U.S. patent application number 14/506406 was filed with the patent office on 2015-01-22 for pattern substrate and touch panel using the same.
This patent application is currently assigned to LG Innotek Co., Ltd.. The applicant listed for this patent is LG INNOTED CO., LTD.. Invention is credited to Jin Su KIM, Jun LEE, Young Jae LEE, Kyoung Jong YOO.
Application Number | 20150022742 14/506406 |
Document ID | / |
Family ID | 48668752 |
Filed Date | 2015-01-22 |
United States Patent
Application |
20150022742 |
Kind Code |
A1 |
LEE; Jun ; et al. |
January 22, 2015 |
PATTERN SUBSTRATE AND TOUCH PANEL USING THE SAME
Abstract
A touchscreen display device includes a display module and an
electrically conductive and light transmissive layer provided over
the display module to allow detection of touch input. The
electrically conductive and light transmissive layer includes a
transparent substrate and a transparent layer provided over the
transparent substrate. The transparent layer has first and second
surfaces, which are opposing surfaces, and the first surface faces
the transparent substrate. The second surface includes a plurality
of protrusions extending in different directions such that the
plurality of first protrusions intersect to form recess regions on
the second surface. The recess regions include a plurality of
second protrusions, and the second protrusions have a height and a
width less than the first protrusions. At least one metallic wiring
layer is formed on the plurality of first protrusions including at
locations where the first protrusions intersect.
Inventors: |
LEE; Jun; (Seoul, KR)
; YOO; Kyoung Jong; (Seoul, KR) ; LEE; Young
Jae; (Seoul, KR) ; KIM; Jin Su; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LG INNOTED CO., LTD. |
Seoul |
|
KR |
|
|
Assignee: |
LG Innotek Co., Ltd.
|
Family ID: |
48668752 |
Appl. No.: |
14/506406 |
Filed: |
October 3, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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14358701 |
May 15, 2014 |
|
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PCT/KR2012/010739 |
Dec 11, 2012 |
|
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14506406 |
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Current U.S.
Class: |
349/12 |
Current CPC
Class: |
H01L 23/49894 20130101;
G06F 2203/04103 20130101; H01L 2924/0002 20130101; G03F 7/0002
20130101; G06F 3/041 20130101; Y10T 428/24612 20150115; B82Y 30/00
20130101; H01L 2924/0002 20130101; G03F 7/002 20130101; H05K 1/036
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
349/12 |
International
Class: |
G02F 1/1333 20060101
G02F001/1333; G02F 1/1335 20060101 G02F001/1335 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 19, 2011 |
KR |
10-2011-0137217 |
Claims
1. A touchscreen display device comprising: a display module; and
an electrically conductive and light transmissive layer provided
over the display module and allowing detection of touch input, the
electrically conductive and light transmissive layer having a
transparent substrate; a transparent layer provided over the
transparent substrate, the transparent layer having first and
second surfaces, which are opposing surfaces, the first surface
facing the transparent substrate, the second surface having a
plurality of protrusions extending in different directions such
that the plurality of first protrusions intersect to form recess
regions on the second surface, and the recess regions having a
plurality of second protrusions, the second protrusions having a
height and a width less than the first protrusions; and at least
one metallic wiring layer formed on the plurality of first
protrusions including at locations where the first protrusions
intersect.
2. The touchscreen display device of claim 1, wherein the display
module is a liquid crystal display module.
3. The touchscreen display device of claim 1, wherein the
transparent substrate has first and second surfaces, the first
surface of the transparent substrate facing the display module, and
the second surface facing the second surface of the transparent
layer.
4. The touchscreen display device of claim 1, wherein the second
surface of the transparent layer face the display module.
5. The touchscreen display device of claim 1, wherein each of the
first protrusions has a width of 200-1000 nm, and each of the
second protrusions has a width of 50-100 nm.
6. The touchscreen display device of claim 1, wherein the at least
one metallic wiring layer has a thickness greater than a pitch
value between two adjacent second protrusions.
7. The touchscreen display device of claim 1, wherein the
transparent layer is made of resin material.
8. The touchscreen display device of claim 7, wherein the resin
material is one of a thermosetting polymer or a photo-curable
polymer, the polymer being one of PET, PC and PI.
9. The touchscreen display device of claim 1, wherein the substrate
is at least one of glass or quarts.
10. The touchscreen display device of claim 1, wherein the
plurality of first protrusions form a mesh layout on the second
surface of the resin layer.
11. The touchscreen display device of claim 1, wherein the
plurality of first protrusions comprises a first group of
protrusions extending in a first direction and a second group of
protrusions extending in a second direction, the first and second
directions being different directions.
12. The touchscreen display device of claim 11, wherein the first
and second directions are perpendicular to each other such that the
recess regions have a rectangular shape.
13. The touchscreen display device of claim 1, wherein a recess is
proved between adjacent second protrusions to form a pattern of
protrusions and recesses.
14. The touchscreen display device of claim 1, wherein the
plurality of first protrusions comprises a first group of
protrusions extending in a first direction and a second group of
protrusions extending in a second direction, the first and second
directions being different directions, the plurality of second
protrusions extending in the first direction of the first group of
protrusions.
15. The touchscreen display device of claim 1, wherein the at least
one metallic wiring layer comprises at least one of Al, Cr, Ag, Cu,
Ni, Co or Mo.
16. The touchscreen display device of claim 1, wherein an
electrical conductivity of the electrically conductive and light
transmissive layer is equal to indium tin oxide (ITO).
17. The touchscreen display device of claim 1, wherein a width of a
first protrusion is 200-1000 nm.
18. The touchscreen display device of claim 1, wherein each of the
plurality of first protrusions has a width wider than a width of
each of the plurality of second protrusions.
19. The touchscreen display device of claim 1, wherein each of the
first and second protrusions have a rectangular shape.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Continuation-In-Part application of
U.S. application Ser. No. 14/358,701 having a 371(c) filing date of
May 15, 2014, which is a U.S. National Stage application of
International Application No. PCT/KR2012/010739 filed Dec. 11,
2012, claiming priority to Korean Application No. 10-2011-0137217
filed on Dec. 19, 2011, whose entire disclosures are incorporated
herein by reference.
BACKGROUND
[0002] 1. Field
[0003] The present disclosure relates to a transparent substrate
having a nano pattern for use to a touchscreen of a display
module.
[0004] 2. Related Art
[0005] When manufacturing a semiconductor device, a word line, it
is necessarily required to implement various fine patterns such as
a digit line, a contact and the like. A lithograph technology has
been generally applied to form these fine patterns.
[0006] A contact lithograph method which has been traditionally and
widely used enables the pattern to be formed throughout a wide
area. However, due to a limit of the diffraction of light, it was
problematic that a pitch of the fine pattern which can be formed is
limited (1.about.2 .mu.m).
[0007] Accordingly, to solve this problem, a stepper method, a
scanner method, a holographic lithography method and the like were
developed. However, these methods need complicated and
sophisticated equipment and incur high expenses. Further, the
methods have a limit in view of the fact that an area which can
form a pattern is limited. That is, the conventional lithograph
method is basically limited to implement nonoscale fine patterns
due to the problems such as a limitation of equipment or a process
property. More specifically, upon the use of the conventional
lithography technology, it would be difficult to implement
nanoscale patterns which are uniformly formed throughout a large
area of more than 8 inch.
[0008] According to the aforesaid problems, a method of forming a
porous metal thin film using a porous template made of a metal
material as disclosed in Korean Laid-Open Patent Publication No.
2011-0024892, and forming nano patterns using the porous metal thin
film as a catalyst was suggested. The method was problematic in
that because the porous template should be prepared in advance, it
is inconvenient to use the method, and because a catalyst growth
method is used, nano patterns can be formed at only desired
regions. Moreover, it was problematic that the nano patterns cannot
be formed on a transparent substrate.
[0009] The above references are incorporated by reference herein
where appropriate for appropriate teachings of additional or
alternative details, features and/or technical background.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The embodiments will be described in detail with reference
to the following drawings in which like reference numerals refer to
like elements, wherein:
[0011] FIG. 1 and FIG. 2 are flow charts showing the order of a
method of manufacturing a transparent substrate having a nano
pattern according to the present disclosure.
[0012] FIG. 3 through FIG. 9 are the exemplary views of processes
illustrating roughly the manufacturing processes of a transparent
substrate having a nano pattern according to the present
disclosure.
[0013] FIG. 10 illustrates a touchscreen comprising the transparent
substrate having a nano pattern of the present disclosure.
[0014] FIGS. 11A-11C illustrate the arrangement of the transparent
substrate as a touch screen in various display module
configurations.
DETAILED DESCRIPTION OF THE INVENTION
[0015] FIG. 1 and FIG. 2 are flow charts showing the order of a
method of manufacturing a transparent substrate having a nano
pattern according to the present disclosure. A method of
manufacturing a transparent substrate having a nano pattern
according to the present disclosure may include: forming a resin
layer made of a transparent material on a transparent substrate
(S1); forming at least one or more unit pattern parts, which are
composed of a first and a second pattern areas in which a plurality
of grid patterns are formed, and a protrusion pattern formed
between the first pattern area and the second pattern area, on the
resin layer (S3); and forming a nanoscale metal layer on the
protrusion pattern (S5).
[0016] A material of the transparent substrate in used in step S1
may be glass, quartz, a polymer made of a transparent material, for
example, publicly known polymer materials such as PET (polyethylene
terephthalate), PC (polycarbonate), PI (polyimide). In addition to
this, various flexible substrates may be used. The material is not
limited.
[0017] After the transparent substrate is prepared, a resin layer
is formed by applying a resin made of a transparent material to the
transparent substrate. At this time, the resin may use a
thermosetting polymer or a photo curable polymer. Meanwhile, to
improve a bonding ability between the resin layer and the
transparent substrate, the resin layer may be also formed by
coating the transparent substrate with an adhesive before applying
the resin, and thereafter applying the resin to the transparent
substrate.
[0018] After step S1, at least one or more unit pattern parts,
which are composed of a first pattern area and a second pattern
area in which a plurality of grid patterns are formed,
respectively, and a protrusion pattern formed between the first
pattern area and the second pattern area, is formed on the resin
layer (S3). Specially, step S3 may be performed as described
below.
[0019] First, a master mold is produced (S31), the master mold
having at least one or more unit mold pattern parts, which are
composed of the first mold pattern area and the second mold pattern
area in which a plurality of grid mold patterns are formed
respectively, between the plurality of grid mold patterns there are
formed with recesses, and a concave mold pattern formed between the
first mold pattern area and the second mold pattern area.
[0020] The plurality of nanoscale grid mold patterns are first
formed on an original material of the master mold using a space
lithography process, for example, "a method of manufacturing a
nanoscale pattern having a large area" as described in Korean
patent application No. 10-2010-0129255. The master mold of the
present disclosure may be produced by forming a concave mold
pattern to divide a first mold pattern area and a second mold
pattern area and forming one or more unit mold pattern parts. At
this time, specifically, the formation method of the concave mold
pattern may be performed by an electron-beam lithography process.
However, the present disclosure is not limited to this.
[0021] Meanwhile, a width (A) of a recess between the gird mold
patterns of the first mold pattern area or the second mold pattern
area may be formed in a range of 50 to 100 nm. A width (B) of
concave or squared recess mold pattern may be formed in a range of
200 to 1000 nm. The width (C) of the protrusions in the first mold
pattern area or the second mold pattern area may be in a range of
50 to 100 nm. The master mold produced by this method is reusable
until it is damaged. Furthermore, the master mold can continue to
use at an imprinting process, causing economical advantages such as
the reduction of a raw material charge and a production cost.
[0022] Then, the master mold produced in step S31 is arranged in an
upper part of the resin layer, and one or more unit pattern parts
corresponding to one or more unit mold pattern parts are formed on
the resin layer through an imprinting process for pressurizing the
resin layer (S33). Here, the unit pattern parts mean a structure
including the first pattern area corresponding to the first mold
pattern area, the second pattern area corresponding to the second
mold pattern area, and the protrusion pattern unit corresponding to
the concave mold pattern. The plurality of grid patterns
corresponding to recesses between the plurality of grid mold
patterns are provided in the first pattern area and the second
pattern.
[0023] A process of hardening the resin layer is performed (S35).
At this time, in a case where the resin layer is made of a
thermosetting polymer, the resin layer is hardened by applying heat
thereto. In a case where the resin layer is a photo curable
polymer, the resin layer is hardened by irradiating ultraviolet
rays thereto. Thereafter, step S3 of the present disclosure may be
conducted by releasing the master mold from the resin layer
(S37).
[0024] Then, in step S5, the nanoscale metal layer is formed on the
protrusion pattern of the resin layer. A metallic layer is first
deposited on the grid patterns and the protrusion pattern. At this
time, the deposited metal may use any one of Al, Cr, Ag, Cu, Ni, Co
and Mo or an alloy thereof. However, the present disclosure should
not be limited to this, and other metals may be appropriately used
as need. The deposition method of the metal may be at least one
method of a sputtering method, a chemical vapor deposition method,
and an evaporation method. However, this is only one example. In
addition to the methods, all deposition methods, which have been
developed and commercialized or can be embodied according to future
technical development, may be used.
[0025] Meanwhile, a height of depositing the metal may be formed to
be more than a pitch value (See "P" of FIG. 7) of the grid
patterns, and the metal may be uniformly deposited on each grid
pattern and the protrusion pattern. The pitch value being a
distance between a center of a protrusion to a center of an
adjacent protrusion. This pitch value may be in a range of 100 to
200 nm. This is intended to easily remove the metal formed on the
grid patterns at an etching process later.
[0026] After the metal is deposited, a wet etching process is
performed thereon, so isotropic etching is performed at exposed
three sides of the metal. Thus, the metal deposited on the grid
patterns is etched, or a part bonded to the grid patterns is peeled
off. Consequently, the metal deposited on the grid patterns is
removed, and the metal on the protrusion pattern remain so as to
form the metal layer. The reason why the metal deposited on the
grid patterns is removed and the metal on the protrusion pattern
remains so as to form the metal layer is because a contact area
between the metal deposited on the grid patterns and an etching
solution used during the wet etching process is more than the metal
deposited on the protrusion pattern. Thus, the transparent
substrate having the nano pattern of the present disclosure,
including the nano pattern and nanoscale metal layer may be
produced.
[0027] As the wet etching process is used, the process can be
performed even at room temperature, and as the manufacturing
process of the master mold can be performed separately, flexible
processes can be secured. Furthermore, the master mold is available
until it is damaged, causing the reduction of a raw material charge
and a production cost.
[0028] The nano patterns may be uniformly implemented throughout
the wide area of the transparent substrate, and the nanoscale metal
layer may be also uniformly formed on the transparent substrate.
Thus, it is advantageous that the transparent substrate having
electrical conductivity equal to ITO can be provided at a low cost,
and an Ag mesh which is emerging as a substitute for the ITO can be
produced as a nanoscale pattern. Accordingly, the transparent
substrate with nano patterns can be utilized in various fields such
as a touch panel, a liquid crystal device, a solar cell and the
like.
[0029] FIG. 3 through FIG. 9 are the exemplary views of processes
illustrating roughly the manufacturing processes of a transparent
substrate having a nano pattern according to the present
disclosure. As illustrated in FIG. 3, a structure 10a in which the
plurality of nanoscale grid mold patterns 11 on an upper surface
thereof are formed is produced. At this time, the space lithograph
process may be used as a method of forming the grid mold pattern
11. This is the same as described in the explanation of FIG. 2.
[0030] Thereafter, as illustrated in FIG. 4 and FIG. 5, a master
mold 10 having at least one or more unit mold pattern parts 10b are
produced by patterning the structure 10a as illustrated in FIG. 3
through an electron-beam lithography process. At this time, the
unit mold pattern parts 10b are composed of a first mold pattern
area 13, a second mold pattern area 17, and a concave or squared
recessed mold pattern 15 formed between the first mold pattern area
13 and the second mold pattern area 17. The mold pattern area 13
and the second mold pattern area 17 have a plurality of grid mold
patterns 11 with recesses between them. The grid mold pattern 11 is
shown as a series of protrusions, e.g., squared protrusions, but
other shaped protrusion patterns are possible.
[0031] Here, a width (B) of the concave mold pattern 15 is formed
to be wider than a width (A) of the recess between the patterns of
the first mold pattern area 13 or a width of the recess between the
patterns of the second mold pattern area 17. More specifically, the
width (B) of the concave mold pattern 15 may be formed in the range
of 200 to 1000 nm. The width (A) of the recess between the patterns
of the first mold pattern area 13 or the width (A) of the recess
between the patterns of the second mold pattern area 17 may be
formed in the range of 50 to 100 nm. The width (C) of the
protrusions may be in the range of 50 to 100 nm. However, the
present disclosure is not limited to this. Also, a depressed depth
of the concave mold pattern 15 may be formed to be deeper than a
height of the grid mold pattern 11. In an embodiment, the height of
the pattern 15 is greater than the height of the pattern 11 and the
height of the pattern 11 is less than the height of the pattern
15.
[0032] Then, as illustrated in FIG. 6, the imprinting process for
pressurizing the resin layer 30 formed on the transparent substrate
20 using the master mold (10 of FIG. 5), in which one or more unit
mold pattern parts 10b are formed, is conducted. The detailed
explanation on the transparent substrate 20 and the resin layer 30
is the same as described in the explanation of FIG. 1 and FIG. 2,
and thus is omitted. The master mold (10 of FIG. 5) is released
from the resin layer 30 after applying a photo curing process or a
heat curing process, as illustrated in FIG. 7, so that one or more
unit pattern parts 30b corresponding to the unit mold pattern parts
(10b of FIG. 5 and FIG. 6) may be formed on the resin layer 30.
Here, the unit pattern parts 30b are composed of the first pattern
area 33, the second pattern area 37, and the protrusion pattern 35
formed between the first pattern area 33 and the second pattern
area 37. The first pattern area 33, and the second pattern area 37
have the plurality of grid patterns 31, and the protrusion 35 have
shapes and patterns that complements the shapes and patterns
recesses of the first mold pattern area 13, of the second mold
pattern area 17, and the recess 15.
[0033] Due to the imprint of the master mold on the resin layer 30,
the dimensions are substantially the same in a complementary
manner. A width (E) of the protrusion pattern 35 may be formed to
be wider than a width of the grid pattern of the first pattern area
33 or a width of the grid pattern of the second pattern area 37.
More specifically, the width (E) of the protrusion pattern 35 may
be formed in a range of 200 to 1000 nm, i.e., width (E) equals
width (B). The width (D) of the grid pattern 31 of the first
pattern area 33 or the width of the grid pattern of the second
pattern area 37 may be formed in a range of 50 to 100 nm, i.e.,
width (D) equals width (A). The width (F) of the recesses of the
first pattern area 33 or the second grid pattern area 37 may be
formed in a range of 50 to 100 nm, i.e, width (F) equals width (C).
However, the present disclosure is not limited to this. Also, a
height of the protrusion pattern 35 is formed to be higher than a
height of the grid patterns 31.
[0034] Then, the metal is deposited on the grid patterns 31 and the
protrusion pattern 35, and the metal deposited on the grid patterns
31 is removed through the wet etching process, so that the
nanoscale metal layer 40 may be formed on the protrusion pattern
35, as illustrated in FIG. 8. The width of the metal may be the
same or smaller than the width (E), and the height of the metal
layer 40 may be greater than or equal to 100 nm. In the above
disclosed embodiments, although the protrusion pattern 35 is
illustrated as higher than grid patterns 31 formed in the first
pattern area and the second pattern area, the present disclosure is
not limited thereto. The protrusion pattern 35 may also be
substituted with a wide pattern 35 that is equal in height to the
grid patterns 31 (i.e., narrow patterns 31), but is wider than
individual narrow patterns 31.
[0035] Thus, the transparent substrate having the nano pattern with
a large area as illustrated in FIG. 9 can be obtained, which
illustrates a top view of transparent substrate, where FIG. 8 is a
section view of the area shown in dotted lines. As shown, the metal
layer 40 are formed in X and Y directions on top of the protrusion
pattern 35 to form a mesh of x and y signal lines x1-x4 and y1-y4
with a plurality of first and second pattern areas 33 and 37.
[0036] FIG. 10 illustrates a touchscreen 50 incorporating the
transparent substrate having nano pattern, which is provided in
area A. A black mask 51 is provided at the periphery of The
touchscreen display device 50 to hide any circuitry or visible
signal lines, e.g., x and y signal lines of the transparent
substrate, which are connected to input and/or output lines 52.
[0037] FIG. 11A illustrates a first implementation of the
touchscreen 50 in a display device 60. In this embodiment, the
touchscreen 50 using a transparent film 32 with signal lines, e.g.,
x or y signal lines, is adhered using an adhesive 62 between an LCD
module 64 and a window 66.
[0038] FIG. 11B illustrates a second implementation of the
touchscreen 50 in a display device 60. In this embodiment, the
touchscreen 50 using glass 34 as the transparent substrate with
signal lines, e.g., x or y signal lines, is adhered using an
adhesive 62 between an LCD module 64 and a window 66.
[0039] FIG. 11C illustrates a third implementation of the
touchscreen 50 in a display device 60. In this embodiment, a window
66 having either a film or glass as a substrate with x or y signal
lines serve as the touchscreen 50. The touchscreen 50 is adhered to
the LCD module 64 using an adhesive 62.
[0040] According to the present disclosure, it is advantageous that
the nanoscale grid patterns can be uniformly formed throughout a
wide area of the transparent substrate.
[0041] Also, according to the present disclosure, it is
advantageous that the nanoscale metal layer as well as the
aforesaid grid patterns can be also uniformly formed on the
transparent substrate, thereby enabling the transparent substrate
having electrical conductivity equal to ITO to be provided at a low
cost.
[0042] In addition, the master mold used in the present disclosure
is recyclable until it is damaged, causing economical advantages
such as the reduction of a raw material charge and a production
cost.
[0043] Any reference in this specification to "one embodiment," "an
embodiment," "example embodiment," etc., means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
invention. The appearances of such phrases in various places in the
specification are not necessarily all referring to the same
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with any embodiment, it
is submitted that it is within the purview of one skilled in the
art to effect such feature, structure, or characteristic in
connection with other ones of the embodiments.
[0044] Although embodiments have been described with reference to a
number of illustrative embodiments thereof, it should be understood
that numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, various
variations and modifications are possible in the component parts
and/or arrangements of the subject combination arrangement within
the scope of the disclosure, the drawings and the appended claims.
In addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
* * * * *