U.S. patent application number 14/455074 was filed with the patent office on 2015-02-19 for methods for manufacturing polishing pad and polishing apparatus.
The applicant listed for this patent is San Fang Chemical Industry Co., Ltd.. Invention is credited to CHUNG-CHIH FENG, YUNG-CHANG HUNG, WEN-CHIEH WU, I-PENG YAO.
Application Number | 20150047266 14/455074 |
Document ID | / |
Family ID | 52465789 |
Filed Date | 2015-02-19 |
United States Patent
Application |
20150047266 |
Kind Code |
A1 |
FENG; CHUNG-CHIH ; et
al. |
February 19, 2015 |
METHODS FOR MANUFACTURING POLISHING PAD AND POLISHING APPARATUS
Abstract
The present invention relates to a method for manufacturing a
polishing pad. The method of the invention includes the steps of
(a) providing a releasing carrier; (b) providing a foaming resin
composition; (c) coating the foaming resin composition of the step
(b) on the carrier of the step (a); and (d) curing the foaming
resin composition of the step (c). The invention also provides a
process for manufacturing a polishing apparatus.
Inventors: |
FENG; CHUNG-CHIH; (Kaohsiung
City, TW) ; YAO; I-PENG; (Kaohsiung City, TW)
; HUNG; YUNG-CHANG; (Kaohsiung City, TW) ; WU;
WEN-CHIEH; (Kaohsiung City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
San Fang Chemical Industry Co., Ltd. |
Kaohsiung City |
|
TW |
|
|
Family ID: |
52465789 |
Appl. No.: |
14/455074 |
Filed: |
August 8, 2014 |
Current U.S.
Class: |
51/295 ;
51/296 |
Current CPC
Class: |
B24B 37/24 20130101 |
Class at
Publication: |
51/295 ;
51/296 |
International
Class: |
B24D 11/00 20060101
B24D011/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 16, 2013 |
TW |
102129404 |
Claims
1. A method for manufacturing a polishing pad comprising: (a)
providing a carrier, wherein the carrier is a releasing material;
(b) providing a foaming resin composition; (c) coating the foaming
resin composition of the step (b) on the carrier of the step (a);
and (d) curing the foaming resin composition of the step (c).
2. The method according to claim 1, wherein the carrier comprises a
polyethylene glycol terephthalate film, a polypropylene film, a
polycarbonate film, a polyethylene film, a polyethylene
terephthalate film, a releasing paper or a releasing fabric.
3. The method according to claim 1, wherein the carrier is
continuously provided.
4. The method according to claim 1, wherein the foaming resin
composition comprises a resin, a foaming agent, and a bridging
agent.
5. The method according to claim 4, wherein the resin comprises at
least one selected from the group consisting of polyurethane,
polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic
rubber, polystyrene, poly aromatic molecules, fluorine-containing
polymer, polyimide, crosslinked polyurethane, crosslinked
polyolefin, polyether, polyester, polyacrylate, elastic
polyethylene, polytetrafluoroethene, poly (ethylene terephthalate),
poly aromatic amide, polyarylalkene, polymethyl methacrylate, a
copolymer thereof, a block copolymer thereof, a mixture thereof,
and a blend thereof.
6. The method according to claim 1, wherein the foaming resin
composition further comprises a polishing particle.
7. The method according to claim 1, wherein the step (c) comprises
blade coating, printing wheel coating, roll extrusion coating or
spraying.
8. The method according to claim 1, further comprising a surface
finishing step, which is finishing a surface of the cured resin
composition in the step (d).
9. The method according to claim 1, further comprising a groove
forming step, which is forming at least one groove on a surface of
the cured resin composition in the step (d).
10. The method according to claim 1, further comprising a step (e)
of removing the carrier.
11. The method according to claim 1, further comprising a step of
applying an adhesive on a surface of the cured resin
composition.
12. The method according to claim 1, further comprising a step of
applying an adhesive on a surface of the carrier.
13. A process for manufacturing a polishing apparatus, wherein the
polishing apparatus comprising: a base plate; a substrate; a
polishing pad, which is adhered on the base plate for polishing the
substrate; and a slurry, which is contacting with the substrate for
polishing; wherein the process comprises the method for
manufacturing the polishing pad according to claim 1.
14. The process according to claim 13, wherein the carrier
comprises a polyethylene glycol terephthalate film, a polypropylene
film, a polycarbonate film, a polyethylene film, a polyethylene
terephthalate film, a releasing paper or a releasing fabric.
15. The process according to claim 13, wherein the carrier is
continuously provided.
16. The process according to claim 13, wherein the foaming resin
composition comprises a resin, a foaming agent, and a bridging
agent.
17. The process according to claim 16, wherein the resin comprises
at least one selected from the group consisting of polyurethane,
polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic
rubber, polystyrene, poly aromatic molecules, fluorine-containing
polymer, polyimide, crosslinked polyurethane, crosslinked
polyolefin, polyether, polyester, polyacrylate, elastic
polyethylene, polytetrafluoroethene, poly (ethylene terephthalate),
poly aromatic amide, polyarylalkene, polymethyl methacrylate, a
copolymer thereof, a block copolymer thereof, a mixture thereof,
and a blend thereof.
18. The process according to claim 13, wherein the foaming resin
composition further comprises a polishing particle.
19. The process according to claim 13, wherein the step (c)
comprises blade coating, printing wheel coating, roll extrusion
coating or spraying.
20. The process according to claim 13, further comprising a surface
finishing step, which is finishing a surface of the cured resin
composition in the step (d).
21. The process according to claim 13, further comprising a groove
forming step, which is forming at least one groove on a surface of
the cured resin composition in the step (d).
22. The process according to claim 13, further comprising a step
(e) of removing the carrier.
23. The process according to claim 13, further comprising a step of
applying an adhesive on a surface of the cured resin
composition.
24. The process according to claim 13, further comprising a step of
applying an adhesive on a surface of the carrier.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method for manufacturing
a polishing pad and a process for manufacturing a polishing
apparatus.
[0003] 2. Description of the Related Art
[0004] Polishing generally refers to a wear control for a
preliminary coarse surface in a process of chemical mechanical
polishing (CMP), which makes the slurry containing fine particles
evenly dispersed on the upper surface of a polishing pad, and at
the same time places a substrate against the polishing pad and then
rubs the substrate repeatedly with a regular motion. The substrate
may be objects such as a semiconductor, a storage medium substrate,
an integrated circuit, an LCD flat-panel glass, an optical glass
and a photoelectric panel. During the polishing process, a
polishing pad must be used for polishing the substrate, and the
quality of the polishing pad directly influences the polishing
effect of the substrate.
[0005] FIG. 1 shows a schematic view of a polishing apparatus with
a conventional polishing pad. The polishing apparatus 1 includes a
lower base plate 11, a mounting sheet 12, a substrate 13, an upper
base plate 14, a polishing pad 15 and slurry 16. The lower base
plate 11 is positioned opposite to the upper base plate 14. The
mounting sheet 12 is adhered to the lower base plate 11 through an
adhesive layer (not shown) and is used for carrying and mounting
the substrate 13. The polishing pad 15 is mounted on the upper base
plate 14, and faces to the lower base plate 11 for polishing the
substrate 13.
[0006] The operation mode of the polishing apparatus 1 is as
follows. First, the substrate 13 is mounted on the mounting sheet
12, and then both the upper and lower base plates 14 and 11 are
rotated and the lower base plate 11 is simultaneously moved
downward, such that the polishing pad 15 contacts the surface of
the substrate 13, and a polishing operation for the substrate 13
may be performed by continuously supplementing the slurry 16 and
using the effect of the polishing pad 15.
[0007] A conventional method for manufacturing the polishing pad is
as disclosed by U.S. Patent No. 2006/0035573, which comprises
foaming a polymer resin solution by infiltrating air, adding a
bridging agent, and then filling the solution into an appropriate
mold. After forming a columnar elastomer by high temperature or
chemical crosslinking curing interaction, and removing the mold,
then, the polishing pad is formed by cooling and cutting into
slices. In the conventional method for manufacturing the polishing
pad, when foaming the polymer resin solution by infiltrating air,
the air easily floats due to its low density. As a reason, the air
is not easy to uniformly distribute as filling the solution into
the mold. The air content of an upper part of the columnar
elastomer is too much, and the air content of a lower part of the
columnar elastomer is too less, so only a middle part of the
columnar elastomer can be used. Furthermore, if an interior region
of the columnar elastomer exists a defect such as unevenly foaming;
several polishing pads positioned in the interior region are all
affected. Moreover, it is difficult to control the process of mold
filling, especially when the filling size rises. For example, the
prolonged filling time may affect the curing of the resin and
thereby affect the post processing. When applying the conventional
polishing pad in the chemically mechanical polishing method, the
flatness of the substrate is poor due to the poor quality of the
polishing pad, and the rise of the uneven degree of the substrate
causes polishing particles in the slurry be remained on a surface
of the substrate and scrap the surface of the substrate to be
polished. For example, in a wafer manufacture, a scraping of a
wafer surface affects stability and affects a post manufactures of
lithography, development, and etching. After micro integrated
circuit multiple overlaid, the stability is also reduced which
increases the defective rate, and further increases the cost.
SUMMARY OF THE INVENTION
[0008] The invention adopts a coating method for manufacturing a
polishing pad, and a polishing pad of uniformly foaming is obtained
thereby, and thickness of the polishing pad is controlled easily. A
post processing, storage and transportation are improved also and
the polishing pad can be applied in a continuously manufacture.
[0009] The invention provides a method for manufacturing a
polishing pad comprising: [0010] (a) providing a carrier, wherein
the carrier is a releasing material; [0011] (b) providing a foaming
resin composition; [0012] (c) coating the foaming resin composition
of the step (b) on the carrier of the step (a); and [0013] (d)
curing the foaming resin composition of the step (c).
[0014] The invention also provides a process for manufacturing a
polishing apparatus, wherein the polishing apparatus comprising:
[0015] a base plate; [0016] a substrate; [0017] a polishing pad,
which is adhered on the base plate for polishing the substrate; and
[0018] a slurry, which is contacting with the substrate for
polishing; [0019] wherein the process comprises the aforementioned
method for manufacturing the polishing pad.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 shows a schematic view of a polishing apparatus with
a conventional polishing pad;
[0021] FIG. 2 shows a schematic view of a polishing apparatus with
a polishing pad according to the invention;
[0022] FIG. 3 shows a view under the scanning electron microscope
of the polishing pad according to the invention; and
[0023] FIG. 4 shows a view under the scanning electron microscope
of the conventional polishing pad.
DETAILED DESCRIPTION OF THE INVENTION
[0024] The invention provides a method for manufacturing a
polishing pad comprising: [0025] (a) providing a carrier, wherein
the carrier is a releasing material; [0026] (b) providing a foaming
resin composition; [0027] (c) coating the foaming resin composition
of the step (b) on the carrier of the step (a); and [0028] (d)
curing the foaming resin composition of the step (c).
[0029] The term "carrier" as used herein refers to an element which
allows the foaming resin composition formed thereon and the foaming
resin composition can be easily removed after curing. Preferably,
the carrier is a sheet; in another aspect, the carrier is a
releasing material. The term "releasing material" as used herein
refers to a material which does not react with the foaming resin
composition in the polishing pad manufacturing process and the
foaming resin composition can be easily removed after the curing.
Preferably, the releasing material is "a film with low
permeability." The term "film with low permeability" as used herein
refers to a film or thin film that substantially prevents the
foaming resin composition on an upper surface of the film with low
permeability according to the invention from permeating to a lower
surface of the film with low permeability. In one preferred
embodiment of the invention, the film with low permeability can be
formed on a base material, for example, a paper. Preferably, the
carrier comprises a polyethylene glycol terephthalate film, a
polypropylene film, a polycarbonate film, a polyethylene film, a
polyethylene terephthalate film, a releasing paper or a releasing
fabric. Additionally, the preferable polypropylene is oriented
polypropylene.
[0030] Preferably, the carrier is continuously provided, for
example, is a rolling releasing material. The rolling releasing
material can be used by roll to roll. Comparing to the conventional
manufacture relative to molding or casting a single polishing pad,
the method according to the invention improves batch
uniformity.
[0031] In one embodiment of the invention, the foaming resin
composition comprises a resin, a foaming agent, and a bridging
agent.
[0032] The resin according to the invention is, preferably, an
elastomer. As used herein, the term "elastomer," also known as
"elastic polymer," refers to a type of polymer that exhibits
rubber-like qualities. When polishing, the elastomer serves as a
good buffer to avoid scraping a surface of the substrate to be
polished. As used herein, the term "foaming resin" refers to a
material containing a thermoplastic resin and a thermodecomposing
foaming agent. Preferably, the resin comprises at least one
selected from the group consisting of polyurethane, polyolefin,
polycarbonate, polyvinyl alcohol, nylon, elastic rubber,
polystyrene, poly aromatic molecules, fluorine-containing polymer,
polyimide, crosslinked polyurethane, crosslinked polyolefin,
polyether, polyester, polyacrylate, elastic polyethylene,
polytetrafluoroethene, poly (ethylene terephthalate), poly aromatic
amide, polyarylalkene, polymethyl methacrylate, a copolymer
thereof, a block copolymer thereof, a mixture thereof, and a blend
thereof.
[0033] The term "foaming agent" as used herein refers to a resin
foaming agent or method according the invention. A manner of
foaming the resin according the invention can be chemically foaming
or physically foaming, wherein the chemically foaming manner uses
an agent to carry on a chemical reaction to yield gas for being
evenly distributed in the resin composition. Besides, the
physically foaming manner comprises infiltrating gas into the resin
composition for being evenly distributed in the resin composition
by stiffing.
[0034] The term "crosslinked agent" as used herein refers to an
agent that may generate a crosslinked reaction with the resin
according to the invention and cure the resin under an appropriate
condition. The kind of the crosslinked agent is determined
according to the kind of the resin.
[0035] In one preferred embodiment of the invention, the foaming
resin composition further comprises a polishing particle. The
polishing particle can coordinate with the slurry for polishing.
The polishing particle is evenly distributed in the foaming resin
composition; wherein, it can exist in the resin of the polishing
pad, and it can also exist in foaming pores of the polishing pad.
Preferably, the polishing particle comprises cerium dioxide,
silicon dioxide, aluminum oxide, yttrium oxide, or ferric oxide.
Additionally, the particle diameter of the polishing particle is
from 0.01 .mu.m to 10 .mu.m.
[0036] In one embodiment of the invention, the step (c) comprises
blade coating, printing wheel coating, roll extrusion coating or
spraying. The manner of coating may be chosen by artisans skilled
in this field. Besides, the preferred coating is continuously
coating.
[0037] The method according the invention, the step (d) is curing
the foaming resin composition of the step (c). The manner of curing
may be chosen by artisans skilled in this field according to the
kind of the curing resin and bridging agent needed. In one
preferred embodiment of the invention, the curing step is curing
the foaming resin composition which has been dried at a high
temperature of 60.degree. C. to 130.degree. C.
[0038] In one preferred embodiment of the invention, the method
further comprises a surface finishing step, which is finishing a
surface of the cured resin composition in the step (d). The
embodiment of finishing is polishing or shaving a part of the
surface. The manner of polishing or shaving the part of the surface
may be chosen by artisans skilled in this field, for example, using
sandpaper to polish or a knife to shave; wherein the manners of the
polishing or shaving are well known to artisans skilled in this
field.
[0039] In one preferred embodiment of the invention, the method
further comprises a step of groove forming, which is forming at
least one groove on the surface of the cured resin composition in
the step (d). The manner of processing of forming the groove on the
surface of the cured resin composition may be chosen by artisans
skilled in this field according to the specification, for example,
using laser processing. The groove helps the slurry flow in the
polishing, and preferably, the ratio of the groove range and the
groove wide is from about 1 to about 0.05.
[0040] In one preferred embodiment of the invention, the method
according to the invention is to collocate with a continuously
provided carrier. The steps of the invention are coordinated as a
production line with the using of a roller, and providing, coating,
curing, finishing, and groove forming, can be performed
continuously and the manufacture is more easily.
[0041] In one preferred embodiment of the invention, the method
further comprises a step (e) of removing the carrier. Preferably,
the step of removing the carrier is removing the polishing pad from
manufacturing equipment after the manufacture method is completed.
On the other hand, the step of removing the carrier is removing the
carrier from the polishing pad when polishing. The specific manner
of the removing depends on the carrier, for example, the manner is
peeling.
[0042] In one embodiment of the invention, the method further
comprises a step of applying an adhesive on the surface of the
cured resin composition which makes the polishing pad fix on the
base plate. The adhesive may be chosen by artisans skilled in this
field according to the specification.
[0043] In one embodiment of the invention, the method further
comprises a step of applying an adhesive on a surface of the
carrier which makes the polishing pad fix on the base plate. The
adhesive may be chosen by artisans skilled in this field according
to the specification.
[0044] In one preferred embodiment of the invention, the adhesive
is a pressure sensitive adhesion or polyurethane. The term
"pressure sensitive adhesion" as used herein refers to a thin
carrier film of and an adhesive agent on the upper and lower side
of the thin carrier film. Preferably, the thin carrier film is
selected from the group consisting of polyethylene terephthalate,
polypropylene and polyethylene.
[0045] Because the invention adopts a coating method for
manufacturing the polishing pad, the step of mold filing is
avoided, and a polishing pad of uniformly foaming is obtained.
Furthermore, it is easy to control the thickness of coating. It
benefits the post processing, storage and transportation. It can be
applied in the continuously manufacture and reduce the
manufacturing costs because of eliminating the steps of
process.
[0046] The invention also provides a process for manufacturing a
polishing apparatus, wherein the polishing apparatus comprising:
[0047] a base plate; [0048] a substrate; [0049] a polishing pad,
which is adhered on the base plate for polishing the substrate; and
[0050] a slurry, which is contacting with the substrate for
polishing; [0051] wherein the process comprises the aforementioned
method for manufacturing the polishing pad. [0052] Preferably, the
polishing apparatus further comprises: [0053] a lower base plate
positioned opposite to the base plate; and [0054] a mounting sheet
adhered to the lower base plate for mounting and securing the
substrate.
[0055] FIG. 2 shows a schematic view of a polishing apparatus with
a polishing pad according to the invention. The polishing apparatus
2 includes a lower base plate 21, a mounting sheet 22, a substrate
23, an upper base plate 24, a polishing pad 25 and slurry 26. The
lower base plate 21 is positioned opposite to the upper base plate
24. The mounting sheet 22 is adhered to the lower base plate 21
through an adhesive layer (not shown) and is used for carrying and
mounting the substrate 23. The polishing pad 25 is mounted on the
upper base plate 24 and faces to lower base plate 21 for polishing
the substrate 23.
[0056] The operation mode of the polishing apparatus 2 is as
follows. First, the substrate 23 is mounted on the mounting sheet
22, and then both the upper and lower base plates 24 and 21 are
rotated and the upper base plate 24 is simultaneously moved
downward, such that the polishing pad 25 contacts the surface of
the substrate 23, and a polishing operation for the substrate 23
may be performed by continuously supplementing the slurry 26 and
using the effect of the polishing pad 25.
[0057] The following Examples are given for the purpose of
illustration only and are not intended to limit the scope of the
present invention.
Example
[0058] A resin composition is stirred uniformly and air is
infiltrated into the resin composition at a rate of 1000 rpm to
4000 rpm. Then, the resin composition is coated on a releasing
paper with a scraper. The resin composition is cured at 110.degree.
C. for 1 minute, and then dried at 80.degree. C. for 30 seconds in
an oven, and the surface is shaved. FIG. 3 shows a view under the
scanning electron microscope, and the figure shows that the foam is
evenly distributed.
Comparative Example
[0059] A resin composition is stirred uniformly and air is
infiltrated into the resin composition at a rate of 1000 rpm to
4000 rpm, then the resin composition is filled into a mold. The
resin composition is heated at 60.degree. C. for 3 minutes and
removed from the mold. The resin composition is further heated at
110.degree. C. for 16 seconds, and cut into slices. FIG. 4 shows a
view under the scanning electron microscope. Because the resin
composition is foamed by infiltrating air, the air easily floats
due to its low density. The foam is difficult to be uniformly
distributed as filling the composition into the mold. The air
content of an upper part of the resin composition is too much, and
the air content of a lower part of the resin composition is too
less, so only a middle part of the resin composition can be
used.
[0060] The physically evaluation results of the aforementioned
polishing pads are as shown in the following Table 1, which shows
that the polishing pads obtained in Examples have the lower
compression rate and the higher hardness, and the polishing pads
obtained in Examples are better than the polishing pads obtained in
Comparative Examples. Furthermore, the amount of transformation is
also relatively lower.
TABLE-US-00001 TABLE 1 Hard- Com- Coating Film ness Com- pression
Den- interval thickness (shore pression recover sity (mm) (mm) D)
rate rate (g/cm.sup.3) Example 0.75 0.50-0.55 16-18 1.58% 89.77%
0.75 Comparative 2.50 2.90-3.10 14-16 5.16% 73.46% 0.63 Example
[0061] While embodiments of the present invention have been
illustrated and described, various modifications and improvements
can be made by persons skilled in the art. The embodiments of the
present invention are therefore described in an illustrative but
not restrictive sense. It is intended that the present invention is
not limited to the particular forms as illustrated, and that all
the modifications not departing from the spirit and scope of the
present invention are within the scope as defined in the appended
claims.
* * * * *