U.S. patent application number 14/149440 was filed with the patent office on 2015-03-05 for controlling method for thermoelectric cooling device and heat-dissipating module employing same.
This patent application is currently assigned to DELTA ELECTRONICS, INC.. The applicant listed for this patent is DELTA ELECTRONICS, INC.. Invention is credited to Meng-Sheng Chang.
Application Number | 20150059358 14/149440 |
Document ID | / |
Family ID | 52581241 |
Filed Date | 2015-03-05 |
United States Patent
Application |
20150059358 |
Kind Code |
A1 |
Chang; Meng-Sheng |
March 5, 2015 |
CONTROLLING METHOD FOR THERMOELECTRIC COOLING DEVICE AND
HEAT-DISSIPATING MODULE EMPLOYING SAME
Abstract
A controlling method for a thermoelectric cooling device is
provided. The thermoelectric cooling device has a cold side and a
hot side. After the thermoelectric cooling device is enabled, a
temperature of the cold side and an ambient temperature around the
thermoelectric cooling device are acquired. By judging whether the
ambient temperature is higher than or equal to a preset reference
temperature, an initial value of a duty cycle corresponding to an
electric energy to be received by the thermoelectric cooling device
is set. Then, a judging step is performed to judge whether the
temperature of the cold side is higher than or equal to the ambient
temperature. If the judging condition is satisfied, the duty cycle
is increased by a specified percentage. If the judging condition is
not satisfied and the duty cycle is higher than 0%, the duty cycle
is decreased by the specified percentage.
Inventors: |
Chang; Meng-Sheng; (Taoyuan
Hsien, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DELTA ELECTRONICS, INC. |
Taoyuan Hsien |
|
TW |
|
|
Assignee: |
DELTA ELECTRONICS, INC.
Taoyuan Hsien
TW
|
Family ID: |
52581241 |
Appl. No.: |
14/149440 |
Filed: |
January 7, 2014 |
Current U.S.
Class: |
62/3.2 |
Current CPC
Class: |
F25B 2700/2107 20130101;
F25B 2700/2106 20130101; F25B 21/02 20130101; F25B 2321/0212
20130101 |
Class at
Publication: |
62/3.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 4, 2013 |
TW |
102131902 |
Claims
1. A controlling method for a thermoelectric cooling device, the
thermoelectric cooling device having a cold side and a hot side,
the method comprising steps of: (a) enabling the thermoelectric
cooling device, and acquiring a temperature of the cold side and an
ambient temperature around the thermoelectric cooling device; (b)
judging whether the ambient temperature is higher than or equal to
a preset reference temperature; (c) setting an initial value of a
duty cycle corresponding to an electric energy to be received by
the thermoelectric cooling device according to a judging result of
the step (b); (d) judging whether the temperature of the cold side
is higher than or equal to the ambient temperature; (e) if the
judging condition of the step (d) is satisfied, increasing the duty
cycle by a specified percentage, and repeatedly performing the step
(d); and (f) if the judging condition of the step (d) is not
satisfied, decreasing the duty cycle by the specified percentage
and repeatedly performing the step (d) by judging whether the duty
cycle is higher than 0%.
2. The controlling method according to claim 1, wherein in the step
(c), if the ambient temperature is higher than or equal to the
preset reference temperature, the initial value of the duty cycle
is set as 50%.
3. The controlling method according to claim 1, wherein in the step
(c), if the ambient temperature is higher than or equal to the
preset reference temperature, the initial value of the duty cycle
is set as 50% after a delaying time.
4. The controlling method according to claim 1, wherein in the step
(c), if the ambient temperature is lower than the preset reference
temperature, the initial value of the duty cycle is set as 0%.
5. The controlling method according to claim 1, wherein in the step
(b), the preset reference temperature is 30.degree. C.
6. The controlling method according to claim 1, wherein in the step
(f), if the duty cycle is higher than 0%, the duty cycle is
decreased by the specified percentage, and the step (d) is
repeatedly done.
7. The controlling method according to claim 1, wherein in the step
(f), if the duty cycle is equal to 0%, the step (d) is repeatedly
done.
8. A heat-dissipating module, comprising: a thermoelectric cooling
device having a cold side and a hot side; a power supply circuit
electrically connected with the thermoelectric cooling device and
operated at a duty cycle for providing electric energy to the
thermoelectric cooling device and driving the thermoelectric
cooling device; a first temperature sensor disposed adjacent to the
cold side of the thermoelectric cooling device for detecting a
temperature of the cold side; a second temperature sensor for
detecting an ambient temperature around the thermoelectric cooling
device; and a controller electrically connected with the first
temperature sensor, the second temperature sensor and the power
supply circuit, judging whether the temperature of the cold side of
the thermoelectric cooling device is higher than or equal to the
ambient temperature according to a detecting result of the first
temperature sensor and the second temperature sensor, and adjusting
the duty cycle of the power supply circuit according to a judging
result for adjusting the electric energy provided by the power
supply circuit correspondingly.
9. The heat-dissipating module according to claim 8, wherein the
controller performs a controlling method comprising steps of: (a)
enabling the thermoelectric cooling device, and acquiring the
temperature of the cold side and the ambient temperature around the
thermoelectric cooling device; (b) judging whether the ambient
temperature is higher than or equal to a preset reference
temperature; (c) setting an initial value of the duty cycle
corresponding to an electric energy to be received by the
thermoelectric cooling device according to a judging result of the
step (b); (d) judging whether the temperature of the cold side is
higher than or equal to the ambient temperature; (e) if the judging
condition of the step (d) is satisfied, increasing the duty cycle
by a specified percentage, and repeatedly performing the step (d);
and (f) if the judging condition of the step (d) is not satisfied,
decreasing the duty cycle by the specified percentage and
repeatedly performing the step (d) by judging whether the duty
cycle is higher than 0%.
10. The heat-dissipating module according to claim 8, wherein the
first temperature sensor is in direct contact with the cold side of
the thermoelectric cooling device.
11. The heat-dissipating module according to claim 8, further
comprising a plurality of fins disposed on the hot side of the
thermoelectric cooling device for transferring the heat of the hot
side.
12. The heat-dissipating module according to claim 8, further
comprising a third temperature sensor located near the hot side of
the thermoelectric cooling device and electrically connected with
the controller for detecting the temperature of the hot side,
wherein when the temperature of the hot side of the thermoelectric
cooling device exceeds a protective temperature, the controller
controls the power supply circuit to stop providing electric energy
to the thermoelectric cooling device.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a controlling method, and
more particularly to a controlling method for a thermoelectric
cooling device and a heat-dissipating module employing the
same.
BACKGROUND OF THE INVENTION
[0002] Recently, with increasing development of industrial
technologies and science, a variety of electronic devices are
gradually improved, so that the functions and the processing speeds
of these electronic devices are enhanced. Consequently, the
electronic components within these electronic devices must have
high power or high integration level. During operation of the
electronic devices, the electronic components may generate energy
in the form of heat. If no proper heat-dissipating mechanism is
provided to transfer enough heat to the ambient air, the elevated
operating temperature may result in damage of the electronic
components or breakdown of the whole electronic device. For
maintaining normal operations of the electronic device and
extending the use life of the electronic device, it is important to
dissipate the heat from the electronic device.
[0003] Generally, the heat-dissipating mechanism for removing heat
from the optical components or electronic components of a high
power electronic device (e.g. a projector or a personal computer)
includes a heatsink with a plurality of heat pipes or a liquid
cooling mechanism. However, the applications of the heatsink and
the liquid cooling mechanism are restricted. As known, the heat of
the components that generate high power and withstand low
temperature can't be effectively removed by the heatsink or the
liquid cooling mechanism. For increasing heat-dissipating
efficiency and reliability, a thermoelectric cooling device is
gradually used.
[0004] The thermoelectric cooling device is substantially a PN
semiconductor device. When a current passes through the
thermoelectric cooling device, two sides of the thermoelectric
cooling device become a cold side and a hot side, respectively. Due
to a temperature difference between the cold side and hot side, the
temperature of the cold side is very low. The cold side of the
thermoelectric cooling device is in contact with the component to
be cooled. The hot side of the thermoelectric cooling device is
hotter than the cold side. However, the use of the thermoelectric
cooling device still has some drawbacks. For example, if the
temperature of the cold side of the thermoelectric cooling device
is lower than the ambient temperature, the thermoelectric cooling
device and the inner component of the electronic device may result
in dew or even generate moisture vapor. Under this circumstance,
the reliability and the use life of the electronic device are
reduced.
[0005] Therefore, there is a need of providing a controlling method
for a thermoelectric cooling device and a heat-dissipating module
using the thermoelectric cooling device in order to eliminate the
above drawbacks.
SUMMARY OF THE INVENTION
[0006] The present invention provides a controlling method for a
thermoelectric cooling device and a heat-dissipating module using
the thermoelectric cooling device. By judging the relationship
between the temperature of the cold side of the thermoelectric
cooling device and the ambient temperature, the duty cycle
corresponding to the electric energy to be received by the
thermoelectric cooling device is selectively increased or
decreased. In case that the temperature of the cold side of the
thermoelectric cooling device is higher than or equal to the
ambient temperature, the chilling efficiency of the cold side of
the thermoelectric cooling device is enhanced by increasing the
duty cycle. In case that the temperature of the cold side of the
thermoelectric cooling device is lower than the ambient
temperature, the duty cycle is decreased, so that the possibility
of resulting in dew and generating moisture vapor is minimized.
When the heat-dissipating module of the present invention is used
to remove heat from electronic components of an electronic device,
the influence of the moisture vapor on the electronic components
are largely reduced. Consequently, the reliability and the use life
of the electronic device are enhanced.
[0007] In accordance with an aspect of the present invention, there
is provided a controlling method for a thermoelectric cooling
device. The thermoelectric cooling device has a cold side and a hot
side. In a step (a), the thermoelectric cooling device is enabled,
and a temperature of the cold side and an ambient temperature
around the thermoelectric cooling device are acquired. Then, a step
(b) is performed to judge whether the ambient temperature is higher
than or equal to a preset reference temperature. In a step (c), an
initial value of a duty cycle corresponding to an electric energy
to be received by the thermoelectric cooling device is set
according to a judging result of the step (b). Then, a step (d) is
performed to judge whether the temperature of the cold side is
higher than or equal to the ambient temperature. In a step (e), if
the judging condition of the step (d) is satisfied, the duty cycle
is increased by a specified percentage, and the step (d) is
repeatedly performed. In a step (f), if the judging condition of
the step (d) is not satisfied, the duty cycle is decreased by the
specified percentage and the step (d) is repeatedly performed by
judging whether the duty cycle is higher than 0%.
[0008] In accordance with another aspect of the present invention,
there is provided a heat-dissipating module. The heat-dissipating
module comprises a thermoelectric cooling device, a power supply
circuit, a first temperature sensor, a second temperature sensor,
and a controller. The thermoelectric cooling device has a cold side
and a hot side. The power supply circuit is electrically connected
with the thermoelectric cooling device and operated at a duty cycle
for providing electric energy to the thermoelectric cooling device
and driving the thermoelectric cooling device. The first
temperature sensor is disposed adjacent to the cold side of the
thermoelectric cooling device for detecting the temperature of the
cold side. The second temperature sensor is used for detecting the
ambient temperature around the thermoelectric cooling device. The
controller is electrically connected with the first temperature
sensor, the second temperature sensor and the power supply circuit,
judges whether the temperature of the cold side of the
thermoelectric cooling device is higher than or equal to the
ambient temperature according to a detecting result of the first
temperature sensor and the second temperature sensor, and adjusts
the duty cycle of the power supply circuit according to a judging
result for adjusting the electric energy provided by the power
supply circuit correspondingly.
[0009] The above contents of the present invention will become more
readily apparent to those ordinarily skilled in the art after
reviewing the following detailed description and accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic circuit block diagram illustrating the
architecture of a heat-dissipating module according to an
embodiment of the present invention;
[0011] FIG. 2 is a schematic view illustrates some components of
the heat-dissipating module according to the embodiment of the
present invention;
[0012] FIG. 3 is a flowchart illustrating a method for controlling
a thermoelectric cooling device according to an embodiment of the
present invention; and
[0013] FIG. 4 is a flowchart illustrating a method for controlling
a thermoelectric cooling device according to another embodiment of
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0014] The present invention will now be described more
specifically with reference to the following embodiments. It is to
be noted that the following descriptions of preferred embodiments
of this invention are presented herein for purpose of illustration
and description only. It is not intended to be exhaustive or to be
limited to the precise form disclosed.
[0015] FIG. 1 is a schematic circuit block diagram illustrating the
architecture of a heat-dissipating module according to an
embodiment of the present invention. As shown in FIG. 1, the
heat-dissipating module 1 comprises a first temperature sensor 10,
a second temperature sensor 11, a power supply circuit 12, a
controller 13, and a thermoelectric cooling device 14. The power
supply circuit 12 is electrically connected with the thermoelectric
cooling device 14. Moreover, the power supply circuit 12 is
operated at a specified duty cycle in order to provide electric
energy to the thermoelectric cooling device 14 and drive the
thermoelectric cooling device 14. The thermoelectric cooling device
14 is a PN semiconductor device with a cold side 140 and a hot side
141 (see FIG. 2). The cold side 140 and the hot side 141 are
located at two opposite sides of the thermoelectric cooling device
14. After the thermoelectric cooling device 14 is enabled by
receiving the electric energy from the power supply circuit 12, the
cold side 140 of the thermoelectric cooling device 14 generates a
chilling effect. Meanwhile, the hot side 141 is relatively hotter
than the cold side 140. The first temperature sensor 10 is used for
detecting the temperature of the cold side 140 of the
thermoelectric cooling device 14. The second temperature sensor 11
is used for detecting an ambient temperature around the
thermoelectric cooling device 14, i.e. the ambient temperature
around the heat-dissipating module 1.
[0016] The controller 13 is electrically connected with the first
temperature sensor 10, the second temperature sensor 11 and the
power supply circuit 12. According to the detecting results of the
first temperature sensor 10 and the second temperature sensor 11,
the controller 13 judges whether the temperature of the cold side
140 of the thermoelectric cooling device 14 is higher than or equal
to the ambient temperature. According to the judging result, a duty
cycle of the power supply circuit 12 is adjusted by the controller
13. After the duty cycle of the power supply circuit 12 is
adjusted, the electric energy provided by the power supply circuit
12 is correspondingly adjusted.
[0017] FIG. 2 is a schematic view illustrates some components of
the heat-dissipating module according to the embodiment of the
present invention. As shown in FIGS. 1 and 2, the cold side 140 of
the thermoelectric cooling device 14 is located near an electronic
component 9. After the thermoelectric cooling device 14 is enabled,
the cold side 140 of the thermoelectric cooling device 14 can cool
the electronic component 9. In addition, the first temperature
sensor 10 is disposed adjacent to the cold side 140 of the
thermoelectric cooling device 14. Of course, the first temperature
sensor 10 may be in direct contact with the cold side 140 of the
thermoelectric cooling device 14 in order to measure the
temperature of the cold side 140 more accurately.
[0018] Optionally, the heat-dissipating module 1 further comprises
a plurality of fins 15. As shown in FIG. 2, the fins 15 are
disposed on the hot side 141 of the thermoelectric cooling device
14 for transferring the heat of the hot side 141 through thermal
conduction. Optionally, the heat-dissipating module 1 further
comprises a third temperature sensor 16. The third temperature
sensor 16 is located near or disposed on the hot side 141 of the
thermoelectric cooling device 14. Moreover, the third temperature
sensor 16 is electrically connected with the controller 13. The
temperature sensor 16 is used for detecting the temperature of the
hot side 141 of the thermoelectric cooling device 14. In case that
the temperature of the hot side 141 of the thermoelectric cooling
device 14 exceeds a protective temperature, the controller 13 may
control the power supply circuit 12 to stop providing electric
energy to the thermoelectric cooling device 14. Consequently, the
heat-dissipating module 1 can be protected. The protective
temperature may be previously determined according to the practical
requirements. For example, the maximum withstandable temperature
may be set as the protective temperature.
[0019] Hereinafter, a method for controlling the thermoelectric
cooling device 14 by the controller 13 will be illustrated with
reference to FIGS. 1, 2 and 3. FIG. 3 is a flowchart illustrating a
method for controlling a thermoelectric cooling device according to
an embodiment of the present invention. Firstly, in the step S1,
the heat-dissipating module 1 is enabled (i.e. the thermoelectric
cooling device 14 is enabled). Then, in the step S2, the
temperature of the cold side 140 of the thermoelectric cooling
device 14 and the ambient temperature around the thermoelectric
cooling device 14 are acquired. The temperature of the cold side
140 of the thermoelectric cooling device 14 is detected by the
first temperature sensor 10. The ambient temperature around the
thermoelectric cooling device 14 is detected by the second
temperature sensor 11. Then, in the step S3, the controller 13
judges whether the ambient temperature is higher than or equal to a
preset reference temperature. For example, the preset reference
temperature is 30.degree. C., but is not limited thereto.
[0020] Then, in the step S4, an initial value of a duty cycle of
the power supply circuit 12 corresponding to the electric energy to
be received by the thermoelectric cooling device 14 is set
according to the judging result of the step S3. The step S4
comprises two sub-steps S40 and S41. In particular, either the
sub-step S40 or the sub-step S41 is performed according to the
judging result of the step S3. If the ambient temperature is higher
than or equal to the preset reference temperature (e.g. 30.degree.
C.), the initial value of the duty cycle of the power supply
circuit 12 is set as 50% by the controller 13. That is, the
sub-step S40 is performed. Under this circumstance, since the power
supply circuit 12 can provide higher electric energy to the
thermoelectric cooling device 14 at the initial stage, the cooling
rate of the cold side 140 of the thermoelectric cooling device 14
is higher. Meanwhile, in response to the high ambient temperature,
the heat of the electronic component 9 can be quickly removed at
the higher cooling rate by the thermoelectric cooling device
14.
[0021] On the other hand, if the ambient temperature is lower than
the preset reference temperature, the judging condition of the step
S3 is not satisfied. Meanwhile, the initial value of the duty cycle
of the power supply circuit 12 is set as 0% by the controller 13.
That is, the sub-step S41 is performed. Under this circumstance,
since the ambient temperature is low, the power supply circuit 12
needn't to provide high electric energy to the thermoelectric
cooling device 14 immediately and the cooling rate of the cold side
140 of the thermoelectric cooling device 14 is lower at the initial
stage. Therefore, the initial value of the duty cycle of the power
supply circuit 12 is set as 0% by the controller 13.
[0022] After the step S4, the step S5 is performed. In the step S5,
the controller 13 judges whether the temperature of the cold side
140 of the thermoelectric cooling device 14 is higher than or equal
to the ambient temperature. If the judging condition of the step S5
is satisfied, the cold side 140 of the thermoelectric cooling
device 14 will not result in dew. Consequently, the duty cycle of
the power supply circuit 12 is continuously increased to increase
the output electric energy of the power supply circuit 12. Under
this circumstance, the step S6 is performed. In the step S6, the
duty cycle of the power supply circuit 12 is increased by a
specified percentage (e.g. 1%) by the controller 13. Meanwhile, the
temperature of the cold side 140 is continuously decreased, and the
chilling effect is enhanced. Consequently, the heat of the
electronic component 9 can be quickly removed at the higher cooling
rate by the thermoelectric cooling device 14.
[0023] On the other hand, if the judging condition of the step S5
is not satisfied, the cold side 140 of the thermoelectric cooling
device 14 may result in dew and generate moisture vapor. For
minimizing the possibility of resulting in dew and generating
moisture vapor, the duty cycle of the power supply circuit 12
should be decreased. Then, the step S7 is performed to judge
whether the duty cycle of the power supply circuit 12 is higher
than 0%. If the judging condition of the step S7 is not satisfied
(Namely, if the duty cycle of the power supply circuit 12 is equal
to 0%), the step S5 is performed again. Whereas, if the judging
condition of the step S7 is satisfied, the step S8 is performed. In
the step S8, the duty cycle of the power supply circuit 12 is
decreased by a specified percentage (e.g. 1%) by the controller 13.
Since the duty cycle of the power supply circuit 12 is decreased,
the output electric energy of the power supply circuit 12 is
decreased. Under this circumstance, the temperature of the cold
side 140 of the thermoelectric cooling device 14 is gradually
increased, and the possibility of resulting in dew and generating
moisture vapor is minimized.
[0024] FIG. 4 is a flowchart illustrating a method for controlling
a thermoelectric cooling device according to another embodiment of
the present invention. In this embodiment, the sub-step S40 of the
step S4 of FIG. 3 is replaced by the sub-step S40'. In the step
S40', an initial value of a duty cycle of the power supply circuit
12 corresponding to the electric energy to be received by the
thermoelectric cooling device 14 is set according to the judging
result of the step S3 after a delaying time. Under this
circumstance, the cooling rate of the cold side 140 of the
thermoelectric cooling device 14 is gradually increased, and the
heat of the electronic component 9 is gradually removed by the
thermoelectric cooling device 14. Consequently, the possibility of
resulting in dew and generating moisture vapor is minimized.
[0025] From the above descriptions, the present invention provides
a controlling method for a thermoelectric cooling device and a
heat-dissipating module using the thermoelectric cooling device. By
judging the relationship between the temperature of the cold side
of the thermoelectric cooling device and the ambient temperature,
the duty cycle corresponding to the electric energy to be received
by the thermoelectric cooling device is selectively increased or
decreased. In case that the temperature of the cold side of the
thermoelectric cooling device is higher than or equal to the
ambient temperature, the chilling efficiency of the cold side of
the thermoelectric cooling device is enhanced by increasing the
duty cycle. In case that the temperature of the cold side of the
thermoelectric cooling device is lower than the ambient
temperature, the duty cycle is decreased, so that the possibility
of resulting in dew and generating moisture vapor is minimized.
When the heat-dissipating module of the present invention is used
to remove heat from electronic components of an electronic device,
the influence of the moisture vapor on the electronic components
are largely reduced. Consequently, the reliability and the use life
of the electronic device are enhanced.
[0026] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *