U.S. patent application number 14/312026 was filed with the patent office on 2015-01-22 for germanium enriched silicon material for making solar cells.
The applicant listed for this patent is Silicor Materials Inc.. Invention is credited to Matthias Heuer, Martin Kaes, Fritz G. Kirscht, Kamel Ounadjela.
Application Number | 20150020729 14/312026 |
Document ID | / |
Family ID | 45316074 |
Filed Date | 2015-01-22 |
United States Patent
Application |
20150020729 |
Kind Code |
A1 |
Kirscht; Fritz G. ; et
al. |
January 22, 2015 |
GERMANIUM ENRICHED SILICON MATERIAL FOR MAKING SOLAR CELLS
Abstract
Techniques for the formation of silicon ingots and crystals
using silicon feedstock of various grades are described. A common
feature is adding a predetermined amount of germanium to the melt
and performing a crystallization to incorporate germanium into the
silicon lattice of respective crystalline silicon materials. Such
incorporated germanium results in improvements of respective
silicon material characteristics, including increased material
strength and improved electrical properties. This leads to positive
effects at applying such materials in solar cell manufacturing and
at making modules from those solar cells.
Inventors: |
Kirscht; Fritz G.; (Berlin,
DE) ; Heuer; Matthias; (Berlin, DE) ; Kaes;
Martin; (Berlin, DE) ; Ounadjela; Kamel;
(Belmont, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Silicor Materials Inc. |
Palo Alto |
CA |
US |
|
|
Family ID: |
45316074 |
Appl. No.: |
14/312026 |
Filed: |
June 23, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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|
12954498 |
Nov 24, 2010 |
8758507 |
|
|
14312026 |
|
|
|
|
12140104 |
Jun 16, 2008 |
7887633 |
|
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12954498 |
|
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Current U.S.
Class: |
117/21 ;
117/41 |
Current CPC
Class: |
C30B 13/10 20130101;
Y02P 70/50 20151101; C30B 11/08 20130101; C30B 29/06 20130101; H01L
31/1804 20130101; C30B 15/00 20130101; Y02P 70/521 20151101; C30B
29/52 20130101; C30B 15/04 20130101; C30B 11/04 20130101; C30B
11/00 20130101; C30B 13/00 20130101; Y02E 10/547 20130101; C30B
13/08 20130101; C30B 15/02 20130101 |
Class at
Publication: |
117/21 ;
117/41 |
International
Class: |
C30B 13/10 20060101
C30B013/10; C30B 29/06 20060101 C30B029/06; C30B 15/04 20060101
C30B015/04 |
Claims
1. A method for forming crystalline silicon having improved
mechanical and electrical characteristics, comprising the steps of:
initiating a silicon crystallization process using a predetermined
amount of a silicon feedstock material; adding to said silicon
feedstock material a predetermined quantity of germanium, wherein
the quantity of germanium ranges from 5 to 50 ppmw; generating a
melt from respective silicon feedstock material and said quantity
of germanium; and performing a crystallization of said melt.
2. The method of claim 1, further comprising the step of initiating
a directional solidification silicon crystallization process using
a predetermined amount of silicon feedstock material.
3. The method of claim 1, further comprising the step of initiating
a directional solidification silicon crystallization process using
a predetermined amount of UMG silicon feedstock material.
4. The method of claim 1, further comprising the step of initiating
a CZ silicon crystal pulling process using an EG silicon feedstock
material.
5. The method of claim 1, further comprising the step of initiating
a CZ silicon crystal pulling process using an SOG silicon feedstock
material.
6. The method of claim 1, further comprising the step of initiating
an FZ silicon crystallization process using an EG silicon supply
rod.
7. The method of claim 1, wherein adding to said silicon feedstock
material the quantity of germanium includes adding germanium with a
minimum purity level of 99.999 percent purity.
8. The method of claim 1, wherein adding to said silicon feedstock
material the quantity of germanium includes adding germanium in a
silicon-germanium alloy of the form Si.sub.xGe.sub.(1-x) with
0<x<1.
9. The method of claim 1, wherein adding to said silicon feedstock
material the quantity of germanium includes adding germanium in a
concentration ranging from 10 to 40 ppmw.
10. The method of claim 1, further comprising the step of adding to
said silicon feedstock material the quantity of germanium ranging
from 30 to 40 ppmw.
11. The method of claim 1, further comprising the step of adding to
said silicon feedstock material a combination of germanium and
gallium.
12. The method of claim 11, wherein adding to said silicon
feedstock material a combination of germanium and gallium includes
adding gallium in a concentration between 0 and 10 ppmw gallium.
Description
CLAIM OF PRIORITY
[0001] This application is a Continuation-In-Part of and claims the
benefit of priority under 35 U.S.C. .sctn.120 to U.S. Patent
Application Serial No.12/140,104, filed Jun. 16, 2008. This
application also claims the benefit of priority to
PCTUS2009/047539, filed Jun. 16, 2009 now published as WO
2010/005736 on Jan. 14, 2010. Each document is also incorporated by
reference herein in its entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to methods and systems for
use in the fabrication of semiconductor materials such as silicon,
for example using lower-grade silicon. More particularly, the
present disclosure relates to a method and system for forming a
silicon crystal or ingot with improved mechanical and electrical
characteristics, using feedstock material of various grades and
germanium enrichment.
BACKGROUND
[0003] The photovoltaic (PV) industry is growing rapidly and is
responsible for an increasing amount of silicon being consumed
beyond the more traditional uses as integrated circuit (IC)
applications. Today, the silicon needs of the solar cell industry
are partially competing with the silicon needs of the IC industry.
With present manufacturing technologies, both IC and PV industries
require a refined, purified, silicon feedstock as a raw silicon
starting material.
[0004] Materials alternatives for the bulk of current solar cells
range from mono-crystalline silicon wafers, for example based on
very clean raw silicon such as electronic-grade (EG) silicon
feedstock needed for the IC industry, to multi-crystalline (mc)
silicon wafers based on not as clean raw silicon such as the
so-called called solar-grade (SOG) silicon feedstock or an even
lower-quality material called upgraded metallurgical-grade (UMG)
silicon feedstock.
[0005] Low-grade feedstock materials for the PV industry, such as
UMG silicon, are typically processed into ingots and wafers of
mc-silicon where the ultimate, solar cell relevant quality is
typically controlled by grain boundaries, other structural defects
and a relatively high concentration of impurities such as
transition metals. Also carbon related and oxygen related defects
in the wafer bulk can degrade cell properties, in particular when
associated with metals. Some species of the broad defect spectrum
may be passivated with hydrogen to reduce their electrical
degradation potential.
[0006] Higher-grade feedstock materials for the solar cell
industry, such as EG silicon, are typically processed into
mono-crystals and, subsequently, wafers with mono-crystalline
structure where the ultimate, solar cell relevant quality is
controlled by impurities similar to the case of mc-silicon
described above. There are two well-established growing techniques
for mono-crystals of silicon (in the following called crystals). By
far dominant is the Czochralski (CZ) technique where a CZ crystal
is pulled out of a silicon melt residing in a quartz crucible.
Medium to high-grade feedstock silicon is employed for generating
the CZ silicon melt. A more sophisticated alternative is the
Floating Zone (FZ) technique where a FZ crystal is grown by
"floating" a small melt zone through a so-called supply rod of
high-grade feedstock silicon. One way of getting predetermined
amounts of elements into FZ crystals is so-called "pill doping"
into supply rods before generating the melt zone. Typically, FZ
silicon crystals contain less impurities than CZ crystals, mainly
because no crucible is required.
[0007] In any case, since silicon is brittle at room temperature,
there is the general problem of wafer breakage at wafer and solar
cell processing and handling, including the manufacturing of
modules out of solar cells. Consequently, the mechanical strength
of silicon wafers and related solar cells is also an important
quality factor in the PV industry, besides electrical properties.
This holds for mono-crystalline material and equally for
multi-crystalline ingot material.
[0008] Wafer breakage is initiated by crack formation and
subsequent propagation. Cracks may originate from, for example,
handling-induced local damage on surfaces, in particular at edges
and corners. State-of-the-art solar cell manufacturing technology
uses careful handling and processing of wafers and solar cells to
avoid such situations. Intrinsic material strength of bulk silicon
is also a function of bulk lattice defects. Of particular concern
are defects that generate local tensile lattice strain, enabling
internal crack formation/propagation at reduced external force
(relative to an ideal lattice structure).
[0009] A need exists for a simple process that delivers UMG-based
multi-crystalline silicon material with good ingot yield and
improved mechanical and electrical properties, the latter in regard
to solar cell quality. Such a process should be easily transferable
to higher-grade, non-UMG feedstock silicon which is used partially
or exclusively for producing mono-crystalline silicon materials,
for example by applying the CZ technique or the FZ technique.
SUMMARY
[0010] A technique is here disclosed for the crystallization of
silicon which may be useful for ultimately making solar cells. The
present disclosure includes a method and system for making silicon
ingots or crystals with improved electrical and mechanical material
characteristics, for use in a variety of solar cell
applications.
[0011] The resulting solar cells may be shipped, installed, and
used without concern for strong susceptibility to breakage. In
addition to delivering improved mechanical strength, improved
electrical properties of the silicon material resulting from
related ingots or crystals may also lead to higher ingot/crystal
yield, measured as ingot/crystal portion with a recombination
lifetime of certain minimum level needed to reach critical cell
efficiencies.
[0012] According to one aspect of the disclosed subject matter, a
silicon ingot forming method and associated system are provided for
using a low-grade silicon feedstock that includes forming within a
crucible device a molten solution from a low-grade silicon
feedstock and a predetermined amount of germanium. The process and
system perform a directional solidification of the molten solution
to form a silicon ingot within the crucible
[0013] According to another aspect of the disclosed subject matter,
a silicon ingot forming method and associated system are provided
for adding not only a predetermined amount of germanium but also a
predetermined amount of Ga to a silicon feedstock of various
grades. According to another aspect of the disclosed subject
matter, a silicon crystal forming method and associated system are
provided for using a higher-grade silicon feedstock and a
predetermined amount of germanium. The process and system perform a
crystallization of the molten solution to form a silicon
crystal.
[0014] In one case, crystallization is achieved using the CZ
technique, where a predetermined amount of germanium is added to
the higher-grade silicon feedstock before meltdown and subsequent
CZ crystal pulling.
[0015] In another case, crystallization is achieved using the FZ
technique, where the predetermined amount of germanium is attached
to the high-grade silicon supply rod before applying the floating
melt zone for FZ crystal growing.
[0016] The predetermined amount of germanium can be added in pure
form. It can be also part of a compound such as a pure
silicon-germanium alloy.
[0017] These and other advantages of the disclosed subject matter,
as well as additional novel features, will be apparent from the
description provided herein. The intent of this summary is not to
be a comprehensive description of the claimed subject matter, but
rather to provide a short overview of some of the subject matter's
functionality. Other systems, methods, features and advantages here
provided will become apparent to one with skill in the art upon
examination of the following Figures and detailed description. It
is intended that all such additional systems, methods, features and
advantages be included within this description, be within the scope
of the accompanying claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The features, nature, and advantages of the disclosed
subject matter may become more apparent from the detailed
description set forth below when taken in conjunction with the
drawings in which reference characters identify correspondingly
throughout and wherein:
[0019] FIG. 1 is a prior art general process for the formation of a
solar cell beginning with the formation of a silicon ingot;
[0020] FIG. 2 illustrates conceptually a process flow for producing
a silicon ingot with improved characteristics according to the
present disclosure;
[0021] FIG. 3 provides a process flow for one embodiment the
present disclosure employing low-grade raw silicon feedstock for a
directional solidification ingot formation process;
[0022] FIG. 4 provides a process flow for one embodiment of the
present disclosure employing higher-grade raw silicon feedstock for
a CZ crystal pulling process;
[0023] FIG. 5 provides a process flow for one embodiment the
present disclosure employing a supply rod of high-grade raw silicon
feedstock for an FZ crystal growing process;
[0024] FIG. 6 illustrates conceptually another process flow for
producing a silicon ingot with improved characteristics according
to the present disclosure;
[0025] FIG. 7 shows a diagram of breakage test results on a
plurality of different wafers tested from a reference ingot and an
engineered ingot using an embodiment of the present disclosure;
[0026] FIG. 8 illustrates a diagram of breakdown voltage test
results on a plurality of different wafers tested from a reference
ingot and an engineered ingot using an embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0027] The method and system of the present disclosure provide a
semiconductor ingot formation process for producing a silicon ingot
or crystal using a low purity or high purity silicon feedstock. As
a result of using the presently disclosed subject matter, an
improvement in the properties of ingots formed from low-grade
semiconductor materials, such as upgraded metallurgical grade
silicon (UMG) occurs. Such improvement allows use of UMG silicon,
for example, in producing solar cells for applications in solar
power generation. The method and system of the present disclosure,
moreover, particularly benefits the formation of silicon-based
solar cells using UMG or other non-electronic grade feedstock
materials. The present disclosure may, therefore, allow the
manufacture of solar cells in greater quantities and in a greater
number of fabrication facilities than has heretofore been
possible.
[0028] Laying a context for the present disclosure, FIG. 1 depicts
a known process 10 beginning at step 12. At step 12, MG or other
low-grade silicon enters known wafer forming process flow 10. Known
process flow 10 extracts high-grade silicon from MG silicon at step
14. High-grade silicon extraction step 14 is a high-cost processing
sequence resulting in EG silicon or somewhat relaxed silicon
quality called SOG feedstock quality. Those are the types of
silicon feedstock materials used for making the ingot in step 16.
Known process flow 10 includes slicing the silicon ingot, generally
using a wire-saw to derive a silicon wafer at step 18. The
resulting silicon wafers then enter solar cell formation process 20
using the resulting wafer.
[0029] FIG. 2 depicts, in general terms, novel aspects of how the
disclosed process may be integrated into the overall solar cell
fabrication flow 30. The improved silicon ingot characteristics
arising from the present disclosure may include greater mechanical
strength , and better electrical characteristics such as
recombination lifetime of the resulting wafers, and hence the
resulting solar cells, using feedstock material of various grades
and the presently disclosed germanium enrichment steps.
[0030] Fabrication flow 30 includes using MG silicon at step 32
that may be purified to some degree to become UMG silicon. The
resulting silicon quality still results in low-grade silicon 34.
Accordingly, silicon quality 34 relates to much lower cost as
compared to silicon quality 14. Also, low-grade silicon ingot 34
includes a higher content of metallic and non metallic impurities
as compared to silicon quality 14. The present disclosure includes
the addition or enhancement of a predetermined quality and quantity
of germanium 36 for the purpose of improving the mechanical
strength, and electrical properties of the resulting ingot
material. The combination of silicon and germanium are heated to
form a silicon melt as an initial aspect of ingot formation step
38.
[0031] At step 38, silicon ingot formation may occur using, for
example, a directional solidification process, a CZ crystal
formation process, or a FZ crystal formation process. Adjustment of
the crystallization conditions based on actually applied germanium
concentrations further enhances mechanical properties and
electrical properties. Step 40 represents the formation of silicon
wafers. Finally, the solar cell forming process occurs at step
42.
[0032] FIG. 3 provides a process flow 50 for one embodiment of the
present disclosure employing low-grade raw silicon feedstock. In
process flow 50, a first step 52 includes placing low-grade raw
silicon (e.g., UMG silicon) into a crucible. Before the heating
process for silicon melt formation begins, the present disclosure
contemplates the addition, at step 54, of a predetermined amount of
pure germanium (e.g., germanium with a purity of 99.99 percent or
99.999 percent) to the low-grade silicon feedstock.
[0033] The total range of added germanium in improved silicon may
range from 5 to 200 ppmw. Another embodiment may allow for a range
of germanium from 5 to 50 ppmw. Another embodiment may allow for a
range of germanium from 20 to 40 ppmw. Another embodiment may allow
for a range of germanium from 30 to 40 ppmw. Another embodiment may
allow for a range of germanium from 50 to 100 ppmw. Another
embodiment may allow for a range of germanium from 50 to 200 ppmw.
Another embodiment may allow for a range of germanium from 100 to
150 ppmw. Another embodiment may allow for a range of germanium
from 120 to 180 ppmw.
[0034] Once the combination of solid low-grade silicon and pure
germanium reside in the crucible, step 56 includes heating the
solid mixture for generating a melt of the low-grade silicon and
added germanium at step 58. The molten low-grade silicon and
germanium may be subsequently crystallized, step 60, by performing
a directional solidification, for example.
[0035] FIG. 4 provides a process flow 70 for a further embodiment
of the present disclosure employing higher-grade raw silicon
feedstock. In process flow 70, a first step 72 includes placing
higher-grade raw silicon (e.g., EG silicon) into a crucible. Before
the heating process for silicon melt formation begins, the present
disclosure contemplates the addition, at step 74 of a predetermined
amount of pure germanium (e.g., germanium with a purity at least of
99.999) to the higher-grade silicon feedstock.
[0036] Once the combination of solid low-grade silicon and pure
germanium reside in the crucible, step 76 includes heating the
solid mixture for generating a melt of the higher-grade silicon and
added germanium, step 78. A portion of molten higher-grade silicon
and germanium may be subsequently formed into a silicon crystal,
step 80, by pulling a CZ crystal using established procedures for
achieving and maintaining desired crystal properties throughout the
CZ process.
[0037] FIG. 5 provides a process flow 90 for a further embodiment
the present disclosure starting with a supply rod of high-grade raw
silicon, specifically EG silicon feedstock. In process flow 90, a
first step 92 includes beginning with a high-grade raw silicon
(e.g., EG silicon) supply rod. The supply rod allows the use of a
floating zone or FZ region for an FZ crystallization process. In
association with forming the FZ region, the present disclosure
contemplates the addition, at step 94, of a predetermined amount of
pure germanium (e.g., germanium with a purity at least of 99.999)
to the supply rod of high-grade raw silicon feedstock.
[0038] Once the combination of solid high-grade silicon and pure
germanium exist in the FZ, step 96 includes using the floating melt
zone of the higher-grade silicon and added germanium, step 98, to
subsequently form a silicon crystal, step 100, by growing an FZ
crystal from the supply rod and germanium mixture. At this point,
the established procedures for achieving and maintaining desired
crystal properties throughout the FZ process may find
application.
[0039] FIG. 6 depicts, in general terms, novel aspects of another
process that may be integrated into the overall solar cell
fabrication flow 130. Fabrication flow 130 includes using MG
silicon at step 132 that may be purified to some degree to become
UMG silicon. The resulting silicon quality still results in
low-grade silicon 134. Accordingly, silicon quality 134 relates to
much lower cost as compared to unmodified silicon as described in
FIG. 1. Also, low-grade silicon ingot 134 includes a higher content
of metallic and non metallic impurities as compared to unmodified
silicon. The present disclosure includes adding germanium in
conjunction with further addition or enhancement of a predetermined
quality and quantity of gallium 136 for the purpose of further
improving properties, including mechanical and electrical
properties of the resulting ingot. In one example gallium is added
at concentrations in a range of 0 to 10 ppmw. The combination of
silicon with germanium and gallium are heated to form a silicon
melt as an initial aspect of ingot formation step 138.
[0040] FIG. 7 depicts a characteristic result 110 of an experiment
comparing the mechanical wafer strength of an example of
germanium-doped material from ingot B with non-doped reference
material from ingot A. For both ingots the very same type of UMG
feedstock silicon has been selected, and the casting was done
sequentially with the same tool applying the same casting
conditions. Then, from each ingot one set of near-bottom wafers
(116 and 120) and one set of near-top wafers (118 and 122) were
selected for determining the mechanical wafer strength, measured as
ratio of maximum external force F.sub.max over maximum wafer
deformation I.sub.max in a standard 4-line bending test. The
normalized wafer strength (strength divided by wafer thickness) 112
is presented for the various wafer groups where the sequence number
114 describes the original location within respective ingots
(increasing numbers from bottom to top). From the graph we see that
wafers from the germanium-doped ingot B exhibit higher strength
than wafers from the reference ingot A. The results shown here
support the conclusion that the addition of germanium in the
formation of a silicon ingot yield greater strength characteristics
than a silicon ingot made from an otherwise identically formed
silicon ingot.
[0041] These results are further substantiated by the Table below,
which shows an example of additional improvements achieved with
material from a germanium-doped silicon ingot.
TABLE-US-00001 TABLE INGOT YIELD, CARRIER LIFETIME, AND EFFICIENCY
INCREASE Increase of Increase of Increase in ingot yield
recombination lifetime efficiency 44.7% 20.7% 1.2%
[0042] The Table reports data for a medium-grade feedstock that was
used in formation of a multi-crystalline silicon ingot. The above
data shows improvements of electrical material characteristics, on
top of improved mechanical characteristics described above. In the
Table, measured improvements of such electrical characteristics are
given as percentage of increase in enhanced silicon, as described
in embodiments above, as compared to silicon that has not been
modified consistent with the present disclosure. Because of the
improved material properties, there results a corresponding yield
increase in possible number of silicon wafers and related solar
cells from such an ingot. Moreover, improved electrical
characteristics translate into an average yield increase for the
resulting solar cells.
[0043] In other words, the improved material characteristics of a
silicon ingot formed consistent with the teachings of the present
disclosure have a cascading effect to promote a corresponding
reduction in the final costs associated with the manufacture of
solar cells and systems using such solar cells. That is, because
the germanium doped silicon material exhibits improved material
strength and flexibility over non-doped silicon material, a greater
likelihood exists that the mechanical processes of slicing the
wafers from the ingot will result in less wafer breakage. Then,
once the wafers are sliced, the continuing material strength and
flexibility of the silicon wafers provide increased durability as
such silicon wafers are further formed into solar cells. Moreover,
such resulting solar cells are less likely to break, crack, or
demonstrate fracture stress upon installation or shipping from the
solar cell manufacturing site to the points of assembly as solar
cell arrays and the final installation in the field of such solar
cell arrays. Lastly, the increased durability and flexibility of
such solar cells may further increase the operational life of the
solar cell arrays, as weathering, thermal and environmental
transients in the field may damage or otherwise occur.
[0044] From the increased yield of silicon wafers, the increased
yield of solar cells, the increased yield of solar cell arrays, and
the increased mechanical durability of the solar cell arrays
embodying the teachings of the present disclosure, highly
significant economies may arise in the solar cell industry. Such
economies directly and materially translate to reduced costs in the
generation of electricity from solar cells.
[0045] As the above Table depicts, the germanium-doping example may
cause an increase in not only the carrier lifetime of respective
silicon material but also the overall solar cell efficiency. This
is seen, for example, in the demonstrated increase in recombination
lifetime of 20.7% and a measured cell efficiency increase of 1.2%
in the above Table.
[0046] FIG. 8 further illustrates further improvements in
electrical properties of the silicon material as a result of an
addition of germanium as described in the present disclosure. The
Figure shows breakdown voltage versus a wafer identification
number, where a lower wafer identification number indicates a
location near a bottom of an ingot, and a higher wafer
identification number indicates a location near a top of an ingot.
As can be seen from the Figure, the reference ingot data 150 shows
consistently lower breakdown voltages than ingots processed
according to embodiments of the invention 152.
[0047] In one example, selecting an effective amount of germanium
for addition to the silicon depends on a number of potentially
competing factors. For example although mechanical properties such
as strength and flexibility can be enhanced by adding more
germanium, additions over a certain concentration can introduce
unwanted effects such as formation of silicon carbides. Therefore,
for example, concentrations of germanium in the range of 5 to 50
ppmw provide enhanced electrical properties such as low
light-induced degradation and high recombination lifetimes, along
with enhanced mechanical strength and low dislocation densities,
while keeping unwanted effects to a minimum. In one example, an
effective amount of germanium includes concentrations of germanium
in the range of 0 to 20 ppmw. In one example, an effective amount
of germanium includes concentrations of germanium in the range of
30 to 60 ppmw.
[0048] The silicon material improvements of the present disclosure
may derive from increased compressive lattice strain associated
with substitutionally incorporating germanium atoms in the lattice
structure of crystalline silicon. Such substitutional incorporation
of germanium may compensate local tensile stresses associated with
certain bulk defects in silicon wafers or solar cells and result in
improved control of the intrinsic material strength.
[0049] Empirical results indicate that a silicon material with
germanium in sufficient amounts demonstrates an increased material
strength. The best practical range depends on the material quality
generated. Slightly higher germanium concentrations turn out to
work better for mono-crystalline silicon, as compared to
multi-crystalline silicon.
[0050] In summary, the disclosed subject matter provides a method
and system for forming a silicon ingot or crystal which includes
forming within a crucible device a molten solution from silicon
feedstock and a predetermined amount of germanium, followed by
either directional solidification to form an ingot within the
crucible, pulling CZ crystals from the melt, or growing FZ
crystals.
[0051] Although various embodiments that incorporate the teachings
of the present disclosure have been shown and described in detail
herein, those skilled in the art may readily devise many other
varied embodiments that still incorporate these teachings. The
foregoing description of the preferred embodiments, therefore, is
provided to enable any person skilled in the art to make or use the
claimed subject matter. Various modifications to these embodiments
will be readily apparent to those skilled in the art, and the
generic principles defined herein may be applied to other
embodiments without the use of the innovative faculty. Thus, the
claimed subject matter is not intended to be limited to the
embodiments shown herein, but is to be accorded the widest scope
consistent with the principles and novel features disclosed
herein.
* * * * *