U.S. patent application number 14/338528 was filed with the patent office on 2015-01-29 for heat exchanger and method and apparatus for manufacturing the same.
This patent application is currently assigned to LG ELECTRONICS INC.. The applicant listed for this patent is LG ELECTRONICS INC.. Invention is credited to Sung Jhee, Jangseok Lee, Hyunsoo SONG.
Application Number | 20150027678 14/338528 |
Document ID | / |
Family ID | 51205214 |
Filed Date | 2015-01-29 |
United States Patent
Application |
20150027678 |
Kind Code |
A1 |
SONG; Hyunsoo ; et
al. |
January 29, 2015 |
HEAT EXCHANGER AND METHOD AND APPARATUS FOR MANUFACTURING THE
SAME
Abstract
A heat exchanger and a method and apparatus for manufacturing
the same are provided. The heat exchanger may include a refrigerant
tube, through which a refrigerant may flow, at least one
heat-exchange fin, into which the refrigerant tube may be inserted,
a plurality of tube treatments provided on a surface of the
refrigerant tube, and a plurality of fin treatments provided on a
surface of the at least one heat-exchange fin.
Inventors: |
SONG; Hyunsoo; (Seoul,
KR) ; Lee; Jangseok; (Seoul, KR) ; Jhee;
Sung; (Seoul, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LG ELECTRONICS INC. |
Seoul |
|
KR |
|
|
Assignee: |
LG ELECTRONICS INC.
Seoul
KR
|
Family ID: |
51205214 |
Appl. No.: |
14/338528 |
Filed: |
July 23, 2014 |
Current U.S.
Class: |
165/181 ; 29/726;
29/890.046 |
Current CPC
Class: |
F28F 2255/20 20130101;
C23C 2222/20 20130101; F28D 2021/0071 20130101; F28F 17/005
20130101; F28F 13/187 20130101; C23C 22/74 20130101; Y10T 29/49378
20150115; Y02T 50/60 20130101; B21D 53/022 20130101; Y02T 50/6765
20180501; F28D 2021/007 20130101; F28F 21/084 20130101; Y10T
29/53113 20150115; C23C 22/78 20130101; F28D 1/0477 20130101; F28F
19/006 20130101; C23C 22/02 20130101; F28F 2245/04 20130101; F28F
19/06 20130101; F28F 1/32 20130101 |
Class at
Publication: |
165/181 ;
29/890.046; 29/726 |
International
Class: |
B21D 53/02 20060101
B21D053/02; F28F 1/12 20060101 F28F001/12 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 23, 2013 |
KR |
10-2013-0086584 |
Claims
1. A heat exchanger, comprising: a refrigerant tube through which a
refrigerant flows; at least one heat-exchange fin, into which the
refrigerant tube is inserted; a plurality of tube treatments
provided on a surface of the refrigerant tube; and a plurality of
fin treatments provided on a surface of the at least one
heat-exchange fin.
2. The heat exchanger according to claim 1, wherein the plurality
of tube treatments comprises: a first tube treatment provided on
the surface of the refrigerant tube, the first tube treatment
comprising a fine unevenness formed in a micrometer (.mu.m) unit;
and a second tube treatment provided on a surface of the first tube
treatment, the second tube treatment comprising a metal layer
formed in a nanometer (nm) unit.
3. The heat exchanger according to claim 2, wherein the first tube
treatment is formed through one of a sand blast method, a sand
paper method, a shot blast method, a plasma etching method, a
discharge treatment method, a laser treatment method, or an acid
(base) etching method.
4. The heat exchanger according to claim 2, wherein the metal layer
of the second tube treatment is formed by an acid or base treatment
process.
5. The heat exchanger according to claim 2, wherein the plurality
of tube treatments further comprises a third tube treatment
provided on a surface of the second tube treatment, the third tube
treatment comprising a hydrophobic high-molecular layer.
6. The heat exchanger according to claim 5, wherein the hydrophobic
high-molecular layer of the third tube treatment is coated with a
fluorinate-based compound.
7. The heat exchanger according to claim 1, wherein the plurality
of fin treatments comprises: a first fin treatment provided on the
surface of the at least one heat-exchange fin, the first fin
treatment comprising a fine unevenness formed in a micrometer
(.mu.m) unit; and a second fin treatment provided on a surface of
the first fin treatment, the second fin treatment comprising a
metal layer formed in a nanometer (nm) unit.
8. The heat exchanger according to claim 7, wherein the plurality
of fin treatments further comprises a third fin treatment provided
on a surface of the second fin treatment, the third fin treatment
comprising a hydrophobic high-molecular layer.
9. The heat exchanger according to claim 1, wherein each of the
refrigerant tube and the at least one heat-exchange fin is formed
of an aluminum material.
10. The heat exchanger according to claim 1, wherein the at least
one heat-exchange fin comprises a plurality of heat-exchange fins,
each of the plurality of heat-exchange fins having a through hole,
through which the refrigerant tube passes.
11. A method for manufacturing a heat exchanger, the method
comprising: assembling a refrigerant tube with at least one
heat-exchange fin to form an assembled body; processing a fine
unevenness on a surface of the assembled body; and forming a metal
nano-layer on a surface of the fine unevenness.
12. The method according to claim 11, wherein the at least one
heat-exchange fin comprises a plurality of heat-exchange fins, each
of the plurality of heat-exchange fins having a through hole,
through which the refrigerant tube passes.
13. The method according to claim 11, wherein the method further
comprises: forming a hydrophobic high-molecular layer on a surface
of the metal nano-layer.
14. The method according to claim 13, wherein the processing of the
fine unevenness on the surface of the assembled body is performed
using one of a sand blast method, a sand paper method, a shot blast
method, a plasma etching method, a discharge treatment method, a
laser treatment method, or an acid or base etching method.
15. The method according to claim 14, wherein the processing of the
fine unevenness on the surface of the assembled body comprises:
dipping the assembled body into a first base solution; and dipping
the assembled body into an acid solution.
16. The method according to claim 13, wherein the forming of the
metal nano-layer on the surface of the fine unevenness comprises:
dipping the assembled body into a second base solution; and dipping
the assembled body into deionized-water.
17. The method according to claim 16, wherein a time taken for
dipping the assembled body into the second base solution is longer
than a time taken for dipping the assembled body into the first
base solution.
18. The method according to claim 13, wherein the forming of the
hydrophobic high-molecular layer on the surface of the metal
nano-layer comprises: performing a first drying process on the
assembled body; treating the assembled body using a
fluorinate-based compound; and performing a second drying process
on the assembled body.
19. The method according to claim 11, wherein the method further
comprises: performing a cleaning process on the assembled body.
20. An apparatus for manufacturing a heat exchanger, the apparatus
comprising: at least one bath in which a solution is stored to dip
an assembled body of a refrigerant tube and at least one
heat-exchange fin; and a reaction inducing device disposed at at
least one side of the at ea one bath to induce a reaction between
the assembled body and the solution.
21. The apparatus according to claim 20, wherein the reaction
inducing device comprises: a drive that generates a drive force;
and a blade rotated by the drive force of the drive.
22. The apparatus according to claim 20, wherein the reaction
inducing device comprises at least one vibrator coupled to the at
least one bath to generate ultrasonic waves due to vibration.
23. The apparatus according to claim 20, wherein the at least bath
comprises a plurality of baths, each having a different
solution.
24. The apparatus according to claim 20, wherein the at least one
heat-exchange fin comprises a plurality of heat-exchange fins, each
of the plurality of heat-exchange fins having a through hole,
through which the refrigerant tube passes.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] The present application claims priority under 35 U.S.C. 119
and 35 U.S.C. 365 to Korean Patent Application No. 10-2013-0086584,
filed in Korea on Jul. 23, 2013, which is hereby incorporated by
reference in its entirety.
BACKGROUND
[0002] 1. Field
[0003] A heat exchanger and a method and apparatus for
manufacturing the same are disclosed herein.
[0004] 2. Background
[0005] A heat exchanger may be one component of a refrigeration
cycle. The heat exchanger may be used in electric appliances, such
as refrigerators or air conditioners in which the refrigeration
cycle is performed.
[0006] The heat exchanger may include a refrigerant tube through
which a refrigerant may flow and a heat-exchange fin coupled to the
refrigerant tube to allow the refrigerant to be heat-exchanged with
external air. The heat-exchange fin may be coupled to the
refrigerant tube to increase a heat-exchange area in which the
refrigerant is heat-exchanged with the air.
[0007] The heat exchanger may function as a condenser or an
evaporator. When a heat exchanger functions as a condenser, a
high-pressure refrigerant compressed by a compressor may flow
through the refrigerant tube to heat-exchange (heat dissipation)
with air and then be condensed. On the other hand, when a heat
exchanger functions as an evaporator, a low-pressure refrigerant
may flow through the refrigerant tube to heat-exchange (heat
adsorption) with air and then be evaporated.
[0008] When a heat exchanger functions as an evaporator of a
refrigerator, the heat exchanger may be exposed to a
low-temperature environment of a storage compartment of the
refrigerator to heat-exchange with cool air of the storage
compartment. That is, the refrigerant tube of the heat exchanger
may have a temperature less than a temperature of the cool air of
the storage compartment, and thus, condensate water may be
generated due to a temperature difference between the refrigerant
tube (or the heat exchange fin) and the cool air.
[0009] The condensate water may freeze forming frost on a surface
of the heat exchanger, that is, surfaces of the refrigerant tube
and heat-exchange fin (frost formation), thereby disturbing heat
exchange action between the refrigerant tube and the cool air.
Therefore, it is important to prevent frost from being formed on
the surface of the heat exchanger so as to improve efficiency of
the heat exchanger.
[0010] However, in the case of the related art heat exchanger, as
the refrigerant tube or the heat-exchange fin is not separately
surface-treated, frost may form on the refrigerant tube or the
heat-exchanger, and thus, it takes a lot of time to remove the
frost formed on the heat exchanger.
[0011] To solve this limitation, the present applicant has filed a
patent for applying a porous material onto a heat exchanger, Korean
Application No. 10-2006-0000742. However, according to the
technology for applying the porous material, the formation of the
frost on the heat exchanger may be prevented somewhat, but the
effect is insignificant.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Embodiments will be described in detail with reference to
the following drawings in which like reference numerals refer to
like elements, and wherein:
[0013] FIG. 1 is a schematic view of a heat exchanger according to
an embodiment;
[0014] FIG. 2 is a cross-sectional view taken along line II-II' of
FIG. 1;
[0015] FIG. 3 is a flowchart of a method for manufacturing a heat
exchanger according to an embodiment;
[0016] FIG. 4 is a schematic view of an apparatus for manufacturing
a heat exchanger according to an embodiment;
[0017] FIG. 5 is a flowchart of a surface treatment process
according to an embodiment;
[0018] FIG. 6 is a schematic view of an apparatus for manufacturing
a heat exchanger according to another embodiment; and
[0019] FIG. 7 is a schematic view of an apparatus for manufacturing
a heat exchanger according to another embodiment.
DETAILED DESCRIPTION
[0020] Reference will now be made in detail to embodiments,
examples of which are illustrated in the accompanying drawings.
Embodiments may, however, be embodied in many different forms and
should not be construed as being limited to the embodiments set
forth herein; rather, alternate embodiments included in other
retrogressive inventions or falling within the spirit and scope of
the embodiments will fully convey the concept of the embodiments to
those skilled in the art.
[0021] FIG. 1 is a view of a schematic heat exchanger according to
an embodiment. FIG. 2 is a cross-sectional view taken along line
II-II' of FIG. 1.
[0022] Referring to FIGS. 1 and 2, a heat exchanger 10 according to
this embodiment may include a refrigerant tube 100, through which a
refrigerant may flow, and at least one heat-exchange fin 110
coupled to the refrigerant tube 100. The at least one heat-exchange
fin 110 may include a plurality of heat-exchange fins 110. The
refrigerant tube 100 may be arranged in a plurality of rows and be
coupled to the plurality of the heat-exchange fins 110.
[0023] A through hole 115, through which the refrigerant tube 100
may pass, may be formed in each of the plurality of heat-exchange
fins 110. The refrigerant tube 100 may be disposed to pass through
the plurality of heat-exchange fins 110 through the through holes
115. The refrigerant flowing through the refrigerant tube 100 may
be heat-exchanged with air flowing between the plurality of
heat-exchange fins 110.
[0024] The refrigerant tube 100 may include a refrigerant
introduction 101, through which the refrigerant may be introduced,
and a refrigerant discharge 105, through which the refrigerant may
be discharged. The refrigerant introduced through the refrigerant
introduction 101 may be heat-exchanged with the air and then be
discharged from the heat exchanger 10 through the refrigerant
discharge 105.
[0025] The heat exchanger 10 may include at least one coupling
plate 120 that supports the refrigerant tube 100, and at least one
return band 108 coupled to the at least one coupling plate 120 to
turn a flow direction of the refrigerant of the refrigerant tube
100. For example, the return band 108 may have a U-shape, at least
one portion of which may be curved.
[0026] The at least one coupling plate 120 may include a coupling
plate 120 disposed at both sides or ends of the refrigerant tube
100 to support the refrigerant tube 100. Also, one portion of
refrigerant tube 100 may be coupled to a first end of the return
band 108, and another portion of the refrigerant tube 100 may be
coupled to a second end of the return band 108.
[0027] The refrigerant tube 100 and the heat-exchange fin 110 may
be formed of aluminum materials, respectively. As the refrigerant
tube 100 and the heat-exchange fin 110 may be formed of the
aluminum materials, the heat exchanger 10 may be reduced in weight
and manufacturing cost.
[0028] The refrigerant tube 100 and the heat-exchange fin 110 may
be surface-treated through a predetermined processing process. The
processing process may be performed at one time in a state in which
the refrigerant tube 100 and the heat-exchange fin 110 are coupled
to each other.
[0029] Surface surface-treatments having the same structure may be
disposed on the refrigerant tube 100 and the heat-exchange fin 110,
respectively. In detail, a first tube treatment 130 may be disposed
on the refrigerant tube 100. The first tube treatment 130 may
include a fine unevenness formed by performing physical or chemical
treatment on the surface of the refrigerant tube 100. For example,
the fine unevenness of the first tube treatment 130 may have a
structure in which a protrusion and a recess are repeatedly
formed.
[0030] The fine unevenness of the first tube treatment 130 may have
a size in micrometer (.mu.m) unit. Herein, the term micrometer
(.mu.m) unit may be understood as a size ranging from about 1 .mu.m
to about 1000 .mu.m.
[0031] A first fin treatment 140 may be disposed on the
heat-exchange fin 110. The first fin treatment 140 may include a
fine unevenness formed by performing physical or chemical treatment
on the surface of the heat-exchange fin 110. For example, the fine
unevenness of the first fin treatment 140 may have a structure in
which a protrusion and a recess are repeatedly formed. The fine
unevenness of the first fin treatment 140 may have a size in
micrometer (.mu.m) unit.
[0032] A second tube treatment 135 may be disposed on a surface of
the first treatment 130. The second tube treatment 135 may include
a surface layer formed through an acid or base treatment process,
for example. The surface layer may have a size in nanometer (nm)
unit. Herein, the term "nanometer (nm) unit" may be understood as a
size ranging from about 1 nm to about 1000 nm. The surface layer of
the second tube treatment 135 may have a flake shape that protrudes
from the surface of the first tube treatment 130 and be called a
"metal nano-layer".
[0033] A second fin treatment 145 may be disposed on a surface of
the first fin treatment 140. The second fin treatment 145 may
include a surface layer formed through an acid or base treatment
process, for example. The surface layer of the second fin treatment
145 may have a flake shape that protrudes from the surface of the
first fin treatment 140 and have a size in nanometer (nm) unit.
[0034] A third tube treatment 138 may be disposed on the surface of
the second treatment 135. The third tube treatment 138 may include
a hydrophobic high-molecular layer formed through a coating
process, for example. The hydrophobic high-molecular layer of the
third tube treatment 38 may include a fluorinate-based compound and
have a thickness in nanometer (nm), for example, a thickness of
about 1 nm to about 5 nm.
[0035] A third fin treatment 148 may be disposed on the surface of
the second fin treatment 145. The third fin treatment 148 may
include a hydrophobic high-molecular layer formed through a coating
process, for example. The hydrophobic high-molecular layer of the
third fin treatment 148 may include a fluorinate-based compound and
have a thickness in nanometer (nm), for example, a thickness of
about 1 nm to about 5 nm.
[0036] Due to the first, second, and third tube treatments 130,
135, and 138, a plurality of layers may be laminated on the surface
of the refrigerant tube 100. Also, due to the first, second, and
third fin treatments 140, 145, and 148, a plurality of layers may
be laminated on the surface of the heat-exchange fin 110.
[0037] Hereinafter, a method for manufacturing the heat exchanger
according to embodiments will be discussed.
[0038] FIG. 3 is a flowchart of a method for manufacturing a heat
exchanger according to an embodiment. Referring to FIG. 3, the
refrigerant tube 100 may be assembled with the at least one
heat-exchange fin 110 to form an assembled body, in step S11. In
step S11, the term "assembled body" may be understood as an
assembly in which the refrigerant tube 100 and the at least one
heat-exchange fin 100 are not yet surface-treated.
[0039] A fine unevenness may be processed on a surface of the
assembled body, in step S12. The fine unevenness may include a
first tube treatment 130 and a first fin treatment 140. The fine
roughness may be formed through one of a sand blast method, a sand
paper method, a shot blast method, a plasma etching method, a
discharge treatment method, a laser treatment method, or an acid
(base) etching method, for example.
[0040] The sand blast method may be a method in which fine sand
particles are sprayed by compressed air to physically collide with
the surfaces of the refrigerant tube 100 and the at least one
heat-exchange fin 110, thereby forming a fine roughness. The sand
paper method may be a method in which the surfaces of the
refrigerant tube 100 and the at least one heat-exchange fin 110 are
rubbed with a sand paper. The shot blast method may be a process in
which fine particles of a metal or non-metal, such as a shut or
grit, are sprayed onto the surfaces of the refrigerant tube 100 and
the at least one heat-exchange fin 110.
[0041] The plasma etching method may be a dry etching process using
gas plasma. Also, the acid (base) etching method may be a wet
etching process using an acid solution or a base solution as an
etchant. The etchant may be a fluorinate acid-diluted solution, a
nitric acid-diluted solution, a phosphoric acid-diluted solution,
an acetic acid-diluted solution, a hydrochloric acid-diluted, a
sulfuric acid-diluted solution, or a mixture thereof.
[0042] The discharge treatment method may be a method in which the
surfaces of the refrigerant tube 100 and the at least one
heat-exchange fin 110 are melted using high-temperature heat
generated by electrical discharge and then re-coagulated. The laser
treatment method may be a method in which a high power laser pulse
is incident into the refrigerant tube 100 and the at least one
heat-exchange fin 110 to allow the surfaces of the refrigerant tube
100 and the at least one heat-exchange fin 110 to wear.
[0043] After the fine unevenness is processed on the assembled
body, a process for forming a metal nano-layer may be performed on
a surface of the fine unevenness, in step S13. The metal nano-layer
may include a second tube treatment 135 and a second fin treatment
145.
[0044] In detail, the process for forming the metal nano-layer may
include an acid or base treatment process, for example. In step
S13, the acid or base treatment process may include a process for
dipping the heat exchanger 10 into a bath in which a predetermined
acid or base solution may be stored.
[0045] After the metal nano-layer is formed, a process for forming
the hydrophobic high-molecular layer may be performed on the metal
nano-layer, in step S14. In detail, in step S14, the process for
forming the hydrophobic high-molecular layer may include a process
for coating with a fluorinate-based compound and a drying process,
for example.
[0046] The surface treatment process will be described in detail
with reference to FIG. 5.
[0047] FIG. 4 is a schematic view of an apparatus for manufacturing
a heat exchanger according to an embodiment. FIG. 5 is a flowchart
of a surface treatment process according to an embodiment.
[0048] Referring to FIG. 4, an apparatus for manufacturing the heat
exchanger according to an embodiment may include at least one bath
200 containing a predetermined compound (solution) 250 so as to dip
the heat exchanger 10 in the bath 200.
[0049] Alternatively, a plurality of baths 200 may be provided. The
plurality of baths 200 may store solutions 250 different from each
other. The heat exchanger 10 may be sequentially dipped into the
different solutions 250 stored in the baths 200 according to a
predetermined process order.
[0050] Here, the refrigerant tube 100 and the at least one
heat-exchange fin 110 of the heat exchanger 10 may be dipped into
the solution 250 except for the refrigerant introduction 101 and
the refrigerant discharge 105.
[0051] Referring to FIG. 5, the process for surface-treating the
heat exchanger 10 according to an embodiment will be described. The
flowchart of FIG. 5 may correspond to steps S12 to S14 of FIG.
3.
[0052] In step S21, the refrigerant tube 100 and the at least one
heat-exchange fin 110 may be assembled to form the assembled body,
and then the surface treatment process may start.
[0053] When the surface treatment process starts, a first
base-solution treatment process may be performed. The first
base-solution treatment process may include a process for dipping
the heat exchanger 10 into the bath 200 containing a sodium
hydroxide (NaOH) solution for a predetermined period of time. In
step S22, the predetermined period of time may be a time of about
20 seconds to about 30 seconds, for example, and the sodium
hydroxide (NaOH) solution may have a concentration of about 0.5 mol
and be under room temperature, for example.
[0054] After the first base-solution treatment process is
performed, an acid-solution treatment process may be performed. The
acid-solution treatment process may include a process for dipping
the heat exchanger 10 into a bath 200 containing a hydrochloric
acid (HCL) solution for a predetermined period of time. The
predetermined period of time may be a time of about 60 seconds to
about 90 seconds, for example, and the hydrochloric acid (HCL)
solution may have a concentration of about 1 mol and a temperature
of about 70 to about 90.degree. C., for example.
[0055] In step S23, when the acid-solution treatment process is
completed, the first tube treatment 130 may be formed on the
refrigerant tube 100, and the first fin treatment 140 may be formed
on the at least one heat-exchange fin 110.
[0056] After the acid-solution treatment process is performed, a
second base-solution treatment process may be performed. The second
base-solution treatment process may include a process for dipping
the heat exchanger 10 into a bath 200 containing a sodium hydroxide
(NaOH) solution for a predetermined period of time.
[0057] The predetermined period of time may be a time of about 3
seconds to about 5 seconds, for example, and the sodium hydroxide
(NaOH) solution may have a concentration of about 0.5 mol and under
room temperature, for example. That is, in step S24, the second
base-solution treatment process may take a time less than a time of
the first base-solution treatment process.
[0058] After the second base-solution treatment process is
performed, a deionized-water treatment process may be performed.
The deionized-water may be water which is substantially pure water
from which mineral slats in water, for example, positive ions such
as sodium (Na), or calcium (Ca), and negative ions such as chloride
ions or sulfate ions are removed.
[0059] The heat exchanger 10 treated with the base-solution and the
acid-solution may be cleaned by performing the deionized-water
treatment process. Thus, the deionized-water treatment process may
be called a cleaning process.
[0060] In step S25, when the deionized-water treatment process is
completed, the second tube treatment 135 may be formed on the
refrigerant tube 100, and the second fin treatment 145 may be
formed on the heat-exchange fin 110.
[0061] After the deionized-water treatment process is performed, a
first drying process may be performed, in step S26. An oven may be
provided as a dryer to perform the first drying process. The heat
exchanger 10 may be inserted into the oven, and then the first
drying process may be performed for a predetermined period of time
at a temperature of about 100.degree. C. to 120.degree. C., for
example. In step S26, the predetermined period of time may be about
5 minutes to about 10 minutes, for example.
[0062] After the first drying process is performed, the
fluorinate-based compound treatment process may be performed. In
step S27, the fluorinate-based compound treatment process may
include a process for dipping the heat exchanger 10 into a solution
in which (heptadeca-fluoro-1,1,2,2-tetra-hydrodecyl)
trichlorosilane (HDFS) is mixed with n-hexane at a ratio of about
1:1000.
[0063] After the fluorinate-based compound treatment process is
performed, a second drying process may be performed, in step S28.
An oven may be provided as a dryer to perform the second drying
process. The heat exchanger 10 may be inserted into the oven, and
then the second drying process may be performed for a predetermined
period of time at a temperature of about 100.degree. C. to
120.degree. C. The predetermined period of time may be about 5
minutes to about 10 minutes, for example.
[0064] In step S28, when the second drying process is completed, a
third tube treatment 138 may be formed on the refrigerant tube 100,
and a third fin treatment 148 may be formed on the at least one
heat-exchange fin 110. In step S29, after the second drying process
is performed, a cleaning process may be performed.
[0065] The surface treatment process may be performed to form the
first, second, and third tube treatments 130, 135, and 138 on the
refrigerant tube 100, and the first, second, and third fin
treatments 140, 145, and 148 on the at least one heat-exchange fin
110. In summary, as the unevenness, the metal nano-layer, and the
hydrophobic high-molecular layer may be formed on the refrigerant
tube 100 and the at least one heat-exchange fin 110, the
refrigerant tube 100 and the at least one heat-exchange fin 110 may
have super-water-repellant surfaces. As the surfaces of the
refrigerant tube 100 and the at least one heat-exchange fin 110 may
have super-water-repellant characteristics to bounce the water even
though the heat exchanger 10 is touched by the water, a contact
angle between the surface and the water may increase and a contact
surface between the surface and the water may decrease. For
example, the contact angle may be about 150.degree. or more.
[0066] Thus, as the condensate water formed on the surface of the
heat exchanger 10 may easily flow downward, the possibility of the
formation of frost on the surface of the heat exchanger 10 may be
low or reduced, and even when frost is formed on the surface of the
heat exchanger 10, the frost may be easily removed from the surface
of the heat exchanger 10.
[0067] Hereinafter, additional embodiments will be described. As
the additional embodiments are different from the previous
embodiment in the apparatus for manufacturing the heat exchanger,
different points therebetween will be mainly described herein, and
the same parts as those described according to the previous
embodiment will be denoted by the descriptions and reference
numerals according to the previous embodiment.
[0068] FIG. 6 is a schematic view of an apparatus for manufacturing
a heat exchanger according to another embodiment. Referring to FIG.
6, an apparatus for manufacturing the heat exchanger according to
this embodiment may include a bath 200 in which a solution 250 for
dipping may be stored, and a reaction inducing device 300 coupled
to the bath 200 to induce a surface treatment reaction between the
heat exchanger 10 and the solution 250.
[0069] In detail, the reaction inducing device 300 may include a
drive 310 that generates a drive force, a connection shaft 320 that
extends from the drive 310, and a rotatable element coupled to the
connection shaft 320.
[0070] For example, the drive 310 may be a motor, and the
connection shaft 320 may be a drive or motor shaft. When the motor
is driven, the motor shaft may be rotated in a predetermined
direction. Also, the rotatable element 330 may include one or more
blades that rotate together with the motor shaft in a predetermined
direction.
[0071] When the rotatable element 330 is rotated, a rotation force
may be applied to the solution 250, and thus, the solution 250 may
move. According to the movement of the solution 250, the heat
exchanger 10 and the solution 250 may quickly react with each other
(reaction acceleration phenomenon). Thus, a process time for
surface-treating the heat exchanger 10 may be reduced.
[0072] FIG. 7 is a schematic view of an apparatus for manufacturing
a heat exchanger according to another embodiment. Referring to FIG.
7, an apparatus for manufacturing the heat exchanger according to
this embodiment may include a bath 200 in which a solution 250 may
be stored and a reaction inducing device 400 disposed at at least
one surface of the bath 200. For example, the reaction inducing
device 400 may include "ultrasonic wave generators" for generating
ultrasonic waves. The ultrasonic wave generators may be provided on
opposite surfaces of the bath 200, for example.
[0073] In detail, the reaction induction device 400 may include a
vibrator 410 that generates vibration when a predetermined input
signal is applied to output ultrasonic waves. The vibrator 410 may
be coupled to the bath 200 so that the vibrator 410 is exposed to
the solution 250 in the bath 200.
[0074] The ultrasonic waves generated through the vibrator 410 may
be transmitted into the solution 250. The ultrasonic waves may have
a function to accelerate oxidation or reduction reaction.
[0075] That is, when the reaction inducing device 400 is operated
to transmit the ultrasonic waves toward the solution 250, the heat
exchanger 10 and the solution 250 may quickly react with each other
(reaction acceleration phenomenon). Thus, a process time for
surface-treating the heat exchanger 10 may be reduced.
[0076] According to embodiments, predetermined structures are
applied onto surfaces of the heat exchanger, that is, surfaces of
the refrigerant tube and the at least one heat-exchange fin, to
allow the surfaces of the heat exchanger to have
super-water-repellant characteristics, and thus, freezing on the
surfaces of the heat exchanger may be relatively reduced, and also,
frost formed on surfaces of the heat exchanger may be easily
removed. Also, as the completely assembled heat exchanger may be
dipped into the bath and then surface-treated, the surface
treatment process on the refrigerant tube and the at least one
heat-exchange fin may be simply performed at once.
[0077] Also, as the reaction inducing device may be disposed in the
bath in which the solution for surface-treating is contained, the
heat exchanger may quickly react with chemical materials. Also, as
each of the refrigerant tube and the at least one heat-exchange fin
which constitute the heat exchanger may be formed of an aluminum
material, the heat exchanger may be reduced in weight and
manufacturing cost.
[0078] Embodiments provide a heat exchanger that is capable of
preventing frost from forming on a surface of the heat exchanger
and improving defrost performance, and a method and apparatus for
manufacturing the heat exchanger.
[0079] Embodiments disclosed herein provide a heat exchanger that
may include a refrigerant tube, through which a refrigerant may
flow; a heat-exchange fin, into which the refrigerant tube may be
inserted; a plurality of tube treatment parts or treatments
laminated on a surface of the refrigerant tube; and a plurality of
fin treatment parts or treatments laminated on a surface of the
heat-exchange fin. The plurality of tube treatment parts may
include a first tube treatment part or treatment formed by
processing the surface of the refrigerant tube. The first tube
treatment part may include a fine unevenness formed in a micrometer
(.mu.m) unit, and a second tube treatment part or treatment formed
by processing the surface of the first tube treatment part. The
second tube treatment part may include a metal layer formed in a
nanometer (nm) unit.
[0080] The first tube treatment part may be formed through one of a
sand blast method, a sand paper method, a shot blast method, a
plasma etching method, a discharge treatment method, a laser
treatment method, or an acid (base) etching method, for example.
The metal layer of the second tube treatment part may be formed by
an acid or base treatment process, for example.
[0081] The plurality of tube treatment parts may include a third
tube treatment part or treatment formed by processing a surface of
the second tube treatment part. The third tube treatment part may
include a hydrophobic high-molecular layer, for example. The
hydrophobic high-molecular layer of the third tube treatment part
may be coated with a fluorinate-based compound, for example.
[0082] The plurality of fin treatment parts may include a first fin
treatment part formed by processing a surface of the heat-exchange
fin, the first fin treatment part including a fine unevenness
formed in a micrometer (.mu.m) unit, and a second fin treatment
part formed by processing a surface of the first fin treatment
part. The second fin treatment part may include a metal layer
formed in a nanometer (nm), for example.
[0083] The plurality of fin treatment parts may include a third fin
treatment part formed by processing the surface of the second fin
treatment part. The third fin treatment part may include a
hydrophobic high-molecular layer, for example.
[0084] Each of the refrigerant tube and the heat-exchange fin may
be formed of an aluminum material, for example.
[0085] Embodiments disclosed herein further provide a method for
manufacturing a heat exchanger that may include assembling a
refrigerant tube with at least one heat-exchange fin to form an
assembled body; processing a fine unevenness on a surface of the
assembled body; forming a metal nano-layer on a surface of the fine
unevenness; and forming a hydrophobic high-molecular layer on a
surface of the metal nano-layer.
[0086] The processing of the fine unevenness on the surface of the
assembled body may be performed by using one of a sand blast
method, a sand paper method, a shot blast method, a plasma etching
method, a discharge treatment method, a laser treatment method, or
an acid (base) etching method, for example.
[0087] The processing of the fine unevenness on the surface of the
assembled body may include dipping the assembled body into a first
base solution, and dipping the assembled body into an acid
solution. The forming of the metal nano-layer on the surface of the
fine unevenness may include dipping the assembled body into a
second base solution, and dipping the assembled body into
deionized-water. A time taken for dipping the assembled body into
the second base solution may be longer than a time taken for
dipping the assembled body into the first base solution.
[0088] The forming of the hydrophobic high-molecular layer on the
surface of the metal nano-layer may include performing a first
drying process on the assembled body; treating the assembled body
by using a fluorinate-based compound; and performing a second
drying process on the assembled body.
[0089] Embodiment disclosed herein further provide an apparatus for
manufacturing a heat exchanger that may include at least one bath
in which a solution may be stored to dip an assembled body of a
refrigerant tube and at least one heat-exchange fin; and a reaction
inducing device disposed at at least one side of the bath to induce
reaction between the assembled body and the solution. The reaction
inducing device may include a driving part or drive that generates
a driving force, and a rotation part disposed rotatable according
to the driving of the driving part.
[0090] The reaction inducing device may include a vibrator coupled
to the bath to generate ultrasonic waves due to vibration.
[0091] Although embodiments have been described with reference to a
number of illustrative embodiments thereof, it should be understood
that numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, various
variations and modifications are possible in the component parts
and/or arrangements of the subject combination arrangement within
the scope of the disclosure, the drawings and the appended claims.
In addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
[0092] Any reference in this specification to "one embodiment," "an
embodiment," "example embodiment," etc., means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
invention. The appearances of such phrases in various places in the
specification are not necessarily all referring to the same
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with any embodiment, it
is submitted that it is within the purview of one skilled in the
art to effect such feature, structure, or characteristic in
connection with other ones of the embodiments.
[0093] Although embodiments have been described with reference to a
number of illustrative embodiments thereof, it should be understood
that numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, various
variations and modifications are possible in the component parts
and/or arrangements of the subject combination arrangement within
the scope of the disclosure, the drawings and the appended claims.
In addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
* * * * *