U.S. patent application number 14/477555 was filed with the patent office on 2015-03-05 for segmented insole for support of embedded systems.
This patent application is currently assigned to SOLEPOWER LLC. The applicant listed for this patent is SOLEPOWER LLC. Invention is credited to Hahna Ruth Alexander, Davit Frengul Davitian, Elliot Isaac Kahn, Matthew James Stanton.
Application Number | 20150059204 14/477555 |
Document ID | / |
Family ID | 52581180 |
Filed Date | 2015-03-05 |
United States Patent
Application |
20150059204 |
Kind Code |
A1 |
Alexander; Hahna Ruth ; et
al. |
March 5, 2015 |
Segmented Insole for Support of Embedded Systems
Abstract
A two part insole having one part for housing smart systems
embedded within an insole, and a second part for maintaining
comfort of a cut-to-fit insole to increase the functionality of the
overall product for the user.
Inventors: |
Alexander; Hahna Ruth;
(Pittsburgh, PA) ; Davitian; Davit Frengul;
(Pittsburgh, PA) ; Kahn; Elliot Isaac;
(Pittsburgh, PA) ; Stanton; Matthew James;
(Pittsburgh, PA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SOLEPOWER LLC |
Pittsburgh |
PA |
US |
|
|
Assignee: |
SOLEPOWER LLC
Pittsburgh
PA
|
Family ID: |
52581180 |
Appl. No.: |
14/477555 |
Filed: |
September 4, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61873421 |
Sep 4, 2013 |
|
|
|
Current U.S.
Class: |
36/44 |
Current CPC
Class: |
A43B 3/26 20130101; A43B
3/0031 20130101; A43B 3/0005 20130101; A43B 3/0084 20130101 |
Class at
Publication: |
36/44 |
International
Class: |
A43B 3/00 20060101
A43B003/00; A43B 13/38 20060101 A43B013/38 |
Claims
1. A segmented insole comprising: a bottom, support layer; and a
top, comfort layer, said top layer defining one or more surfaces
designed to mate with said bottom layer; wherein said bottom layer
is composed of a semi-rigid structural material and defines a
cavity therein for holding an embedded device; and further wherein
said top layer covers said bottom layer.
2. The segmented insole of claim 1 further comprising one or more
attachment points wherein said bottom layer and said top layer are
attached to each other.
3. The segmented insole of claim 1 further comprising an attachment
method for attaching said bottom layer to said top layer at said
one or more attachment points.
4. The segmented insole claim 3 wherein said attachment method
comprises an attachable and detachable material.
5. The segmented insole of claim 3 wherein said attachment method
comprises an adhesive.
6. The segmented insole of claim 3 wherein said attachment method
comprises friction-inducing fixtures, grooves, or pegs.
7. The segmented insole of claim 1 wherein said top layer has
cut-to-fit sizing lines.
8. The segmented insole of claim 1 wherein said bottom layer and
the portion of said top layer not covering said bottom layer each
define a bottom surface, said bottom surface defining treads for
engaging the base of a shoe into which said insole is disposed.
9. The segmented insole of claim 1 wherein said top layer is
composed of a shock-absorbing material.
10. The segmented insole of claim 9 wherein said top layer is
composed of a material which is softer than said bottom layer.
11. The segmented insole of claim 9 wherein said shock-absorbing
material is selected from a group consisting of gels, fabrics,
foams, recycled materials and soft plastic materials.
12. The segmented insole of claim 1 wherein semi-rigid structural
material is selected from a group consisting of hard plastics,
composites, metals, foams and recycled materials.
13. The segmented insole of claim 3 wherein said attachment method
consists of a cavity defined in said top layer for accepting
insertion of said bottom layer therein.
14. The segmented in sole of claim 13 wherein said cavity is
composed of the same material as said top layer.
15. The segmented insole of claim 13 wherein said cavity is
composed of a fabric attached to said top layer.
16. The segmented insole of claim 1 wherein said bottom layer
defines one or more grooves or channels therein to allow for
exposure of portions of said embedded device external to said
insole.
17. The segmented insole of claim 16 wherein said bottom layer
comprises two parts which, when joined, encase said embedded system
inside of said bottom layer.
18. The segmented insole of claim 17 wherein said bottom layer
permanently encases said embedded system.
Description
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application Ser. No. 61/873,421, filed Sept. 4, 2013.
BACKGROUND OF THE INVENTION
[0002] Smart footwear is defined as footwear having embedded
mechanical and electrical systems for performing various functions.
Embedded systems may be located anywhere on the shoe, but it is
desirable, both for function and aesthetic reasons, that the
embedded system be hidden in the insole of the shoe. Typical
examples of such systems include energy harvesting devices,
footwear-embedded GPS devices and step-logging (pressure sensing)
devices. Devices hidden in the insole of the shoe require support
material for the embedded device to prevent damage from impacts
from the user's foot and from moisture that may be present within
the shoe.
[0003] Off-the-shelf after-market insoles are frequently made to be
cut-to-fit. A range of sizes will be marked on the insole so that
the user can cut the toe end of the insole to personalize the size.
However, optimal fitting depends on user precision, and the insole
can easily be ruined by user error, rendering the entire system
unusable. For an insole without an embedded system, two insoles are
typically offered for purchase in one package, or the user can buy
another insole for a relatively low cost if the insole is ruined by
user error.
[0004] Insoles for smart footwear, however, have a much higher
expected cost and cannot be repurchased as easily. Other problems
related to embedded systems within insoles include added wear on
those systems from machine washing, replacement of the soft
(comfort-related) materials from wear, and the high cost of
customization due to aesthetic desires like color. Therefore, it is
desirable to provide an insole design that addresses these
deficiencies, while supporting a wide variety of embedded
systems.
SUMMARY OF THE INVENTION
[0005] A novel two part insole is presented for use with any
mechanical mechanism or electronic device located in the heel of an
insole. The two part insole construction is designed for both
stability and support of the embedded system present in smart
footwear, as well as for comfort of the user, while still
addressing the cut-to-fit and reusability constraints desirable for
insoles.
[0006] The insole is provided as a two-part construction having a
bottom layer and a top layer. The bottom layer is a more rigid
construction and provides stability and encasing for engineered
systems. The top comfort layer is detachable from the bottom layer,
is customizable by material, color, and size, and consists of a
softer, more flexible material for the comfort of the user. The
insole layers may be attached to each other using grooves,
adhesives, or detachable materials like Velcro. The toe end of the
top layer of the insole may be provided with a cut-to-fit pattern
for user fitting, or maybe provided pre-sized from the factory.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 shows an exploded view of the segmented insole of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0008] Smart footwear having engineered devices embedded in the
insole are best served by a two part insole where the cheaper, top
comfort layer 1 of the insole can be customizable and removable,
while the lower, more rigid layer 2 supports the embedded device.
The present invention is a two part insole for this purpose. The
system includes an upper insole layer 1 for comfort, having
cut-to-fit lines on the toe end thereof for customizability, and a
lower insole layer 2 for support, having a cavity 5 of variable
shape for embedding mechanical and electrical systems. An
attachment method between the lower support 2 and upper comfort
insole layer 1 is provided. The insole may also feature treads on
the base of the insole for inducing friction between the insole and
the base of the shoe.
[0009] The smart footwear insole of the present invention is shown
in FIG. 1. Top, comfort layer 1 is thin at the heel-end, becomes
thicker under the arch at the arch point, and tapers to be thinner
by the toe end. A notch 4 at the arch point is shaped to mate with
bottom support layer 2. Cut-to-fit lines 3 are marked on comfort
layer 1, such that the user can cut comfort layer 1 to their
personal foot/shoe size along one of cut-to-fit lines 3.
[0010] Comfort layer 1 is preferably made of a soft,
shock-absorbing material, such as gels, fabrics, foams, recycled
material, or plastic materials common to comfort-based, standard
orthotics. Support layer 2 provides stability for the user's foot,
as well as support for the embedded device. It is preferably
constructed of a structural material, such as hard plastics,
composites, metals, foams, recycled material or any other
structural material suitable for the base of an insole, and
provides a step-down surface to protect any mechanical or
electrical systems embedded within embedded systems cavity 5.
Embedded systems cavity 5 may be of any shape depending on the
design of the particular embedded system, and may include channels
for antenna, wires or other parts which are required to be
positioned external to the insole (not shown). In a second
embodiment of the invention, support layer 2 may comprise a
two-part construction defining a cavity on the interior thereof
such that the embedded system is completely encased by the rigid
material of support layer 2. In such cases, the two parts of
support layer 2 may be attached to each other using methods similar
to those used to attach the whole support layer 2 to comfort layer
1. In other embodiments, the embedded systems may be manufactured
already permanently or non-permanently encased in support layer 2,
ready to be joined with comfort layer 1.
[0011] The length of support layer 2 will preferably not exceed the
length from the heel to arch point 4. Comfort layer 1 may be
attached to the top side of support layer 2 using grooves, pegs,
friction-inducing fixtures, adhesives or other fixtures in the
materials. In the embodiment shown, two pads 6 are shown to
represent a hook and loop attachment method, such as Velcro.RTM..
The strips are orthogonal to the user's foot, but other embodiments
could be in any arrangement on the outward faces of support layer 2
and comfort layer 1.
[0012] In another embodiment, comfort layer 1 would be thicker at
the heel end with a separate pocket for support layer 2. Support
layer 2 would then fit into a fabric pocket to be fastened to
comfort layer 1 (not shown). In this embodiment, the fabric pocket
would replace the strips of attachment material 6 seen in the
embodiment of FIG. 1. In yet another embodiment, comfort layer 1
may define a cavity in the heal portion thereof into which support
layer 2 may be inserted (not shown).
* * * * *