U.S. patent application number 14/355398 was filed with the patent office on 2015-04-02 for smart card simultaneously having two read/write mode matrixes and method for producing same.
The applicant listed for this patent is Xiaodong Zhang. Invention is credited to Xiaodong Zhang.
Application Number | 20150090799 14/355398 |
Document ID | / |
Family ID | 45960638 |
Filed Date | 2015-04-02 |
United States Patent
Application |
20150090799 |
Kind Code |
A1 |
Zhang; Xiaodong |
April 2, 2015 |
Smart Card simultaneously having two read/write mode matrixes and
method for producing same
Abstract
A smart card with two read-write modes includes antenna layer,
and an antenna and a chip module circuits on the antenna layer,
wherein the antenna and the chip module circuit are electrically
connected via an elastic conductive device. The invention also
provides a manufacturing method of the aforesaid smart card with
two read-write modes, which includes steps of: embedding an antenna
on a back side or a front side of an antenna layer; after
completing embedding on the antenna layer, add bedding sheets,
printed sheets and protection films respectively above and
underneath the antenna layer, then laminating to obtain a card base
carrier; cutting card from the treated whole-sheet card base
carrier to obtain a card base, and milling slots on the obtained
card base, then finally encapsulating.
Inventors: |
Zhang; Xiaodong; (Beijing,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Zhang; Xiaodong |
Beijing |
|
CN |
|
|
Family ID: |
45960638 |
Appl. No.: |
14/355398 |
Filed: |
January 6, 2012 |
PCT Filed: |
January 6, 2012 |
PCT NO: |
PCT/CN2012/070084 |
371 Date: |
November 10, 2014 |
Current U.S.
Class: |
235/492 ;
29/601 |
Current CPC
Class: |
G06K 19/0723 20130101;
G06K 19/07754 20130101; Y10T 29/49018 20150115 |
Class at
Publication: |
235/492 ;
29/601 |
International
Class: |
G06K 19/077 20060101
G06K019/077; G06K 19/07 20060101 G06K019/07 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 3, 2011 |
CN |
201110344303.1 |
Claims
1-10. (canceled)
11. A smart card with two read-write modes, comprising an antenna
layer, and an antenna and a chip module circuits on the antenna
layer, wherein: the antenna and the chip module circuits are
electrically connected via an elastic conductive device.
12. The smart card with the two read-write modes as described in
claim 11, wherein: a wire end of the antenna and elastic conductive
device are electrically connected, the elastic conductive device is
set in the corresponding area of circuit contact points of the chip
module circuit, and one side of the elastic conductive device is
electrically connected with the circuit contact points of the chip
module circuit.
13. The smart card with the two read-write modes as described in
claim 12, wherein: the elastic conductive device is a metallic
elastic conductive device.
14. The smart card with the two read-write modes as described in
claim 12, wherein: the elastic conductive device is a nonmetallic
elastic conductive device.
15. The smart card with the two read-write modes as described in
claim 13, wherein: the wire end of the antenna is set by
single-wire or multi-wire reciprocating windings on the antenna
layer in the area corresponding to the circuit contact points of
the chip module circuit.
16. The smart card with the two read-write modes as described in
claim 14, wherein: the wire end of the antenna is set by
single-wire or multi-wire reciprocating windings on the antenna
layer in the area corresponding to the circuit contact points of
the chip module circuit.
17. The smart card with the two read-write modes as described in
claim 15, wherein: the wire end of the antenna and the other side
of the elastic conductive device are electrically connected by
welding.
18. The smart card with the two read-write modes as described in
claim 16, wherein: the wire end of the antenna and the other side
of the elastic conductive device are electrically connected by
welding.
19. The smart card with the two read-write modes as described in
claim 15, wherein: the wire end of the antenna and the other side
of the elastic conductive device are electrically connected by
direct contact.
20. The smart card with the two read-write modes as described in
claim 16, wherein: the wire end of the antenna and the other side
of the elastic conductive device are electrically connected by
direct contact.
21. The smart card with the two read-write modes as described in
claim 17, wherein: a thickness of the antenna layer is
0.13.about.0.16 mm.
22. The smart card with the two read-write modes as described in
claim 18, wherein: a thickness of the antenna layer is
0.13.about.0.16 mm.
23. The smart card with the two read-write modes as described in
claim 19, wherein: a thickness of the antenna layer is
0.13.about.0.16 mm.
24. The smart card with the two read-write modes as described in
claim 20, wherein: a thickness of the antenna layer is
0.13.about.0.16 mm.
25. A manufacturing method of a smart card with two read-write
modes, comprising steps of: (1) embedding: embedding an antenna on
a back side or a front side of an antenna layer, and setting a wire
end of the antenna in an area corresponding to circuit contact
points of a chip module circuit; (2) laminating: after completing
embedding on the antenna layer, add bedding sheets, printed sheets
and protection films respectively above and underneath the antenna
layer, then laminating to obtain a card base carrier; (3) cutting
card and slotting: cutting the card from the treated whole-sheet
card base carrier to obtain a card base; milling slot in the
obtained card base: firstly milling a slot B5 on a location for
insetting of a chip module, with a depth thereof equaling to a
thickness of a chip module lead frame, then milling a slot B6 in a
center of the slot B5; adopting a milling cutter with a special
sensor for milling the location; while milling the slot using the
milling cutter, real-time detecting whether to mill to an embedded
cooper wire layer; when the wire end of the embedded wire is
touched, immediately stopping by a preset program and memorizing a
value; then milling slots B3 on locations for elastic devices,
depths of the B3 slots are decided by the memorized value; and (4)
encapsulating: at first insetting the elastic devices into the
slots B3 and connecting with the wire ends of the antenna, then
insetting the chip module circuit into the slot B5 and the slot B6
at the location of the elastic conductive device corresponding to
the circuit contact points, then finalizing a shape.
26. The manufacturing method as described in claim 25, wherein: in
the step (1), the wire end of the antenna is made into a contact
pad through reciprocating windings, which is located in the area
corresponding to the circuit contact points of the chip module
circuit.
Description
CROSS REFERENCE OF RELATED APPLICATION
[0001] This is a U.S. National Stage under 35 U.S.C 371 of the
International Application PCT/CN2012/070084, filed Jan. 6, 2012,
which claims priority under 35 U.S.C. 119(a-d) to CN
201110344303.1, filed Nov. 3, 2011.
BACKGROUND OF THE PRESENT INVENTION
[0002] 1. Field of Invention
[0003] This invention belongs to the field of manufacturing of
smart card, and relates particularly to smart card with two
read-write modes as well as to its manufacturing method.
[0004] 2. Description of Related Arts
[0005] DI (Dual Interface) card is the abbreviation of smart card
with two read-write modes. Constructed with PVC (Polyvinyl
Chloride) layer, chip module and coil, the DI card is a single chip
module based card with integrated contact and contactless
interfaces. With two operation interfaces, the DI card allows
access to the chip module either via contact points of the contact
mode or via radio frequency mode in a certain distance (within 10
cm), to execute the same operation; the two interfaces follow two
different standards: the contact interface meets ISO/IEC 7816,
while the contactless interface meets ISO/IEC 14443. The two
interfaces share a same micro processor, operating system and
EEPROM (Electrically Erasable Programmable Read-Only Memory).
[0006] Besides one chip module, inside the DI card, there is also
an antenna coil connecting with the chip module, when using the
contactless interface, the electro-magnetic field generated by the
reader will provide energy, through radio frequency to supply
energy and transmit data.
[0007] At present, there are two kinds of DI card manufacturing
process, one of which includes the below steps:
[0008] Make ready the antenna and base materials, and make
pre-lamination to get the inlay layer; align and register the top
layer which contains top printed sheet and protection film, the
bottom layer which contains bottom printed sheet and protection
film, precisely with the Inlay layer, then laminate and cut card,
to obtain the card base of smart card with two read-write modes;
mill slot for the first time at the location of chip module of the
card base, and manually pick and draw the wires, trim wire end, and
etc., of the antenna on the card base obtained after the first time
slotting, then mill slot for the second time; concurrently, on
another equipment, solder and mill flat to the two contact points
of the chip module; and finally, in the encapsulation machine,
place in order the treated card base and the chip module to
encapsulate them, place in order the treated card base and chip
module on the dual-interface encapsulation machine to encapsulate
them.
[0009] The other kind has the following steps:
[0010] Make ready the antenna and base materials, and make
pre-lamination to get the inlay layer; align and register the top
layer which contains top printed sheet and protection film, the
bottom layer which contains bottom printed sheet and protection
film, precisely with the Inlay layer, then laminate and cut card,
to obtain the card base of smart card; mill slot for the first time
at the location of chip module of the card base, and mill slot for
the second time at the locations of the chip module's circuit
contact points; infill with conductive adhesive on the location of
second time slotting, and set the chip module into the
corresponding contact points to solidify.
[0011] Finally place in sequence the treated card base and chip
module on the dual-interface encapsulation machine.
[0012] In the course of materializing the above said DI card
production, it is found by the inventor that there are at least the
following problems with the existing techniques: many steps have to
resort to manual work, e.g., soldering, and etc., characterized by
low daily output, and also by difficulty in controlling the
operation method, where, even skilled workers are hard to guarantee
product quality; manual work also causing high rejection rate, and
applying the method on the treatment of soldering and copper wire
may damage the antenna wire end and the chip module, resulting in
reduced stability of the finished card. If conductive adhesive is
adopted, the exposure in the air of the adhesive in the course of
solidification process, as well as the fairly long solidification
time yields the adhesive's conductivity significantly susceptible
to time and environmental factors, which would result in unstable
conductivity of card.
SUMMARY OF THE PRESENT INVENTION
[0013] An object technical problem the present invention deals with
is to provide a high-output, good quality, high-yield, and
high-stability smart card with two read-write modes, as well as a
manufacturing method thereof.
[0014] In order to solve the above technical problems, the present
invention adopts the technical proposal as follows:
[0015] A smart card with two read-write modes, comprising an
antenna layer, and antenna and chip module circuit on the antenna
layer, wherein: the antenna and the chip module circuits are
electrically connected via an elastic conductive device.
[0016] In the smart card with the two read-write modes of the
present invention, a wire end of the antenna and elastic conductive
device are electrically connected with each other, the elastic
conductive device is set in the corresponding area of circuit
contact points of the chip module circuit, and one side of the
elastic conductive device is electrically connected with the
circuit contact points of the chip module circuit.
[0017] In the smart card with the two read-write modes of the
present invention, the elastic conductive device in which is a
metallic elastic conductive device.
[0018] In the smart card with the two read-write modes of the
present invention, the elastic conductive device is a nonmetallic
elastic conductive device.
[0019] In the smart card with the two read-write modes of the
present invention, the wire end of the antenna is set by
single-wire or multi-wire reciprocating windings on the antenna
layer in the area corresponding to circuit contact points of the
chip module circuit.
[0020] In the smart card with the two read-write modes of the
present invention, the wire end of the antenna and the other side
of elastic conductive device are electrically connected with each
other by welding.
[0021] In the smart card with the two read-write modes of the
present invention, the wire end of the antenna and the other side
of elastic conductive device are directly contacted to electrically
connect.
[0022] In the smart card with two read-write modes of the present
invention, a thickness of the antenna layer is 0.13.about.0.16
mm.
[0023] The present invention also affords a manufacturing method of
the aforesaid smart card with the two read-write modes, which
includes the following steps of:
[0024] (1) embedding: embedding an antenna on a back side or a
front side of an antenna layer, and setting a wire end of the
antenna in an area corresponding to circuit contact points of a
chip module circuit;
[0025] (2) laminating: after completing embedding on the antenna
layer, add bedding sheets, printed sheets and protection films
respectively above and underneath the antenna layer, then
laminating to obtain a card base carrier;
[0026] (3) cutting card and slotting: cutting the card from the
treated whole-sheet card base carrier to obtain a card base;
milling slot in the obtained card base: firstly milling a slot B5
on a location for insetting of a chip module, with a depth thereof
equaling to a thickness of a chip module lead frame, then milling a
slot B6 in a center of the slot B5; adopting a milling cutter with
a special sensor for milling the location; while milling the slot
using the milling cutter, real-time detecting whether to mill to an
embedded cooper wire layer; when the wire end of the embedded wire
is touched, immediately stopping by a preset program and memorizing
a value; then milling slots B3 on locations for elastic devices,
depths of the B3 slots are decided by the memorized value; and
[0027] (4) encapsulating: at first insetting the elastic devices
into the slots B3 and connecting with the wire ends of the antenna,
then insetting the chip module circuit into the slot B5 and the
slot B6 at the location of the elastic conductive device
corresponding to the circuit contact points, then finalizing a
shape.
[0028] In the manufacturing method of the smart card with the two
read-write modes of the present invention, in the step (1) of
which, mthe wire end of the antenna is made into a contact pad
through reciprocating windings, which is located in the area
corresponding to the circuit contact points of the chip module
circuit.
[0029] The two read-write modes smart card and its manufacturing
method of the present invention, electrically connect the antenna
and the chip module circuit adopting the elastic conductive device,
saving manual operations such as soldering, and etc., resulting in
increased production efficiency; and mill slot using milling cutter
with special sensor, resulting in the guaranteed product quality,
high yield rate, as well as stable performance of the obtained
smart card.
[0030] The bending and torsion tests outperform the international
and national testing standards by 2.about.3 folds, the
high-temperature high-humidity and impact resistance tests by
0.5.about.1 fold and all other tests meet the international and
national standards.
[0031] The smart card with two read-write modes and its
manufacturing method of the present invention is further expounded
in combination with the attached figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 is a schematic diagram of the two read-write modes
smart card of the present invention
[0033] FIG. 2 is a perspective view of the two read-write modes
smart card of the present invention
[0034] FIG. 3 is a section view of the two read-write modes smart
card of the present invention
[0035] FIG. 4 is a partial enlarged view of FIG. 3
[0036] FIG. 5 is a schematic diagram of the card base finished of
slotting process
[0037] FIG. 6 is a schematic diagram of inset elastic conductive
devices
[0038] FIG. 7 is a schematic diagram of the position relationship
of the chip module, elastic conductive device and antenna
[0039] FIG. 8 is a schematic diagram of the antenna layer after
wire-embedding
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0040] As shown in FIGS. 1-4 and FIG. 7, a smart card with two
read-write modes of the present invention comprehends a base layer
1, an antenna layer 2, an antenna 3 set above the antenna layer 2
and a chip module circuit (4); a thickness of antenna layer 2 is
0.13.about.0.16 mm, and the antenna layer 2 is set inside the base
layer 1; a wire end 31 of the antenna 3 is by way of single-wire or
multi-wire reciprocating windings set on the antenna layer 2 in an
area corresponding to circuit contact points of the chip module
circuit 4; slots B5 and B6 are milled on the base layer 1, two
slots B3 are respectively milled on a bottom side of slot B5; there
are two elastic conductive device 5, respectively set inside the
two slots B3; the elastic conductive device 5 are respectively set
in the area corresponding to the two circuit contact points of the
chip module circuit 4; the wire end 31 of the antenna 3 is
electrically connected to one side of the elastic conductive device
5; the chip module circuit is set inside the slots B5 and B6; the
other side of the elastic conductive device 5 is electrically
connected with the circuit contact points of the chip module
circuit 4. The elastic conductive device 5 is a metallic elastic
conductive device, e.g., a metallic spring piece, or alternatively
a non-metallic elastic conductive device, e.g., conductive
graphite. The wire end 31 of the antenna 3 is electrically
connected with the elastic conductive device by welding or direct
contact.
[0041] The smart card with the two read-write modes and its
manufacturing method of the present invention include the following
steps of:
[0042] (1) Wire Embedding
[0043] As shown in FIG. 8, embedding an antenna 3 on a back or a
front side of an antenna layer 2, and making a wire end of the
antenna 3 by reciprocating winding into a contact pad, or making a
contact piece by other method, for instance, welding a wire on a
metal piece, then placing the contact pad or the contact piece on
the antenna layer 2 at a location corresponding to a chip module
circuit 4, namely two circuit contact points of a chip module,
e.g., B1 and B2 (FIG. 7), which serves purpose of causing the
antenna 3 and the chip module to be reliably contacted through an
elastic conductive device. The FIG. 8 displays a pattern of
reciprocating wire end winding.
[0044] (2) Laminating
[0045] After finishing wire embedding on the antenna layer 2,
adding bedding sheets, printed sheets and protection films
respectively above and underneath the antenna layer 2 before
laminating to obtain a steadily bonded card base carrier. Thickness
of the layers may vary upon different requirements. Taking this
example, the thickness of the wire-embedding antenna layer 2 is
approximately 0.15 mm, bedding sheets, printed sheets and
protection films are added respectively above and underneath of the
antenna layer to cause it to develop certain strength, contributing
to a final thickness of the card base up to around 0.8 mm.
[0046] (3) Cutting Card and Slotting
[0047] Cutting card from the treated whole-sheet card base carrier
to obtain a card base; milling slots on the obtained card base, as
shown in FIG. 5, firstly milling a slot B5 on a location for
insetting the chip module circuit 4, with its depth equaling to a
thickness of a chip module lead frame, then milling a slot B6 in
the middle of the slot B5; adopting a milling cutter with a special
sensor for milling this location; while milling the slot using the
milling cutter, real-time detecting whether milling to an embedded
cooper wire layer; when the wire end of the embedded wire is
touched, immediately stopping by a preset program and memorizing a
value; then milling slots B3 on location of the elastic device 5,
depths of the B3 slots are to be decided by the memorized
value.
[0048] (4) Encapsulating
[0049] As shown in FIG. 6 and FIG. 7, at first insetting the
elastic device 5 into the slots B3, then insetting the chip module
circuit 4 into the slots B5 and B6 by the location of the elastic
conductive device 5 corresponding to the circuit contact points, at
last proceeding thermal encapsulation, cold encapsulation forming,
and smart card function testing.
[0050] The above said example serves to describe the optimal
implementation way only, other than lay limits on the extent of the
present invention. Apart from a departure from the design spirit of
the present invention, any transformation and/or improvement made
on the technical proposal of the present invention by common
technical personnel in this field shall exclusively fall within the
scope of protection defined by the present invention claims.
INDUSTRIAL UTILITIES
[0051] The smart card with two read-write modes of the present
invention can find wide applications in finance and accounting,
social insurance, transportation and travel, medical and public
health, governmental administration, commodity retailing, leisure
and recreation, school administration, and etc.
* * * * *