U.S. patent application number 14/385231 was filed with the patent office on 2015-02-19 for led illumination module.
This patent application is currently assigned to Seoul Semiconductor Co., Ltd. The applicant listed for this patent is Seoul Semiconductor Co., Ltd.. Invention is credited to Jung Hwa Jung, Seoung Ho Jung, Eun Ju Kim.
Application Number | 20150049486 14/385231 |
Document ID | / |
Family ID | 49161484 |
Filed Date | 2015-02-19 |
United States Patent
Application |
20150049486 |
Kind Code |
A1 |
Jung; Jung Hwa ; et
al. |
February 19, 2015 |
LED ILLUMINATION MODULE
Abstract
Provided is a light emitting diode (LED) illumination module.
The LED illumination module includes a fluorescent substance plate
mounted to be capable of being attached to and detached from an
opening formed in a top surface of a heat sink. Also, the LED
illumination module includes a lens that covers the opening of the
heat sink and is mounted to be capable of being attached to and
detached from the heat sink.
Inventors: |
Jung; Jung Hwa; (Ansan-si,
KR) ; Kim; Eun Ju; (Ansan-si, KR) ; Jung;
Seoung Ho; (Ansan-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Seoul Semiconductor Co., Ltd. |
Ansan-si |
|
KR |
|
|
Assignee: |
Seoul Semiconductor Co.,
Ltd
Ansan-si
KR
|
Family ID: |
49161484 |
Appl. No.: |
14/385231 |
Filed: |
March 14, 2013 |
PCT Filed: |
March 14, 2013 |
PCT NO: |
PCT/KR2013/002050 |
371 Date: |
September 15, 2014 |
Current U.S.
Class: |
362/260 |
Current CPC
Class: |
F21K 9/60 20160801; F21V
29/74 20150115; F21V 13/02 20130101; F21K 9/64 20160801; H01L
2224/48091 20130101; F21V 7/0091 20130101; F21V 17/12 20130101;
H01L 33/50 20130101; F21V 5/04 20130101; F21Y 2115/10 20160801;
H01L 33/52 20130101; H01L 2924/181 20130101; H01L 2224/48091
20130101; H01L 2924/00014 20130101; H01L 2924/181 20130101; H01L
2924/00012 20130101 |
Class at
Publication: |
362/260 |
International
Class: |
F21V 13/02 20060101
F21V013/02; H01L 33/52 20060101 H01L033/52; H01L 33/50 20060101
H01L033/50; F21K 99/00 20060101 F21K099/00; F21V 29/00 20060101
F21V029/00; F21V 17/12 20060101 F21V017/12 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 14, 2012 |
KR |
10-2012-0026275 |
Claims
1. A light emitting diode (LED) illumination module, comprising: a
heat sink comprising an opening in a top surface of the heat sink
and a recess unit formed in a bottom surface of the opening, the
recess unit having a smaller width than the opening; an LED package
comprising an LED chip disposed within the recess unit; a
fluorescent substance plate detachably disposed in the opening; and
a lens covering the opening and disposed on the heat sink.
2. The LED illumination module of claim 1, wherein the LED chip is
spaced from the fluorescent substance plate.
3. The LED illumination module of claim 2, wherein the distance
between the LED chip and the fluorescent substance plate is defined
by a depth of the recess unit.
4. The LED illumination module of claim 1, further comprising an
optical plate detachably disposed in the opening.
5. The LED illumination module of claim 4, wherein the optical
plate comprises a light diffuser plate or a dichroic filter.
6. The LED illumination module of claim 1, wherein the lens is
detachably disposed on the heat sink.
7. The LED illumination module of claim 6, wherein: a groove unit
corresponding to an outer circumferential shape of the heat sink is
formed in a lower portion of the lens; and the heat sink is
disposed in the groove unit.
8. The LED illumination module of claim 6, wherein the lens is
spirally connected with the heat sink.
9. The LED illumination module of claim 6, wherein: an insertion
groove is formed in a bottom surface of the lens or a top surface
of the heat sink; an insertion protrusion is formed in the bottom
surface of the lens or the top surface of the heat sink, opposite
to the insertion groove; and the insertion groove and the insertion
protrusion are detachably connected.
10. The LED illumination module of claim 1, wherein a central
portion of the lens comprises a total reflection surface having a V
sectional shape.
11. The LED illumination module of claim 1, wherein the LED package
comprises: an LED chip disposed on a circuit substrate disposed in
the recess unit; and an encapsulation unit covering the LED
chip.
12. The LED illumination module of claim 8, wherein: a screw groove
corresponding to an inner circumferential edge of the lens is
formed on an upper portion of the heat sink; a screw protrusion
corresponding to an outer circumferential edge of the heat sink is
formed on a lower portion of the lens; and the screw groove and the
screw protrusion are detachably connected.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is the National Stage of International
Application No. PCT/KR2013/002050, filed on Mar. 14, 2013, and
claims priority from and the benefit of Korean Patent Application
No. 10-2012-0026275, filed on Mar. 14, 2012, which are hereby
incorporated by reference for all purposes as if fully set forth
herein.
BACKGROUND
[0002] 1. Field
[0003] The present invention relates to an illumination module, and
more particularly, to a light emitting diode (LED) illumination
module mounted integrally with a heat sink.
[0004] 2. Discussion of the Background
[0005] Since light emitting diodes (LEDs) have many advantages,
such as environmental friendliness, a long lifespan, low power
consumption, and high luminous efficiency, the application range of
LEDs has gradually expanded with recent developments of
semiconductor technology. In particular, with the recent
commercialization of high-luminance white LEDs, various attempts to
adopt the high-luminance white LEDs as illuminators have
continued.
[0006] FIG. 1 is a cross-sectional view of a conventional LED
package.
[0007] The conventional LED package may include a package main body
1 on which lead frames 2 and 3 are disposed, the package main body
1 having an opening 4, an LED chip 5 mounted on the package main
body 1, a bonding wire 6 connected to the LED chip 5, an
encapsulation unit 7 covering the LED chip 5 and the bonding wire 6
within the opening 4, and a lens 8 capable of adjusting an
orientation angle of emitted light.
[0008] The encapsulation unit 7 may include a fluorescent substance
9 configured to convert a wavelength of some light emitted from the
LED chip 5. In general, the encapsulation unit 7 may be formed by
molding an encapsulant containing the fluorescent substance 9 in
the opening 4.
[0009] However, in the above-described case, since the fluorescent
substance 9 is integrally formed with the LED package along with
the encapsulation unit 7, the LED package itself should be attached
and detached to change the color of emitted light. Also, the
fluorescent substance 9 is liable to be degraded due to heat
generated by the LED chip 5.
[0010] Meanwhile, although an orientation angle of light emitted by
an LED is about 120.degree., an orientation angle larger than
120.degree. is required to use the LED for an illuminator.
Accordingly, an additional secondary lens is needed to obtain an
orientation angle of about 180.degree. or more, and there was a
burden of preparing an additional support unit configured to locate
the lens at a sufficient height from the ground.
SUMMARY
[0011] Accordingly, the present invention is directed to a light
emitting diode (LED) illumination module in which a fluorescent
substance plate and a lens may be mounted to be capable of being
attached to and detached from a heat sink.
[0012] One aspect of the present invention provides a light
emitting diode (LED) illumination module. The LED illumination
module includes a heat sink including an opening formed in a top
surface of the heat sink and a recess unit formed in a bottom
surface of the opening, the recess unit having a smaller width than
the opening, an LED package including at least one LED chip mounted
within the recess unit, at least one fluorescent substance plate
mounted to be capable of being attached to and detached from the
opening, and a lens covering the opening and mounted on the heat
sink.
[0013] The LED chip may be spaced a predetermined distance apart
from the fluorescent substance plate mounted within the
opening.
[0014] The lens may be mounted to be capable of being attached to
and detached from the heat sink.
[0015] According to the present invention, since a fluorescent
substance plate is mounted to be attached to and detached from a
heat sink, the color of emitted light can be easily changed as
needed. Also, since the fluorescent substance plate is mounted a
predetermined distance apart from an LED chip, the loss of optical
efficiency can be minimized. In addition, degradation of a
fluorescent substance due to heat generated by the LED chip can be
prevented.
[0016] Furthermore, since the heat sink itself can serve to support
a lens, no additional support unit is required to increase the
efficiency of a fabrication process. Moreover, since the lens is
mounted to be capable of being attached to and detached from the
heat sink, the lens may be exchanged with a different one to obtain
various light orientation angles.
[0017] Aspects of the present invention should not be limited by
the above description, and other unmentioned aspects will be
clearly understood by one of ordinary skill in the art from
exemplary embodiments described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 is a cross-sectional view of a conventional light
emitting diode (LED) package.
[0019] FIG. 2 is a cross-sectional view of an LED illumination
module according to an exemplary embodiment of the present
invention.
[0020] FIG. 3 is a cross-sectional view of an LED illumination
module to and from which a fluorescent substance plate and a lens
are externally attached and detached according to an exemplary
embodiment of the present invention.
[0021] FIG. 4 is a cross-sectional view of an LED illumination
module to and from which a fluorescent substance plate and a lens
are externally attached and detached according to another exemplary
embodiment of the present invention.
[0022] FIG. 5 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
[0023] FIG. 6 is a cross-sectional view of an LED illumination
module to and from which a lens is externally attached and detached
according to another exemplary embodiment of the present
invention.
[0024] FIG. 7 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
[0025] FIG. 8 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0026] Hereinafter, exemplary embodiments of the present invention
will be described in detail. It should be understood, however, that
there is no intent to limit the invention to the particular forms
disclosed. On the contrary, the invention is to cover all
modifications, equivalents, and alternatives falling within the
spirit and scope of the claims.
[0027] It will be understood that when a layer is referred to as
being "on" another layer or substrate, it can be directly on the
other layer or substrate or intervening layers may also be present.
Terms that describe spatial relationships, such as "beneath,"
"below," "lower," "above," "upper" and the like, may be used herein
for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. It will be understood that such terms are intended to
encompass different orientations of the device in use or operation
in addition to the orientation(s) depicted in the figures. For
example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
term "below" can encompass both an orientation of above and below.
The orientation of the device may be changed in other ways (e.g.,
rotated 90 degrees or some other angle) and spatial relationships
described herein should be interpreted within the context of the
changed orientation.
[0028] In the drawings, the thicknesses of layers and regions may
be exaggerated for clarity. Like reference numerals refer to like
elements throughout.
[0029] FIG. 2 is a cross-sectional view of a light emitting diode
(LED) illumination module according to an exemplary embodiment of
the present invention.
[0030] FIG. 3 is a cross-sectional view of an LED illumination
module, to and from which a fluorescent substance plate and a lens
are externally attached and detached, according to an exemplary
embodiment of the present invention.
[0031] Referring to FIGS. 2 and 3, a heat sink 10 may include a
recess unit 12 in which an LED package 20 may be mounted, and an
opening 14, which may extend onto the recess unit 12. A fluorescent
substance plate 30 may be mounted in the recess unit 12.
[0032] The heat sink 10 may serve to externally emit heat generated
by the LED package 20. The heat sink 10 may be formed of a metal
having good thermal conductivity.
[0033] In addition, the heat sink 10 serves to support a lens 40
formed to cover the opening 14 of the heat sink 10. In this case,
the heat sink 10 preferably has such a height as to sufficiently
space the lens 40 from the ground. Accordingly, an additional unit
for supporting the lens 40 may not be used, and an orientation
angle of light may increase.
[0034] The LED package 20 may be mounted in the recess unit 12.
Although FIGS. 2 and 3 illustrate that a package 20 including a
plurality of LED chips 24 is mounted in the recess unit 12, the
present invention is not limited thereto. In some cases, a
plurality of LED packages may be mounted, or a package including
one LED chip may be mounted.
[0035] The LED package 20 may include a circuit substrate 22 having
an electrode pattern, an LED chip 24 formed on the circuit
substrate 22, and an encapsulation unit 26 configured to
encapsulate the LED chip 24. In another case, the electrode pattern
may be directly formed on the heat sink without the circuit
substrate 22. Although not shown in the drawings, the LED chip 24
may be electrically connected to the electrode pattern through a
bonding wire.
[0036] The LED chip 24 may be a light source configured to emit
light having a predetermined orientation angle due to an applied
current. The LED chip 24 may have a horizontal, vertical, or
flip-chip structure. At least one LED chip 24 may be mounted as
needed. Light emitted by the LED chip 24 may be ultraviolet (UV)
light or blue light and mixed with light emitted from a fluorescent
substance to embody white light.
[0037] A sidewall of the recess unit 12 may have a predetermined
slope in consideration of an orientation angle of light of the LED
chip 24. In this case, when the heat sink 10 is formed of a metal
(e.g., aluminum (Al)) having high light reflectance, an additional
reflection surface may not be formed on the sidewall of the recess
unit 12.
[0038] However, in another case, an additional reflection surface
may be formed on the sidewall of the recess unit 12. In an example,
the reflection surface may be formed by coating a light reflection
material having a high reflection rate. For example, the light
reflection material may be titanium oxide (TiO.sub.2), silicon
oxide (SiO.sub.2), or zinc oxide (ZnO). However, the present
invention is not limited thereto.
[0039] The encapsulation unit 26 may encapsulate the LED chip 24
and include a light-transmitting resin including at least one
selected out of a silicone resin, an epoxy resin, an acrylic resin,
or a urethane resin. However, the present invention is not limited
thereto.
[0040] The opening 14 is formed in a top surface of the heat sink
10. The opening 14 may form a predetermined partition over the
recess unit 12. In this case, the opening 14 may have a greater
width than the width of the recess unit 12. As a result, the
later-described fluorescent substance plate 30 may cover the entire
surface of the LED package 20 mounted in the recess unit 12. Also,
the opening 14 may be formed to have such a width as to provide an
area into which the fluorescent substance plate 30 may be tightly
inserted. The present invention is not limited thereto, and the
width of the opening 14 measured in a major-axis direction may be
equal to or different from the width of the opening 14 measured in
a minor-axis direction. Also, an additional element or structure
for mounting the fluorescent substance plate 30 not in the opening
14 but on the recess unit 12 may be prepared. The shapes and
positions of the opening 14 and the recess unit 12 may be
changed.
[0041] The fluorescent substance plate 30 may be mounted within the
opening 14. In this case, the fluorescent substance plate 30 may be
spaced a predetermined distance apart from the LED chip 24. For
example, the distance between the LED chip 24 and the fluorescent
substance plate 30 may be defined by the depth of the recess unit
12.
[0042] The fluorescent substance plate 30 may be a ceramic plate.
The ceramic plate may be formed by arranging fluorescent substance
particles and heating the fluorescent substance particles under a
high pressure until the surfaces of the fluorescent substance
particles begin to soften and melt. In this case, the sintered
fluorescent substance particles may be of different kinds. Since a
material (e.g., a resin) having a low thermal conductivity is
excluded from the ceramic plate, heat generated by a fluorescent
substance may be efficiently emitted to improve heat dissipation
performance.
[0043] Furthermore, the fluorescent substance plate 30 may be
formed by coating a fluorescent substance on the surface of a resin
film. In this case, respective surfaces of the fluorescent
substance plate 30 may be coated with different kinds of
fluorescent substances. However, the present invention is not
limited thereto, and a fluorescent substance may be included in the
resin film. The resin film may be a thermosetting resin film having
transparency. For example, the thermosetting resin may be selected
from the group consisting of an epoxy resin, a silicone resin,
polycarbonate (PC), and polymethylmethacrylate (PMMA).
[0044] For example, the fluorescent substance plate 30 may include
a red fluorescent substance, a blue fluorescent substance, or a
yellow fluorescent substance. When the LED chip 24 is a UV LED
chip, the red fluorescent substance, the blue fluorescent
substance, and the yellow fluorescent substance may be included in
the fluorescent substance plate 30 to embody white light. When the
LED chip 24 is a blue LED chip, the yellow fluorescent substance
may be included in the fluorescent substance plate 30 to embody
white light.
[0045] The fluorescent substance plate 30 may be inserted into the
opening 14. Various kinds of fluorescent substance plates 30 may be
exchanged and mounted as needed. Thus, various combinations of
colors may be made so that the color of emitted light can be easily
changed.
[0046] The lens 40 is mounted to cover the opening 14 of the heat
sink 10. The lens 40 functions to protect the LED package 20 from
the external environment and adjust an orientation angle of light.
The lens 40 may have various shapes and be exchanged as needed.
Accordingly, various light orientation angles may be obtained.
[0047] The lens 40 may be mounted to be capable of being attached
and detached. In an example, a groove unit 40b corresponding to an
outer circumferential shape of the heat sink 10 may be prepared in
a lower portion of the lens 40. Accordingly, the lens 40 may be
mounted to cover at least an upper portion of the heat sink 10.
However, the present invention is not limited thereto, and the
mounting of the lens 40 according to other embodiments will be
described later.
[0048] The lens 40 may be a plastic lens fabricated by
injection-molding a polymer, such as an epoxy resin, an acrylic
resin, PMMA, PC, or cyclo-olefin polymer (COP). However, the
present invention is not limited thereto.
[0049] Although the lens 40 may have various shapes as mentioned
above, when the lens 40 has corners, color separation may occur due
to a prismatic effect caused at the corners of the lens 40. In this
case, the corners of the lens 40 may be mechanically or chemically
processed to form roughness and induce diffused reflection so that
light emitted by the lens 40 can be softened.
[0050] Furthermore, the lens 40 may have at least one total
reflection surface to control a direction in which light is
emitted. In an example, a central portion of the lens 40 may have a
total reflection surface 40a having a V sectional shape. However,
the present invention is not limited thereto, and the total
reflection surface 40a may have any shape having such a slope as to
totally reflect light that is emitted from the LED chip 24 and
incident on the total reflection surface 40a.
[0051] Since the light emitted from the LED chip 24 is mainly
emitted in a vertical direction, a relatively large quantity of
light is concentrated on the central portion of the lens 40. In
this case, when the central portion of the lens 40 has the total
reflection surface 40a having the V sectional shape, light incident
on the central portion of the lens 40 may be totally reflected,
refracted at a refraction surface of the rounded lens 40, and
emitted toward the ground. Accordingly, the LED illumination module
according to one embodiment of the present invention may widen an
orientation angle of emitted light and be effectively used for an
illuminator configured to illuminate a wide ambient region.
[0052] The lens 40 may contain a light diffusion material. For
example, the light diffusion material may be a material, such as
SiO.sub.2, Al.sub.2O.sub.3, Zr.sub.2O.sub.3, Y.sub.2O.sub.3,
TiO.sub.2, B.sub.2O.sub.3, or CaCO.sub.3. Thus, a light diffusion
effect may be increased within the lens 40, thereby softening
emitted light.
[0053] FIG. 4 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
[0054] Referring to FIG. 4, a plurality of fluorescent substance
plates 32 and 34 may be mounted within an opening 14 of a heat sink
10.
[0055] The plurality of fluorescent substance plates 32 and 34 may
be sequentially stacked and mounted within the opening 14. A first
fluorescent substance plate 32 disposed close to an LED chip 24 may
contain a fluorescent substance having a longer wavelength than a
second fluorescent substance plate 34 mounted on the first
fluorescent substance plate 32.
[0056] In an example, when the LED chip 24 is a blue LED chip, the
first fluorescent substance plate 32 may contain a red fluorescent
substance, and the second fluorescent substance plate 34 may
contain a yellow fluorescent substance. A first emission spectrum
of blue light emitted by the LED chip 24 is initially radiated to
and partially absorbed by the first fluorescent substance plate 32,
and a wavelength-converted second emission spectrum may be emitted.
Although the second emission spectrum is radiated to the second
fluorescent substance plate 34, the second emission spectrum is not
absorbed but transmitted. Meanwhile, part of the first emission
spectrum transmitted through the first fluorescent substance plate
32 is radiated to and partially absorbed by the second fluorescent
substance plate 34, and a wavelength-converted third emission
spectrum is emitted. Accordingly, a first blue spectrum, a second
red spectrum, and a third yellow spectrum may be mixed to embody
white light having good color rendition.
[0057] Although FIG. 4 shows an example in which two fluorescent
substance plates 32 and 34 are mounted, the present invention is
not limited thereto. A plurality of different kinds of fluorescent
substance plates may be mounted within the opening 14 as
needed.
[0058] Since other components are the same as those of FIG. 2, a
repeated description thereof is omitted.
[0059] FIG. 5 is a cross-sectional view of an LED illumination
module to and from which a fluorescent substance plate and a lens
are externally attached and detached according to another exemplary
embodiment of the present invention.
[0060] Referring to FIG. 5, the lens 40 may be mounted to be
capable of being attached and detached. In an example, a groove
unit 40b corresponding to an outer circumferential shape of the
heat sink 10 may be prepared in a lower portion of the lens 40.
Accordingly, the lens 40 may be mounted to cover at least an upper
region of the heat sink 10.
[0061] In this case, the lens 40 may be spirally combined with an
upper portion of the heat sink 10. That is, a screw protrusion 60a
may be formed on an inner circumferential edge of the lower portion
of the lens 40, and a screw groove 60b is formed in an outer
circumferential edge of the upper portion of the heat sink 10 so
that the screw protrusion 60a and the screw groove 60b can be
spirally combined with each other. The screw protrusion 60a may be
integrally formed with the lens 40, and the screw groove 60b may be
integrally formed with the heat sink 10. However, the present
invention is not limited thereto. In another case, a screw groove
60b may be formed in an inner circumferential edge of the lower
portion of the lens 40, and a screw protrusion 60a may be formed on
an outer circumferential edge of the upper portion of the heat sink
10 so that the screw groove 60b and the screw protrusion 60a can be
spirally combined with each other.
[0062] Since other components are the same as those of FIG. 2, a
repeated description thereof is omitted.
[0063] FIG. 6 is a cross-sectional view of an LED illumination
module to and from which a lens is attached and detached, according
to another exemplary embodiment of the present invention.
[0064] Referring to FIG. 6, a fluorescent substance plate 30 and an
optical plate 50 may be mounted in an opening 14 of a heat sink
10.
[0065] The optical plate 50 may serve to control light emitted from
an LED chip 24. In an example, the optical plate 50 may be a light
diffuser plate. The light diffuser plate may be disposed on the
fluorescent substance plate 30 and diffuse light transmitted
through the fluorescent substance plate 30. For example, the light
diffuser plate may be formed by sintering particles formed of a
material, such as SiO.sub.2, Al.sub.2O.sub.3, Zr.sub.2O.sub.3,
Y.sub.2O.sub.3, TiO.sub.2, B.sub.2O.sub.3, or CaCO.sub.3, at a high
temperature under a high pressure.
[0066] In another example, the optical plate 50 may be a dichroic
filter. The dichroic filter may selectively transmit or cut off
light having a specific wavelength. The dichroic filter may be
interposed between the LED chip 24 and the fluorescent substance
plate 30. The dichroic filter may transmit light emitted from the
LED chip 24 and reflect light emitted from the fluorescent
substance plate 30.
[0067] Accordingly, since backward scattered light, out of the
light emitted from the fluorescent substance plate 30, is cut off
by the dichroic filter, damage due to heat absorbed by the LED chip
24 may be prevented. However, the present invention is not limited
thereto, and dichroic filters may be disposed among a plurality of
fluorescent substance plates. The dichroic filter may have a
structure in which at least two materials having a different
refractive index are alternately stacked on the glass or resin film
having a high transmission rate.
[0068] The lens 40 may be mounted to cover the opening 14 of the
heat sink 10. In an example, an insertion groove 61a may be formed
in a top surface of the heat sink 10 and an insertion protrusion
61b may be formed on a bottom surface of the lens 40 so that the
insertion groove 61a and the insertion protrusion 61b may be
inserted into and combined with each other. The insertion groove
61a may be integrally formed with the heat sink 10, and the
insertion protrusion 61b may be integrally formed with the lens 40.
Shapes of the insertion groove 61a and the insertion protrusion 61b
may be variously changed. However, the present invention is not
limited thereto. An insertion groove 61a may be formed in any one
of the bottom surface of the lens 40 and the top surface of the
heat sink 10 and an insertion protrusion 61b may be formed on the
other one thereof, so the insertion groove 61a and the insertion
protrusion 61b may be inserted into and combined with each
other.
[0069] Since other components are the same as those of FIG. 2, a
repeated description thereof is omitted.
[0070] FIG. 7 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
[0071] Referring to FIG. 7, a lens 42 may have a concave central
portion, and a lateral portion extending from the central portion
of the lens 42 may have a convex shape. Since light emitted from
the LED chip 24 is mainly emitted in a vertical direction, the
quantity of light is relatively concentrated on the central portion
of the lens 42. In this case, while light is being transmitted
through the central portion of the lens 42, the light may be
refracted in a lateral direction of the lens 42 to increase the
quantity of light emitted from the the lateral portion of the lens
42.
[0072] The lens 42 may cover an opening 14 of a heat sink 10 and be
mounted to be capable of being attached and detached. In an
example, a groove unit corresponding to an outer circumferential
shape of the heat sink may be prepared in a lower portion of the
lens 42 and simultaneously, the lens 42 may include an insertion
protrusion 62a. An insertion groove 62b having a shape
corresponding to the insertion protrusion 62a may be prepared in a
sidewall of the heat sink 10. Due to the above-described structure,
the lens 42 may be mounted on the heat sink 10 and coupled with the
heat sink 10 more strongly than in the manner in which the lens 40
shown in FIG. 2 is mounted. However, the present invention is not
limited thereto, and a lens may be mounted using various coupling
units.
[0073] A plurality of heat radiation fins 11 may be prepared in a
lower portion of the heat sink 10 to increase a heat dissipation
area and improve heat dissipation performance. However, the present
invention is not limited thereto, and the heat sink 10 may have any
shape for increasing the heat dissipation area.
[0074] Since other components are the same as those of FIG. 2, a
repeated description thereof is omitted.
[0075] FIG. 8 is a cross-sectional view of an LED illumination
module according to another exemplary embodiment of the present
invention.
[0076] Referring to FIG. 8, a portion of a lens 44 may be inserted
into an upper end of the opening 14. For example, the opening 14
may be stepped. The opening 14 may include a first stepped portion
14a and a second stepped portion 14b disposed on the first stepped
portion 14a.
[0077] A fluorescent substance plate 30 may be mounted in the first
stepped portion 14a, and a portion of the lens 44 may be mounted in
the second stepped portion 14b.
[0078] In an example, the lens 44 may have an arched structure. A
semicircular refraction surface may be prepared not only on a top
surface of the lens 44 having the arched structure but also on a
bottom surface thereof. Accordingly, an orientation angle of light
transmitted through the lens 44 and emitted outward may further
increase.
[0079] Since other components are the same as those of FIG. 2, a
repeated description thereof is omitted.
[0080] While the invention has been shown and described with
reference to certain exemplary embodiments thereof, it will be
understood by those skilled in the art that various changes in form
and details may be made therein without departing from the spirit
and scope of the invention as defined by the appended claims.
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