U.S. patent application number 14/511062 was filed with the patent office on 2015-01-22 for single fpc board for connecting multiple modules and touch sensitive display module using the same.
This patent application is currently assigned to NOVATEK MICROELECTRONICS CORP.. The applicant listed for this patent is NOVATEK MICROELECTRONICS CORP.. Invention is credited to Tsen-Wei CHANG, Hao-Jan HUANG, Ching-Chun LIN, Tzu-Jen LO, Yu-Tsung LU, Wing-Kai TANG, Jiun-Jie TSAI.
Application Number | 20150022744 14/511062 |
Document ID | / |
Family ID | 47353294 |
Filed Date | 2015-01-22 |
United States Patent
Application |
20150022744 |
Kind Code |
A1 |
TSAI; Jiun-Jie ; et
al. |
January 22, 2015 |
SINGLE FPC BOARD FOR CONNECTING MULTIPLE MODULES AND TOUCH
SENSITIVE DISPLAY MODULE USING THE SAME
Abstract
A single flexible printed circuit (FPC) board for connecting
multiple modules including a thin film is provided. The thin film
has a first module connecting portion, a second module connecting
portion and a third module connecting portion. The first module
connecting portion is located on a first side of the thin film. The
second module connecting portion and the third module connecting
portion are located on a second side of the thin film. The first
side is opposite to the second side. At least one first line is
disposed between the first module connecting portion and the second
module connecting portion. At least one second line is disposed
between the first module connecting portion and the third module
connecting portion.
Inventors: |
TSAI; Jiun-Jie; (Hsinchu
City, TW) ; LIN; Ching-Chun; (New Taipei City,
TW) ; CHANG; Tsen-Wei; (Taichung City, TW) ;
LU; Yu-Tsung; (Hsinchu City, TW) ; LO; Tzu-Jen;
(Hsinchu City, TW) ; HUANG; Hao-Jan; (Hsinchu
City, TW) ; TANG; Wing-Kai; (Hsinchu City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NOVATEK MICROELECTRONICS CORP. |
HsinChu |
|
TW |
|
|
Assignee: |
NOVATEK MICROELECTRONICS
CORP.
HsinChu
TW
|
Family ID: |
47353294 |
Appl. No.: |
14/511062 |
Filed: |
October 9, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13438636 |
Apr 3, 2012 |
|
|
|
14511062 |
|
|
|
|
61497505 |
Jun 15, 2011 |
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Current U.S.
Class: |
349/12 ;
361/749 |
Current CPC
Class: |
G06F 1/185 20130101;
H05K 1/147 20130101; H05K 1/189 20130101; G06F 3/0412 20130101;
H05K 2201/10166 20130101; H05K 2201/052 20130101; G06F 1/184
20130101; G06F 2203/04102 20130101; H05K 2201/10128 20130101; H05K
1/028 20130101; G06F 1/1626 20130101; G06F 3/041 20130101; H05K
2201/10151 20130101 |
Class at
Publication: |
349/12 ;
361/749 |
International
Class: |
H05K 1/18 20060101
H05K001/18; G06F 3/041 20060101 G06F003/041; H05K 1/02 20060101
H05K001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 17, 2011 |
TW |
100129439 |
Claims
1. A single FPC board for connecting multiple modules, comprising:
a thin film having a first module connecting portion, a second
module connecting portion and a third module connecting portion,
wherein the first to the third module connecting portions are a
display panel connecting portion, a touch panel connecting portion
and a motherboard connecting portion, respectively; at least one
first line disposed between the first module connecting portion and
the second module connecting portion; and at least one second line
disposed between the first module connecting portion and the third
module connecting portion.
2. The single FPC board according to claim 1, wherein the first
module connecting portion is located on a first side of the thin
film, the second module connecting portion and the third module
connecting portion are located on a second side of the thin film,
and the first side is opposite to the second side.
3. The single FPC board according to claim 2, wherein the thin film
further has a slot separating the second module connecting portion
and the third module connecting portion.
4. The single FPC board according to claim 3, wherein the thin film
further has a folding portion located between the first module
connecting portion and the second module connecting portion.
5. The single FPC board according to claim 1, wherein the first
module connecting portion is divided into a first signal connecting
portion and a second signal connecting portion, which are
electrically connected to the at least one first line and the at
least one second line, respectively.
6. The single FPC board according to claim 1, wherein the first
module connecting portion and the second module connecting portion
are located on a first side of the thin film, the third module
connecting portion is located on a second side of the thin film,
and the first side is opposite to the second side.
7. The single FPC board according to claim 6, wherein the thin film
further has a first slot separating the first module connecting
portion and the second module connecting portion.
8. The single FPC board according to claim 7, wherein the first
module connecting portion is divided into a first signal connecting
portion and a second signal connecting portion, which are
electrically connected to the at least one first line and the at
least one second line, respectively.
9. The single FPC board according to claim 8, wherein the thin film
further has a second slot located on the second side of the thin
film, and the second slot separates the at least one first line and
the at least one second line.
10. The single FPC board according to claim 8, wherein the thin
film further has a second slot located on the first side of the
thin film, and the second module connecting portion is located
between the first slot and the second slot.
11. The single FPC board according to claim 10, wherein the first
slot separates the first signal connecting portion and the second
module connecting portion, and the second slot separates the second
signal connecting portion and the second module connecting
portion.
12. The single FPC board according to claim 11, wherein the second
module connecting portion has an extension portion protruded from
the first side of the thin film, such that the at least one first
line is extended outwards.
13. A touch sensitive display module, comprising: a first to a
third module; and the single FPC board according to claim 1,
wherein the first to the third module connecting portions are
connected to the first to the third modules, respectively.
14. The touch sensitive display module according to claim 13,
wherein the second and the third module are located on top and
bottom sides of the first module, respectively.
15. A touch sensitive display module, comprising: a first module; a
second module disposed on the first module; a third module adjacent
to the first module, wherein the first module is located between
the second module and the third module; and a single FPC board
connecting the first module, the second module and the third
module, wherein the first module is a display panel, the second
module is a touch panel, and the third module is a motherboard.
16. The touch sensitive display module according to claim 15,
wherein the single FPC board comprises: a thin film having a first
module connecting portion, a second module connecting portion and a
third module connecting portion, wherein the first module
connecting portion is located on a first side of the thin film, the
second module connecting portion and the third module connecting
portion are located on a second side of the thin film, and the
first side is opposite to the second side; at least one first line
disposed between the first module connecting portion and the second
module connecting portion; and at least one second line disposed
between the first module connecting portion and the third module
connecting portion.
17. The single FPC board according to claim 16, wherein the thin
film further has a slot separating the second module connecting
portion and the third module connecting portion.
18. The single FPC board according to claim 16, wherein the thin
film further has a folding portion located between the first module
connecting portion and the second module connecting portion.
19. The touch sensitive display module according to claim 16,
wherein the first module connecting portion is divided into a first
signal connecting portion and a second signal connecting portion,
which are electrically connected to the at least one first line and
the at least one second line respectively.
20. The touch sensitive display module according to claim 15,
wherein the first module connecting portion and the second module
connecting portion are located on a first side of the thin film,
the third module connecting portion is located on a second side of
the thin film, and the first side is opposite to the second
side.
21. The touch sensitive display module according to claim 20,
wherein the thin film further has a first slot separating the first
module connecting portion and the second module connecting
portion.
22. The touch sensitive display module according to claim 21,
wherein the first module connecting portion is divided into a first
signal connecting portion and a second signal connecting portion,
which are electrically connected to the at least one first line and
the at least one second line, respectively.
23. The touch sensitive display module according to claim 22,
wherein the thin film further has a second slot located on the
second side of the thin film, and the second slot separates the at
least one first line and the at least one second line.
24. The touch sensitive display module according to claim 22,
wherein the thin film further has a second slot located on the
first side of the thin film, and the second module connecting
portion is located between the first slot and the second slot.
25. The touch sensitive display module according to claim 24,
wherein the first slot separates the first signal connecting
portion and the second module connecting portion, and the second
slot separates the second signal connecting portion and the second
module connecting portion.
26. The touch sensitive display module according to claim 25,
wherein the second module connecting portion has an extension
portion protruded from the first side of the thin film, such that
the at least one first line is extended outwards.
Description
[0001] This application is a continuation of U.S. patent
application Ser. No. 13/438,636, filed Apr. 3, 2012. This
application claims the benefits of U.S. provisional application
Ser. No. 61/497,505, filed Jun. 15, 2011 and Taiwan application
Serial No. 100129439, filed Aug. 17, 2011, the subject matters of
which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates in general to a flexible printed
circuit (FPC) board, and more particularly to a single FPC board
for connecting multiple modules and a touch sensitive display
module using the same.
[0004] 2. Description of the Related Art
[0005] Touch panels have now been widely used in various electronic
products. Particularly, most display panels are equipped with a
touch panel for allowing users to click or press the screen with a
finger or a stylus. For example, the resistive touch panel detects
the coordinates of the touch point by sensing voltage drop, and the
capacitive touch panel calculates the coordinates of the touch
point by forming a uniform electrical field on the panel and
sensing the current of the touch point. Then, the coordinates of
the touch point are processed through a FPC board and a control
circuit so as to generate an image on the display panel and to
provide a more convenient and user-friendly operating interface for
the user.
[0006] Referring to FIGS. 1 and 2, a schematic diagram and an
assembly structural diagram of a conventional touch sensitive
display module are respectively shown. The touch sensitive display
module 100 is formed by a display panel 110, a touch panel 120 and
a motherboard 130. The display panel 110 has a first FPC board 142
and a connector 144. The touch panel 120 has a second FPC board
140. A cover 150 covers the touch panel 120 disposed on the display
panel 110, and the touch panel 120 and the display panel 110 can be
bonded together with a bonding adhesive. During assembly, after the
second FPC board 140 is connected to the first FPC board 142
through the connector 144, the first FPC board 142 is electrically
connected to the motherboard 130 through the connector 132 on the
motherboard 130.
[0007] In the above assembly structure, two FPC boards 140 and 142
are used and are connected through a connector 144, and more
assembly hours and a larger space are required for assembling the
two FPC boards. Since two FPC boards are used, more cost will be
incurred and more wastes will be generated in the manufacturing
process.
SUMMARY OF THE INVENTION
[0008] The disclosure is directed to a single FPC board for
connecting multiple modules and a touch sensitive display module
using the same. The disclosure allows reduction of the assembly
hours of multiple modules and the assembly space of the FPC board.
In addition, the discourse can be conformed to the thinning
requirement. Moreover, the FPC board can be formed by a single thin
film, hence incurring lower cost and generating fewer wastes in the
manufacturing process.
[0009] According to an aspect of the present invention, a single
FPC board for connecting multiple modules including a thin film, at
least one first line and at least one second line is provided. The
thin film has a first module connecting portion, a second module
connecting portion and a third module connecting portion. At least
one first line is disposed between the first module connecting
portion and the second module connecting portion. At least one
second line is disposed between the first module connecting portion
and the third module connecting portion.
[0010] According to another aspect of the present invention, a
touch sensitive display module including a first module, a second
module, a third module and a single FPC board is provided. The
second module is disposed on the first module. The third module is
adjacent to the first module located between the second module and
the third module. The single FPC board connects the first module,
the second module and the third module.
[0011] The above and other aspects of the invention will become
better understood with regard to the following detailed description
of the preferred but non-limiting embodiment(s). The following
description is made with reference to the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIGS. 1 and 2 respectively show a schematic diagram and an
assembly structural diagram of a conventional touch sensitive
display module;
[0013] FIGS. 3A-3C show assembly structural diagrams of a touch
sensitive display module according to one embodiment of the
invention;
[0014] FIG. 4 shows a schematic diagram of a single FPC board for
connecting multiple modules according to one embodiment of the
invention;
[0015] FIGS. 5A-5D respectively show assembly flowcharts of a touch
sensitive display module;
[0016] FIGS. 6A-6C respectively show assembly structural diagrams
of a touch sensitive display module according to one embodiment of
the invention;
[0017] FIGS. 7A and 7B respectively show schematic diagram of a
single FPC board for connecting multiple modules according to one
embodiment of the invention;
[0018] FIGS. 8A-8C respectively show assembly flowcharts of a touch
sensitive display module; and
[0019] FIGS. 9A-9B respectively show schematic diagrams of a single
FPC board for connecting multiple modules according to one
embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0020] The single FPC board for connecting multiple modules of a
present embodiment adopts a single thin film design for connecting
three or more modules, such as a display panel, a touch panel and a
motherboard for transmitting relevant electrical signals. In one
embodiment, a folding connection design of the single FPC board
enables the lines on the thin film to be electrically connected
between the display panel and the touch panel. In another
embodiment, a design of branch connection of the single FPC board
enables the lines on the thin film to be electrically connected
between the display panel and the touch panel. Thus, the lines on
the thin film can be electrically connected between the display
panel and the touch panel through one FPC board without using an
extra connector, so that the time for assembling the multiple
modules and the space for assembling the FPC board can be reduced
and the thinning requirement can be satisfied.
[0021] The invention is elaborated below with the exemplification
of a touch sensitive display module. However, the embodiments below
are for exemplification purpose only, not for limiting the scope of
protection of the invention.
First Embodiment
[0022] Referring to FIGS. 3A-3C and 4. FIGS. 3A-3C show assembly
structural diagrams of a touch sensitive display module according
to one embodiment of the invention. FIG. 4 shows a schematic
diagram of a single FPC board for connecting multiple modules
according to one embodiment of the invention. The touch sensitive
display module 200 includes a first module 210, a second module
220, a third module 230 and a single FPC board 240. The single FPC
board 240 connects the first module 210, the second module 220 and
the third module 230. The first module 210 is such as a display
panel. The second module 220, such as a touch panel, is disposed on
the first module 210. The third module 230, such as a motherboard,
is adjacent to the first module 210. Preferably, the first module
210 is disposed between the second module 220 and the third module
230. In one embodiment, the touch panel can be pasted on a lower
surface (as indicated in FIG. 3A) of the cover 250 according to an
out cell solution; a touch-sensitive transparent conductive layer
222 (as indicated in FIG. 3B) can be formed on the cover 250
according to a one glass solution; or, the touch-sensitive
transparent conductive layer 222 can be integrated onto the display
panel or embedded into the display panel (as indicated in FIG. 3C)
according to an on cell/in cell solution.
[0023] Referring to FIG. 4, the single FPC board 240 has a single
thin film 241, which has a first module connecting portion 242, a
second module connecting portion 244, a third module connecting
portion 246, a folding portion 248 and a slot S. The first module
connecting portion 242, such as a display panel connecting portion,
has multiple first bonding pads B1 such as golden fingers. Each
first bonding pad B1 can be connected to the first module 210 with
a conductive glue for transmitting relevant electrical signals. The
second module connecting portion 244, such as a touch panel
connecting portion, has multiple second bonding pads B2 such as
golden fingers. Each second bonding pad B2 can be connected to the
second module 220 with a conductive glue for transmitting relevant
electrical signals. In addition, the third module connecting
portion 246, such as a motherboard connecting portion, has multiple
third bonding pads B3 such as golden fingers. Each third bonding
pad B3 can be electrically connected to the third module 230
through the connector 232 on the third module 230 for transmitting
relevant electrical signals. The third bonding pad B3 can also be
electrically connected to the third module 230 through other
elements in addition to the connector 232.
[0024] Referring to FIG. 4, based on the source of the signal, the
first module connecting portion 242 is divided into a first signal
connecting portion 242a and a second signal connecting portion 242b
which are electrically connected to the first line 243 and the
second line 245 respectively. At least one first line 243 is
disposed between the first module connecting portion 242 and the
second module connecting portion 244 for transmitting a first type
signal, such as a touch-sensitive signal, which provides the
sensing data of the touch position for the control chip on the
display panel to calculate the coordinates of the touch position.
In addition, at least one second line 245 is disposed between the
first module connecting portion 242 and the third module connecting
portion 246 for transmitting a second type signal, such as a
display panel driving signal from the third module 230 and a touch
position signal calculated by the control chip on the first module
210 to the third module 230, for generating an image on the display
panel according to the touch position signal so as to complete
touch display operation.
[0025] Referring to FIGS. 5A-5D, assembly flowcharts of a touch
sensitive display module are respectively shown. As indicated in
FIG. 5A, the first module connecting portion 242 located on a first
side L1 of the thin film 241 is connected to the first module 210.
As indicated in FIG. 5B, the second module connecting portion 244
located on a second side L2 of the thin film 241 is connected to
the second module 220. Since the slot S separates the second module
connecting portion 244 and the third module connecting portion 246
and the folding portion 248 is located between the first module
connecting portion 242 and the second module connecting portion
244, the second module connecting portion 244 can be stacked on a
part of the first module connecting portion 242 through the folding
design. Meanwhile, the third module connecting portion 246 located
on a second side L2 of the thin film 241 is not folded. As
indicated in FIG. 5D, the third module connecting portion 246 is
connected to the connector 232 of the third module 230. Thus, the
assembly procedure for assembling the touch sensitive display
module 200 can be completed, and the time required for assembling
the multiple modules can be reduced. The above assembly process is
merely an embodiment for exemplification purpose, and the invention
does not have restrictions with respect to the procedures of the
assembly process.
[0026] In the above assembly process, the second module 220 does
not have to be stacked on the first module 210. The second module
220 can also be stacked under the first module 210 or be separated
from the first module 210 for a distance in a vertical direction.
Instead of the stacking design, the first module 210 and the second
module 220 can be disposed in parallel or separated for a distance
in a horizontal direction. In addition, the first bonding pad B1 of
the first module connecting portion 242 is not necessarily
connected above the first module 210, and can also be connected
under the first module 210. The second bonding pad B2 of the second
module connecting portion 244 is not necessarily connected under
the second module 220, and can also be connected above the second
module 220. The third bonding pad B3 of the third module connecting
portion 246 is not necessarily connected above the third module
230, and can also be connected under the third module 230. The
single FPC board 240 is not limited to a rectangle as indicated in
FIG. 4, and can have any other shape. For example, the thin film
241 can be extended towards the second module connecting portion
244, towards the third module connecting portion 246, towards the
left side or the right side or the two sides, or towards any
combination of the above extending directions for increasing the
bendability or application/assembly flexibility of the single FPC
board. Besides, the length and width of the slot S can be
determined according to the needs of design and application. In the
above exemplification, the slot S has a width. However, in
practical application, the slot can be formed by cutting a line
(i.e., the width can be relatively small, e.g., to nearly zero),
the shape and width of the slot can have various designs, and the
extending direction can be deflected. According to the needs of
design, more slots can be designed for increasing the bendability
or application/assembly flexibility of the single FPC board. Thus,
the above assembly process can be adjusted or combined according to
actual needs, and the invention does not have further
restrictions.
Second Embodiment
[0027] Referring to FIGS. 6A-6C and 7A-7B. FIGS. 6A-6C respectively
show assembly structural diagrams of a touch sensitive display
module according to one embodiment of the invention. FIGS. 7A and
7B respectively show schematic diagram of a single FPC board for
connecting multiple modules according to one embodiment of the
invention. The touch sensitive display module 300 includes a first
module 310, a second module 320, a third module 330 and a single
FPC board 340. The first module 310 is such as a display panel. The
second module 320 is such as a touch panel. The third module 330 is
such as a motherboard. In one embodiment, the touch panel can be
pasted on a lower surface (as indicated in FIG. 6A) of the cover
350 according to an out cell solution; a touch-sensitive
transparent conductive layer 322 (as indicated in FIG. 6B) can be
formed on the cover 250 according to a one glass solution; or the
touch-sensitive transparent conductive layer 322 can be integrated
onto the display panel or embedded into the display panel (as
indicated in FIG. 6C) according to an on cell/in cell solution.
[0028] Referring to FIGS. 7A and 7B. The single FPC board 340 has a
single thin film 341. The thin film 341 has a first module
connecting portion 342, a second module connecting portion 344, a
third module connecting portion 346 and a first slot S1. The first
module connecting portion 342, such as a display panel connecting
portion, has multiple first bonding pads B1 such as golden fingers.
Each first bonding pad B1 can be connected to the first module 310
with a conductive glue for transmitting relevant electrical
signals. The second module connecting portion 344, such as a touch
panel connecting portion, has multiple second bonding pads B2 such
as golden fingers. Each second bonding pad B2 can be connected to
the second module 320 with a conductive glue for transmitting
relevant electrical signals. In addition, the third module
connecting portion 346, such as a motherboard connecting portion,
has multiple third bonding pads B3 such as golden fingers. The
third bonding pad B3 can be electrically connected to the third
module 330 through the connector 332 on the third module 330 for
transmitting relevant electrical signals. The third bonding pad B3
can also be electrically connected to the third module 330 through
other elements in addition to the connector 332.
[0029] Referring to FIGS. 7A and 7B. Based on the source of the
signal, the first module connecting portion 342 is divided into a
first signal connecting portion 342a and a second signal connecting
portion 342b which are electrically connected to the first line 343
and the second line 345 respectively for transmitting different
types of signals such as a touch-sensitive signal from the second
module 320 and a display panel driving signal/a touch position
signal. The details are disclosed in the first embodiment, and the
similarities are not repeated here.
[0030] The main differences between FIG. 7A and FIG. 7B are as
follows: As indicated in FIG. 7A, the thin film 341 further has a
second slot S2 located on a second side L2 of the thin film 341,
wherein the second slot S2 separates the first line 343 and the
second line 345 for increasing the bendability of the thin film
341. The first slot S1 and the second slot S2 are located on
different sides of the thin film 341, and the lengths of the two
slots are determined according to the needs of application and can
thus be the same or different from each other. For example, the
lengths of the first slot S1 and the second slot S2 may be about a
half of the length of the thin film for increasing the bendability
of the thin film 341. Despite the second slot S2 is not illustrated
in FIG. 7B, the thin film 341 can be extended towards the second
module connecting portion 346 for increasing the bendability of the
single FPC board 340.
[0031] Referring to FIGS. 8A-8C, assembly flowcharts of a touch
sensitive display module are respectively shown. FIGS. 8A-8C are
exemplified by the single FPC board 340 of FIG. 7A, and the analogy
can be applied to the single FPC board 340 of FIG. 7B. As indicated
in FIG. 8A, the first module connecting portion 342 located on a
first side L1 of the thin film 341 is connected to the first module
310. As indicated in FIG. 8B, the second module connecting portion
344 located on a first side L1 of the thin film 341 is connected to
the second module 320. Meanwhile, the second module 320 stacks on
the first module 310. Since the first slot S1 separates the first
module connecting portion 342 and the second module connecting
portion 344, the branch design enables the first module connecting
portion 342 and the second module connecting portion 344 to be
located on the first module 310 and the second module 320
respectively. As indicated in FIG. 8C, the third module connecting
portion 346 located on a second side L2 of the thin film 341 is
connected to the connector 332 of the third module 33. Thus, the
assembly procedure of the touch sensitive display module 300 can be
completed, and the time required for assembling the multiple
modules can be reduced. The above assembly process is merely an
embodiment for exemplification purpose, and the invention does not
have restrictions with respect to the procedures of the assembly
process.
[0032] In the above assembly process, the second module 320 does
not have to be stacked on the first module 310. The second module
320 can also be stacked under the first module 310 or separated
from the first module 310 for a distance in a vertical direction.
Instead of the stacking design, the first module 310 and the second
module 320 can be disposed in parallel or separated for a distance
in a horizontal direction. In addition, the first bonding pad B1 of
the first module connecting portion 342 is not necessarily
connected above the first module 310, and can also be connected
under the first module 310. The second bonding pad B2 of the second
module connecting portion 344 is not necessarily connected under
the second module 320, and can also be connected above the second
module 320. The third bonding pad B3 of the third module connecting
portion 346 is not necessarily connected above the third module
330, and can also be connected under the third module 330. The
single FPC board 340 is not limited to a rectangle as indicated in
FIGS. 7A and 7B, and can have any other shape. For example, the
thin film 341 can be extended towards the first module connecting
portion 342 (342a or 342b or both), towards or opposite to the
second module connecting portion 344, towards the third module
connecting portion 346, towards the left side or the right side or
the two sides, or towards any combination of the above extending
directions for increasing the bendability or application/assembly
flexibility of the single FPC board. Besides, the length and width
of the first slot S1 and the second slot S2 can be determined
according to the needs of design and application. In the above
exemplification, both the first slot S1 and the second slot S2 have
widths. However, in practical applications, the slot can be formed
by cutting a line (i.e. the widths of the first slot S1 and the
second slot S2 can be relatively small, e.g., to nearly zero), the
shape and width of the slot can have various designs, and the
extending direction can be deflected. According to the needs of
design, more slots can be designed for increasing the bendability
or application/assembly flexibility of the single FPC board. Thus,
the above assembly process can be adjusted or combined according to
actual needs, and the invention does not have further
restrictions.
Third Embodiment
[0033] FIGS. 9A-9B respectively show schematic diagrams of a single
FPC board for connecting multiple modules according to one
embodiment of the invention. The single FPC board 440 has a single
thin film 441. The thin film 441 has a first module connecting
portion 442, a second module connecting portion 444, a third module
connecting portion 446, a first slot S1 and a second slot S2. The
present embodiment is similar to the second embodiment, and the
main differences are as follows: the first slot S1 and the second
slot S2 are located on the same side of the thin film 441, and the
second module connecting portion 444 is located between the first
slot S1 and the second slot S2.
[0034] Based on the source of the signal, the first module
connecting portion 442 is divided into a first signal connecting
portion 442a and a second signal connecting portion 442b according
to the source of the signal. The first slot S1 separates the first
signal connecting portion 442a and the second module connecting
portion 444. The second slot S2 separates the second signal
connecting portion 442b and the second module connecting portion
444. The first signal connecting portion 442a is electrically
connected to the first line 443 for transmitting a first type
signal such as a touch-sensitive signal. The second signal
connecting portion 442b is electrically connected to the second
line 445 for transmitting a second type signal such as a display
panel driving signal.
[0035] The main differences between FIG. 9A and FIG. 9B are as
follows: As indicated in FIG. 9B, the second module connecting
portion 444 further has an extension portion 447 protruded from the
first side L1 of the thin film 441, such that the first line 443 is
extended outwards for increasing the bendability of the thin film
441. In addition, the first line 443 can be extended to the left or
to the right for a suitable length in cooperation with the size of
the thin film 441 so that the second module connecting portion 444
will not be deformed when over-bent and can further be precisely
fixed on the second module 220 for increasing the assembly
reliability. It is noted that in FIGS. 7A and 7B, the second module
connecting portion 344 can adopt similar design and be extended
outside the thin film 341. The single FPC board 440 is not limited
to a rectangle as indicated in FIGS. 9A and 9B, and can have any
other shape. For example, the thin film 441 can be extended towards
the first module connecting portion 342 (342a or 342b or both),
towards or opposite to the second module connecting portion 344,
towards the third module connecting portion 346, towards the left
side or the right side or the two sides, or towards any combination
of the above extending directions for increasing the bendability or
application/assembly flexibility of the single FPC board. Besides,
the length and width of the first slot S1 and the second slot S2
can be determined according to the needs of design and application.
In the above exemplification, both the first slot S1 and the second
slot S2 have widths. However, in practical applications, the slot
can be formed by cutting a line (i.e., the widths of the first slot
S1 and the second slot S2 can be relatively small, e.g., to nearly
zero), the shape and width of the slot can have various designs,
and the extending direction can be deflected. According to the
needs of design, more slots can be designed for increasing the
bendability or application/assembly flexibility of the single FPC
board. Relevant assembly structure and assembly process of the
touch sensitive display module of FIGS. 9A and 9B can be obtained
from the analogy of the second embodiment, and the similarities are
not repeated here.
[0036] The single FPC board for connecting multiple modules
disclosed in above embodiments of the invention adopts the design
of single thin film for connecting at least two modules for
transmitting relevant electrical signals. Since only one FPC board
is used and the lines on the thin film can be electrically
connected between the display panel and the touch panel through one
FPC board without using extra connector, the assembly procedure can
be made more convenient and the time for assembling multiple
modules can thus be reduced. The FPC board is formed by a single
thin film, and a largest number of thin films can be manufactured
if a smallest size is adopted. Therefore, unnecessary wastes can be
avoided during the manufacturing process, and the cost can be
further reduced.
[0037] While the invention has been described by way of example and
in terms of the preferred embodiments, it is to be understood that
the invention is not limited thereto. On the contrary, it is
intended to cover various modifications and similar arrangements
and procedures, and the scope of the appended claims therefore
should be accorded the broadest interpretation so as to encompass
all such modifications and similar arrangements and procedures.
* * * * *