U.S. patent application number 14/467509 was filed with the patent office on 2015-02-26 for manufacturing method of thin film transistor and display array substrate using same.
The applicant listed for this patent is Ye Xin Technology Consulting Co., Ltd.. Invention is credited to WEI-CHIH CHANG, KUO-LUNG FANG, YI-CHUN KAO, HUI-CHU LIN, I-MIN LU, I-WEI WU.
Application Number | 20150056761 14/467509 |
Document ID | / |
Family ID | 52480729 |
Filed Date | 2015-02-26 |
United States Patent
Application |
20150056761 |
Kind Code |
A1 |
WU; I-WEI ; et al. |
February 26, 2015 |
MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND DISPLAY ARRAY
SUBSTRATE USING SAME
Abstract
A manufacturing method of a thin film transistor includes
hard-baking and etching processes for a stop layer. Two through
holes are exposed and developed in a photoresistor layer, in which
a distance between the two through holes is substantially equal to
the channel length of the thin film transistor. Further, the
etching stop layer is dry-etched to obtain the thin film transistor
having an expected channel length.
Inventors: |
WU; I-WEI; (Hsinchu, TW)
; LU; I-MIN; (Hsinchu, TW) ; CHANG; WEI-CHIH;
(Hsinchu, TW) ; LIN; HUI-CHU; (Hsinchu, TW)
; KAO; YI-CHUN; (Hsinchu, TW) ; FANG;
KUO-LUNG; (Hsinchu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Ye Xin Technology Consulting Co., Ltd. |
Hsinchu |
|
TW |
|
|
Family ID: |
52480729 |
Appl. No.: |
14/467509 |
Filed: |
August 25, 2014 |
Current U.S.
Class: |
438/158 |
Current CPC
Class: |
H01L 27/1288 20130101;
H01L 29/7869 20130101; H01L 29/66969 20130101; H01L 21/31058
20130101; H01L 21/31144 20130101; H01L 29/78606 20130101 |
Class at
Publication: |
438/158 |
International
Class: |
H01L 27/12 20060101
H01L027/12; H01L 21/308 20060101 H01L021/308; H01L 21/3065 20060101
H01L021/3065; H01L 29/66 20060101 H01L029/66 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 23, 2013 |
TW |
102130378 |
Claims
1. A manufacturing method of a thin film transistor, the method
comprising: forming a gate electrode on a substrate and coating a
gate insulating layer on the gate electrode; forming a channel
layer on the gate insulating layer, the channel layer corresponding
to the gate electrode, coating an etching stop layer on the channel
layer; causing the etching stop layer to be flat and solid by
hard-baking the etching stop layer; coating a photoresistor layer
on the etching stop layer; patterning the photoresistor layer and
defining two through holes on the patterned photoresistor layer;
etching the etching stop layer to the channel layer to form two
contact holes using the patterned photoresistor layer as a mask;
stripping away residual photoresistive material from the
photoresistor layer; and forming a source electrode and a drain
electrode on the etching stop layer, wherein the source electrode
and the drain electrode contact the channel layer via the two
contact holes.
2. The manufacturing method of claim 1, wherein the etching stop
layer is made of organic and transparent materials.
3. The manufacturing method of claim 1, wherein a photosensitivity
of the photoresistor layer is better than a photosensitivity of the
etching stop layer.
4. The manufacturing method of claim 1, wherein the etching stop
layer is hard-baked under a temperature condition between
100.degree. C.-400.degree. C.
5. The manufacturing method of claim 1, wherein a distance between
the two through holes is less than ten micrometers.
6. The manufacturing method of claim 5, wherein the distance
between the two through holes is 3-5 micrometers.
7. The manufacturing method of claim 1, further comprising
providing a photomask having two transmission portions and a
shading portion, and photo exposing and developing the
photoresistor layer to define the two through holes using the
photomask.
8. The manufacturing method of claim 7, wherein a distance between
the two transmission portions is defined to be the distance between
the two through holes.
9. The manufacturing method of claim 1, wherein the etching stop
layer is etched by a plasma etching method or a reactive ion
etching (RIE) method.
10. The manufacturing method of claim 1, wherein the etching stop
layer comprises an organic stop layer and a hard mask layer, the
hard mask layer is located on a surface of the organic stop layer
opposite to the substrate to enhance a hardness of the organic stop
layer.
11. The manufacturing method of claim 10, wherein a photosensivity
of the photoresistor layer is better than a photosensivity of the
organic stop layer.
12. The manufacturing method of claim 11, wherein a thickness of
the hard mask layer is less than a thickness of the organic stop
layer.
13. The manufacturing method of claim 11, wherein the hard mask
layer comprises silicon nitride (SiNx), Silicon oxide (SiOx),
silicon fluorion (SiFx), or silicon nitride oxide (SiNxOy).
14. A manufacturing method of a display array substrate,
comprising: forming a plurality of thin film transistors on a
substrate, wherein a method of manufacturing the thin film
transistor comprises: forming a gate electrode on a substrate and
coating a gate insulating layer on the gate electrode; forming a
channel layer on the gate insulating layer, the channel layer
corresponding to the gate electrode, forming an etching layer on
the channel layer and coating the etching stop layer; causing the
etching stop layer to be flat and solid by hard-baking the etching
stop layer; coating a photoresistor layer on the etching stop
layer; patterning the photoresistor layer and defining two through
holes on the patterned photoresistor layer; etching the etching
stop layer to the channel layer to form two contact holes using the
patterned photoresistor layer as a mask; stripping away residual
photoresistive material from the photoresistor layer; and forming a
source electrode and a drain electrode on the etching stop layer,
wherein the source electrode and the drain electrode contact the
channel layer via the two contact holes.
15. The manufacturing method of claim 14, wherein a material of the
etching stop layer is organic and transparent and a photosensivity
of the photoresistor layer is better than a photosensitivity of the
etching stop layer.
16. The manufacturing method of claim 14, wherein the etching stop
layer is hard-baked under a temperature condition between
100.degree. C.-400.degree. C., and a distance between the two
through holes is less than ten micrometers.
17. The manufacturing method of claim 16, wherein the distance
between the two through holes is 3-5 micrometers.
18. The manufacturing method of claim 14, further comprising
providing a photomask having two transmission portions and a
shading portion, and photo exposing and developing the
photoresistor layer to define the two through holes using
photomask.
19. The manufacturing method of claim 18, wherein a distance
between the two transmission portions defines the distance between
the two through holes.
20. The manufacturing method of claim 14, wherein the etching stop
layer comprises an organic stop layer and a hard mask layer, the
hard mask layer is located on a surface of the organic stop layer
opposite to the substrate to enhance a hardness of the organic stop
layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to Taiwanese Patent
Application No. 102130378 filed on Aug. 23, 2013 in the Taiwan
Intellectual Property Office, the contents of which are
incorporated by reference herein.
FIELD
[0002] The disclosure generally relates to thin film transistor
manufacture.
BACKGROUND
[0003] A channel layer of a thin film transistor can be made of
metal oxide semiconductor. An etching stop layer can be arranged on
the channel layer to protect the metal oxide semiconductor. A
thickness of the etching stop layer is generally greater than 100
nanometers. However, in etching stop (ES) process a resolution of
exposing a through hole in the etching stop layer is not high
enough to achieve a shorter channel length between a source
electrode and a drain electrode of the thin film transistor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Implementations of the present technology will now be
described, by way of example only, with reference to the attached
figures.
[0005] FIG. 1 is a partially sectioned isometric view of a pixel
electrode of a display array substrate with thin film transistors
according the present disclosure.
[0006] FIG. 2 is a sectional view of the thin film transistor of
FIG. 1 according to a first embodiment.
[0007] FIGS. 3-8 are sectional views illustrating a manufacturing
method of the thin film transistor of FIG. 2.
[0008] FIG. 9 is a flowchart of the manufacturing method of the
thin film transistor of FIG. 2.
[0009] FIG. 10 is a sectional view of the thin film transistor of
FIG. 1 according to a second embodiment.
[0010] FIGS. 11-17 are sectional views illustrating a manufacturing
method of the thin film transistor of FIG. 10.
[0011] FIG. 18 is a flowchart of the manufacturing method of the
thin film transistor of FIG. 10.
DETAILED DESCRIPTION
[0012] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details. In other
instances, methods, procedures, and components have not been
described in detail so as not to obscure the related relevant
feature being described. The drawings are not necessarily to scale
and the proportions of certain parts may be exaggerated to better
illustrate details and features. The description is not to be
considered as limiting the scope of the embodiments described
herein.
[0013] Referring to FIG. 1, a display array substrate 10 can
include a plurality of gate lines 11 and a plurality of data lines
12. The gate lines 11 are parallel to each other. The data lines 12
are parallel to each other, and each independently intersects with
the gate lines 11. The data lines 12 and the gate lines 11 define
multiple intersections where the data lines 12 cross the gate lines
11. A thin film transistor (TFT) 100 is arranged on each of the
multiple intersections. The thin film transistor 100 can include a
gate electrode 110, a source electrode 120, and a drain electrode
130. The gate electrode 110 is electrically connected to one gate
line 11 to receive a gate signal which is output by a gate driver
(not shown). The source electrode 120 is electrically connected to
one data line 12 to receive a data signal which is output by a data
driver (not shown).
[0014] When a potential of the gate signal is greater than a
threshold potential of the thin film transistor 100, a channel
layer 103 (as shown in FIG. 2) is turned on, thus the data signal
is output to the drain electrode 130 via the source electrode
120.
[0015] Referring also to FIG. 2, the thin film transistor 100 can
further include a gate insulating layer 105 and an etching stop
layer 107. The gate electrode 110 is formed on a substrate 101. The
source electrode 120 and the drain electrode 130 are arranged on
the same layer. The channel layer 103 is coupled between the source
electrode 120 and the drain electrode 130. The gate insulating
layer 105 is formed on the same substrate 101 on which the gate
electrode 110 is formed, and electrically insulates the gate
electrode 110 from the channel layer 103. The etching stop layer
107 is arranged on a surface of the channel layer 103 to protect
the channel layer 103.
[0016] FIGS. 3-8 show sectional views illustrating a manufacturing
method of the thin film transistor 100. FIG. 9 shows a flowchart of
the manufacturing method of the thin film transistor 100.
[0017] At block 301, as shown in FIG. 3, the gate electrode 110 and
the gate insulating layer 105 are formed on the substrate 101. In
detail, a first metal layer is deposited on the substrate 101, and
then the first metal layer is patterned to form the gate electrode
110. The gate insulating layer 105 is coated on the gate electrode
110. In the embodiment, the first metal layer is etched by photo
lithography process. The substrate 101 can be a glass substrate or
a quartz substrate. The first metal layer can include molybdenum
(Mo), aluminum (Al), chromium (Cr), copper (Cu), or neodymium (Nd).
The gate insulating layer 105 can include silicon nitride (SiNx) or
Silicon oxide (SiOx). In the embodiment, the gate insulating layer
105 can formed by sputtering, vacuum evaporation, pulsed laser
deposition (PLD), or Plasma Enhanced CVD (PECVD) methods.
[0018] Referring also to FIG. 3, at block 303, the channel layer
103 is formed on the gate insulating layer 105 to correspond to the
gate electrode 110, and the etching stop layer 107 is coated on the
channel layer 103. The channel layer 103 can be metal oxide
semiconductor, such as indium gallium zinc oxide (IGZO), zinc oxide
(ZnO), indium oxide (InO), gallium oxide (GaO), or the like. In the
embodiment, a metal oxide semiconductor layer is formed on the gate
insulating layer 105 by sputtering, vacuum evaporation, pulsed
laser deposition (PLD), or Plasma Enhanced CVD (PECVD) method, and
then the metal semiconductor layer is patterned to form the channel
layer 103. A material of the etching stop layer 107 is organic and
transparent. In the embodiment, the etching stop layer 107 is
photo-active compound (PAC), and a photosensitivity of the etching
stop layer 107 is not better than a photosensitivity of a
photoresistor. The etching stop layer 103 protects the channel
layer 103 against damage in subsequent processing, and a thickness
of the etching stop layer 107 is generally greater than 100
nanometers up to a few micormeter.
[0019] At block 305, the etching stop layer 107 is hard-baked to
become flat and solid. The hard-baking process of the etching stop
layer 107 enhances adhesion between the etching stop layer 107 and
the channel layer 103. In the embodiment, the etching stop layer
107 is hard-baked under a temperature between 100.degree.
C.-400.degree. C. Residual organic solvents of the etching stop
layer 107 are evaporated in the hard-baking, thus the etching stop
layer 107 becomes solid and the adhesion between the etching stop
layer and the channel layer 103 is enhanced.
[0020] At block 307, referring to FIG. 4, a photoresistor layer 109
is coated on the etching stop layer 107.
[0021] At block 309, referring to FIG. 5, the photoresistor layer
109 is patterned and two through holes, H1 and H2, are defined on
the patterned photoresistor layer 109. In detail, the photoresistor
layer 109 is photo-exposed and developed to define the two through
holes H1 and H2, under a shield of a photomask 14. A distance
between the two through holes H1 and H2 is equal to a predetermined
channel length. In the embodiment, the distance between the two
through holes H1 and H2 is 3-5 micrometers. The photomask 14 can
include two transmission portions 140 and a shading portion 141. A
distance between the two transmission portions 140 is defined to be
the distance between the two through holes H1 and H2.
[0022] At block 311, referring to FIG. 6, two contact holes, O1 and
O2, are formed by etching the etching stop layer 107 to the channel
layer 103 using the patterned photoresistor layer 109 as a mask.
The two contact holes O1 and O2 respectively contact the two
through holes H1 and H2. In the embodiment, the etching stop layer
107 is etched by a dry-etching method, such as a plasma etching
method or a reactive ion etching (RIE) method. A distance between
the two contact holes O1 and O2 is substantially equal to the
channel length L1.
[0023] At block 313, referring to FIG. 7, residual photoresistor
layer 109 is stripped away.
[0024] At block 315, referring to FIG. 8, the source electrode 120
and the drain electrode 130 are formed on the etching stop layer
107. The source electrode 120 and the drain electrode 130
respectively infill the two contact holes O1 and O2 to contact the
channel layer 103. In detail, a second metal layer is deposited on
the etching stop layer 107, and then the source electrode 120 and
the drain electrode 130 are formed in a mask process by patterning
the second metal layer. The first metal layer can include
molybdenum (Mo), aluminum (Al), chromium (Cr), copper (Cu), or
neodymium (Nd).
[0025] FIG. 10 shows a thin film transistor (thin film transistor
200) according to a second embodiment. The thin film transistor 200
can include a gate electrode 210, a channel layer 203, and a gate
insulating layer 210. The gate electrode 210 is formed on a
substrate 201. The channel layer 203 is arranged on the gate
insulating layer 210 to correspond to the gate electrode 210. The
thin film transistor 200 can further include an etching stop layer
207 protectively covering the channel layer 203. In one embodiment,
the etching stop layer 207 can include an organic stop layer 207a
and a hard mask layer 207b. The hard mask layer 207b is stacked up
on the organic stop layer 207a. The organic stop layer 207a can be
a transparent organic material layer after a curing process. The
hard mask layer 207 is arranged on a surface of the organic stop
layer 207a opposite to the substrate 201 to enhance a hardness of
the organic stop layer 207a. In the embodiment, a thickness of the
hard mask layer 207b is less than a thickness of the organic stop
layer 207a. Two contact holes O21 and O22 penetrate the etching
stop layer 207 to expose the channel layer 207. A distance between
the two contact holes O21 and O22 defines a channel length L2. In
the embodiment, the distance between the two contact holes O21 and
O22 is less than ten micrometers. The preferred distance between
the two contact holes O21 and O22 is 3-5 micrometers.
[0026] The thin film transistor 200 can further include a source
electrode 220 and a drain electrode 230. The channel layer 203 is
coupled between the source electrode 220 and the drain electrode
230. The source electrode 220 and the drain electrode 230 make
contact with the channel layer 203 via the two contact holes O21
and O22.
[0027] FIGS. 11-17 show sectional views illustrating a
manufacturing method of the thin film transistor 200. FIG. 18 shows
a flowchart of the manufacturing method of the thin film transistor
200.
[0028] At block 401, referring to FIG. 11, the gate electrode 210
and the gate insulating layer 205 are formed on the substrate 201.
In detail, a first metal layer is deposited on the substrate 201,
and then the first metal layer is patterned to form the gate
electrode 210. The gate insulating layer 205 is coated on the gate
electrode 210. In the embodiment, the first metal layer is etched
by photo lithography process. The substrate 201 can be a glass
substrate or a quartz substrate. The first metal layer can include
molybdenum (Mo), aluminum (Al), chromium (Cr), copper (Cu), or
neodymium (Nd). The gate insulating layer 205 can include silicon
nitride (SiNx) or Silicon oxide (SiOx). In the embodiment, the gate
insulating layer 205 can formed by sputtering, vacuum evaporation,
pulsed laser deposition (PLD), or Plasma Enhanced CVD (PECVD)
process.
[0029] At block 403, referring also to FIG. 11, the channel layer
203 is formed on the gate insulating layer 205 to correspond to the
gate electrode 210, and the organic stop layer 207a is coated on
the channel layer 203. The channel layer 103 can be metal oxide
semiconductor, such as indium gallium zinc oxide (IGZO), zinc oxide
(ZnO), indium oxide (InO), gallium oxide (GaO), or the like. In the
embodiment, a metal oxide semiconductor layer is formed on the gate
insulating layer 205 by sputtering, vacuum evaporation, pulsed
laser deposition (PLD), or Plasma Enhanced CVD (PECVD) process, and
then the metal semiconductor layer is patterned to form the channel
layer 203. A material of the organic stop layer 207a is organic and
transparent. In the embodiment, a photosensitivity of the organic
stop layer 207a is not better than a photosensitivity of a
photoresistor. The organic stop layer 207a protects the channel
layer 203 against damage of subsequent processes, and a thickness
of the organic stop layer 207a is one micrometer.
[0030] At block 405, the organic stop layer 207a is hard-baked to
be flat and solid. Hard-baking the organic stop layer 207a enhances
adhesion between the organic stop layer 207a and the channel layer
203. In the embodiment, the organic stop layer 207a is hard-baked
between 100.degree. C.-400.degree. C. Residual organic solvents of
the organic stop layer 207a is evaporated in the hard-baking, thus
the organic stop layer 207a is solid and the adhesion between the
etching stop layer and the channel layer 203 is enhanced.
[0031] At block 407, referring to FIG. 12, the hard mask layer 207b
is formed on the organic stop layer 207a. The hard mask layer 207b
is stacked up with the organic stop layer 207a to form the etching
stop layer 207. In the embodiment, a thickness of the hard mask
layer 207b is less than a thickness of the organic stop layer 207a.
The hard mask layer 207b can include silicon nitride (SiNx),
Silicon oxide (SiOx), silicon fluorion (SiFx), or silicon nitride
oxide (SiNxOy). In one embodiment, the hard mask layer 207b is
formed by chemical vapor deposition (CVD) or sputtering
process.
[0032] At block 409, referring to FIG. 13, a photoresistor layer
209 is coated on the etching stop layer 207.
[0033] At block 411, referring to FIG. 14, the photoresistor layer
209 is patterned and two through holes H21 and H22 are defined on
the patterned photoresistor layer 209. In detail, the photoresistor
layer 209 is photo-exposed and developed to define the two through
holes H21 and H22, under a shield of a photomask 24. A distance
between the two through holes H21 and H22 is equal to a
predetermined channel length. In the embodiment, the distance
between the two through holes H21 and H22 is 3-5 micrometers. The
photomask 24 can include two transmission portions 240 and a
shading portion 241. A distance between the two transmission
portions 240 defines the distance between the two through holes H21
and H22.
[0034] At block 413, referring to FIG. 15, two contact holes O21
and O22 are formed by etching the organic stop layer 207a and the
hard mask layer 207b to the channel layer 207, with the patterned
photoresistor layer 209 as a mask. The two contact holes O21 and
O22 make respective contact with the two through holes H21 and H22.
In the embodiment, the organic stop layer 207a and the hard mask
layer 207b are etched by dry-etching method, such as plasma etching
or reactive ion etching (RIE). A distance between the two contact
holes O21 and O22 is substantially equal to the channel length
L2.
[0035] At block 415, referring to FIG. 16, residual photoresistor
layer 209 is stripped away.
[0036] At block 417, referring to FIG. 17, the source electrode 220
and the drain electrode 230 are formed on the hard mask layer 207b.
The source electrode 220 and the drain electrode 230 infill the two
contact holes O21 and O22 to make contact with the channel layer
203. In detail, a second metal layer is deposited on the hard mask
layer 207b, and then the source electrode 220 and the drain
electrode 230 are formed in a mask process by patterning the second
metal layer. The first metal layer can include molybdenum (Mo),
aluminum (Al), chromium (Cr), copper (Cu), or neodymium (Nd).
[0037] When the thin film transistors 100 and 200 are applied to a
liquid crystal display panel by a subsequent process, a planar
layer and pixel structure will be formed.
[0038] In summary, a manufacturing method of the thin film
transistor includes hard-baking and etching a stop layer, and two
through holes are exposed and developed in a photoresistor layer,
the distance between the two through holes being substantially
equal to the channel length of the thin film transistor. The
etching stop layer is dry-etched to obtain the thin film transistor
with an expected channel length.
[0039] It is to be understood that even though numerous
characteristics and advantages of the present embodiments have been
set forth in the foregoing description, with details of the
structures and functions of the embodiments, the disclosure is
illustrative only; and changes may be in detail, especially in the
matter of arrangement of parts within the principles of the
embodiments to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *