chamber 330, the beam irradiator 335 may
also be disposed outside the third chamber 330 and a laser beam may
be focused at the photothermal conversion layer 204 of the second
film 202 through a projection lens.
[0092] FIG. 11 is a view schematically illustrating a structure of
the fourth chamber 340 of FIG. 3. Referring to FIG. 11, the fourth
chamber 340 is disposed close to the third chamber 330 and the
second film 202 closely contacted by the substrate 120 output from
the third chamber 330 is input into the fourth chamber 340.
[0093] A detachment unit 342 for detaching the second film 202 and
the substrate 120 from each other is provided in the fourth chamber
340. The detachment unit 342 includes a detachment roll 341 that
supports the second film 202 and winds the second film 202 in a
direction to be separated from the substrate 120. In the embodiment
of FIG. 11, the detachment roll 341 winds the second film 202 in a
downward direction to connect to a second roll 206. For a rapid
detachment process, the second roll 206 may be disposed in the
fourth chamber 340 and the second roll 206 may be replaced during
the PM operation.
[0094] When the LITI is completed in the third chamber 330 as
described above, the transfer layer 205 of the second film 202 is
transferred to the substrate 120 in a pattern corresponding to the
pattern of the mask 332. In this state, a second film 202, from
which the transfer layer 205 has been removed, corresponding to the
pattern of the mask 332 passes through the detachment roll 341 to
be wound around the second roll 206. To facilitate the detachment
process, the substrate 120 may be disposed in an upper side whereas
the second film 202 may be disposed in a lower side.
[0095] As illustrated in FIG. 2, the second film 202 includes the
photothermal conversion layer 204 that converts a laser beam into
thermal energy. The transfer layer 205 is transferred to the
substrate 120 due to the thermal energy. The transfer layer 205 is
melt and stuck to a surface of the substrate 120 due to the thermal
energy. After the melting and sticking, the second film 202 tends
to naturally fall down due to the gravity. In this state, when the
detachment roll 341 applies a force to the second film 202' to face
downwardly, the second film 202' is naturally separated from the
substrate 120.
[0096] The fourth chamber 340 may be in a vacuum state
substantially equal to or less than a degree of a vacuum of the
third chamber 330.
[0097] The substrate 120 having passed through the process is
transferred to the unloading chamber 360 as illustrated in FIG. 3
and drawn out for a subsequent process.
[0098] In one embodiment, as illustrated in FIGS. 12 and 13, a gate
unit 400 is installed at at least one of a film inlet and a film
outlet of at least one of the chambers to maintain an inner vacuum
degree during passing of the donor film 200.
[0099] For example, the gate unit 400 may be installed between the
loading chamber 350 and the first chamber 310, between the first
and second chambers 310 and 320, between the third and fourth
chambers 330 and 340, and/or between the fourth chamber 230 and the
unloading chamber 360.
[0100] FIG. 12 is a view schematically illustrating an example of
the gate unit 400 installed between the loading chamber 350 and the
first chamber 310. FIG. 13 is a magnified cross sectional view of a
portion A of FIG. 12.
[0101] A first gate block 410 and a second gate block 420 are
arranged to face each other and may be driven to approach and be
separated from each other. Both of the first and second gate blocks
410 and 420 may be driven, or one of the gate blocks 410 and 4240
may be fixed whereas the other one is driven.
[0102] A plurality of first pad units 411 are formed on a surface
of the first gate block 410 facing the second gate block 420,
whereas a plurality of second pad units 421 are formed on a surface
of the second gate block 420 facing the first gate block 410. The
first pad units 411 and the second pad units 421 protrude from the
surfaces of the first and second gate blocks 410 and 420 facing
each other. When the first and second gate blocks 410 and 420 are
driven to approach each other, that is, perform a closing
operation, the first pad units 411 and the second pad units 421
contact each other.
[0103] A first vacuum suction hole 412 is formed in the first gate
block 410 and extends to each of the first pad units 411. A second
vacuum suction hole 422 is formed in the second gate block 420 and
extends to each of the second pad units 421.
[0104] Each of the first pad units 411 further includes a first
suction unit 413 on a surface of each of the first pad units 411
facing each of the second pad units 421. The first suction unit 413
extends such that an edge thereof is curved downwardly. The edge is
elastically deformed upwardly as the first suction unit 413 is
pressed downwardly.
[0105] Each of the second pad units 421 further includes a second
suction unit 423 on a surface of each of the second pad units 421
facing each of the first pad units 411. The second suction unit 423
extends such that an edge thereof is curved upwardly. The edge is
elastically deformed downwardly as the second suction unit 423 is
pressed upwardly.
[0106] The first suction unit 413 and the second suction unit 423
may be formed of an elastic material such as rubber, urethane, or
silicon.
[0107] In FIG. 13, the first suction unit 413 is illustrated to be
larger than the second suction unit 423. However, the second
suction unit 423 may also be formed to be larger than the first
suction unit 413. Alternatively, the first suction unit 413 and the
second suction unit 423 may have the same size.
[0108] The first vacuum suction hole 412 and the second vacuum hole
422 may extend to the first suction unit 413 and the second suction
unit 423, respectively.
[0109] According to the above structure, when the gate unit 400 is
closed, an interval between the first and second blocks 410 and 420
has a degree of vacuum higher than a connected chamber, that is,
the first chamber 310, via the first and second vacuum suction
holes 412 and 422, the first and second pad units 411 and 421, in
particular, the first and second suction units 413 and 423, may
suck the first film 201 using a difference in vacuum pressure. As
described above, since the first and second suction units 413 and
423 are formed of an elastic material so as to be elastically
deformed and to closely contact the first film 201. Accordingly,
the sealing of the first chamber 310 may be maintained using the
gate unit 400.
[0110] When the gate unit 400 is open, the interval between the
first and second gate blocks 410 and 420 may be decreased. In one
embodiment, the first film 201 has a thickness of about 0.01 mm to
about 1 mm and thus the interval between the first and second gate
blocks 410 and 420 may be maintained as narrow as possible, except
for a case of being moved together with the substrate 120.
Accordingly, a degree of vacuum of the chamber where the gate unit
400 is installed may be maintained.
[0111] Accordingly, whenever a process is performed in each
chamber, the gate unit 400 is closed to maintain the sealing. When
the film 201 is transferred, the gate unit 400 is open to make loss
of vacuum as low as possible.
[0112] Next, a method of fabricating an organic light emitting
display panel using the organic light emitting display panel
according to an embodiment will be described below.
[0113] First, as illustrated in FIG. 1, the substrate 120 in which
the first electrode 115 and the pixel define layer 113 are formed
on the protection layer 112 is prepared. In the substrate 120, the
HITL of the organic layer 116 may be formed on the first electrode
115 and the pixel define layer 113.
[0114] The first film 201 as illustrated in FIG. 2 is prepared. The
first film 201 is wound around the first roll 205 as illustrated in
FIG. 3.
[0115] At the initial stage of the process, the first film 201
wound around the first roll 205 may be wound around the second roll
206 located in the fourth chamber 340. This is to perform the
overall process in a roll-to-roll process method.
[0116] A degree of vacuum of each chamber is independently
maintained.
[0117] When the process is performed, the gate unit 400 installed
between the neighboring chambers is open and the first film 201 is
moved from the loading chamber 350 to the first chamber 310.
[0118] In the first chamber 310, the lower surface of the first
film 201 is supported by the support rolls 311 and the upper
surface of the first film 201 is supported by the auxiliary rolls
312. The auxiliary rolls 312 support an area other than the
deposition area of the supper surface of the first film 201. The
deposition source 315 ejects a material for the transfer layer 205
toward the upper surface of the first film 201. Thus, the transfer
layer 205 is formed on the upper surface of the first film 201 and
the first film 201 becomes the second film 202 when the first film
201 leaves the first chamber 310.
[0119] During the deposition, the gate unit 400 is closed so that a
degree of vacuum of the first chamber 310 may be maintained. When
the degrees of vacuum of the loading chamber 350 and the first
chamber 310 are substantially the same, the gate unit 400 between
the loading chamber 350 and the first chamber 310 may be open. When
the degrees of vacuum of the first chamber 310 and the second
chamber 320 are the same, the gate unit 400 between the first
chamber 310 and the second chamber 320 may be open.
[0120] Next, the gate unit 400 between the first and second
chambers 310 and 320 is open, and the second film 202 output from
the first chamber 310 is transferred to the second chamber 320.
After the transfer, the gate unit 400 between the first and second
chamber 310 and 320 is closed and the process may be performed in
the second chamber 320. However, when the degrees of vacuum of the
first and second chambers 310 and 320 are the same, the gate unit
400 between the two chambers 310 and 320 may be open.
[0121] The substrate 120 is input into the second chamber 320
through a separate inlet. The substrate 120 input into the second
chamber 320 is supported by the support unit 321. As the support
portion 321 descends and inserted into the receiving unit 323, the
substrate 120 is accommodated on the second film 202 placed on the
driving rollers 324.
[0122] In this state, when the driving rollers 324 rotate to
transfer the second film 202 toward the upper and lower combination
rolls 326 and 325, the upper combination rolls 326 support the
substrate 120 and the lower combination rolls 325 support the
second film 202. The upper and lower combination rolls 326 and 325
press the second film 202 and the substrate 120 interposed
therebetween to closely contact each other. Since the central
portion of the upper combination roll 326 has the indented portion
327 that is indented slightly less than the thickness of the
substrate 120 as illustrated in FIG. 8, the central portion of the
upper combination roll 326 accordingly presses and supports the
upper surface of the substrate 120.
[0123] Next, the gate unit 400 between the second chamber 320 and
the third chamber 330 is open, and the second film 202 and the
substrate 120 output from the second chamber 320 are transferred to
the third chamber 330. After the transfer, the gate unit 400
between the second and third chambers 320 and 330 is closed and the
process may be performed in the third chamber 330. However, when
the degrees of vacuum of the second and third chamber 320 and 330
are substantially the same, the gate unit 400 between the chambers
320 and 330 may be open during the process.
[0124] The substrate 120 and the second film 202 are transferred
together by the driving rollers 331 in the third chamber 330 and
accommodated on the mask 332.
[0125] The first camera unit 333 recognizes an align mark formed on
the substrate 120. The mask 332 and the substrate 120 are aligned
by the second camera unit 334 for recognizing a start portion of a
pixel. The mask 332 is connected to a separate driving apparatus
and thus the mask 332 may be aligned to the substrate 120 through a
fine adjustment of the mask 332.
[0126] After the alignment of the mask 332 and the substrate 120,
the beam irradiator 335 irradiates a laser beam to transfer the
transfer layer formed on the second film 220 to the substrate
120.
[0127] Next, the gate unit 400 between the third chamber 330 and
the fourth chamber 340 is open, the second film 202 and the
substrate 120 output from the third chamber 330 are transferred to
the fourth chamber 340. By making the degrees of vacuum of the
third and fourth chambers 330 and 340 to be the same, the gate unit
400 between the third chamber 330 and the fourth chamber 340 may be
open.
[0128] In the fourth chamber 340, since the detachment roll 341
winds the second film 202 to be connected to the second roll 206
from under the second film 202, the second film 202 is detached
from the substrate 120. In doing so, to facilitate the detachment
process, the second roll 206 may be disposed in the fourth chamber
340. As described above, the second film 202 is disposed under the
substrate 120.
[0129] The above-described roll-to-roll process may be variously
changed by changing the position of each chamber. For example, as
illustrated in FIG. 5, the input direction of the first film may be
reversed to have the deposition source 314 disposed under the first
film 201 in the deposition process of FIG. 5. In this case, the
second to fourth chambers 320-340 and the unloading chamber 360 are
disposed under or above the first chamber 310 so that the up/down
sides and the proceeding direction of the second film 202 output
from the first chamber 310 may be reversed.
[0130] The reversion of a flow direction may occur between the
first and second chambers 310 and 320, between the second and third
chambers 320 and 330, and/or between the third and fourth chambers
330 and 340.
[0131] A test zone may be further provided at a leading end of the
first chamber 301, that is, in the loading chamber 350 or between
the loading chamber 350 and the first chamber 310, so that a defect
of the first film 201 may be detected.
[0132] Also, a test zone may be further provided in the fourth
chamber 340. Accordingly, a defect of the second film 202' having
completed the LITI process may be detected through a review test so
that each process in the first to fourth chambers 310-340 may be
improved.
[0133] According to at least one of the disclosed embodiments, the
roll-to-roll type LITI method may be embodied continuously or
non-continuously in some sections. Accordingly, an organic light
emitting display panel may be more efficiently fabricated.
[0134] Also, since the degree of vacuum of each chamber may
independently maintained and the substrate and/or film is prevented
from being exposed to the air during a process, a defect due to
air, that is, a void is formed as air is trapped between the donor
film and the substrate during the combination of the donor film and
the substrate, may be prevented. Furthermore, a combination detect
generated according to the above problem, which deteriorates
productivity, may be prevented. In addition, when the donor film
and the substrate are detached from each other, a back transfer
phenomenon that organic substances adhere to the donor film due to
the air intruding between the donor film and the substrate when the
donor film and the substrate are detached from each other may be
prevented. Therefore, yield may be improved and a process time may
be reduced.
[0135] While the above embodiments have been described with
reference to the accompanying drawings, it will be understood by
those skilled in the art that various changes in form and details
may be made therein without departing from the spirit and scope of
the appended claims.
* * * * *